KR20200018078A - Lighting module having enhanced heat radiation performance, bent type heat plate used therefor, and method for manufacturing bent type heat plate - Google Patents

Abstract

Provided are a light emitting module having improved heat radiation performance, a bending type heat plate used therefor, and a manufacturing method of the bending type heat plate. The light emitting module having improved heat radiation performance comprises: a light source; a circuit board on which the light source is mounted; and a heat plate coupled with the circuit board and discharging heat generated in the light source. The heat plate includes: a heat collection unit disposed to face a bottom surface of the circuit board so as to support the circuit board and receiving the heat from the light source through the circuit board; and a heat diffusion and discharge unit bent and extended from the heat collection unit to be disposed to face a side surface of the circuit board and diffusing and discharging the heat received from the heat collection unit.

Description

LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE, BENT TYPE HEAT PLATE USED THEREFOR, AND METHOD FOR MANUFACTURING BENT TYPE HEAT PLATE}

The present invention relates to a light emitting module having improved heat dissipation performance, a bending heat plate used therein, and a method of manufacturing a bending heat plate.

In general, the display device is a device for displaying an image on the screen, for example, may have the form of a television, a computer monitor, a digital information display.

The display apparatus includes a display panel and a backlight unit for injecting light into the rear surface of the display panel. The backlight unit is provided with a light source for injecting light into the display panel. A light emitting diode or the like is used as the light source. At this time, the light source of the backlight unit not only generates light but also generates heat to deteriorate the display panel. For example, a plurality of LED lamps installed in the backlight unit consumes about 1W of power per unit, and more than 70% of heat is generated from the power of 1W. The number of LED lamps commonly used in 30-inch TFT-LCDs is about 200, and the heat generated is 140W. The heat generated in this way increases the temperature inside the backlight unit, thereby lowering the reliability of the operation of the electronic circuit. The thermal stress of the parts or the case is caused by the internal temperature difference, which causes deformation of the product.

Therefore, the display device is provided with heat dissipation means for appropriately dissipating heat generated from the light source of the backlight unit.

One object of the present invention is to manufacture a light emitting module having improved heat dissipation performance, a bent heat plate used therein, and a bent heat plate, in which heat generated from a light source can be diffused and discharged in a direction different from that in which it is generated. To provide a way.

Another object of the present invention is to provide a light emitting module having an improved heat dissipation performance, a bent heat plate used therein, and a bent heat plate manufacturing method, which enables the heat plate to efficiently collect heat generated from a light source. It is.

It is still another object of the present invention to provide a light emitting module having improved heat dissipation performance, a bending type heat plate used therein, and a bending type heat type, so that the receiving space for receiving the working fluid is not blocked when the heat plate is bent. It is to provide a plate manufacturing method.

Light emitting module having an improved heat dissipation performance according to an aspect of the present invention for realizing the above object, the light source; A circuit board on which the light source is mounted; And a heat plate coupled to the circuit board and dissipating heat generated from the light source, wherein the heat plate is disposed to face the bottom surface of the circuit board to support the circuit board, and to support the circuit board through the circuit board. A heat collecting part receiving heat from the light source; And a heat diffusion discharge part that is bent and extended from the heat collection part to face the side surface of the circuit board and diffuses and discharges the heat transferred from the heat collection part.

Here, the heat diffusion discharge portion may have a greater length than the heat collection portion along the extension direction of the heat plate.

Here, the heat plate, the first plate; And a second plate coupled to the first plate and disposed farther from the circuit board than the first plate, wherein the first plate is thicker than the second plate.

Here, the thickness of the first plate may be twice the thickness of the second plate.

Here, the heat plate further includes a working fluid for absorbing and evaporating heat generated by the light source, the heat collecting unit includes a first receiving space for receiving the working fluid, the heat diffusion discharge unit, A second accommodation space for receiving a working fluid, said first accommodation space and said second accommodation space being in communication with each other.

According to another aspect of the present invention, a bent heat plate includes: a heat collecting part formed to face a bottom surface of a heat generating source to support the heat generating source and to receive heat generated from the heat generating source; A heat diffusion discharging part extending from the heat collecting part, having a larger area than the heat collecting part, and diffusing and discharging the heat transferred from the heat collecting part; And a working fluid accommodated in the heat diffusion discharge unit to receive the heat through the heat collection unit and to evaporate the heat diffusion discharge unit.

Here, the heat diffusion discharge unit may be disposed perpendicular to the heat collection unit.

