KR20200065383A - Display device, tiliing display device and method for compensation luminance difference by using the same - Google Patents

Abstract

The present invention relates to a display device, a tiling display device, and a luminance difference compensation method of the display device. According to one embodiment of the present invention, the display device comprises: a substrate in which a plurality of sub-pixels including at least one first sub-pixel are defined; a plurality of light emitting elements disposed on each of the plurality of sub-pixels; a piezoelectric element disposed at one side of the first sub-pixel and having a reflection unit; and a light receiving element disposed at the other side of the first sub-pixel. Therefore, by using the reflection unit of the piezoelectric element, light from the light emitting element is incident on the light receiving element, and the luminance of the light emitting element may be measured, and a luminance deviation compensation coefficient capable of reducing luminance variations between the plurality of sub-pixels may be generated.

Description

Display device and tiling display device using the same, and compensation method for luminance deviation of display device {DISPLAY DEVICE, TILIING DISPLAY DEVICE AND METHOD FOR COMPENSATION LUMINANCE DIFFERENCE BY USING THE SAME}

The present invention relates to a display device, and more particularly, to a display device capable of compensating for luminance deviation by receiving light emitted from a light emitting element using a piezoelectric element.

Display devices used in computer monitors, TVs, and mobile phones include organic light emitting displays (OLEDs) that emit light by themselves, and liquid crystal displays (LCDs) that require a separate light source. have.

2. Description of the Related Art A display device has a wide range of applications, not only a computer monitor and a TV, but also a personal portable device, and research has been conducted on a display device having a large display area and a reduced volume and weight.

On the other hand, recently, a tiled display device having a large display area by connecting a plurality of display devices is attached to a wall or the like and used as a billboard.

First, display devices are used from small-sized electronic devices used in mobile phones to large-sized electronic devices such as large TVs. As such, the display device is manufactured from a small size to a large size of tens of inches, and is used for various purposes. However, it is a technically difficult situation to manufacture a display device with an extra large size of several hundred inches or more, and instead, a tiling display device having a large display area by connecting multiple display devices is used. In addition, a tiling display device composed of a plurality of display devices is attached to a wall surface to be used as a billboard, or used as a large billboard or outdoor advertising billboard in a stadium.

A plurality of light emitting elements and a plurality of semiconductor elements for driving the plurality of light emitting elements may be disposed in each of the plurality of display devices constituting the tiling display device. In addition, deviations such as characteristics of a plurality of light emitting elements and a plurality of semiconductor elements may be compensated before shipment of the plurality of display devices before shipment. However, as the display device is driven, deviations due to deterioration of a plurality of light emitting elements and threshold voltages or mobility changes of the plurality of semiconductor elements may occur, and thus luminance deviation and color deviation may occur in the display device.

Accordingly, the inventors of the present invention recognized a problem in that luminance deviation and color deviation of the display device are generated according to driving of the display device, and image viewing may be disturbed by the luminance deviation and color deviation. In addition, the inventors of the present invention have recognized a problem that a luminance deviation and color deviation between a plurality of display devices may occur even in a tiling display device composed of a plurality of display devices.

Accordingly, the inventors of the present invention invented a method for compensating for luminance deviation and color deviation between a plurality of light emitting elements in one display device even before and after the display device is shipped. In addition, the inventors of the present invention have invented a method for compensating for luminance deviation and color deviation between a plurality of display devices in a tiling display device composed of a plurality of display devices before and after delivery.

Accordingly, a problem to be solved by the present invention is to provide a display device capable of compensating for luminance deviation and color deviation in one display device in real time.

Another problem to be solved by the present invention is to provide a display device capable of compensating for luminance deviation and color deviation due to deterioration of a light emitting element and deviation of a driving circuit in one display device even after shipment.

Another problem to be solved by the present invention is to provide a display device that reflects light from a light emitting element to a light receiving element only when the luminance deviation and color deviation are compensated, and does not reduce the luminance of the display device when displaying an image.

Another problem to be solved by the present invention is to provide a display device capable of easily compensating for luminance deviation and color deviation between a plurality of display devices when a plurality of display devices are implemented as a tiled display device.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A display device according to an exemplary embodiment of the present invention includes: a substrate on which a plurality of sub-pixels including at least one first sub-pixel are defined, a plurality of light-emitting elements disposed on each of the plurality of sub-pixels, and one of the first sub-pixels It includes a piezoelectric element disposed on the side, the reflecting portion and a light receiving element disposed on the other side of the first sub-pixel. Therefore, the luminance of the light emitting element can be measured by incident light from the light emitting element to the light receiving element by using the reflector of the piezoelectric element, and a luminance deviation compensation coefficient capable of reducing luminance deviation between a plurality of sub-pixels can be generated. have.

A display device according to another exemplary embodiment of the present invention includes a substrate on which a plurality of light emitting elements are disposed, a piezoelectric element disposed on a substrate, and a piezoelectric element configured to bendable at one end, and a substrate to emit light of some of the plurality of light emitting elements A piezoelectric element includes a light receiving element configured to receive light emitted from the element, the piezoelectric element includes a reflector disposed on one side of the piezoelectric element, and compensates for luminance by measuring a luminance deviation between some of the light emitting elements. It is possible to reflect light from the light emitting element of the light-receiving element.

In the tiling display device according to an exemplary embodiment of the present invention, a plurality of display devices are arranged in a tile form.

A method for compensating for luminance deviation of a display device according to an exemplary embodiment of the present invention includes: lighting a light emitting element disposed in a first subpixel among a plurality of subpixels on a substrate, disposed on one side of the first subpixel, and reflecting Turning on the piezoelectric element having a portion to reflect light from the light emitting element to the light receiving element side disposed on the other side of the first sub-pixel, transferring the photocurrent from the light receiving element to the data driver, and the photocurrent And reflecting the luminance deviation compensation coefficient derived from the data voltage.

Details of other embodiments are included in the detailed description and drawings.

The present invention can improve luminance uniformity and color uniformity in one display device.

The present invention can improve luminance uniformity and color uniformity between a plurality of display devices.

The present invention can easily compensate for luminance deviation and color deviation by using only a piezoelectric element and a light receiving element instead of a complicated compensation circuit.

The effect according to the present invention is not limited by the contents exemplified above, and more various effects are included in the present invention.

1 is a schematic configuration diagram of a display device according to an exemplary embodiment of the present invention.
2A is a plan view of one first pixel of a display device according to an exemplary embodiment of the present invention.
2B is a plan view of one second pixel of a display device according to an exemplary embodiment of the present invention.
3 is a cross-sectional view of the display device according to III-III' of FIG. 2A.
4 is a flowchart illustrating a method for compensating for luminance deviation in a display device according to an exemplary embodiment of the present invention.
5A to 5D are schematic diagrams for describing a luminance deviation compensation method in a display device according to an exemplary embodiment of the present invention.
6A to 6C are schematic plan views of tiling display devices according to various embodiments of the present invention.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the person having the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for describing the embodiments of the present invention are exemplary, and the present invention is not limited to the illustrated matters. The same reference numerals refer to the same components throughout the specification. In addition, in the description of the present invention, when it is determined that detailed descriptions of related known technologies may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. When'include','have','consist of', etc. mentioned in the present invention are used, other parts may be added unless'~man' is used. When a component is expressed as a singular number, the plural number is included unless otherwise specified.

In interpreting the components, it is interpreted as including the error range even if there is no explicit description.

In the case of the description of the positional relationship, for example, when the positional relationship of two parts is described as'~top','~upper','~bottom','~side', etc. Alternatively, one or more other parts may be located between the two parts unless'direct' is used.

An element or layer being referred to as being "on" another element or layer includes all instances of another layer or other element immediately above or in between.

Also, the first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another component. Accordingly, the first component mentioned below may be the second component within the technical spirit of the present invention.

The same reference numerals refer to the same components throughout the specification.

The area and thickness of each configuration shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the area and thickness of the configuration.

Each of the features of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving is possible, and each of the embodiments may be independently performed with respect to each other or may be implemented together in an association relationship. It might be.

Hereinafter, the present invention will be described with reference to the drawings.

1 is a schematic configuration diagram of a display device according to an exemplary embodiment of the present invention. Referring to FIG. 1, the display device 100 according to an exemplary embodiment of the present invention includes a timing controller TC, a gate driver GD, a data driver DD, a plurality of wires LL, a substrate 110, and It includes a plurality of pixels PX.

The timing controller TC arranges the image data input from the outside and transmits the image data to the data driver DD. The timing controller TC uses a synchronization signal input from the outside, for example, a vertical/horizontal synchronization signal (Vsync, Hsync), a data enable signal (Data Enable), a dot clock (DCLK), and a gate control signal and data. Control signals can be output. In addition, the timing controller TC may control the gate driver GD and the data driver DD by transmitting the generated gate control signal and data control signal to the gate driver GD and the data driver DD, respectively.

The gate driver GD transmits a scan voltage to each of the plurality of pixels PX of the substrate 110 according to a plurality of gate control signals transmitted from the timing controller TC.

The data driver DD converts image data transmitted from the timing controller TC into data voltages according to a plurality of data control signals transmitted from the timing controller TC. Then, the converted data voltage is transferred to each of the plurality of pixels PX.

The data driver DD, the gate driver GD, and a plurality of wires LL connected to the substrate 110 are respectively disposed. The plurality of wires LL may electrically connect the plurality of pixels PX to the gate driver GD and the data driver DD.

The plurality of wires LL includes a plurality of first wires LL1 and a plurality of second wires LL2. The plurality of first wires LL1 may receive the voltage from the gate driver GD and transfer the voltage to each of the plurality of pixels PX. The plurality of second wires LL2 may receive the voltage from the data driver DD and transfer the voltage to each of the plurality of pixels PX. For example, the plurality of first wires LL1 may be gate wires, the plurality of second wires LL2 may be data wires, and the plurality of first wires LL1 and the plurality of second wires LL2 may be power supplies. It may be a wiring or a common wiring, but is not limited thereto.

Meanwhile, in the case of driving circuits such as the gate driver GD and the data driver DD, the plurality of pixels PX may be disposed on the substrate 110 or may be disposed on the rear surface of the substrate 110. . In this case, the area where the gate driver GD and the data driver DD are disposed may be a region in which the light emitting elements of the plurality of pixels PX are difficult to be disposed, and an image may not be substantially displayed. When the gate driver GD and the data driver DD are disposed on the upper surface of the substrate 110, an area in which an image is not displayed may exist on the upper surface of the substrate 110. On the other hand, when the gate driver GD and the data driver DD are disposed on the rear surface of the substrate 110, an area in which an image is not displayed on the upper surface of the substrate 110 can be minimized. That is, only a plurality of pixels PX may be disposed on the upper surface of the substrate 110, and a zero bezel in which no bezel region is substantially present may be implemented. Hereinafter, it will be described on the assumption that the gate driver GD and the data driver DD are disposed on the rear surface of the substrate 110, but the arrangement of the gate driver GD and the data driver DD may be variously designed. And is not limited thereto.

