KR20190044031A - Heating apparatus for manufacturing component - Google Patents

Abstract

The present invention relates to a heating apparatus for manufacturing components. According to one embodiment of the present invention, the heating apparatus for manufacturing components includes: a beam source discharging a beam; a hot bar plate made of thermal conductive nonmetal material and heating a heating target which receives the beam discharged from the beam source to be heated and is in contact therewith; and a control unit controlling discharge of the beam from the beam source.

Description

[0001] HEATING APPARATUS FOR MANUFACTURING COMPONENT [0002]

The present invention relates to a heating apparatus for manufacturing parts. And more particularly, to a heating device for manufacturing parts having a hot-bar plate made of a thermally conductive non-metallic material.

As technology becomes more sophisticated and integrated, parts, for example, electronic parts, are getting smaller and integrated quickly. One of the important factors in achieving miniaturization and integration of these components, such as electronic components, is soldering technology. Soldering is a process of laminating electronic component substrates to melt solder balls and electrically connect the upper and lower layers. And integration of electronic components that are downsized through soldering between electronic component substrates is achieved.

In this soldering operation, heat is applied to one side of the electronic component substrate to melt the solder balls to bond the upper and lower layers. At this time, the heating device is a device for applying heat to the electronic component substrate, that is, the heating target, and applying a pressing force together with heat in some cases. As such a heating device, there is a pulse heater which heats by a pulse heating method by adjusting a heating and cooling cycle.

In the tip portion of the heating device, a plate which is in contact with an object to be heated, such as an electronic component substrate, is generally called a hot bar plate. Such a hot bar plate is made of a material having a high thermal conductivity so that heating and cooling can be performed quickly.

The conventional ceramic hot bar plate has a problem of a relatively low thermal conductivity and residual heat remaining after power-off. Particularly, when used in a pulse heater, there is a limit in shortening the pulse heating period due to residual heat.

Further, even in the case of a hot-bar plate using a metal or non-metal resistance heating element using a wire or the like, due to the characteristics of the resistance heating element, there is a problem that residual heat remains after the power is turned off. In particular, when a resistance heating element is applied to the pulse heater, .

Korean Patent Publication No. 10-2010-0010539 (published on February 02, 2010) Korean Patent Publication No. 10-2008-0095375 (published on October 29, 2008) Korean Registered Patent No. 10-1333631 (registered on November 21, 2013)

It is required to improve the thermal conductivity in the hot bar plate used in the heating device for parts manufacturing and to improve the productivity of the product so that the residual heat is quickly removed after the power is turned off.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a heating device for manufacturing parts having a hot bar plate which is made of a non-metallic material having a very high thermal conductivity and heated by a beam,

According to one aspect of the present invention, there is provided a beam source for emitting a beam; A hot bar plate made of a thermally conductive nonmetallic material and heated by the beam emitted from the beam source to heat the object to be heated; And a control unit for controlling the emission of the beam from the beam source.

At this time, in one example, the heating device for manufacturing parts further includes a cooling hole for circulating a cooling fluid for passing through the inside of the hot bar plate and for cooling the hot bar plate, and the control unit controls the circulation of the cooling fluid in the cooling hole can do.

At this time, in another example, the heating device for manufacturing a part may further include a suction hole formed to be exposed to the upper surface via the inside of the hot bar plate and to provide a pressure for sucking the heating target.

It is further contemplated that, in one example, the heating device for manufacturing a component further comprises a chamber housing defining a chamber and having an opening for irradiating a beam backward of the hot bar plate and supporting the hot bar plate on the opening, A hot bar cooling section formed in the hot bar plate and a housing cooling section connected to the hot bar cooling section and penetrating the upper side of the chamber housing, wherein the suction holes penetrate the hot bar plate and are exposed to the upper surface of the hot bar plate, And a housing connecting section penetrating the upper side of the chamber housing to be connected to the hot bar adsorption hole.

Further, in one example, the hot bar plate is supported by the chamber housing and heated by receiving the beam from the rear surface, and protrudes from the base portion and the base portion through which the hot bar cooling section and the hot bar adsorption hole pass, And a base portion and a protrusion are formed integrally with each other between the base portion and the protruding portion and without the laminated interface between the base portion and the protruding portion.

In another example, at this time, in another example, the hot bar cooling section includes an inner cooling section forming at least one closed loop in the base section and a surface of the base section connected to both ends of the inner cooling section at both ends of the base section and in contact with the chamber housing And a first internal connection portion communicating with the housing cooling section passing through the upper side of the chamber housing. The hot bar suction hole includes an exposure absorption hole exposed from the inside of the base portion to the upper surface of the projection, An inner hole section connected to the hole and formed in parallel with a section forming a closed loop in the region by the closed loop, and a surface of the base portion connected to one end of the inner hole section in at least one of the opposite end portions of the base section and in contact with the chamber housing And a second internal connection portion communicating with the housing connection portion There.

In addition, the housing cooling section includes a housing connection part connected to the first internal connection part, a housing cooling part connected to the housing connection part and formed around the opening of the chamber housing, and an external connection part connecting the outside of the chamber housing with the housing cooling part .

Further, in one example, the opening of the chamber housing is formed long along the longitudinal direction of the hot bar plate, and the cross-sectional structure in the width direction of the opening part is narrower in width than the lower side .

