KR20190053332A - Different material joint body and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a heterogeneous material assembly, which has excellent bonding force between heterogeneous materials, and a manufacturing method thereof. The heterogeneous material assembly of the present invention comprises: a metal layer including a protrusion and a flat surface; a first resin layer provided on the flat surface of the metal layer; and a second resin layer provided on the metal layer and the first resin layer.

Description

TECHNICAL FIELD [0001] The present invention relates to a bonded material of heterogeneous materials and a method of manufacturing the same.

The present invention relates to a heterogeneous material conjugate and a method of manufacturing the same.

Generally, joining between different materials such as metal and resin is not easy because the physical and chemical characteristics inherent to each material and the surface state are different.

Techniques that can be attempted for joining such disparate materials include bonding using adhesives, mechanical fastening, welding, and insert injection. Among them, the method of using an adhesive is advantageous in that it is simple to use, and therefore, it is most widely used in a representative and classic method used for bonding different materials in electronic products.

Processes using adhesives or mechanical fasteners have made it possible to bond dissimilar materials in a relatively easy way, but the joints are exposed on the exterior.

In order to solve the above problems, there has been proposed a method of forming a pattern of a specific shape on a surface of a metal material to bond the dissimilar materials to improve the bonding force, but the effect of improving the bonding force is insufficient.

Therefore, there is a need for research on a method for improving the bonding force between different kinds of materials without using the relatively simple process but without revealing the joints to the outside.

Korean Patent Registration No. 10-1499665

The present invention provides a heterogeneous material conjugate and a method for producing the same.

It should be understood, however, that the present invention is not limited to the above-mentioned problems and other problems which are not mentioned can be understood by those skilled in the art from the following description.

According to an embodiment of the present invention, there is provided a semiconductor device comprising: a metal layer including at least two etching grooves, a projection provided adjacent to the etching groove, and a flat surface; A first resin layer provided on a flat surface of the metal layer and having a light reflectance of 10% or less at any wavelength of 840 nm to 1064 nm; And a second resin layer provided on the metal layer and the first resin layer, wherein the second resin layer is filled in the etching groove, between the surface of the metal layer and the protrusion, and is fixed to the metal layer, to provide.

Another embodiment of the present invention provides a method of manufacturing the heterogeneous material conjugate.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a metal layer having a first resin layer on one surface; A metal layer etching step of irradiating a surface of the metal layer having the first resin layer with a first laser to form an etching groove and a protrusion on one surface of the metal layer; And providing a second resin layer on one side of the etched metal layer, and then joining the metal layer and the second resin layer by irradiating a second laser to the method of manufacturing the dissimilar material bonded body .

The dissimilar materials bonded body according to one embodiment of the present invention has an advantage of excellent bonding strength between dissimilar materials having different physical properties.

The method of manufacturing a hetero-material bonded body according to an embodiment of the present invention has an advantage of minimizing the loss of laser energy generated in the process of bonding different materials using laser.

According to one embodiment of the present invention, there is an advantage in that the bonding strength between different materials can be improved by a simple method.

1 is a schematic view of a side surface and a surface of a metal layer provided with a first resin layer according to an embodiment of the present invention.
2 is a schematic view of a metal layer etching step according to an embodiment of the present invention.
FIG. 3 is a schematic view of a method of manufacturing a heterogeneous material joined body according to an embodiment of the present invention.
4 is an image of a cross section of a metal layer provided with the first resin layer of Example 1 by scanning electron microscope.
5 is an image of a section of the metal layer provided with the first resin layer of Comparative Example 1 taken by a scanning electron microscope.

In this specification, when a part is referred to as " including " an element, it is to be understood that it may include other elements as well, without departing from the other elements unless specifically stated otherwise.

In the present specification, when an element is referred to as being " equipped " with a certain element, it is not formed through a special or limited method, but may be located or provided on any element.

In the present specification, the thickness of the member is measured in comparison with a corresponding scale in an image of a scanning electron microscope (SEM; Scanning Electron Microscope S-4800, HITACHI) on the side of the member or by using a thickness gauge It can be measured.

In the present specification, the light reflectance may be a light reflectance at a specific wavelength measured using a Shidadzu Spolid 3700 instrument.

The inventors of the present invention have found that there is a problem that energy of a laser transmitted through a resin is reflected and lost on the surface of a metal in the process of joining a conventional dissimilar material, specifically, a metal and a resin by using a laser, The present inventors have made intensive studies to solve these problems and have come to the present invention.

In order to overcome the problem that the laser energy is not effectively transferred by the metal layer having a high light reflectivity when the metal and the resin are bonded by laser, the inventors of the present invention have found that, between the metal layer to be bonded and the resin layer, ≪ / RTI > Accordingly, when the laser beam is applied to bond the metal layer and the resin layer to be bonded, an additional resin layer having a high light absorptivity can effectively absorb the laser energy and effectively melt the resin layer, thereby increasing the bonding force between the metal and the resin The present invention has been developed as follows.

Hereinafter, the present invention will be described in more detail.

According to an embodiment of the present invention, there is provided a semiconductor device comprising: a metal layer including at least two etching grooves, a projection provided adjacent to the etching groove, and a flat surface; A first resin layer provided on a flat surface of the metal layer and having a light reflectance of 10% or less at any wavelength of 840 nm to 1064 nm; And a second resin layer provided on the metal layer and the first resin layer, wherein the second resin layer is filled in the etching groove, between the surface of the metal layer and the protrusion, and is fixed to the metal layer, to provide.

According to an embodiment of the present invention, the metal layer may include two or more etching grooves, protrusions provided adjacent to the etching grooves, and a flat surface on one surface.

According to an embodiment of the present invention, the metal layer is made of a pure metal such as aluminum (Al), titanium (Ti), or zinc (Zn); And an alloy such as stainless steel (STS). However, the present invention is not limited thereto, and it can be freely selected from among those known in the art if it is easy to process by laser irradiation and has high thermal conductivity.

As used herein, the term " Thermal Conductivity " may mean a property that indicates the ability of a substance to transfer heat by conduction.

