KR20200063980A - Method and apparatus of dividing a substrate for substrate pieces - Google Patents

Abstract

(Objective) An electrode is prevented from being unintentionally connected when a substrate piece is derived from a resin substrate. (Solution) A method of deriving a substrate piece (SP1) having a first side crossing a plurality of electrodes (d1) and a second side extending along an organic light emitting diode (OLED) layer, from a resin substrate (P1) having the OLED layer (d1) and the plurality of electrodes (d1) for connecting the OLED layer (d) to the outside includes: the steps of deriving the substrate piece (SP1) as a first cutting line (SL1) is formed along the first side and a second cutting line (SL2) is formed along the second side; and forming an electrode-less area (d11) extending in a direction to cross the plurality of electrodes (d1) in the plurality of electrodes between the first side of the substrate piece (SP1) and the OLED layer (d).

Description

Method and device for cutting out a piece of substrate {METHOD AND APPARATUS OF DIVIDING A SUBSTRATE FOR SUBSTRATE PIECES}

In the present invention, a small piece of a substrate having a first side intersecting the electrode and a second side extending along the element is cut out from the resin substrate on which the element and the electrode for connecting the element to the outside are formed. It relates to a method for discharging, and a cutting device for cutting out the small piece of the substrate.

Background Art Conventionally, a substrate in which a plurality of elements and a plurality of electrodes for connecting each of the plurality of elements to the outside are formed on a resin substrate, such as an OLED substrate, is known. From this board|substrate, the board|substrate piece which was made from one electronic element containing one element and the said some electrode is cut out.

Further, as a method of forming a cutting line for cutting out a piece of a substrate from a resin substrate, there is known a method of forming a cutting line by irradiating laser light from one side of the resin substrate along the side of the piece of the substrate. For example, see Patent Document 1).

Japanese Patent Publication No. 2018-15784

When cutting out a piece of a substrate including one electronic element from the resin substrate, a cutting line crossing a plurality of electrodes formed on the resin substrate is formed. Particularly, when a cutting line intersecting a plurality of electrodes is formed by irradiation of laser light, carbides generated by carbonization of the resin substrate by irradiation of laser light may connect the plurality of electrodes.

Generally, carbides generated by carbonization of a resin substrate have conductivity. Therefore, when a plurality of electrodes which should be in an insulated state are connected by carbide, the plurality of electrodes are in a conductive state, and the electronic element included in the substrate piece may malfunction and/or malfunction.

An object of the present invention is to cut a piece of a substrate having a first side intersecting the plurality of electrodes and a second side extending along the element from a resin substrate on which the element and a plurality of electrodes for connecting the element to the outside are formed. This is to avoid unintentionally electrically connecting a plurality of electrodes when unloading.

Hereinafter, a plurality of embodiments will be described as a means for solving the problem. These embodiments can be arbitrarily combined as necessary.

A cutting method according to an aspect of the present invention has a first side intersecting a plurality of electrodes and a second side extending along the element from a resin substrate on which the element and a plurality of electrodes for connecting the element to the outside are formed. It is a method of cutting out a piece of substrate. The cutting method includes the following steps.

Step of cutting a piece of the substrate by forming a first cutting line along the first side and a second cutting line along the second side.

Step of forming an electrodeless region extending in a direction intersecting the plurality of electrodes on a plurality of electrodes existing between the first side of the substrate piece and the element.

In the above-described method for cutting out a piece of substrate, an electrodeless region is formed between the first side and the element intersecting the plurality of electrodes of the piece of substrate so as to intersect with the plurality of electrodes.

Accordingly, when the first cut line is formed so as to intersect the plurality of electrodes for cutting out the piece of the substrate, the element side is more than the electrodeless region even when the plurality of electrodes are electrically connected on the first side or its vicinity. In, a plurality of electrodes are not electrically connected. As a result, it is possible to avoid malfunction and/or failure of the electronic element in the piece of substrate after cutting.

The first cut line may be formed by irradiating laser light to the electrode and the resin substrate. Accordingly, the first cut line can be easily formed on the electrode and the resin substrate while minimizing damage to the piece of the substrate.

