KR20190080687A - Adhesive tape with low dielectric constant - Google Patents

Abstract

The present invention relates to a low dielectric constant adhesive tape and, more specifically, to a low dielectric constant adhesive tape comprising: a base layer; and an adhesive layer formed on one side or both sides of the base layer, wherein the adhesive layer is composed of an acrylic monomer mixture, a polymerization initiator, a solvent, and a curing agent. In addition, the adhesive tape exhibits excellent adhesive performance, and has effect of suppressing jamming when applied to an electronic device or the like due to the low dielectric constant.

Description

ADHESIVE TAPE WITH LOW DIELECTRIC CONSTANT [0002]

More particularly, the present invention relates to a low dielectric constant adhesive tape which exhibits excellent adhesive performance, but exhibits an effect of suppressing radio wave interference when applied to electronic equipment or the like due to its low dielectric constant.

In the highly information-oriented society like the 21st century, the semiconductor industry is a cutting-edge industry with infinite possibilities in addition to the flat display device industry and the secondary battery industry, and as a base industry for upgrading the production structure of major industries, Is an indispensable industry.

In the case of memory areas such as DRAM, the increase of memory capacity is the most important issue, and the domestic memory manufacturing technology related to this has reached the highest level in the world including Samsung Electronics.

However, in the case of MPU and system-on-chip (SoC), which are much larger than the memory market, the improvement of integration and the speed of data processing are the most important issues. Of the world's manufacturing industry.

In order to achieve high integration and high speed of non-memory devices, it is most desirable to minimize the RC delay represented by the product of the capacitance (C) and the resistance (R) of the wiring depending on the degree of integration It is important to develop an interlayer insulating material having a low dielectric constant, such as using copper having lower electrical resistance than aluminum, which is currently a semiconductor wiring interconnect.

This is also the case in the adhesive materials field, and various conductive films and adhesive films are attached to the upper and lower semiconductor structures included in various electronic devices. In this field, adhesive tapes are required to adhere the surfaces of different materials, and general double-sided tapes are used as base layers by applying an adhesive material to both sides of a rigid film such as polyethylene terephthalate.

Korean Patent Registration No. 10-1181335 (2012.09.04). Korean Patent Registration No. 10-1753718 (June 27, 2017).

An object of the present invention is to provide a low dielectric constant adhesive tape which exhibits excellent adhesive performance, but exhibits an effect of suppressing radio wave interference when applied to electronic equipment or the like due to its low dielectric constant.

It is an object of the present invention to provide a low dielectric constant pressure-sensitive adhesive tape comprising a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the adhesive layer comprises an acrylic monomer mixture, a polymerization initiator, a solvent and a curing agent .

Further, the object of the present invention is to provide a low dielectric constant adhesive tape characterized by comprising a substrate layer and an adhesive layer formed on both sides of the substrate layer, wherein the adhesive layer comprises an acrylic monomer mixture, a polymerization initiator, a solvent and a curing agent As shown in FIG.

According to a preferred feature of the present invention, the base layer is made of polyethylene or polypropylene.

According to a more preferred feature of the present invention, the adhesive layer comprises 100 parts by weight of the acrylic monomer mixture, 0.1 to 0.5 parts by weight of a polymerization initiator, 10 to 200 parts by weight of a solvent, and 0.1 to 10 parts by weight of a curing agent.

According to a further preferred feature of the present invention, the acrylic monomer mixture comprises 100 parts by weight of an acrylic monomer and 1 to 3 parts by weight of a functional monomer.

According to a more preferred feature of the present invention, the acrylic monomer is at least one monomer selected from the group consisting of vinyl acrylate, ethyl acrylate, butyl acrylate, butyl methacrylate, hexyl acrylate, hexyl methacrylate, n-octyl acrylate, Selected from the group consisting of acrylate, isooctyl acrylate, isooctyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isononyl acrylate, isononyl methacrylate and cyclohexyl methacrylate It shall be made up of one or more.