According to one embodiment of the present invention, the shape of the metal layer can be applied without particular limitation as long as it can be laser-etched and can be smoothly bonded to the resin. For example, Cylindrical, polyhedral, or the like.

In this specification, the etching groove may be a groove region formed in the metal layer through etching according to laser irradiation as described below, and etched in the metal layer. The etch grooves may be continuous or discontinuous, and may be provided in the form of a continuous line, for example.

In this specification, the flat surface may mean an area other than the area where the etching grooves and protrusions are formed on one surface of the metal layer, and specifically, the area where the surface of the metal layer is not deformed by etching.

The metal layer may include protrusions adjacent to the etch grooves, and the protrusions may be formed on one surface of the metal layer. Further, the protrusions may be continuously connected or partially discontinuously along the direction of the etching groove. Specifically, the protruding portion may be a burr formed by the residues of the metal layer that are formed when the etching trench is formed, adjacent to the etching trench and protruding outward and agglomerated.

According to an embodiment of the present invention, the projection may be provided in a direction away from the etching groove. Specifically, the protrusion may be provided on the surface of the metal layer adjacent to the etch groove, or may protrude in a direction away from the etch groove.

According to an embodiment of the present invention, when the etching grooves are formed in two or more continuous lines on the metal layer, the protrusions may be provided on the metal layer in a direction away from the etching grooves formed by the continuous lines. When the etching grooves formed in the continuous lines are provided in the directions parallel to each other, the protrusions may be formed to face each other in a manner to surround the flat surface provided between the etching grooves. In this case, the first resin layer can be more firmly fixed to the metal layer when the second resin layer and the metal layer are joined using a laser.

According to one embodiment of the present invention, one end of the projection may be provided in a direction away from the etching groove, specifically, in a direction away from the center axis of the etching groove. At the same time, the other end of the protrusion may be provided in the direction of the center axis of the etching groove, which is opposite to the one end of the protrusion. Accordingly, the other end of the projection provided in the center axis direction of the etching groove can form an inlet of the etching groove.

According to an embodiment of the present invention, the protrusion may be formed at an acute angle with respect to the surface of the metal layer. Specifically, the angle formed between the protruding portion provided in a direction away from the etching groove and the surface of the metal layer may be an acute angle.

That is, the protrusion may be provided in a direction away from the etching groove, and the protrusion may be formed at an acute angle with the surface of the metal layer. Specifically, the angle formed by the protrusion and the extension line of the surface of the metal layer may be an acute angle.

According to an embodiment of the present invention, the angle formed between the protruding portion and the surface of the metal layer is 30 to 80, 30 to 70, 35 to 80, 35 to 70, 60 degrees or less, 40 degrees or more and 70 degrees or less, or 40 degrees or more and 60 degrees or less.

Within this range, a second resin layer, which is melted in accordance with the second laser irradiation described below, can be sufficiently filled in the etch groove and between the protrusions. Accordingly, since the second resin layer can be fixed to the metal layer with a sufficient bonding force, the bonding strength of the metal layer to the second resin layer can be improved.

The length from one end to the other end of the projecting portion is not less than 25 占 퐉 and not more than 80 占 퐉, not less than 25 占 퐉 nor more than 70 占 퐉, not less than 30 占 퐉 nor more than 80 占 퐉, not less than 30 占 퐉 nor more than 70 占 퐉, Mu m or more and 70 mu m or less, or 35 mu m or more and 50 mu m or less.

According to an embodiment of the present invention, the height of the protrusion is not less than 30 占 퐉 and not more than 100 占 퐉, not less than 30 占 퐉 nor more than 90 占 퐉, not less than 40 占 퐉 nor more than 100 占 퐉, not less than 40 占 퐉 nor more than 90 占 퐉, 50 mu m or more and 90 mu m or less, or 50 mu m or more and 80 mu m or less.

The second resin layer is sufficiently fixed to the groove and the protrusion of the metal layer when the angle between the protrusion and the surface of the metal layer, the length of the protrusion, and the height of the protrusion are within the above range, The bonding force can be greatly improved.

In this specification, the height of the protrusion may mean the length of a vertical line extending from the one end end point not adjacent to the surface of the metal layer of the protrusion to the surface of the metal layer.

According to an embodiment of the present invention, the progress direction of one etching groove and the progress direction of another etching groove may be parallel or intersect. In addition, when the direction of the one etching groove intersects with the direction of the other etching groove, they may intersect at right angles or at right angles.

According to an embodiment of the present invention, when the progress direction of one etching groove intersects with the progress direction of another etching groove, a region surrounded by the etching groove on the flat surface of the metal layer, specifically, Can be formed.

According to an embodiment of the present invention, the etch groove may be formed in two or more continuous lines on the metal layer, and the two or more continuous lines may form a pattern on the metal layer. Specifically, the etching groove may be formed as two or more pattern lines on the metal layer, and the flat surface on the metal layer may be divided into the pattern lines. The pattern may be a rule or an irregular pattern. Specifically, the pattern may be a mesh pattern including a triangular, square, or honeycomb pattern unit. In this case, the protrusion may be provided in the form of a fence surrounding the pattern unit .

In this specification, the term " advancing direction of the etching groove " may mean a direction in which the etching groove is continuously provided on the surface of the metal layer.

According to an embodiment of the present invention, the ratio of the etching groove depth to the etching groove entrance width may be 1: 3 to 1: 14, specifically 1: 3 to 1: 13.

In this specification, the entrance width of the etching groove may mean a length from one end to the other end in a portion corresponding to the surface of the metal layer of the etching groove.

In this specification, the depth of the etching groove may mean the length of a vertical line extending from the lowest point of the etching groove to the etching groove entrance.

According to one embodiment of the present invention, the width of the etching groove inlet may be 10 탆 or more and 25 탆 or less, or 10 탆 or more and 20 탆 or less. The depth of the etching groove may be 50 탆 or more and 250 탆 or less, 50 탆 or more and 240 탆 or less, 60 탆 or more and 250 탆 or less, or 60 탆 or more and 240 탆 or less.

