KR20190003515A - 360 degree hinge assembly for electronic devices - Google Patents

Abstract

In one example, the hinge assembly for an electronic device comprises a first bracket rotatable about a first shaft extending through a first bushing and comprising the first bracket coupled to the first bushing disposed at a first end of the first bracket, A first linkage arm rotatable about a second shaft extending through the second bushing and a second linkage arm rotatable about the second shaft extending through the second bushing, A third hinge including a second bracket rotatable about a third shaft extending through the second bushing and coupled to the second bushing disposed at a first end of the second bracket, Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples can be described.

Description

360 degree hinge assembly for electronic devices

Related application

This application claims the benefit of 35 U.S.C. In accordance with § 365 (c), priority is claimed to US Application No. 15 / 163,165, filed May 24, 2017, entitled 360 DEGREE HINGE ASSEMBLY FOR ELECTRONIC DEVICES FOR ELECTRONIC DEVICES do. The entire disclosure of which is hereby incorporated by reference in its entirety.

The subject matter described herein relates generally to the field of electronic devices, and more particularly to 360 degree hinge assemblies in electronic devices.

Electronic devices such as laptop computers, notebook computers, and the like include a display that is generally coupled to the base section by a hinge assembly. The design advancement in mobile computing devices has increased the need for hinge assemblies that allow rotation in the 360 degree range between the base section and the second section that can include the display. Additional hinge arrangements may therefore be useful.

The detailed description will be made with reference to the accompanying drawings.
1 is a schematic illustration of an electronic device that may be adapted to implement a 360 degree hinge assembly in accordance with some examples.
2 is an illustration of a perspective view of a 360 degree hinge assembly in accordance with an example.
Figures 3A-3E are schematic perspective views of a hinge assembly and electronic device according to various examples at various degrees of rotation.
Figures 4A-4E are schematic cross-sectional illustrations of an electronic device including a 360 degree hinge assembly in accordance with various examples at various degrees of rotation.
5 is a side elevational view of an electronic device fully rotated into a table mode according to various examples.
Figures 6-10 are schematic illustrations of electronic devices that may be adapted to implement a 360 degree hinge assembly in accordance with some examples.

Exemplary systems and methods for implementing a 360 degree hinge assembly in electronic devices are described herein. In the following description, numerous specific details are set forth in order to provide a thorough understanding of various examples. It will be appreciated, however, by one of ordinary skill in the art that various embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been shown or described in detail to avoid obscuring the specific examples.

As described above, it may be useful to provide 360 degree hinge assemblies to electronic device displays. The subject matter described herein solves these and other problems by providing a hinge assembly for an electronic device that is rotatable about a first shaft extending through a first bushing and is rotatable about a first axis of a first bracket, A first bushing including the first bracket coupled to the first bushing disposed at an end thereof and coupled to the first section, a second bushing, a first bushing rotatable about a second shaft extending through the second bushing, A second hinge including a linkage arm and a second linkage arm rotatable about the second shaft extending through the second bushing and a second shaft rotatable about a third shaft extending through the second bushing, And a third hinge coupled to the second section and including the second bracket coupled to the second bushing disposed at a first end of the bracket, wherein the first linkage arm rotates Neunghage bonded and the second linkage arm is rotatably coupled to the third shaft.

Additional structural and operational details will be described with reference to Figures 1 to 10 below.

1 is a schematic illustration of an electronic device 100 that may be adapted to implement a 360 degree hinge assembly in accordance with some examples. In some instances, the electronic device 100 may include a chassis 160 having a first section 162 and a second section 164 rotatably coupled to the first section 162 by a hinge assembly. In various examples, the electronic device 100 includes one or more accompanying input / output devices including a display, one or more speakers, a keyboard, one or more other I / O device (s), a mouse, a camera, Can be combined. Other exemplary I / O device (s) may include, but are not limited to, a touch screen, a voice activated input device, a track ball, a geolocation device, an accelerometer / gyroscope, biometric feature input devices, Lt; RTI ID = 0.0 > and / or < / RTI >

The electronic device 100 includes system hardware 120 and memory 140, which may be implemented as random access memory and / or read only memory. A file repository may be communicatively coupled to the electronic device 100. The file repository may be internal to the electronic device 100, such as, for example, an eMMC, an SSD, one or more hard drives, or other types of storage devices. Alternatively, the file repository may also be external to the electronic device 100, such as, for example, one or more external hard drives, network attached storage, or discrete storage networks.

The system hardware 120 may include one or more processors 122, a graphics processor 124, a network interface 126, and bus structures 128. In one example, processor 122 may be an Intel Atom processor based on Intel Atom-based System-on-a-Chip (SOC) or Intel Core 2 Duo (Intel® Core2 Duo®) or i3 / i5 / i7 series processors. As used herein, the term " processor " refers to a microprocessor, microcontroller, a complex instruction set computing (CISC) microprocessor, a reduced instruction set (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, Means any type of computing element, such as, but not limited to, any other type of processor or processing circuitry.

