KR20200015234A - Adhesive tape having urethane resin for sputtering for electromagnetic interference shielding of BGA package and method manufacturing the same - Google Patents

Abstract

The present invention relates to an adhesive tape for sputtering for shielding electromagnetic interference of a BGA package having a urethane adhesive layer, which comprises: a release liner; a UV curing adhesive layer; a urethane adhesive layer; and a base film, wherein the UV curing adhesive is manufactured by mixing an acrylic copolymer, a ultraviolet curing acrylic oligomer, a curing agent, a photopolymerization initiator and a reaction solvent, the acrylic copolymer is formed by polymerizing a soft type monomer and a hard type monomer in an appropriate ratio, and the urethane adhesive layer is formed using polycarbonate diol, diisocyanate and a chain extender, and to a manufacturing method thereof.

Description

Adhesive tape having urethane resin for sputtering for electromagnetic interference shielding of BGA package and method manufacturing the same}

The present invention relates to a sputtering adhesive tape for EMI shielding of a BGA package having a urethane adhesive layer and a method of manufacturing the same, and more particularly, to an optimal combination of a soft type monomer and a hard type monomer. The present invention relates to a sputtering adhesive tape and a method of manufacturing the same, comprising an acrylic pressure sensitive adhesive layer and a urethane pressure sensitive adhesive layer having excellent re-peelability and improving electromagnetic interference shielding of a BGA package having improved adhesion, cohesion, adhesion and re-peelability.

Recently, the development of the information and communication industry and the thinning and multifunctionalization of IT devices such as mobile devices result in high-density mounting of semiconductors and the increase of the operating frequency to high frequency bands, causing malfunctions and signal quality deterioration due to electromagnetic interference or noise. . The importance of electromagnetic interference shielding technology has been increased to solve this problem. Electromagnetic interference (EMI) means that electromagnetic waves incidentally generated from an electronic device affect the operation of a device or another device of the vehicle body. In particular, the growth of the mobile devices, wearables, the Internet of Things, and the fintech market is increasing the demand for technology for shielding electromagnetic waves. In addition, whether the electromagnetic wave is harmful to the human body is emerging as a social problem, it is important to reduce the amount of unnecessary electromagnetic emissions to a certain level or to create an environment that shields or blocks the external electromagnetic waves in order to solve the electromagnetic interference.

EMI shielding means shielding of electromagnetic interference incident from the outside, and absorbs or reflects the power of electromagnetic waves from the surface to prevent the power from being transferred to the inside. One such electromagnetic shielding technique is sputtering. Sputtering is a technology that prevents electromagnetic interference between components by preventing electromagnetic waves emitted from outside or incident from outside through highly conductive metal thin film deposition on a semiconductor chip or package surface.

In the semiconductor manufacturing process, a ball grid array (BGA) is compared with a pin grid array (PGA) among mounting technologies for electrically connecting a substrate and a chip. The pins of the PGA are used to carry electrical signals from the integrated circuit to the printed circuit board (PCB) to which the chip is attached. In BGA, the pins were replaced with solder balls (aka solder balls) attached to the underside of the package. BGA is a package method that minimizes the problem of increasing semiconductor size when there are many pins in an integrated circuit. The thin and multifunctional electronic devices have increased the number of pins in semiconductor packages and the pin spacing has become more complicated, so that the soldering process becomes more complicated. BGA is to solve this problem.

Due to its morphological characteristics, a BGA package cannot obtain a package having a normal electron shielding function using an existing sputtering adhesive tape (adhesive layer thickness of 20 μm or less). The ball of the package should be sufficiently dipped into the adhesive layer of the tape so that the ball is not exposed to the outside, thereby preventing sputtering to the ball and its surroundings.

The adhesive tape has a structure in which an adhesive is coated on a base film. The adhesive tape should have sufficient adhesive force to fix the semiconductor package in the sputtering process, and at the same time, the adhesive tape should be easily peeled off from the semiconductor package after UV irradiation. In addition, when picking up a package after sputtering, no adhesive residue should be left on the package and solder balls.

Therefore, the development of a pressure-sensitive adhesive composition and a tape having a high adhesive strength before the ultraviolet irradiation, and a low adhesive strength after the ultraviolet irradiation is urgently required.

