KR20200015126A - Heat conversion device - Google Patents

Abstract

Disclosed is a thermal conversion apparatus using waste heat to produce electricity. According to one embodiment of the present invention, the thermal conversion apparatus comprises: a plurality of unit modules arranged in a first direction and a second direction crossing the first direction; a frame supporting the plurality of unit modules and including first coolant inlet and outlet pipes arranged in the first direction; a plurality of second coolant inlet pipes connected to the first coolant inlet pipe and arranged on one side of the plurality of unit modules in the second direction; and a plurality of second coolant outlet pipes connected to the first coolant outlet pipe and arranged on the other side of the plurality of unit modules in the second direction. Each unit module comprises: a coolant passing chamber; a first thermoelectric module disposed on a first surface of the coolant passing chamber; and a second thermoelectric module disposed on a second surface of the coolant passing chamber. The coolant passing chamber comprises: a third surface disposed between the first and second surfaces; a fourth surface disposed between the first and second surfaces and disposed on the third surface in a third direction; a fifth surface disposed between the third and fourth surfaces and having a coolant inlet disposed thereon; and a sixth surface disposed between the third and fourth surfaces and having a coolant outlet disposed thereon. The first thermoelectric module includes a plurality of group thermoelectric elements, each group thermoelectric element includes a plurality of thermoelectric elements with an equal minimum separation distance from the fourth surface in the third direction, the plurality of thermoelectric elements are electrically interconnected in at least one group thermoelectric element among the plurality of group thermoelectric elements, and the third direction crosses the first and second directions.

Description

Heat Converter {HEAT CONVERSION DEVICE}

Embodiments relate to a heat conversion device, and more particularly, to a heat conversion device for generating power using heat from a hot gas.

Thermoelectric phenomenon is a phenomenon caused by the movement of electrons and holes in a material, and means a direct energy conversion between heat and electricity.

A thermoelectric device is a generic term for a device using a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

Thermoelectric elements may be classified into a device using a temperature change of the electrical resistance, a device using the Seebeck effect, a phenomenon in which electromotive force is generated by a temperature difference, and a device using a Peltier effect, a phenomenon in which endothermic or heat generation by current occurs. .

Thermoelectric devices have been applied to a variety of home appliances, electronic components, communication components and the like. For example, the thermoelectric element may be applied to a cooling device, a heating device, a power generating device, or the like. Accordingly, the demand for thermoelectric performance of thermoelectric elements is increasing.

Recently, there is a need to generate electricity by using waste heat and thermoelectric elements generated from engines such as automobiles and ships. At this time, a structure for increasing power generation performance is required.

As such, in the case of a power generation apparatus using waste heat, improvement in assemblability and replacement of some modules are required, and a structure for supporting a region through which cooling water passes due to the weight of the cooling water is also required.

The embodiment provides a heat conversion apparatus that generates power using waste heat.

It also provides a thermoconversion device that changes the electrical connection of the thermoelectric legs in accordance with the temperature difference.

In addition, a thermal converter having an improved temperature gradient is provided.

The problem to be solved in the examples is not limited thereto, and the object or effect that can be grasped from the solution means and the embodiment described below will also be included.

In one embodiment, a heat conversion device includes a plurality of unit modules arranged in a first direction and a second direction crossing the first direction; A frame supporting the plurality of unit modules and including a first coolant inlet pipe and a first coolant discharge pipe disposed along the first direction; A plurality of second coolant inlet pipes connected to the first coolant inlet pipe and disposed along the second direction at one side of the plurality of unit modules; And a plurality of second coolant discharge pipes connected to the first coolant discharge pipes and disposed along the second direction on the other side of the plurality of unit modules, wherein each unit module comprises: a coolant passage chamber; A first thermoelectric module disposed on a first surface of the cooling water passage chamber; And a second thermoelectric module disposed on a second surface of the cooling water passage chamber, wherein the cooling water passage chamber includes: a third surface disposed between the first surface and the second surface; A fourth surface disposed between the first surface and the second surface and disposed in a third direction from the third surface; A fifth surface disposed between the third surface and the fourth surface and having a cooling water inlet disposed therein; And a sixth surface disposed between the third surface and the fourth surface and having a cooling water outlet, wherein the first thermoelectric module includes a plurality of group thermoelectric elements, and each group thermoelectric element includes the fourth surface. And a plurality of thermoelectric elements having the same minimum distance from the surface in the third direction, wherein the plurality of thermoelectric elements are electrically connected to each other in at least one group thermoelectric element of the plurality of group thermoelectric elements. It is a direction crossing with a 1st direction and a said 2nd direction.

The plurality of group thermoelectric element,

A first group thermoelectric element; And a second group thermoelectric element disposed to be spaced apart from the first group thermoelectric element, wherein a minimum separation distance in the third direction from the fourth surface of the first group thermoelectric element is the first group thermoelectric element. It may be larger than the minimum separation distance in the third direction from four sides.

Each thermoelectric element includes a first substrate; A plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed alternately on the first substrate; A second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; A first electrode connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series and disposed on a first substrate; And a second electrode connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series and disposed on a second substrate.

The first electrode includes a plurality of group sub electrodes, each group sub electrode includes a plurality of sub electrodes having the same minimum separation distance from the fourth surface in a third direction, and at least one of the plurality of group sub electrodes. In the group sub-electrodes of the plurality of sub-electrodes may be electrically connected to each other.

In the at least one group thermoelectric element of the plurality of group thermoelectric elements, a plurality of thermoelectric elements may be connected in series, and in the at least one group sub electrode of the plurality of group sub electrodes, the plurality of sub electrodes may be connected in series.

The plurality of group sub electrodes,

A first-first electrode; And first and second electrodes spaced apart from each other, wherein the minimum separation distance of the first-first electrode may be greater than the minimum separation distance of the first and second electrodes.

The plurality of group thermoelectric element,

The maximum temperature difference in each group thermoelectric element is greater than the minimum temperature difference between adjacent group thermoelectric elements, and the maximum temperature difference is a difference between the highest temperature difference and the lowest temperature difference between the heat generating portion and the heat absorbing portion in each group thermoelectric element, and the minimum temperature difference is the adjacent temperature difference between the adjacent thermoelectric elements. It may be a minimum deviation of the temperature difference between the heat generating portion and the heat absorbing portion between the group thermoelectric elements.

The frame includes a support wall disposed between the first unit module group and the second unit module group, and the support wall has a hole formed to correspond to the position of the coolant inlet and the position of the coolant outlet. The cooling water outlet of one of the plurality of unit modules included in the first unit module group may be connected to the cooling water inlet of one of the plurality of unit modules included in the second unit module group through the hole.

The plurality of unit module groups,

And a first unit module group and a second unit module group spaced apart at predetermined intervals along the first direction, wherein gas passes through the predetermined interval, and the temperature of the gas is greater than the temperature of the cooling water of the cooling water passage chamber. Can be high.

The specific heat of the gas may be greater than the specific heat of the cooling water.

The gas flows along a third direction crossing the first direction and the second direction,

A coolant passage tube is formed in the coolant passage chamber to be connected to the coolant outlet through the coolant inlet, and the coolant may flow along the second direction through the coolant passage tube.

According to the embodiment, it is possible to implement a heat conversion apparatus for generating power using waste heat.

In addition, it is possible to fabricate a thermoconversion device having an improved temperature gradient for changing the electrical connection of the thermoelectric legs according to the temperature difference.

In addition, it is possible to manufacture a heat conversion device having an improved temperature gradient.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and will be more readily understood in the course of describing specific embodiments of the present invention.

1 is a perspective view of a thermal conversion apparatus according to an embodiment of the present invention,
2 is a partially enlarged view of a heat conversion apparatus according to an embodiment of the present invention;
3 is a perspective view of a unit module included in a heat conversion apparatus according to an embodiment of the present invention,
4 is an exploded view of the unit module of FIG. 3,
5 is a cross-sectional view of a heat conversion device according to an embodiment of the present invention,
6 is a cross-sectional view of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention.
7 is a perspective view of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention;
8 is a view for explaining the operation of the hot gas and cooling water flowing in the heat conversion apparatus according to an embodiment of the present invention,
9 is a cross-sectional view of a thermal conversion apparatus according to an embodiment of the present invention,
10 is a view showing a first thermoelectric module and a first thermoelectric element in a thermoelectric converter according to an embodiment of the present invention,
11 is a view illustrating a first thermoelectric module and a first thermoelectric device in a thermoelectric conversion apparatus according to another exemplary embodiment of the present invention.
12 is a view showing a first thermoelectric module and a first thermoelectric device in a thermoelectric conversion apparatus according to another embodiment of the present invention.
13 is a modification of FIG. 10,
14 and 15 are views illustrating effects of the first thermoelectric module according to an embodiment.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some embodiments described, but may be embodied in different forms, and within the technical idea of the present invention, one or more of the components may be selectively selected between the embodiments. Can be combined and substituted.

In addition, the terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those skilled in the art to which the present invention pertains, unless specifically defined and described. The terms commonly used, such as terms defined in advance, may be interpreted as meanings in consideration of the contextual meaning of the related art.

In addition, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

As used herein, the singular forms may also include the plural unless specifically stated otherwise, and may be combined as A, B, C when described as "at least one (or more than one) of A and B, C". It can include one or more of all possible combinations.

In addition, in describing the components of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only to distinguish the components from other components, and the terms are not limited to the nature, order, order, or the like of the components.

And when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only connected, coupled or connected directly to the other component, It may also include the case of 'connected', 'coupled' or 'connected' due to another component between the other components.

