KR20190070104A - Apparatus for micro-phone and method for manufacturing the same - Google Patents

Abstract

According to an embodiment of the present invention, a microphone apparatus with improved sensitivity and a manufacturing method thereof are provided. The microphone apparatus comprises: a board reflecting light; and an optical fiber providing the light to the board and collecting the light reflected by the board. The board includes: an incident surface having a predetermined inclined angle on one surface and having the light provided from the optical fiber incident thereto; and an exit surface having a predetermined inclined angle on the one surface and exiting the light reflected by the incident surface to the optical fiber.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a microphone device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microphone, and more specifically, to an apparatus and a manufacturing method of a microphone through MEMS (Micro Electro Mechanical Systems) technology.

Microelectromechanical systems (MEMS) are generally referred to as technologies for designing, fabricating, and applying small parts and systems in micro units by fusing electronic (semiconductor) technology, mechanical technology, and optical technology. And is being applied to ultra-small machine technology.

BACKGROUND ART [0002] A MEMS-based capacitance-type microphone is widely used in a microphone which receives an acoustic wave or an ultrasonic wave and generates an electric signal according to the vibration.

In such a conventional capacitance type microphone, when an excessive negative pressure is introduced from the outside, collapse of the diaphragm occurs. In addition, a phenomenon that a diaphragm and a back plate are attached due to the influence of an electrostatic force which may occur in a device using a microphone such as a mobile phone occurs. Therefore, the sensitivity of the microphone is lowered and internal damage is caused.

In addition, in the conventional capacitive microphone, a diaphragm for sensing a capacitance change according to sound and a signal processing chip for processing a signal are separated from each other, so that the area occupies a large area, which results in an increase in size of the device. In addition, there is a problem that contamination sources such as dust penetrate into the sensing element and reliability is lowered.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a microphone device and a method of manufacturing a micro-sized microphone with reduced size through MEMS technology.

It is another object of the present invention to provide a microphone device and a method of manufacturing a micro-sized microphone with reduced size through a simplified process.

It is still another object of the present invention to provide a microphone device and a manufacturing method with improved sensitivity.

According to an aspect of the present invention, there is provided a microphone device including a substrate for reflecting light, and an optical fiber for supplying light to the substrate and collecting light reflected from the substrate, Wherein the substrate has a predetermined inclination angle on one surface thereof and has an incident surface on which the light provided from the optical fiber is incident and an exit surface that has a predetermined inclination angle on the one surface and emits the light reflected by the incident surface to the optical fiber .

In an embodiment, the substrate may be partitioned into an outer fixed region and a vibration region that is spaced inward of the fixed region and vibrates with respect to the fixed region.

In an embodiment, the substrate may be provided with a flat surface having no inclination in the vibration region.

In an embodiment, the optical fiber may be arranged to be perpendicular to the flat surface.

In an embodiment, the substrate may be provided with the incident surface and the emission surface in the vibration region.

In an embodiment, the substrate may be provided with the incident surface and the emission surface in the fixed region.

In an embodiment, the substrate may further include a connection portion connecting the vibration region separated from the fixed region and the fixed region.

The optical fiber may further include a guide unit coupled to the substrate and the optical fiber to fix the position of the optical fiber with respect to the substrate.

In an embodiment, the optical fiber can acquire a voice signal based on the collected light amount.

According to another aspect of the present invention, there is provided a method of manufacturing a microphone, the method including: providing a substrate for reflecting light; and coupling an optical fiber to the substrate, The step of providing includes the step of providing an incident surface on which light provided from the optical fiber is incident on one surface of the substrate and a step of providing an exit surface for emitting the reflected light from the incident surface.

In the embodiment, the step of providing the incidence surface and the step of providing the emergence surface may be provided with the incidence surface by at least one of anisotropic wet etching and dry etching.

In one embodiment, coupling the optical fiber to the substrate may couple the optical fiber to the substrate by fixing the position of the optical fiber relative to the substrate by a guide.

Effects of the microphone device and the manufacturing method according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, the microphone device can be miniaturized and reduced in size.

