KR20190042838A - Flexible module system and connection structure - Google Patents

Abstract

A flexible energy module with a structure capable of tension comprises: a plurality of island-shaped energy elements in which at least one electrode is formed to convert energy; and an interconnect connecting each adjacent energy elements. The interconnect is manufactured to allow electricity to flow by including a conductor and is located under the connected energy element in a folded shape. When outward force is exerted on both ends of the energy module, the energy module is tensioned since the folded shape of the interconnect is unfolded.

Description

[0001] FLEXIBLE MODULE SYSTEM AND CONNECTION STRUCTURE [0002]

The present invention relates to a flexible module system and a connection structure, and more particularly, to an island-bridge concept module device and a connection structure thereof that minimize the area occupied by an interconnect.

In general, a module structure consists of a working device area, which is a real working area, and an interconnect that connects the working device area. In recent years, there is an increasing demand for wearable devices as well as miniaturization of devices. Therefore, there is an increasing need for flexible modules that occupy a small area.

The island-bridge concept approach has been widely used as a representative approach for creating a flexible modular system. The island-bridge concept refers to a structure that includes a bridge that is an interconnect that connects working devices and working devices located on an island.

Particularly, in an energy device such as a solar cell, in order to increase the flexibility and tensile property of the island-bridge concept, the area occupied by the interconnect must increase. On the other hand, the area occupied by the working device, which is a region that substantially performs work in the modular system of the energy element, must be wide so that the module performance can be improved.

In the conventional energy element module of the general island-leg concept, since the working device and the interconnect are located on the same plane, there is a problem that the active area occupied by the working device is reduced in order to increase the tensile or flexibility.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is an object of the present invention to minimize the area occupied by the pre-tension interconnect by using a method such as kirigami, origami, And aims to provide a module device and structure thereof which satisfy both the performance and the tensile property of the module by maximizing the area.

In order to achieve the above object, according to one aspect of the present invention, there is provided a flexible energy module of a structure capable of being tensioned, comprising: a plurality of island-shaped energy elements in which one or more electrodes are formed to convert energy, Wherein the interconnect is fabricated to allow electricity to flow therethrough including a conductor positioned below the connected energy element in a folded configuration and wherein when the energy module is externally biased on the ends of the energy module, An energy module is provided that is stretched by the expanded form of the fold.

According to an embodiment of the present invention, when the force externally applied to both ends of the energy module disappears, the interconnect may be returned to the folded configuration.

According to an embodiment of the present invention, the energy module further includes an elastic member connected to both ends of the energy module, wherein the elastic member is configured such that when the force externally applied to both ends of the energy module disappears, can do.

According to an embodiment of the present invention, the folded shape of the interconnect is a Kirigami pattern, and the length of the folded shape of the interconnect may be equal to the total length of the adjacent energy device, have.

According to an embodiment of the present invention, the folded shape of the interconnect may be a native pattern.

According to an embodiment of the present invention, the folded shape of the interconnect may be a spiral spring pattern.

According to an embodiment of the present invention, the interconnect may be located under the adjacent energy element in a folded form such that the distance between adjacent energy elements is zero.

According to an embodiment of the present invention, the plurality of island-shaped energy devices may be solar cells.

According to a further aspect of the present invention there is provided a flexible module of a tensionable structure comprising a plurality of island elements, an LED disposed in each of the plurality of island elements, and an interconnect connecting each of the adjacent elements, The module being provided with a module that is tensioned by expanding the collapsed shape of the interconnect when the module is externally biased on both ends of the module, .

According to an embodiment of the present invention, when the force externally applied across the module disappears, the interconnect may be returned to the folded configuration.

According to an embodiment of the present invention, there is further provided an elastic member connected to both ends of the module, the elastic member being capable of supporting the module to return to the previous state when the force externally applied to both ends of the module disappears .

According to an embodiment of the present invention, the folded shape of the interconnect may be any of a Kirigami pattern, an origami pattern, and a spiral spring pattern.

Devices in accordance with various embodiments of the present invention enable a modular architecture that minimizes the area occupied by the pre-tension interconnect using various folding methods. Further, the apparatus proposed in the present invention simultaneously improves the active region and the tensile property occupied by the working device, thereby enabling a module structure of a high-performance flexible energy element. Therefore, it is possible to expand and spread the energy device module in locations and fields where it has been difficult to introduce the energy device module up to now through the energy device module having high tensile properties and flexibility.

The effects obtained by the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description will be.