In another example, the thermally conductive base metal material may be diamond, CBN (Cubic Boron Nitride), or BN (Boron Nitride) material.

Further, the heating device for manufacturing parts further includes a temperature sensor for sensing the temperature of the hot bar plate, and the control unit can control the beam emission at the beam source according to the preset information and the result sensed by the temperature sensor.

At this time, in another example, the heating apparatus for manufacturing a part may further include a beam width setting unit for allowing the beam emitted from the beam source to be provided to the hot bar plate at a predetermined beam width.

Also, at this time, in one example, the beam-width setting unit may be a magnetic-field lens that causes the beam to be provided to the hot bar plate in a predetermined shape along the longitudinal direction of the hot bar plate.

In another example, the beam source may include a beam generating unit for generating and emitting a beam, and a grid unit for accelerating the beam emitted from the beam generating unit so that the beam is uniformly irradiated onto the setting area.

Further, in one example, the heating device for manufacturing parts is a pulse heating type.

Further, in one example, the beam may be an electron beam, an ion beam, or a laser beam.

In another example, the heating device for manufacturing parts is characterized in that it is used for soldering of electronic parts.

According to one embodiment of the present invention, a hot-bar plate made of a nonmetallic material having excellent thermal conductivity can be provided, thereby improving the thermal conductivity and shortening the heating and cooling rate. The product productivity can be improved by using the heating device for manufacturing parts according to one example of the present invention in accordance with the shortening of the heating and cooling rate.

In addition, according to one embodiment of the present invention, since the hot bar plate made of a non-metallic material having excellent thermal conductivity heated by receiving the beam is provided, rapid temperature control during operation can be achieved. In addition, precise temperature control becomes possible.

It is apparent that various effects not directly referred to in accordance with various embodiments of the present invention can be derived by those of ordinary skill in the art from the various configurations according to the embodiments of the present invention.

1A and 1B are schematic views of a heating apparatus for manufacturing parts according to one embodiment of the present invention, respectively.
Figs. 2A and 2B are schematic views showing a cooling hole and a suction hole, respectively, of a heating device for manufacturing parts according to one embodiment of the present invention. Fig.
3A and 3B are views schematically showing a hot bar cooling section in a heating apparatus for manufacturing parts according to an embodiment of the present invention, respectively.
4 is a view schematically showing an opening portion of a chamber housing in a heating apparatus for manufacturing parts according to one embodiment of the present invention.
5 is a view schematically showing a heating apparatus for manufacturing parts according to another embodiment of the present invention.
6 is a view schematically showing a heating apparatus for manufacturing parts according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing the configuration of a first embodiment of the present invention; Fig. In the description, the same reference numerals denote the same components, and a detailed description may be omitted for the sake of understanding of the present invention to those skilled in the art.

As used herein, unless an element is described as being connected, coupled, or arranged with another element, it is understood that there is no need for any other form of " direct connection, But may also be in the form of being connected, bonded or disposed by intervening components. Also, where described in terms of direction and / or position in the present description, such terms are relative concepts as determined from the bases, wherein the bases may be described directly or not, Can be fully understood from the relationship between the configuration and the related configuration.

It should be noted that, although a singular expression is used in this specification, it can be used as a concept representing a plurality of constitutions as long as it is contrary to the concept of the invention or is not interpreted as being obviously different or contradictory. It is to be understood that the phrases "including", "having", "having", "comprising", etc. in this specification are intended to be additionally or interchangeable with one or more other elements or combinations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which: FIG.

A heating device for manufacturing a part according to an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals denote the same components, and reference numerals which are not shown in the drawings denote the same components as those in the other drawings.

FIGS. 1A and 1B are schematic views of a heating apparatus for manufacturing parts according to one embodiment of the present invention, and FIGS. 2A and 2B respectively show a cooling hole of a heating apparatus for manufacturing parts according to one embodiment of the present invention, 3A and 3B are diagrams schematically showing a hot bar cooling section in a heating apparatus for manufacturing parts according to one embodiment of the present invention, and FIG. 4 is a view schematically showing one embodiment of the present invention FIG. 5 is a schematic view of a heating apparatus for manufacturing parts according to another embodiment of the present invention, and FIG. 6 is a schematic view of a heating apparatus for manufacturing parts according to another embodiment of the present invention. 1 schematically shows a heating device for manufacturing parts according to one embodiment.

Referring to FIGS. 1A, 1B, 5 and / or 6, a heating apparatus for manufacturing parts according to one example comprises a beam source 10, a hot bar plate 30 and a control unit 60. Further, referring to Figs. 1A, 1B, 5 and / or 6, the heating device for manufacturing parts may further include a cooling hole 40. Fig. Further, referring to Figs. 1A, 1B, 5 and / or 6, the heating device for manufacturing parts may further include a suction hole 50. [ 1A, 1B, 5 and / or 6, the heating apparatus for manufacturing parts may further include a chamber housing 20. [ 5, the heating apparatus for manufacturing a part may further include a beam width setting unit 70. [ Although not shown, in another example, the heating device for manufacturing parts may further include a temperature sensor.