In addition, when described as being formed or disposed on the "top" or "bottom" of each component, the top (bottom) or the bottom (bottom) is not only when two components are in direct contact with each other, but also one. It also includes a case where the above-described further components are formed or disposed between two components. In addition, when expressed as "up (up) or down (down)" may include the meaning of the down direction as well as the up direction based on one component.

1 is a perspective view of a heat conversion apparatus according to an embodiment of the present invention, FIG. 2 is a partially enlarged view of a heat conversion apparatus according to an embodiment of the present invention, and FIG. 3 is heat according to an embodiment of the present invention. 4 is a perspective view of a unit module included in the converter, FIG. 4 is an exploded view of the unit module of FIG. 3, and FIG. 6 is a cross-sectional view of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention, and FIG. 7 is a perspective view of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention.

1 to 5, the thermal conversion apparatus 10 includes a plurality of unit module groups and a frame 2000 supporting a plurality of unit module groups. Here, each unit module group includes a plurality of unit modules 1000.

Here, the plurality of unit modules 1000 may be arranged in plural in the first direction and the second direction, respectively, and the second direction may be a direction crossing the first direction, for example, a direction perpendicular to the first direction. Can be. In the present specification, the plurality of unit modules 1000 arranged in the first direction may be described as forming one unit module group. Accordingly, the plurality of unit module groups may be arranged along the second direction. Here, the plurality of unit modules 1000 included in one unit module group may be spaced apart from each other at predetermined intervals. In the present specification, for convenience of description, the thermal conversion apparatus 10 includes five unit module groups arranged along the second direction, that is, the first unit module group 1000 -A and the second unit module group 1000-. B), the third unit module group 1000 -C, the fourth unit module group 1000-D, and the fifth unit module group 1000-E are described as an example, but are not limited thereto.

The frame 2000 may be a frame or a border that is arranged to surround the outside of the plurality of unit modules 1000. In this case, the frame 2000 has a coolant inlet pipe (not shown) for injecting coolant into the plurality of unit modules 1000 and a coolant discharge pipe for discharging the coolant passing through the inside of the plurality of unit modules 1000 (not shown). May be formed. One of the coolant inlet pipe and the coolant discharge pipe is formed at an edge disposed at the side of the unit module group, for example, the first unit module group 1000-A, disposed at one edge of the plurality of unit module groups, and the other The unit module group disposed on the other edge of the plurality of unit module groups, for example, may be formed on the edge disposed on the side of the fifth unit module group 1000 -E.

In particular, referring to FIGS. 3 to 4, each unit module 1000 includes a coolant passage chamber 1100, a first thermoelectric module 1200 and a coolant passage chamber disposed on one surface 1101 of the coolant passage chamber 1100. The second thermoelectric module 1300 is disposed on the other surface 1102 of the 1100. Here, one side 1101 and the other side 1102 of the coolant passage chamber 1100 may be both sides disposed to be spaced apart from each other at a predetermined interval along the first direction, in this specification one of the coolant passage chamber 1100 The side 1101 and the other side 1102 may be mixed with the first side and the second side of the coolant passage chamber 1100.

The low temperature part of the first thermoelectric module 1200, that is, the heat radiating part, is disposed on the outer surface of the first surface 1101 of the cooling water passage chamber 1100, and the high temperature part of the first thermoelectric module 1200, that is, the heat absorbing part, is adjacent to another unit. It may be disposed to face the second thermoelectric module 1300 of the module 1000. Similarly, the low temperature portion of the second thermoelectric module 1300, that is, the heat dissipation portion, is disposed on the outer surface of the second surface 1102 of the cooling water passage chamber 1100, and the high temperature portion of the second thermoelectric module 1300, that is, the heat absorbing portion, is adjacent thereto. May be disposed to face the first thermoelectric module 1200 of the other unit module 1000.

In the heat conversion apparatus 10 according to an exemplary embodiment of the present invention, a temperature difference between a coolant flowing through a coolant passage chamber 1100 and a high temperature gas passing through a space spaced between the plurality of unit modules 1000, that is, the first Power may be produced using a temperature difference between the heat absorbing part and the heat generating part of the thermoelectric module 1200 and a temperature difference between the heat absorbing part and the heat radiating part of the second thermoelectric module 1300. Here, the cooling water may be water, but is not limited thereto, and may be various kinds of fluids having cooling performance. The temperature of the coolant flowing into the coolant passage chamber 1100 may be less than 100 ° C, preferably less than 50 ° C, more preferably less than 40 ° C, but is not limited thereto. The temperature of the cooling water discharged after passing through the cooling water passage chamber 1100 may be higher than the temperature of the cooling water flowing into the cooling water passage chamber 1100. The temperature of the hot gas passing through the spaced space between the plurality of unit modules 1000 may be higher than the temperature of the cooling water. For example, the temperature of the hot gas passing through the spaced space between the plurality of unit modules 1000 may be 100 ° C. or higher, preferably 150 ° C. or higher, more preferably 200 ° C. or higher, but is not limited thereto. . In this case, the width of the spaced space between the plurality of unit modules 1000 may be a few mm to several tens of mm, and may vary depending on the size of the heat conversion device, the temperature of the incoming gas, the inflow rate of the gas, the required power generation amount, and the like. .

The first thermoelectric module 1200 and the second thermoelectric module 1300 may each include a plurality of thermoelectric elements 100. The number of thermoelectric elements included in each thermoelectric module may be adjusted according to the amount of power required.

The plurality of thermoelectric elements 100 included in each thermoelectric module may be electrically connected, and at least some of the plurality of thermoelectric elements 100 may be electrically connected using a bus bar (not shown). For example, the bus bar may be disposed at an outlet side through which hot gas passes through spaced spaces between the plurality of unit modules 1000, and may be connected to an external terminal. Accordingly, power is supplied to the first thermoelectric module 1200 and the second thermoelectric module 1300 without the PCB for the first thermoelectric module 1200 and the second thermoelectric module 1300 being disposed inside the thermoelectric device. Therefore, it is easy to design and assemble the heat conversion device.

Each thermoelectric module may include a plurality of group thermoelectric elements according to distances spaced in a third direction from the third surface 1103 or the fourth surface 1104. For example, the first thermoelectric module 1200 may include a plurality of group thermoelectric elements having the same minimum distance (hereinafter, referred to as a minimum separation distance) spaced apart from the fourth surface 1104 in a third direction. The first group thermoelectric element HA1 to the fourth group thermoelectric element HA4 may be included. Here, the first group thermoelectric element HA1 is disposed closest to the fourth surface 1104 of the group thermoelectric elements of the first thermoelectric module 1200, and the fourth group thermoelectric element HA4 is the first thermoelectric module ( The thermoelectric element of 1200 may be disposed closest to the third surface 1103. This will be described below with reference to this.

Each unit module 1000 may further include a heat insulating layer 1400 and a shield layer 1500 disposed between the plurality of thermoelectric elements 100. The heat insulation layer 1400 may be disposed to surround at least a portion of the outer surface of the coolant passage chamber 1100 except for a region where the thermoelectric element 100 is disposed among the outer surfaces of the coolant passage chamber 1100. In particular, the heat insulation layer 1400 is disposed between the thermoelectric elements 100 on the first and second surfaces 1101 and 212 of the outer surface of the cooling water passage chamber 1100. In this case, since the heat insulation between the low temperature side and the high temperature side of the thermoelectric element 100 may be maintained due to the heat insulation layer 1400, power generation efficiency may be improved.

In addition, the shield layer 1500 may be disposed on the heat insulation layer 1400, and may protect the heat insulation layer 1400 and the plurality of thermoelectric elements 100. To this end, the shield layer 1500 may include a stainless material.

The shield layer 1500 and the coolant passage chamber 1100 may be fastened by a screw. Accordingly, the shield layer 1500 may be stably coupled to the unit module 1000, and the first thermoelectric module 1200 or the second thermoelectric module 1300 and the heat insulation layer 1400 may also be fixed together.

In this case, each of the first thermoelectric module 1200 and the second thermoelectric module 1300 uses a thermal pad 1600 on the first surface 1101 and the second surface 1102 of the cooling water passage chamber 1100. May be adhered to. Since the thermal pad 1600 is easy to heat transfer, heat transfer between the cooling water passage chamber 1100 and the thermoelectric module may not be disturbed. In addition, each of the first thermoelectric module 1200 and the second thermoelectric module 1300 may include a heat sink 200 disposed on the high temperature side of the thermoelectric element 100 and a metal plate disposed on the low temperature side of the thermoelectric element 100. 300), for example, may further comprise an aluminum plate. At this time, the heat sink 200 is disposed toward another adjacent unit module. The heat sink 200 included in the first thermoelectric module 1200 is disposed toward the second thermoelectric module 1300 of another unit module 1000-1 (see FIG. 2) adjacent to the second thermoelectric module 1300. The heat sink 200 included in may be disposed toward the first thermoelectric module 1200 of another adjacent unit module 1000-2 (see FIG. 2). In this case, the heat sinks 200 of adjacent unit modules 1000 may be spaced at predetermined intervals. Accordingly, the temperature of the air passing between the plurality of unit modules 1000 can be efficiently transmitted to the high temperature side of the thermoelectric element 100 through the heat sink 200. On the other hand, since the metal plate 300, for example, the aluminum plate has high heat transfer efficiency, the temperature of the coolant passing through the coolant passage chamber 1100 is effective on the low temperature side of the thermoelectric element 100 through the metal plate 300. Can be delivered. As shown, a plurality of thermoelectric elements 100 may be disposed on one metal plate 300, but is not limited thereto. One thermoelectric element 100 may be disposed on one metal plate 300. It may be.