The electrodeless region may be formed by irradiating at least an electrode with laser light. Thus, the electrodeless region can be easily formed while minimizing damage to the piece of the substrate.

The step of forming the electrodeless region may be performed after the step of cutting out the small piece of the substrate. Accordingly, an electrodeless region can be individually formed for each piece of substrate.

The step of forming the electrodeless region may be performed before the step of cutting out the small piece of the substrate. Thus, the electrodeless region can be formed in advance on the resin substrate before cutting out the small piece of the substrate.

A cutting device according to another aspect of the present invention has a first side crossing a plurality of electrodes and a second side extending along the element from a resin substrate on which the element and a plurality of electrodes for connecting the element to the outside are formed. It is a device to cut out a piece of substrate. The cutting device includes first cutting means and second cutting means.

The first cutting means forms a first cutting line along the first side, and forms a non-electrode region extending in a direction intersecting the plurality of electrodes on a plurality of electrodes existing between the first side and the element. do. The second cutting means forms a second cutting line along the second side.

In the above-mentioned cutting device, an electrodeless region is formed between the first side intersecting the plurality of electrodes of the substrate piece and the element by the first cutting means to intersect the plurality of electrodes.

Accordingly, when the first cut line is formed so as to intersect the plurality of electrodes for cutting out the piece of the substrate, the element side is more than the electrodeless region even when the plurality of electrodes are electrically connected on the first side or its vicinity. In, a plurality of electrodes are not electrically connected. As a result, it is possible to avoid malfunction and/or failure of the electronic element in the piece of substrate after cutting.

By forming an electrodeless region between the first side intersecting the plurality of electrodes of the substrate piece and the element, it is no longer electrically connected to the plurality of electrodes on the element side than the electrodeless region, so that the substrate piece after cutting out In, it is possible to avoid malfunction and/or failure of the electronic device.

1 is a view showing a cross-sectional structure of a resin substrate.
2 is a view showing a planar structure of a resin substrate.
3 is a view showing the configuration of a cutting device according to the first embodiment.
Fig. 4 is a view schematically showing a case of cutting out a piece of a substrate from the cross-sectional direction of the resin substrate (No. 1).
Fig. 5 is a view schematically showing a case of cutting out a piece of a substrate from the cross-sectional direction of the resin substrate (No. 2).
Fig. 6 is a view schematically showing a case of cutting out a piece of the substrate from the plane direction of the resin substrate (No. 1).
Fig. 7 is a view schematically showing a case of cutting out a piece of the substrate from the plane direction of the resin substrate (No. 2).

(Form for carrying out the invention)

1. First embodiment

(1) Structure of resin substrate

Hereinafter, a method of cutting out a small piece of the substrate from the resin substrate according to one embodiment of the present invention will be described. Hereinafter, from the resin substrate in which a plurality of OLED layers d (an example of a device) are formed in an array shape, one OLED layer d and an electrode d1 connecting the OLED layer d to the outside are connected. A method of cutting out the included substrate piece SP1 will be described as an example of a method of cutting out the substrate piece SP1. Therefore, first, the structure of the resin substrate P1 is demonstrated using FIGS. 1 and 2. 1 is a view showing a cross-sectional structure of a resin substrate. 1 shows a cross-sectional structure of a resin substrate. 2 is a view showing a planar structure of a resin substrate.

1 and 2, the horizontal direction of the resin substrate P1 is defined as "X direction", and the vertical direction is defined as "Y direction". In addition, the vertical direction (Y direction) of the resin substrate P1 is defined as a first direction, and the horizontal direction (X direction) is defined as a second direction.

The resin substrate P1 is a rectangular substrate extending in the X direction and the Y direction. The resin substrate P1 has a resin layer L1, an OLED layer d (organic LED), and an electrode d1.

The resin layer L1 is, for example, a substrate made of polyimide (PI). In order to barrier moisture, a first protective layer L2 is formed between the resin layer L1 and the OLED layer d and the electrode d1 as one surface of the resin layer L1. have. The first protective layer L2 is, for example, an inorganic film such as SiO ₂ .