In one example, a heating device for manufacturing parts is used for manufacturing parts, for example, for manufacturing electronic parts. For example, a heating device for manufacturing parts according to one example can be used for soldering electronic components. At this time, the heating device may be a heating device for semiconductor packaging. For example, in the soldering operation of the electronic component substrate, the hot bar plate 30 of the heating component for manufacturing parts may contact the substrate of the electronic component to transfer heat to perform soldering. At this time, the electronic component may be an IC component integrated in multiple layers.

In one example, the heating device for manufacturing parts may be a pulse heating type or a continuous heating type. In the pulse heating system, the pulse period, that is, the irradiation period of the beam is controlled, and in the continuous heating system, the beam can be continuously irradiated and heated.

The beam source 10 emits the beam 1. The hot bar plate 30 is made of a thermally conductive nonmetal material. For example, the thermally conductive nonmetal material may be diamond, CBN (Cubic Boron Nitride), or BN (Boron Nitride) material. The hot bar plate 30 receives the beam 1 emitted from the beam source 10 and is heated. At this time, the heated hot bar plate 30 heats the heated object 100 in contact with the heated hot bar plate 30. Next, the suction holes 50 are formed to be exposed through the inside of the hot bar plate 30 to the upper surface. At this time, the suction holes 50 provide a pressure for adsorbing the object to be heated 100. Then, the control unit 60 controls the emission of the beam 1 at the beam source 10.

For example, in one example, if the heating device for manufacturing parts further includes a cooling hole 40, the cooling hole 40 penetrates the inside of the hot bar plate 30 and supplies a cooling fluid for cooling the hot bar plate 30 Circulate. At this time, the control unit 60 can control the cooling fluid circulation in the cooling hole 40. [

In addition, in one example, the heating apparatus for manufacturing a component may further include a chamber housing 20, wherein the chamber housing 20 forms a chamber, has an opening, and supports the hot- do. At this time, the beam 1 is irradiated to the rear of the hot bar plate 30 through the opening.

The heating apparatus for manufacturing parts according to another example may further include a beam width setting unit 70. [

Hereinafter, each configuration of the heating device for manufacturing parts will be described in detail. In the basic configuration, the beam source 10, the hot bar plate 30, and the control unit 60 are examined, and the cooling hole 40, the suction hole 50, the chamber housing 20, A beam width setting unit 70, and the like. The beam source 10, the hot bar plate 30, the cooling hole 40, the suction hole 50, the control unit 60, the chamber housing 20, the beam width setting unit 70, .

[Beam source]

1A, 1B, 5 and / or 6, the beam source 10 emits a beam 1 to heat the hot bar plate 30. For example, the beam 1 may be an electron beam, an ion beam or a laser beam. As a heating source for heating the hot bar plate 30, the beam source 10 may emit an electron beam or an ion beam or a laser beam according to the embodiment. The electron beam 1 and the ion beam impinge on the hot bar plate 30 to heat the hot bar plate 30 by the impact heat and the laser beam is irradiated to the hot bar plate 30 to heat the hot bar plate 30.

For example, the beam source 10 may emit electrons or ionic particles by emitting a hot electron in a filament fashion or by generating a plasma, or by irradiating a laser to a target, in the case of a particle beam. Alternatively, the target may be irradiated with plasma particles to release particles from the target. Further, when the beam emitted from the beam source 10 is a laser beam, it can be irradiated directly to the hot bar plate 30. [

In the case of the particle beam, since the hot bar plate 30 is heated by the impact on the hot bar plate 30, it is important to accelerate the particles in order to generate a lot of collision heat. Thus, in one example, the particle beam can be an electron beam that is small in mass and easy to accelerate.

For example, when the beam 1 emitted from the beam source 10 is an electron beam or an ion beam, the beam source 10 may have a multipolar structure, for example, a triode or a quadrupole structure. Or the beam source 10 according to the embodiment may have a short-pole structure.

Further, in one example, the emission of the beam 1 from the beam source 10 may be done in a pulsed manner, or in a continuous heating manner. In the case of the pulse heating method, the emission period of the beam 1 emitted from the beam source 10 can be controlled and heating and cooling can be controlled.

For example, referring to FIG. 6, in one example, the beam source 10 may include a beam generating section 11 and a grid section 13. The beam generating unit 11 generates and emits the beam 1. The grid portion 13 accelerates the beam 1, e.g., a particle beam, emitted from the beam generating portion 11. [ At this time, the particle beam may be an electron beam. At this time, the grid portion 13 causes the beam 1 to be uniformly irradiated to the setting region.

For example, the grid portion 13 may be a mesh type or a hole type through which the beam 1 can pass. The beam 1 emitted from the beam source 10 can be uniformly irradiated to the rear surface setting area of the hot bar plate 30 by the grid unit 13 formed of, for example, a mesh type or a hole type . That is, the grid portion 13 can be formed such that a mesh or a hole is arranged so that the beam 1 passing through the mesh or the hole is not concentrated in a specific region, for example.

The grid portion 13 can be used as an electrode to be used to accelerate the beam 1, e.g., a particle beam. For example, the grid portion 13 may be an anode for accelerating the electron beam 1. [

1a, 1b, 5 and / or 6, the beam source 10 may be supported by the chamber housing 20 and form a chamber with the chamber housing 20, Or may be formed in the chamber housing 20.