6 to 7, each thermoelectric element 100 is disposed on the first substrate 110, the plurality of first electrodes 120 and the plurality of first electrodes 120 disposed on the first substrate 110. A plurality of P-type thermoelectric legs 130 and a plurality of N-type thermoelectric legs 140, a plurality of P-type thermoelectric legs 130, and a plurality of second N-type thermoelectric legs 140 disposed on the An electrode 150 and a second substrate 160 disposed on the plurality of second electrodes 150 are included.

In this case, the first electrode 120 is disposed between the first substrate 110, the bottom surface of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second electrode 150 is the second substrate. And an upper bottom surface of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 may be electrically connected by the first electrode 120 and the second electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the first electrode 120 and the second electrode 150 and electrically connected to each other may form a unit cell.

Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be a bismuth fluoride (Bi-Te) -based thermoelectric leg including bismuth (Bi) and tellurium (Ti) as a main raw material. P-type thermoelectric leg 130 is antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium relative to the total weight 100wt% A mixture containing 99 to 99.999 wt% of bismustelulide (Bi-Te) -based main raw material including at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In), and 0.001 or more. It may be a thermoelectric leg including to 1wt%. For example, the main raw material is Bi-Se-Te, and may further include Bi or Te as 0.001 to 1wt% of the total weight. The N-type thermoelectric leg 140 has selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium based on the total weight of 100 wt%. A mixture containing 99 to 99.999 wt% of bismustelulide (Bi-Te) -based main raw material including at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In), and 0.001 or more. It may be a thermoelectric leg including to 1wt%. For example, the main raw material is Bi-Sb-Te, and may further comprise Bi or Te as 0.001 to 1wt% of the total weight.

The P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be formed in a bulk type or a stacked type. In general, the bulk P-type thermoelectric leg 130 or the bulk N-type thermoelectric leg 140 is heat-treated thermoelectric material to produce an ingot (ingot), pulverizing and sieving the ingot to obtain a powder for thermoelectric legs, then Sintering, and can be obtained through the process of cutting the sintered body. The stacked P-type thermoelectric leg 130 or the stacked N-type thermoelectric leg 140 is formed by applying a paste including a thermoelectric material on a sheet-shaped substrate to form a unit member, and then stacking and cutting the unit members. Can be obtained.

In this case, the pair of P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may have the same shape and volume, or may have different shapes and volumes. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different, the height or the cross-sectional area of the N-type thermoelectric leg 140 is the height or the cross-sectional area of the P-type thermoelectric leg 130. It can also be formed differently.

The performance of the thermoelectric device according to the exemplary embodiment of the present invention may be represented by Seebeck index. The Seebeck index ZT may be expressed as in Equation 1.

Where α is the Seebeck coefficient [V / K], sigma is the electrical conductivity [S / m], and α ² sigma is the Power Factor [W / mK ² ]. And T is the temperature and k is the thermal conductivity [W / mK]. k can be represented by a · c _p · ρ, a is thermal diffusivity [cm ² / S], c _p is specific heat [J / gK], and ρ is density [g / cm ³ ].

In order to obtain the Seebeck index of the thermoelectric element, the Z value (V / K) may be measured using a Z meter, and the Seebeck index (ZT) may be calculated using the measured Z value.

According to another exemplary embodiment of the present invention, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may have a structure shown in FIG. 6 (b). Referring to FIG. 6B, the thermoelectric legs 130 and 140 may be stacked on one surface of the thermoelectric material layers 132 and 142 and the thermoelectric material layers 132 and 142. -1), second plating layers 134-2 and 144-2 stacked on one surface of the thermoelectric material layers 132 and 142 opposite to each other, and thermoelectric material layers 132 and 142 and the first plating layer. First bonding layers 136-1 and 146-1 disposed between the 134-1 and 144-1 and between the thermoelectric material layers 132 and 142 and the second plating layers 134-2 and 144-2, respectively. And a first metal layer laminated on the second bonding layers 136-2 and 146-2, and the first plating layers 134-1 and 144-1 and the second plating layers 134-2 and 144-2, respectively. 138-1 and 148-1 and second metal layers 138-2 and 148-2.

In this case, the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 directly contact each other, and the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146- 2) can be in direct contact with each other. The first bonding layers 136-1 and 146-1 and the first plating layers 134-1 and 144-1 are in direct contact with each other, and the second bonding layers 136-2 and 146-2 and the second are in direct contact with each other. The plating layers 134-2 and 144-2 may directly contact each other. In addition, the first plating layers 134-1 and 144-1 and the first metal layers 138-1 and 148-1 directly contact each other, and the second plating layers 134-2 and 144-2 and the second metal layer ( 138-2 and 148-2 may be in direct contact with each other.

The thermoelectric material layers 132 and 142 may include bismuth (Bi) and tellurium (Te), which are semiconductor materials. The thermoelectric material layers 132 and 142 may have the same material or shape as the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 described with reference to FIG. 6A.

In addition, the first metal layers 138-1 and 148-1 and the second metal layers 138-2 and 148-2 may be selected from copper (Cu), a copper alloy, aluminum (Al), and an aluminum alloy. To 0.5 mm, preferably 0.2 to 0.3 mm. The thermal expansion coefficients of the first metal layers 138-1 and 148-1 and the second metal layers 138-2 and 148-2 are similar to or larger than those of the thermoelectric material layers 132 and 142. Since compressive stress is applied at the interface between the first metal layers 138-1 and 148-1 and the second metal layers 138-2 and 148-2 and the thermoelectric material layers 132 and 142, cracking or peeling can be prevented. Can be. In addition, since the bonding force between the first metal layers 138-1 and 148-1 and the second metal layers 138-2 and 148-2 and the electrodes 120 and 150 is high, the thermoelectric legs 130 and 140 are formed of an electrode ( 120, 150) can be combined stably.

Next, the first plating layers 134-1, 144-1, and the second plating layers 134-2, 144-2 may include at least one of Ni, Sn, Ti, Fe, Sb, Cr, and Mo, respectively. It may have a thickness of 1 to 20㎛, preferably 1 to 10㎛. The first plating layers 134-1 and 144-1 and the second plating layers 134-2 and 144-2 are Bi or Te, which are semiconductor materials in the thermoelectric material layers 132 and 142, and the first metal layer 138-1, Since the reaction between the 148-1) and the second metal layers 138-2 and 148-2 is prevented, not only the performance degradation of the thermoelectric element can be prevented, but also the first metal layers 138-1 and 148-1 and the first metal layers 138-1 and 148-2 are prevented. Oxidation of the two metal layers 138-2 and 148-2 can be prevented.

In this case, a first is formed between the thermoelectric material layers 132 and 142 and the first plating layers 134-1 and 144-1, and between the thermoelectric material layers 132 and 142 and the second plating layers 134-2 and 144-2. The bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 may be disposed. In this case, the first bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 may include Te. For example, the first bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 are Ni-Te, Sn-Te, Ti-Te, Fe-Te, and Sb-. It may include at least one of Te, Cr-Te and Mo-Te. According to an embodiment of the present invention, each of the first bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 has a thickness of 0.5 to 100 μm, preferably 1 to 50. May be μm. According to an embodiment of the present invention, a first electrode including Te is provided between the thermoelectric material layers 132 and 142, the first plating layers 134-1 and 144-1, and the second plating layers 134-2 and 144-2. The bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 are disposed in advance so that the Te in the thermoelectric material layers 132 and 142 is the first plating layer 134-1 and 144. -1) and diffusion into the second plating layers 134-2 and 144-2 can be prevented. Accordingly, the occurrence of the Bi rich region can be prevented.

Accordingly, the Te content is higher than the Bi content from the center of the thermoelectric material layers 132 and 142 to the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1, and the thermoelectric material layer The Te content is higher than the Bi content from the center of the 132 and 142 to the interface between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. Te content from the center of the thermoelectric material layers 132 and 142 to the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the center of the thermoelectric material layers 132 and 142. The amount of Te from the interface between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2 may be 0.8 to 1 times that of the Te content at the center of the thermoelectric material layers 132 and 142. . For example, the Te content in the thickness of 100 μm in the direction of the center of the thermoelectric material layers 132 and 142 from the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 is measured. It may be 0.8 to 1 times the Te content of the central portion of the material layer (132, 142). Here, the Te content is kept constant within a thickness of 100 μm in the direction of the center of the thermoelectric material layers 132 and 142 from the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1. For example, the thickness of the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 in the direction of the center of the thermoelectric material layers 132 and 142 may be within 100 μm. The rate of change of the Te weight ratio may be 0.9 to 1.

In addition, the content of Te in the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2 is the same as or similar to the content of Te in the thermoelectric material layers 132 and 142. can do. For example, the content of Te in the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2 is 0.8 of the content of Te in the thermoelectric material layers 132 and 142. To 1 times, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, more preferably 0.95 to 1 times. Here, the content may be a weight ratio. For example, when the content of Te in the thermoelectric material layers 132 and 142 is 50 wt%, the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2. The content of Te in the) may be 40 to 50wt%, preferably 42.5 to 50wt%, more preferably 45 to 50wt%, more preferably 47.5 to 50wt%. In addition, the content of Te in the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2 may be greater than that of Ni. The content of Te is uniformly distributed in the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2, while the Ni content is the first bonding layer 136-1. , 146-1) or in the second bonding layers 136-2 and 146-2, the closer to the direction of the thermoelectric material layers 132 and 142.

The interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. From the interface, the interface between the first plating layer 136-1, 146-1 and the first bonding layer 136-1, 146-1 or the second plating layer 134-2, 144-2 and the second bonding layer 136 Te content up to the interface between -2, 146-2) may be uniformly distributed. For example, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. ) Interface between the first plating layer 136-1, 146-1 and the first bonding layer 136-1, 146-1 or the second plating layer 134-2, 144-2 and the second bonding layer The rate of change of the Te weight ratio to the interface between 136-2 and 146-2 may be 0.8 to 1. Here, as the change ratio of the Te weight ratio is closer to 1, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the thermoelectric material layers 132 and 142 and the second bonding layer ( The interface between the first plating layers 136-1 and 146-1 and the first bonding layers 136-1 and 146-1 or the second plating layers 134-2 and 144- from the interface between the 136-2 and 146-2. This may mean that the Te content up to the interface between 2) and the second bonding layers 136-2 and 146-2 is uniformly distributed.

The surfaces of the first bonding layers 136-1 and 146-1 that contact the first plating layers 134-1 and 144-1, that is, the first plating layers 136-1 and 146-1 and the first bonding layer. Interface between (136-1, 146-1) or the surface contacting the second plating layer 134-2, 144-2 in the second bonding layer 136-2, 146-2, that is, the second plating layer 134-2 , 144-2 and the content of Te at the interface between the second bonding layers 136-2 and 146-2 and the first bonding layers 136-1 and 146-1 in the thermoelectric material layers 132 and 142. The contact surface, that is, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the second bonding layers 136-2 and 146-2 in the thermoelectric material layers 132 and 142. ), That is, 0.8 to 1 times the amount of Te at the interface between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2, preferably 0.85 to 1 times. Preferably it may be 0.9 to 1 times, more preferably 0.95 to 1 times. Here, the content may be a weight ratio.

In addition, the Te content in the center portion of the thermoelectric material layers 132 and 142 may correspond to the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 and the thermoelectric material layers 132 and 142. It can be seen that the same or similar to the Te content of the interface between the second bonding layer (136-2, 146-2). That is, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. The Te content at the interface may be 0.8 to 1 times, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, more preferably 0.95 to 1 times the Te content of the center portion of the thermoelectric material layers 132 and 142. have. Here, the content may be a weight ratio. Here, the center of the thermoelectric material layers 132 and 142 may refer to a peripheral area including the center of the thermoelectric material layers 132 and 142. The boundary surface may mean the boundary surface itself, or may include a boundary region adjacent to the boundary surface within a predetermined distance from the boundary surface.

In addition, the content of Te in the first plating layers 136-1 and 146-1 or the second plating layers 134-2 and 144-2 is the content of Te in the thermoelectric material layers 132 and 142 and the first bonding layer ( 136-1, 146-1) or lower content of Te in the second bonding layer 136-2, 146-2.

In addition, the Bi content in the center portion of the thermoelectric material layers 132 and 142 may correspond to the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 and the thermoelectric material layers 132 and 142. It can be seen that the Bi content of the interface between the second bonding layer (136-2, 146-2) or the same or similar. Accordingly, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 from the center of the thermoelectric material layers 132 and 142 or the second thermoelectric material layers 132 and 142 and the second layer. Since the content of Te is higher than the content of Bi up to the interface between the bonding layers 136-2 and 146-2, the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1. There is no section in which the Bi content reverses the Te content around the interface between the interface or the interface between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. For example, the Bi content at the center of the thermoelectric material layers 132 and 142 may be an interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the thermoelectric material layers 132 and 142. ) And 0.8 to 1 times, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, more preferably 0.95 to 1 of the Bi content of the interface between the second bonding layer (136-2, 146-2) It may be a boat. Here, the content may be a weight ratio.

Meanwhile, the first electrode 120 disposed between the first substrate 110, the P-type thermoelectric leg 130, and the N-type thermoelectric leg 140, and the second substrate 160 and the P-type thermoelectric leg 130. And the second electrode 150 disposed between the N-type thermoelectric legs 140 may include at least one of copper (Cu), silver (Ag), and nickel (Ni), and may have a thickness of 0.01 mm to 0.3 mm. have. If the thickness of the first electrode 120 or the second electrode 150 is less than 0.01mm, the function of the electrode is reduced, the electrical conduction performance may be lowered, if the thickness exceeds 0.3mm, the conduction efficiency is lowered due to the increase in resistance Can be.

In addition, the first substrate 110 and the second substrate 160 that face each other may be an insulating substrate or a metal substrate. The insulating substrate may be an alumina substrate or a polymer resin substrate. The polymer resin substrate is made of various insulating resin materials such as polyimide (PI), polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), and high permeability plastic such as polyethylene terephthalate (PET). It may include.

Alternatively, the polymer resin substrate may be a heat conductive substrate made of a resin composition containing an epoxy resin and an inorganic filler. The thickness of the thermally conductive substrate may be 0.01 to 0.65 mm, preferably 0.01 to 0.6 mm, more preferably 0.01 to 0.55 mm, and thermal conductivity is 10 W / mK or more, preferably 20 W / mK or more, more preferably It may be 30 W / mK or more.

For this purpose, the epoxy resin may comprise an epoxy compound and a curing agent. At this time, it may be included in 1 to 10 volume ratio of the curing agent with respect to 10 volume ratio of the epoxy compound. Here, the epoxy compound may include at least one of a crystalline epoxy compound, an amorphous epoxy compound and a silicon epoxy compound. The crystalline epoxy compound may comprise a mesogen structure. Mesogen is the liquid crystal It is a basic unit and includes a rigid structure. The amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in a molecule, and may be, for example, glycidyl etherate derived from bisphenol A or bisphenol F. Herein, the curing agent may include at least one of an amine curing agent, a phenol curing agent, an acid anhydride curing agent, a polycapcaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a block isocyanate curing agent, and two or more kinds of curing agents. It can also be mixed and used.

The inorganic filler may include at least one of aluminum oxide, boron nitride, and aluminum nitride. In this case, the boron nitride may include a boron nitride aggregate in which a plurality of plate-like boron nitride is aggregated. Here, the surface of the boron nitride agglomerate may be coated with a polymer having unit 1 below, or at least a portion of the pores in the boron nitride agglomerate may be filled with a polymer having unit 1 below.

Unit 1 is as follows.

[Unit 1]

Wherein one of R ¹ , R ² , R ³ and R ⁴ is H, the other is selected from the group consisting of C ₁ -C ₃ alkyl, C ₂ -C ₃ alkenes and C ₂ -C ₃ alkyne, R ⁵ May be a linear, branched or cyclic divalent organic linker having 1 to 12 carbon atoms.

In one embodiment, one of R ¹ , R ² , R ³ and R ⁴ except H is selected from C ₂ to C ₃ alkenes, and the other and the other of C ₁ to C ₃ alkyl Can be selected. For example, the polymer according to the embodiment of the present invention may include the following unit 2.

[Unit 2]

Alternatively, the rest of R ¹ , R ² , R ^3, and R ⁴ except H may be selected to be different from each other in a group consisting of C ₁ -C ₃ alkyl, C ₂ -C ₃ alkenes, and C ₂ -C ₃ alkyne. have.

As such, when the polymer according to Unit 1 or Unit 2 is coated on the plated boron nitride agglomerates and fills at least a part of the pores in the boron nitride agglomerates, the air layer in the boron nitride agglomerates is minimized to form the boron nitride agglomerates. The heat conduction performance can be improved, and the bonding force between the plate-like boron nitride can be increased to prevent the breakage of the boron nitride agglomerates. When the coating layer is formed on the plated boron nitride agglomerates, the functional groups are easily formed, and when the functional groups are formed on the coating layer of the boron nitride agglomerates, the affinity with the resin may be increased.

When the first substrate 110 and the second substrate 160 are polymer resin substrates, the first substrate 110 and the second substrate 160 may have a thinner thickness, higher heat dissipation performance, and insulation performance than the metal substrate. In addition, when the electrode is placed on the semi-cured polymer resin layer coated on the heat sink 200 or the metal plate 300 and then thermally compressed, a separate adhesive layer may not be required.

In this case, the size of the first substrate 110 and the second substrate 160 may be formed differently. For example, the volume, thickness, or area of one of the first substrate 110 and the second substrate 160 may be greater than the volume, thickness, or area of the other. Accordingly, the heat absorbing performance or heat dissipation performance of the thermoelectric element can be improved.

In addition, a heat radiation pattern, for example, an uneven pattern may be formed on at least one surface of the first substrate 110 and the second substrate 160. As a result, the heat dissipation performance of the thermoelectric element can be improved. When the uneven pattern is formed on the surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate can also be improved.

Meanwhile, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a cylindrical shape, a polygonal pillar shape, an elliptical pillar shape, or the like.

According to an embodiment of the present invention, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be formed to have a wide width of the portion to be bonded to the electrode.

Referring back to FIGS. 1 to 5, according to an embodiment of the present invention, each unit module 1000 may include a third surface between the first surface 1101 and the second surface 1102 of the coolant passage chamber 1100. The first support frame 1700 disposed on the side of 1103 and the second support disposed on the side of the fourth side 1104 between the first side 1101 and the second side 1102 of the coolant passage chamber 1100. It may further include a frame 1800. Here, the third surface 1103 may be a surface facing downward in the third direction, and the fourth surface 1104 may be a surface facing the third surface 1103 and may face upward in the third direction.

The shape of at least one of the first support frame 1700 and the second support frame 1800 may be an H shape, for example, an H beam. The number of each of the first support frame 1700 and the second support frame 1800 included in the heat conversion apparatus 10 may be equal to the total number of unit modules 1000 included in the heat conversion apparatus 10. . As shown in FIGS. 3 to 4, the first support frame 1700 and the second support frame 1800 disposed on the same unit module side may be referred to as a pair of support frames. When the first support frame 1700 and the second support frame 1800 are disposed on the third surface 1103 side and the fourth surface 1104 side of the coolant passage chamber 1100, respectively, the rigidity of the unit module can be maintained. And, it can prevent the problem of bending or deformation during vibration.