In general, acrylic adhesives are excellent in adhesive strength, but when the adhesive sheet is attached to the adherend, there is a tendency to easily attract bubbles to the adhesive interface. There exists a tendency for the adherend contamination which an adhesive remains on the surface of a complex to produce easily.

The present invention is to solve the above problems, the present invention synthesizes the adhesive by the optimal combination of a soft type monomer and a hard type monomer to improve the adhesive strength and cohesive force, using a polycarbonate diol It is to provide a polyurethane adhesive layer prepared on the base film to provide a sputtering adhesive tape for shielding electromagnetic interference of the BGA package excellent in re-peelability and a method of manufacturing the same.

According to one embodiment of the present invention for solving the above technical problem, the adhesive tape for sputtering for electronic shielding having a urethane adhesive layer, in the adhesive tape, a release liner having a thickness of 50μm; A UV cured pressure sensitive adhesive layer disposed on a lower surface of the release liner and having a thickness of 100 to 150 μm; A urethane adhesive layer disposed on a lower surface of the UV curing adhesive layer and having a thickness of 100 μm to 150 μm; And a base film disposed on a lower surface of the urethane adhesive layer and having a thickness of 100 μm or 125 μm and composed of a PET material, wherein the UV curable adhesive in the UV curable adhesive layer is an acrylic copolymer, an ultraviolet curable acrylic oligomer, a curing agent, and a photopolymerization. Prepared by mixing an initiator and a reaction solvent, the acrylic copolymer is one of butyl acrylate (Ethyl acrylate) and ethylhexyl acrylate (Ethylhexyl Acrylate) of the soft type monomer (monomer) It is formed by polymerizing at least one of methyl methacrylate and hydroxyethyl methacrylate, which are ideal and hard monomers, and the ultraviolet curable acrylic oligomer is a dimer. Hydroxyethyl (meth) acrylate (2-Hydroxyethyl methacrylate), 2-hydroxypropyl (Meth) acrylate (2-Hydroxypropyl methacrylate), 2-hydroxybutyl (meth) acrylate (2-Hydroxybutyl methacrylate), 4-hydroxybutyl (meth) acrylate (4-Hydroxybutyl methacrylate), acrylic acid (Acrylic acid ), Methacrylic acid (methacrylic acid) and isocyanate monomer (Isocyanate monomer) is formed using one or more, the curing agent is an isocyanate-based curing agent, the photopolymerization initiator is hydroxy alkyl phenone-based, phosphine oxide-based, benzophenol One or more of the photoinitiator is used, and the reaction solvent is ethyl acetate, butyl acetate, toluene, xylene, acetone, methyl ethyl ketone, methyl ethyl ketone, At least one of butyl carbitol acetate is used, and the urethane adhesive layer is made of polycarbonate diol and diisocyanate. After the prepolymer is produced, the degree of polymerization is increased by using a chain extender, and the diisocyanate is selected from the group consisting of isophorone diisocyanate, hexamethylene diisocyanate, isocyanatocyclohexyl methane and diphenylmethane diisocyanate. It is used one or a combination of two or more selected, the chain extender is ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, ethylenediamine, One or two or more of 1,3-diaminopropane, isophoronediamine, and 4,4'-diaminodicyclohexylmethane may be used in combination, and the UV curable pressure sensitive adhesive may be used based on the total amount of the UV curable pressure sensitive adhesive. 40 to 60% by weight of the copolymer, 10 to 25% by weight of the ultraviolet curable acrylic oligomer, 10 to 20% by weight of the curing agent, 0.1 to 0.5% by weight of the photopolymerization initiator, And 10 to 15% by weight of the reaction solvent, wherein the urethane pressure sensitive adhesive is 55 to 61% by weight of the polycarbonate diol, 37 to 43% by weight of the diisocyanate, and the chain extender based on the total amount of the urethane pressure sensitive adhesive. Contains 1 to 2% by weight.

The acrylic copolymer may contain 70 to 80 wt% of the soft type monomer and 20 to 30 wt% of the hard type monomer based on the total amount of the acrylic copolymer.