Figure 1 shows a modular system of a conventional island-leg concept.
Figures 2A-2C illustrate a schematic interconnect structure of a Kirigami pattern according to an embodiment of the present invention.
3A-3C illustrate a schematic interconnect structure of a spiral spring pattern according to an embodiment of the present invention.
4A to 4C illustrate a folding process of reducing the interconnect of the Kirigami pattern according to an embodiment of the present invention to the same length as the island region.
Figures 5A through 5C illustrate a folding process to reduce the interconnect of Kirigami patterns according to an embodiment of the present invention to half of the island region length.
6A to 6C illustrate a folding process of reducing the interconnect of a Kirigami pattern according to an embodiment of the present invention to 1/4 of the island region length.
7A-7D illustrate the tensile state of a 2X2 module with a Kirigami pattern interconnect according to an embodiment of the present invention.
Figures 8A-8D illustrate the tensile state of a 2X2 module with an interconnect of an origami pattern (accordion structure) according to one embodiment of the present invention.
9A-9C illustrate a bottom view of a tensile state of a 3X3 module with a Kirigami pattern interconnect in accordance with an embodiment of the present invention.
10A-10B show a top view of a tensile state of a 3X3 module with an interconnect of Kirigami pattern in accordance with an embodiment of the present invention.
11A to 11E illustrate a tensioned state of an LED module having interconnects of spiral spring patterns according to an embodiment of the present invention.
12A to 12C illustrate a tensile state of an LED module having an interconnect of a spiral spring pattern according to another embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, the terms first, second, etc. may be used to describe various components, but the components may not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The term " and / or " may include any combination of a plurality of related listed items or any of a plurality of related listed items.

On the other hand, when it is mentioned that an element is " directly connected " or " directly coupled " to another element, it can be understood that no other element exists in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In this application, the terms "comprise", "having", and the like are used interchangeably to designate the presence of stated features, integers, steps, operations, elements, parts or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Although the present invention is described on the premise of an energy element module such as a solar cell, it is only an illustrative example for explanation, and the scope of the present invention is not limited thereto.

Figure 1 shows a modular system of a conventional island-leg concept.

1, the island-bridge concept includes a plurality of islands 110, interconnects 120 electrically interconnecting the plurality of islands 110, and a plurality of islands 110 on the substrate 100, And a plurality of posts 130 that are not directly attached to and fixed at a predetermined interval. The substrate 100 may be an elastomeric substrate.

According to one embodiment of the present invention, in the case of a solar cell module, a structure is employed in which a plurality of solar cell elements are connected in series or in parallel to extract electric power. A solar cell device is a semiconductor device that converts light energy generated from the sun into electrical energy. Generally, electricity is generated by using two types of semiconductors, p-type semiconductor and n-type semiconductor. The solar cell module has a structure in which several finely separated solar cell elements are connected in series or in parallel so that a single solar cell fails even if power failure is prevented.

Referring to FIG. 1, a working device for producing substantially energy such as a solar cell is located in the island 110 region. In other words, the substrate 100 includes a plurality of island-shaped energy devices (solar cells) in which one or more electrodes are formed to convert energy. Hereinafter, an island type energy element is referred to as an island for convenience of explanation. Therefore, the larger the area occupied by the island 110 in the same area of the substrate 100, the greater the amount of energy produced, i.e., the performance of the module can be improved.

The interconnect 120 connects the plurality of islands 110. According to one embodiment, the interconnect 120 may electrically connect a plurality of solar cells. For example, the interconnect 120 may be comprised of a conductive metal, or may further comprise a flexible material coated on the surface of the conductive metal.

The posts 130 are structures that support the islands 110, and may, according to one embodiment, be included to support the four corners of a square island 110. According to a different embodiment, the post 130 may have any structure of a support that positions the island 110 at a distance from the substrate 100.

Referring to FIG. 1, since the interconnect 120 is generally formed in the form of a thin conductive wire made of a conductive metal, it can be manufactured in a zigzag shape to allow a certain level of tension. However, due to the nature of the conductive metal material, even if a small force is applied, it may lose its restoring force if it is pulled above a certain level. In addition, since the area occupied by the interconnect 120 can not be entirely excluded, the active region may be reduced and the efficiency of the energy device may deteriorate.

In order to solve the problems of the conventional energy element module, there is a need for a method for simultaneously maximizing the tensile property while minimizing the area occupied by the interconnect. To this end, the present invention proposes a structure in which Kirigami, origami, spiral spring patterns and the like, which are advantageous for tension, are introduced into the interconnect and the interconnect is folded in the region between the island and the substrate. The structure of the above-described interconnect is shown in Figs. 2-8.