To this end, the frame 2000 may further include a support wall 2300 disposed between the first unit module group 1000 -A and the second unit module group 1000 -B, and the first support frame ( 1700 and the second support frame 1800 may be fastened to the support wall 2300. In this case, the support wall 2300 may be fastened to the frame or the edge of the frame 2000 or integrally molded.

More specifically, the supporting wall 2300 is disposed between the first unit module group 1000 -A and the second unit module group 1000 -B, and each of the first unit module group 1000 -A is disposed. Each of the first support frame 1700 and the second support frame 1800 disposed in the unit module 1000 may be disposed under and above the support wall 2300 in the direction in which the second unit module group 1000 -B is disposed. Each of the first support frame 1700 and the second support frame 1800 disposed in each unit module 1000 of the second unit module group 1000 -B is extended to the first unit module group 1000 -A. It may extend from the bottom and the top of the support wall (2300) toward the disposed direction. At this time, the extension length of each of the first support frame 1700 and the second support frame 1800 may not exceed half of the thickness of the support wall 2300. The lower portion of the first support frame 1700 and the support wall 2300 and the upper portion of the second support frame 1800 and the support wall 2300 may be fastened by screws, respectively. According to this, since the unit module itself does not need to be directly fixed to the frame by screws, assembly is easy. In addition, it is easy to adjust the number of unit modules according to the amount of power required.

Here, the pair of support frames are shown to support one single module, but is not limited thereto. Each of the first support frame 1700 and the second support frame 1800 simultaneously performs one of a plurality of unit modules included in one unit module group and one of a plurality of unit modules included in another adjacent unit module group. It may extend along the second direction to support it. Accordingly, the number of each of the first support frame 1700 and the second support frame 1800 included in the thermal conversion apparatus 10 is greater than that of the unit module 1000 included in the first unit module group 1000 -A. It may be equal to the number or may be a multiple of the number of the unit modules 1000 included in the first unit module group 1000 -A.

To this end, a plurality of grooves in which the first support frame 1700 is disposed is formed at the lower end of the support wall 2300, and a plurality of grooves in which the second support frame 1800 is disposed at the upper end of the support wall 2300. Each of the first support frame 1700 and the second support frame 1800 may be fastened to the support wall 2300 by a fixing member such as a screw. The number of grooves formed at the bottom and the top of one support wall 2300 may be the same as the number of unit modules 1000 arranged in one unit module group.

According to an embodiment of the present invention, a coolant inlet is formed at one side of the coolant passage chamber 1100 and a coolant outlet is formed at the other side.

That is, the fifth surface 1105, which is one of both surfaces between the first surface 1101, the second surface 1102, the third surface 1103, and the fourth surface 1104 of the coolant passage chamber 1100, may be disposed on the fifth surface 1105. A coolant inlet 1110 is formed, and the sixth face 1106, which is the other of the two faces between the first face 1101, the second face 1102, the third face 1103, and the fourth face 1104. Cooling water outlet 1120 may be formed. In FIG. 1, a first unit module group 1000 -A, a second unit module group 1000 -B, a third unit module group 1000 -C, a fourth unit module group 1000 -D, and a fifth unit When the module group 1000 -E is sequentially arranged along the second direction, and the coolant flows in the direction from the first unit module group 1000 -A toward the fifth unit module group 1000 -E, the first A coolant inlet 1110 is formed on one side of each coolant passage chamber 1100 of the unit module 1000 included in the unit module group 1000 -A, that is, the fifth side 1105 that is the outer side. Each cooling water passage chamber 1100 of each unit module 1000 included in the first unit module group 1000 -A is a side disposed to face the other side, that is, the second unit module group 1000 -B. Cooling water outlet 1120 may be formed on the six sides (1106). Similarly, one side of each cooling water passage chamber 1100 of each unit module 1000 included in the second unit module group 1000 -B is disposed to face the first unit module group 1000 -A. A coolant inlet 1110 is formed at the fifth surface 1105, which is a side surface, and the other side of each coolant passage chamber 1100 of each unit module 1000 included in the second unit module group 1000 -B, that is, The cooling water outlet 1120 may be formed on the sixth surface 1106, which is a side surface disposed to face the third unit module group 1000 -C.

In this case, in order to allow the coolant to flow from the first unit module group 1000 -A toward the fifth unit module group 1000 -E, a cooling water inlet 1110 may be provided in the support wall 2300 disposed between the unit module groups. ) And a hole 2310 may be formed to correspond to the position of the coolant outlet 1120. For example, the hole 2310 may be a location of the coolant outlet 1120 and the second unit module formed in each coolant passage chamber 1100 of each unit module 1000 included in the first unit module group 1000 -A. It may be formed to correspond to the position of the coolant inlet 1110 formed in each coolant passage chamber 1100 of each unit module 1000 included in the group (1000-B). Accordingly, the coolant outlet 1120 formed in each coolant passage chamber 1100 of each unit module 1000 included in the first unit module group 1000 -A is connected to the second unit module group through the hole 2310. Each unit module included in the first unit module group 1000 -A may be connected to a coolant inlet 1110 formed in each coolant passage chamber 1100 of each unit module 1000 included in the 1000-B. Cooling water may flow from each coolant passage chamber 1100 of 1000 to each coolant passage chamber 1100 of each unit module 1000 included in the second unit module group 1000 -B. The same structure is also applied to the second unit module group 1000 -B, the third unit module group 1000 -C, the fourth unit module group 1000 -D, and the fifth unit module group 1000 -E. Can be applied.

According to an embodiment of the present invention, as shown in FIG. 5, each cooling water inlet 1110 is connected to a first fitting member 1112, and each cooling water outlet 1120 is connected to a second fitting member 1122. Can be. In this case, each of the first fitting member 1112 and the second fitting member 1122 may be fitted to the cooling water inlet 1110 and the cooling water outlet 1120, and may have a hollow tubular shape to allow the cooling water to pass therethrough. In addition, the first fitting member 1112 and the second fitting member 1122 may be simultaneously fitted into one hole 2310. For example, one of the plurality of holes 2310 formed in the support wall 2300 disposed between the first unit module group 1000 -A and the second unit module group 1000 -B may include a first unit module group. On the second fitting member 1122 and the second unit module group 1000-B connected to the coolant outlet 1120 formed in each coolant passage chamber 1100 of each unit module 1000 included in 1000-A. The first fitting member 1112 connected to the coolant inlet 1110 formed in each coolant passage chamber 1100 of each unit module 1000 may be fitted together. At this time, in order to prevent a problem in which the coolant flows out between the second fitting member 1122 and the first fitting member 1112, an outer circumferential surface of the first fitting member 1112, an outer circumferential surface and a hole of the second fitting member 1122 are provided. The inner circumferential surface of 2310 may be sealed together.

According to the exemplary embodiment of the present invention, a plurality of coolant inlets 1110 and a plurality of coolant outlets 1120 are formed at each of the fifth surface 1105 and the sixth surface 1106 of each coolant passage chamber 1100. A plurality of holes 2310 may be formed in the support wall 2300 to correspond to positions of the plurality of coolant inlets 1110 and positions of the plurality of coolant outlets 1120.

At this time, in order to smoothly flow the coolant, a plurality of coolant passage tubes 1130 may be formed in the coolant passage chamber 1100. The coolant passage tube 1130 is connected from the coolant inlet 1110 to the coolant outlet 1120 in the coolant passage chamber 1100, and the coolant may flow along the second direction through the coolant passage tube 1130. According to this, even if the flow rate of the coolant is not enough to fill the inside of each coolant passage chamber 1100, since the coolant can be evenly distributed in each coolant passage chamber 1100, the front surface of each coolant passage chamber 1100 It is possible to obtain even thermoelectric conversion efficiency.

As such, after the coolant flows into the first unit group module 1000 -A, the second unit group module 1000 -B, the third unit group module 1000 -C, and the fourth unit are along the second direction. It may be discharged to the fifth unit group module 1000 -E via the group module 1000 -D.

Then, the hot gas flows from the top of the cooling water passage chamber 1100 toward the bottom. For example, hot gas may flow from fourth side 1104 toward third side 1103. And when the second support frame 180 is disposed on the upper end of the unit module 1000 as in the embodiment of the present invention, it is possible to prevent the problem that the performance of the thermoelectric element is degraded due to the high temperature of the high-temperature gas.

In addition, although not shown, according to an embodiment of the present invention, a coolant inlet pipe is formed on one side of the first unit module group 1000 -A, for example, on a frame or an edge of the frame 2000 facing the fifth surface 1105. The coolant discharge pipe may be formed on a frame or an edge of the frame 2000 facing the other side of the fifth unit module group 1000 -E, for example, the sixth surface 1106. The coolant introduced into the coolant inlet pipe may be dispersed and introduced into the coolant inlet 1110 of each of the coolant passage chambers 1100 of the plurality of unit modules 1000 included in the first unit module group 1000 -A. The coolant discharged from the coolant outlet 1120 of each of the coolant passage chambers 1100 of the plurality of unit modules 1000 included in the fifth unit module group 1000 -E may be discharged to the outside collected in the coolant discharge pipe. have.

According to another embodiment of the present invention, a heat radiation fin may be disposed on an inner wall of each coolant passage chamber 1100 or an inner wall of the coolant passage tube 1130. The shape, the number, and the area occupying the inner wall of each cooling water passage chamber 1100 may be variously changed according to the temperature of the cooling water, the temperature of the waste heat, the required power generation capacity, and the like. The area where the heat dissipation fins occupy the inner wall of each cooling water passage chamber 1100 may be, for example, 1 to 40% of the cross-sectional area of each cooling water passage chamber 1100. According to this, it is possible to obtain high thermoelectric conversion efficiency without disturbing the flow of cooling water. In addition, since the cooling water moves in the second direction and the gas moves in the third direction, the cooling water and the gas may move in the direction crossing each other.