The UV-curable pressure-sensitive adhesive may be prepared by adding at least one or more of a curing accelerator, a dispersing agent, and an antioxidant, and the curing accelerator is dimethylcyclohexylamine, triethylamine, dibutyltin dilaurate (Dibutyltin dilaurate), potassium acetate (Potassium acetate) may be used by selecting one or more, and the dispersant may be used by selecting one of anionic polyether, cationic polyether and nonionic polyether. The antioxidant may be a hindered phenol-based antioxidant (hindered phenol system), the curing accelerator based on the total amount of the UV curing adhesive 1.1 to 3% by weight, the dispersing agent is 1.3 to 1.7% by weight and the antioxidant 0.01 to 0.7% by weight may be added.

Advantageous Effects of Invention According to the present invention, an acrylic pressure-sensitive adhesive by an appropriate combination of hard and soft type monomers maintains a very high adhesive force before ultraviolet irradiation and forms a polyurethane adhesive layer on the surface of the substrate to provide excellent adhesion and re-peelability. Has

In addition, since the thickness of the components of the adhesive tape is thick, BGA (Ball Grid Array) type has the advantage that it is more useful when a large ball size of 150μm or more of the solder ball (solder ball) size is required.

1 is a view showing a cross-sectional view showing an adhesive tape for sputtering for electronic shielding having a urethane adhesive layer according to an embodiment of the present invention.
2 is a flowchart illustrating a method for manufacturing a sputtering adhesive tape for electronic shielding having a urethane adhesive layer according to an embodiment of the present invention.

Hereinafter, a substrate cleaning apparatus according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a view showing a cross-sectional view showing an adhesive tape for sputtering for electronic shielding having a urethane adhesive layer according to an embodiment of the present invention.

Referring to FIG. 1, the sputtering adhesive tape 100 for electron shielding includes a release liner 10, a UV curing adhesive layer 20, a urethane adhesive layer 30, and a base film 40. do.

The liner substrate used for the release liner 10 of the present invention is not particularly limited as long as it is a general release material. Preferably, the liner base may be a film such as polyester. The liner substrate may have a single layer or a plurality of laminates. The plastic substrate can be appropriately selected and used from various plastic substrates, and examples thereof include polyester substrates such as polyethylene terephthalate substrate and polyamide-type substrate.

In the above-mentioned liner substrate, various surface treatments such as corona discharge treatment, or various surface treatments such as embossing may be optionally applied to their surfaces.

The thickness of the release liner 10 is 38 to 75 μm, preferably 50 μm.

The thickness of the UV cure adhesive layer 20 is 100-150 micrometers, Preferably it is 125 micrometers.

UV-curable pressure-sensitive adhesive is based on the total amount of the UV-curable adhesive, the acrylic copolymer is 40 to 60% by weight, UV curable acrylic oligomer 10 to 25% by weight, curing agent 10 to 20% by weight, photopolymerization initiator 0.1 to 0.5% by weight, and reaction solvent 10 to 15 weight percent.

The acrylic copolymer is synthesized by polymerizing using an injection monomer (monomer, monomer). Acrylic copolymers include butyl acrylate, methyl methacrylate, ethyl acrylate, ethylhexyl acrylate, and hydroxyethyl methacrylate, which are injectable monomers. Methacrylate) is formed by polymerizing two or more kinds.

Specifically, the acrylic copolymer is at least one of butyl acrylate, ethyl acrylate and ethylhexyl acrylate, which is a soft type monomer, and methyl methacrylate, which is a hard type monomer. It is formed by polymerizing one or more of (Methyl Methacrylate) and hydroxyethyl methacrylate (Hydroxyethyl Methacrylate).

The soft type monomer means that the glass transition temperature (Tg) is 0 ° C or less, and the hard type monomer means that the glass transition temperature is 0 ° C or more. The soft type monomer increases the flexibility in the polymer to lower the glass conduction temperature, increases the tacky property and improves the adhesiveness of the adhesive, and the hard type monomer improves the cohesion of the adhesive.

In one embodiment of the present invention, based on the total amount of the acrylic copolymer, the soft type monomer contains 70 to 80% by weight, the hard type monomer contains 20 to 30% by weight. According to the ratio of the soft type monomer and the hard type monomer mentioned above, the adhesive force is improved and the cohesive force is improved than the conventional acrylic UV curable adhesive tape.

UV-curable acrylic oligomer production may be prepared using a functional diluent monomer capable of bonding through a functional reaction with a functional group present in the acrylic oligomer including a double bond polymerized primarily. Preferably, dilution monomers for UV curing that are capable of bonding with hydroxyl groups and / or carboxyl groups are used.