The OLED layer (d) is formed on the surface of the first protective layer (L2) in a plurality of side by side in an array shape in the X direction and the Y direction. Specifically, the OLED layer d includes, for example, a light emitting layer, a driving element (for example, TFT (thin film transistor)) for controlling light emission by the light emitting layer, and wiring of the OLED layer d. Is formed.

The electrode d1 is formed on a surface of the first protective layer L2 and formed in plurality by extending in the Y direction from the OLED layer d, and has a rectangular conductive metal (for example, chromium, aluminum) , Gold, silver, copper, etc.). The electrode d1 serves as a terminal for connecting the OLED layer d and an external circuit in the substrate piece SP1.

In the present embodiment, the electrode d1 is formed in the resin substrate P1 beyond the boundary in the Y direction of the substrate piece SP1. As described later, when cutting out the substrate piece SP1, the electrode d1 is traversed in the X direction, so that the first side of the substrate piece SP1 in the Y direction (FIG. 7(e)) is formed. do.

The resin substrate P1 has a second protective layer L3. The second protective layer L3 is, for example, an inorganic film such as an SiO ₂ film, and is formed on the OLED layer d to barrier moisture.

As will be described later, the regions in which the first protective layer L2 and the second protective layer L3, which are inorganic films, are not present, are scribed with the scribe wheel SW.

The resin substrate P1 of this embodiment further has a 1st PET layer L4 and a 2nd PET layer L5. The first PET layer L4 and the second PET layer L5 are films made of polyethylene terephthalate (PET), and protect the OLED layer d and the electrode d1.

The first PET layer L4 is adhered to the surface of the resin layer L1 on the side where the OLED layer d and the electrode d1 are formed. On the other hand, the second PET layer L5 is adhered to the surface of the resin layer L1 opposite to the side on which the OLED layer d and the electrode d1 are formed.

Moreover, about the part which covers the electrode d1 among the 1st PET layer L4, it peels off when cutting out the small piece SP1 of the board|substrate.

(2) Cutting device

Next, the structure of the cutting device 1 of this embodiment is demonstrated using FIG. 3 is a diagram showing a configuration of a cutting device according to the first embodiment. The cutting device 1 is a device that cuts out a substrate piece SP1 including one OLED layer d and an electrode d1 corresponding to the resin substrate P1 having the above-described configuration.

The cutting device 1 includes a first cutting line forming means 11, a second cutting line forming means 13, a mechanical drive system 15, and a control unit 17.

The first cutting line forming means 11 (an example of the first cutting means) is an apparatus for forming a cutting line in the resin layer L1 by irradiating the first laser beam LA1 with the resin layer L1. .

The first cutting line forming means 11 has a laser oscillator that outputs the first laser light LA1, and a transmission optical system that transmits the first laser light LA1 to a mechanical drive system 15 described later ( Not all shown). The transmission optical system includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, etc., although not shown. Further, the transmission optical system has, for example, an X-axis movement mechanism (not shown) for moving the laser irradiation head (not shown) in which a laser oscillator and other optical systems are incorporated (not shown) in the X-axis direction. . The laser oscillator of the first cutting line forming means 11 is, for example, a UV laser that outputs laser light in the ultraviolet region, a green laser that outputs green laser light, or the like.

As described above, the first protective layer L2, which is an inorganic layer, is formed between the resin layer L1 and the electrode d1 and the OLED layer d, and the second protective layer L3 is formed on the OLED layer d. ) Is formed. Therefore, the vicinity of the OLED layer d and the electrode d1 of the resin substrate P1 becomes fragile. Therefore, when cutting out the substrate piece SP1, if a cut line is to be formed by the scribe wheel SW at the place where these protective layers are formed, the electrode d1 near the boundary (side) of the substrate piece SP1 and / Or there is a possibility that the OLED layer (d) is destroyed.

Therefore, among the sides of the substrate piece SP1, in particular, the first cut line SL1 corresponding to the side crossing the electrode d1 is formed by irradiation of the first laser light LA1. Thereby, a cutting line for cutting out the substrate small piece SP1 in the vicinity of the electrode d1 can be formed without destroying the fragile protective layer or the like.

