KR20200010855A - Complextype 5-axis machining apparatus - Google Patents

Abstract

In a five-axis machining apparatus for machining a workpiece, a hybrid five-axis machining apparatus according to the present invention comprises: a cutting machining unit performing cutting machining for the workpiece; a laser machining unit disposed adjacent to the cutting machining unit and performing laser machining for the workpiece; and a Z-axis drive unit moving the cutting machining unit and the laser machining unit in the Z-axis direction which is the direction closer to or away from the workpiece.

Description

Hybrid 5-Axis Processing Equipment {COMPLEXTYPE 5-AXIS MACHINING APPARATUS}

The present invention relates to a hybrid 5-axis machining apparatus, and more particularly, to a hybrid 5-axis machining apparatus capable of performing both laser processing and cutting processing with one apparatus.

In general, the 5-axis cutting machine is a cutting machine based on CNC (Computerized Numerical Control), which can be used to cut the work piece at various positions and angles. Of course, it refers to a cutting machine factory capable of feeding or rotating in the A-axis and B-axis directions.

In this case, since the type and size of a suitable tool may vary according to the work order, the cutting machine factory automatically performs an operation of exchanging a tool according to the work order. In addition, for automatic tool change of the cutting device, the cutting machine is provided with a tool holder for storing a plurality of tools having different types and sizes.

However, despite the fact that a plurality of tools having different types and sizes are accommodated in the cutting apparatus, it is difficult to process a workpiece for processing small articles such as scissors and accessories. This is because, in the case of a workpiece for processing a small article, because the thickness is thin, it does not have sufficient rigidity, so if the external machining is performed with a general 5-axis cutting machine, the workpiece may be damaged. In order to prevent such a risk of damage, a laser processing method capable of cutting a workpiece without being in contact with the workpiece is used in a work such as cutting a workpiece for processing a small article.

For example, after cutting a thin workpiece by using a laser processing machine, a work such as cutting, planing, shaping, slotting, boring, drilling, milling, tapping, and the like is performed using a 5-axis cutting machine.

At this time, when using the laser processing machine and the 5-axis cutting machine factory, respectively, there is a problem that the work efficiency is lowered.

Moreover, the laser processing machine also includes a system for 5-axis machining, in which the laser processing machine becomes a surplus system because the workpiece is first processed using the laser processing machine and then moved to the 5-axis cutting machine, thereby increasing the manufacturing cost of the article. There is a problem that increases.

In order to solve this problem, in recent years, a five-axis processing machine combined with a laser processing machine and a five-axis cutting machine has been developed.

At this time, since the 5-axis cutting machine and the laser processing machine are mounted on one body (or block), there is a problem that the laser processing machine interferes with the 5-axis cutting machine.

Accordingly, the present applicant has proposed the present invention to solve the above problems, and as related prior art documents, Korean Patent Publication No. 10-2018-0056846 (name of the invention: 5-axis laser processing machine, publication) Sun: 2018.05.30.

It is an object of the present invention to provide a hybrid 5-axis machining apparatus capable of performing both laser machining and cutting machining using a single machining apparatus.

In addition, another object of the present invention is to provide a hybrid 5-axis machining apparatus capable of preventing interference by a laser processing machine during cutting.

The problem to be solved by the present invention is not limited to the above-mentioned problem, another task that is not mentioned will be clearly understood by those skilled in the art from the following description.

The above object, according to the present invention, a 5-axis machining apparatus for processing a workpiece, a cutting unit for performing a cutting process for the workpiece; A laser processing unit disposed adjacent to the cutting processing unit and performing laser processing on the workpiece; A Z-axis driving unit for moving the cutting unit and the laser processing unit in a Z-axis direction which is a direction closer to or away from the workpiece; It can be achieved by a hybrid 5-axis processing apparatus comprising a.

The second driving unit may support the cutting processing unit and the laser processing unit together and move the cutting processing unit and the laser processing unit integrally.

The apparatus may further include a position moving unit mounted on the Z axis driving unit and moving the position of the laser processing unit on the Z axis driving unit.