The substrate 110 is for supporting various components included in the display device 100 and may be made of an insulating material. For example, the substrate 110 may be made of a plastic material such as glass or polyimide.

A plurality of pixels PX may be defined on the substrate 110. In addition, the plurality of pixels PX includes a first pixel PX1 and a second pixel PX2. The first pixel PX1 may be formed of a plurality of first sub-pixels SPX1, and the second pixel PX2 may be formed of a plurality of second sub-pixels SPX2. The plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2 are the smallest units constituting the screen, and the combination of the plurality of first sub-pixels SPX1 of the first pixel PX1 of various colors The light may emit light, and a plurality of second sub-pixels SPX2 may emit light of various colors in the second pixel PX2. For example, each of the plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2 may include red sub-pixels, green sub-pixels, and blue sub-pixels, but is not limited thereto.

A light emitting element and a driving circuit for driving the light emitting element may be disposed in each of the plurality of first sub pixels SPX1 and the plurality of second sub pixels SPX2. The light emitting device may be differently defined according to the type of the display device 100. For example, when the display device 100 is an organic light emitting display device, the light emitting device may be an organic light emitting device including an anode, an organic light emitting layer, and a cathode. For example, the display device 100 is an inorganic light emitting display device In this case, the light emitting device may be a light emitting diode (LED) or a micro LED (Micro LED) including an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer. However, the light emitting device may be configured in various ways, and is not limited thereto.

The driving circuit for driving the light emitting element may include a plurality of semiconductor elements and a storage capacitor. For example, the driving circuit may include a switching thin film transistor, a driving thin film transistor, a sensing thin film transistor, and a storage capacitor, but is not limited thereto.

Meanwhile, as described above, each of the plurality of first pixels PX1 and the plurality of second pixels PX2 may be various colors by combining the plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2. Can emit light. Accordingly, in the case of the first pixel PX1, the plurality of first sub-pixels SPX1 constituting the first pixel PX1 include a first red sub-pixel RSPX1 emitting red light and a first emitting green light. The green sub-pixel GSPX1 may include a first blue sub-pixel BSPX1 emitting blue light. In the case of the second pixel PX2, the plurality of second sub-pixels SPX2 constituting the second pixel PX2 include a second red sub-pixel RPSX2 emitting red light and a second green emitting green light. The sub-pixel GSPX2 may include a second blue sub-pixel BSPX2 emitting blue light. Hereinafter, for convenience of description, the first pixel PX1 includes a first red sub-pixel RSPX1, a first green sub-pixel GSPX1, and a first blue sub-pixel BSPX1, and the second pixel PX2 Is assumed to be composed of a second red sub-pixel RSPX2, a second green sub-pixel GSPX2, and a second blue sub-pixel BSPX2, but is not limited thereto.

Meanwhile, in comparison to the plurality of second sub-pixels SPX2, a piezoelectric element and a light-receiving element may be further disposed in each of the plurality of first sub-pixels SPX1 in addition to the light emitting element and the driving circuit. The piezoelectric element and the light receiving element may be configured to measure luminance of light emitted from a plurality of light emitting elements of the plurality of first sub-pixels SPX1. Accordingly, the plurality of first sub-pixels SPX1 in which the piezoelectric element and the light-receiving element are further disposed may function as a reference pixel for measuring and compensating for luminance deviation and color deviation within one display device 100.

In this case, the first pixel PX1 formed of the plurality of first sub-pixels SPX1 may be disposed at various positions in the substrate 110. For example, the first pixel PX1 may be disposed at the center of the substrate 110 or may be disposed at four corners of the substrate 110 among the outermost pixels PX of the substrate 110. In addition, the first pixel PX1 may be at least one of the outermost pixels of the substrate 110. For example, the first pixel PX1 may be an outermost pixel disposed at the center of each of a plurality of edges of the substrate 110 among the outermost pixels of the substrate 110. Although FIG. 1 illustrates that nine first pixels PX1 are disposed on the substrate 110, the arrangement and number of the first pixels PX1 may vary, but is not limited thereto.

Hereinafter, a method for compensating for luminance deviation using the first pixel PX1 and the first pixel PX1 will be described in more detail with reference to FIGS. 2A to 5D.

2A is a plan view of one first pixel of a display device according to an exemplary embodiment of the present invention. 2B is a plan view of one second pixel of a display device according to an exemplary embodiment of the present invention. 3 is a cross-sectional view of the display device according to III-III' of FIG. 2A. Specifically, FIG. 2A is a schematic plan view of each of the first red sub-pixel RSPX1, first green sub-pixel GSPX1, and first blue sub-pixel BSPX1 of the first pixel PX1. 2B is a schematic plan view of each of the second red sub-pixel RSPX2, second green sub-pixel GSPX2, and second blue sub-pixel BSPX2 of the second pixel PX2. FIG. 3 is a cross-sectional view of the first red sub-pixel RSPX1 among the first red sub-pixel RSPX1, the first green sub-pixel GSPX1, and the first blue sub-pixel BSPX1.

2A to 3, a display device 100 according to an exemplary embodiment of the present invention includes a substrate 110, a plurality of semiconductor elements 120, a gate insulating layer 111, a passivation layer 112, and 1 insulating layer 113, second insulating layer 114, third insulating layer 115, a plurality of pad electrodes (PE), a plurality of light emitting elements (130, 140, 150), piezoelectric element 160, light receiving The device 170 includes a plurality of wires LL, a plurality of additional wires LLA, an adhesive layer 180 and a protective film 190.

2A and 2B, a plurality of light emitting devices 130, 140, and 150 are disposed on the substrate 110. Specifically, each of the plurality of light emitting elements 130, 140, and 150 includes a plurality of first sub-pixels SPX1 of the first pixel PX1 and a plurality of second sub-pixels SPX2 of the second pixel PX2, respectively. Is placed on. The plurality of light emitting devices 130, 140, and 150 are light emitting devices that emit light when a voltage is applied. The plurality of light emitting devices 130, 140, and 150 include light emitting devices that emit red light, green light, blue light, and the like, and combinations thereof can implement various colors of light including white light.

If each of the plurality of light emitting elements 130, 140, and 150 emits light of different colors, the light emitting elements disposed in the first red sub-pixel RSPX1 and the second red sub-pixel RPSX2 may emit red light. The red light emitting device 130 may emit light, and the light emitting devices disposed in the first green subpixel GSPX1 and the second green subpixel GSPX2 may be the green light emitting device 140 emitting green light. The light emitting device disposed on the first blue sub-pixel BSPX1 and the second blue sub-pixel BSPX2 may be a blue light-emitting device 150 emitting blue light.

On the other hand, when each of the plurality of light emitting elements 130, 140, 150 emits light of the same color, a light conversion member such as a light conversion layer or a color filter is disposed on each of the plurality of light emitting devices 130, 140, 150 Light emitted from the plurality of light emitting devices 130, 140, and 150 may be converted into various colors. Hereinafter, it is assumed that each of the plurality of light emitting devices 130, 140, and 150 emits light of different colors, but is not limited thereto.

A plurality of lines LL is disposed in each of the pixels PX. The plurality of wires LL may be electrically connected to each of the plurality of first sub-pixels SPX1 of the first pixel PX1 and each of the plurality of second sub-pixels SPX2 of the second pixel PX2. The plurality of wires LL may apply voltages from the gate driver GD and the data driver DD to the light emitting elements 130 and 140 of each of the plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2. 150) and a plurality of first sub-pixels SPX1 and a plurality of second sub-pixels SPX2 by driving the driving circuit including the semiconductor device 120.

Meanwhile, referring to FIG. 2A, a plurality of additional wirings LLA are further disposed only on the first pixel PX1 among the plurality of pixels PX. The plurality of additional wires LLA may be electrically connected to the piezoelectric element 160 and the light receiving element 170 of each of the plurality of first subpixels SPX1 of the first pixel PX1. Although not shown in the drawing, the plurality of additional wires LLA extend toward the gate driver GD and/or the data driver DD to generate a voltage from the gate driver GD and/or the data driver DD. 160) and the light receiving element 170.

The plurality of additional wirings LLA include a first additional wiring LLA1, a second additional wiring LLA2, a third additional wiring LLA3, and a fourth additional wiring LLA4.

The first additional wire LLA1 and the second additional wire LLA2 among the plurality of additional wires LLA may be electrically connected to the piezoelectric element 160. The first additional wiring LLA1 and the second additional wiring LLA2 may transfer a voltage from the gate driver GD and/or the data driver DD to the piezoelectric element 160, or a voltage from a separate driving IC or the like. To the piezoelectric element 160, but is not limited thereto.

The third additional wire LLA3 and the fourth additional wire LLA4 among the plurality of additional wires LLA may be electrically connected to the light receiving element 170. The third additional wiring LLA3 and the fourth additional wiring LLA4 may transfer the reverse bias voltage from the gate driver GD and/or the data driver DD to the light receiving element 170, or a separate driving IC The voltage may be transferred from the back to the piezoelectric element 160, but is not limited thereto. Further, the third additional wiring LLA3 and the fourth additional wiring LLA4 may transfer the photocurrent from the light receiving element 170 to a data driver DD or a separate driving IC.

A piezoelectric element 160 including a reflector 167 is disposed in each of the plurality of first sub-pixels SPX1. The piezoelectric element 160 is disposed on one side of each of the plurality of first sub-pixels SPX1. The piezoelectric element 160 is a device that converts voltages supplied from the first additional wiring LLA1 and the second additional wiring LLA2 into mechanical energy. That is, the piezoelectric element 160 is a device that causes mechanical displacement by electric energy, for example, the piezoelectric element 160 is shaped by the voltage of the first additional wiring LLA1 and the second additional wiring LLA2. It can be transformed. For example, the piezoelectric element 160 may be a piezoelectric actuator made of a piezoelectric material, and may be a unimorph actuator, a bimorph actuator, a multimorph actuator, or the like. Hereinafter, it will be described on the assumption that the piezoelectric element 160 is a bimorph actuator, but the type of the piezoelectric element 160 is not limited thereto.

Meanwhile, the piezoelectric element 160 may be bent by applying a voltage from the first additional wire LLA1 and the second additional wire LLA2. For example, one end of the piezoelectric element 160 may be bent upward while the support portion 161 of the other end is fixed, and thus one end of the reflective portion 167 may move. Deformation of the piezoelectric element 160 as a voltage is applied to the piezoelectric element 160 and functions of the reflector 167 will be described in detail later with reference to FIGS. 5A to 5D.