Within the above range, the second resin layer is sufficiently fixed to the etching trenches and the protrusions of the metal layer, so that the bonding force between the metal layer and the second resin layer can be greatly improved.

According to an embodiment of the present invention, the ratio of the etching groove intermediate width to the etching groove entrance width may be 1: 1.3 to 1: 3.

Furthermore, according to an embodiment of the present invention, the intermediate width of the etching groove may be 15 탆 or more and 30 탆 or less, or 20 탆 or more and 30 탆 or less.

Within this range, the area of contact with the metal in the etched groove of the second resin layer melted by the second laser irradiation, which will be described below, can be maximized, so that the area between the metal layer and the second resin layer Can be improved.

In this specification, the etching groove intermediate width may mean a length of an imaginary line segment running in a direction parallel to the surface of the metal layer at a point where the depth of the etching groove is half.

According to an embodiment of the present invention, the distance between the center axes of the etching grooves is 50 占 퐉 to 1,000 占 퐉, 50 占 퐉 to 800 占 퐉, 80 占 퐉 to 1,000 占 퐉, 80 占 퐉 to 800 占 퐉, Mu m or less, 100 mu m or more and 500 mu m or less, 80 mu m or more and 250 mu m or less, or 100 mu m or more and 250 mu m or less.

If the thickness is within the above range, two or more protrusions facing each other may be in contact with each other, thereby preventing the second resin layer, which is melted according to the second laser irradiation described below, from being supplied onto the flat surface of the metal layer. In addition, within the above range, the bonding area between the metal layer and the first and second resin layers can be maximized and the bonding force between them can be greatly improved.

In this specification, the distance between the center axes of the etching grooves may mean the distance between adjacent pattern lines in parallel when the etching grooves form a continuous line, that is, a pattern line, on the metal layer.

According to an embodiment of the present invention, the dissimilar material joined body may include a first resin layer provided on a flat surface of the metal layer.

Since the first resin layer is provided on the flat surface of the metal layer, laser energy reflection of the metal layer can be prevented during the process of joining the metal layer with the second resin layer according to laser irradiation as described below. The loss of the supplied laser energy can be prevented.

Specifically, the etching grooves and protrusions are formed, and the metal layer before the first resin layer is provided may have a light reflectance of at least 20% at a wavelength of 915 nm. This may mean that at least 20% of the irradiated second laser beam is not transmitted to the metal layer and is reflected in the course of bonding the metal layer and the second resin layer by irradiating the second laser described below.

Meanwhile, according to an embodiment of the present invention, the light reflectance of the first resin layer at any wavelength of 840 nm to 1064 nm may be 10% or less. Specifically, the light reflectance of the first resin layer at a wavelength of 915 nm may be 10% or less.

The light having a wavelength of 840 nm to 1064 nm may be in a wavelength range of the laser for forming the heterogeneous material conjugate. The laser wavelength may be appropriately selected according to the material to be applied, and the light reflectance and the light absorption rate may be reflectance and absorption rate for laser light, respectively.

Wherein the dissimilar material bonded body includes a first resin layer having a relatively low light reflectance as compared to the metal layer so that when bonding the metal layer and the second resin layer using a laser, The bonding of the resin layer can be performed smoothly. Specifically, when the dissimilar material bonded body includes the first resin layer on the flat surface of the metal layer, the second laser irradiated to bond the metal layer and the second resin layer is not reflected from the metal layer, It can be absorbed in the first resin layer. Further, the laser energy absorbed in the first resin layer is transferred to the metal layer to generate heat energy effectively, so that the first resin layer and the second resin layer can be sufficiently melted and fixed to the metal layer . That is, the first resin layer and the second resin layer are sufficiently melted and can be sufficiently fixed to the etching grooves and / or protrusions of the metal layer by the low light reflectance of the first resin layer.

In this specification, the term light reflectance may mean that the amount of light reflected with respect to the irradiated light amount is expressed as a percentage.

According to an embodiment of the present invention, the first resin layer may be provided on the flat surface of the metal layer. Specifically, the first resin layer may be provided in an area excluding the etching grooves and the protrusions on the metal layer.

According to an embodiment of the present invention, when the etching grooves are provided in at least two pattern lines on the metal layer, and the flat surface is a pattern unit body partitioned by the pattern lines, On the flat surface. In this case, the first resin layer may be formed in a shape surrounded by the protrusions.

According to an embodiment of the present invention, the thickness of the first resin layer may be 10 μm or more and 50 μm or less, 10 μm or more and 40 μm or less, 20 μm or more and 50 μm or less, or 20 μm or more and 40 μm or less.

Within the above range, the first resin layer can sufficiently transfer the laser energy irradiated in the manufacturing process of the dissimilar material joined body to the metal layer. Accordingly, the first resin layer and / or the second resin layer can be sufficiently melted during the second laser irradiation for the metal layer bonding with the second resin layer, and the first resin layer and / It can be sufficiently filled. Accordingly, the bonding force between the metal layer and the second resin layer can be greatly improved.

Specifically, when the thickness of the metal layer is less than the above range, the metal layer may fail to reflect the laser for bonding with the second resin layer. If the range is exceeded, The molten second resin layer may not be smoothly supplied by laser irradiation, so that the metal layer may not be smoothly bonded to the second resin layer.

According to an embodiment of the present invention, the first resin layer may be formed on a flat surface of the metal layer using a general coating method such as a spray coating method, a spin coating method, or the like. Preferably, the first resin layer may be provided on the flat surface through an electrodeposition method in order to improve a bonding strength between the metal layer and the first resin layer.

According to one embodiment of the present invention, the first resin layer may include a cationic resin and a colorant. Specifically, by including the cationic resin and the colorant in the first resin layer, the reflectance in the above-mentioned range can be realized.

According to an embodiment of the present invention, the first resin layer includes a cationic resin, so that the first resin layer can be provided with a sufficient bonding force on the metal layer through the electrodeposition method.

Accordingly, the energy of the second laser irradiated on the first resin layer can be efficiently transferred to the metal layer, and by the thermal energy generated in the metal layer to which the transferred laser energy is transmitted, The layer is sufficiently melted and the second resin layer can be sufficiently fixed to the metal layer.