8 is a view for explaining the operation of the hot gas and the cooling water flowing in the heat conversion apparatus according to an embodiment of the present invention.

Referring to FIG. 8, as described above, the coolant may be introduced into the coolant inlet 1110 disposed on the fifth surface 1105. In addition, the coolant may be discharged to the coolant outlet 1120 by moving in the second direction through the coolant passage chamber therein. Alternatively, the hot gas can flow in the third direction. For example, hot gas may flow from fourth side 1104 toward third side 1103. In addition, since the plurality of group thermoelectric elements are sequentially disposed in the third direction, the hot gas may be heat-exchanged with the plurality of group thermoelectric elements arranged in the third direction. Accordingly, the temperature may be higher as the plurality of group thermoelectric elements are adjacent to the third surface 1103 or further away from the fourth surface 1104 by heat exchange with a high temperature gas. That is, the temperature may decrease by heat exchange while hot gas passes through the thermoelectric module.

For example, the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 may be arranged side by side in the third direction. Accordingly, the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 are respectively spaced apart from the fourth surface 1104. The distance can gradually increase. For example, the minimum separation distance d1 between the fourth surface 1104 and the first group thermoelectric element HA1, the minimum separation distance d2 between the fourth surface 1104 and the second group thermoelectric element HA2, The minimum separation distance d3 between the fourth surface 1104 and the third group thermoelectric element HA3 and the minimum separation distance d4 between the fourth surface 1104 and the fourth group thermoelectric element HA4 become gradually larger. Can be.

As described above, the high temperature gas passes through the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 by heat exchange. The temperature may gradually decrease.

That is, the 1-1a thermoelectric element 100-1a is the 2-1a thermoelectric element 100-2a of the second group thermoelectric element HA2 and the 3-1a thermoelectric element of the third group thermoelectric element HA3. The 4-1a thermoelectric elements 100-4a of the 100-3a and the fourth group thermoelectric element HA4 may be arranged side by side in the third direction, and the 1-1a thermoelectric elements 100-1a may be arranged side by side. The 2-1a thermoelectric element 100-2a, the 3-1a thermoelectric element 100-3a, and the 4-1a thermoelectric element 100-4a may sequentially exchange heat with a gas having a relatively low temperature. .

Similarly, the coolant may be exchanged with the plurality of first thermoelectric elements and the plurality of second thermoelectric elements arranged in the second direction while moving through the coolant inlet 1110. Accordingly, as described above, the temperature of the cooling water discharged after passing through the cooling water passage chamber may be higher than the temperature of the cooling water flowing into the cooling water passage chamber 1100.

In detail, the first group thermoelectric element HA1 is a plurality of first thermoelectric elements 100-1 arranged in a second direction, such as a first-first a thermoelectric element 100-1a and a first-first b thermoelectric element 100. -1b), 1-1c thermoelectric element 100-1c, 1-1d thermoelectric element 100-1d, 1-1e thermoelectric element 100-1e, 1-1f thermoelectric element 100-1f ), The 1-1g thermoelectric device 100-1g, and the 1-1h thermoelectric device 100-1h. The temperature of the coolant in a region where the first-first-a thermoelectric element 100-1a and the cooling water passage chamber contact each other (for example, a region overlapping in the first direction) is set in the first-first h thermoelectric element 100-1h and the cooling water passage. It may be less than the temperature of the coolant in the area where the chamber is in contact.

However, the gas may have a greater amount of heat exchanged with respect to the same volume than the cooling water. This may occur because the specific heat of the gas (eg air) is greater than the specific heat of the liquid (eg water).

In addition, the temperature of the gas in contact with the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 decreases and decreases. Since the rate of change is greater than the rate of change of the temperature of the cooling water, the temperature difference between the heat absorbing part and the heat generating part of the first thermoelectric module 1200 may vary between the first group thermoelectric element HA1, the second group thermoelectric element HA2, and the third group thermoelectric element ( HA3) and the fourth group thermoelectric element HA4. Accordingly, the power generated by each thermoelectric element may be reduced in the order of the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4. have. However, the heat conversion apparatus according to the embodiment includes a heat absorbing unit in the order of the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4. Even if the temperature difference between the heat generating parts increases, it may have a structure that can improve the efficiency of the power amount. This will be described in detail with reference to FIGS. 10 to 13.

9 is a cross-sectional view of a heat conversion device according to an embodiment of the present invention.

Referring to FIG. 9, as described with reference to FIG. 5, the coolant may move in a second direction through the coolant passage chamber, and the coolant passage chamber 1100 may include the thermoelectric elements 100 and the second elements of the first thermoelectric module 1200. The thermoelectric element 100 of the thermoelectric module 1300 may be in contact with each other on the first surface 1101 and the second surface 1102, respectively. As described above, the heat dissipation portion (cooling) of the thermoelectric element 100 of the first thermoelectric module 1200 is in contact with the first surface 1101, and the heat dissipation portion of the thermoelectric element 100 of the second thermoelectric module 1300 ( Cooling) may be in contact with the second surface 1102. In addition, the heat absorbing portion of the thermoelectric element 100 of the first thermoelectric module 1200 may be in contact with the heat sink 200 and heat exchange with gas may occur. Similarly, the heat absorbing portion of the thermoelectric element 100 of the second thermoelectric module 1300 may be in contact with the heat sink 200 and heat exchange with gas may occur.

FIG. 10 is a diagram illustrating a first thermoelectric module and a first thermoelectric device in a thermoelectric device according to an exemplary embodiment of the present invention.

Referring to FIG. 10, the first thermoelectric module 1200 and the first thermoelectric element 100 in the first thermoelectric module 1200 will be described. However, the structure described below may be equally applied to each thermoelectric module of the other unit module 1000 as well as the second thermoelectric module 1300.

As described above, the first thermoelectric module 1200 includes a first group thermoelectric element HA1, a second group thermoelectric element HA2, a third group thermoelectric element HA3, and a fourth group thermoelectric arranged side by side in a third direction as described above. The device HA4 may include the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 in order. The temperature may decrease due to heat exchange of the gas, thereby increasing the temperature difference between the heat generating portion and the heat absorbing portion.

Thus, in the thermoelectric device according to an embodiment, the thermoelectric elements in the group thermoelectric elements HA1 to HA4 having the same minimum separation distance may be electrically connected, and in particular, may be connected in series between adjacent thermoelectric elements.

Specifically, the first group thermoelectric element HA1 is a plurality of first thermoelectric elements 100-1 arranged in the second direction as described with reference to FIG. 8, and the first-first a thermoelectric elements 100-1a and the first group. -1b thermoelectric element 100-1b, 1-1c thermoelectric element 100-1c, 1-1d thermoelectric element 100-1d, 1-1e thermoelectric element 100-1e, 1-1f The thermoelectric element 100-1f, the 1-1g thermoelectric element 100-1g, and the 1-1h thermoelectric element 100-1h may be included.

And the 1-1a thermoelectric element 100-1a, the 1-1 b thermoelectric element 100-1b, the 1-1c thermoelectric element 100-1c, the 1-1d thermoelectric element 100-1d, and The 1-1e thermoelectric element 100-1e, the 1-1f thermoelectric element 100-1f, the 1-1g thermoelectric element 100-1g, and the 1-1h thermoelectric element 100-1h are electrically connected to each other. And may be connected in series with adjacent thermoelectric elements. Accordingly, each thermoelectric element in the group thermoelectric element may have a similar temperature difference between the heat generating portion and the heat absorbing portion. For example, the temperature difference may be within a predetermined error range. On the other hand, when the temperature difference between the electrically connected thermoelectric elements is large, since the current corresponding to the optimal power generated is different, there may be a problem that the power generation performance is reduced. As a result, the thermal conversion apparatus according to the embodiment may improve power efficiency since thermoelectric elements having similar temperature differences are electrically connected to each other to maintain the same power generation output. In addition, even if a defect such as disconnection of the thermoelectric element occurs, the defect of the thermoelectric element can be easily confirmed through power detection.

As described above, the second group thermoelectric element HA2 includes a plurality of thermoelectric elements arranged in a second direction, and the plurality of arranged thermoelectric elements may be electrically connected to each other, and a series connection may be made between adjacent thermoelectric elements. Can be.

Similarly, the third group thermoelectric element HA3 and the fourth group thermoelectric element HA4 each include a plurality of thermoelectric elements arranged in a second direction, and the plurality of thermoelectric elements arranged may be electrically connected to each other and adjacent thermoelectric elements. Series connections can be made between the devices.

Also, in the thermoelectric conversion apparatus, the first group thermoelectric element HA1, the second group thermoelectric element HA2, the third group thermoelectric element HA3, and the fourth group thermoelectric element HA4 have a maximum temperature difference in each group thermoelectric element. May be greater than the minimum temperature difference between adjacent group thermoelectric elements. Here, the maximum temperature difference means a difference between the highest temperature difference and the lowest temperature difference between the heat generating portion and the heat absorbing portion in each group thermoelectric element. The minimum temperature difference means a minimum deviation of the temperature difference between the heat generating unit and the heat absorbing unit between adjacent different group thermoelectric elements. For example, the maximum temperature difference is a temperature difference (maximum temperature difference) of the heat generating part and the heat absorbing part of the 1-1a thermoelectric element 100-1a in the first group thermoelectric element HA1 and the 1-8 th thermoelectric element 100-1h. It means the temperature difference between the temperature difference (lowest temperature difference) of the heat generating portion and the heat absorbing portion. The minimum temperature difference is a temperature difference between the heat generating portion and the heat absorbing portion of the 1-8 thermoelectric elements 100-1h and the 2-1 thermoelectric element 100-1 in the first group thermoelectric element HA1 and the second group thermoelectric element HA2. It means the temperature deviation between the temperature difference of the heat generating portion and the heat absorbing portion of 2a).