Figures 2A-2C illustrate a schematic interconnect structure of a Kirigami pattern according to an embodiment of the present invention.

Referring to FIG. 2A, the interconnect 120 may have a symmetrical structure formed in a Kirigami pattern and connected to the islands 110-1 and 110-2 at both ends thereof. In accordance with one embodiment of the present invention, the interconnect 120 may be made of a material that is conductive, such as an elastomer including a material such as nanowires, but is foldable and has a moderate elasticity that can be restored to its original shape. For example, the interconnect 120 may be a Kirigami pattern structure in which the conductive nanomaterial is pressed onto the polymer filament using a 3D printer. When the interconnect 120 is folded along the dotted line, it may have a structure as shown in FIGS. 2B and 2C.

Referring to FIG. 2B, there is shown a perspective view of a structure formed by folding the interconnect 120 of the Kirigami pattern of FIG. 2A along the dotted line from the bottom. Referring to FIG. 2C, there is shown a top perspective view of the structure of folded interconnect 120 of the Kirigami pattern of FIG. 2A along the dashed line. When the interconnect 120 is folded along the dotted line, the islands 110-1 and 110-2 at both ends are brought into contact with each other, and the interconnect 120 is located in the space below the islands 110-1 and 110-2. Thus, in a structure including posts having spaces between the substrate and the islands, the interconnects 120 are located below the islands 110-1 and 110-2, and the area occupied by the interconnects 120 can be minimized have. In addition, as shown in Figure 2A, the actual length of the collapsed interconnect 120 with a Kirigami pattern is sufficiently long so that the module structure can provide flexibility that can be folded or stretched sufficiently.

3A-3C illustrate a schematic interconnect structure of a spiral spring pattern according to an embodiment of the present invention.

Referring to FIG. 3A, the interconnects 120-1 to 120-6 are formed in a spiral spring pattern and have a symmetrical structure. Each pair of interconnects 120-1 and 120-2, 120-3 and 120-4, 120-5 and 120-6 has a structure that is connected to the islands 110-1 to 110-4 at both ends thereof . In accordance with one embodiment of the present invention, interconnects 120-1 through 120-6 may be made of a material that is conductive, such as an elastomer including a material such as nanowires, but that is foldable and has a moderate elasticity, . When the interconnect 120 is folded along a dotted line, it may have a structure as shown in FIGS. 3B and 3C.

Referring to FIG. 3B, a top view of the structure formed by folding the interconnects 120-1 to 120-6 of the spiral spring pattern of FIG. 3A along the dotted line is shown. Referring to FIG. 3C, there is shown a side view of a structure formed by folding the interconnects 120-1 to 120-6 of the spiral spring pattern of FIG. 3A along the dotted line. When the interconnects 120-1 to 120-6 are folded along the dotted lines, the islands 110-1 to 110-4 at both ends are brought into contact with each other, and the spiral portion of the interconnects 120-1 to 120-6 is connected to the island (110-1 to 110-4), the straight line portion is located in the lower space. 3A, the interconnects 120-1 through 120-6 are located above or below the islands 110-1 through 110-4, and substantially the interconnects 120-1 through 120-4 are located above or below the islands 110-1 through 110-4, 120-6) can be minimized. Further, as shown in FIG. 3A, since the actual lengths of the collapsed interconnects 120-1 through 120-6 with the spiral spring pattern are sufficiently long, the module structure can provide flexibility that can be folded or stretched sufficiently.

4A to 4C illustrate a folding process of reducing the interconnect of the Kirigami pattern according to an embodiment of the present invention to the same length as the island region.

Referring to FIGS. 4A-4C, a pattern folding method is shown for reducing the interconnect 120 of Kirigami patterns to the same length as the islands 110-1, 110-2. According to one embodiment of the present invention, the area occupied by the interconnect 120 can be minimized by folding the two portions of the interconnect 120 and the boundary between the interconnect 120 and the islands 110-1 and 110-2.

Referring to FIG. 4A, the islands 110-1 and 110-2 are farthest away from each other in the maximum tension state. At this time, the length of the interconnect 120 is maximized by the Kirigami pattern.

Referring to FIG. 4B, the intermediate state shows an intermediate state where the two portions of the interconnect 120 and the boundary portions of the interconnects 120 and the islands 110-1 and 110-2 are folded.