In one example of the present invention, since the heating device for manufacturing parts is a method in which the hot plate 30 is heated by the beam 1, rapid heating and fast cooling in the hot plate 30 can be performed. That is, unlike the resistance heating element system, the beam 1 is irradiated or impinged by the hot bar plate 30 to heat the hot bar plate 30, so that the pulse heating is smoothly performed through the emission of the beam 1 by the power on / off control Lt; / RTI > Accordingly, when heating with the beam 1, the pulse heating period can be made shorter than that of the conventional resistance heating element, and the productivity of the product using the heating device for manufacturing parts can be improved.

Also, in one example of the present invention, the heating device for manufacturing parts is a method in which the hot bar plate 30 is heated by the beam 1, so that rapid temperature control in the hot bar plate 30 is possible. Furthermore, precise temperature control in the hot bar plate 30 is also possible.

[ Hot bar  plate]

Next, the hot bar plate 30 will be described with reference to Figs. 1A, 1B, 2a, 2B, 4, 5 and / or 6. The hot bar plate 30 receives the beam 1 emitted from the beam source 10 and is heated. At this time, the hot bar plate 30 conveys heat to the heated body 100 in contact with it, and heats the heated body 100. In the example of the present invention, since the hot bar plate 30 is heated by the beam 1, rapid heating and fast cooling in the hot bar plate 30 can be performed. When the beam 1 is used, the emission of the beam 1 is immediately stopped by turning off the power source at the beam source 10, so that the heating source for heating the hot bar plate 30 disappears immediately and rapid cooling can be performed. The hot bar plate 30 such as the conventional resistance heating element system has difficulty in performing rapid cooling due to residual heat on the resistance heating element even when the power is turned off. However, by using the beam 1, for example, an electron beam, The residual heat as in the resistance heating element for heating the hot plate 30 can be essentially eliminated. That is, unlike the resistance heating body system, the heating source for heating the hot plate 30 is irradiated or collided with the hot plate 30 by the beam 1, so that heating and cooling through power on / off control can be smoothly performed. For example, pulse heating can be smoothly performed by controlling the irradiation period of the beam (1). Accordingly, when heating with the beam 1, the pulse heating period can be made shorter than that of the conventional resistance heating element, and the productivity of the product using the heating device for manufacturing parts can be improved.

In the present specification, the hot bar plate 30 refers to a part or device that contacts the heated body 100 as a heating source of the heated body 100 and transmits heat to the heated body 100. The hot bar plate 30 has a bar-shaped structure and has a flat top surface contacting with the heated body 100. At this time, the contact surface to be contacted with the heated body 100, that is, the tip face of the hot bar plate 30 may be a tip type structure having a narrow width and a long shape or a relatively wide width.

An example of the heated body 100 to be heated by being brought into contact with the hot bar plate 30 may be, for example, an electronic component substrate. For example, in the soldering operation of the electronic component substrate, the hot bar plate 30 contacts the substrate to transfer heat to perform soldering. In accordance with development of the integration technology, a large number of integrated IC components are manufactured. At this time, the hot bar plate 30 contacts with the solder during the soldering operation for laminating the IC components, so that the soldering can be performed.

In the example of the present invention, the hot bar plate 30 is made of a thermally conductive non-metallic material. Since the hot bar plate 30 is made of a material having excellent thermal conductivity, high heat transfer rate and rapid heating and cooling are possible. In this case, in one example, in the case of the pulse heating method, the cycle of pulse heating for repeating heating and cooling can be shortened. In the example of the present invention, the hot bar plate 30 is quickly heated and cooled quickly by using a material superior in heat conduction characteristics to the material of the hot bar plate of the conventional pulse heating apparatus, and according to the high heat conductivity, Heat transfer to the body 100 can be performed.

At this time, the material of the hot bar plate 30 may not be coated with a different material having excellent thermal conductivity but may be made of one material.

Diamond, CBN (Cubic Boron Nitride), BN (Boron Nitride) and the like can be used as a non-metallic material having excellent thermal conductivity. Diamond, CBN and BN are not only excellent in thermal conductivity, but also capable of CVD. Therefore, the hot bar plate 30 can be integrally manufactured from a material having excellent thermal conductivity through CVD. The diamond material may be not only CVD synthetic diamond using CVD but also polycrystalline diamond (PCD).

For example, diamond materials have a very high thermal conductivity. The thermal conductivity of diamond is much higher than that of silver or copper, which has excellent thermal conductivity among metals. Since the hot bar plate 30 made of a diamond material having a very high thermal conductivity is used, a high heat transfer rate and fast heating and cooling can be achieved. This makes it possible to shorten the cycle of pulse heating for repeating heating and cooling. The diamond material is superior to the ceramic material used in the conventional pulse heating apparatus and has excellent thermal conductivity. Therefore, the hot-bar plate 30 made of diamond according to the present invention can be heated faster than the hot bar plate made of a ceramic material of the conventional pulse heating apparatus and cooled quickly. Further, according to the high thermal conductivity of the diamond material, the heat transfer to the heated body 100 can be performed more quickly and uniformly than the conventional ceramic hot bar plate.

The diamond material of the hot bar plate 30 is not simply coated on a metal or base metal having excellent thermal conductivity as in the conventional case, . In the case of forming a diamond coating on the surface of a metal or other non-metallic material as in the prior art, there is a difference in heating and cooling rates depending on the difference in thermal conductivity between different materials. In particular, There may be problems. On the other hand, as in one example of the present invention, when both the surface and the interior of the hot bar plate 30 are made of a diamond material, the difference in heating and cooling speed due to different materials between the surface and the inside can be eliminated, It is possible to overcome the problem of residual heat due to the cooling rate delay of the material.