Accordingly, the thermoelectric device according to the embodiment may improve the power generation performance of the thermoelectric device by connecting the thermoelectric elements in the same group thermoelectric element in series.

In addition, the electrical connection between each thermoelectric leg and the electrode in the thermoelectric element may be made in a variety of directions, when described with reference to the first electrode is a plurality of first electrodes in the 3-2 direction, 3-1 direction and It can be connected in various ways in two directions. Hereinafter, the electrical connection in the thermoelectric element will be described with reference to the first electrode. Here, the 3-1 direction may be a direction from the third surface to the fourth surface, and the 3-2 direction may be a direction from the fourth surface to the third surface and may be the same as the moving direction in which the gas flows.

11 is a diagram illustrating a first thermoelectric module and a first thermoelectric device in a thermoelectric conversion apparatus according to another exemplary embodiment of the present invention.

Referring to FIG. 11, each of the plurality of thermoelectric elements in the same group thermoelectric element may be electrically connected between thermoelectric legs or electrodes having the same minimum separation distance in the third direction from the fourth surface in the thermoelectric device according to another exemplary embodiment. In particular, adjacent thermoelectric legs or electrodes can be connected in series with each other. However, as described above, the following description will be made based on the first electrode (since both the P-type leg and the N-type thermoelectric leg are disposed on the first electrode), and the following description may also be applied to the thermoelectric leg.

Specifically, the first group thermoelectric element HA1 will be described based on the first-first a thermoelectric element 100-1a and the first-first b thermoelectric element 100-1b. First, the 1-1a thermoelectric element 100-1a may include a plurality of thermoelectric legs and electrodes. In particular, the 1-1a thermoelectric device 100-1a may include the 1-1st electrode 110-1, the 1-2nd electrode 110-2, and the 1-3 that are sequentially arranged in the 3-2 direction. The electrode 110-3 and the first-fourth electrode 110-4 may be included. The first-first electrode 110-1, the first-second electrode 110-2, the first-third electrode 110-3, and the first-fourth electrode 110-4 are sequentially disposed from the fourth surface. The minimum separation distance in the 3-2 direction may increase. In addition, the 1-1b thermoelectric elements 100-1b may include the first to fifth electrodes 110-5, the first to sixth electrodes 110-6, and the first to seventh to seventh to third to be sequentially arranged in the 3-2 direction. The electrode 110-7 and the first-eight electrode 110-8 may be included. The 1-5th electrode 110-5, the 1-6th electrode 110-6, the 1-7th electrode 110-7, and the 1-8th electrode 110-8 are sequentially disposed from the fourth surface. The minimum separation distance in the 3-2 direction may increase. That is, even in the plurality of thermoelectric elements, the positions of the respective thermoelectric legs or the electrodes may be different or the same along the third direction.

In the thermoelectric device according to another embodiment, each thermoelectric leg or electrode in the plurality of thermoelectric elements may be electrically connected between thermoelectric legs or electrodes having the same minimum distance from the fourth surface.

First, in the 1-1a thermoelectric device 100-1a, the 1-1st electrode 110-1 may include a plurality of first sub-electrodes 110-1a to 110-1c arranged in a second direction. . Also, the first-first electrode 110-1 may be referred to as a 'first group sub-electrode', and the plurality of thermoelectric elements may include a plurality of group sub-electrodes. It demonstrates below as a reference. For example, the first-first electrode 110-1 may include the first-first sub-electrode 110-1a, the first-second sub-electrode 110-1b, and the first-third sub-electrode 110-1c. It may include. The first-first sub-electrode 110-1a, the first-second sub-electrode 110-1b, and the first-third sub-electrode 110-1c are arranged side by side in the second direction, and are formed from the fourth surface. The minimum separation distance in the 3-2 direction may be the same. That is, the temperatures of the heat-exchanging gas of the first-first sub-electrode 110-1a, the first-second sub-electrode 110-1b, and the first-third sub-electrode 110-1c may be substantially similar. Accordingly, the 1-1 sub-electrode 110-1a, the 1-2 sub-electrode 110-1b, and the 1-3 sub-electrode 110-1c are electrically connected in series to generate power generation performance of the thermal converter. This can be improved.

The first electrode 110-2, the first electrode 110-3, and the first electrode 110-4 are connected to the plurality of sub-electrodes similarly to the first electrode 110-1. The plurality of sub-electrodes of each of the 1-2 electrodes 110-2, the 1-3 electrodes 110-3, and the 1-4 electrodes 110-4 may be formed from the fourth surface to the third surface. Since the minimum separation distance in the −2 direction is the same, the temperature of the gas to be heat exchanged may be similar.

Similarly, in the 1-1b thermoelectric device 100-1b, the first-5 electrode 110-5 may include a plurality of sub electrodes arranged in a second direction, and the plurality of sub electrodes may include the fifth sub electrode 110. -5a to 110-5c).

In addition, the 1-5th electrode 110-5 includes the 5-1 sub-electrode 110-5a, the 5-2 sub-electrode 110-5b, and the 5-3 sub-electrode 110-5c. can do. The 5-1 sub-electrode 110-5a, the 5-2 sub-electrode 110-5b, and the 5-3 sub-electrode 110-5c are arranged side by side in the second direction, and are formed from the fourth surface. The minimum separation distance in the 3-2 direction may be the same. That is, the temperatures of the gas to be heat-exchanged may be substantially similar to those of the 5-1 sub-electrode 110-5a, the 5-2 sub-electrode 110-5b, and the 5-3 sub-electrode 110-5c. Accordingly, the 5-1 sub-electrode 110-5a, the 5-2 sub-electrode 110-5b, and the 5-3 sub-electrode 110-5c are electrically connected in series to generate power generation performance of the thermal converter. This can be improved.

In addition, the first-5 electrode 110-5 may be disposed in parallel with each other in the second direction and electrically connected to the first-first electrode 110-1 of the first-first-a thermoelectric element 100-1a that is an adjacent thermoelectric element. Can be. In detail, the fifth sub-electrode 110-5a of the first-5 electrode 110-5 may be electrically connected to the third sub-electrode 110-1c in series. In addition, the first and second electrodes 110-5 may have the same minimum distance from the first and second electrodes 110-1 and 3-2 in the 3-2 direction, and may have substantially the same temperature of the heat exchanged gas. . Accordingly, the power generation performance of the heat conversion device can be further improved.

Similarly, the 1-6 electrode 110-5 is electrically connected to the 1-2 electrode 110-2, and the 1-7 electrode 110-7 is electrically connected to the third electrode 110-3. The first-eighth electrode 110-8 may be electrically connected to the first-fourth electrode 110-4.

As described above, the thermoconversion device according to another embodiment may be formed depending on whether the connection between the plurality of electrodes in the thermoelectric elements in each group thermoelectric element is the same as the minimum separation distance in the third direction from the fourth surface. As a result, the thermal conversion efficiency of the thermal converter can be further improved.

12 is a diagram illustrating a first thermoelectric module and a first thermoelectric device in a thermoelectric conversion apparatus according to still another embodiment of the present invention.

Referring to FIG. 12, at least one of the plurality of thermoelectric elements in the same group thermoelectric element may be electrically connected between thermoelectric legs or electrodes having the same minimum separation distance from the fourth surface in the third direction in the thermoelectric device according to another exemplary embodiment. Can be. In particular, adjacent thermoelectric legs or electrodes may be connected in series with each other.

Specifically, the first group thermoelectric element HA1 will be described based on the first-first a thermoelectric element 100-1a and the first-first b thermoelectric element 100-1b. First, the 1-1a thermoelectric element 100-1a may include a plurality of thermoelectric legs and electrodes (however, the first electrode will be described based on the first electrode as described above). In particular, the 1-1a thermoelectric device 100-1a may include a 1-1 electrode, a 1-2 electrode, a 1-3 electrode, and a 1-4 electrode sequentially arranged in the 3-2 direction. Can be. The above description is the same as that described with reference to FIG. 11, and the descriptions of the first to fifth through eighth electrodes of the 1-1b thermoelectric device 100-1b may also be the same as described with reference to FIG. 11. .

Accordingly, the minimum separation distance of the first-first electrode, the first-second electrode, the first-third electrode, and the first-fourth electrode may increase in the order from the fourth surface to the third-second direction. In addition, the 1-1b thermoelectric element 100-1b may include 1-5 electrodes, 1-6 electrodes, 1-7 electrodes, and 1-8 electrodes sequentially arranged in the 3-2 direction. Can be. In addition, the minimum separation distance of the first to fifth electrodes, the first to sixth electrodes, the first to seventh electrodes, and the first to eighth electrodes may increase in the order of 3-2 from the fourth surface. As described above, even in the plurality of thermoelectric elements, the positions of the respective thermoelectric legs or the electrodes may be different or the same along the third direction.

However, in the thermal conversion apparatus according to another exemplary embodiment, the first-first electrode may include first-first sub-electrodes 110-1a to first-fourth sub-electrodes 110-1d. Unlike FIG. 11, the thermal conversion apparatus according to another embodiment further includes the first to fourth sub-electrodes 110-1d, but the number of such sub-electrodes may be modified by the size of the thermoelectric element.