Graphics processor (s) 124 may function as an attached processor that manages graphics and / or video operations. The graphics processor (s) 124 may be integrated on the motherboard of the electronic device 100 or may be coupled through expansion slots on the motherboard, or may be located on the same die or the same package as the processing unit.

In one example, the network interface 126 may be a wired interface such as an Ethernet interface (e.g., see Institute of Electrical and Electronics Engineers / IEEE 802.3-2002) or an IEEE 802.11a, b, or g- compliant interface For more information, please refer to the IEEE Standard for IT-Telecommunications and Information Exchange between systems LAN / MAN - Part II: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications Amendment 4: 802.11G-2003). Other examples of air interfaces include a general packet radio service (GPRS) interface (e.g., see Guidelines on GPRS Handset Requirements, Global System for Mobile Communications / GSM Association, Ver. 3.0.1, December 2002).

The bus structures 128 couple various components of the system hardware 128. In one example, the bus structures 128 may be implemented as a memory bus, a peripheral bus or an external bus, and / or an 11-bit bus, an industry standard architecture (ISA), a micro-channel architecture (MSA), an extended ISA (PCI), Universal Serial Bus (USB), Advanced Graphics Port (AGP), Personal Computer Memory Card International Association Bus (PCMCIA), and Small Computer System Interface (IDE), VESA Local Bus (VLB), Peripheral Component Interconnect Including a local bus using any of a variety of available bus architectures including, but not limited to, SCSI, high speed synchronous serial interface (HSI), serial low power inter-chip media bus (SLIMbus) Type bus structure (s).

The electronic device 100 includes an RF transceiver 130 for transmitting and receiving RF signals, a short range wireless communication (NFC) radio 134 and a signal processing module 132 for processing signals received by the RF transceiver 130 can do. The RF transceiver may implement a local wireless connection over a protocol such as, for example, Bluetooth or 802.11X. IEEE 802.11a, b, or g-compliant interfaces (eg, IEEE Standard for Information Technology between Telecommunications and Information Exchange between systems LAN / MAN - Part II: Wireless LAN Medium Access Control (MAC) 4: Further Higher Data Rate Extension in the 2.4 GHz Band, 802.11G-2003). Other examples of air interfaces may be WCDMA, LTE, General Packet Radio Service (GPRS) interfaces (see, for example, Guidelines on GPRS Handset Requirements, Global System for Mobile Communications / GSM Association, Ver. 3.0.1, December 2002 ).

The electronic device 100 may further include one or more input / output interfaces, such as, for example, a keypad 136 and a display 138. In some instances, the electronic device 100 does not have a keypad and can use the touch panel for input.

The memory 140 may include an operating system 142 for managing operations of the electronic device 100. In one example, operating system 142 includes a hardware interface module 154 that provides an interface to system hardware 120. The operating system 140 also includes a file system 150 that manages the files used to operate the electronic device 100 and a process control subsystem 152 that manages processes running on the electronic device 100 .

The operating system 142 may include (or manage) one or more communication interfaces 146 that may operate in conjunction with the system hardware 120 to send and receive data packets and / or data streams from a remote source. The operating system 142 may further include a system call interface module 144 that provides an interface between the operating system 142 and one or more application modules resident in the memory 130. [ The operating system 142 may be implemented as a UNIX operating system or any derivative thereof (e.g., Linux, Android, etc.) or as a Windows® brand operating system, or other operating systems.

In some instances, the electronic device may include a controller 170, which may include one or more controllers separate from the main execution environment. This separation may be physical in that the controller can be implemented in controllers that are physically separate from the main processors. Alternatively, a trusted execution environment may be logical in that the controller may be hosted on the same chip or chipset hosting the main processor.

By way of example, in some instances, the controller 170 is an independent integrated circuit located on the motherboard of the electronic device 100, for example, as a dedicated processor block on the same SOC die. In other instances, a trusted execution engine may be implemented on a portion of processor (s) 122 that is separate from the remainder of processor (s) using hardware enforcement mechanisms.

In the example depicted in FIG. 1, the controller 170 includes a processor 172, a memory module 174, and an I / O interface 178. In some instances, the memory module 174 may comprise a persistent flash memory module, and the various functional modules may be implemented as logic instructions encoded in a persistent memory module, e.g., firmware or software. I / O module 178 may include a serial I / O module or a parallel I / O module. Controller 170 may be secured (i. E., Typically by mounting software attacks from host processor 122) since controller 170 is separate from main processor (s) 122 and operating system 142 Hackers are inaccessible).

In various examples, the electronic device 100 may be implemented as a mobile information processing platform, e.g., a laptop computer, a tablet device, a mobile phone, an electronic reader, a dual-screen device, or other similar.

