KR20190086101A - Method of analyzing pollution in subsidiary materials for process - Google Patents

Abstract

A method for analyzing pollution prepares a plurality of subsidiary materials, corrodes the subsidiary materials using a plurality of sources, measures metal pollution based on the corroded subsidiary materials, and selects an optimal subsidiary material based on the measured metal pollution.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a method for analyzing contaminants in process materials,

The embodiments relate to a method for analyzing contamination due to corrosion in process auxiliary materials.

Semiconductor equipment is equipped with various process auxiliary materials for injecting or discharging various process sources.

Prolonged use of the semiconductor process can corrode process auxiliary materials by process sources. If the process auxiliary material is corroded in this way, metal contamination may occur, which may cause deterioration of the quality of the semiconductor device.

The embodiments are directed to solving the above problems and other problems.

Another object of the present invention is to provide a method for analyzing contamination of process auxiliary materials which can easily confirm the degree of metal contamination according to the corrosion state of the auxiliary material.

It is still another object of the present invention to provide a method for analyzing contamination of process auxiliary materials which can easily grasp the influence of corrosive properties on the environment where the auxiliary materials are exposed, for example, the source.

It is another object of the present invention to provide a method for analyzing contamination of process auxiliary materials capable of selecting an optimal auxiliary material having a strong corrosive force to a specific source.

According to an aspect of the present invention, there is provided a method for analyzing contamination of a process auxiliary material, comprising: preparing a plurality of auxiliary materials; Corroding the plurality of subsidiary materials using a plurality of sources; Measuring metal contamination based on the corroded materials; And selecting an optimal auxiliary material based on the measured metal contamination.

The effect of the pollution analysis method of process auxiliary materials according to the embodiment will be described as follows.

According to at least one of the embodiments, various kinds of subsidiary materials that can be used in a semiconductor facility can be artificially corroded using various sources used in a semiconductor facility, and metal contamination due to corrosion can be measured, It is easy to check the degree of the problem.

According to at least one of the embodiments, the metal contamination due to corrosion is measured, so that the influence of the corrosion characteristics on the source where the accessory is exposed can be easily grasped.

According to at least one of the embodiments, metal contamination due to corrosion is measured, so that an optimal auxiliary material having a strong corrosive force to a specific source can be selected.

Additional ranges of applicability of the embodiments will be apparent from the following detailed description. It should be understood, however, that various changes and modifications within the spirit and scope of the embodiments will become apparent to those skilled in the art, and that specific embodiments, such as the detailed description and the preferred embodiments, are given by way of example only.

1 is a flowchart illustrating a method for analyzing contamination of process auxiliary materials according to an embodiment.
Figure 2 shows the contamination analysis for steel.
Figure 3 shows the contamination analysis for SUS304 and SUS316.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, It is to be understood that the invention includes equivalents and alternatives.

Metal contamination of various subsidiary materials that can be employed in semiconductor equipment has been analyzed in the examples. Steel, SUS304 and SUS316 may be used as auxiliary materials, but the present invention is not limited thereto.

The auxiliary material may be, for example, a pipe through which the process source flows. The auxiliary material may be a pipe through which at least one mixed gas used in the processing of the semiconductor substrate in the chamber is discharged from the semiconductor facility. In addition, various piping that can be used for semiconductor equipment may be an auxiliary material for analysis of metal contamination in the embodiment.

In the examples, various process sources available in semiconductor equipment were used. As a process source, for example, an acid, a base, and / or distilled water may be used, but the present invention is not limited thereto. The acid may be, for example, hydrofluoric acid (HF), nitric acid (HNO3) or a mixture thereof. The base may be sodium hydroxide (NaOH). The distilled water may be deionized water (DIW).

In the embodiment, various kinds of auxiliary materials are etched using various sources used in semiconductor equipment, and then the metal contamination is analyzed on the corroded subsidiary materials to determine whether the various members used in the semiconductor equipment have strong corrosion resistance It is easy to grasp the weakness.

In the embodiment, it is possible to easily grasp how the auxiliary material used in the semiconductor equipment is affected by the source through the metal contamination analysis.

In addition, in the embodiment, through the analysis of metal contamination, it is possible to select an optimal auxiliary material having a strong anti-corrosive property to a specific source. The optimum auxiliary material is installed in a semiconductor facility in which a specific source is used, and a specific source is injected into a semiconductor facility through an optimal subsidiary material, so that a high-quality semiconductor device can be manufactured by the semiconductor facility.

Hereinafter, the pollution analysis method according to the embodiment will be described in detail.

Fig. 1 is a flow chart illustrating a method for analyzing contamination of process auxiliary materials according to an embodiment, Fig. 2 shows a contamination analysis for steel, and Fig. 3 shows a contamination analysis for SUS304 and SUS316.

Referring to FIG. 1, a plurality of subsidiary materials may be prepared (S11). The auxiliary materials may include but are not limited to steel, SUS304 and SUS316. The auxiliary material may be provided in a small size for testing, not for the actual size used in semiconductor equipment.

Each of the plurality of subsidiary materials can be artificially and / or forcibly corroded (S12). That is, each of the plurality of subsidiary materials can be corroded by each of the plurality of sources. Sources may include, but are not limited to, acids, bases and distilled water. The acid may be, for example, hydrofluoric acid (HF), nitric acid (HNO3) or a mixture thereof. The base may be sodium hydroxide (NaOH). The distilled water may be DIW.

For example, the first steel may be corroded by acid, the second steel may be corroded by the base, and the third steel may be corroded by the distilled water. Likewise, SUS304 and SUS316, respectively, can be corroded by acid, base or distilled water.

The source may, for example, be dipped in a container. The container may be, but is not limited to, a bottle.