Here, the heat plate, the first plate; And a second plate coupled to the first plate to receive the working fluid in an accommodation space formed together with the first plate, wherein the first plate and the second plate are formed to have different thicknesses. Can be.

The heat collecting part may include a first accommodating space accommodating the working fluid, and the heat diffusion discharging part includes a second accommodating space accommodating the working fluid, the first accommodating space and the second accommodating space. Spaces can communicate with each other.

Bending type heat plate manufacturing method according to another aspect of the present invention comprises the steps of preparing a first plate and the second plate and forming a bead on at least one of them by pressing the second plate to form a bead; Bonding the first plate and the second plate to form an accommodation space based on the beads; Bending the first plate and the second plate about a reference line to form a heat collecting part receiving heat from a heat generating source and a heat diffusion discharging part receiving and diffusing the heat from the heat collecting part; And injecting a working fluid into the accommodation space and encapsulating the accommodation space.

Here, preparing the first plate and the second plate and forming a bead on at least one of them may include pressing a bending section corresponding to the reference line among the beads deeper than the remaining sections.

Bending type heat plate manufacturing method according to another aspect of the present invention comprises the steps of preparing a first plate and the second plate and forming a bead on at least one of them; Bending the first plate and the second plate about a reference line, respectively; Bonding the bent first plate and the second plate to form a receiving space based on the beads, and forming a heat collecting part receiving heat from a heat generating source and a heat diffusion discharging part for receiving and diffusing the heat from the heat collecting part. Making; And injecting a working fluid into the accommodation space and encapsulating the accommodation space.

According to the light emitting module having the improved heat dissipation performance, the bending type heat plate used therein, and the bending type heat plate manufacturing method according to the present invention configured as described above, heat generated from a light source (heating source) is heated through a circuit board. It is delivered to the plate and then discharged from the heat plate. At this time, the heat collecting portion of the heat plate collects heat generated from the light source on the lower side of the circuit board, the heat diffusion discharging portion is extended in the direction bent from the heat collecting portion and diffuses and discharges the heat received from the heat collecting portion. Thereby, the heat concentrated on the heat collection portion side can be quickly diffused and discharged in a direction different from the direction in which it is generated, so that the heat generating source can be cooled effectively.

The heat plate is composed of a first plate and a second plate, and since the first plate and the second plate close to the circuit board are formed to have different thicknesses, the heat collecting unit effectively collects heat generated from the light source, It can be delivered. In addition, since the working fluid is also accommodated in the heat collecting unit, it is possible to reduce the heat transfer path to the working fluid to increase the heat transfer efficiency to the working fluid.

By bending the first plate and the second plate separately or by pressing the bending section of the second plate more deeply, the bending space between the heat collecting portion and the heat diffusion discharging portion does not block the receiving space for receiving the working fluid.

1 is a perspective view illustrating a state in which a light emitting module having improved heat dissipation performance according to an embodiment of the present invention is mounted in a chassis C. Referring to FIG.
FIG. 2 is a perspective view of the bent heat plate 300 of FIG. 1 viewed from another direction.
3 is a cross-sectional view taken along the line III-III of FIG. 1.
4 is a cross-sectional view illustrating a bent heat plate 300 ′ according to a modification of the bent heat plate 300 of FIG. 3.
5 is a flowchart illustrating a method of manufacturing a bent heat plate according to another embodiment of the present invention.
FIG. 6 is a conceptual diagram illustrating a processing form of a first plate and a second plate related to one step S1 of FIG. 5.
7 is a flowchart illustrating a method of manufacturing a bent heat plate according to another embodiment of the present invention.
FIG. 8 is a conceptual diagram illustrating a processing form of a first plate and a second plate related to one step S13 of FIG. 7.

Hereinafter, a light emitting module having an improved heat dissipation performance according to a preferred embodiment of the present invention, a bending heat plate used therein, and a bending heat plate manufacturing method will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are assigned to the same or similar configurations in different embodiments, and the description thereof is replaced with the first description.

1 is a perspective view illustrating a state in which a light emitting module having improved heat dissipation performance according to an embodiment of the present invention is mounted in a chassis C. Referring to FIG.

Referring to the figure, the light emitting module is mounted on the chassis C of the display device, and emits light onto a light guide plate (not shown). Specifically, the light emitting module may include a light source 100, a circuit board 200, and a bending heat plate 300.

The light source 100 is configured to output light, and may be, for example, an LED. Such LEDs output light and generate heat.