According to a further preferred feature of the present invention, the functional monomer is selected from the group consisting of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxybutyl acrylate, hydroxypropyl acrylate, glycidyl methacrylate, hydroxyethyl methacrylate A hydroxyalkyl methacrylate, a hydroxyethyl methacrylate, a hydroxyethyl methacrylate, a hydroxyethyl methacrylate, a hydroxyethyl methacrylate, a hydroxyethyl methacrylate, a hydroxyethyl methacrylate and an arylamide.

According to a further preferred feature of the present invention, the curing agent is one selected from the group consisting of an epoxy resin, a melamine resin, a urea resin, a dialdehyde and a metal chelate compound.

INDUSTRIAL APPLICABILITY The low dielectric constant pressure-sensitive adhesive tape according to the present invention exhibits excellent adhesive performance, but exhibits an excellent effect of suppressing radio wave interference when applied to electronic equipment or the like because of its low dielectric constant.

1 is an exploded perspective view showing a low dielectric constant adhesive tape according to an embodiment of the present invention.
2 is an exploded perspective view showing a low dielectric constant adhesive tape according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention and physical properties of the respective components will be described in detail with reference to the accompanying drawings. However, the present invention is not limited thereto, And this does not mean that the technical idea and scope of the present invention are limited.

The low dielectric constant adhesive tape according to the present invention comprises a base layer 10 and an adhesive layer 20 formed on one surface of the base layer 10. The adhesive layer 20 is composed of an acrylic monomer mixture, And a curing agent.

The low dielectric constant adhesive tape according to the present invention comprises a base layer 10 and an adhesive layer 20 formed on both sides of the base layer 10. The adhesive layer 20 is composed of an acrylic monomer mixture, , A solvent and a curing agent.

The base layer 10 is a base layer of a low dielectric constant adhesive tape according to the present invention and is made of polyethylene or polypropylene. In the case of polyethylene or polypropylene as described above, a polyethylene terephthalate having a benzene ring in a chain structure The dielectric constant of the adhesive tape can be lowered by using polyethylene or polypropylene as the substrate layer.

At this time, the thickness of the base layer 20 may vary depending on the portion to which the adhesive tape is applied. Generally, the base layer 20 is preferably formed to a thickness of 10 to 30 탆, and most preferably 20 탆.

The adhesive layer 20 is formed on one side or both sides of the base layer 10. When the adhesive layer 20 is formed on one side of the base layer 10, the adhesive layer 20 is provided as a general adhesive tape, Is provided on both surfaces of the base layer 10, it is provided as a double-sided pressure-sensitive adhesive tape.

The pressure-sensitive adhesive layer 20 is composed of an acrylic monomer mixture, a polymerization initiator, a solvent and a curing agent, and comprises 100 parts by weight of an acrylic monomer mixture, 0.1 to 0.5 parts by weight of a polymerization initiator, 10 to 200 parts by weight of a solvent, Is preferable.

The acrylic monomer mixture is composed of 100 parts by weight of an acrylic monomer and 1 to 3 parts by weight of a functional monomer as a main component constituting the adhesive layer 20 and not only gives excellent adhesion performance to the adhesive layer 20, Low dielectric constant components are used to provide an adhesive tape with a low dielectric constant.

The acrylic monomer may be selected from the group consisting of vinyl acrylate, ethyl acrylate, butyl acrylate, butyl methacrylate, hexyl acrylate, hexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, Is at least one selected from the group consisting of isooctyl methacrylate, isooctyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isononyl acrylate, isononyl methacrylate and cyclohexyl methacrylate, It is preferable to use an acrylic ester monomer having a glass transition temperature in the range of -80 占 폚 to 30 占 폚 in consideration of adhesive strength.

The functional monomer may also be selected from the group consisting of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxybutyl acrylate, hydroxypropyl acrylate, glycidyl methacrylate, hydroxyethyl methacrylate, And arylamide. It is preferable to use 1 to 3 parts by weight of the acrylic monomer relative to the acrylic monomer so that the adhesive layer can realize a low dielectric constant.

If the content of the functional monomer is less than 1 part by weight, the degree of crosslinking of the pressure-sensitive adhesive layer 20 may be lowered to deteriorate the adhesive property. If the content of the functional monomer exceeds 3 parts by weight, Can be excessively improved.