The position shifting unit may move the laser processing unit to a second position away from the cutting processing unit at a first position at which the laser processing unit performs laser processing on the workpiece, or move the laser processing unit to the first position at the second position. The laser processing unit can be moved to a position.

The position shifting unit may operate the laser processing unit in the cutting processing mode by the cutting processing unit in order to prevent the laser processing unit from interfering with the workpiece during the cutting processing of the cutting processing unit. The second position may be moved to a position for preventing interference with an object.

The position shifter may move the laser processing unit in the Z-axis direction.

A Y-axis driving unit for moving the cutting unit and the laser machining unit in a Y-axis direction in a left-right direction with respect to the work object; An X-axis driving unit for moving the work object in an X-axis direction, which is a direction orthogonal to the Y-axis driving unit; And a rotation drive unit which supports the workpiece and rotates the workpiece based on the Y axis direction or rotates the workpiece based on the X axis direction. It may include.

The tool holder further includes a tool holder for storing the cutting tool mounted on the cutting unit, wherein the cutting tool receiving groove of the tool holder mitigates the impact of the cutting tool during the cutting tool exchange process using the cutting unit, or reduces the cutting unit. An elastic member may be provided to allow the cutting tool to be fully engaged with respect to the cutting tool.

The hybrid 5-axis machining apparatus of the present invention can perform both laser processing and cutting processing on a workpiece by using a single machining apparatus, thereby increasing processing efficiency of the workpiece. Furthermore, by installing the laser processing unit and the cutting unit in the cutting device, 5-axis machining using laser and cutting can be performed with one cutting device, thereby reducing the manufacturing cost of the cutting device.

In addition, in the hybrid 5-axis machining apparatus of the present invention, since the cutting processing unit and the laser processing unit are relatively moved according to the processing of the workpiece, it is possible to prevent the interference by the laser processing unit during the cutting processing.

1 is a perspective view of a hybrid 5-axis machining apparatus according to an embodiment of the present invention.
2 to 4 are side views for explaining the operation of the hybrid 5-axis machining apparatus shown in FIG.
FIG. 5 is an enlarged view of a portion A shown in FIG. 1.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

It is noted that the figures are schematic and not drawn to scale. The relative dimensions and ratios of the parts in the figures have been exaggerated or reduced in size for clarity and convenience in the figures and any dimensions are merely exemplary and not limiting. And the same reference numerals are used to represent similar features in the same structures, elements or parts that appear in more than one figure.

Embodiments of the present invention specifically illustrate ideal embodiments of the present invention. As a result, various modifications of the drawings are expected. Thus, the embodiment is not limited to the specific form of the illustrated region, and includes, for example, modification of the form by manufacture.

Hereinafter, with reference to the accompanying drawings will be described a hybrid 5-axis processing apparatus (100, hereinafter referred to as a 'processing device') according to an embodiment of the present invention.

As shown in Figures 1 to 4, the processing apparatus 100 according to an embodiment of the present invention is a cutting unit 140 for performing a cutting process on the workpiece (W); A laser processing unit 150 disposed adjacent to the cutting processing unit 140 and performing laser processing on the workpiece W; It includes a Z-axis driving unit 110 for moving the cutting unit 140 and the laser processing unit 150 in the Z-axis direction that is closer or farther away from the workpiece (W).

First, referring to FIGS. 1 to 3, the cutting unit 140 is a member for cutting the workpiece W using the mounted cutting tool 10. To this end, the cutting unit 140 includes a spindle 144 for rotating the cutting tool 10 by clamping the cutting tool 10, and a driving motor 142 for rotating the spindle 144. .

1 to 4, the laser processing unit 150 is a member for laser processing the workpiece W using a laser. The laser processing unit 150 is equipped with a laser for generating light, and cutting the workpiece (W) or the edge using a laser.

At this time, the cutting unit 140 and the laser processing unit 150 according to an embodiment of the present invention may be supported together by one member, that is, Z-axis drive unit 110.

The Z axis driving unit 110 is a means for supporting the cutting unit 140 and the laser processing unit 150 together and moving the cutting unit 140 and the laser processing unit 150 integrally.