Diluent monomers used include 2-Hydroxyethyl methacrylate, 2-Hydroxypropyl methacrylate, 2-Hydroxypropyl methacrylate, 2-Hydroxybutyl (meth) acrylate One or more of (2-Hydroxybutyl methacrylate), 4-hydroxybutyl methacrylate, 4-Hydroxybutyl methacrylate, acrylic acid, methacrylic acid, and isocyanate monomer can be used. Can be.

For crosslinking of the acrylic copolymer portion, a curing agent is suitably mixed with the acrylic pressure-sensitive adhesive component before ultraviolet irradiation so as to increase the molecular weight of the pressure-sensitive adhesive to control initial adhesive force and cohesive force. The curing agent may be an epoxy curing agent, a phosphate curing agent or an isocyanate curing agent capable of thermal curing. Preferably, an isocyanate curing agent is used as the curing agent. Isocyanate-based curing agent has the advantage of easy control of the curing reaction temperature, speed and adhesion. In the case of a curing agent, if the acrylic copolymer is less than the above-mentioned limited range, there is a fear that the partial crosslinking of the acrylic copolymers may not be made properly, and when the amount of the curing agent exceeds the above-defined range, the adhesive force of the UV-curable pressure-sensitive adhesive layer And shear peeling force may be lowered.

A photopolymerization initiator is a substance that absorbs energy from ultraviolet rays and starts a polymerization reaction. One or more of a hydroxy alkylphenone-based, phosphine oxide-based, and benzophenol-based photoinitiators may be used as the photopolymerization initiator used to cause efficient photocuring even at a low UV irradiation dose.

A reaction solvent is used to prevent the gelation of the synthesized acrylic copolymer and to control the reaction temperature while maintaining the liquid phase. As the reaction solvent, one or more of ethyl acetate, butyl acetate, toluene, xylene, acetone, acetone, methylethylketone, and butyl carbitol acetate are used. do. The molecular weight of the reaction solvent is preferably 500,000 to 1,500,000 in consideration of the bonding strength of the UV-curable pressure-sensitive adhesive layer 20, the adhesion of the base film 40, and the solubility.

At least one or more curing accelerators, dispersants, and antioxidants may be further added to the UV curing adhesive.

A curing accelerator plays a role of accelerating the curing action of the curing agent to lower the activation energy of the curing reaction to speed up the reaction rate and promote partial crosslinking. It is preferable to add 1.1 to 3% by weight based on the total amount of the UV curing adhesive. If the amount of the curing accelerator is less than the above range, the curing reaction time may be long. If the amount of the curing accelerator is more than the above range, the curing reaction may be very fast and the pot life may be shortened.

In one embodiment of the present invention, the curing accelerator is specifically one of dimethylcyclohexylamine (trimethylamine), triethylamine (Triethylamine), dibutyltin dilaurate (Dibutyltin dilaurate), potassium acetate (Potassium acetate) or More than that can be selected.

The dispersant is preferably a polymer having an ether skeleton, and specific examples thereof include anionic polyethers such as carboxyl group-containing polyethers and cationic polyethers such as amino group-containing polyethers, and nonionic polyethers. Examples of the skeleton of the polyether include polyoxyalkylene groups, and specific examples thereof include polyoxyalkylene homopolymers such as polyethylene ether, polypropylene ether, and polybutylene ether, ethylene oxide groups, and propylene oxide groups. The polyoxyalkylene copolymer etc. which have 2 or more types of alkylene oxide groups, such as butylene oxide group, are mentioned. Among these, nonionic polyether is more preferable. As for the weight average molecular weight of a dispersing agent, 1000-100,000 are preferable.

The dispersant may be added 1.3 to 1.7% by weight based on the total amount of the UV curing adhesive.

Antioxidant may be further added in order to improve heat yellowing, repulsion resistance, and storage stability of an adhesion layer. Antioxidant is used by selecting one of a hindered phenol antioxidant and a polyphenol antioxidant.

 Antioxidant may be added 0.01 to 0.7% by weight, based on the total amount of the UV curing adhesive.

The urethane adhesive layer 30 is prepared using polycarbonate diol, diisocyanate and a chain extender.

The thickness of the urethane adhesive layer 20 is 100-150 micrometers, Preferably it is 125 micrometers.