2 is an illustration of a perspective view of a 360 degree hinge assembly in accordance with an example. 2, hinge assembly 200, which may be used with electronic device 100 in some examples, is rotatable about a first shaft 216 extending through a first bushing 214, And a first hinge 210 including a first bracket 212 coupled to a first bushing 214 disposed at a first end of the first bushing 212.

The hinge assembly 210 includes a second bushing 222, a first linkage arm 224 rotatable about a second shaft 226 extending through the second bushing 222, and a second bushing 222 And a second hinge 220 including a second linkage arm 228 rotatable about a second shaft 226 extending therethrough.

The hinge assembly 200 is rotatable about a third shaft 236 extending through the second bushing 234 and coupled to a third bushing 234 disposed at a first end of the second bracket 232 And a third hinge 230 including a second bracket 232. In some instances, the first linkage arm 224 is rotatably coupled to the first shaft 216 and the second linkage arm 228 is rotatably coupled to the third shaft 236.

In some instances, the first bracket 212 is rotatable about the first shaft 216 throughout the first angular rotational range. In the example depicted in Figure 2, the first angular rotation range is defined by the tab 213 on the first bracket 212 rotating within the groove 223 formed on the surface of the first linkage arm 224. Bracket 212 in FIG. 2 is depicted at a first limit within a first angular rotation range. The bracket 212 is free to rotate about the first shaft 216 within the range of angular motion defined by the groove 223.

In some instances, the first bushing 214 provides a first rotational resistance to the first hinge 210. In the example depicted in FIG. 2, the first bushing 214 is configured to provide a frictional engagement with the first shaft 216 to provide a first rotational resistance to the first hinge 210.

In some instances, the first linkage arm 224 and the second linkage arm 226 are rotatable about the second shaft 226 throughout the 360 degree angular range of motion. In the embodiment depicted in Figure 2, the second bushing 234 includes a torque engine 225 that provides a second rotational resistance. The torque engine 225 may be implemented with a tension spring and / or a constant torque spring.

In some instances, the second bracket 232 is rotatable about the third shaft 236 throughout the third angular rotational range. In the example depicted in FIG. 2, the third angular rotation range is defined by a tab 233 on the first bracket 232 that rotates within a groove 229 formed on the surface of the second linkage arm 228. Bracket 232 in FIG. 2 is depicted at a first limit within a first angular rotation range. The bracket 232 is free to rotate about the third shaft 236 within the range of angular motion defined by the groove 229. [

In some instances, the second bushing 234 provides a third rotational resistance. In the example depicted in FIG. 2, the second bushing 234 is configured to provide a frictional engagement with the third shaft 236 to provide a third rotational resistance to the third hinge 230.

In some instances, the first hinge 210 may have a first rotational resistance that is less than the second rotational resistance of the second hinge 220. Also, the second rotational resistance of the second hinge 220 may be less than the third rotational resistance of the third hinge 230.

The hinge assembly 200 may be suitably formed of the right material. In some instances, some or all of the various components of the hinge assembly 200 may be formed of one or more suitable metals, for example, steel or aluminum, while in other instances some or all of the various components of the hinge assembly And may be formed of a rigid polymer.

In one example, one or more hinge assemblies 200 may be integrated into a chassis for an electronic device, such as electronic device 100. In these examples, the first bracket 212 may be secured to the first section 162 of the electronic device 100 and the second bracket 232 may be secured to the electronic device 100 to provide a 360 degree hinge assembly for the electronic device 100. [ May be secured to the second section (164) of the housing (100).

The operation of the hinge assembly 200 will be described with reference to Figs. 3A to 3E and Figs. 4A to 4E. Referring to Figures 3a and 4a, when the electronic device 100 is in a closed configuration referred to as the clamshell mode in Figure 3a, the hinge assembly is in the configuration depicted in Figure 3a. In some instances, the chassis of the electronic device 100 may include a first section 162 and a second section 164 disposed proximate the opposing surfaces of the first section 162 and the second section 164 to help secure the electronic device 100 in a closed configuration. Or more magnets 166 (FIG. 4A).

As described above, in some instances, the first hinge 210 may have a first rotational resistance that is less than the second rotational resistance of the second hinge 220. Thus, when the user begins to open the electronic device 100, the first hinge 210 rotates independently from the configuration depicted in Fig. 3A to the configuration depicted in Figs. 3B and 4B. The rotation of the first hinge stops when the tab 213 of the bracket 212 reaches the upper edge of the groove 223 in the linkage arm 224.

When the user continues to open the electronic device, the first linkage arm 224 rotates about the second shaft 226 of the second hinge 220, thereby causing the electronic device 100 to rotate in the direction shown in Figures 3c and 4c In a conventional laptop operating configuration, or as depicted in Figs. 3d and 4d, as shown in Figs.