4C, the collapsed state is a state in which the two parts of the interconnect 120 and the interconnect 120 and the boundary of the islands 110-1 and 110-2 are folded so that the length occupied by the interconnect 120 is less than the length of the islands 110-1 , 110-2, respectively. The interconnect 120 can be hidden under the islands 110-1 and 110-2 so that the area occupied by the interconnect 120 at this point can be minimized.

Figures 5A through 5C illustrate a folding process to reduce the interconnect of Kirigami patterns according to an embodiment of the present invention to half of the island region length.

Referring to Figures 5A-5C, a pattern folding method is shown for reducing the interconnect 120 of Kirigami patterns to half the length of the islands 110-1, 110-2. In accordance with one embodiment of the present invention, the area occupied by the interconnect 120 can be minimized by folding the six portions of the interconnect 120 and the boundaries of the interconnect 120 and the islands 110-1 and 110-2.

Referring to FIG. 5A, in the maximum tension state, the islands 110-1 and 110-2 are located farthest from each other, and the length of the interconnect 120 is maximized by the Kirigami pattern.

Referring to FIG. 5B, the intermediate state shows an intermediate state folding the six portions of the interconnect 120 and the boundary portions of the interconnect 120 and the islands 110-1 and 110-2.

5C, the collapsed state is a state in which the length occupied by the interconnect 120 by folding the six portions of the interconnect 120, the interconnect 120, and the islands 110-1 and 110-2, , And 110-2, respectively. The interconnect 120 can be hidden under the islands 110-1 and 110-2 so that the area occupied by the interconnect 120 at this point can be minimized. The length occupied by the interconnect 120 is one-half of that of FIG. 4A, but the height is twice that of FIG. 4A.

6A to 6C illustrate a folding process of reducing the interconnect of a Kirigami pattern according to an embodiment of the present invention to 1/4 of the island region length.

Referring to Figs. 6A-6C, a pattern folding method is shown for reducing the interconnect 120 of Kirigami pattern to 1/4 of the length of the islands 110-1, 110-2. According to one embodiment of the present invention, the open area of the interconnect 120 and the boundary of the interconnect 120 and the islands 110-1 and 110-2 may be folded to minimize the area occupied by the interconnect 120. [

Referring to FIG. 6A, in the maximum tension state, the islands 110-1 and 110-2 are located farthest from each other, and the length of the interconnect 120 is maximized by the Kirigami pattern.

Referring to FIG. 6B, the intermediate state shows an intermediate state of folding the fourteen part of the interconnect 120 and the boundary of the interconnect 120 and the islands 110-1 and 110-2.

6C, the collapsed state is formed by folding the fourteen part of the interconnect 120 and the boundary between the interconnect 120 and the islands 110-1 and 110-2 so that the length occupied by the interconnect 120 is less than the length of the islands 110-1 , 110-2, respectively. The interconnect 120 can be hidden under the islands 110-1 and 110-2 so that the area occupied by the interconnect 120 is substantially minimized. The length occupied by the interconnect 120 is 1/4 of Fig. 4A, but the height is quadrupled from Fig. 4A.

As shown in Figs. 4A-6C, a suitable folding scheme can be selected, taking into account the correlation of the plane length and height occupied by the interconnect 120 and the restoring force after the module is tensioned.

7A-7D illustrate the tensile state of a 2X2 module with a Kirigami pattern interconnect according to an embodiment of the present invention.

Referring to FIG. 7A, the reduced state is a bottom perspective view in which the length of the interconnect 120 is reduced to 1/2 of the length of the islands 110-1 and 110-2 according to the folding method shown in FIG. 5C.

Referring to FIG. 7B, the reduction module state is a top view of the 2X2 module with the half-reduced islands 110-1 to 110-4 connected thereto. The interconnects 120-1 to 120-4 are located below the islands 110-1 to 110-4 and have a filling ratio, that is, an area occupied by the working device in the overall system is one.

Referring to FIG. 7C, in the first tension state, an external force is applied to the module, and the diagonal length between the islands 110-1 to 110-4 is stretched by 50%. According to one embodiment of the present invention, the module may further include an elastic member 140 to increase the restoring force. The elastic member 140 may be a material having a restoring force to return to a circular state such as rubber or an elastomer. 7B if the external force is removed from the interconnect 120 that has been tensioned according to the material and dimensions (length, thickness, etc.) of the interconnect 120. In order to more reliably assure such restoring force, the elastic member 140 may be used. That is, the elastic member 140 may serve to assist the module to return to its original state. The module including the elastic member 140 can easily return to the state of 1 when the external force is removed, as in the case of the shrink module of FIG. 7B.