According to at least one of the embodiments of the present invention, a microphone device and a manufacturing method thereof can produce a miniature microphone having a reduced size through a simplified process.

According to at least one of the embodiments of the present invention, the microphone device can improve the sensitivity and provide excellent sound detection performance even in a large space.

1 is a view showing the principle of a microphone device according to an embodiment of the present invention.
2 is a cross-sectional view of a microphone device according to an embodiment of the present invention.
3 is a plan view of a microphone device according to an embodiment of the present invention.
FIG. 4 is a view showing specific examples of connection portions in the plane of the microphone device according to FIG. 3;
5 is a cross-sectional view of a microphone device according to another embodiment of the present invention.
6 is a plan view of a microphone device according to another embodiment of the present invention.
7 is a view illustrating a method of manufacturing a microphone device according to an embodiment of the present invention in accordance with a process order.
8 is a view showing a manufacturing method of a microphone device according to another embodiment of the present invention in accordance with a process order.
9 is a view illustrating a guide unit for fixing an optical fiber in a microphone device according to various embodiments of the present invention.
10 is a flowchart showing a method of manufacturing a microphone device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix "module" and " part "for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

The front face described in this specification is defined as a face contacting the voice signal, and the rear face can be defined and used as a face on which the optical fiber is located.

1 is a view showing the principle of a microphone device according to an embodiment of the present invention.

 1 (a), a microphone device according to an embodiment of the present invention may include a substrate 110, and an optical fiber 130.

The substrate 110 has a substrate capable of reflecting light, and can reflect light incident perpendicularly to the substrate 110. The substrate 110 may be formed of a wafer in which SiO ₂ and SOI layers are stacked, or may be formed of a material reflecting light.

Further, the substrate 110 can vibrate between the position A and the position B through the vibration of sound incident from the front side.

A structure for forming an inclined surface on both sides of the lower end of the substrate 110 may be provided and each inclined surface may be formed as an incident surface 120 and an exit surface 121. The structure forming the incident surface 120 and the exit surface 121 can reflect light and can downsize the size of the microphone.

The optical fiber 130 may be provided perpendicular to the substrate 110 and may provide light to the substrate 110 and collect light reflected from the substrate 110. To this end, the optical fiber 130 may include a light emitting portion 131 for providing light to the substrate 110 and a light receiving portion 132 for collecting light reflected from the substrate.

The light emitting portion 131 may provide light in a direction perpendicular to the substrate, and the provided light may be reflected by the incident surface 120. Finally, the light can be reflected by the emitting surface 121 in a direction perpendicular to the substrate 110 and collected by the light-receiving unit 132. [ The amount of light collected in this way can be converted into a voice signal.

1B can simplify the first reflected light 140a and the second reflected light 140b collected in the light receiving unit 132 of the optical fiber 130. [

1B shows the amount of light incident on the light receiving region 132a of the light receiving unit 132 when the substrate 110 is located at A, as shown in FIG. When the substrate 110 is positioned at A, it can be seen that most of the first reflected light 141a emitted by the emitting surface 121 is incident on the light receiving region 132a.

1B shows the amount of light incident on the optical fiber 130 when the substrate 110 vibrates and is located at B. As shown in FIG. When the substrate 110 is positioned at B, it can be confirmed that only a part of the second reflected light 141b is incident on the light receiving region 132a.

When the substrate 110 vibrates between the positions A and B according to the sound incident on the substrate 110, the amount of light collected by the light receiving unit 132 in the optical fiber 130 may vary. As a result, the optical fiber 130 can acquire a voice signal based on the collected light amount.

2 is a cross-sectional view of a microphone device according to an embodiment of the present invention.

Referring to FIG. 2, a substrate according to an embodiment of the present invention may include a flat surface 211, an incident surface 220, and an exit surface 221.

The substrate 110 illustrated in FIG. 1 does not include the incident surface 120 and the emission surface 121, but the substrate 210 of FIG. 2 has a flat surface 211, an incident surface 220, And a surface 221 is provided.