Continued rotation of the second hinge ultimately causes the linkage arm 224 to come into physical contact with the shaft 236, which limits rotation of the second hinge 220. Continuously applying a torque to the hinge assembly 200 when the second hinge 220 reaches the end of its rotation causes the second bracket 232 to rotate about the third shaft 236, 3e and to a position in tablet mode as depicted in FIG.

The first hinge 210 has a first rotational resistance that is less than the rotational resistance of the second hinge 220 and the rotational resistance of the second hinge is then less than the rotational resistance of the third hinge 230. Thus, when the electronic device 100 is opened, the first hinge 230 is first moved over its entire rotational range, the second hinge 220 is moved a second time over its entire rotational range, Finally, it moves throughout its range of rotation.

Thus, the hinge assembly 200 includes three separate (not shown), independently operating, hinge assemblies 200 that operate independently to provide a full 360 degree rotation between the first section 162 and the second section 164 of the chassis 160 of the electronic device 100 The hinge was used. The first hinge 210 and the third hinge 230 are offset from the second hinge 220 by the linkage arms 224 and 228, respectively. Thus, the first hinge 210 and the third hinge 230 orbit the second hinge 220 as the electronic device 100 is opened and / or closed.

As described above, in some instances the electronic device may be implemented as a computer system. FIG. 6 shows a block diagram of a computing system 600 in accordance with an example. Computing system 600 may include one or more central processing unit (s) 602 or processors that communicate via an interconnection network (or bus) Processors 602 may be any general purpose processor, a network processor (which processes data communicated through computer network 603), or other types of processors (such as a Reduced Instruction Set Computer (RISC) processor or a Complex Instruction Set Computer And the like). Moreover, the processors 602 may have a single or multi-core design. Processors 602 with multi-core designs may incorporate different types of processor cores on the same integrated circuit (IC) die. In addition, processors 602 having a multi-core design may be implemented as symmetric or asymmetric multiprocessors. In one example, one or more of the processors 602 may be the same or similar to the processors 102 of FIG.

The chipset 606 may also communicate with the interconnection network 604. The chipset 606 may include a memory control hub (MCH) The MCH 608 may include a memory controller 610 that communicates with a memory 612 (which may be the same or similar to the memory 130 of FIG. 1). The memory 412 may store data including sequences of instructions that may be executed by the processor 602, or any other device included in the computing system 600. In one example, memory 612 may include one or more volatile storage (or memory) devices, such as random access memory (RAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), static random access memory (SRAM) Devices. A nonvolatile memory such as a hard disk may also be used. Additional devices such as multiple processor (s) and / or multiple system memories may communicate via interconnection network 604.

The MCH 608 may also include a graphical interface 614 in communication with the display device 616. In one example, the graphical interface 614 may communicate with the display device 616 via an accelerated graphics port (AGP). In one example, the display 616 (such as a flat panel display) is configured to translate a digital representation of an image stored in a storage device, such as, for example, video memory or system memory, Lt; RTI ID = 0.0 > 614 < / RTI > The display signal generated by the display device may be communicated through the various control devices before being interpreted by the display 616 and subsequently displayed on the display.

The hub interface 618 may enable the MCH 608 and the input / output control hub (ICH) 620 to communicate. The ICH 620 may provide an interface to the I / O device (s) in communication with the computing system 600. ICH 620 communicates with bus 622 through a peripheral bridge (or controller) 624, such as a peripheral component interconnect (PCI) bridge, a universal serial bus (USB) controller, or other type of peripheral bridge or controller can do. Bridge 624 may provide a data path between processor 602 and peripheral devices. Other types of topologies may be used. In addition, multiple buses may communicate with the ICH 620 via, for example, multiple bridges or controllers. Moreover, other peripheral devices in communication with the ICH 620 may be, in various examples, integrated drive electronics (IDE) or small computer system interface (SCSI) hard drive (s), USB port (s) (S), serial port (s), floppy disk drive (s), digital output support (e.g., digital video interface (DVI)), or other devices.

The bus 622 may communicate with an audio device 626, one or more disk drive (s) 628, and a network interface device 630 (in communication with the computer network 603). Other devices may communicate via bus 622. [ In addition, various components (such as network interface device 630) may be in communication with the MCH 608 in some instances. In addition, the processor 602 and one or more other components discussed herein may be combined to form a single chip (e.g., to provide a system on chip (SOC)). Moreover, the graphics accelerator 616 may be included in the MCH 608 in other examples.

Moreover, the computing system 600 may include volatile and / or non-volatile memory (or storage). For example, non-volatile memory may include one or more of the following: read only memory (ROM), programmable ROM (PROM), erasable PROM (EPROM), electrical EPROM (EEPROM) 628), a floppy disk, a compact disk ROM (CD-ROM), a digital versatile disk (DVD), a flash memory, a magneto-optical disk, or any other device capable of storing electronic data Type non-volatile machine readable medium.