Referring to FIG. 7D, the second tensile state is such that a larger external force is applied to the module and the diagonal length between the islands 110-1 to 110-4 is stretched by 100%. According to one embodiment of the present invention, the module may further include an elastic member 140 to increase the restoring force.

Figures 8A-8D illustrate the tensile state of a 2X2 module with an interconnect of an origami pattern (accordion structure) according to one embodiment of the present invention.

Referring to FIG. 8A, the reduced state is a bottom perspective view in which the interconnect 120 is folded and reduced to a length equal to the length of the islands 110-1 and 110-2.

Referring to FIG. 8B, the reduction module state is a plan view of the 2X2 module with the island 110-1 through 110-4 in a contracted state of FIG. The interconnects 120-1 to 120-4 are located under the islands 110-1 to 110-4, and have a charge rate of 1.

Referring to FIG. 8C, in the first tension state, an external force is applied to the module, and the diagonal length between the islands 110-1 to 110-4 is 30%. According to one embodiment of the present invention, the module may further include an elastic member 140 to increase the restoring force. The elastic member 140 may serve to assist in returning the module to its original state, and may be made of a material such as rubber or elastomer. The module including the elastic member 140 can easily return to the state of 1 when the external force is removed, as in the case of the shrink module of FIG. 8B.

Referring to FIG. 8D, the second tensile state is such that a larger external force is applied to the module and the diagonal length between the islands 110-1 to 110-4 is 60% stretched. According to one embodiment of the present invention, the module may further include an elastic member 140 to increase the restoring force.

9A-9C illustrate a bottom view of a tensile state of a 3X3 module with a Kirigami pattern interconnect in accordance with an embodiment of the present invention.

Referring to FIG. 9A, the reduction module state is a bottom view of the 3X3 module with the islands 110-1 through 110-9 joined together. The interconnects 120-1 through 120-12 are located under the islands 110-1 through 110-9 and have a fill factor of one.

Referring to FIG. 9B, the first tension state is a state in which an external force is applied to the module, and the length of the interconnects 120-1 to 120-12 between the islands 110-1 to 110-9 is partially stretched. For example, the first tension condition may be an intermediate state in which the folded interconnects 120-1 through 120-12 are partially unfolded.

Referring to Fig. 9C, the second tension condition is a tensioned state in which a greater external force is applied to the module so that the interconnects 120-1 through 120-12 between the islands 110-1 through 110-9 are fully extended. For example, the second tension condition may be the full tensile state in which all of the folded interconnects 120-1 through 120-12 are unfolded.

10A-10B show a top view of a tensile state of a 3X3 module with an interconnect of Kirigami pattern in accordance with an embodiment of the present invention.

Referring to FIG. 10A, the shrink module state is a top view of the 3X3 module with the islands 110-1 through 110-9 joined together. The interconnects 120-1 through 120-12 are not visible below the islands 110-1 through 110-9, and have a fill factor of one.

Referring to FIG. 10B, the tensile state is a state in which an external force is applied to the module to stretch the lengths of the interconnects 120-1 to 120-12 between the islands 110-1 to 110-9. For example, the tensile state can be the maximum tensile state in which all of the folded interconnects 120-1 through 120-12 are unfolded. According to one embodiment of the present invention, the module may further include an elastic member 140 to increase the restoring force. The elastic member 140 may serve to assist in returning the module to its original state, and may be made of a material such as rubber or elastomer. The module including the elastic member 140 can easily return to a state where the filling rate is 1 as in the case of the reducing module of FIG. 10A when the external force is removed.

11A to 11E illustrate a tensioned state of an LED module having interconnects of spiral spring patterns according to an embodiment of the present invention.

Referring to FIG. 11A, the reduced state is a state in which the interconnects 120-1 to 120-6 of the spiral spring pattern according to the embodiment of the present invention are folded and the filling rate is 1.

Referring to FIG. 11B, the reduction module state is a plan view of a module having LEDs mounted on the islands 110-1 to 110-4 as viewed from above. The interconnects 120-1 through 120-6 are located under the islands 110-1 through 110-4 and have a fill factor of one. Thus, the LEDs before stretching can be positioned adjacent to each other since there is no gap between the islands 110-1 to 110-4.