A light receiving element 170 is disposed in each of the plurality of first sub-pixels SPX1. The light receiving element 170 is disposed on the other side of each of the plurality of first sub-pixels SPX1. That is, the light receiving element 170 may be disposed opposite to the piezoelectric element 160 with the plurality of light emitting elements 130, 140, and 150 of the first pixel PX1 interposed therebetween.

The light receiving element 170 is a device that converts light energy into electrical energy in a state in which reverse bias voltages from the third additional wire LLA3 and the fourth additional wire LLA4 are applied. The light-receiving element 170 can absorb light and convert it into electrical energy, that is, photocurrent, and measure the photocurrent value generated by the light-receiving element 170 to measure the light from the plurality of light-emitting elements 130, 140, 150. Luminance can be measured. The light receiving element 170 may be, for example, a PIN photo diode, an Avalanch photo diode, or the like. Hereinafter, it is assumed that the light receiving element 170 is a PIN photodiode, but it is not limited thereto.

Hereinafter, the first red sub-pixel RSPX1 among the plurality of first sub-pixels SPX1 of the first pixel PX1 will be described in more detail with reference to FIG. 3 together.

Referring to FIG. 3, the semiconductor device 120 is disposed on the substrate 110. The semiconductor element 120 is a component included in a driving circuit for driving the plurality of light emitting elements 130, 140, and 150 disposed in each of the plurality of pixels PX. That is, the semiconductor element 120 may be used as a driving element of the display device 100. The semiconductor device 120 is electrically connected to either the first wire LL1 or the second wire LL2 among the plurality of wires LL to transfer the voltage from the gate driver GD or the data driver DD. Can receive

The semiconductor device 120 may be, for example, a thin film transistor (TFT), an N-channel metal oxide semiconductor (NMOS), or a P-channel metal oxide semiconductor (PMOS). ), Complementary Metal Oxide Semiconductor (CMOS), Field Effect Transistor (FET), and the like, but are not limited thereto. Hereinafter, it is assumed that the semiconductor device 120 is a thin film transistor, but is not limited thereto.

The semiconductor device 120 includes a gate electrode 121, an active layer 122, a source electrode 123 and a drain electrode 124.

The gate electrode 121 is disposed on the substrate 110. The gate electrode 121 may be made of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof, but is not limited thereto.

The gate insulating layer 111 is disposed on the gate electrode 121. The gate insulating layer 111 is a layer for insulating the gate electrode 121 and the active layer 122, and may be made of an insulating material. For example, the gate insulating layer 111 may be formed of a single layer or a multilayer of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

The active layer 122 is disposed on the gate insulating layer 111. For example, the active layer 122 may be made of an oxide semiconductor, amorphous silicon (a-Si) or polysilicon (Poly-Si), but is not limited thereto.

The source electrode 123 and the drain electrode 124 are spaced apart from each other on the active layer 122. The source electrode 123 and the drain electrode 124 may be electrically connected to the active layer 122. The source electrode 123 and the drain electrode 124 may be made of a conductive material, for example, copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof. It is not limited.

The passivation layer 112 is disposed on the semiconductor device 120. The passivation layer 112 is an insulating layer for protecting the structure under the passivation layer 112. For example, the passivation layer 112 may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

The first insulating layer 113 is disposed on the passivation layer 112, and the third additional wiring LLA3 is disposed on the first insulating layer 113. The first insulating layer 113 is an insulating layer for protecting the upper portion of the substrate 110 including the plurality of semiconductor elements 120. For example, the first insulating layer 113 may be an organic material such as an acryl-based material, or may be composed of a single layer or multiple layers of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Does not. In addition, although the upper surface of the first insulating layer 113 is shown in FIG. 3 as a flat surface, the upper surface of the first insulating layer 113 may be disposed along the shape of the semiconductor device 120 like the passivation layer 112. , But is not limited to this.

The second insulating layer 114 is disposed on the first insulating layer 113 and the third additional wiring LLA3, and the first additional wiring LLA1 and the fourth additional wiring on the second insulating layer 114 ( LLA4) is deployed. The second insulating layer 114 is an insulating layer for protecting the upper portion of the substrate 110 including the third additional wiring LLA3 and the plurality of semiconductor elements 120. In addition, the second insulating layer 114 includes a third additional wiring (LLA3) under the second insulating layer 114, a first additional wiring (LLA1) and a fourth additional wiring (above the second insulating layer 114). The electrical short of LLA4) can be minimized. For example, the second insulating layer 114 may be an organic material such as an acryl-based material, or may be composed of a single layer or multiple layers of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Does not. In addition, although the upper surface of the second insulating layer 114 is shown in FIG. 3 as a flat surface, the upper surface of the second insulating layer 114 has a third additional wiring LLA3 and a first insulation under the second insulating layer 114. It may be disposed along the shape of the layer 113, but is not limited thereto.

The third insulating layer 115 is disposed on the first additional wiring LLA1, the fourth additional wiring LLA4, and the second insulating layer 114. The third insulating layer 115 is for protecting the upper portion of the substrate 110 including the first additional wiring LLA1, the fourth additional wiring LLA4, the third additional wiring LLA3, and the semiconductor device 120. It is an insulating layer. In addition, the third insulating layer 115 includes the first additional wiring LLA1 and the fourth additional wiring LLA4 below the third insulating layer 115, and the second additional wiring above the third insulating layer 115 ( LLA2) and the electrical short between the plurality of pad electrodes PE may be minimized. For example, the third insulating layer 115 may be an organic material such as an acryl-based material or a single layer or multiple layers of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto. Does not. In addition, although the upper surface of the third insulating layer 115 is shown in FIG. 3 as a flat surface, the upper surface of the third insulating layer 115 is the first additional wiring LLA1 and the fourth addition under the third insulating layer 115. The wiring LLA4 and the second insulating layer 114 may be disposed along the shape, but are not limited thereto.

Meanwhile, in FIG. 3, the third additional wiring LLA3 is disposed on the first insulating layer 113, and the first additional wiring LLA1 and the fourth additional wiring LLA4 are disposed on the third additional wiring LLA3. The second additional wiring LLA2 is disposed on the first additional wiring LLA1 and the fourth additional wiring LLA4, but the stacking order of each of the plurality of additional wirings LLA may be different. It is not limited to this.

A plurality of pad electrodes PE are disposed on the third insulating layer 115. The plurality of pad electrodes PE are electrodes for electrically connecting the plurality of additional wires LLA and the semiconductor element 120 to each of the piezoelectric element 160, the red light emitting element 130, and the light receiving element 170. The plurality of pad electrodes PE includes a first pad electrode PE1, a second pad electrode PE2, a third pad electrode PE3, a fourth pad electrode PE4, a fifth pad electrode PE5, and a sixth pad electrode PE. And a pad electrode PE6.

Each of the first pad electrode PE1 and the second pad electrode PE2 is an electrode for electrically connecting the plurality of additional wires LLA and the piezoelectric element 160. The first pad electrode PE1 may electrically connect the first additional wire LLA1 and the piezoelectric element 160, and the second pad electrode PE2 may include the second additional wire LLA2 and the piezoelectric element 160. Can be electrically connected. Specifically, a contact hole exposing the first additional wiring LLA1 may be disposed on the third insulating layer 115, and the first pad electrode PE1 may be formed through the contact hole of the third insulating layer 115. 1 The additional wiring LLA1 and the piezoelectric element 160 may be electrically connected. In addition, the second pad electrode PE2 is disposed to extend from the second additional wire LLA2 disposed on the third insulating layer 115, and the second pad electrode PE2 is piezoelectric with the second additional wire LLA2. The device 160 may be electrically connected. That is, the second pad electrode PE2 may be integrally formed with the second additional wire LLA2, but is not limited thereto.

Each of the third pad electrode PE3 and the fourth pad electrode PE4 is an electrode for electrically connecting the driving circuit of each of the plurality of wirings LL and the plurality of sub-pixels PX and the red light emitting device 130. . For example, the third pad electrode PE3 may electrically connect the semiconductor element 120 and the red light emitting element 130 of the driving circuit, and the fourth pad electrode PE4 may include a plurality of wires LL. The red light emitting device 130 may be electrically connected. Specifically, a contact hole exposing the drain electrode 124 of the semiconductor device 120 may be disposed on the first insulating layer 113, the second insulating layer 114, and the third insulating layer 115. The 3 pad electrode PE3 may electrically connect the drain electrode 124 of the semiconductor device 120 and the red light emitting device 130 through the contact hole. In addition, the fourth pad electrode PE4 is disposed to extend from either the first wiring LL1 or the second wiring LL2 of the plurality of wirings LL disposed on the third insulating layer 115. The four pad electrodes PE4 may electrically connect either the first wiring LL1 or the second wiring LL2 and the red light emitting device 130.

Each of the fifth pad electrode PE5 and the sixth pad electrode PE6 is an electrode for electrically connecting the plurality of additional wires LLA and the light receiving element 170. The fifth pad electrode PE5 may electrically connect the third additional wire LLA3 and the light receiving element 170, and the sixth pad electrode PE6 may include the fourth additional wire LLA4 and the light receiving element 170. Can be electrically connected. Specifically, a contact hole exposing the third additional wiring LLA3 may be disposed on the second insulating layer 114 and the third insulating layer 115, and the fifth pad electrode PE5 may be formed through the contact hole. 3 The additional wiring LLA3 and the light receiving element 170 may be electrically connected. In addition, a contact hole exposing the fourth additional wiring LLA4 may be disposed on the third insulating layer 115, and the sixth pad electrode PE6 may include a fourth additional wiring LLA4 and a light receiving element ( 170) can be electrically connected.

The bank 116 is disposed on the plurality of pad electrodes PE and the third insulating layer 115. The bank 116 is an insulating layer for distinguishing each of the plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2 adjacent to each other. Further, the bank 116 may be an insulating layer for distinguishing the red light emitting device 130, the piezoelectric device 160, and the light receiving device 170 from the plurality of first subpixels SPX1. The bank 116 may be disposed to open a portion of each of the plurality of pad electrodes PE, and the bank 116 may be an organic insulating material disposed to cover the edges of each of the plurality of pad electrodes PE. .

The piezoelectric element 160 is disposed on the first pad electrode PE1 and the second pad electrode PE2 exposed from the bank 116. As described above, the piezoelectric element 160 is an element that causes mechanical displacement by electrical energy. The piezoelectric element 160 may be deformed in shape by voltages provided from the first additional wire LLA1 and the second additional wire LLA2, and for example, a voltage is applied to the piezoelectric element 160 to cause piezoelectricity. When the element 160 is turned on, one end of the piezoelectric element 160 may be bent to face the upper side of the substrate 110.