Of course, the cutting unit 140 and the laser processing unit 150 may be separately configured and coupled to the member without being integrally coupled to the Z-axis driving unit 110.

However, since the laser processing unit 150 must process the workpiece W all, the convenience of movement in the Z-axis direction close to the workpiece W and the Z axis of the cutting unit 140 and the laser machining unit 150. It is preferable to combine the cutting unit 140 and the laser processing unit 150 integrally with the Z-axis drive unit 110 for convenience in the direction.

Z-axis drive unit 140 is coupled to the support block 112, the support block 112 supported by the Y-axis processing unit 120, the cutting processing unit 140 and the laser processing unit 150 is mounted together And a moving member 114 to move the cutting unit 140 and the laser processing unit 150 in the Z-axis direction.

At this time, the support block 112 and the moving member 114 are coupled by the Z-axis movement guide 111. The Z-axis moving guide 111 is a means for connecting the support block 112 and the moving member 114, and may be provided in the form of a linear motion guide (LM guide). The Z-axis moving guide 111 provided as the LM guide is in the form of a rail, and is provided in the form of a guide rail and a guide block. The guide rails of the Z-axis moving guide 111 are provided in pairs on the front of the support block 112, and the guide blocks of the Z-axis moving guide 111 are provided to correspond to the guide rails on the rear side of the moving member 114. Combined with the guide rail. For reference, although not shown, the Z-axis movement guide 111 is moved in the Z-axis direction with respect to the support block 112 through a servo motor (not shown) provided separately.

1 to 4, the cutting processing unit 140 and the laser processing unit 150 may be coupled to the moving member 114 via the connection block 116.

Of course, the cutting processing unit 140 and the laser processing unit 150 may be directly coupled to the moving member 114 without being coupled to the moving member 114 after being first coupled to the connection block 116. However, for convenience in cutting and laser machining on the workpiece W, the connecting block 116 is positioned between the cutting processing unit 140 and the laser processing unit 150, and the cutting processing unit 140 and the laser are processed. Processing unit 150 is preferably mounted on the connection block 116.

Meanwhile, the Y-axis driving unit 120 supports the Z-axis driving unit 140 and moves the cutting unit 140 and the laser processing unit 150 in the Y-axis direction in the left-right direction with respect to the workpiece W. Means. To this end, the Y-axis drive unit 120 is coupled to the support frame 122 and the Y-axis support frame 122 coupled to a portion of the processing apparatus 100 not shown in the drawings, cutting unit 140 and laser Y-axis movement guide 124 to move the machining unit 150 in the Y-axis direction. Here, the Y-axis movement guide 124 is provided in the form of a ball screw (ball-screw), but is not necessarily limited thereto. The cutting unit 140 and the laser processing unit 150 are movable in the Y-axis direction by being coupled to the Y-axis movement guide 124 on the rear surface of the support block 112 of the Z-axis driving unit 140.

In addition, the X-axis drive unit 130 is the X-axis direction (the front-rear direction, which is a direction orthogonal to the Y-axis drive unit 120 with respect to the cutting unit 140 and the laser processing unit 150 for the workpiece W Means to move forward and backward). To this end, the X-axis drive unit 130 is the X-axis drive unit 130 is an X-axis provided in the bed 132, the bed 132 is coupled to a portion of the processing apparatus 100 not shown in the drawings X-axis servo motor 136 to rotate the movement guide 134 and the X-axis movement guide 134. Here, the X-axis movement guide 134 is provided in the form of a ball screw (ball-screw) similar to the Y-axis movement guide 124 described above.

That is, the Z-axis, Y-axis, and X-axis drive unit 130 is a cutting processing unit 140 and a laser processing unit 150 equipped with a cutting tool 10 through the respective movement guides (111, 124, 134). Is moved in the Z, Y, and X directions according to the preset data.

Meanwhile, as described above, the cutting unit 140 and the laser processing unit 150 are moved together in the Z-axis direction by the Z-axis driving unit 140.

