KR20200066885A - Insulator coated with liquid coating agent containing ceramic microsphere and silicone mirosphere - Google Patents
Insulator coated with liquid coating agent containing ceramic microsphere and silicone mirosphere Download PDFInfo
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- KR20200066885A KR20200066885A KR1020180153572A KR20180153572A KR20200066885A KR 20200066885 A KR20200066885 A KR 20200066885A KR 1020180153572 A KR1020180153572 A KR 1020180153572A KR 20180153572 A KR20180153572 A KR 20180153572A KR 20200066885 A KR20200066885 A KR 20200066885A
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- liquid coating
- coating agent
- insulating material
- microsphere
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- 239000004005 microsphere Substances 0.000 title claims abstract description 42
- 239000011248 coating agent Substances 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 title claims abstract description 27
- 239000000919 ceramic Substances 0.000 title claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 title description 5
- 239000012212 insulator Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims abstract description 12
- 239000011810 insulating material Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 17
- 239000003365 glass fiber Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000003063 flame retardant Substances 0.000 claims description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004014 plasticizer Substances 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000012774 insulation material Substances 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000010276 construction Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011449 brick Substances 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- BJQHLKABXJIVAM-BGYRXZFFSA-N 1-o-[(2r)-2-ethylhexyl] 2-o-[(2s)-2-ethylhexyl] benzene-1,2-dicarboxylate Chemical compound CCCC[C@H](CC)COC(=O)C1=CC=CC=C1C(=O)OC[C@H](CC)CCCC BJQHLKABXJIVAM-BGYRXZFFSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N Diethylhexyl phthalate Natural products CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000582 polyisocyanurate Polymers 0.000 description 2
- 239000011495 polyisocyanurate Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006004 Quartz sand Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006328 Styrofoam Polymers 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940067572 diethylhexyl adipate Drugs 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- 239000006012 monoammonium phosphate Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000008261 styrofoam Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/69—Particle size larger than 1000 nm
Abstract
Description
본 발명은 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재에 관한 것이다.The present invention relates to an insulating material coated with a liquid coating agent comprising a ceramic microsphere and a silicon microsphere.
일반적으로 콘크리트 건물에서 실내를 구획하는 외벽체 및 층간 슬라브에는 실내를 냉난방 하는데 따른 열 손실 및 결로현상을 방지하고자 단열재를 설치한다. 콘크리트 건물 등의 벽체에 대한 시공은 일반적으로 크게 단열시공과 마감시공으로 나누어지며, 이 두 가지의 시공이 각각 따로 이루어진다. 예를 들면, 건축물의 벽체 내측면에 단열재를 부착 설치하는 것에 의하여 단열시공이 이루어지고, 상기 단열재 상에 석고보드 등을 설치함으로써 마감시공이 이루어진다.In general, the outer wall and the interlayer slabs that divide the room in a concrete building are installed with insulation to prevent heat loss and condensation caused by heating and cooling the room. Construction of walls for concrete buildings and the like is generally largely divided into adiabatic construction and finishing construction, and these two constructions are performed separately. For example, the insulation construction is performed by attaching and installing an insulating material on the inner surface of the wall of the building, and the finishing construction is performed by installing a plasterboard or the like on the insulation material.
일반적으로 사용되는 단열재로는, 폴리스티렌(polystylene)이 발포되어 형성된 스티로폼, 폴리이소시아누레이트(polyisocyanurate, PIR)의 발포체, 폴리우레탄(polyurethane, PUR)의 발포체 또는 유리섬유 등이 있다. As a commonly used insulation material, there are styrofoam formed by foaming polystyrene, polyisocyanurate (PIR) foam, foam or glass fiber of polyurethane (PUR), or the like.