The urethane adhesive contains 55 to 61% by weight of polycarbonate diol, 37 to 43% by weight of diisocyanate, and 1 to 2% by weight of chain extender based on the total amount of urethane adhesive.

Specifically, a polycarbonate diol and an excess of diisocyanate are first reacted to prepare a prepolymer having an isocyanate at the terminal, and then a degree of polymerization is increased using a chain extender to prepare a polyurethane adhesive layer.

Polycarbonate diol is a compound containing a carbonate structure with a weight average molecular weight of 500 to 2,000 is used in the production of high performance urethane resin with excellent flexibility and durability, and has a hydroxyl group at both ends of the molecular chain, hydroxy group and isocyanate group By bonding to form a urethane bond.

Polycarbonate diol is a polyol having excellent mechanical properties, chemical resistance, chemical resistance, hydrolysis resistance, light resistance, and heat resistance compared to polyester diol, polyether diol, and polycaprolactone diol. The demand is increasing, especially in the fields of automobiles, electronic materials, industrial materials that require high durability.

Inexpensive polyester diols have been mainly used for polyurethane resins. However, in the present invention, to prepare a urethane adhesive layer for high durability and high reliability, polycarbonate diol is applied.

As the diisocyanate, one type selected from the group consisting of isophorone diisocyanate, hexamethylene diisocyanate, isocyanatocyclohexylmethane, and diphenylmethane diisocyanate or two or more thereof may be used. Diisocyanate types include aromatics such as 4,4'-diphenylmethane diisocyanate, toluene diisocyanate, 1,5-naphthalene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and hydrozine. There is an aliphatic system such as Tied MDI, and the aromatic system has a disadvantage in that yellowing occurs, but it is generally used because of its excellent reactivity and excellent economic efficiency.

Chain extenders are low molecular weight compounds having at least two active hydrogens that react with isocyanate groups. Chain extenders typically include polyols and polyamines. Examples include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, ethylenediamine, 1,3-diaminopropane, isophoronediamine, 4, 1 type or 2 or more types are used together in 4'- diamino dicyclohexyl methane.

The base film 40 may preferably be selected from polyethylene terephthalate (PET) films or polyethylene naphthalate (PEN) films. In addition, the base film 40 preferably has a thickness of 75 to 175 μm, more preferably 100 μm or 125 μm. In the present invention, the base film 40 may use various plastic sheets and films. As a specific example of the base film 40, the sheet | seat and film of various synthetic resins, such as polyester resins, such as a polyethylene terephthalate resin, a polyethylene naphthalate resin, a polybutylene terephthalate resin, and a polyamide resin, are mentioned, for example. In particular, a sheet or a film made of polyester resin such as polyethylene terephthalate resin is preferable because of its high strength and low cost. The base film 40 may be a single layer, or may be a multilayer of two or more layers of the same kind or different kinds.

2 is a flowchart illustrating a method of manufacturing a sputtering adhesive tape for electronic shielding according to an embodiment of the present invention.

Referring to FIG. 2, in step 210, an acrylic copolymer, an ultraviolet curing acrylic oligomer, a curing agent, a photopolymerization initiator, and a reaction solvent are used to prepare a UV curing adhesive.

Here, at least one or more curing accelerators, dispersants and antioxidants may be further added.

Each component is omitted because it is the same as described in FIG.

In step 220, a polyurethane pressure-sensitive adhesive layer is produced, and the polyurethane pressure-sensitive adhesive layer is coated on the base film to be dried and cured.

The polycarbonate diol, diisocyanate and chain extender for producing the polyurethane adhesive layer are the same as those described in FIG. 1 and are omitted in order to avoid redundant description.

In step 230, a UV curable adhesive is coated on the release liner and dried to cure.

In step 240, a urethane adhesive layer is laminated on the UV cured pressure sensitive adhesive layer.

The thicknesses of the UV-curable pressure-sensitive adhesive layer, the polyurethane pressure-sensitive adhesive layer, the base film, and the release liner are the same as those described with reference to FIG.

After that, it is wound up in a roll state, cut to a certain size, and packed.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific preferred embodiments described above, and the present invention belongs to the present invention without departing from the gist of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such changes are within the scope of the claims.