The substrate 210 may be partitioned into an outer fixed region S1 and an inner fixed region and into a vibration region S2 that vibrates with respect to the fixed region. Specifically, the outer fixed area S1 can be fixed in position irrespective of the sound. The vibration region S2 provided inside the fixed region S1 exists at a horizontal position A with respect to the fixed region S1 when no sound is incident and can oscillate between the position A and the position B when an acoustic is incident.

The flat surface 211 can be formed on all or a part of the vibration area S2 with a flat surface free from inclination. The flat surface 211 shown in Fig. 2 may be provided over the entire vibration area S2.

2, the light from the light emitting portion 231 of the optical fiber 230 is reflected by the incident surface 220 and the light reflected by the incident surface 220 is incident on the flat surface 211 have. The flat surface 211 reflects the incident light and provides the reflected light to the emitting surface 221 and the emitting surface 210 can emit the provided light to the light receiving portion 232 of the optical fiber 230.

The amount of light collected by the light receiving unit 232 by the flat surface 211 vibrating according to the incident sound differs between the first reflected light 241a and the second reflected light 241b as described with reference to FIG.

3 is a plan view of a microphone device according to an embodiment of the present invention.

3, the substrate 310 according to an embodiment of the present invention may include a flat surface 311, an incident surface 320, an exit surface 321, a connecting portion 350, and a sloped surface 360 have.

The incident surface 320, the exit surface 321, and the inclined surface 360 may be located in the fixed area S1.

For example, FIG. 3 may be provided as an exit surface 321 on the right side of the incident surface 320 on the left side. When the optical fiber rotates by 90 degrees, the incident surface 320 and the exit surface 321 may be provided in the form of an inclined surface 360 positioned at the upper and lower ends. Therefore, the incident surface 320 and the exit surface 321 may be located at the left and right and at the upper and lower ends.

The incident surface 320 and the emitting surface 321 may be formed in a shape having a predetermined angle through etching. The incident surface 320 and the emitting surface 321 having a constant inclination angle (54.7 DEG) can be formed through the ordinary wet etching (anisotropic) solution. Here, the etching method may include at least one of a wet etching (anisotropic) method using a commonly used KOH, TMAH solution or the like, an ion reactive etching method, and an ion beam etching method.

The flat surface 311 may be formed on all or a part of the vibration area S2 with a flat surface without inclination located in the vibration area S2. The flat surface 311 shown in Fig. 3 is an example of being located entirely in the vibration area S2. The flat surface 311 may be formed of a material capable of reflecting light and capable of emitting light incident through the incident surface 320 to the emission surface 321. In an embodiment of the present invention, the SOI wafer may be formed of a silicon material.

The connection portion 350 may serve to connect the vibration region S2 separated from the fixed region S1 and the fixed region S1. The distance in which the fixed region S1 and the vibration region S2 are spaced apart can be formed wider or narrower than the width shown in Fig. The connection portions 350 shown in FIG. 3 may exist in one or more than one and may not exist.

When the connecting portion 350 is not present, the flat surface 311 can vibrate and move on the incident sound. Connection

In addition, the shape of the connection part 350 may exist in various shapes such as a right angle shape and a negative shape.

FIG. 4 is a view showing specific examples of connection portions in the plane of the microphone device according to FIG. 3;

Referring to FIG. 4, the connecting portion (350 of FIG. 3) of the microphone device may include a first connecting portion 450a, a second connecting portion 450b, and a third connecting portion 450c.

The shape of the connecting portion 350 may include at least one of a right angle shape of the first connecting portion 450a, a - shape of the second connecting portion 450b, and a U shape of the third connecting portion 450c have. 3) may be formed as at least one or more than one and may connect the fixed region and the vibration region. Accordingly, the plurality of connection portions (350 of FIG. 3) may include a first connection portion 450a, a second connection portion 450b And the third connection part 450c.

5 is a cross-sectional view of a microphone device according to another embodiment of the present invention. The microphone device of Fig. 5 is the same as that of the microphone device of Figs. 2 to 4 except for the area where the incident surface and the emission surface are provided in the substrate, and thus a duplicate description will be omitted.