상기 단열재들은 주로, 플라스틱 성형물로서 이종의 발포성 기체를 사용하여 발포시키기 때문에 단열성이 좋고, 상대적으로 높은 내수성을 가지지만, 부피를 많이 차지하고, 다수의 시공 단계를 거쳐야 하므로, 시공비 및 시공 시간 면에서 불리하고, 열에 매우 취약할 뿐만 아니라 여름철 장마 등의 습기를 막아주는 방수효과가 좋지 않다는 문제점이 있다.The insulating materials are mainly molded by using a different type of foaming gas as a plastic molding, and thus have good thermal insulation properties, have relatively high water resistance, but occupy a lot of volume and require a number of construction steps, and thus are disadvantageous in terms of construction cost and construction time. And, it is not only very vulnerable to heat, but also has a problem that the waterproof effect that prevents moisture such as rainy season in summer is not good.
한편, 유리섬유를 이용한 단열재의 경우, 유리섬유를 그대로 사용하지 않고, 표면에 함석 등을 부착하여 유리섬유 가루 등이 날리지 않도록 하는데, 이때 접착제를 사용하고 있어 환경호르몬 등의 심각한 문제점이 있어, 이를 해소하기 위한 방안이 절실히 필요한 상태이다.On the other hand, in the case of an insulating material using glass fibers, the glass fibers are not used as they are, and a tin or the like is attached to the surface so that the glass fiber powder does not fly away. There is an urgent need for a solution to resolve this.
본 발명의 단열재 관련 종래 기술로는 한국등록특허 제1683141호에 난연성이 부여된 단열재 조성물 및 이를 이용한 건축용 단열재 제조방법이 개시되어 있고, 한국등록특허 제1651150호에 친환경 보온성 단열재 및 이의 제조방법이 개시되어 있으나, 본 발명의 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재에 대해서는 개시된 바 없다.As the related art related to the heat insulating material of the present invention, an insulating material composition having a flame retardant property granted to Korean Registered Patent No. 1683141 and a method for manufacturing a building insulating material using the same are disclosed. However, it has not been disclosed for a heat insulating material coated with a liquid coating comprising a ceramic microsphere and a silicon microsphere of the present invention.
본 발명은 상기와 같은 요구에 의해 도출된 것으로서, 본 발명은 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재를 제공하고, 본 발명의 단열재가 종래의 단열재에 비해 두께가 얇아도 열관류율 및 열전도율이 낮아 단열효과가 우수하다는 것을 확인함으로써, 본 발명을 완성하였다.The present invention has been derived by the above-described needs, the present invention provides a heat insulating material coated with a liquid coating agent comprising ceramic microspheres and silicon microspheres, even though the heat insulating material of the present invention is thinner than conventional heat insulating materials The present invention was completed by confirming that the heat insulation effect is excellent due to low heat permeability and low thermal conductivity.
상기 목적을 달성하기 위하여, 본 발명은 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재를 제공한다.In order to achieve the above object, the present invention provides a heat insulating material coated with a liquid coating agent comprising a ceramic microsphere and a silicon microsphere.
본 발명은 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재에 관한 것으로, 종래에 사용되는 단열재 대비, 표면에 도포된 액상 코팅제 층이 내부 공기를 밀폐시켜 대류현상이 차단되어 단열성능을 향상시킬 수 있어서, 종래의 두꺼운 단열재(50~100mm)보다 더 얇은 10~12mm의 단열재를 사용하여도 열관류율이 우수한 효과가 있다. 또한, 액상 코팅제는 친수성 기를 포함하고 있지 않으므로, 단열뿐만 아니라, 방수 효과도 있는 것이 특징이다. The present invention relates to a heat insulating material coated with a liquid coating agent containing ceramic microspheres and silicon microspheres, compared to a heat insulating material used in the prior art, the liquid coating layer applied to the surface seals the internal air, thereby preventing convection and insulating performance. It can be improved, even when using a thermal insulation material of 10 to 12mm thinner than the conventional thick insulation (50 ~ 100mm) has an excellent effect of heat permeability. In addition, since the liquid coating agent does not contain a hydrophilic group, it is characterized by having not only heat insulation but also a waterproof effect.