The diamond material of the hot bar plate 30 may be a synthetic diamond material such as CVD synthetic diamond or PCD (polycrystalline diamond). Synthetic diamond materials can also have substantially the same thermal conductivity as natural diamonds. For example, the hot bar plate 30 of synthetic diamond material can be manufactured through chemical vapor deposition (CVD), which is used in semiconductor processing.

An example of a process for manufacturing a hot bar plate using a non-metallic material having excellent thermal conductivity will be briefly described. At this time, a process of manufacturing a hot-bar plate of a synthetic diamond material by CVD deposition will be described. CBN and BN as well as diamonds can be CVD, making it possible to manufacture hot bar plates in a similar manner.

First, a base plate made of a synthetic diamond material is prepared, and the receiving groove is processed such that the upper side of the base plate is opened by laser processing, etching, or the like. A base plate on which a receiving groove is machined by CVD deposition may also be prepared. At this time, the receiving groove is a groove for forming the hot bar cooling section 41 and the hot bar adsorption hole 51, which will be described later.

(For example, a CVD method) made of the same material as that of the base plate and having an open side in one side is prepared, and the groove is inserted into the receiving groove such that the open side of the prepared groove is directed to the bottom of the receiving groove do. The open side of the grooved frame is inserted so as to face the bottom of the receiving groove so that the hot bar cooling section 41 and the hot bar adsorption hole 51 can be formed.

Next, the base plate having the grooved frame inserted therein is subjected to, for example, CVD vapor deposition to grow a hot bar cooling section 41 and a hot bar adsorption hole 51 therein. The hot bar adsorption hole 51 also has a hot bar The plate 30 is formed.

Referring to Figures 2a and / or 2b, in one example, the hot bar plate 30 includes a base portion 30a and a projection 30b. At this time, the base portion 30a and the protruding portion 30b are integrally formed of a thermally conductive non-metallic material such as diamond, CBN, or BN. In one example, the base portion 30a and the protrusion 30b may be diamond, CBN or BN materials. In one example, base portion 30a and protrusion 30b may be synthetic diamond materials.

The base portion 30a is supported by a chamber housing 20 described later. At this time, the base portion 30a receives the beam 1 emitted from the beam source 10 at the rear, and is heated. The hot bar cooling section 41 and the hot bar suction hole 51 pass through the base portion 30a. For example, the inlet and the outlet of the hot bar cooling section 41 may be formed on the contact surface with the chamber housing 20 described later. For example, the inlet and the outlet of the hot bar cooling section 41 may be formed on the rear surface or the side surface of the base portion 30a. The hot bar cooling section 41 will be described later.

The projecting portion 30b is protruded from the base portion 30a. The projection 30b contacts the heating target 100 to heat the heating target 100. [ The top surface of the protruding portion 30b, that is, the tip end surface is a contact surface that contacts the target 100 to be heated. At this time, the protrusion 30b may have a tip shape having a narrow width and a long shape or a plate shape having a relatively wide width. Even when the protruding portion 30b has a tip shape, the tip end face contacting with the heating target 100 is flat.

The hot bar adsorption hole 51 is exposed from the upper surface of the protruding portion 30b. The hot bar adsorption hole 51 is formed through the inside of the base portion 30a and the protruding portion 30b and is exposed on the upper surface of the protruding portion 30b. The description of the hot bar adsorption hole 51 will be given later.

At this time, the base portion 30a and the protruding portion 30b are formed integrally with each other between the base portion 30a and the protruding portion 30b and without the laminated interface between the base portion 30a and the protruding portion 30b. That is, the hot bar plate 30 is made of a non-metallic material having excellent thermal conductivity, for example, a diamond material, and is integrally formed without a laminated interface and / or an adhesive interface. At this time, the hot bar plate 30 may be integrally formed without deposition or lamination via CVD deposition. If the adhesive interface exists, the thermal conductivity of the adhesive on the adhesive interface is much lower than, for example, the diamond material, so that the heat transfer between the upper and lower portions of the adhesive interface can not be smoothly performed, and the hot bar plate 30 is made of a non- , For example, it is difficult to maximize the thermal conductivity characteristics of the diamond material.

[ Cooling hole]

Next, referring to Figs. 1A, 1B, 5 and / or 6, the heating device for manufacturing parts may further include a cooling hole 40. Fig. At this time, the cooling holes 40 will be described with reference to FIGS. 1A, 1B, 2A, 2B, 3A, 3B, 5 and / or 6. The cooling hole 40 penetrates the inside of the hot bar plate 30 and circulates the cooling fluid for cooling the hot bar plate 30. [ The cooling method may be water cooling or air cooling. As the cooling fluid, a refrigerant fluid or liquefied nitrogen used for refrigeration can be used. For example, the hot bar plate 30 may be cooled by circulating the refrigerant by a heat pump method. The cooling fluid for cooling the heated hot plate 30 through the cooling hole 40 is circulated. The cooling method may be water-cooling and / or air cooling. Liquid nitrogen may also be used as cooling fluid. Further, a refrigerant used for a refrigerator or a refrigeration operation can be used as a cooling fluid. The hot plate 30 is quickly cooled by the cooling holes 40. [