The circuit board 200 is an object on which the light source 100 is mounted and controls the operation of the light source 100. The circuit board 200 may be, for example, a metal PCB. In this case, the metal PC ratio is advantageous in transferring heat generated from the light source 100 to the bending type heat plate 300. In view of the bending heat plate 300, the light source 100 and the circuit board 200 may be referred to as a heat generating source.

The bending heat plate 300 is coupled to the circuit board 200 to discharge heat generated from the light source 100. Specifically, the bending heat plate 300 includes a heat collecting part 310 and a heat diffusion discharging part 330. The heat collector 310 supports the circuit board 200 and collects heat therefrom. The heat diffusion discharge unit 330 diffuses and discharges the heat collected by the heat collection unit 310.

By such a configuration, the bending type heat plate 300 can be structurally coupled with the heat generating source through the heat collecting unit 310 without any other installation member. In addition, the bending type heat plate 300 may first collect heat of the heat generating source through the heat collecting unit 310 and diffusely discharge the second heat through the heat diffusion discharging unit 330.

Detailed configuration of the bending type heat plate 300 for this purpose will be described with reference to FIG. 2.

FIG. 2 is a perspective view of the bent heat plate 300 of FIG. 1 viewed from another direction.

Referring to this figure, the bending heat plate 300 has a heat collecting unit 310 and a heat diffusion discharge unit 330 as described above.

The heat collector 310 may be formed to have a width wider than the width of the circuit board 200. The heat collector 310 is disposed to face the bottom of the circuit board 200 and supports the circuit board 200. The circuit board 200 may be coupled to the heat collector 310 by tape, bond, or the like. The above-described tape, bond, etc. may be a barrier to the heat collector 310 to receive heat from the circuit board 200. In order to overcome such obstacles and to increase the heat transfer efficiency from the circuit board 200 to the heat collection unit 310, the bent heat plates 300 and 300 ′ of the new configuration are illustrated in FIGS. 3 and 4.

Referring back to FIG. 2, the heat spreader 330 is bent and extended from the heat collector 310. As a result, the heat collecting unit 310 and the heat spreading and discharging unit 330 may extend in different directions, for example, may be disposed perpendicular to each other. The heat spreader 330 may have a greater length than the heat collector 310 along the extension direction from the heat collector 310 to the heat spreader 330. Accordingly, the area of the heat diffusion discharge unit 330 may be larger than the area of the heat collection unit 310. The heat diffusion discharge unit 330 diffuses the heat received from the heat collection unit 310 to discharge to the chassis (C). In detail, the heat diffusion discharger 330 is connected to the heat collector 310 in the lower region 331 to receive heat from the heat collector 310. The heat is diffused to the upper region 332 through the working fluid 390 (see FIG. 3) contained in the heat diffusion discharge portion 330 and is discharged to the chassis C. An injection hole 335 for injecting the working fluid 390 into the heat diffusion discharge portion 330 may be formed at a side of the heat diffusion discharge portion 330.

The bending type heat plate 300 may include a first plate 350 and a second plate 370 from a laminated structural point of view, unlike the division according to the above region.

The first plate 350 is positioned closer to the light source 100 than the second plate 370. Beads 375 may be formed on the second plate 370. The bead 375 is a portion in which a groove is formed by pressing the second plate 370. In this figure, a block protruding surface is shown. The bead 375 is a configuration on which the receiving space 333 (see FIG. 3) is formed. Bead 375 may specifically include vertical beads 376 and horizontal beads 377. Vertical beads 376 guide the working fluid 390 in the evaporation direction E from the lower region 331 to the upper region 332, and also in the condensation direction from the upper region 332 to the lower region 331. You may be guided to (C). The plurality of vertical beads 376 may be provided and arranged in parallel with each other. The horizontal beads 377 may be connected to both ends of the vertical beads 376 to communicate the plurality of vertical beads 376 with each other. The beads 375 may be formed on the first plate 350 instead of the second plate 370, or may be formed on the first plate 350 and the second plate 370 to correspond to each other.

The relative relationship between the first plate 350 and the second plate 370 will be described with reference to FIG. 3.

3 is a cross-sectional view taken along the line III-III of FIG. 1.

Referring to this drawing, when the first plate 350 and the second plate 370 are bonded to each other, an accommodation space 333 is formed based on the bead 375 of the second plate 370. In other words, the accommodation space 333 is a closed space formed by covering the open face of the bead 375 of the second plate 370 with the first plate 350. The working fluid 390 is accommodated in the accommodation space 333. The accommodation space 333 may be formed in an area of the thermal diffusion discharge part 330.