Referring to FIG. 5A, a substrate 510 according to another embodiment of the present invention may include a flat surface 511, an incident surface 520, and an exit surface 521. In Fig. 5A, the flat surface 511 is a flat surface without inclination, and may be provided at a part of the vibration area S2, specifically at the center in the vibration area S2.

5 may further include an incident surface 520 and an emission surface 521 on both sides of the flat surface 511. The vibration surface S2 shown in FIG.

5B illustrates the first reflected light 541a and the second reflected light 541b collected in the optical fiber 530 in a simplified manner. 5B illustrates the amount of light incident on the light receiving region 532a of the light receiving portion 532 in the optical fiber 530 when the substrate 510 is located at A. In this case, It can be seen that when the substrate 510 is located at A, the first reflected light 541a emitted by the exit surface 521 is provided as an area including the light receiving area 532a.

5B shows the intensity of light incident on the light receiving region 532a of the light receiving portion 532 in the optical fiber 530 when the substrate 510 vibrates and is located at B .

5 (a) and 5 (b), the light emitted from the light emitting portion 531 spreads as the traveling distance increases, so that the first reflected light 541a provided in the light receiving region 532a is reflected by the second reflected light 541b, that is, the density of light is large. As a result, the light receiving section 532 can receive the light quantity corresponding to the density of light.

When the substrate 510 vibrates between the position A and the position B according to the sound incident on the substrate 510, the amount of light collected by the light receiving unit 532 in the optical fiber 530 may change. As a result, the optical fiber 530 can acquire a voice signal based on the collected light amount.

6 is a plan view of a microphone device according to another embodiment of the present invention.

6, a substrate 610 according to another embodiment of the present invention includes a sloped surface 660, an emitting surface 621, and a connecting portion 650 including a flat surface 611 and an incident surface 620, . ≪ / RTI >

The inclined surface 660 is located in the vibration area S1 and may include an incident surface 620 and an exit surface 621. [ For example, the inclined surface 660 shown in FIG. 6 may be provided as an exit surface 621 on the right side of the incident surface 620 on the left side. The positions of the incident surface 620 and the emitting surface 621 can be changed, and they can be located at the left and right and at the upper and lower ends.

The flat surface 611 may be formed on all or a part of the vibration area S2 with a flat surface in which no inclination is present in the vibration area S2. The flat surface 611 shown in Fig. 6 is located at the center (a part) of the vibration area S2. The flat surface 611 may be formed of a material capable of reflecting light and capable of emitting light incident through the incident surface 620 to the emission surface 621. In an embodiment of the present invention, the SOI wafer may be formed of a silicon material.

The incident surface 620, the emitting surface 621, and the connecting portion 650 have the same configurations as those of FIG. 3, and the detailed description is omitted.

7 is a view illustrating a manufacturing method according to a process sequence of a microphone device according to an embodiment of the present invention.

7, the manufacturing process of the microphone device according to an exemplary embodiment of the present invention includes steps of providing a substrate 710, etching one surface of the substrate, etching one surface of the substrate to form an incidence surface 720, Providing the surface 721, and removing the intermediate sacrificial layer 770.

The components used in the manufacturing process of Fig. 7 can be described in more detail with reference to Figs. 2 and 3. Fig.

FIG. 7A is a view showing the step of providing the substrate 710. FIG. The substrate 710 may be formed of a wafer in which SiO2 and SOI layers are stacked.

7B is a view showing a step of etching one surface of the substrate 710. FIG. One surface of the substrate, that is, a part of the front surface, may be etched as much as the thickness of the substrate to be manufactured.

Here, the etching method may include at least one of a wet etching (anisotropic) method using a commonly used KOH, TMAH solution, etc., a dry etching, an ion reaction etching method, and a ion beam etching method.

7 (c) is a view showing a step of etching the other surface of the substrate 710. The other side of the substrate, i.e., a portion of the backside, may be etched by the thickness d of the substrate 710.