FIG. 7 shows a block diagram of a computing system 700 in accordance with an example. System 700 may include one or more processors 702-1 through 702-N (generally referred to herein as " processors 702 " or " processor 702 "). Processors 702 may communicate via an interconnection network or bus 704. Each processor may include various components, some of which are discussed with reference to processor 702-1 only for clarity. Thus, each of the remaining processors 702-2 through 702-N may include the same or similar components discussed with reference to the processor 702-1.

In one example, processor 702-1 includes one or more processor cores 706-1 through 706-M (referred to herein as "cores 706" or more generally as "cores 706"), A shared cache 708, a router 710, and / or processor control logic or unit 720. The processor cores 706 may be implemented on a single integrated circuit (IC) chip. Moreover, the chip may include one or more shared and / or dedicated caches (e.g., cache 708), busses or interconnection (e.g., bus or interconnection network 712), memory controllers, .

In one example, the router 710 may be used to communicate between the various components of the processor 702-1 and / or the system 700. [ Furthermore, processor 702-1 may include more than one router 710. [ Furthermore, multiple routers 710 may communicate to enable data routing between various components, either internal or external to processor 702-1.

The shared cache 708 may store data (e.g., including instructions) used by one or more components of the processor 702-1, such as the cores 706. [ For example, the shared cache 708 may locally cache data stored in the memory 714 for faster access by the components of the processor 702. [ In one example, the cache 708 may include an intermediate level cache (e.g., level 2 (L2), level 3 (L3), level 4 (L4), or other levels of cache), a last level cache (LLC) Combinations thereof. Moreover, various components of the processor 702-1 may communicate directly with the shared cache 708 via a bus (e.g., bus 712), and / or a memory controller or hub. 7, in some instances, one or more of the cores 706 may include a level 1 (L1) cache 716-1 (generally referred to herein as " L1 cache 716 & .

8 illustrates a block diagram of portions and other components of a processor core 706 of a computing system, according to an example. In one example, the arrows shown in FIG. 8 illustrate the flow direction of the instructions through the core 706. One or more processor cores (e.g., processor core 706) may be implemented on a single integrated circuit chip (or die) as discussed with reference to FIG. Furthermore, the chip may include one or more shared and / or dedicated caches (e.g., cache 708 of FIG. 7), interconnection (e.g. interconnection 704 and / or 112 of FIG. 7) Units, memory controllers, or other components.

As shown in FIG. 8, the processor core 706 may include a fetch unit 802 for fetching instructions (including instructions with conditional branches) for execution by the core 706. The instructions may be fetched from any storage devices, such as memory 714. The core 706 may also include a decode unit 804 for decoding the fetched instruction. For example, the decode unit 804 may decode the fetched instruction into a plurality of uop (micro-operations).

Additionally, the core 706 may include a scheduling unit 806. The scheduling unit 806 may be operable to decode the decoded instructions (e.g., decode instructions) until the instructions are ready for dispatch, e.g., until all source values of the decoded instruction are available. (Which is received from the base station 804). In one example, the scheduling unit 806 may schedule and / or issue (or dispatch) decoded instructions to the execution unit 808 for execution. The execution unit 808 may execute the dispatched instructions after they are decoded (e.g., by the decode unit 804) and dispatched (e.g., by the scheduling unit 806). In one example, execution unit 808 may include more than one execution unit. Execution unit 808 may also perform various arithmetic operations, such as addition, subtraction, multiplication, and / or division, and may include one or more arithmetic logic units (ALUs). In one example, a co-processor (not shown) may perform various arithmetic operations with execution unit 808. [

Further, the execution unit 808 may execute the instructions in a non-sequential manner. Thus, processor core 706 may be an unordered processor core in one example. The core 706 may also include a retirement unit 810. The retirement unit 810 may retire the executed instructions after they have been committed. In one example, the retirement of executed instructions may result in the processor state being committed from execution of the instructions, the physical registers used by the instructions being de-allocated, and so on.

The core 706 is coupled between the components of the processor core 706 and other components (e.g., the components discussed with reference to Figure 8) via one or more buses (e.g., busses 804 and / or 812) And a bus unit 714 that enables communication. The core 706 may also include one or more registers 816 for storing data (e.g., values associated with power consumption state settings) accessed by the various components of the core 706. [

7 illustrates a control unit 720 coupled to the core 706 via an interconnect 812, in various examples, the control unit 720 may be located elsewhere, e.g., within the core 706 , Coupled to the core via bus 704, or the like.