Referring to FIG. 11C, in the first tensile state, an external force is applied to the module, and the length between the islands 110-1 to 110-4 is 100%. For example, the first tension state may remain in the spiral form of interconnects 120-1 through 120-6 in an intermediate state where folded interconnects 120-1 through 120-6 are partially unfolded.

Referring to FIG. 11D, the second tensile state is a state in which a greater external force is applied to the module and the length between the islands 110-1 to 110-4 is 420% stretched. The second tensile state may be a state in which the spiral shape of the interconnects 120-1 to 120-6 is unrecognized.

Referring to FIG. 11E, the third tensile state is a state in which a greater external force is applied to the module and the length between the islands 110-1 to 110-4 is 720%. The third tensile state may be in the form of a nearly straight line with no spiral form of the interconnects 120-1 through 120-6. As the length between the islands 110-1 to 110-4 is stretched, the distance between the LEDs also increases proportionally.

12A to 12C illustrate a tensile state of an LED module having an interconnect of a spiral spring pattern according to another embodiment of the present invention.

12A, the reduced state is a state in which the interconnects 120-1 to 120-6 of the spiral spring pattern according to another embodiment of the present invention are folded and the filling rate is 1.

Referring to FIG. 12B, the reduction module state is a plan view of a module having LEDs mounted on the islands 110-1 to 110-4 as viewed from above. The interconnects 120-1 through 120-6 are located under the islands 110-1 through 110-4 and have a fill factor of one. The LEDs before stretching can be positioned adjacent.

Referring to FIG. 12C, a tensile state is a state in which an external force is applied to the module and a length between the islands 110-1 to 110-4 is 200%. For example, the tensile state may be in the unfolded state of the folded interconnects 120-1 through 120-6. As the length between the islands 110-1 to 110-4 is stretched, the distance between the LEDs also increases proportionally.

The embodiments according to Figs. 11A to 12C can be utilized as an apparatus for visually displaying a tensile state of a module by attaching a display device such as an LED to the islands.

In the above-mentioned specific embodiments, the elements included in the invention have been expressed singular or plural in accordance with the specific embodiments shown. It should be understood, however, that the singular or plural representations are selected appropriately for the sake of convenience of description and that the above-described embodiments are not limited to the singular or plural constituent elements, , And may be composed of a plurality of elements even if they are represented by a single number.

While the invention has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the scope of the present invention should not be limited by the illustrated embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.

100: substrate 110: island
120: Interconnect 130: Post
140: elastic member

Claims (12)

As a flexible energy module with a tensionable structure,
A plurality of island-shaped energy elements for converting at least one electrode into energy; And
An interconnect interconnecting adjacent energy elements,
The interconnect is fabricated to allow electricity to flow, including conductors, and is located under the connected energy element in a folded form,
Wherein when the energy module is externally forced across the energy module, the energy module is pulled by expanding the folded shape of the interconnect. The method according to claim 1,
Wherein when the force externally applied across the energy module disappears, the interconnect returns to the folded configuration. The method of claim 2,
And an elastic member connected to both ends of the energy module,
Wherein the elastic member assists the energy module to return to its previous state when the force externally applied across the energy module disappears. The method according to claim 1,
Wherein the folded shape of the interconnect is a Kirigami pattern,
The length of the folded shape of the interconnect being equal to, or a half or a quarter of the total length of the adjacent energy element. The method according to claim 1,
Wherein the folded shape of the interconnect is a native pattern. The method according to claim 1,
Wherein the folded shape of the interconnect is a spiral spring pattern. The method according to claim 1,
Wherein the interconnect is located under the adjacent energy element in a folded configuration such that the distance between adjacent energy elements is zero. The method according to claim 1,
Wherein the plurality of island-shaped energy elements are solar cells. As a flexible module with a tensile-capable structure,
A plurality of island elements;
An LED disposed in each of the plurality of island elements; And
An interconnect interconnecting adjacent elements,
The interconnect is fabricated to allow electricity to flow, including a conductor, positioned below the connected element in a folded configuration,
Wherein when a force is externally applied across the module, the module is tensioned by expanding the folded shape of the interconnect. The method of claim 9,
Wherein when the force externally applied across the module disappears, the interconnect returns to the folded configuration. The method of claim 10,
Further comprising an elastic member connected to both ends of the module,
Wherein the elastic member assists the module to return to its previous state when the force externally applied to both ends of the module disappears. The method of claim 9,
Wherein the collapsed shape of the interconnect is any of a Kirigami pattern, an origami pattern, and a spiral spring pattern.

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