In addition, the 1-2 electrode may include the 2-1 sub-electrodes 110-2a to 2-4 sub-electrodes 110-2d. In this case, the first-first electrode and the first-second electrode may be electrically connected to each other. For example, the 1-1 sub electrode 110-1a is connected in series with the 2-1 sub electrode 110-2a, and the 2-1 sub electrode 110-2a is connected to the 2-2 sub electrode 110. -2b) can be connected in series. Subsequently, the second-2 sub-electrodes 110-2b are sequentially formed with the 1-2 sub-electrodes 110-1b, and the 1-2 sub-electrodes 110-1b have a 1-3 sub-electrode 110-1c. ), And the 1-3 sub electrode 110-1c are the 2-3 sub electrodes 110-2c, and the 2-3 sub electrode 110-2c are the 1-4 sub electrodes 110-1d. ) Can be connected in series.

Similarly, the 1-5th electrode includes the 5-1st sub-electrodes 110-5a to 5-4th sub-electrodes 110-5d, and the 1-6th electrode includes the 6-1th sub-electrode 110-. 6a) to 6th-4th sub-electrodes 110-6d. In this case, the first to fifth electrodes and the first to sixth electrodes may be electrically connected to each other. For example, the 5-1 sub-electrode 110-5a is connected to the 6-1 sub-electrode 110-6a in series, and the 6-1 sub-electrode 110-6a is the 6-2 sub-electrode 110. -6b) can be connected in series. Subsequently, the 5-2 sub-electrodes 110-5b are sequentially formed by the 6-2 sub-electrodes 110-6b, and the 5-3 sub-electrodes 110-5c are respectively formed by the 5-2 sub-electrodes 110-5b. ), The fifth-3 sub-electrodes 110-5c are the sixth-3 sub-electrodes 110-6c, and the sixth-3 sub-electrodes 110-6c are the fifth-4 sub-electrodes 110-5d. ) Can be connected in series.

However, the 1-3 electrode may be connected in series with the 1-7 electrode, and the 1-4 electrode may be connected in series with the 1-8 electrode. The plurality of sub-electrodes may also be applied in the same manner as described with reference to FIG. 12. And by this configuration it is possible to improve the power generation performance of the heat conversion device. In addition, the connection relationship between the sub-electrodes can be adjusted to easily match the desired power generation performance.

FIG. 13 is a modification of FIG. 10.

Referring to FIG. 13, at least one of the plurality of group thermoelectric elements may be electrically connected to a group thermoelectric element having the same minimum distance from the fourth surface in the third direction.

Specifically, the first group thermoelectric element HA1 may include a plurality of thermoelectric elements arranged side by side in the second direction, and the plurality of thermoelectric elements may be connected in series with each other in the second direction. Similarly, the second group thermoelectric element HA2 may include a plurality of thermoelectric elements arranged side by side in the second direction, and the plurality of thermoelectric elements may be connected in series to each other in the second direction.

In contrast, each of the third group thermoelectric element HA3 and the fourth group thermoelectric element HA4 includes a plurality of thermoelectric elements, and each of the plurality of thermoelectric elements electrically connected in a direction 3-2 or 3-1. It may include.

14 and 15 are views illustrating effects of the first thermoelectric module according to an embodiment.

14 and 15, between the heat absorbing portion and the heat generating portion, respectively, for three identical thermoelectric elements (hereinafter, the first thermoelectric element TE1, the second thermoelectric element TE2, and the third thermoelectric element TE3), respectively. When the temperature difference is different, the generated power for each current (FIG. 15) and the generated power for each current (FIG. 14) when the first to third thermoelectric elements TE1 to TE3 are connected in series are shown.

Here, the thermoelectric element has an internal resistance of 1.73 kV when the temperature difference between the heat generating part and the heat absorbing part is 100 ° C., an internal resistance of 1.94 kV when the temperature difference is 150 ° C., and an internal resistance of 2.11 kV when the temperature difference is 200 ° C. FIG.

First, referring to FIG. 15, the first thermoelectric element TE1 has the maximum power generated at the first current CA1, which is about 1.4 [A], when the temperature difference between the heat generating portion and the heat absorbing portion is 100 ° C. (about 3.43 [W]). Can be provided. In addition, the second thermoelectric element TE2 may provide the maximum generated power (about 6.79 [W]) at a second current CA2 of about 1.8 [A] when the temperature difference between the heat generating unit and the heat absorbing unit is 150 ° C. The third thermoelectric element TE2 may provide the maximum generated power (about 10.26 [W]) at a third current CA3 of about 2.2 [A] when the temperature difference between the heat generating part and the heat absorbing part is 200 ° C. In the case where a plurality of first thermoelectric elements TE1 to third third thermoelectric elements TE3 are connected in series, the amount of power may increase in proportion to the number.

On the contrary, referring to FIG. 14, when the first thermoelectric element TE1, the second thermoelectric element TE2, and the third thermoelectric element TE3 are connected in series, the temperature difference between the heating part and the heat absorbing part is 150 ° C. (ie, , (100 ° C. + 150 ° C. + 200 ° C.) / 3) or about 1.72 [A], similar to the second current CA, may provide the maximum generated power (18.22 [W]). That is, this may be less than the maximum generated power (about 20.4 [W]) when the three second thermoelectric elements TE2 are connected in series. In addition, the above-described value may be smaller than the sum of the maximum generated powers of each of the first thermoelectric element TE1 to the third thermoelectric element TE3 (20.48 [W], 3.43 + 6.79 + 10.26).

That is, the series connection between thermoelectric elements having a large temperature difference reduces the maximum generated power. Accordingly, the thermoelectric conversion apparatus according to the above-described embodiments can improve power generation performance by making a series connection between thermoelectric elements or thermoelectric legs (electrodes) having similar temperature differences.

Claims (11)

A plurality of unit modules each arranged in a first direction and a second direction crossing the first direction;
A frame supporting the plurality of unit modules and including a first coolant inlet pipe and a first coolant discharge pipe disposed along the first direction;
A plurality of second coolant inlet pipes connected to the first coolant inlet pipe and disposed along the second direction at one side of the plurality of unit modules; And
And a plurality of second cooling water discharge pipes connected to the first cooling water discharge pipes and disposed along the second direction on the other side of the plurality of unit modules.
Each unit module,
A coolant passage chamber;
A first thermoelectric module disposed on a first surface of the cooling water passage chamber; And
And a second thermoelectric module disposed on a second surface of the cooling water passage chamber.
The cooling water passage chamber,
A third surface disposed between the first surface and the second surface;
A fourth surface disposed between the first surface and the second surface and disposed in a third direction from the third surface;
A fifth surface disposed between the third surface and the fourth surface and having a cooling water inlet disposed therein; And
And a sixth surface disposed between the third surface and the fourth surface and having a cooling water outlet formed therein.
The first thermoelectric module includes a plurality of group thermoelectric elements,
Each group thermoelectric element includes a plurality of thermoelectric elements having the same minimum separation distance in a third direction from the fourth surface,
In the at least one group thermoelectric element of the plurality of group thermoelectric elements, the plurality of thermoelectric elements are electrically connected to each other,
And the third direction is a direction crossing the first direction and the second direction.
The method of claim 1,
The plurality of group thermoelectric element,
A first group thermoelectric element; And
A second group thermoelectric element spaced apart from the first group thermoelectric element,
And a minimum separation distance in the third direction from the fourth surface of the first group thermoelectric element is greater than a minimum separation distance in the third direction from the fourth surface of the second group thermoelectric element.
The method of claim 1,
Each thermoelectric element
A first substrate;
A plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed alternately on the first substrate;
A second substrate disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs;
A first electrode connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series and disposed on a first substrate; And
And a second electrode connecting the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs in series and disposed on a second substrate.
The method of claim 3,
The first electrode includes a plurality of group sub electrodes,
Each group sub electrode includes a plurality of sub electrodes having the same minimum separation distance from the fourth surface in a third direction,
And a plurality of sub electrodes in at least one group sub electrode of the plurality of group sub electrodes are electrically connected to each other.
The method of claim 4, wherein
A plurality of thermoelectric elements are connected in series in at least one group thermoelectric element of the plurality of group thermoelectric elements,
And a plurality of sub-electrodes in series at least one of the plurality of group sub-electrodes.
The method of claim 4, wherein
The plurality of group sub electrodes,
A first-first electrode; And first and second electrodes spaced apart from each other;
The minimum separation distance of the first-first electrode is greater than the minimum separation distance of the electrode 1-2.
The method of claim 1,
The plurality of group thermoelectric element,
The maximum temperature difference within each group thermoelectric element is greater than the minimum temperature difference between adjacent group thermoelectric elements,
The maximum temperature difference is a difference between the highest temperature difference and the lowest temperature difference between the heat generating portion and the heat absorbing portion in each of the group thermoelectric elements,
And the minimum temperature difference is a minimum deviation of the temperature difference between the heat generating portion and the heat absorbing portion between the adjacent group thermoelectric elements.
The method of claim 1,
The frame includes a support wall disposed between the first unit module group and the second unit module group,
The support wall is formed with a hole corresponding to the position of the cooling water inlet and the position of the cooling water outlet,
And a cooling water outlet of one of the plurality of unit modules included in the first unit module group is connected to the cooling water inlet of one of the plurality of unit modules included in the second unit module group through the hole.
The method of claim 1,
The plurality of unit module groups,
A first unit module group and a second unit module group spaced apart at predetermined intervals along the first direction;
Gas passes through the predetermined interval
The temperature of the gas is higher than the temperature of the cooling water of the cooling water passage chamber.
The method of claim 9,
The specific heat of the gas is greater than the specific heat of the cooling water.
The method of claim 9,
The gas flows along a third direction crossing the first direction and the second direction,
And a coolant passage tube connected to the coolant inlet from the coolant inlet to the coolant outlet, and the coolant flows along the second direction through the coolant passage.

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