100: sputtering adhesive tape for electronic shielding
10: release liner
20: UV curing adhesive layer
30: urethane adhesive layer
40: base film

Claims (3)

In the adhesive tape,
A release liner having a thickness of 50 μm;
A UV cured pressure sensitive adhesive layer disposed on a lower surface of the release liner and having a thickness of 100 to 150 μm;
A urethane adhesive layer disposed on a lower surface of the UV curing adhesive layer and having a thickness of 100 μm to 150 μm; And
Is disposed on the lower surface of the urethane adhesive layer, has a 100μm or 125μm thickness and comprises a base film made of a PET material,
The UV curable pressure sensitive adhesive in the UV curable pressure sensitive adhesive layer is prepared by mixing an acrylic copolymer, an ultraviolet curable acrylic oligomer, a curing agent, a photopolymerization initiator, and a reaction solvent,
The acrylic copolymer is at least one of hard butyl acrylate, ethyl acrylate and ethyl hexyl acrylate, and a hard type monomer. It is formed by polymerizing one or more of methyl methacrylate and hydroxyethyl methacrylate (Hydroxyethyl methacrylate),
The ultraviolet curable acrylic oligomer is a dimerization monomer, 2-hydroxyethyl (meth) acrylate (2-Hydroxyethyl methacrylate), 2-hydroxypropyl (meth) acrylate (2-Hydroxypropyl methacrylate), 2-hydroxybutyl (meth) ) Acrylate (2-Hydroxybutyl methacrylate), 4-hydroxybutyl (meth) acrylate (4-Hydroxybutyl methacrylate), acrylic acid, methacrylic acid and isocyanate monomer Is formed using,
The curing agent is an isocyanate curing agent,
The photopolymerization initiator is used at least one of hydroxy alkyl phenone-based, phosphine oxide-based, benzophenol-based photoinitiator,
The reaction solvent may be one or more of ethyl acetate, butyl acetate, toluene, toluene, xylene, acetone, methyl ethyl ketone, methyl butyl ketone, and butyl carbitol acetate. Used,
The urethane adhesive layer is produced by producing a prepolymer using polycarbonate diol and diisocyanate, and then raising the degree of polymerization using a chain extender.
As the diisocyanate, one type selected from the group consisting of isophorone diisocyanate, hexamethylene diisocyanate, isocyanatocyclohexylmethane and diphenylmethane diisocyanate is used, or a combination of two or more thereof,
The chain extender, ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, ethylenediamine, 1,3-diaminopropane, isophoronediamine, It is used in 1 type, or 2 or more types in parallel in 4,4'- diamino dicyclohexyl methane,
The UV curable pressure sensitive adhesive is 40 to 60% by weight of the acrylic copolymer, 10 to 25% by weight of the ultraviolet curable acrylic oligomer, 10 to 20% by weight of the curing agent, and 0.1 to 4% of the photopolymerization initiator, based on the total amount of the UV curable pressure sensitive adhesive. 0.5 wt%, and the reaction solvent contains 10-15 wt%,
The urethane pressure-sensitive adhesive is urethane, characterized in that the polycarbonate diol based on the total amount of the urethane pressure-sensitive adhesive 55 to 61% by weight, the diisocyanate 37 to 43% by weight, and the chain extender contains 1 to 2% by weight Adhesive tape for sputtering for electronic shielding with adhesive layer. The method of claim 1,
The acrylic copolymer is an electronic shield having a urethane adhesive layer, characterized in that the soft type monomer contains 70 to 80% by weight, the hard type monomer 20 to 30% by weight based on the total amount of the acrylic copolymer. Adhesive tape for sputtering. The method of claim 2,
The UV curing adhesive may be prepared by adding at least one or more curing accelerators, dispersants and antioxidants,
The curing accelerator may be used by selecting one or more of dimethylcyclohexylamine, triethylamine, dibutyltin dilaurate, potassium acetate,
The dispersant may be selected from one of anionic polyether, cationic polyether and nonionic polyether,
The antioxidant may be used hindered phenol-based antioxidant (hindered phenol 系),
The curing accelerator is 1.1 to 3% by weight, the dispersant is 1.3 to 1.7% by weight and the antioxidant is 0.01 to 0.7% by weight based on the total amount of the UV-curable pressure-sensitive adhesive to the electronic shield having a urethane adhesive layer Adhesive tape for sputtering.

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