Also, the polymerization initiator is contained in an amount of 0.1 to 0.5 parts by weight, and serves to polymerize the acrylic monomer mixture composed of the acrylic monomer and the functional monomer, and is preferably composed of lauryl peroxide.

The solvent is contained in an amount of 10 to 200 parts by weight and is at least one selected from the group consisting of toluene, ethyl acetate, cyclohexane, n-hexane, acetone, dimethyl carbonate, methanol, ethanol and isopropyl alcohol, If the content of the solvent is less than 10 parts by weight, the viscosity of the mixture constituting the pressure-sensitive adhesive layer becomes excessively high and the efficiency of the coating work process is deteriorated. When the content of the solvent exceeds 200 parts by weight, the content of the solid content decreases, Can be degraded.

The curing agent is contained in an amount of 0.1 to 10 parts by weight, and is composed of one selected from the group consisting of an epoxy resin, a melamine resin, a urea resin, a dialdehyde and a metal chelate compound. Normally, the isocyanate compound has a permittivity It is preferable to use the curing agent components listed above in order to make the dielectric constant of the adhesive layer 20 low.

If the content of the curing agent is less than 0.1 parts by weight, the pressure-sensitive adhesive layer 20 may coagulate and break under high temperature and high humidity conditions, and the durability reliability may deteriorate. If the content of the curing agent exceeds 10 parts by weight, .

As described above, the adhesive tape comprising the base layer 10 and the adhesive layer 20 is prepared by mixing 100 parts by weight of an acrylic monomer mixture, 0.1 to 0.5 parts by weight of a polymerization initiator, 10 to 200 parts by weight of a solvent and 0.1 to 10 parts by weight of a curing agent, Layer mixture is prepared, the mixture for adhesive layer is applied to a release paper having releasability, and the mixture is cured to form an adhesive layer (20).

At this time, the releasing paper may be formed of polyethylene terephthalate, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyurethane, polystyrene, polycarbonate, fluororesin, A resin film such as acetylcellulose, or one selected from the group consisting of a top-quality paper, a coated paper, a gloss paper, and a laminated paper.

The method of applying the releasing agent to the adhesive layer mixture may be a conventional method such as a bar coating method, a reverse roll coating method, a knife coating method, a roll knife coating method, a gravure coating method, a doctor blade coating method and a slot die coating method, It is preferable to apply the coating solution so as to have a thickness of 10 占 퐉 to 50 占 퐉 after being applied to the release paper and dried and cured.

After the above process, the release paper is removed to form the adhesive layer 20, and the adhesive layer is laminated on one side or both sides of the base layer 10 to provide a low dielectric constant adhesive tape.

Hereinafter, the properties of the low dielectric constant pressure sensitive adhesive tape manufactured through the method of manufacturing a low dielectric constant pressure sensitive adhesive tape and the method of manufacturing the same according to the present invention will be described with reference to examples.

≪ Example 1 >

45 parts by weight of 2-ethylhexyl acrylate, 45 parts by weight of butyl acrylate, 10 parts by weight of cyclohexyl methacrylate and 1.5 parts by weight of acrylic acid, and 0.3 part by weight of lauryl peroxide, which is a polymerization initiator, And 1 part by weight of an epoxy curing agent having a solids content of 2% was added thereto and cured to form a pressure-sensitive adhesive layer Layer mixture was prepared, and the resulting mixture for a pressure-sensitive adhesive layer was applied to a polyethylene terephthalate release paper to a thickness of 15 탆, followed by drying and curing. The pressure-sensitive adhesive layer formed by removing the release paper was coated on both sides of a polypropylene base layer To prepare a double-faced pressure-sensitive adhesive tape.

≪ Comparative Example 1 &

The procedure of Example 1 was repeated except that 6 parts by weight of acrylic acid was added to prepare a double-sided pressure-sensitive adhesive tape.

≪ Comparative Example 2 &

A double-faced pressure-sensitive adhesive tape was produced in the same manner as in Example 1 except that polyethylene terephthalate was used as a base layer.