For example, nine vessels may be provided for corrosion to steel, SUS304 and SUS316, respectively. Three of which are containers containing acid, the other three containers are bases containing bases, and the other three containers may be containers containing distilled water.

The capacity of the acid, base, and distilled water contained in each vessel may be the same but is not limited thereto.

The supplementary material may be sized to be immersed in each container.

According to the embodiment, the corrosion time at which the auxiliary material is dipped in each container and corroded may be from 10 hours to 20 hours. If the corrosion time is within 10 hours, the corrosion of the auxiliary materials is weak and it may be difficult to analyze metal contamination later. If the corrosion time exceeds 20 hours, it is difficult to judge the degree of corrosion of the auxiliary materials due to overexcitation of the auxiliary material, so that it may be difficult to analyze the metal contamination.

After the corroded auxiliary material is taken out from each vessel, it can be immersed in a nitric acid (HNO3) solution (S13). The auxiliary material is immersed in a nitric acid (HNO 3) solution for 1 hour to 2 hours, so that the foreign material that has corroded into the auxiliary material can be eluted. For example, nitric acid (HNO3) may be 2% nitric acid, but this is not limiting. 2% nitric acid is mostly composed of water and the density is close to 1. Can be obtained by diluting 20 g of nitric acid (HNO3) in a solution of 1000 g of 2% nitric acid, for example.

2% nitric acid can easily dissolve foreign matter that has been corroded into the auxiliary material. Any solution can be used in the embodiment in which the foreign material that has been corroded to the subsidiary material can be easily eluted.

After the elution solution is extracted (S14), metal contamination can be measured on the eluted solution (S15). The extraction of the elution solution and the measurement of metal contamination are well known and will not be described in detail.

The optimum subsidiary material can be selected through metal contamination measurement (S16).

The selection of the optimal subsidiary material will be described with reference to FIGS. 2 and 3. FIG. In FIG. 2, metal contamination due to corrosion of steel can be shown. Specifically, FIG. 2A shows metal contamination when steel is corroded by acid, FIG. 2B shows metal contamination when steel is corroded by a base, and FIG. 2C shows that steel is corroded by distilled water Can show metal contamination.

As shown in FIGS. 2A to 2C, when steel was corroded by acid, base and distilled water, iron (Fe) and copper (Cu) were detected to be high. Particularly, unlike the case shown in Figs. 2A to 2C, iron was detected to have 2,000,000 ppb or more. Copper was also detected more than 6000 ppb when it was corroded by acid or base. From this, it can be seen that steel (Fe) and copper (Cu) are detected much when the steel is corroded by acid, base and distilled water, and therefore it is not suitable as an auxiliary material through which acid, base or distilled water flows.

In FIG. 3, metal contamination due to corrosion of SUS304 and SUS316, respectively, can be shown. 3A shows metal contamination when SUS304 and SUS316 are corroded by acid, and FIG. 3B shows metal contamination when SUS304 and SUS316 respectively are corroded by a base. In FIG. 3C, SUS304 and SUS316 It can show metal contamination if it is corroded by distilled water.

As shown in Fig. 3A, when SUS304 and SUS316 were corroded by acid, almost no metal contaminants were detected. Therefore, it can be seen that SUS304 and SUS316 are suitable as a subsidiary material through which acid flows in a semiconductor facility.

As shown in FIG. 3B, SUS304 was found to be highly iron (Fe), copper (Cu) and nickel (Ni) when it was corroded by a base. Respectively. Therefore, it can be seen that SUS304 and SUS316 are not suitable as auxiliary materials through which a base flows in a semiconductor facility.

As shown in FIG. 3C, when both SUS304 and SUS316 were corroded by distilled water, only iron (Fe) was detected high, and the following metal contaminants were hardly detected. SUS304 and SUS316 can be used as auxiliary materials through which distilled water flows in semiconductor equipment.

In summary, steel is not suitable as an auxiliary material for flowing acids, bases, and distilled water, because it generates a lot of metal contaminants due to corrosion due to its weak corrosive property against acid, base and distilled water.

SUS304 and SUS316 are not suitable as auxiliary materials for the base flow because the corrosion characteristic is weak against the base and many metallic contaminants are generated due to corrosion.

SUS304 and SUS316 are suitable as supplementary materials for flowing acid or distilled water because they have a strong corrosion property for both acid and distilled water, and metal pollution due to corrosion hardly occurs.

As a result, SUS304 or SUS316 can be used as an auxiliary material through which acid or distilled water flows. Steel, SUS304, and SUS316 are not suitable as base materials. However, by using the above metal contamination analysis method, auxiliary materials for flowing the base can be easily found.

As described above, the optimum subsidiary material suitable for flowing the respective sources can be selected through analysis of the metal contamination, and the selected subsidiary material is installed in the semiconductor facility, thereby minimizing metal contamination occurring in the semiconductor facility, It is possible to manufacture.

The foregoing detailed description should not be construed in all aspects as limiting and should be considered illustrative. The scope of the embodiments should be determined by rational interpretation of the appended claims, and all changes within the equivalents of the embodiments are included in the scope of the embodiments.

Claims (4)

Preparing a plurality of subsidiary materials;
Corroding the plurality of subsidiary materials using a plurality of sources;
Measuring metal contamination based on the corroded materials; And
And selecting an optimal auxiliary material based on the measured metal contamination. The method according to claim 1,
And the optimal subsidiary material is selected for each of the plurality of sources. The method according to claim 1,
Wherein the optimal subsidiary material has a high corrosion strength for a specific source. The method according to claim 1,
Wherein measuring the metal contamination comprises:
Immersing the corroded plurality of subsidiary materials in a nitric acid solution; And
Extracting an eluting solution from the plurality of sub materials to be immersed,
Wherein the metal contamination is measured on the basis of the extracted eluting solution.

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