According to one embodiment of the present invention, the cationic resin may include a resin containing a polar functional group. Specifically, the polar functional group-containing resin may mean a resin to which at least one polar functional group is bonded.

According to one embodiment of the present invention, the polar functional group may include at least one of a hydroxyl group (-OH) and a carboxyl group (-COOH), but is not limited thereto.

According to one embodiment of the present invention, the cationic resin may include at least one of a polar functional group-containing epoxy resin, a polar functional group-containing melamine resin and a polar functional group-containing urethane resin, And may be freely selected from among those that can be used, and are not particularly limited.

According to one embodiment of the present invention, the first resin layer includes the colorant so that the energy of the second laser irradiated on the metal layer side for bonding with the second resin layer is not reflected, Can be absorbed.

On the other hand, when the colorant is not included, the second laser as described below may be transmitted as it is, and the energy of the transmitted laser may be reflected and not sufficiently transmitted to the metal layer.

According to one embodiment of the present invention, the coloring agent may include a pigment.

In the present specification, the pigment may mean a coloring agent in powder form in solid phase which is insoluble in water and / or an organic solvent.

According to one embodiment of the present invention, the pigment may include at least one of an inorganic pigment and an organic pigment.

According to one embodiment of the present invention, the inorganic pigment may include a coloring pigment, an extender pigment, an anticorrosive pigment and the like. However, the material may be freely selected from among inorganic materials that are not decomposed by the second laser as described below and can absorb the energy of the second laser and transmit it to the metal layer, and are not particularly limited.

According to one embodiment of the present invention, the coloring pigment may include, but not limited to, carbon black, spinach, and the like.

According to one embodiment of the present invention, the extender pigment may include, but is not limited to, kaolin, talc, aluminum silicate, calcium carbonate, mica and clay.

According to one embodiment of the present invention, the anticorrosive pigment is selected from the group consisting of zinc phosphate, iron phosphate, aluminum phosphate, calcium phosphate, zinc phosphite, zinc cyanide, zinc oxide, aluminum triphosphate, zinc molybdate, aluminum molybdate Calcium, aluminum aluminum phosphomolybdate, zinc aluminum aluminum phosphite, and the like, but is not limited thereto.

According to one embodiment of the present invention, the organic pigment includes at least one of an azo pigment, a phthalocyanine pigment, a rake pigment, a thioindigo pigment, a perinone pigment, a quinacridone pigment and a quinaphthalone pigment But is not limited thereto.

Fig. 1 is a schematic view of a side surface A and a surface B of a metal layer provided with an etching groove, a projection, a flat surface and a first resin layer according to an embodiment of the present invention.

1 (A), an etching groove 10 may be formed on the surface of the metal layer, protrusions 20a and 20b may be provided adjacent to the etching groove 10, .

The protrusions 20a and 20b may be formed as a part of the metal layer uplifted from the surface of the metal layer. The protrusions may protrude in a direction away from the etch groove . Furthermore, a first resin layer 31 may be provided between the protruding portions 20b and 20c facing each other and on the flat surface 30 of the metal layer.

Specifically, a protrusion 20b adjacent to the one etching groove 10 and a protrusion 20c adjacent to the other etching groove are formed on the surface of the metal layer so as to face each other And the first resin layer 31 may be provided on the flat surface 30 of the metal layer, between the protrusions provided opposite to each other.

1 (B), the direction X of the one etching groove 10 and the direction Y of the other etching groove 10 intersect at right angles, A mesh pattern can be formed. The protrusions 20 may be provided in a direction away from the etch grooves and may be provided continuously along the proceeding directions X and Y of the etch grooves 10.

In addition, the region surrounded by the protrusion 20 may be formed in a square or rectangular shape, and the first resin layer 31 may be provided on the flat surface 30 of the metal layer. When a mesh pattern is formed on the surface of the metal layer by the etching grooves and the first resin layer is provided on the flat surface defined by the etching grooves as described above, In the process of bonding the two resin layers, the reflection of the second laser energy on the surface of the metal layer is minimized, so that the bonding of the metal layer and the second resin layer can proceed smoothly.

The dissimilar material bonded body including the metal layer on which the lattice-structured line pattern is formed has adhesion strength between the metal layer and the second resin layer as well as airtightness and airtightness Watertightness) can be realized.

In the present specification, the term " airtightness " may mean that the metal layer and the second resin layer are bonded without forming pores.

Specifically, the airtightness can be confirmed by measuring the pressure loss under a certain period of time and under pneumatic pressure. For example, if the heterogeneous material conjugate with the metal layer and the second resin layer is prepared and the internal pressure of the heterogeneous material conjugate measured for 30 seconds at a pneumatic pressure of 30.52 PSIG (2 bar) is less than 0.057 PSIG, Confidentiality can be judged as secured.

According to an embodiment of the present invention, the dissimilar material joined body may further include an auxiliary metal layer.

In addition, when the dissimilar material bonded body further includes an auxiliary metal layer, the auxiliary metal layer may be provided between the metal layer and the first resin layer.

According to one embodiment of the present invention, the dissimilar material bonded body includes a metal layer, an auxiliary metal layer provided on one surface of the metal layer, a first resin layer provided on one surface of the auxiliary metal layer, And a second resin layer provided on the first resin layer.

According to an embodiment of the present invention, the dissimilar material joined body further includes the auxiliary metal layer, so that the bonding force between the metal layer and the first resin layer can be improved. In order to prevent separation of the metal layer and the first resin layer, an auxiliary metal layer having an excellent bonding strength with each of the metal layer and the first resin layer may be provided so that the metal layer of the dissimilar metal bonding body and the first / Can be improved.

The auxiliary metal layer may include a metal and / or an alloy of the same or different type as the metal layer. The auxiliary metal layer may be patterned easily by laser irradiation, and the kind thereof is not particularly limited as long as the thermal conductivity is excellent.