For example, referring to Figs. 2A and / or 2B, in one example, the cooling hole 40 comprises a hot bar cooling section 41 and a housing cooling section 43. Fig. The hot bar cooling section 41 is formed inside the hot bar plate 30. The heated fluid flows through the hot bar cooling section 41 formed inside the hot bar plate 30 and the heated hot bar plate 30 is quickly cooled. The inlet and outlet of the hot bar cooling section 41 may be formed on the contact surface with the chamber housing 20 supporting the hot bar plate 30. [ For example, the hot bar cooling section 41 can penetrate the inside of the hot bar plate 30 by forming a pair of two holes formed at both ends of the rear surface of the hot bar plate 30 or both side ends thereof, forming an inlet and an outlet .

Referring to FIGS. 2A, 2B, 3A and / or 3B, in another example, the hot bar cooling section 41 may include an internal cooling portion 41b and a first internal connection portion 41a. The inner cooling portion 41b forms at least one closed loop in the base portion 30a of the hot bar plate 30. [ At this time, the inner cooling portion 41b may be connected to the first inner connection portion 41a at both end portions of the base portion 30a. The first internal connection portion 41a is connected to both ends of the internal cooling portion 41b at both end portions of the base portion 30a of the hot bar plate 30. [ The first internal connection part 41a communicates with the housing cooling section 43 passing through the upper surface of the chamber housing 20 through the surface of the base part 30a contacting the chamber housing 20. [

On the other hand, the housing cooling section 43 is connected to the hot bar cooling section 41 and penetrates the upper side of the chamber housing 20 described later. The cooling fluid flows through the housing cooling section 43 and the heat transferred to the joining portion of the chamber housing 20 supporting the hot plate 30 can be cooled.

2A, 2B, and 4, the housing cooling section 43 may include a housing connecting portion 43a, a housing cooling portion 43b, and an external connecting portion 43c . The housing connection portion 43a is connected to the first internal connection portion 41a. The housing cooling portion 43b is connected to the housing connection portion 43a and is formed in the chamber housing 20 along the periphery of the opening of the chamber housing 20. [ The external connection part 43c connects the housing cooling part 43b and the outside of the chamber housing 20. [ A cooling fluid circulating pump (not shown) is connected to the outside so that the cooling fluid is introduced into the cooling hole 40 through the external connection portion 43c under the control of the control unit 60 and the circulating cooling fluid is supplied to the external connection portion And 43c.

[ Absorption hole ]

Next, the adsorption holes 50 will be described with reference to Figs. 1A, 1B, 2A, 2B, 3A, 3B, 5 and / or 6. The suction holes 50 are formed through the inside of the hot bar plate 30 so as to be exposed on the upper surface. At this time, the suction holes 50 provide a pressure for adsorbing the object to be heated 100. The adsorption hole 50 is for adsorbing the object to be heated 100, and the object to be heated 100 can be adsorbed by maintaining a pressure lower than the substantial vacuum state or the external pressure through the adsorption hole 50. For example, the adsorption of the target object 100 through the adsorption hole 50 may serve to fix the target object 100. [ In addition, in one example, the adsorption hole 50 may provide a pressure for desorbing the adsorbed target object 100. [ For example, the desorption pressure can maintain the pressure in the adsorption hole 50 substantially equal to the pressure in the chamber.

Referring to FIG. 2, in one example, the adsorption hole 50 comprises a hot bar adsorption hole 51 and a housing connection section 53. The hot bar adsorption holes 51 penetrate the inside of the hot bar plate 30 and are exposed to the upper surface of the hot bar plate 30. The housing connection section 53 penetrates the upper side of the chamber housing 20 to be described later to be connected to the hot bar adsorption hole 51.

Like the hot bar cooling section 41, the hot bar adsorption hole 51 passes through the inside of the hot bar plate 30 but is exposed on the contact surface of the hot bar plate 30, unlike the hot bar cooling section 41. At this time, the object to be heated 100 is held substantially at a vacuum or at a pressure lower than the peripheral portion through the hot bar adsorption hole 51, and the pressure of the hot bar adsorption hole 51 is changed to substantially the same as the ambient pressure, It is possible to cause the heated body 100 to be separated from or removed from the contact surface.

At least one or more, for example, a plurality of hot bar adsorption holes 51 are exposed from the contact surface of the hot bar plate 30 to be connected to one another in the hot bar plate 30 or a plurality of hot bar adsorption The holes 51 may be connected by two or more internal passages. The inlet and the outlet of the hotbar adsorption hole 51 may be formed on the contact bearing surface where the hotbar plate 30 is supported by the chamber housing 20 of the heating device for manufacturing parts. For example, the hot bar adsorption hole 51 may have an inlet and an outlet formed on a rear surface or a side surface of the hot bar plate 30.

For example, referring to FIGS. 2A and / or 2B, in one example, the hot bar adsorption hole 51 may include a second inner connection portion 51a, an inner hole section 51b and an exposure adsorption hole 51c have. The exposure adsorption hole 51c is exposed from the inside of the base portion 30a to the upper surface of the projecting portion 30b. For example, the exposure adsorption holes 51c may be formed vertically on the upper surface of the hot bar plate 30, specifically, on the upper surface of the projection 30b in the inner hole section 51b. For example, when there are two or more exposure adsorption holes 51c exposed on the upper surface of the protrusion 30b, that is, the tip end surface, a plurality of exposure adsorption holes 51c are formed in one inner hole section 51b formed in the base portion 30a, Or may be communicated separately from the plurality of inner hole sections 51b.