Here, the etching method can be provided with the incident surface 720 and the emission surface 721 by at least one of wet etching (anisotropic) and dry etching using KOH, TMAH solution or the like. Specifically, when anisotropic etching is used, the rear surface of the substrate 710 may be provided in a shape having an inclination angle of 54.7 degrees.

7D is a view showing the step of removing the intermediate sacrificial layer 770 from the substrate. The intermediate sacrificial layer 770 may be formed of an oxide film, and is preferably performed using a SiO ₂ film. Since the SiO ₂ thin film does not react with KOH and TMAH which etch the wafer, it can sufficiently function as an oxide film even in a long process.

As a result, the upper portion of the substrate 710 may have a shape in which the vibration region of the substrate is floating in the air, so that the upper portion of the substrate 710 can be coupled to the connection portion 750 on both sides, and the flat surface 711, can do.

8 is a view showing a manufacturing method of a microphone device according to another embodiment of the present invention in accordance with a process order.

8, the manufacturing process of the microphone device according to another embodiment of the present invention includes steps of providing a substrate 810, etching a front surface of the substrate, etching the rear surface of the substrate to form an incident surface 820, Providing the surface 821 and removing the intermediate sacrificial layer 870.

The components used in the manufacturing process of Fig. 8 can be described in more detail with reference to Figs. 5 and 6. Fig.

8A is a view showing a step of providing the substrate 810. FIG. The substrate 810 may be formed of a wafer in which SiO2 and SOI layers are stacked.

8B is a view showing a step of etching one surface of the substrate 810. FIG. One surface of the substrate, that is, a part of the front surface, may be etched as much as the thickness of the substrate to be manufactured.

Here, the etching method may include at least one of a wet etching (anisotropic) method using a commonly used KOH, TMAH solution, etc., a dry etching, an ion reaction etching method, and a ion beam etching method.

8 (c) is a view showing a step of etching the other surface of the substrate 810. The other side of the substrate, that is, a portion of the backside, may be etched by the thickness d of the substrate 810. The thickness of the substrate 810 may be adjusted according to the amount of light of the first reflected light 541a and the second reflected light 541b of FIG.

Here, the incident surface 820 and the emitting surface 821 can be provided by at least one of wet etching (anisotropic) and dry etching using KOH, TMAH solution, or the like. Specifically, when anisotropic etching is used, the rear surface may be provided in a shape having an inclination angle of 54.7 DEG.

8D is a view showing the step of removing the intermediate sacrificial layer 870 from the substrate. The intermediate sacrificial layer 870 may be formed of an oxide film, and is preferably performed using a SiO ₂ film. The SiO2 thin film does not react with KOH, TMAH, or the like, which etches the wafer, so that it can sufficiently function as an oxide film even in a long process.

As a result, the upper portion of the substrate 810 becomes a shape in which the vibration region of the substrate floats in the air, and can be coupled to the connection portions 650 on both sides. 8, the vibration region of the substrate 810 may be formed to include the flat surface 811, the incident surface 820, and the exit surface 821. [

9 is a view illustrating a guide unit for fixing an optical fiber in a microphone device according to various embodiments of the present invention.

9, the microphone device according to various embodiments of the present invention may include a substrate 910, a first guide portion 960, and a second guide portion 961 of an optical fiber 930.

 The substrate 910 and the optical fiber 930 of FIG. 9 can be implemented in various embodiments of FIGS. 2 to 6, and redundant description is omitted.

The first guide portion 960 and the second guide portion 961 may be formed to fix the position of the optical fiber 930 with respect to the substrate 910. Since the optical fiber 930 of the present invention is formed perpendicular to the substrate 910, the first guide portion 960 and the second guide portion 961 are respectively disposed on the optical fiber 930 The optical fiber 930 may be coupled to the optical fiber 930 so as to surround both sides of the optical fiber 930. The first guide portion 960 and the second guide portion 961 may be coupled to the lower portion of the substrate 910 in a coupled state.

10 is a flowchart showing a manufacturing process of a microphone device according to an embodiment of the present invention.