According to an embodiment of the present invention, the thickness of the auxiliary metal layer may be 5 mu m or more and 20 mu m or less, 5 mu m or more and 15 mu m or less, 7 mu m or more and 20 mu m or less, or 7 mu m or more and 15 mu m or less.

When the thickness of the auxiliary metal layer is within the above range, the bonding strength of the metal layer to the first resin layer can be improved, and the energy of the second laser can be efficiently transferred to the metal layer have. Furthermore, when the thickness of the auxiliary metal layer is within the above-mentioned range, it is possible to appropriately secure a space in which the second resin layer can be inserted between the flat surface of the metal layer and the protruding portion.

According to an embodiment of the present invention, the dissimilar material bonded body may include the metal layer and a second resin layer provided on the first resin layer. The second resin layer may be filled in the etch groove, between the surface of the metal layer and the protrusion, and may be fixed to the metal layer.

According to an embodiment of the present invention, the second resin layer may be formed of a polypropylene (PP) resin, a polyamide (PA) resin, a polyphenylene oxide (PPO) , But the kind is not limited. The reinforcing material may be at least one selected from the group consisting of glass fiber, talc, and carbon fiber, but the type of the reinforcing material is not limited.

According to one embodiment of the present invention, the second resin layer may be melted by the second laser irradiation described below and filled in the inside of the etching groove, between the metal layer surface and the protrusion. Accordingly, the second resin layer may be fixed to the metal layer provided with the etching grooves and the protrusions.

The dissimilar material bonded body may include a portion in which the metal layer, the first resin layer, and the second resin layer are sequentially provided. More specifically, when the dissimilar material bonded body further includes an auxiliary metal layer, the dissimilar material bonded body may include a portion where the metal layer, the auxiliary metal layer, the first resin layer, and the second resin layer are sequentially provided.

According to an embodiment of the present invention, the light transmittance of the second resin layer at any wavelength of 840 nm to 1064 nm may be 30% or more. Specifically, the light transmittance of the second resin layer at a wavelength of 915 nm may be 30% or more.

That is, when a laser having a wavelength of 840 nm to 1064 nm, for example, 915 nm, is irradiated to bond the second resin layer and the metal layer, more than 30% It is possible to transmit the second resin layer.

Accordingly, the energy of the laser irradiated to bond the metal layer and the second resin layer can be efficiently transferred to the first resin layer and / or the metal layer. Furthermore, the energy of the laser transferred to the metal layer can be converted into thermal energy, and the first resin layer and / or the second resin layer can be melted by the heat energy converted in the metal layer.

The molten second resin layer may be filled in the etching groove of the metal layer, the protrusion, the flat surface, and the first resin layer, so that the metal layer and the first resin layer and / Thereby enabling smooth joining.

On the other hand, when the light transmittance of the second resin layer at any wavelength of 840 nm to 1064 nm, for example, at a wavelength of 915 nm is less than 30%, the laser irradiated for the bonding of the second resin layer and the metal layer, There is a problem that the surface of the second resin layer is deformed due to excessive absorption into the resin layer. In addition, when the thickness is less than the above range, the bonding strength between the metal layer and the second resin layer may be greatly reduced.

Another embodiment of the present invention provides a method of manufacturing a heterogeneous material conjugate.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a metal layer having a first resin layer on one surface; A metal layer etching step of irradiating a surface of the metal layer having the first resin layer with a first laser to form an etching groove and a protrusion on one surface of the metal layer; And providing a second resin layer on one side of the etched metal layer, and then joining the metal layer and the second resin layer by irradiating a second laser to the method of manufacturing the dissimilar material bonded body .

According to an embodiment of the present invention, the manufacturing method of the dissimilar material bonded body further comprises preparing a metal layer having a first resin layer on one surface thereof.

According to an embodiment of the present invention, an auxiliary metal layer may be provided between the first resin layer and the metal layer.

The first resin layer may be formed on the metal layer using an electrodeposition method as described above, but the present invention is not limited thereto.

The method of providing the auxiliary metal layer is not particularly limited.

The metal layer, the first resin layer, the auxiliary metal layer, and the like are as described above.

According to an embodiment of the present invention, the manufacturing method of the dissimilar material bonded body includes a metal layer etching step of irradiating a surface of the metal layer with a first laser to form an etching groove and a protrusion on one surface of the metal layer.

According to an embodiment of the present invention, the first laser may be irradiated in the direction of the metal layer from the first resin layer.

According to one embodiment of the present invention, the first laser can be irradiated onto the surface of the first resin layer, and specifically, the first laser can be irradiated with a focus on the surface of the metal layer.

The etch grooves can form a continuous line, as described above, which can be formed by successive irradiation of the first laser. Furthermore, the flat surface of the surface of the metal layer may refer to a region where the first laser is not irradiated.

According to an embodiment of the present invention, the first resin layer and / or the auxiliary metal layer on the region irradiated with the first laser may be removed in accordance with the first laser irradiation.

That is, an etching groove and a protrusion may be formed on the metal layer in the region irradiated with the first laser, and a region where the first laser is not irradiated may be formed on the flat surface of the metal layer and the first resin layer have.

The thickness of the first resin layer included in the region where the first laser is not irradiated may not be changed by the first laser irradiation under the conditions described below. That is, the region to which the first laser is not irradiated under the conditions described below may not be affected by the irradiation of the first laser.

According to an embodiment of the present invention, an etching groove may be formed on the metal layer in accordance with the traveling direction of the first laser by irradiating the metal layer with the first laser. That is, the traveling direction of the first laser and the traveling direction of the etching groove may coincide with each other.

According to an embodiment of the present invention, an etching groove for forming a pattern line on the surface of the metal layer may be formed according to the first laser irradiation.

Further, when the metal layer is etched through the first laser irradiation, as described above, the projecting portion may be formed on the surface of the metal layer in a direction away from the etching groove.

According to an embodiment of the present invention, an etching groove may be formed on the surface of the metal layer by the first laser irradiation, and a protrusion may be formed adjacent to the etching groove and away from the etching groove.

According to an embodiment of the present invention, an etching groove may be formed on the surface of the metal layer by the first laser irradiation, and a protrusion may be formed adjacent to the etching groove and away from the etching groove.