The first plate 350 transfers heat received from the light source 100 to the working fluid 390. Here, the thicknesses of the first plate 350 and the second plate 370 may be different from each other. The difference in thickness between them is determined by consideration to allow the first plate 350 to effectively transfer the heat of the light source 100 to the working fluid 390. Specifically, when aluminum or copper having good thermal conductivity is used as the first plate 350, the first plate 350 may be formed thicker than the second plate 370. For example, the thickness of the first plate 350 may be twice the thickness of the second plate 370. On the contrary, when stainless having poor thermal conductivity is used, the thickness of the first plate 350 may be thinner than that of the second plate 370. Due to this thickness difference, the overall rigidity of the heat plate 300 is maintained at a certain level, and the first plate 350 can effectively perform heat transfer to the working fluid 390.

A configuration in which heat transfer to the working fluid 390 is effectively performed in a manner different from that described above will be described with reference to FIG. 4.

4 is a cross-sectional view illustrating a bent heat plate 300 ′ according to a modification of the bent heat plate 300 of FIG. 3.

Referring to this figure, unlike the previous embodiment, the thickness of the first plate 350 and the second plate 370 in the bent heat plate 300 ′ may be the same. However, the accommodating space 313 (first accommodating space) is also formed in the heat collecting part 310 to correspond to the accommodating space 333 (second accommodating space) provided in the heat diffusion discharge part 330. These first accommodating spaces 313 and second accommodating spaces 333 communicate with each other. To this end, the beads 375 of the second plate 370 may be formed to extend not only to the heat diffusion discharge portion 330 but also to the heat collection portion 310.

According to this configuration, heat generated from the light source 100 is transferred to the working fluid 390 through the shortest path via the circuit board 200. In detail, heat of the circuit board 200 may be directly transferred to the working fluid 390 through the bottom portion 351 of the first plate 350 that supports the circuit board 200.

In the above description, the thicknesses of the first plate 350 and the second plate 370 may be the same as each other, and their thicknesses may be different from each other.

Next, the manufacturing method of the bending type heat plate 300 'is demonstrated with reference to FIGS.

5 is a flowchart illustrating a method for manufacturing a bent heat plate according to another exemplary embodiment of the present invention, and FIG. 6 is a conceptual view illustrating a processing form of a first plate and a second plate related to one step S1 of FIG. 5. to be.

Referring to FIG. 5, in order to manufacture the bent heat plate 300 ′ (see FIG. 4), first, the first plate 350 and the second plate 370 should be prepared. Here, the beads 375 are formed in at least one of them, for example, the second plate 370 (S1). In order to form the beads 375, the disc of the second plate 370 may be pressed.

In forming the bead 375, as illustrated in FIG. 6, the bending section 375a corresponding to the reference line S may be pressed deeper than the remaining sections. The bending section 375a may have a rectangular shape (Fig. 6 (a)). Alternatively, the bending section 375b may have a triangular shape (Fig. 6 (b)).

Referring back to FIG. 5, the first plate 350 and the second plate 370 are joined to each other while the beads 375 are formed in the second plate 370 (S3). Their bonding can be carried out by the brazing method. By joining the first plate 350 and the second plate 370 to each other, receiving spaces 313 and 333 based on the beads 375 are formed.

Now, in order to form the heat collecting part 310 and the heat spreading discharge part 330, the first plate 350 and the second plate 370 joined to each other are bent around the reference line S (S5). In this bending process, the bending sections 375a and 375b may be bent with a large amount of deformation in a section corresponding to the reference line S of the second plate 370. As a result, even when the depth of the bead 375 is not deep in the section corresponding to the reference line S, the first plate 350 and the second plate 370 are no longer constricted.

After the first plate 350 and the second plate 370 are bent in this manner, the working fluid 390 (see FIG. 4) is introduced into the receiving spaces 313 and 333 through the inlet 335 (FIG. 2). May be injected. Thereafter, the accommodation spaces 313 and 333 may be sealed by pinching the injection hole 335.

Finally, another manufacturing method for the bent heat plate 300 ′ will be described with reference to FIGS. 7 to 8.

7 is a flowchart illustrating a method of manufacturing a bent heat plate according to another embodiment of the present invention, and FIG. 8 illustrates a processing form of a first plate and a second plate related to one step S13 of FIG. 7. Conceptual diagram.

First, referring to FIG. 7, a first plate 350 and a second plate 370 are prepared, and as one of them, for example, a bead 375 is formed in the second plate 370 (S11).