However, in the cutting mode using the cutting unit 140, the laser processing unit 150 is moved in the Z-axis direction separately from the cutting unit 140. To this end, the Z-axis driving unit 140 separates the position processing unit 118 for moving the laser processing unit 150 in the Z-axis direction on the Z-axis driving unit 110 separately from the cutting unit 140. It includes more. In other words, the position moving unit 118 is mounted on the Z-axis driving unit 110 and moves the laser processing unit 150 independently of the cutting processing unit 140.

2 to 4, the position moving unit 118 is separated from the cutting unit 140 at an initial position where the laser processing unit 150 performs laser processing on the workpiece W, that is, the first position. The laser processing unit 150 is moved to a position, that is, a second position. In addition, the position moving unit 118 may move the laser processing unit 150 from the second position to the first position.

First, as shown in FIG. 2, when no processing is performed on the workpiece W, the cutting unit 140 and the laser processing unit 150 are located at the same position. At this time, the position where the laser processing unit 150 is located is called a first position.

On the other hand, as shown in Figure 3, after the laser processing mode is finished using the laser processing unit 150, in the case of performing a cutting process on the workpiece (W) using the cutting unit 140, that is, cutting In the mode, the laser processing unit 150 is moved from the second position to the second position away from the cutting unit 140.

Moving the laser processing unit 150 from the first position to the second position in the cutting mode using the cutting unit 140, the laser processing unit 150 in the process of cutting the cutting unit 140. ) Is to prevent interference with the workpiece (W). That is, by moving the laser processing unit 150 from the first position to the second position which is a direction away from the cutting unit 140 in the cutting mode, the laser processing unit 150 in the cutting mode is the workpiece (W) It can prevent the interference with.

In general, in the cutting mode using the cutting unit 140 to perform a variety of operations, such as lathe, drilling, milling, depending on the cutting tool 10 is mounted. If the position of the laser processing unit 150 is located at the same position as the cutting processing unit 140, it is necessary to process various surfaces of the workpiece W by using various cutting tools 10 to secure a visual field. This may be difficult, and an error may occur in performing machining by a preset program. In addition, when performing a variety of operations such as lathe, drilling, milling using the cutting tool 10, the cutting chip (chip) must be generated from the workpiece (W), due to the cutting chip generated laser processing unit 150 ) May be damaged. Accordingly, the laser processing unit 150 is moved above the cutting unit 140, that is, from the first position to the second position by using the position moving unit 118 when performing the cutting process using the cutting unit 140. By doing so, it is possible to improve the processing efficiency in cutting and to prevent any damage of the laser processing unit 150 in advance.

For reference, in the laser processing mode of the workpiece W using the laser processing unit 150, the laser processing unit 150 may not move downward from the position of the cutting processing unit 140 by the position moving unit 118. You don't have to.

In the laser processing mode using the laser processing unit 150, because the processing using the laser (laser) is performed because it is not in contact with the workpiece (W), because a separate cutting tool 10 is not used, No cutting chips are generated. Accordingly, the processing apparatus 100 according to the embodiment of the present invention does not move the position of the laser processing unit 150 in the upward direction or the downward direction when performing the laser processing mode using the laser processing unit 150. You don't have to.

Then, as shown in Figure 4, after moving the laser processing unit 150 from the first position to the second position away from the cutting unit 140, the moving member 115 when cutting is performed By moving in a direction closer to the workpiece (W), the cutting unit 140 is closer to the workpiece (W) to perform the cutting on the workpiece (W).

For reference, before performing the cutting mode for the workpiece W using the cutting unit 150, the cutting tool 10 must be mounted in the cutting unit 150 in accordance with a preset computer programming.

To this end, although not shown in the drawings, the moving member 114 for supporting the cutting unit 140 and the laser processing unit 150 together with the laser processing unit 150 is moved from the first position to the second position. To the Y-axis direction, that is, the tool holder 170 mounted on the support frame 166 of the rotation driving unit 160 to be described later is positioned above the tool holder 170. Then, the moving member 114 is moved in the Z-axis direction which is closer to the tool holder 170, thereby inserting the cutting tool 10 required for the cutting unit 140, and by using this to the workpiece (W) Perform cutting.

On the other hand, by providing a position moving unit (not shown) separate from the position moving unit 118 of the laser processing unit 150 so that the cutting processing unit 140 moves away from or close to the workpiece (W) ( 150) can be moved independently.