The etching grooves and protrusions are as described above.

According to one embodiment of the present invention, when protrusions are formed in a direction away from the etching groove in accordance with the irradiation of the first laser, the opposite ends of the protrusions can be melted toward the etching groove central axis, An etching groove having a relatively narrow entrance width can be formed.

A schematic view of the metal layer etching step according to one embodiment of the present invention is shown in Fig.

Referring to FIG. 2, when the first laser is irradiated on the side of the laminate having the metal layer, the auxiliary metal layer and the first resin layer sequentially, etching grooves and protrusions are formed on the metal layer in the above- A flat surface may be formed in a region where the first laser is not irradiated.

Specifically, etching grooves and protrusions may be formed in the region irradiated with the first laser, and a first resin layer may be formed on the flat surface of the metal layer between opposing protrusions on the region not irradiated with the first laser .

According to one embodiment of the present invention, the first laser may be a fiber pulsed laser having an output of 10 W or more and 100 W or less, 10 W or more and 70 W or less, 30 W or more and 100 W or less, or 30 W or more and 70 W or less and output have.

According to an embodiment of the present invention, the first laser may be a fiber pulsed laser, and the first laser may be 10 W to 100 W, 10 W to 70 W, 30 W to 100 W, or 30 W Or more and 70 W or less.

In addition, within the output range of the first laser, the above-mentioned etching grooves and protrusions can be formed. Specifically, when the thickness is less than the above range, the above-described etching groove and protrusion can not be formed.

Further, when the amount of the laser beam exceeds the above range, the energy of the irradiated laser beam is dispersed on the surface of the metal layer, so that the first resin layer on the region where the first laser beam is not directly irradiated may peel off. That is, in the metal layer etching step, the first resin layer and / or the auxiliary metal layer are removed by collecting and irradiating a pulsed laser having a strong output in the above range in a narrow region, and etching grooves and projections in one region of the metal layer are effectively .

In this specification, the term " fiber pulsed laser " may refer to a laser using an optical fiber as a resonator, which has oscillation and stoppage in time.

According to an embodiment of the present invention, the wavelength of the first laser may be a wavelength of any one of 1,000 nm to 1,100 nm.

According to an embodiment of the present invention, the first laser has a scanning rate of 100 mm / s or more and 500 mm / s or less, 100 mm / s or more and 400 mm / s or less, 200 mm / / s, or between 200 mm / s and 400 mm / s.

In this specification, the irradiation speed of the laser may mean the speed of movement from one point to another point of the irradiated laser.

According to an embodiment of the present invention, the repetition rate of the first laser may be 30 kHz or more and 100 kHz or less, 30 kHz or more and 80 kHz or less, 50 kHz or more and 100 kHz or less, 50 kHz or more and 80 kHz or less .

In the present specification, the repetition rate of the laser may mean the frequency per second of the pulse laser.

According to an embodiment of the present invention, the pulse width of the first laser may be 100 ns or more and 400 ns or less, 100 ns or more and 300 ns or less, 200 ns or more and 400 ns or less, or 200 ns or more and 300 ns or less have.

In this specification, the pulse width may mean a time interval at which the amplitude becomes half at the rise time and the fall time of the pulse.

By irradiating the laser within the irradiation speed, repetition rate, and pulse width range, the above-mentioned etching grooves and projections can be sufficiently formed in the metal layer provided with the first resin layer. Specifically, when the laser beam is irradiated outside the above-described range, the metal layer may be cut or broken, and etching grooves and projections may not be formed sufficiently.

According to an embodiment of the present invention, the number of repetitions of the first laser may be 2 or more and 10 or less, or 2 or more and 5 or less.

Within this range, protrusions and etching grooves of sufficient size can be formed on the metal layer, thereby improving the bonding strength between the metal layer and the second resin layer. Specifically, when the thickness is less than the above range, the size of the protrusion may not be sufficient to form an anchoring structure, and if the thickness exceeds the above range, the metal layer may be damaged.

According to one embodiment of the present invention, the spot size of the first laser may be in the range of 15 탆 or more and 50 탆 or less, 25 탆 or more and 50 탆 or less, 30 탆 or more and 50 탆 or less, or 35 탆 or more and 50 탆 or less. Within the above range, etching grooves having the above-described conditions can be formed on the metal layer.

In this specification, the spot size (or beam size) may mean the maximum distance from one end to the other end of the focus of the laser.

According to an embodiment of the present invention, the irradiation interval of the first laser is 50 mu m or more and 1,000 mu m or less, 50 mu m or more and 800 mu m or less, 80 mu m or more and 1,000 mu m or less, 80 mu m or more and 800 mu m or less, Or less and 100 m or more and 500 m or less, 80 m or more and 250 m or less, or 100 m or more and 250 m or less.

The irradiation interval of the first laser may be the same as the distance between the central axes of the etching grooves described above. That is, when a line pattern is formed on the metal layer in accordance with the first laser irradiation, the distance on the line pattern spaced parallel to each other may be equal to the irradiation interval of the first laser.

When the first laser having the irradiation interval within the above range is irradiated, the protrusions provided in the direction away from one etching groove and the other protrusions provided in the direction away from the other etching groove are bonded to each other, It is possible to prevent the problem that the second resin layer melted in accordance with the second laser irradiation is not supplied.

In addition, the second resin layer melted in accordance with the second laser irradiation described below can be sufficiently supplied to the inside of the etching groove, the projecting portion and the surface of the metal layer within the range of the first laser irradiation condition, And the bonding strength between the first resin layer and the second resin layer can be greatly improved.

One embodiment of the present invention includes a step of bonding a metal layer and the second resin layer by irradiating a second laser after providing a second resin layer on one side of the etched metal layer.

According to one embodiment of the present invention, the description of the second resin layer is as described above.

According to an embodiment of the present invention, in the step of bonding the metal layer and the second resin layer, the second resin layer is melted according to the second laser irradiation so that the second resin layer is bonded to the metal layer .