Further, in the first cutting line forming means 11, the electrode d1 does not exist between the OLED layer d of the electrode d1 and the boundary (first side) in the Y direction of the substrate piece SP1. A non-electrode region d11 is formed. In the case of forming the electrodeless region d11, the first cutting line forming means 11 uses the first laser light LA1 having a weaker intensity than the case where the first cutting line SL1 is formed, and the electrode d1. Investigate the place where the electrodeless region d11 is to be formed.

The second cutting line forming means 13 (an example of the second cutting means), among the cutting lines for cutting out the substrate piece SP1 from the resin substrate P1, other than the first side of the substrate piece SP1 It is a device for forming a cutting line (referred to as the second cutting line SL2) along the second side (Fig. 7(e)).

When forming the second cutting line SL2, the second cutting line forming means 13 forms a groove in the PET layer by irradiation with laser light, and passes through the scribe wheel SW (described later) to the groove. A cutting line is formed in the resin layer L1.

In addition, the second cutting line forming means 13 forms a cutting line (filling line) for peeling the portion where the electrode d1 of the first PET layer L4 is formed. At this time, the second cutting line forming means 13 is a groove corresponding to the boundary between the OLED layer d and the electrode d1 of the first PET layer L4 by irradiation of laser light, and the groove as the filling line. To form.

Specifically, the second cutting line forming means 13 has a second laser device 13A and a scribe wheel cutting device 13B.

The second laser device 13A has a laser oscillator that outputs the second laser light LA2, and a transmission optical system that transmits the second laser light LA2 to a mechanical drive system 15, which will be described later (all shown). Do not). The transmission optical system includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like, although not shown. Further, the transmission optical system has, for example, an X-axis direction movement mechanism (not shown) for moving the laser irradiation head (not shown) in which the laser oscillator and other optical systems are interposed in the X-axis direction. The laser oscillator of the second laser device 13A is, for example, a CO ₂ laser.

The scribe wheel cutting device 13B is a device that cuts a substrate by transmitting the scribe wheel SW. In this embodiment, the scribe wheel cutting device 13B is used to form the second cutting line SL2 on the resin layer L1 of the resin substrate P1.

The scribe wheel SW is a disk-shaped member in which the outer circumferential portion is formed in a V shape. The outer circumferential portion of the scribe wheel SW becomes a blade for forming a cutting line in the resin layer L1. The scribe wheel SW has, for example, a diameter of 5 to 15 mm, and the apex angle of the V-shaped blade tip is 20 to 50°.

The mechanical drive system 15 is a mechanism that moves the resin substrate P1 in the horizontal direction and rotates around the central axis. Specifically, the machine drive system 15 moves the bed 15A, the processing table 15B on which the resin substrate P1 is placed, and the processing table 15B in the horizontal direction with respect to the bed 15A. It has a device 15C. The moving device 15C is a known mechanism having a guide rail, a moving table, a rotating mechanism, a motor, and the like.

In the cutting device 1 of the present embodiment, the moving device 15C moves the resin substrate P1 relative to the first cutting line forming means 11 and the second cutting line forming means 13. , A cut line is formed on the resin substrate P1.

In addition, the mechanical drive system 15 includes a mechanism for rotating the resin substrate P1 (processing table 15B) and a mechanism for reversing the front and back of the resin substrate P1 (all not shown).

The control unit 17 includes a processor (for example, a CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A/D converter, D/A converter) , Communication interface, etc.). The control unit 17 performs various control operations by executing a program stored in the storage unit (corresponding to part or all of the storage area of the storage device).

The control unit 17 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.

Although not illustrated, a sensor for detecting the size, shape, and position of the resin substrate P1, a sensor and a switch for detecting the state of each device, and an information input device are connected to the control unit 17.

In this embodiment, the control unit 17 can control the first cutting line forming means 11, the second cutting line forming means 13, and the moving device 15C.

(3) Method of cutting out substrate fragments

Hereinafter, a substrate piece (Fig. 4 to 7), a plurality of OLED layers (d) from the resin substrate (P1) formed in an array shape, a substrate small piece comprising an electrode (d1) corresponding to one OLED layer (d) ( The method of cutting out SP1) will be described. 4 and 5 are views schematically showing a case in which the cut-out method of the substrate piece is seen from the cross-sectional direction of the resin substrate. 6 and 7 are views schematically showing a case in which the cut-out method of the substrate piece is seen from the plane direction of the resin substrate. In the following, a method of cutting out a small piece of substrate SP1 having a rectangular shape will be described.