However, the cutting unit 140 is a member that performs the cutting process using the mounted cutting tool 10. At this time, a lot of force is generated when the cutting process using the mounted cutting tool (10). If the cutting unit 140 is coupled to a separate position moving unit (not shown) to be moved independently of the laser processing unit 150, the cutting object 10 is cut using the cutting tool 10. When not much force is generated when it becomes difficult to precisely machine the workpiece (W). Therefore, it is preferable to implement the laser processing unit 150 to move independently of the cutting processing unit 140, rather than moving the cutting unit 140 in the Z-axis direction independently of the laser processing unit 150.

Here, the position moving unit 118 according to an embodiment of the present invention is provided as an LM guide. As the position moving unit 118 is provided as the LM guide, the laser processing unit 150 may be moved above the position of the cutting unit 140. For reference, although not shown in the drawing, the position moving unit 118 is moved in the Z-axis direction by a cylinder or the like.

On the other hand, in the laser processing mode using the laser processing unit 150 may be to move the laser processing unit 150 in a lower position than the cutting processing unit 140, that is, the direction closer to the workpiece (W). However, in the process of performing the laser processing by using the laser processing unit 150 is not directly in contact with the workpiece (W) is processed using the laser in a non-contact state. Accordingly, in the laser processing mode, it is not necessary to move the laser processing unit 150 toward the workpiece W, but may vary according to a user who implements the present invention.

1 to 4, the rotation driving unit 160 supports the work object W processed by the cutting tool 10 or the laser processing unit 150 mounted on the cutting processing unit 140 and works. It is a means for rotating the object W in the A-axis or B-axis direction. Here, the A-axis and B-axis direction is a term generally used in a conventional 5-axis processing apparatus, the A-axis rotation means the direction of rotation around the Y axis in Figure 1, the B-axis rotation is Figure 1 In the direction of rotation about the X axis.

The rotation drive unit 160 rotates the jig 162 for clamping the workpiece W in the A-axis direction, and rotates the jig 162 in the B-axis direction. Rotation bracket 164 interconnecting the B-axis servo motor 163, the A-axis servo motor 161, and the B-axis servo motor 163, and a support frame 166 provided on the bed 132 to support these components. It includes.

The A-axis servo motor 161 is disposed in front of the support frame 166 and is coupled to one end of the rotation bracket 164. At this time, the A-axis servo motor 161 is coupled to the rotation bracket 164 in a state in which the rotation shaft is inserted into the motor coupling bracket 161a through one end of the rotation bracket 164, the motor coupling bracket 161a It is connected to the jig 162 disposed on the opposite side with respect to the rotary bracket 164 through the). The A-axis servo motor 161 rotates the jig 162 clamped with the workpiece W in the A-axis direction.

The B-axis servo motor 163 is disposed at the rear of the support frame 166 and disposed opposite to the support frame 166 with the rotation axis penetrating the support frame 166, that is, the support frame 166. It is coupled to the other end of the rotating bracket 164 disposed in front of the). The B-axis servo motor 163 rotates the rotation bracket 164 in the B-axis direction to rotate the jig 162 in which the workpiece W is clamped in the B-axis direction.

The rotating bracket 164 is a bent shape of the 'b' shape, the A-axis servo motor 161 is coupled to one end thereof, and the B-axis servo motor 163 is coupled to the other end thereof. Since the rotating bracket 164 is provided to be rotatable in the B-axis direction on the support frame 166, the B-axis servo motor 163 coupled to the other end rotates in the B-axis direction as the B-axis servo motor 163 rotates. At this time, since the jig 162 is coupled to one end of the rotating bracket 164 having the bent shape, the jig 162 to which the workpiece W is clamped is rotated along the B-axis as the rotating bracket 164 rotates. Rotate in the direction. As a result, the B-axis servo motor 163 rotates the jig 162 in the B-axis direction through the rotation bracket 164.