≪ Comparative Example 3 &

Proceeding in the same manner as in Example 1, 0.35 parts by weight of an isocyanate curing agent having a solids content of 75% was added to prepare a double-sided pressure-sensitive adhesive tape.

The peel strength, permittivity and holding force of the double-faced pressure-sensitive adhesive tape prepared in Example 1 and Comparative Examples 1 to 3 were measured and shown in Table 1 below.

(Note that the peel strength was 180 占 peel strength, and 25 占 퐉 PET was laminated on one side of the double-faced pressure-sensitive adhesive tape prepared in Example 1 and Comparative Examples 1 to 3, and a measurement specimen having a width of 25 mm and a length of 250 mm was produced Five specimens were pressed on stainless steel stainless steel (SUS), polycarbonate (PC), and glass two times with 2 kg hand rollers. The specimens were allowed to stand at room temperature for 30 minutes, At a tensile rate of 300 mm / min.

The dielectric constant of the double-faced pressure-sensitive adhesive tapes prepared in Example 1 and Comparative Examples 1 to 3 was measured with a 40 mm diameter measuring specimen. Using a dielectric constant meter capable of measuring the dielectric constant of the thin film and multi- The Tandelta measurement values measured five times at the frequency of 800 MHz in the PROBE method are shown as an average.

In addition, the holding force was obtained by putting 25 m of PET on one side of the double-faced pressure-sensitive adhesive tape prepared in Example 1 and Comparative Examples 3 and 3, measuring 25 mm in width and 150 mm in length, A method of measuring the pushing distance of the tape by applying a load of 1 kg in an oven at 80 ° C after leaving the sample at room temperature for 30 minutes and pressing the sample prepared in the area of 25 mm twice by reciprocating twice with a hand roller Respectively.

<Table 1>

As shown in Table 1 above, the double-sided pressure-sensitive adhesive tapes prepared in Example 1 of the present invention had significantly lower dielectric constant than those of the double-sided pressure-sensitive adhesive tapes prepared in Comparative Examples 1 to 3, .

This is because, as described in the present invention, a structure in which a benzene ring-free material is used as a substrate layer, an epoxy curing agent which does not cause conjugation as a curing agent is used and a content of acrylic acid is lowered.

10; The substrate layer
20; Adhesive layer

Claims (8)

A base layer; And
And an adhesive layer formed on one surface of the substrate layer,
Wherein the pressure-sensitive adhesive layer comprises an acrylic monomer mixture, a polymerization initiator, a solvent, and a curing agent. A base layer; And
And an adhesive layer formed on both surfaces of the substrate layer,
Wherein the pressure-sensitive adhesive layer comprises an acrylic monomer mixture, a polymerization initiator, a solvent, and a curing agent. The method according to claim 1 or 2,
Wherein the base layer is made of polyethylene or polypropylene. The method according to claim 1 or 2,
Wherein the adhesive layer comprises 100 parts by weight of an acrylic monomer mixture, 0.1 to 0.5 parts by weight of a polymerization initiator, 10 to 200 parts by weight of a solvent, and 0.1 to 10 parts by weight of a curing agent. The method of claim 4,
Wherein the acrylic monomer mixture comprises 100 parts by weight of an acrylic monomer and 1 to 3 parts by weight of a functional monomer. The method of claim 5,
The acrylic monomers may be selected from the group consisting of vinyl acrylate, ethyl acrylate, butyl acrylate, butyl methacrylate, hexyl acrylate, hexyl methacrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, Wherein the polymer is at least one selected from the group consisting of methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isononyl acrylate, isononyl methacrylate and cyclohexyl methacrylate. Adhesive tape. The method of claim 5,
The functional monomer is selected from the group consisting of acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxybutyl acrylate, hydroxypropyl acrylate, glycidyl methacrylate, hydroxyethyl methacrylate, Amide. The low dielectric constant pressure-sensitive adhesive tape according to claim 1, The method of claim 4,
Wherein the curing agent is one selected from the group consisting of an epoxy resin, a melamine resin, a urea resin, a dialdehyde, and a metal chelate compound.

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