The piezoelectric element 160 includes a first contact electrode 168, a second contact electrode 169, a support 161, a first electrode 162, a first piezoelectric layer 163, a second electrode 164, a first 2 includes a piezoelectric layer 165, a third electrode 166 and a reflector 167.

Each of the first contact electrode 168 and the second contact electrode 169 is electrically connected to the first pad electrode PE1 and the second pad electrode PE2. The first contact electrode 168 may receive a voltage from the first additional wire LLA1 through the first pad electrode PE1, and the second contact electrode 169 may be provided through the second pad electrode PE2. 2 The voltage may be transmitted from the additional wiring LLA2.

The support part 161 is disposed on the first contact electrode 168 and the second contact electrode 169. The support unit 161 may support the other ends of the first electrode 162, the first piezoelectric layer 163, the second electrode 164, the second piezoelectric layer 165, and the third electrode 166. The support part 161 may include, for example, a first electrode 162, a first piezoelectric layer 163, a second electrode 164, and a second piezoelectric layer on a base substrate made of an insulating material such as silicon (Si). After forming the 165 and the third electrode 166, the base substrate may be formed by etching in the shape of the support 161. As the first electrode 162, the first piezoelectric layer 163, the second electrode 164, the second piezoelectric layer 165, and the support portion 161 supporting the other ends of the third electrode 166 are disposed piezoelectric The device 160 may be formed in the form of a cantilever.

The first electrode 162, the first piezoelectric layer 163, the second electrode 164, the second piezoelectric layer 165, and the third electrode 166 are sequentially disposed on the support 161. The first piezoelectric layer 163 may contract or expand by the voltages of the first electrode 162 and the second electrode 164, and the second piezoelectric layer 165 may include the second electrode 164 and the third electrode It can contract or expand by the voltage of (166). The first piezoelectric layer 163 and the second piezoelectric layer 165 may be made of, for example, a material exhibiting piezoelectric phenomena such as crystal, barium titanate (BaTiO3), lead titanate (PbTiO3), or piezoelectric ceramic (PZT). .

In addition, the first piezoelectric layer 163 and the second piezoelectric layer 165 may have different polarization directions. For example, the first piezoelectric layer 163 may be formed with a polarization in which electrons are collected in an upper region or a lower region, and holes may be collected in a lower region or an upper region. Conversely, the second piezoelectric layer 165 may have a lower region. Alternatively, a polarization in which holes are collected in the upper region and electrons are collected in the upper region or the lower region may be formed.

The same voltage may be applied to the first electrode 162 and the third electrode 166, and different voltages from the first electrode 162 and the third electrode 166 may be applied to the second electrode 164. For example, the first electrode 162 and the third electrode 166 are connected to either the first pad electrode PE1 or the second pad electrode PE2, and the second electrode 164 is connected to the other one. Can be connected.

When voltages in the same direction as the polarization direction are applied to the first piezoelectric layer 163 and the second piezoelectric layer 165, the first piezoelectric layer 163 and the second piezoelectric layer 165 may contract, and the first When voltages in a direction opposite to the polarization direction are applied to each of the piezoelectric layer 163 and the second piezoelectric layer 165, the first piezoelectric layer 163 and the second piezoelectric layer 165 may expand.

In addition, when a voltage is applied to the piezoelectric element 160, either the first piezoelectric layer 163 or the second piezoelectric layer 165 may contract, and the other may expand, and the first piezoelectric layer 163 And the second piezoelectric layer 165 may be bent in one direction. Hereinafter, when the piezoelectric element 160 is turned on by applying a voltage to the piezoelectric element 160, the first electrode 162, the first piezoelectric layer 163, and the second electrode 164 where the support part 161 is not disposed ), one end of the second piezoelectric layer 165 and the third electrode 166 will be described on the assumption that the substrate 110 is bent toward the upper side.

The reflective portion 167 is disposed on the lower surface of the first electrode 162. The reflector 167 may be disposed at one end of the first electrode 162 on the lower surface of the first electrode 162. When the piezoelectric element 160 is turned on, the reflector 167 may reflect light emitted from the light emitting elements 130, 140, and 150 of each of the plurality of first subpixels SPX1 toward the light receiving element 170. have. The reflector 167 may be made of a reflective material, for example, made of a highly reflective material such as aluminum (Al) or silver (Ag).

Meanwhile, in FIG. 2A, although the reflector 167 has a width greater than the width of the first electrode 162 and is not projected to the outside of one end of the first electrode 162, the reflector 167 is The first electrode 162 may have a width equal to or smaller than the width of the first electrode 162, and may protrude outward from one end of the first electrode 162, but is not limited thereto. In addition, in FIGS. 2A to 3, although the reflector 167 is illustrated as having a flat rectangular plate shape, the reflector 167 may have a concave or convex surface, and the shape and size of the reflector 167 are limited thereto. Does not work.

The red light emitting device 130 is disposed on the third pad electrode PE3 and the fourth pad electrode PE4 exposed from the bank 116. The red light emitting element 130 may be disposed on the same plane as the piezoelectric element 160. The red light emitting device 130 may emit light by voltages from the plurality of wirings LL and the semiconductor device 120. Hereinafter, it is assumed that the plurality of light emitting elements 130, 140, and 150 including the red light emitting element 130 are LEDs or micro LEDs, but the plurality of light emitting elements 130, 140, and 150 are display devices. It may vary depending on the type of (100), but is not limited thereto.

On the other hand, when the plurality of light emitting devices 130, 140, and 150 are LEDs, they may be formed in various structures such as a horizontal type, a vertical type, and a flip chip. The LED of the horizontal structure includes a light emitting layer and an N type electrode and a P type electrode disposed horizontally on both sides of the light emitting layer. In the horizontal type LED, electrons transferred to the light emitting layer through the N-type electrode and holes transferred to the light emitting layer through the P-type electrode may be combined to emit light. The LED of the vertical structure includes a light emitting layer, an N-type electrode and a P-type electrode disposed above and below the light emitting layer. The vertical LED, like the horizontal LED, can emit light through a combination of electrons and holes transmitted from an electrode. The flip-chip LED has substantially the same structure as the horizontal LED. However, the LED of the flip-chip structure omits a medium such as a metal wire, and can be directly attached to a printed circuit board or the like. Hereinafter, for convenience of description, it will be described on the assumption that the plurality of light emitting elements 130, 140, and 150 are flip-chip structures, but the present invention is not limited thereto.

Referring to FIG. 3, the red light emitting device 130 includes a third contact electrode 134, a fourth contact electrode 135, a first semiconductor layer 131, a light emitting layer 132, and a second semiconductor layer 133. Includes.

Each of the third contact electrode 134 and the fourth contact electrode 135 is electrically connected to the third pad electrode PE3 and the fourth pad electrode PE4. The third contact electrode 134 may transfer a voltage from the drain electrode 124 of the semiconductor device 120 transferred through the third pad electrode PE3 to the first semiconductor layer 131, and the fourth contact electrode ( 135 may transfer the voltage transmitted through the fourth pad electrode PE4 to the second semiconductor layer 133.

The first semiconductor layer 131 is disposed on the third contact electrode 134, and the second semiconductor layer 133 is disposed on the first semiconductor layer 131. The first semiconductor layer 131 and the second semiconductor layer 133 may be layers formed by implanting N-type or P-type impurities into gallium nitride (GaN). For example, the first semiconductor layer 131 is a P-type semiconductor layer formed by injecting P-type impurities into gallium nitride, and the second semiconductor layer 133 is an N-type formed by injecting N-type impurities into gallium nitride. It may be a semiconductor layer, but is not limited thereto. In addition, the P-type impurity may be magnesium (Mg), zinc (Zn), beryllium (Be), and the like, and the N-type impurity may be silicon (Si), germanium (Ge), tin (Sn), but is not limited thereto. Does not.

The light emitting layer 132 is disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The emission layer 132 may receive holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133 to emit light. The light emitting layer 132 may be formed of a single layer or a multi-quantum well (MQW) structure. For example, the light emitting layer 132 may be made of indium gallium nitride (InGaN) or gallium nitride (GaN), but is not limited thereto.

In this case, the emission layer of the red light emitting device 130 disposed in the first red sub-pixel RSPX1 of the plurality of first sub-pixels SPX1 and the second red sub-pixel RSPX2 of the plurality of second sub-pixels SPX2 Red light may be emitted from 132. In addition, green light may be emitted from the light emitting layer 132 of the green light emitting device 140 disposed in the first green sub pixel GSPX1 and the second green sub pixel GSPX2, and the first blue sub pixel BSPX1 and Blue light may be emitted from the light emitting layer 132 of the blue light emitting device 150 disposed in the second blue sub-pixel BSPX2.

Meanwhile, a portion of the second semiconductor layer 133 protrudes outside the light emitting layer 132 and the first semiconductor layer 131. In other words, the light emitting layer 132 and the first semiconductor layer 131 may have a smaller area than the second semiconductor layer 133 to expose the bottom surface of the second semiconductor layer 133. The second semiconductor layer 133 may be exposed from the light emitting layer 132 and the first semiconductor layer 131 to be electrically connected to the fourth contact electrode 135.

The light receiving element 170 is disposed on the fifth pad electrode PE5 and the sixth pad electrode PE6 exposed from the bank 116. The light receiving element 170 is a device that converts light into electrical energy, and can measure the luminance of light emitted from the red light emitting element 130. In addition, the light receiving element 170 may be disposed on the same plane as the piezoelectric element 160 and the red light emitting element 130.

The light receiving element 170 includes a fifth contact electrode 174, a sixth contact electrode 175, a P-type semiconductor layer 171, an intrinsic semiconductor layer 172 and an N-type semiconductor layer 173.

First, each of the P-type semiconductor layer 171 and the N-type semiconductor layer 173 may be a layer formed by implanting P-type impurities and N-type impurities. For example, the P-type semiconductor layer 171 may be formed by injecting P-type impurities such as boron into silicon, and the N-type semiconductor layer 173 may contain N-type impurities such as phosphorus into silicon. It can be formed by injecting.

An intrinsic semiconductor layer 172 is disposed between the P-type semiconductor layer 171 and the N-type semiconductor layer 173. The intrinsic semiconductor layer 172 may be made of fine crystalline silicon with no impurities added.

Meanwhile, one surface of the P-type semiconductor layer 171 is disposed to have a slope with respect to the substrate 110. One surface of the P-type semiconductor layer 171 closest to the red light emitting device 130 among a plurality of surfaces of the P-type semiconductor layer 171 may be disposed to have an inclination with respect to the substrate 110. For example, a side surface of the P-type semiconductor layer 171 facing the red light emitting device 130 may be disposed to have an inclination with respect to the substrate 110. Light from the reflector 167 may be incident on one surface of the P-type semiconductor layer 171, which will be described later in detail with reference to FIGS. 5A to 5D.