Before cutting out, the first PET layer L4 side of the resin substrate P1 (the side where the OLED layer d and the electrode d1 are formed) is turned up, and the Y direction and the cutting of the resin substrate P1 are cut out. The resin substrate P1 is placed on the processing table 15B so that the movement direction of the resin substrate P1 in the device 1 is parallel.

After placing the resin substrate P1 on the processing table 15B, a cutting line for cutting out the substrate small piece SP1 is formed. In the resin substrate P1 having the multi-layer structure described above, (i) a groove is formed in the PET layer, or (ii) a scribe wheel SW is inserted into the groove formed in the PET layer to cut into the resin layer L1. The cutting line is formed by forming a line or by irradiating the first laser light LA1 from this groove to form a cutting line in the resin layer L1 and the protective layer.

First, a groove for passing the scribe wheel SW and the first laser light LA1 is formed in the first PET layer L4.

Specifically, as shown in FIGS. 4A and 6A, the second laser light LA2 is X-directed along the boundary line on the side where the electrode d1 of the substrate piece SP1 is formed. By scanning with, a first groove G1 is formed at a position corresponding to the first side crossing the electrode d1 of the substrate piece SP1.

Further, in the case of forming the first groove G1, the second laser light LA2 is scanned in the X direction from the OLED layer d side slightly smaller than the end in the Y direction of the electrode d1.

Next, the second laser light LA2 is scanned in the X direction along the boundary line opposite to the side on which the electrode d1 of the OLED layer d is formed, and along the boundary line in the X direction of the OLED layer d. By scanning in the Y direction, a second groove G2 is formed at positions corresponding to three second sides of the substrate piece SP1 other than the first side.

Further, by scanning the second laser light LA2 in the X direction along the boundary line between the OLED layer d and the electrode d1, the first PET layer (at the boundary line between the OLED layer d and the electrode d1) A groove (filling line PL) for peeling L4) from the portion where the electrode d1 is formed is formed.

In addition, it is preferable that the groove formed by the second laser beam LA2 has an opening angle θ in the range of 45° to 100°. The opening angle θ is defined as the angle formed by the two side walls of the groove. Moreover, it is preferable that the groove width is in the range of 40 µm to 200 µm.

After forming the first groove G1 and the second groove G2, a second cut line SL2 corresponding to the second side of the substrate piece SP1 is formed.

Specifically, as shown in FIGS. 4B and 6B, the scribe wheel SW passes through the second groove G2 extending along the boundary line in the X direction of the OLED layer d. By doing so, the resin substrate P1 is moved in the Y direction while the blade end of the scribe wheel SW is pushed into the resin layer L1 by applying a predetermined load, and the scribe wheel SW is further driven. Accordingly, the second resin cutting line PS2 is formed on the resin layer L1 along the two boundary lines in the X direction of the OLED layer d.

As described above, the second cutting line SL2 composed of the second groove G2 and the second resin cutting line PS2 is positioned at positions corresponding to the two boundary lines in the X direction of the substrate piece SP1. Is formed.

In addition, the scribe wheel SW is passed through the scribe wheel SW in the second groove G2 extending along the boundary line opposite to the side on which the electrode d1 of the OLED layer d is formed, by applying a predetermined load. While pushing the blade end of the resin layer (L1), the resin substrate (P1) is moved in the X direction, and the scribe wheel (SW) is further driven. Accordingly, the second resin cutting line PS2 may be formed on the resin layer L1 along the boundary line on the side where the electrode d1 is not formed among the boundary lines in the Y direction of the OLED layer d.

As described above, the second cut formed by the second groove G2 and the second resin cutting line PS2 on the opposite side to the side where the electrode d1 is formed among the boundary lines in the Y direction of the substrate piece SP1. Line SL2 is formed.

After forming the second cut line SL2, the first cut line SL1 corresponding to the first side of the substrate piece SP1 is formed.