Referring to FIG. 10, a method of manufacturing a microphone device according to an embodiment of the present invention includes the steps of (S1000) etching an entire surface of a substrate to form an incident surface and an exit surface, dividing the substrate into a fixed region and a vibration region (S1010) and combining the optical fibers (S1020). The description of FIG. 10 can be more fully explained with reference to FIGS. 7 to 9. FIG.

Step S1000 of etching the first surface of the substrate to form an incident surface and an emission surface may specifically describe the step of providing the substrates 710 and 810 for reflecting light. In the step of providing the substrates 710 and 810, incident surfaces 720 and 820 on which light provided from the optical fiber is incident and incident light 720 and 820 on the one surface of the substrates 710 and 810, And providing the surfaces 721 and 821.

In addition, the step of providing the incident surface and the emitting surface (S1000) may be provided by at least one of an anisotropic wet etching method and a dry etching method.

Step S1010 of dividing the substrates 710 and 810 into a fixed region and a vibration region can divide the substrates 710 and 810 etched in S1000 into vibration regions oscillating with reference to a fixed region and a fixed region outside .

Specifically, in the substrate 310 of FIG. 3, the fixed region includes the inclined plane 360, and the vibration region may include the flat plane 311. In addition, in the substrate 610 of FIG. 6, the vibration region may include a flat surface 611 and an inclined surface 660.

The step of joining the optical fibers (S1020) can position and join the optical fibers on one side of the substrate 710, 810. The optical fiber 930 is fixed in position by the guide portions 980 and 981, and thus the optical fiber 930 can be coupled to the substrate 910.

More specifically, the optical fiber 930 of the present invention is positioned perpendicular to the substrate 910, and the guide portions 980 and 981 can be coupled to the substrate 910 such that the optical fiber 930 is vertically positioned. have.

Accordingly, the microphone device and the manufacturing method of the present invention can manufacture a micro-sized microphone with a reduced size by providing an optical fiber in a direction perpendicular to the substrate, produce a miniature microphone with reduced size through a simplified process, .

The foregoing detailed description should not be construed in any way as being restrictive and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (12)

A substrate for reflecting light; And
And an optical fiber for providing light to the substrate and collecting light reflected from the substrate,
Wherein:
An incidence surface having a predetermined inclination angle on one surface thereof and on which the light provided from the optical fiber is incident; And
And an exit surface having a predetermined inclination angle on the one surface and outputting the light reflected by the incident surface to the optical fiber.
The method according to claim 1,
Wherein:
And a vibration region which is spaced apart from the fixed region and is located inside the fixed region and vibrates with respect to the fixed region.
3. The method of claim 2,
Wherein:
Wherein a flat surface having no inclination in the vibration area is provided.
The method of claim 3,
The optical fiber includes:
And is perpendicular to the flat surface.
The method of claim 3,
Wherein:
And the incident surface and the emission surface are provided in the vibration region.
The method of claim 3,
Wherein:
Wherein the incident surface and the emission surface are provided in the fixed region.
The method according to claim 1,
Wherein:
And a connection portion connecting the fixed region and the vibration region spaced apart from the fixed region.
The method according to claim 1,
Further comprising: a guide portion coupled to the substrate and the optical fiber to fix the position of the optical fiber relative to the substrate.
The method according to claim 1,
The optical fiber includes:
And acquires a voice signal based on the collected light amount.
Providing a substrate for reflecting light; And
And coupling an optical fiber to the substrate,
The step of providing the substrate may include:
Providing an incident surface through which light from the optical fiber is incident on one surface of the substrate; And
And providing an emission surface for emitting the light reflected from the incident surface.
10. The method of claim 9,
Wherein the step of providing the incident surface and the step of providing the emitting surface comprise:
Wherein the incidence plane is provided by at least one of anisotropic wet etching and dry etching.
The method according to claim 1,
Wherein coupling the optical fiber to the substrate comprises:
And fixing the position of the optical fiber with respect to the substrate by a guide portion, thereby coupling the optical fiber to the substrate.

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