The first plate 350 and the second plate 370 are bent around the reference line S, respectively (S13). In bending each of the first plate 350 and the second plate 370, a portion corresponding to the reference line S may be smoothly bent using a jig. Thereby, even if the bead 375 is not deep, the accommodating spaces 313 and 333 do not become narrow.

Next, the bent first plate 350 and the second plate 370 are bonded to each other (S15). They can be brazed and the receiving spaces 313 and 333 are formed based on the beads 375. The first plate 350 and the second plate 370 bonded to each other constitute a heat collecting part 310 and a heat spreading discharge part 330.

After the first plate 350 and the second plate 370 are bonded in this manner, the working fluid 390 (see FIG. 4) may be injected into the accommodation spaces 313 and 333 through the injection holes 335 (FIG. 2). have. Thereafter, the accommodation spaces 313 and 333 may be sealed by pinching the injection hole 335.

The light emitting module having the improved heat dissipation performance as described above, a bent heat plate used therein, and a bent heat plate manufacturing method are not limited to the configuration and operation of the embodiments described above. The above embodiments may be configured such that various modifications may be made by selectively combining all or part of the embodiments.

100: light source 200: circuit board
300, 300 ': bending type heat plate 310: heat collecting portion
330: thermal diffusion discharge unit 350: first plate
370: second plate 390: working fluid

Claims (12)

Light source;
A circuit board on which the light source is mounted; And
A heat plate coupled to the circuit board and dissipating heat generated from the light source;
The heat plate,
A heat collecting part disposed to face a bottom surface of the circuit board to support the circuit board and to receive the heat from the light source through the circuit board; And
A light emitting module having improved heat dissipation performance including a heat diffusion part disposed to be bent from the heat collecting part to face a side surface of the circuit board and to diffuse and discharge the heat received from the heat collecting part.
The method of claim 1,
A light emitting module having improved heat dissipation performance along the extension direction of the heat plate, wherein the heat diffusion discharge portion has a length greater than that of the heat collection portion.
The method of claim 1,
The heat plate,
A first plate; And
A second plate coupled to the first plate and disposed farther from the circuit board than the first plate;
The first plate is thicker than the second plate, the light emitting module having improved heat dissipation performance.
The method of claim 3,
The thickness of the first plate,
A light emitting module having improved heat dissipation performance, which is twice the thickness of the second plate.
The method of claim 1,
The heat plate,
Further comprising a working fluid for absorbing and evaporating heat generated from the light source,
The heat collection unit,
A first receiving space for receiving the working fluid,
The thermal diffusion discharge unit,
A second accommodation space for receiving the working fluid,
And the first receiving space and the second receiving space communicate with each other.
A heat collecting part formed to face the bottom of the heat generating source to support the heat generating source and to receive heat generated from the heat generating source;
A heat diffusion discharging part extending from the heat collecting part, having a larger area than the heat collecting part, and diffusing and discharging the heat transferred from the heat collecting part; And
And a working fluid received in the heat spreader to receive the heat through the heat collector and to evaporate in the heat spreader.
The method of claim 6,
The thermal diffusion discharge unit,
The heat dissipation plate is disposed perpendicular to the heat collecting portion.
The method of claim 6,
The heat plate,
A first plate; And
A second plate coupled to the first plate to receive the working fluid in a receiving space formed together with the first plate,
The first plate and the second plate is a bending heat plate, which is formed to have a different thickness.
The method of claim 6,
The heat collection unit,
A first receiving space for receiving the working fluid,
The thermal diffusion discharge unit,
A second accommodation space for receiving the working fluid,
And the first receiving space and the second receiving space communicate with each other.
Preparing a first plate and a second plate and forming beads in at least one of them;
Bonding the first plate and the second plate to form an accommodation space based on the beads;
Bending the first plate and the second plate about a reference line to form a heat collecting unit receiving heat from a heat generating source and a heat diffusion discharging unit for diffusing and discharging the heat from the heat collecting unit; And
Injecting a working fluid into the receiving space and encapsulating the receiving space.
The method of claim 10,
Preparing the first plate and the second plate and forming beads in at least one of them,
Pressing a bending section corresponding to the baseline of the bead deeper than the remaining section, bending type heat plate manufacturing method.
Preparing a first plate and a second plate and forming beads in at least one of them;
Bending the first plate and the second plate about a reference line, respectively;
Bonding the bent first plate and the second plate to form a receiving space based on the beads, and forming a heat collecting part receiving heat from a heat generating source and a heat diffusion discharging part which receives and diffuses the heat from the heat collecting part. Making; And
Injecting a working fluid into the receiving space and encapsulating the receiving space.

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