Specifically, as shown in FIGS. 4C and 6C, the first laser beam LA1 output from the first cutting line forming means 11 and the first groove G1 are used. By passing through and irradiating the resin layer L1, the first protective layer L2, and the electrode d1, the first resin cut line PS1 is formed.

As described above, at a position corresponding to the first side crossing the plurality of electrodes d1 of the substrate piece SP1, the first groove G1 and the first resin cut line PS1 are configured. The cutting line SL1 is formed.

As for the irradiation conditions of the first laser beam LA1 when forming the first resin cutting line PS1, for example, the fluence (energy amount per unit area) is 1 to 20 J/cm 2 (preferably. , 4-10J/cm2). The number of irradiations may be one or multiple times. Carbonization of the resin layer L1 can be reduced by reducing the amount of energy per time and irradiating a plurality of times (for example, three or more times).

After forming the first cut line SL1 and the second cut line SL2, the front and rear sides of the resin substrate P1 are inverted, and as shown in Figs. 5D and 7D, the second cut line SL2 is formed. A third groove G3 is formed at positions corresponding to the first cut line SL1 and the second cut line SL2 of the PET layer L5.

The third groove G3 is the second laser light at a position corresponding to the first cutting line SL1 and the second cutting line SL2 of the second PET layer L5 by the second laser device 13A. It is formed by moving the second laser light LA2 with respect to the resin substrate P1 by moving the moving device 15C while irradiating (LA2).

After forming the first cutting line SL1 and the second cutting line SL2 for cutting out the substrate small piece SP1 from the resin substrate P1, from the portion where the electrode d1 of the substrate small piece SP1 is formed, 1 Peel the PET layer (L4).

Specifically, for example, a portion to be peeled off of the first PET layer L4 is adhered to the adhesive tape, and the adhesive tape is separated from the substrate piece SP1 to peel the peeling line PL and the first cut line. The portion of the first PET layer L4 surrounded by the (SL1) (first groove G1) and the second cut line SL2 (the second groove G2) is peeled from the substrate piece SP1.

As described above, from the resin substrate P1, the substrate piece SP1 having a cross-sectional structure as shown in Fig. 5(e) and having a planar structure as shown in Fig. 7(e) can be cut out. have. The substrate small piece SP1 has a first side intersecting the electrode d1 and a second side other than that.

The first cut line SL1 corresponding to the first side of the substrate piece SP1 is formed by irradiating the resin layer L1 with the first laser beam LA1. At this time, when the resin layer L1 is carbonized by irradiation of the first laser beam LA1, carbide may be formed on the first side of the substrate piece SP1 and its vicinity.

Moreover, when forming the 1st cut line SL1, the 1st laser beam LA1 is scanned in the direction crossing the electrode d1. Therefore, when forming the first cut line SL1, the carbide may be generated in a state in which the plurality of electrodes d1 are “crosslinked”.

When the carbide is formed in a state in which a plurality of electrodes d1 are crosslinked, a plurality of electrodes d1 that should be insulated from each other short-circuits, and there is a possibility that the OLED layer d malfunctions or malfunctions. This is because carbides produced from the resin layer L1 generally have conductivity.

Therefore, in the present embodiment, after cutting out the substrate piece SP1, the plurality of electrodes (at the position between the OLED layer d and the first side of the plurality of electrodes d1 of the substrate piece SP1) The electrodeless region d11 from which the electrode d1 is removed is formed so as to cross d1).

Specifically, as shown in FIGS. 5(f) and 7(f), the first laser light LA1 is located at a position between the OLED layer d and the first side of the plurality of electrodes d1. ) Is irradiated while scanning in the X direction to remove the electrodes d1 and the second protective layer L3 at corresponding positions.

Further, when the electrode d1 and the second protective layer L3 are removed to form the electrodeless region d11, the intensity of the first laser beam LA1 is the first cutting line SL1 (the first 1 It is made weaker than the strength at the time of formation of the resin cutting line PS1. Accordingly, it is possible to avoid formation of a cutting line to the resin layer L1 by irradiation of the first laser light LA1.

In the irradiation condition of the first laser light LA1 when forming the electrodeless region d11, for example, the fluence (energy amount per unit area) is 1 to 20 J/cm 2 (preferably 4 to 10 J/ Cm2), and the number of irradiations is one.