In some instances, one or more of the components discussed herein may be implemented as a system on chip (SOC) device. 9 shows a block diagram of an SOC package according to an example. 9, the SOC 902 includes one or more processor cores 920, one or more graphics processor cores 930, an input / output (I / O) interface 940, and a memory controller 942 . The various components of the SOC package 902 may be coupled to an interconnect or bus as discussed herein with reference to other figures. In addition, the SOC package 902 may include more or fewer components, such as those discussed herein with reference to other figures. Further, each component of the SOC package 902 may include one or more other components, for example, as discussed herein with reference to other figures. In one example, the SOC package 902 (and its components) is provided on one or more integrated circuit (IC) die, for example, packaged in a single semiconductor device.

As shown in FIG. 9, the SOC package 902 is coupled to a memory 960 (which may be similar or identical to the memory discussed herein with reference to other figures) via a memory controller 942. In one example, the memory 960 (or a portion thereof) may be integrated on the SOC package 902.

The I / O interface 940 may be coupled to one or more I / O devices 970 via interconnects and / or buses as discussed herein, for example, with reference to other figures. I / O device (s) 970 may include one or more of a keyboard, a mouse, a touchpad, a display, an image / video capture device (e.g., a camera or camcorder / video recorder), a touch surface, a speaker, .

FIG. 10 illustrates a computing system 1000 that is arranged in a point-to-point (PtP) configuration, in accordance with an example. In particular, Figure 10 illustrates a system in which processors, memory, and input / output devices are interconnected by a number of point-to-point interfaces. The operations discussed with reference to FIG. 2 may be performed by one or more components of system 1000.

As shown in FIG. 10, system 1000 may include several processors, of which only two processors 1002 and 1004 are shown for clarity. Processors 1002 and 1004 may each include a local memory controller hub (MCH) 1006 and 1008 that enable communication with memories 1010 and 1012, respectively.

In one example, the processors 1002 and 1004 may be one of the processors 702 discussed with reference to FIG. Processors 1002 and 1004 may exchange data via PtP interface 1014 using point-to-point (PtP) interface circuits 1016 and 1018, respectively. Processors 1002 and 1004 can also communicate with chipset 1020 and data via separate PtP interfaces 1022 and 1024 using point-to-point interface circuits 1026, 1028, 1030, and 1032, respectively. Exchangeable. The chipset 1020 may also exchange data with the high-performance graphics circuit 1034 via the high-performance graphics interface 1036 using, for example, the PtP interface circuit 1037. [

As shown in FIG. 10, one or more of the cores 106 and / or the cache 108 of FIG. 1 may be located within the processors 1004. However, other examples may be present in other circuits, logic units, or devices in system 1000 of FIG. Moreover, other examples may be distributed throughout some of the circuits, logic units, or devices shown in FIG.

The chipset 1020 may communicate with the bus 1040 using a PtP interface circuit 1041. Bus 1040 may have one or more devices in communication therewith, e.g., bus bridge 1042 and I / O devices 1043. The bus bridge 1043 may be coupled to the keyboard 1042 via a keyboard 1042 and a bus 1044 via a bus 1044. The bus 1044 may be coupled to the bus 1044 via a keyboard / mouse 1045, communication devices 1046 (e.g., modems, network interface devices, , Audio I / O devices, and / or data storage devices 1048, as well as other devices. The data storage device 1048 (which may be a hard disk drive or a NAND flash based solid state drive) may store code 1049 that may be executed by the processors 1004.

The following are related to additional examples.

Example 1 is a hinge assembly for an electronic device comprising a first bracket rotatable about a first shaft extending through a first bushing and coupled to the first bushing disposed at a first end of the first bracket A first linkage arm rotatable about a second shaft extending through the second bushing and a second linkage arm rotatable about the second shaft extending through the second bushing, And a second bracket rotatable about a third shaft extending through the third bushing and coupled to the third bushing disposed at a first end of the second bracket, 3 hinge, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft.

In Example 2, the subject matter of Example 1 may optionally include a configuration in which the first bracket is rotatable about the first shaft throughout a first angular rotation range.

In Example 3, the subject matter of any one of Examples 1-2 may optionally include a configuration in which the first bushing provides a first rotational resistance.

In Example 4, the subject matter of any of Examples 1-3 may optionally include a configuration in which the first linkage arm and the second linkage arm are rotatable about the second shaft throughout a second angular motion range .

In Example 5, the subject matter of any of Examples 1-4 may optionally include a configuration wherein the second bushing includes a torque engine providing a second rotational resistance.

In Example 6, the subject matter of any of Examples 1-5 may optionally include a configuration in which the second bracket is rotatable about the third shaft throughout the third angular rotational range.

In Example 7, the subject matter of any of Examples 1-6 may optionally include a configuration wherein the second bushing provides a third rotational resistance.

In Example 8, the subject matter of any one of Examples 1-7 may optionally include a configuration in which the first hinge, the second hinge, and the third hinge operate independently of each other.