Each of the fifth contact electrode 174 and the sixth contact electrode 175 is electrically connected to the fifth pad electrode PE5 and the sixth pad electrode PE6. The fifth contact electrode 174 may electrically connect the third additional wire LLA3 and the P-type semiconductor layer 171 through the fifth pad electrode PE5. The sixth contact electrode 175 may electrically connect the fourth additional wire LLA4 and the N-type semiconductor layer 173 through the sixth pad electrode PE6.

On the other hand, when a voltage is applied to the light receiving element 170, the intrinsic semiconductor layer 172 is depleted by the P-type semiconductor layer 171 and the N-type semiconductor layer 173, and an electric field is generated. Holes and electrons generated by light are drifted by an electric field, and current may be generated toward the P-type semiconductor layer 171 and the N-type semiconductor layer 173, respectively. In addition, the amount of current generated may be further increased according to the intensity of light. Accordingly, the intensity of light incident on the light receiving element 170 may be measured through the generated amount of current.

The adhesive layer 180 and the protective film 190 are disposed on the piezoelectric element 160, the plurality of light emitting elements 130, 140, and 150 and the light receiving element 170.

The adhesive layer 180 may be used to bond the protective film 190 on the substrate 110. In this case, since the adhesive layer 180 needs to transmit light emitted from the plurality of light emitting elements 130, 140, and 150, excellent transmittance and adhesion are required. Thus, the adhesive layer 180 may be made of an adhesive material having excellent permeability, for example, the adhesive layer 180 may be made of OCA (Optical Clear Adhesive) or the like, but is not limited thereto.

Meanwhile, the adhesive layer 180 may be disposed to overlap the region except for the first pixel PX1 on the front surface of the substrate 110. Specifically, the adhesive layer 180 is not disposed to overlap the first pixel PX1 including the plurality of first sub-pixels SPX1 on which the plurality of piezoelectric elements 160 and the plurality of light-receiving elements 170 are disposed, The plurality of piezoelectric elements 160 and the plurality of light receiving elements 170 may be disposed to overlap only the second pixel PX2 including the plurality of second sub pixels SPX2 not disposed. That is, the adhesive layer 180 is not disposed to cover the piezoelectric element 160 and the light receiving element 170, and the light emitting element 130 disposed in the second pixel PX2 among the plurality of light emitting elements 130, 140 and 150 , 140, 150 ).

As the adhesive layer 180 is disposed so as not to cover the first pixel PX1, it may not prevent the plurality of piezoelectric elements 160 from bending in the first pixel PX1. In addition, the light of the plurality of light emitting elements 130, 140 and 150 of the first pixel PX1 is transmitted to the light receiving element 170 so that the path of the light reflected from the reflecting portion 167 of the piezoelectric element 160 is not changed. It can be made easy to enter.

The protective film 190 is disposed on the adhesive layer 180. The protective film 190 is a protective member for protecting various components on the substrate 110. The protective film 190 may protect components under the protective film 190 from external impact, moisture, and heat. The protective film 190 may be made of a material having impact resistance and light transmittance. For example, the protective film 190 may be a thin film made of a plastic material such as polymethylmethacrylate (PMMA), polyimide, or polyethylene terephthalate (PET), but is not limited thereto. .

In FIG. 3, for convenience of explanation, only a cross-sectional view of the first red sub-pixel RSPX1 is shown, but compared to the first red sub-pixel RSPX1, the first green sub-pixel GSPX1 and the first blue sub-pixel BSPX1 ) Each of the green light emitting device 140 and the blue light emitting device 150 is disposed instead of the red light emitting device 130, and cross-sectional views of the first green sub pixel GSPX1 and the first blue sub pixel BSPX1 are also shown. It is substantially the same as the cross section of 3.

Hereinafter, a method of compensating for a luminance deviation between a plurality of pixels PX of the display device 100 will be described in detail with reference to FIGS. 4 to 5D.

4 is a flowchart illustrating a method for compensating for luminance deviation in a display device according to an exemplary embodiment of the present invention. 5A to 5D are schematic diagrams for describing a luminance deviation compensation method in a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 5A, a plurality of light emitting elements of a first pixel are turned on (S110).

Specifically, the red light-emitting element 130 of the first red sub-pixel RSPX1 of the first pixel PX1 is turned on. The red light emitting device 130 of the first red sub-pixel RSPX1 may be turned on. In this case, the same voltage may be transmitted to each of the plurality of first red sub-pixels RSPX1 in order to measure luminance deviation and color deviation of each red light-emitting element 130 of the plurality of first red sub-pixels RSPX1. have.

Meanwhile, as described above, the plurality of first sub-pixels SPX1 of the plurality of first pixels PX1 may include a first red sub-pixel RSPX1, a first green sub-pixel GSPX1, and a first blue sub-pixel ( BSPX1). If the red light emitting device 130 of the first red sub-pixel RSPX1 of one of the first pixels PX1 among the plurality of first pixels PX1 is turned on, the first of the other first pixels PX1 is turned on. When the green light-emitting element 140 of the green sub-pixel (GSPX1) is lit, the red light-emitting element 130 and the green light-emitting element 140 each emit light of different colors, and thus the luminance deviation for the red light And color deviation cannot be measured. Accordingly, in the plurality of first pixels PX1 on the substrate 110, only the light emitting elements of the first sub-pixel SPX1 emitting light of the same color can be selectively emitted. For example, the first red sub-pixel is applied to each of the plurality of first pixels PX1 by applying a specific voltage to the first red sub-pixel RSPX1, the first green sub-pixel GSPX1, or the first blue sub-pixel BSPX1. The light emitting devices 130, 140, and 150 disposed in each of the pixel RSPX1, the first green sub-pixel GSPX1, or the first blue sub-pixel BSPX1 may be turned on.

Hereinafter, for convenience of description, it is assumed that the red light emitting device 130 of the first red sub pixel RSPX1 is turned on in the plurality of first sub pixels SPX1 to compensate for luminance deviation and color deviation of red light. Will be explained. However, the process of compensating for luminance deviation and color deviation by lighting the green light emitting element 140 of the first green sub pixel GSPX1 and the blue light emitting element 150 of the first blue sub pixel BSPX1 is performed by the first red sub The process of compensating for luminance deviation and color deviation by lighting the red light emitting device 130 of the pixel RSPX1 may be the same.

Meanwhile, the light emitted from the red light emitting device 130 may be radiated. For example, when the region emitting light emitted from the red light emitting device 130 is referred to as a radiation region, the emission angle θ formed by the radiation region may be about 120 degrees, but is not limited thereto.

Next, referring to FIG. 5A, the piezoelectric element is turned on (S120).

Specifically, the piezoelectric element 160 may be turned on while the red light emitting element 130 is turned on. The voltage is transferred to the first electrode 162, the second electrode 164, and the third electrode 166 of the piezoelectric element 160 to shrink and contract the first piezoelectric layer 163 and the second piezoelectric layer 165. Can inflate. Accordingly, the piezoelectric element 160 may be bent, and one end of the piezoelectric element 160 spaced apart from the support 161 may be bent toward the upper side of the substrate 110.

In addition, when the piezoelectric element 160 is turned on, the reflector 167 disposed at one end of the first electrode 162 on the lower surface of the first electrode 162 may also be moved toward the upper side of the substrate 110. . When the reflector 167 is moved toward the upper side of the substrate 110, the reflector 167 may be moved to have an inclination with the top surface of the substrate 110. That is, when one end of the piezoelectric element 160 is bent toward the upper side of the substrate 110, one end of the piezoelectric element 160 may be bent to have an inclination with the upper surface of the substrate 110, and the first electrode 162 ) One end of the reflection unit 167 may also be disposed to have an inclination with the upper surface of the substrate 110.

Meanwhile, when the piezoelectric element 160 is turned on, the reflector 167 may be disposed higher than the red light emitting element 130 based on the substrate 110. When the piezoelectric element 160 is turned on, the reflector 167 may be disposed closer to the protective film 190 than the red light emitting element 130. When the piezoelectric element 160 is turned on, one end of the piezoelectric element 160 may be disposed higher than the red light emitting element 130 based on the substrate 110.

Meanwhile, the reflector 167 disposed higher than the red light emitting device 130 may be disposed inside the emission area where light emitted from the red light emitting device 130 is emitted. For example, when the piezoelectric element 160 is turned off, the reflective portion 167 of the piezoelectric element 160 is disposed outside the emission area of the red light emitting element 130, but the piezoelectric element 160 is turned on. If it is, it may be disposed inside the emission region of the red light emitting device 130.

Accordingly, when the piezoelectric element 160 is turned on, the reflector 167 is disposed inside the emission area of the red light emitting element 130 and can reflect light emitted from the red light emitting element 130. Specifically, the reflector 167 may reflect light emitted from the red light-emitting element 130 toward the P-type semiconductor layer 171 of the light-receiving element 170. As described above with reference to FIG. 2, the piezoelectric element 160 and the light receiving element 170 are disposed in a straight line with the red light emitting element 130 interposed therebetween. Accordingly, the light reflected from the reflector 167 may be reflected toward the light receiving element 170 disposed on a straight line with the reflector 167.

Next, referring to FIGS. 5A and 5B together, luminance of light is measured in a light receiving element (S130). Subsequently, luminance values of light measured in the first sub-pixel are analyzed (S140 ).

5A and 5B, when the red light emitting element 130 is turned on and the piezoelectric element 160 is turned on, the reflecting portion 167 of the piezoelectric element 160 is a radiation region of the red light emitting element 130 Inside, it may be arranged to have an inclination with an upper surface of the substrate 110, and light from the red light emitting element 130 may be reflected toward the light receiving element 170 by the reflector 167.

Subsequently, light from the reflector 167 may enter the P-type semiconductor layer 171 of the light receiving element 170. The light receiving element 170 may generate a photocurrent from light incident on one surface of the P-type semiconductor layer 171. In this case, the amount of photocurrent may vary depending on the luminance of light from the reflector 167, and the luminance of light can be measured from the amount of photocurrent.

In this case, one surface of the P-type semiconductor layer 171 is disposed to have a slope with respect to the substrate 110. Accordingly, light from the reflection unit 167 may enter the P-type semiconductor layer 171 of the light receiving element 170. That is, when the piezoelectric element 160 is turned on, considering the inclination angle of the reflecting portion 167 with the substrate 110 and the emission area of light emitted from the red light emitting element 130, the reflecting portion 167 One surface of the P-type semiconductor layer 171 may be formed to be inclined so that light can enter the surface of the P-type semiconductor layer 171.