Specifically, in the step of joining the metal layer and the second resin layer, a second resin layer melted by the second laser irradiation is filled between the surface of the metal layer, the surface of the first resin layer, the etching groove, and the protrusions Metal layer.

According to an embodiment of the present invention, the second laser may be a diode laser having an output of 50 W or more and 2,000 W or less.

That is, the step of joining the metal layer and the second resin layer may include providing a second resin layer on one side of the etched metal layer, irradiating the diode laser in the output range to bond the metal layer and the second resin layer, .

In this specification, a diode laser may refer to a laser generated by using a forward semiconductor junction as an active medium.

According to an embodiment of the present invention, the second resin layer may be melted by the diode laser irradiation so that the second resin layer is bonded to the metal layer.

According to an embodiment of the present invention, the second laser may be irradiated in the direction of the metal layer from the second resin layer.

According to an embodiment of the present invention, the second laser can be irradiated with a focus on the surface of the metal layer that is in contact with the second resin layer and / or the first resin layer.

Furthermore, according to an embodiment of the present invention, the second laser can be irradiated through the first resin layer and / or the second resin layer.

That is, according to one embodiment of the present invention, the second laser focuses the surface of the metal layer in contact with the second resin layer and / or the second resin layer in the direction of the metal layer from the second resin layer , And the second resin layer and / or the first resin layer.

Since the first resin layer has a high light absorption rate, energy of the second laser can be effectively absorbed and energy of the second laser can be efficiently transferred to the metal layer. The energy of the second laser transferred to the metal layer may be converted into thermal energy to melt the first resin layer and / or the second resin layer.

According to an embodiment of the present invention, when the second laser is irradiated and bonded by the above-described method, the time required for bonding the metal layer and the second resin layer and / or the metal layer to the first resin layer is And the bonding efficiency by heat conduction can be improved.

According to an embodiment of the present invention, the first resin layer and / or the second resin layer can be melted by the second laser. The first resin layer melted by the second laser may be bonded onto the flat surface of the metal layer and the protruding portion provided opposite to the metal layer. The second resin layer melted by the second laser may be filled between the surface of the metal layer, the surface of the first resin layer, the etching groove, and the protrusion to be fixed to the metal layer.

According to one embodiment of the present invention, the wavelength of the second laser may be the wavelength of the near infrared region. Specifically, the wavelength of the second laser may be a wavelength of one point out of a range of 840 nm to 1064 nm.

According to an embodiment of the present invention, the spot size of the second laser may be 100 μm or more and 5,000 μm or less, and may be appropriately adjusted according to the kind of the material to which the second laser is irradiated.

According to an embodiment of the present invention, the irradiation speed of the second laser may be 10 mm / s or more and 1,000 mm / s or less, and may be appropriately adjusted according to the type of material to which the second laser is irradiated.

According to an embodiment of the present invention, the number of times of irradiation of the second laser may be 1 or more and 50 or less, and may be appropriately adjusted according to the kind of the material to which the second laser is irradiated.

A schematic diagram of the production method of the dissimilar material bonded body is shown in Fig.

3, an etching groove and a protrusion are formed on one surface in accordance with a first laser irradiation, a second resin layer is formed on a metal layer having a first resin layer on a flat surface, The first resin layer and / or the second resin layer is melted and filled on the etching grooves, the flat surface of the metal layer, and the protrusions when the second laser is irradiated on the metal layer side, so that the first resin layer and the second resin layer A layer may be fixed to the metal layer side.

According to an embodiment of the present invention, the metal layer, the first resin layer and / or the resin at the interface between the metal layer and the second resin layer are melted, and the molten first resin layer and / Or the molten second resin layer may flow into the etched grooves of the etched metal layer as well as the surface of the metal layer and between the protrusions formed on the surface of the metal layer so that a harder anchoring effect may occur have.

According to one embodiment of the present invention, there is no possibility of environmental pollution due to chemical harmful substances or difficulty in mass production control unlike the existing dissimilar material joining method. In addition, Can be improved, and a heterogeneous material joined body capable of realizing airtightness and watertightness can be provided.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to examples. However, the embodiments according to the present invention can be modified into various other forms, and the scope of the present invention is not construed as being limited to the embodiments described below. Embodiments of the present disclosure are provided to enable those skilled in the art to more fully understand the present invention.

[ Example  One]

An iron (Fe) layer having a thickness of about 1 mm as a metal layer, and a zinc layer having a thickness of about 10 mu m as an auxiliary metal layer were laminated on the metal layer.

Then, a first resin layer having a light reflectance of about 7% at a wavelength of 918 nm and a thickness of about 30 탆 was formed on the auxiliary metal layer using an electrodeposition method.

A fiber pulsed laser having an output of 50 W in the direction of the metal layer from the first resin layer on the side of the laminated metal layer, the auxiliary metal layer and the first resin layer was irradiated at a repetition rate of 70 kHz, a pulse width of 220 ns, And the metal layer was etched by irradiation at an irradiation speed of 5 times.

Further, as the second resin layer, a polyamide resin containing 25 wt% of glass fibers was prepared. The thickness of the polyamide resin was 1.5 mm.

The etched metal layer and the second resin layer were each cut to a size of 20 mm x 60 mm, and then the second resin layer was fixed on the etched metal layer so as to overlap with the length of 1 cm. Then, in the second resin layer, a diode laser with a wavelength of 915 nm, a spot size of 3 mm, and an output power of 300 W was irradiated once at an irradiation speed of 10 mm / s in the direction of the metal layer to prepare a dissimilar material bonded body.

4 is an image of a cross section of a metal layer provided with the first resin layer of Example 1 by scanning electron microscope. 4 (A) is a side cross-sectional view of the metal layer, and (B) is a scanning electron microscope image of the surface of the metal layer. 4A, it can be seen that the etching groove 10 and the protruding portion 20 are formed in the region irradiated with the fiber pulse laser. In the region where the fiber pulse laser is not irradiated, the first resin layer 31 ) Was provided on the flat surface 30 of the metal layer. 4 (B), the first resin layer 31 is formed in the line pattern of the metal layer, specifically in the region formed by the etching groove 10, more specifically, the line pattern of the projections 20 As shown in FIG.