Example 9 is a chassis for an electronic device, which includes a first section and a second section and a hinge assembly connecting the first section of the chassis to the second section of the chassis, the hinge assembly comprising: A first bushing including a first bracket rotatable about an elongated first shaft and coupled to the first bushing disposed at a first end of the first bracket and coupled to the first section, A second hinge including a first linkage arm rotatable about a second shaft extending through the second bushing and a second linkage arm rotatable about the second shaft extending through the second bushing; And a second bracket rotatable about a third shaft extending through the second bushing and coupled to the second bushing disposed at a first end of the second bracket, the third bracket being rotatable about a third shaft extending through the second bushing, Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft.

In Example 10, the subject matter of Example 9 may optionally include a configuration in which the first bracket is rotatable about the first shaft over a first angular rotation range.

In Example 11, the subject matter of any of Examples 9-10 may optionally include a configuration wherein the first bushing provides a first rotational resistance.

In Example 12, the subject matter of any of Examples 9-11 may optionally include a configuration in which the first linkage arm and the second linkage arm are rotatable about the second shaft throughout a second angular motion range .

In Example 13, the subject matter of any of Examples 9-12 may optionally include a configuration wherein the second bushing includes a second torque engine providing a second rotational resistance.

In Example 14, the subject matter of any of Examples 9-13 may optionally include a configuration in which the second bracket is rotatable about the third shaft throughout the third angular rotational range.

In Example 15, the subject matter of any of Examples 9-14 may optionally include a configuration wherein the second bushing provides a third rotational resistance.

In Example 16, the subject matter of any one of Examples 9-15 may optionally include a configuration in which the first hinge, the second hinge, and the third hinge operate independently of each other.

Example 17 is an electronic device comprising a controller, a chassis including a first section and a second section, and a hinge assembly connecting the first section of the chassis to the second section of the chassis, A first hinge including a first bracket rotatable about a first shaft extending through a bushing and coupled to the first bushing disposed at a first end of the first bracket and coupled to the first section; A first linkage arm rotatable about a second shaft extending through the second bushing and a second linkage arm rotatable about the second shaft extending through the second bushing, And a second bracket rotatable about a third shaft extending through the second bushing and coupled to the second bushing disposed at a first end of the second bracket, the second bracket being coupled to the second section, Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft.

In Example 18, the subject matter of Example 17 may optionally include a configuration in which the first bracket is rotatable about the first shaft throughout a first angular rotational range.

In Example 19, the subject matter of any of Examples 17-18 may optionally include a configuration wherein the first bushing provides a first rotational resistance.

In Example 20, the subject matter of any of Examples 17-19 may optionally include a configuration in which the first linkage arm and the second linkage arm are rotatable about the second shaft throughout a second angular motion range .

In Example 21, the subject matter of any of Examples 17-20 may optionally include a configuration wherein the second bushing includes a second torque engine providing a second rotational resistance.

In Example 22, the subject matter of any one of Examples 17-21 may optionally include a configuration in which the second bracket is rotatable about the third shaft throughout the third angular rotational range.

In Example 23, the subject matter of any of Examples 17-22 may optionally include a configuration wherein the second bushing provides a third rotational resistance.

In Example 24, any one of Examples 17-23 may optionally include a configuration in which the first hinge, the second hinge, and the third hinge operate independently of each other.

The term " logic instructions ", as used herein, refers to a representation that can be understood by one or more machines for performing one or more logical operations. For example, the logic instructions may include instructions interpretable by a processor compiler for executing one or more operations on one or more data objects. However, this is merely an example of machine-readable instructions, and examples are not limited in this respect.

The term " computer-readable medium " as referred to herein relates to a medium capable of retaining recognizable representations by one or more machines. For example, the computer readable medium may include one or more storage devices for storing computer readable instructions or data. Such storage devices may include, for example, storage media such as optical, magnetic, or semiconductor storage media. However, this is merely an example of a computer-readable medium, and examples are not limited in this respect.

The term " logic " as referred to herein relates to a structure for performing one or more logical operations. For example, the logic may include circuitry that provides one or more output signals based on the one or more input signals. Such circuitry may include a finite state machine that receives digital inputs and provides digital outputs, or circuitry that provides one or more analog output signals in response to one or more analog input signals. Such circuitry may be provided in an application specific integrated circuit (ASIC) or a field programmable gate array (FPGA). The logic may also include machine readable instructions stored in memory with processing circuitry for executing such machine readable instructions. However, these are merely examples of structures that can provide logic, and examples are not limited in this respect.

Some of the methods described herein may be implemented as logic instructions on a computer readable medium. The logic instructions, when executed on a processor, cause the processor to be programmed as a special purpose machine implementing the described methods. A processor, when constructed by logic instructions that execute the methods described herein, constitutes a structure for performing the described methods. Alternatively, the method described herein can be reduced to logic, for example, in a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or other like.