Subsequently, referring to FIG. 5B, the light receiving element 170 may absorb light from the reflector 167 to generate a photocurrent. In addition, the photocurrent from each light receiving element 170 of each of the plurality of first red sub-pixels RSPX1 defined on the substrate 110 may be transmitted to the data driver DD.

For example, the photocurrent from the light receiving element 170 may be transmitted to the data driving part DD through a third additional wire LLA3 electrically connected to each of the light receiving device 170 and the data driving part DD. However, although FIG. 5B illustrates that the photocurrent is transmitted from the light receiving element 170 to the data driver DD through the third additional wiring LLA3, the fourth additional wiring LLA4 in addition to the third additional wiring LLA3 Alternatively, the photocurrent may be transmitted through a separate wiring, but is not limited thereto.

In addition, the photocurrent values transmitted to the data driver DD may be analyzed. For example, the luminance values of the red light emitting elements 130 of each of the plurality of first red sub-pixels RSPX1 may be compared by analyzing the photocurrent values. For example, the luminance value of the red light-emitting element 130 of one first red sub-pixel (RSPX1) and the red light emission of the first red sub-pixel (RSPX1) closest to one first red sub-pixel (RSPX1) Whether there is a difference between the luminance values of the device 130 or the like can be analyzed. For example, a deviation between luminance values or average values between luminance values of the red light emitting elements 130 of each of the plurality of first red sub-pixels RSPX1 may be analyzed.

In this case, although it was described that the data driver DD receives and analyzes the photocurrent value from the light receiving element 170, the red light emission of the first red sub-pixel RSPX1 is performed in a separate driving IC or the like other than the data driver DD. The luminance value of the device 130 may be analyzed, but is not limited thereto.

Next, referring to FIGS. 5C and 5D, a luminance deviation compensation coefficient is derived (S150 ). Subsequently, the compensated data voltage is transmitted to the plurality of sub-pixels by reflecting the luminance deviation compensation coefficient (S160 ).

Referring to FIG. 5C, a luminance deviation compensation coefficient can be derived from the data driver DD. Specifically, the data driving unit DD may analyze the photocurrent value from each light receiving element 170 of each of the plurality of first red sub-pixels RSPX1. In addition, by analyzing the photocurrent value from the light-receiving element 170, it is possible to check the luminance deviation between the plurality of red light-emitting elements 130 and to compensate for the luminance deviation between the plurality of red light-emitting elements 130. Can be derived.

In this case, the above-described process is repeated for each of the plurality of first green sub-pixels GSPX1 and the plurality of first blue sub-pixels BSPX1, and the plurality of green light-emitting elements 140 and the plurality of blue light-emitting elements 150 are repeated. It is possible to derive a luminance deviation compensation coefficient capable of compensating for the luminance deviation of the liver.

Specifically, the luminance deviation compensation coefficient may consist of a luminance deviation compensation coefficient for each of the red light emitting device 130, the green light emitting device 140, and the blue light emitting device 150. Then, the luminance deviation and the color deviation for each of the red light, the green light, and the blue light are compensated by using the luminance deviation compensation coefficients for each of the red light emitting device 130, the green light emitting device 140, and the blue light emitting device 150. Can be. For example, the luminance deviation and color deviation of each of the first red sub-pixel RSPX1 and the second red sub-pixel RPSX2 may be compensated by using the luminance deviation compensation coefficient for the red light emitting device 130. The luminance deviation and color deviation of each of the first green sub-pixel GSPX1 and the second green sub-pixel GSPX2 may be compensated by using the luminance deviation compensation coefficient for the green light emitting device 140. The luminance deviation and color deviation of each of the first blue sub-pixel BSPX1 and the second blue sub-pixel BSPX2 may be compensated by using the luminance deviation compensation coefficient for the blue light emitting device 150.

5C and 5D, the compensated data voltage may be transmitted to each of the plurality of first pixels PX1 and the plurality of second pixels PX2 by reflecting the luminance deviation compensation coefficient. Specifically, a luminance value measured from each light receiving element 170 of each of the plurality of first red sub-pixels RSPX1 in a driving IC such as the data driver DD may be analyzed to compensate for luminance deviation for red light. The luminance deviation compensation coefficient can be derived. In addition, the data voltages transmitted to the plurality of first red sub-pixels RSPX1 and the plurality of second red sub-pixels RSPX2 through the timing controller TC and the data driver DD are compensated by reflecting the luminance deviation compensation coefficient. The data voltage can be derived. In addition, the compensated data voltage may be transferred to the plurality of first red sub-pixels RSPX1 and the plurality of second red sub-pixels RSPX2 of the substrate 110 to display an image with improved luminance uniformity.

Similarly, by analyzing a luminance value measured from each light receiving element 170 of each of the plurality of first green sub-pixels GSPX1 in a driving IC such as a data driver DD, luminance capable of compensating for luminance deviation for green light Deviation compensation coefficients can be derived. The data voltages transmitted to the plurality of first green sub-pixels GSPX1 and the plurality of second green sub-pixels GSPX2 through the timing controller TC and the data driver DD are compensated by reflecting the luminance deviation compensation coefficient. The data voltage can be derived. In addition, the compensated data voltage may be transferred to the plurality of first green sub-pixels GSPX1 and the plurality of second green sub-pixels GSPX2 of the substrate 110 to display an image with improved luminance uniformity.

Finally, by analyzing the luminance values measured from the light receiving elements 170 of each of the plurality of first blue sub-pixels BSPX1 in the driving IC such as the data driver DD, the luminance deviation of the blue light can be compensated. The luminance deviation compensation coefficient can be derived. The data voltages transmitted to the plurality of first blue sub-pixels BSPX1 and the plurality of second blue sub-pixels BSPX2 through the timing controller TC and the data driver DD are compensated by reflecting the luminance deviation compensation coefficient. The data voltage can be derived. In addition, the compensated data voltage may be transferred to the plurality of first blue sub-pixels BSPX1 and the plurality of second blue sub-pixels BSPX2 of the substrate 110 to display an image with improved luminance uniformity.

Accordingly, an image with reduced luminance deviation may be implemented by transferring the compensated data voltage to the plurality of first sub-pixels SPX1 and the plurality of second sub-pixels SPX2.

Meanwhile, the method for deriving the luminance deviation compensation coefficient and the compensation method for the data voltage is exemplary, and is not limited thereto.

Referring to FIG. 5D, when a compensated data voltage is transmitted to a plurality of first sub-pixels SPX1 and a plurality of second sub-pixels SPX2 to display an image, the piezoelectric element 160 is turned off to generate a plurality of light emission. It may not interfere with the emission of light from the device (130, 140, 150).

Specifically, the piezoelectric element 160 may be turned off and not bent, and the reflector 167 disposed at one end of the first electrode 162 may emit light emitted from the plurality of light emitting elements 130, 140 and 150. It may be disposed outside the emitted radiation region.

In addition, when the piezoelectric element 160 is turned off, the first electrode 162, the first piezoelectric layer 163, the second electrode 164, the second piezoelectric layer 165, and the third electrode 166 are banks ( It may be disposed parallel to the top surface of the 116, the reflective portion 167 may also be disposed parallel to the top surface of the bank 116, such as the first electrode 162. When the piezoelectric element 160 is turned off, the reflector 167 may be disposed on the side surfaces of the plurality of light emitting elements 130, 140, and 150, and the reflector 167 may be disposed on the basis of the substrate 110. The light emitting devices 130, 140, and 150 may be arranged similarly or lower.

The display device 100 according to an exemplary embodiment may compensate for luminance deviation and color deviation between the plurality of light emitting elements 130, 140, and 150. Specifically, the piezoelectric element 160 and the light receiving element 170 together with the plurality of light emitting elements 130, 140, and 150 are disposed on the first pixel PX1 among the plurality of pixels PX. In addition, in a state in which the light emitting elements 130, 140, and 150 are turned on, the piezoelectric element 160 may be turned on to bend one end of the piezoelectric element 160 toward the upper side of the substrate 110. Accordingly, the reflective portion 167 of the piezoelectric element 160 may be moved toward the upper side of the substrate 110, and the reflective portion 167 of the piezoelectric element 160 may emit light from the light emitting elements 130, 140, and 150 Reflected light. In addition, light reflected from the reflection unit 167 may be incident on the light receiving element 170. Subsequently, the light receiving element 170 may generate a photocurrent from the incident light and transmit it to a driving IC such as a data driver DD. In a driving IC such as the data driver DD, a luminance deviation compensation coefficient capable of compensating for luminance deviation and color deviation may be derived by analyzing photocurrent values from the plurality of first pixels PX1, and thereafter, a plurality of pixels. The data voltage reflecting the luminance deviation compensation coefficient to the data voltage transferred to (PX) may be transferred to the plurality of pixels PX. Therefore, by placing the piezoelectric element 160 and the light receiving element 170 on at least one pixel PX of the plurality of pixels PX, the luminance of light from the light emitting elements 130, 140, 150 can be measured. , It is possible to compensate for luminance deviation and color deviation between the plurality of light emitting devices 130, 140, and 150 from the measured luminance values. Therefore, in the display device 100 according to an exemplary embodiment of the present invention, the light receiving element 170 and the piezoelectric element 160 are further arranged to improve luminance uniformity and color uniformity of an image displayed on the display device 100. And improve the quality of the video.

In the display device 100 according to an exemplary embodiment of the present invention, even if the light emitting elements 130, 140, and 150, the light receiving elements 170, and the piezoelectric elements 160 are disposed on the same plane, the display device 100 is directed to the upper side of the substrate 110. The luminance of light from the emitted light emitting elements 130, 140, 150 can be easily measured. First, in the case of the light emitting devices 130, 140, and 150, it may be transferred on the substrate 110 through a transfer process. In this case, the light receiving element 170 and the piezoelectric element 160 may also be transferred onto the substrate 110 through transfer processes such as the light emitting elements 130, 140 and 150. However, since the light emitted from the light emitting elements 130, 140, 150 is emitted toward the upper side of the light emitting elements 130, 140, 150, the light receiving elements 170 disposed on the side surfaces of the light emitting elements 130, 140, 150 ), it is difficult to measure the light of the light emitting elements (130, 140, 150). Accordingly, the display device 100 according to an exemplary embodiment of the present invention transmits light from the light emitting elements 130, 140, and 150 radiating to the upper side of the substrate 110 to the light receiving element 170 on the side of the substrate 110. The reflective piezoelectric element 160 is disposed to easily measure the luminance of light from the light emitting elements 130, 140, and 150.