Meanwhile, as described above, referring to FIGS. 1 to 4, a tool holder 170 is provided at one side of the support frame 166 provided on the bed 132. In the tool holder 170, a plurality of tool receiving grooves 172 are provided to accommodate the cutting tool 10 mounted on the cutting unit 140.

Here, referring to FIG. 5, the tool receiving groove 172 is provided with an elastic member 174. In other words, the elastic member 174 may be fitted to the cutting tool 10 or may be located at the lower end of the cutting tool 10 depending on the shape of the cutting tool 10 accommodated in the tool receiving groove 172. The elastic member 174 is replaced with the cutting tool 10 to be used by using the cutting processing unit 140 or the cutting processing unit 140 when the used cutting tool 10 is returned to the tool holder 170. ) To reduce the damage to the cutting tool 10 located in the tool receiving groove 172 of the tool holder 170, and also to the cutting processing unit 140 to the end It provides a compressive force that allows it to fit completely.

That is, the elastic member 174 acts as a buffer of the cutting tool 10 located in the tool receiving groove 172 and prevents damage of the cutting tool 10, and the cutting tool 10 is a cutting processing unit ( 140), so that it fits snugly. The elastic member 174 is provided in the form of a compression spring (spring), but is not necessarily limited thereto.

As described above, one embodiment of the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided only to help a more general understanding of the present invention. The present invention is not limited thereto, and various modifications and variations can be made by those skilled in the art to which the present invention pertains. Accordingly, the spirit of the present invention should not be limited to the described embodiments, and all of the equivalents or equivalents of the claims as well as the following claims will fall within the scope of the present invention.

100: Hybrid 5-axis machining
110: Z axis drive unit
114: moving member
118: position moving unit
120: Y axis drive unit
130: X axis drive unit
140: cutting unit
150: laser processing unit
160: rotary drive unit
170: tool holder

Claims (8)

In the 5-axis processing apparatus for processing the workpiece,
Cutting processing unit for performing a cutting process on the workpiece;
A laser processing unit disposed adjacent to the cutting processing unit and performing laser processing on the workpiece; And
A Z-axis driving unit for moving the cutting unit and the laser processing unit in a Z-axis direction which is a direction closer to or away from the workpiece;
Hybrid 5-axis processing apparatus comprising a.
The method of claim 1,
The Z-axis drive unit,
And a hybrid processing apparatus for supporting the cutting processing unit and the laser processing unit together and moving the cutting processing unit and the laser processing unit integrally.
The method according to claim 1 or 2,
And a position moving part mounted on the Z axis driving unit and moving the position of the laser processing unit on the Z axis driving unit.
The method of claim 3,
The position moving unit,
The laser processing unit moves the laser processing unit to a second position away from the cutting processing unit at a first position where the laser processing unit performs laser processing on the workpiece, or the laser processing from the second position to the first position. Hybrid 5-axis machining apparatus characterized by moving the unit.
The method of claim 4, wherein
The position moving unit,
In order to prevent the laser processing unit from interfering with the workpiece in the process of cutting the cutting unit, in the cutting mode by the cutting unit, the laser processing unit may interfere with the workpiece. Hybrid 5-axis processing apparatus, characterized in that for moving to the second position that is the position to prevent.
The method of claim 4, wherein
The position moving unit,
Hybrid 5-axis machining apparatus, characterized in that for moving the laser processing unit in the Z-axis direction.
The method of claim 4, wherein
A Y-axis driving unit for moving the cutting unit and the laser machining unit in a Y-axis direction in a left-right direction with respect to the work object;
An X-axis driving unit for moving the work object in an X-axis direction, which is a direction orthogonal to the Y-axis driving unit; And
A rotation drive unit which supports the workpiece and rotates the workpiece based on the Y axis direction or rotates the workpiece based on the X axis direction; Hybrid 5-axis processing apparatus comprising a.
The method of claim 7, wherein
Further comprising a tool holder for receiving a cutting tool mounted to the cutting unit,
The hybrid tool, characterized in that the cutting tool receiving groove of the tool holder is provided with an elastic member to mitigate the impact on the cutting tool in the cutting tool exchange process using the cutting processing unit or to make the cutting tool in close contact with the cutting processing unit. Shaft processing equipment.

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