In the position between the OLED layer d of the electrode d1 and the first side, by forming the electrodeless region d11 from which the electrode d1 is removed so as to intersect with the plurality of electrodes d1, the plurality of electrodes ( d1) can be separated into an electrode d1 on the OLED layer d side and an electrode d1 on the first side.

In this case, the electrode d1 on the first side may be shorted by the carbide formed on the first side, while the electrode d1 on the OLED layer d side is not affected by the carbide. Does not. Therefore, by connecting the electrode d1 on the OLED layer d side with an external circuit, it is possible to avoid malfunction or failure of the OLED layer d of the substrate piece SP1.

2. Other embodiments

As mentioned above, although one embodiment of the present invention has been described, the present invention is not limited to the above embodiment, and various changes can be made without departing from the gist of the invention. In particular, the plurality of embodiments and modifications written in this specification can be arbitrarily combined as necessary.

(A) In the above-described first embodiment, the first cutting line SL1 is formed after the formation of the second cutting line SL2, but is not limited thereto, and the second cutting line SL1 is formed after the second cutting line SL1 is formed. You may form the cutting line SL2.

(B) The formation of the electrodeless region d11 may be performed in advance before cutting out the substrate piece SP1 (before forming the first cut line SL1 and the second cut line SL2). For example, after forming the first resin cutting line PS1, the resin substrate P1 is slightly moved in the Y direction, and then irradiated while scanning the first laser light LA1 in the X direction again. (d11) can be formed.

Or, on the contrary, after forming the electrodeless region d11 by irradiating the first laser light LA1 along the X direction, after moving the resin substrate P1 slightly in the Y direction, the first laser light LA1 ) By irradiating while scanning along the first side, the first resin cut line PS1 can be formed.

(C) The shape of the substrate small piece SP1 is not limited to a rectangle, and can be any shape. Also in this case, the side that intersects the electrode d1 is defined as the first side and the other side is defined as the second side, and the substrate piece SP1 can be cut out in the same manner as described above.

(Industrial availability)

The present invention can be widely applied to the cutting of small pieces of a substrate from a resin substrate having an electric circuit.

1: cutting device
11: First cutting line forming means
LA1: 1st laser light
13: second cutting line forming means
13A: second laser device
LA2: Second laser light
13B: scribe wheel cutting device
SW: scribe wheel
15: mechanical drivetrain
15A: Bed
15B: processing table
15C: mobile device
17: control unit
P1: Resin substrate
SP1: Substrate
d: OLED layer
d1: electrode
d11: electrodeless area
L1: resin layer
L2: first protective layer
L3: second protective layer
L4: 1st PET layer
L5: second PET layer
G1: 1st home
G2: Second home
G3: Third home
PL: Filling line
PS1: First resin cutting line
PS2: Second resin cutting line
SL1: First cutting line
SL2: Second cutting line

Claims (6)

A method of cutting out a piece of a substrate having a first side intersecting the plurality of electrodes and a second side extending along the element from a resin substrate on which the element and the plurality of electrodes for connecting the element to the outside are formed,
Forming a first cutting line along the first side and forming a second cutting line along the second side to cut out the piece of the substrate;
And forming a non-electrode region extending in a direction intersecting the plurality of electrodes on the plurality of electrodes existing between the first side and the element. According to claim 1,
The first cutting line is formed by irradiating the electrode and the resin substrate with laser light. According to claim 1,
The electrodeless region is formed by irradiating at least the electrode with laser light. The method according to any one of claims 1 to 3,
The step of forming the electrodeless region is performed after the step of cutting out the small piece of the substrate. The method according to any one of claims 1 to 3,
The step of forming the electrodeless region is performed before the step of cutting out the small piece of the substrate. An apparatus for cutting out a piece of a substrate having a first side intersecting the plurality of electrodes and a second side extending along the element, from a resin substrate having a plurality of electrodes for connecting the element and the element to the outside,
Forming a first cutting line along the first side and forming a non-electrode region extending in a direction intersecting the plurality of electrodes on the plurality of electrodes existing between the first side and the element. 1 cutting means,
And a second cutting means for forming a second cutting line along the second side.

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