The display device 100 according to an exemplary embodiment of the present invention continuously compensates for luminance deviation and color deviation caused by changes in characteristics of the semiconductor device 120 and deterioration of the light emitting devices 130, 140, and 150 even after shipment. can do. When the light emitting elements 130, 140, and 150 are transferred onto the substrate 110 without the need to further arrange a complicated compensation circuit, the light receiving elements 170 and the light emitting elements 130, 140, and 150 are transferred together to form the light emitting elements. Luminance of light of (130, 140, 150) can be easily measured. In addition, the piezoelectric element 160 and the light receiving element 170 may be selectively driven only when the luminance deviation and the color deviation of the display device 100 are compensated. In addition, the luminance deviation compensation coefficient can be derived by measuring the luminance of the light of the light emitting elements 130, 140, and 150 from the piezoelectric element 160 and the light receiving element 170, and the luminance uniformity of the image displayed on the display device 100 And color uniformity.

6A to 6C are schematic plan views of tiling display devices according to various embodiments of the present invention. The tiling display devices 1000a, 1000b, and 1000c of FIGS. 6A to 6C are implemented by connecting a plurality of display devices 100a, 100b, and 100c, and a plurality of tiling display devices 1000a, 1000b, and 1000c are respectively formed. The arrangement of the plurality of first pixels PX1 is different from that of the display devices 100a, 100b, and 100c as compared to the display device 100 of FIGS. 1 to 5D. do.

First, since it is difficult to fabricate the display devices 100a, 100b, and 100c to an extra large size of several hundred inches or more, tiling display devices 1000a, 1000b having a large display area by connecting a plurality of display devices 100a, 100b, 100c , 1000c). For example, the plurality of display devices 100a, 100b, and 100c may be arranged in a tile shape so as to appear as one display device, and may be implemented as tiling display devices 1000a, 1000b, and 1000c. In addition, the tiling display devices 1000a, 1000b, and 1000c made up of a plurality of display devices 100a, 100b, and 100c may be used as large-sized billboards or outdoor advertising billboards.

In this case, the plurality of display devices 100a, 100b, and 100c constituting the tiling display devices 1000a, 1000b, and 1000c may be driven like one display device. For example, each of the plurality of display devices 100a, 100b, and 100c may be electrically connected through a separate cable, or may be electrically connected through a wireless communication method. In this case, even if each of the plurality of display devices 100a, 100b, and 100c is driven as one display device, luminance deviation and color deviation between the plurality of display devices 100a, 100b, and 100c may occur. For example, some of the display devices 100a, 100b, and 100c of the plurality of display devices 100a, 100b, and 100c have relatively high luminance images at a specific voltage, and some other display devices 100a, 100b, In 100c), a relatively low luminance image may be implemented at the same specific voltage. As described above, when luminance deviation and color deviation between the plurality of display devices 100a, 100b, and 100c exist, the quality of the image displayed on the tiling display devices 1000a, 1000b, and 1000c may deteriorate. Accordingly, in the tiling display devices 1000a, 1000b, and 1000c according to an exemplary embodiment of the present invention, the first pixel PX1 is disposed on each of the plurality of display devices 100a, 100b, and 100c to display the plurality of display devices 100a, 100b, 100c) can measure and analyze each luminance to compensate for luminance deviation and color deviation, and improve luminance uniformity and color uniformity of tiling display devices 1000a, 1000b, and 1000c.

Referring to FIG. 6A, a first pixel PX1 is disposed at the center of each of the plurality of display devices 100a constituting the tiling display device 1000a. The first pixel PX1 is disposed in the central area of each of the plurality of display devices 100a to measure and compare luminance values between the plurality of display devices 100a, and from the analysis results, the plurality of display devices 100a ) Can improve luminance uniformity and color uniformity. The tiling display device 1000a of FIG. 6A may compensate for luminance deviation and color deviation between the plurality of display devices 100a by disposing a minimum first pixel PX1 in each of the plurality of display devices 100a.

Referring to FIG. 6B, first pixels PX1 are disposed at four corners of the outermost pixels PX of each of the plurality of display devices 100b constituting the tiling display device 1000b. The luminance values between the plurality of display devices 100b may be measured and compared by arranging the first pixel PX1 at four corners of each of the plurality of display devices 100b.

In this case, when luminance deviation and color deviation between the plurality of display devices 100b exist, luminance deviation and color deviation between the plurality of display devices 100b can be easily recognized in a boundary area between the plurality of display devices 100b. Can be. In particular, when a plurality of display devices 100b are arranged in a tile form, luminance deviation and color deviation are easily visualized at points where edges of each of the four display devices 100b among the plurality of display devices 100b are adjacent to each other. Can be.

Accordingly, the first pixel PX1 is disposed at four corners of each of the plurality of display devices 100b in which the luminance deviation and color deviation of each of the plurality of display devices 100b are easily recognized, and each of the plurality of display devices 100b The luminance values of can be measured and compared, and luminance variations and color variations of each of the plurality of display devices 100b can be compensated.

In addition, since a plurality of first pixels PX1 are disposed in one display device 100b, not only can luminance and color deviations between the plurality of display devices 100b be compensated, but also one display device 100b It can compensate for luminance deviation and color deviation within ).

Referring to FIG. 6C, the first pixel PX1 is disposed at the center of each of the plurality of display devices 100c constituting the tiling display device 1000c, and the first pixel PX1 is located at four corners of the outermost pixel PX. ), and the first pixel PX1 is disposed at the center of each of the plurality of edges of the display device 100c among the outermost pixels PX. A plurality of first pixels PX1 may be disposed in each of the plurality of display devices 100c to compensate for luminance deviation and color deviation between the plurality of light emitting elements 130, 140, and 150 in one display device 100c. , It is possible to compensate for luminance deviation and color deviation between the plurality of display devices 100c.

It is possible to compensate for luminance deviation and color deviation in one display device 100c from luminance values of the light emitting elements 130, 140, and 150 measured in each of the plurality of first pixels PX1 in one display device 100c. have.

Further, luminance deviation and color deviation between the plurality of display devices 100c may be compensated from luminance values of the light emitting elements 130, 140, and 150 measured at each of the plurality of first pixels PX1 of the plurality of display devices 100c. Can be.

The tiling display devices 1000a, 1000b, and 1000c according to an embodiment of the present invention include at least one first pixel in each of the plurality of display devices 100a, 100b, and 100c constituting the tiling display devices 1000a, 1000b, and 1000c. By disposing (PX1), luminance deviation and color deviation between the plurality of display devices 100a, 100b, and 100c and luminance deviation and color deviation between the plurality of display devices 100a, 100b, and 100c may be compensated. Specifically, the first pixel PX1 including the piezoelectric element 160 and the light receiving element 170 in addition to the light emitting elements 130, 140, and 150 may be disposed on each of the plurality of display devices 100a, 100b, and 100c. have. For example, in the case of the tiling display device 1000a of FIG. 6A, the first pixel PX1 is disposed in the center of each of the plurality of display devices 100a, and in the case of the tiling display device 1000b of FIG. 6B The first pixel PX1 may be disposed at each of four corners of the display device 100b. In the case of the tiling display device 1000c of FIG. 6C, the first pixel PX1 is disposed at the center and four corners of each of the plurality of display devices 100c, and the display device 100c among the outermost sub-pixels PX ), the first pixel PX1 may be disposed in the center of a plurality of edges. That is, at least one first pixel PX1 is disposed in each of the plurality of display devices 100a, 100b, and 100c according to the design of the tiling display devices 1000a, 1000b, and 1000c to display one display device 100a, 100b, The luminance deviation and color deviation within 100c) may be compensated, and the luminance deviation and color deviation within the plurality of display devices 100a, 100b, and 100c may be compensated. Accordingly, the tiling display devices 1000a, 1000b, and 1000c according to an exemplary embodiment of the present invention may include at least one first pixel PX1 on the plurality of display devices 100a, 100b, and 100c to display a plurality of display devices ( It is possible to improve luminance uniformity and color uniformity between each of 100a, 100b, and 100c and the plurality of display devices 100a, 100b, and 100c.

A display device and a method of manufacturing the display device according to various embodiments of the present invention may be described as follows.

A display device according to an exemplary embodiment of the present invention includes: a substrate on which a plurality of sub-pixels including at least one first sub-pixel are defined, a plurality of light-emitting elements disposed on each of the plurality of sub-pixels, and one of the first sub-pixels It includes a piezoelectric element disposed on the side, the reflecting portion and a light receiving element disposed on the other side of the first sub-pixel.

According to another feature of the invention, the piezoelectric element includes a first electrode, a first piezoelectric layer on the first electrode, a second electrode on the first piezoelectric layer, a second piezoelectric layer on the second electrode, and a third on the second piezoelectric layer. An electrode and a first electrode, a first piezoelectric layer, a second electrode, a second piezoelectric layer, and a support portion supporting the third electrode, and the reflective portion may be disposed at one end of the first electrode on the lower surface of the first electrode.

According to another feature of the invention, when the piezoelectric element is off (off), one end of the piezoelectric element is disposed outside the radiation region in which light emitted from the plurality of light emitting elements is emitted, the piezoelectric element is on (on) In this case, the reflective portion is disposed to have a slope with the substrate, and one end of the piezoelectric element may be disposed in the radiation region.

According to another feature of the present invention, when the piezoelectric element is turned on, the reflector is disposed higher than the plurality of light emitting elements based on the substrate to reflect some of the light emitted from the plurality of light emitting elements toward the light receiving element.

According to another feature of the invention, further comprising an adhesive layer and a protective film disposed on a plurality of light emitting elements, a piezoelectric element and a light receiving element, the adhesive layer of the plurality of sub-pixels, but not the first sub-pixel to overlap only the sub-pixel Can be.

According to another feature of the invention, the distance from the one end of the piezoelectric element to the lower surface of the protective film when the piezoelectric element is on is less than the distance from the one end of the piezoelectric element to the lower surface of the protective film when the piezoelectric element is off. Can be.

According to another feature of the present invention, the light-receiving element includes a P-type semiconductor layer disposed closest to the light-emitting element disposed in the first sub-pixel, an intrinsic semiconductor layer disposed on the other side of the P-type semiconductor layer, and an intrinsic semiconductor layer It includes an N-type semiconductor layer disposed on the other side of, and one surface of the P-type semiconductor layer may be arranged to have a slope with respect to the substrate.

According to another feature of the present invention, a plurality of light emitting elements, piezoelectric elements and light receiving elements may be disposed on the same plane.

According to another feature of the invention, the first sub-pixel may include a sub-pixel disposed in the center of the substrate among the plurality of sub-pixels.

According to another feature of the present invention, the first sub-pixel may be at least one of a plurality of sub-pixels of the outermost sub-pixel.