For example, although not shown, at least one or more exposure adsorption holes 51b of the hot bar adsorption holes 51 exposed on the upper surface of the protrusions 30b may be formed on the bottom of one adsorption groove formed on the upper surface of the protrusions 30b . That is, at least one or more exposure adsorption holes 51c are connected to one adsorption groove (not shown) formed on the upper surface of the protrusion 30b and are held by the adsorption grooves, that is, in a substantially vacuum state in the adsorption grooves, The object to be heated 100 can be adsorbed.

The inner hole section 51b is connected to the exposure adsorption hole 51c inside the base section 30a and is formed in parallel with a section forming a closed loop in the region of the closed loop of the inner cooling section 41b do.

The second inner connection portion 51a is connected to one end of the inner hole section 51b at at least one of both ends of the base portion 30a and penetrates into the surface of the base portion 30a contacting the chamber housing 20 do. The second internal connection portion 51a communicates with the housing connection section 53 passing through the upper side of the chamber housing 20 from the surface of the base portion 30a contacting the chamber housing 20. [ For example, the second internal connection portion 51a may be formed vertically to the lower surface of the base portion 30a contacting the chamber housing 20 in the region of the closed loop of the internal cooling portion 41b.

[Control unit]

Subsequently, referring to Fig. 1A, the control unit 60 controls the emission of the beam 1 at the beam source 10. Further, in one example, when the heating device for manufacturing parts has the cooling hole 40, the control unit 60 can control the circulation of the cooling fluid in the cooling hole 40. [ The control unit 60 can also control the pressure in the suction hole 50. [

The beam emission control by the control unit 60 can control the beam emission by turning on and off the power source applied to the beam source 10. [ According to the embodiment, it is possible to control the beam emission amount by adjusting the intensity of the power source.

The cooling fluid circulation control of the control unit 60 may be performed by controlling the cooling fluid circulation pump connected through the external connection part 43c of the cooling hole 40 although not shown. The pressure control of the suction hole 5 of the control unit 60 may be performed through control of a vacuum pump connected from the outside through the housing connection section 53 of the suction hole 50 although not shown.

For example, in one example, when the heating device for manufacturing parts further includes a temperature sensor (not shown) that senses the temperature of the hot bar plate 30, the control unit 60 controls the pre- And can control the beam emission in the beam source 10 according to the result. For example, in one example, the control unit 60 may control the beam discharge and the cooling fluid circulation in the cooling hole 40 according to the detection result of the temperature sensor. The preset information may be information indicating the control output value for the reference temperature value or the reference temperature range value, for example, as condition and / or parameter information for performing control by the control unit 60. [ At this time, not only the reference temperature value or the reference temperature range value but also the reference pressure may be included in the preset information. The preset information as the control information may be set at the time of manufacture of the heating device for manufacturing a component or may be set or inputted through a test by the user in the technical field.

[ chamber  housing]

Referring to FIGS. 1A, 1B, 5 and / or 6, a heating device for manufacturing a component according to one example may further include a chamber housing 20. FIG. At this time, the chamber housing 20 forms a chamber. The chamber housing 20 has an opening to allow the beam 1 to be irradiated to the rear of the hot bar plate 30. The chamber housing 20 supports the hot bar plate 30 on the opening.

A beam source 10 may be provided in the chamber formed by the chamber housing 20 or a portion of the chamber housing 20 and the beam source 10 may be provided together as shown in Figures 1A, 1B, 5 and / . Referring to FIG. 5, in one example, a beam width setting unit 70 may be provided in a chamber formed by the chamber housing 20.

For example, referring to FIG. 4, in one example, the opening of the chamber housing 20 is formed long along the longitudinal direction of the hot bar plate 30. At this time, the cross-sectional structure in the width direction of the opening portion may be a structure in which the width is narrower than the lower side while moving toward the upper side supporting the hot bar plate 30 at the inside of the chamber.

[ Beam width  Setting unit and others]

Next, referring to FIG. 5, a heating apparatus for manufacturing a part according to one example may further include a beam width setting unit 70. FIG. The beam width setting unit 70 causes the beam 1 emitted from the beam source 10 to be provided to the hot bar plate 30 with the set beam width. For example, the beam width setting unit 70 may have a slit or a hole of a rectangular structure to set the beam width by passing the beam 1, but is not limited thereto. Further, although not shown, the beam width setting unit 70 may include a diaphragm to adjust the width of the slit. Alternatively, when the beam 1 is subjected to a force in the magnetic field space, a magnetic field space may be formed using the magnetic lens as the beam width setting unit 70 to adjust the beam width.

In one example, the beam width setting unit 70 may be a magnetic field lens that causes the beam 1 to be provided in a predetermined shape along the longitudinal direction of the hot bar plate 30 as a hot bar plate. For example, the magnetic field lens can make the beam 1 spread narrow and long along the longitudinal direction of the hot bar plate 30. [

Next, although not shown, the heating apparatus for manufacturing parts may further include a temperature sensor. The temperature sensor senses the temperature of the hot bar plate (30).