[ Comparative Example  One]

A heterogeneous material conjugate was prepared in the same manner as in Example 1, except that the number of irradiation of the fiber pulsed laser was controlled to be one cycle.

5 is an image of a section of the metal layer provided with the first resin layer of Comparative Example 1 taken by a scanning electron microscope. According to FIG. 5, it can be confirmed that the projecting portion and the etching groove can not be formed so that the second resin layer can be sufficiently supplied due to insufficient fiber pulsed laser irradiation amount for metal layer etching.

[ Comparative Example  2]

A heterogeneous material conjugate was prepared in the same manner as in Example 1, except that a separate auxiliary metal layer and a first resin layer were not provided and the metal layer was etched by irradiating the fiber pulsed laser twice.

[ Comparative Example  3]

It was attempted to fabricate a heterogeneous material conjugate by performing the same method as in Example 1 except that the metal layer was not etched using a fiber pulse laser. However, since the metal layer and the second resin layer were not bonded, it was impossible to form a heterogeneous material conjugate .

[Tensile Strength of Dissimilar Material Joints and Fusion  Width measurement]

The tensile strengths of these materials were measured to show the bonding strength of the dissimilar materials bonded bodies according to Example 1 and Comparative Examples 1 to 2. [

The dissimilar material bonded body according to Example 1 and Comparative Examples 1 to 2 was subjected to tensile test at a tensile speed of 10 mm / min using an ultimate test machine (INSTRON 5969) The resulting tensile strength (MPa) was measured.

The fusing width on the dissimilar material bonded body is preferably such that the length of both ends of the fused region formed on the surface of the second resin layer by the second laser irradiation, specifically, the melting point in the direction perpendicular to the second laser irradiation direction The lengths of both ends of the region were measured.

The measurement results of the tensile strength and the fusing width are shown in Table 1 below.

division Tensile Strength (MPa) Fusing width (mm) Example 1 12.5 3.5 Comparative Example 1 Not measurable Not measurable Comparative Example 2 11.5 2.8

According to Table 1, the first embodiment of the heterogeneous material joined body including the first resin layer having the reflectance of about 7% with respect to the second laser on the flat surface of the metal layer efficiently transfers the energy of the second laser to the metal layer It can be confirmed that it has a high tensile strength and a wide welding width.

On the other hand, in the case of Comparative Example 1 in which etching grooves and protrusions were not sufficiently formed, the metal layer and the second resin layer were easily separated by hand, and the bonding strength was such that the tensile strength could not be measured. In addition, it was confirmed that Comparative Example 2 including a metal layer without the first resin layer had a narrow welding width and a relatively low tensile strength value as compared with Example 1.

In this way, when forming a line pattern by irradiating a first laser on the metal layer, the first resin layer is provided on the metal layer to etch the metal layer, and the etched metal layer is bonded to the second resin layer to produce the dissimilar material bonded body , It was confirmed that the absorption rate of the energy according to the second laser irradiation of the metal layer is increased and the bonding strength of the dissimilar material bonded body can be improved.

In summary, it can be seen that a high bonding strength between different kinds of materials can be realized when etching grooves and projections are formed through etching of a metal layer and a first resin layer having a low light reflectance is provided.

10: etching groove
20:
30: Flat surface
31: First resin layer

Claims (15)

A metal layer including two or more etching grooves, projections provided adjacent to the etching grooves, and a flat surface on one surface;
A first resin layer provided on a flat surface of the metal layer and having a light reflectance of 10% or less at any wavelength of 840 nm to 1064 nm; And
And a second resin layer provided on the metal layer and the first resin layer,
And the second resin layer is filled in the etching groove, between the surface of the metal layer and the projection, and is fixed to the metal layer. The method according to claim 1,
Wherein the second resin layer has a light transmittance of 30% or more at any one of wavelengths of 840 nm to 1064 nm. The method according to claim 1,
Wherein the thickness of the first resin layer is 10 占 퐉 or more and 50 占 퐉 or less. The method according to claim 1,
Wherein the dissimilar material bonded body further comprises an auxiliary metal layer,
Wherein the auxiliary metal layer is provided between the metal layer and the first resin layer. The method of claim 4,
Wherein the auxiliary metal layer has a thickness of 5 mu m or more and 20 mu m or less. The method according to claim 1,
Wherein a ratio of the depth of the etching groove to the width of the etching groove inlet is 1: 3 to 1:14. The method according to claim 1,
Wherein a ratio of the etching groove intermediate width to the etching groove entrance width is 1: 1.3 to 1: 3. The method according to claim 1,
The projecting portion is provided in a direction away from the etching groove,
And the projecting portion is formed at an acute angle with the surface of the metal layer. The method according to claim 1,
And the length from one end to the other end of the projecting portion is not less than 25 占 퐉 and not more than 80 占 퐉. Preparing a metal layer having a first resin layer on one surface thereof;
A metal layer etching step of irradiating a surface of the metal layer having the first resin layer with a first laser to form an etching groove and a protrusion on one surface of the metal layer; And
The method of claim 1, further comprising: providing a second resin layer on one side of the etched metal layer, and then irradiating a second laser to bond the metal layer and the second resin layer. The method of claim 10,
Wherein the first laser is a fiber pulse laser having an output of 10 W or more and 100 W or less. The method of claim 10,
Wherein the first laser is irradiated at a repetition rate of 30 kHz or more and 100 kHz or less, an irradiation speed of 100 mm / s or more and 500 mm / s or less, and a pulse width of 100 ns or more and 400 ns or less. The method of claim 10,
Wherein the first laser is irradiated twice or more and 10 times or less. The method of claim 10,
Wherein the second laser is a diode laser having an output of 50 W or more and 2,000 W or less. The method of claim 10,
Wherein the second laser is irradiated at a spot size of 100 占 퐉 or more and 5,000 占 퐉 or less, an irradiation speed of 10 mm / s or more and 1,000 mm / s or less, and a number of times of irradiation of 50 times or less.

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