도 1은 본 발명에 따른 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재의 모식도이다.1 is a schematic diagram of a heat insulating material coated with a liquid coating comprising a ceramic microsphere and a silicon microsphere according to the present invention.
본 발명은 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재에 관한 것이다.The present invention relates to an insulating material coated with a liquid coating agent comprising a ceramic microsphere and a silicon microsphere.
상기 세라믹 마이크로스피어의 직경은 10~50㎛이고, 실리콘 마이크로스피어의 직경은 30~100㎛인 것이 바람직하지만 이에 한정하지 않는다. 상기 액상 코팅제는 75~85중량%의 세라믹 마이크로스피어 및 5~15%의 실리콘 마이크로스피어를 포함하는 것이 바람직하지만 이에 한정하지 않으며, 상기 액상 코팅제는 세라믹 마이크로스피어 및 실리콘 마이크로스피어 이외에 고분자 중합체, 바인더, 안료, 난연제 및 가소제를 더 포함할 수 있으며, 당업계에서 허용하는 고분자 중합체, 바인더, 안료, 난연제 또는 가소제라면 어는 것이든 무방하게 사용할 수 있으며, 상기 난연제는 트리크레실포스페이트, 염소화파라핀, 산화안티몬, 모노암모늄 포스페이트 또는 붕산인 것이 바람직하지만 이에 한정하지 않는다. 상기 가소제(plasticizer)는 프탈산계(phthalates)의 디에틸헥실프탈레이트(DEHP), 디이소논닐프탈레이트(DINP) 또는 디브틸프탈레이트(DBP)이거나, 아디핀산계(adipates)의 디에틸헥실아디페이트(DEHA)인 것이 바람직하지만 이에 한정하지 않는다. The ceramic microspheres have a diameter of 10 to 50 μm, and the silicon microspheres have a diameter of preferably 30 to 100 μm, but are not limited thereto. The liquid coating agent is preferably 75 to 85% by weight of ceramic microspheres and 5 to 15% of silicon microspheres, but is not limited thereto, and the liquid coating agent is a polymer polymer, a binder, in addition to ceramic microspheres and silicon microspheres, Pigments, flame retardants and plasticizers may be further included, and any polymer polymer, binder, pigment, flame retardant, or plasticizer acceptable in the art may be used, and the flame retardant may include tricresyl phosphate, chlorinated paraffin, and antimony oxide. , Monoammonium phosphate or boric acid, but is not limited thereto. The plasticizer may be diethylhexyl phthalate (DEHP), diisononyl phthalate (DINP) or dibutyl phthalate (DBP) of phthalates, or diethylhexyl adipate of adipices ) Is preferred, but is not limited thereto.
상기 도포는 분사하거나 롤러 또는 붓으로 칠할 수 있으며, 도포하고자 하는 단열재를 본 발명에 따른 액상코팅제에 함침하는 등 도포하는 방법에 제한하지 않는다. The coating may be sprayed or painted with a roller or brush, and is not limited to a method of coating, such as impregnating the liquid coating agent according to the present invention with the insulating material to be applied.
본 발명에 따른 단열재는 그 종류에 특별히 제한하지 않으나, 다공질의 구조로 이루어진 것이 바람직하며, 더 바람직하게는 유리섬유, 미분광물 단열벽돌, 코르크질 또는 발포합성수지질인 것이지만 이에 제한하는 것은 아니다. The insulating material according to the present invention is not particularly limited in its kind, but is preferably made of a porous structure, and more preferably, it is a glass fiber, a finely divided insulating brick, cork-like or foam synthetic resin, but is not limited thereto.
상기 액상 코팅제는 0.5~1.5mm의 두께로, 단열재 표면에 도포된 것이 바람직하지만, 이에 한정하지 않으며, 단열재 표면 전체를 도포하는 것이 특징이다.
The liquid coating agent has a thickness of 0.5 to 1.5 mm, and is preferably applied to the surface of the heat insulating material, but is not limited thereto, and is characterized by applying the entire surface of the heat insulating material.