At this time, the control unit 60 controls the beam discharge in the beam source 10 and the cooling fluid circulation in the cooling hole 40 according to the preset information and the result sensed by the temperature sensor.

The foregoing embodiments and accompanying drawings are not intended to limit the scope of the present invention but to illustrate the present invention in order to facilitate understanding of the present invention by those skilled in the art. Embodiments in accordance with various combinations of the above-described configurations can also be implemented by those skilled in the art from the foregoing detailed description. Accordingly, various embodiments of the present invention may be embodied in various forms without departing from the essential characteristics thereof, and the scope of the present invention should be construed in accordance with the invention as set forth in the appended claims. Alternatives, and equivalents by those skilled in the art.

1: beam or electron beam 10: beam source
11: beam generating unit 13: grid unit
20: chamber housing 30: hot bar plate
30a: base portion 30b:
40: cooling hole 41: hot bar cooling section
41a: first inner connecting portion 41b: inner cooling portion
43: housing cooling section 43a: housing connection section
43b: housing cooling section 43c: external connection section
50: suction hole 51: hot bar suction hole
51a: second inner connecting portion 51b: inner hall section
51c: Exposure absorption hole 53: Housing connection section
60: control unit 70: beam width setting unit
100:

Claims (11)

A beam source for emitting a beam;
A hot bar plate made of a thermally conductive nonmetal material for heating the heated object to be heated by receiving the beam emitted from the beam source;
A control unit for controlling the emission of the beam at the beam source;
A cooling hole passing through the inside of the hot bar plate and circulating a cooling fluid for cooling the hot bar plate;
A suction hole formed to be exposed through the inside of the hot bar plate and exposed to an upper surface thereof and providing a pressure for sucking the target to be heated; And
And a chamber housing having an opening for forming a chamber and irradiating the beam to the rear of the hot bar plate and supporting the hot bar plate on the opening,
The control unit controls the cooling fluid circulation in the cooling holes,
Wherein the cooling hole comprises a hot bar cooling section formed in the hot bar plate and a housing cooling section connected to the hot bar cooling section and penetrating the upper side of the chamber housing,
The suction hole includes a hot bar adsorption hole penetrating the inside of the hot bar plate and exposed to the upper surface of the hot bar plate and a housing connection section penetrating the upper side of the chamber housing to be connected to the hot bar adsorption hole,
The thermally conductive nonmetal material may be diamond, CBN (Cubic Boron Nitride) or BN (Boron Nitride)
The hot bar plate is supported by the chamber housing and is heated by receiving the beam from the rear surface, and is provided with a base portion through which the hot bar cooling section and the hot bar adsorption hole pass, and a base portion projecting from the base portion, And a protruding portion which is heated by the heated body and penetrated by the hot bar adsorption hole exposed on the upper surface,
Wherein the base portion and the protruding portion are integrally formed between the base portion and the protruding portion and without a laminated interface between the base portion and the protruding portion.
In claim 1,
Wherein the hot bar cooling section includes an inner cooling section forming at least one closed loop in the base section and a cooling section penetrating through both ends of the base section to both ends of the inner cooling section and passing through the surface of the base section in contact with the chamber housing, And a first internal connection portion communicating with the housing cooling section passing through the upper side of the housing,
The hot bar adsorption hole may include an exposure absorption hole exposed from the inside of the base portion to the upper surface of the protrusion, a portion connected to the exposure adsorption hole in the base portion and forming the closed loop in the region by the closed loop And a second internal connection portion connected to one end of the inner hole section at at least one of both end portions of the base section and communicating with the housing connection section through the surface of the base section in contact with the chamber housing And a heating device for heating the component.
In claim 2,
The housing cooling section includes a housing connection part connected to the first internal connection part, a housing cooling part connected to the housing connection part and formed in the chamber housing along the periphery of the opening of the chamber housing, And an external connection part for connecting the external connection part.
The method according to any one of claims 1 to 3,
Wherein an opening of the chamber housing is elongated along the longitudinal direction of the hot bar plate,
Wherein the widthwise cross-sectional structure of the opening portion has a structure that is narrower in width than the lower side from the inside of the chamber toward the upper side supporting the hot bar plate.
The method according to any one of claims 1 to 3,
The heating device for manufacturing parts further comprises a temperature sensor for sensing the temperature of the hot bar plate,
Wherein the control unit controls beam emission in the beam source according to preset information and a result sensed by the temperature sensor.
In claim 5,
Wherein the heating device for manufacturing a part further comprises a beam width setting unit for allowing the beam emitted from the beam source to be provided to the hot bar plate at a set beam width.
In claim 6,
Wherein the beam width setting unit is a magnetic lens for providing the beam to the hot bar plate in a predetermined shape along the longitudinal direction of the hot bar plate.
In claim 5,
Wherein the beam source includes a beam generator for generating and emitting the beam, and a grid for accelerating the beam emitted from the beam generator, the beam being uniformly irradiated to the setting area.
The method according to any one of claims 1 to 3,
Wherein the heating device for manufacturing parts is a pulse heating method.
The method according to any one of claims 1 to 3,
Wherein the beam is an electron beam, an ion beam, or a laser beam.
The method according to any one of claims 1 to 3,
Wherein the heating device for manufacturing parts is used for soldering electronic parts.

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