A display device according to another exemplary embodiment of the present invention includes a substrate on which a plurality of light emitting elements are disposed, a piezoelectric element disposed on a substrate, and a piezoelectric element configured to bendable at one end, and a substrate to emit light of some of the plurality of light emitting elements A piezoelectric element includes a light receiving element configured to receive light emitted from the element, the piezoelectric element includes a reflector disposed on one side of the piezoelectric element, and compensates for luminance by measuring a luminance deviation between some of the light emitting elements. It is possible to reflect light from the light emitting element of the light-receiving element.

According to another feature of the present invention, when the piezoelectric element is off, the piezoelectric element is non-bended, and the reflector is disposed adjacent to the side of some light emitting elements, and when the piezoelectric element is on, the piezoelectric element is The element is bent, and the reflector may be disposed on the upper side of some light emitting elements.

According to another feature of the present invention, when the piezoelectric element is turned on, at least some of the light emitted from some of the light emitting elements may enter the reflector.

According to another feature of the present invention, the light-receiving element includes a P-type semiconductor layer having one surface inclined with a substrate, an N-type semiconductor layer disposed on the opposite side of one surface of the P-type semiconductor layer, and a P-type semiconductor It includes an intrinsic semiconductor layer disposed between the layer and the N-type semiconductor layer, and light reflected from the reflecting portion may be incident on one surface of the P-type semiconductor layer.

According to another feature of the present invention, a plurality of wires disposed on the substrate, electrically connected to each of the plurality of light emitting elements, and disposed on the substrate, the piezoelectric element and the light receiving element may further include additional wiring. have.

According to another feature of the present invention, further comprising an adhesive layer and a protective film on the adhesive layer disposed to cover a plurality of light emitting elements, the adhesive layer and the protective film may be spaced apart from the piezoelectric element and the light receiving element.

In the tiling display device according to an exemplary embodiment of the present invention, a plurality of display devices are arranged in a tile form.

A method for compensating for luminance deviation of a display device according to an exemplary embodiment of the present invention includes: lighting a light emitting element disposed in a first subpixel among a plurality of subpixels on a substrate, disposed on one side of the first subpixel, and reflecting Turning on the piezoelectric element having a portion to reflect light from the light emitting element to the light receiving element side disposed on the other side of the first sub-pixel, transferring the photocurrent from the light receiving element to the data driver, and the photocurrent And reflecting the luminance deviation compensation coefficient derived from the data voltage.

According to another feature of the present invention, the step of turning on the piezoelectric element to reflect light from the light emitting element toward the light receiving element is a step of placing the reflector inside the emission region where light emitted from the light emitting element is emitted. , The step of transmitting the photocurrent from the light receiving element to the data driver may be a step of generating the photocurrent from the light incident on the light receiving element by the reflector disposed inside the radiation region and transmitting the photocurrent to the data driver.

According to another feature of the present invention, the step of reflecting the luminance deviation compensation coefficient derived from the photocurrent to the data voltage may include analyzing the photocurrent from the light receiving element of the first sub-pixel in the data driver to analyze the luminance deviation between the plurality of sub-pixels. The method may include generating a luminance deviation compensation coefficient that compensates for and reflecting the luminance deviation compensation coefficient in a data voltage transmitted to each of the plurality of sub-pixels.

The embodiments of the present invention have been described in more detail with reference to the accompanying drawings, but the present invention is not necessarily limited to these embodiments, and may be variously modified without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and not restrictive. The scope of protection of the present invention should be interpreted by the claims below, and all technical spirits within the equivalent range should be interpreted as being included in the scope of the present invention.

1000a, 1000b, 1000c: tiling display device
100, 100a, 100b, 100c: display device
110: substrate
111: gate insulating layer
112: passivation layer
113: first insulating layer
114: second insulating layer
115: third insulating layer
116: Bank
120: semiconductor device
121: gate electrode
122: active layer
123: source electrode
124: drain electrode
130: red light emitting element
131: first semiconductor layer
132: light emitting layer
133: second semiconductor layer
134: third contact electrode
135: fourth contact electrode
140: green light emitting element
150: blue light emitting element
160: piezoelectric element
161: support
162: first electrode
163: first piezoelectric layer
164: second electrode
165: second piezoelectric layer
166: third electrode
167: reflector
168: first contact electrode
169: second contact electrode
170: light receiving element
171: P-type semiconductor layer
172: intrinsic semiconductor layer
173: N-type semiconductor layer
174: fifth contact electrode
175: sixth contact electrode
180: adhesive layer
190: protective film
GD: gate driver
DD: Data driver
TC: Timing controller
LL: Multiple wiring
LL1: 1st wiring
LL2: Second wiring
LLA: Multiple additional wiring
LLA1: First additional wiring
LLA2: second additional wiring
LLA3: Third additional wiring
LLA4: 4th additional wiring
PX: Multiple pixels
PX1: 1st pixel
PX2: 2nd pixel
SPX1: Multiple first sub-pixels
RSPX1: first red sub-pixel
GSPX1: first green sub-pixel
BSPX1: first blue sub-pixel
SPX2: a plurality of second sub pixels
RSPX2: second red sub-pixel
GSPX2: second green sub-pixel
BSPX2: second blue sub-pixel
PE: Multiple pad electrodes
PE1: first pad electrode
PE2: second pad electrode
PE3: third pad electrode
PE4: fourth pad electrode
PE5: fifth pad electrode
PE6: 6th pad electrode
θ: Radiation angle

Claims (20)

A substrate on which a plurality of sub-pixels including at least one first sub-pixel are defined;
A plurality of light emitting elements disposed in each of the plurality of sub pixels;
A piezoelectric element disposed on one side of the first sub-pixel and having a reflecting portion; And
And a light receiving element disposed on the other side of the first sub-pixel. According to claim 1,
The piezoelectric element,
A first electrode;
A first piezoelectric layer on the first electrode;
A second electrode on the first piezoelectric layer;
A second piezoelectric layer on the second electrode;
A third electrode on the second piezoelectric layer; And
And a support portion supporting the first electrode, the first piezoelectric layer, the second electrode, the second piezoelectric layer, and the third electrode,
The reflective unit is disposed at one end of the first electrode on a lower surface of the first electrode. According to claim 2,
When the piezoelectric element is turned off, one end of the piezoelectric element is disposed outside the emission region in which light emitted from the plurality of light emitting elements is emitted,
When the piezoelectric element is turned on, the reflective portion is disposed to have a slope with the substrate, and one end of the piezoelectric element is disposed in the radiation region. According to claim 3,
When the piezoelectric element is turned on, the reflector is disposed higher than the plurality of light emitting elements based on the substrate to reflect a portion of the light emitted from the plurality of light emitting elements toward the light receiving element. According to claim 3,
Further comprising an adhesive layer and a protective film disposed on the plurality of light emitting elements, the piezoelectric element and the light receiving element,
The adhesive layer overlaps only the sub-pixels except the first sub-pixel among the plurality of sub-pixels. The method of claim 5,
The distance from the one end of the piezoelectric element to the lower surface of the protective film when the piezoelectric element is on is smaller than the distance from the one end of the piezoelectric element to the lower surface of the protective film when the piezoelectric element is off. . According to claim 1,
The light receiving element,
A P-type semiconductor layer disposed closest to the light emitting element disposed in the first sub-pixel;
An intrinsic semiconductor layer disposed on the other side of the P-type semiconductor layer; And
And an N-type semiconductor layer disposed on the other side of the intrinsic semiconductor layer,
One surface of the P-type semiconductor layer is disposed to have a slope with respect to the substrate, a display device. According to claim 1,
The plurality of light emitting elements, the piezoelectric element and the light receiving element are disposed on the same plane. According to claim 1,
The first sub-pixel includes a sub-pixel disposed in the center of the substrate among the plurality of sub-pixels. The method of claim 9,
The first sub-pixel is at least one of the sub-pixels on the outermost side of the substrate among the plurality of sub-pixels. A substrate on which a plurality of light emitting elements are disposed;
A piezoelectric element disposed on the substrate and configured to be bent at one end; And
A light receiving element disposed on the substrate and configured to receive light emitted from some of the light emitting elements of the plurality of light emitting elements,
The piezoelectric element includes a reflector disposed on one side of the piezoelectric element,
The display device reflects light from the portion of the light-emitting element toward the light-receiving element so as to compensate for luminance by measuring a luminance deviation between the light-emitting elements. The method of claim 11,
When the piezoelectric element is turned off, the piezoelectric element is non-bended, and the reflector is disposed adjacent to a side surface of the light emitting element,
When the piezoelectric element is turned on, the piezoelectric element is bent, and the reflector is disposed above the portion of the light emitting element. The method of claim 12,
When the piezoelectric element is turned on, at least a part of the light emitted from the light emitting element is incident on the reflector. The method of claim 11,
The light receiving element,
A P-type semiconductor layer having one surface inclined with the substrate;
An N-type semiconductor layer disposed on the opposite side of one surface of the P-type semiconductor layer; And
And an intrinsic semiconductor layer disposed between the P-type semiconductor layer and the N-type semiconductor layer,
A display device in which light reflected from the reflector enters one surface of the P-type semiconductor layer. The method of claim 11,
A plurality of wirings disposed on the substrate and electrically connected to each of the plurality of light emitting elements; And
And additional wirings disposed on the substrate and electrically connected to the piezoelectric element and the light receiving element. The method of claim 11,
Further comprising an adhesive layer disposed to cover the plurality of light emitting elements and a protective film on the adhesive layer,
The adhesive layer and the protective film are spaced apart from the piezoelectric element and the light receiving element, a display device. The method according to any one of claims 1 to 16,
A tiled display device in which a plurality of the display devices are arranged in a tile form. Lighting a light emitting element disposed in a first sub pixel among a plurality of sub pixels on a substrate;
Turning on a piezoelectric element provided on one side of the first sub-pixel and having a reflector to reflect light from the light-emitting element toward a light-receiving element disposed on the other side of the first sub-pixel;
Transferring the photocurrent from the light receiving element to a data driver; And
And reflecting a luminance deviation compensation coefficient derived from the photocurrent to a data voltage. The method of claim 18,
The step of turning on the piezoelectric element and reflecting light from the light emitting element toward the light receiving element is a step of placing the reflector inside the emission region where light emitted from the light emitting element is emitted,
In the step of transferring the photocurrent from the light receiving element to the data driving unit, the photocurrent is generated from the light incident on the light receiving element by the reflecting unit disposed inside the emission area and transferred to the data driving unit. Step, compensation method for luminance deviation of the display device. The method of claim 18,
Reflecting the luminance deviation compensation coefficient derived from the photocurrent to the data voltage,
Generating, by the data driver, the luminance deviation compensation coefficient to compensate for luminance deviation between a plurality of subpixels by analyzing the photocurrent from the light receiving element of the first subpixel; And
And reflecting the luminance deviation compensation coefficient in the data voltage delivered to each of the plurality of sub-pixels.

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