이하, 실시예를 이용하여 본 발명을 더욱 상세하게 설명하고자 한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위한 것으로 본 발명의 범위가 이들에 의해 제한되지 않는다는 것은 당해 기술분야에서 통상의 지식을 가진 자에게 있어 자명한 것이다.
Hereinafter, the present invention will be described in more detail using examples. It is obvious to those skilled in the art that these examples are only intended to illustrate the present invention in more detail and that the scope of the present invention is not limited by them.
실시예Example 1. 본 발명의 세라믹 1. Ceramic of the present invention 마이크로스피어Microsphere 및 실리콘 And silicone 마이크로스피어를Microspheres 포함하는 액상 코팅제가 Liquid coating containing 도포된Applied 단열재의 제조 Production of insulation
본 실시예 1에서는 두께가 10mm인 유리섬유 표면에, 1mm의 두께로 액상 코팅제를 도포하여 12mm 두께의 얇은 단열재를 제조하였으며, 상기 액상코팅제의 배합은 80중량%의 세라믹 마이크로스피어, 10중량%의 실리콘 마이크로스피어 및 10중량%의 첨가제(고분자 중합체, 안료, 난연제 및 가소제)의 비율로 배합하여 제조하였다.
In this Example 1, a thin insulating material having a thickness of 12 mm was prepared by applying a liquid coating agent to a surface of a glass fiber having a thickness of 10 mm, and a thickness of 1 mm. It was prepared by blending silicone microspheres and 10% by weight of additives (polymer polymer, pigment, flame retardant, and plasticizer).
실시예Example 2. 본 발명의 세라믹 2. Ceramic of the present invention 마이크로스피어Microsphere 및 실리콘 And silicone 마이크로스피어를Microspheres 포함하는 액상 코팅제가 Liquid coating containing 도포된Applied 단열재의 특성 분석 Characterization of insulation
상기 실시예 1에서 제조한 단열재의 특성을 분석하여 하기 표 1에 개시하였다. The properties of the heat insulating material prepared in Example 1 were analyzed and disclosed in Table 1 below.
실시예Example 3. 본 발명의 세라믹 3. Ceramic of the present invention 마이크로스피어Microsphere 및 실리콘 And silicone 마이크로스피어를Microspheres 포함하는 액상 코팅제가 Liquid coating containing 도포된Applied 단열재의 Insulation 열관류율Heat transmission rate 및 열전도율 분석 And thermal conductivity analysis
상기 실시예 1에서 제조한 단열재의 열전도율(W/mK)을 측정하여 열관류율(W/m2K)을 계산하였다. The thermal conductivity (W/m 2 K) was calculated by measuring the thermal conductivity (W/mK) of the heat insulating material prepared in Example 1.
식 (1) 열관류율(W/m2K)=열전도율(W/mK)/두께(m)Equation (1) Heat permeability (W/m 2 K) = thermal conductivity (W/mK)/thickness (m)
비교예로서, 본 발명의 액상코팅제가 도포되지 않은 유리섬유(비교예 1), 종래에 시판되고 있는 50mm의 단열재(비교예 2)의 열전도율도 측정하였다.As a comparative example, the thermal conductivity of the glass fiber (Comparative Example 1), to which the liquid coating agent of the present invention was not applied, and a 50 mm heat insulating material (Comparative Example 2) commercially available was also measured.
그 결과 하기 표 2에 개시한 바와 같이, 본 발명의 세라믹 마이크로스피어 및 실리콘 마이크로스피어를 포함하는 액상 코팅제가 도포된 단열재의 열전도도가 현저하게 낮아 열관류율이 낮다는 것을 확인하였다.As a result, as shown in Table 2 below, it was confirmed that the thermal conductivity of the insulating material coated with the liquid coating agent containing the ceramic microspheres and the silicon microspheres of the present invention was remarkably low and the heat permeability was low.
Claims (6)
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