In this description and in the claims, along with the terms combined and connected, derivatives thereof may be used. In certain instances, a connected may be used to indicate that two or more elements are in direct physical or electrical contact with each other. A coupled state may mean that two or more elements are in direct physical or electrical contact. However, coupled states may also mean that two or more elements are not in direct contact with each other, but can still cooperate or interact with each other.

Reference in the specification to "one example" or "some examples" means that a particular feature, structure, or characteristic described in connection with the example is included in at least one implementation. The phrase " in one embodiment " in various places in this specification may or may not refer to the same example.

Although the examples have been described in language specific to structural features and / or methodological acts, it should be understood that the claimed subject matter may not be limited to the specific features or acts described. Rather, certain features and behaviors are disclosed as sample forms that implement the claimed subject matter.

Claims (24)

A hinge assembly for an electronic device,
A first hinge including a first bracket rotatable about a first shaft extending through a first bushing and coupled to the first bushing disposed at a first end of the first bracket;
The second hinge - the second hinge -
A second bushing;
A first linkage arm rotatable about a second shaft extending through the second bushing; And
And a second linkage arm rotatable about the second shaft extending through the second bushing; And
And a third hinge including a second bracket rotatable about a third shaft extending through the third bushing and coupled to the third bushing disposed at a first end of the second bracket,
Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. 2. The hinge assembly of claim 1, wherein the first bracket is rotatable about the first shaft throughout a first angular rotational range. 2. The hinge assembly of claim 1, wherein the first bushing provides a first rotational resistance. 2. The hinge assembly of claim 1, wherein the first linkage arm and the second linkage arm are rotatable about the second shaft throughout a second angular motion range. 2. The hinge assembly of claim 1, wherein the second bushing comprises a torque engine providing a second rotational resistance. 2. The hinge assembly of claim 1, wherein the second bracket is rotatable about the third shaft throughout a third angular rotational range. 2. The hinge assembly of claim 1, wherein the second bushing provides a third rotational resistance. The method according to claim 1,
Wherein the first hinge, the second hinge, and the third hinge operate independently. 1. A chassis for an electronic device,
A first section and a second section; And
A hinge assembly connecting a first section of the chassis to a second section of the chassis, the hinge assembly comprising:
A first bracket rotatable about a first shaft extending through the first bushing and coupled to the first bushing disposed at a first end of the first bracket and including a first bracket coupled to the first section, ;
The second hinge - the second hinge -
A second bushing;
A first linkage arm rotatable about a second shaft extending through the second bushing; And
And a second linkage arm rotatable about the second shaft extending through the second bushing; And
A second bracket coupled to the second bushing and rotatable about a third shaft extending through the second bushing and disposed at a first end of the second bracket, Lt; / RTI >
Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. 10. The chassis of claim 9, wherein the first bracket is rotatable about the first shaft over a first angular rotational range. 10. The chassis of claim 9, wherein the first bushing provides a first rotational resistance. 10. The chassis of claim 9, wherein the first linkage arm and the second linkage arm are rotatable about the second shaft in a second angular motion range. 10. The chassis of claim 9, wherein the second bushing comprises a second torque engine providing a second rotational resistance. 10. The chassis of claim 9 wherein the second bracket is rotatable about the third shaft throughout the third angular rotational range. 10. The chassis of claim 9, wherein the second bushing provides a third rotational resistance. 10. The method of claim 9,
Wherein the first hinge, the second hinge, and the third hinge operate independently. As an electronic device,
controller;
A chassis including a first section and a second section; And
A hinge assembly connecting a first section of the chassis to a second section of the chassis, the hinge assembly comprising:
A first bracket rotatable about a first shaft extending through the first bushing and coupled to the first bushing disposed at a first end of the first bracket and including a first bracket coupled to the first section, ;
The second hinge - the second hinge -
A second bushing;
A first linkage arm rotatable about a second shaft extending through the second bushing; And
And a second linkage arm rotatable about the second shaft extending through the second bushing; And
A second bracket coupled to the second bushing and rotatable about a third shaft extending through the second bushing and disposed at a first end of the second bracket, Lt; / RTI >
Wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. 18. The electronic device of claim 17, wherein the first bracket is rotatable about the first shaft over a first angular rotational range. 18. The electronic device of claim 17, wherein the first bushing provides a first rotational resistance. 18. The electronic device of claim 17, wherein the first linkage arm and the second linkage arm are rotatable about the second shaft in a second angular motion range. 18. The electronic device of claim 17, wherein the second bushing comprises a second torque engine providing a second rotational resistance. 18. The electronic device of claim 17, wherein the second bracket is rotatable about the third shaft throughout a third angular rotational range. 18. The electronic device of claim 17, wherein the second bushing provides a third rotational resistance. 18. The method of claim 17,
Wherein the first hinge, the second hinge, and the third hinge operate independently.

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