KR20180090136A - Finger sensor - Google Patents

Abstract

The present invention provides a fingerprint sensor which can be easily manufactured and has increased reliability. According to an embodiment of the present invention, the fingerprint sensor comprises: a piezoelectric layer; a first substrate located on an upper part of the piezoelectric layer; a first electrode pattern between the piezoelectric layer and the first substrate; a first conductive member between the first electrode pattern and the piezoelectric layer; a second substrate located on a lower part of the piezoelectric layer; a second electrode pattern between the piezoelectric layer and the second substrate; and a second conductive member between the second electrode pattern and the piezoelectric layer. Sizes of the first substrate and the second substrate are different.

Description

Fingerprint sensor {FINGER SENSOR}

An embodiment relates to a fingerprint sensor,

The fingerprint sensor is a sensor for detecting human fingerprints and is widely used not only for devices such as door locks which have been widely used but also for determining whether to turn on / off or sleep mode of electronic devices in recent years .

The fingerprint sensor can be classified into an ultrasonic wave type, an infrared ray type, and a capacitive type according to its operation principle. For example, in the case of an ultrasonic wave method, when acoustic waves of a certain frequency emitted from a plurality of piezoelectric sensors are reflected from valleys and ridges of fingerprints, the difference in acoustic impedance between respective bones and floors The cause of the ultrasonic wave is that the fingerprint is detected by using the corresponding plural piezoelectric sensors. In particular, the advantage of the ultrasonic wave method is that the ultrasonic wave is generated in a pulse type beyond the function of the fingerprint recognition, and the Doppler effect It is possible to determine whether the fingerprint is fingerprinted or not by using the fingerprint detection function.

In such a fingerprint sensor, a piezoelectric layer including a piezoelectric material may be disposed on a substrate, for example, a cover substrate, and electrodes may be disposed on both sides of the piezoelectric layer to recognize the fingerprint according to the generation of ultrasonic waves.

Such a fingerprint sensor can be connected to an ASIC (on-demand integrated circuit) by disposing electrodes on the upper and lower portions of the piezoelectric layer and connecting the upper electrode and the lower electrode to the printed circuit board, respectively.

However, in order to connect the upper electrode or the lower electrode to the printed circuit board, a process of forming a via hole in the piezoelectric layer is required, which lowers the process efficiency.

Therefore, a fingerprint sensor having a new structure capable of solving such a problem is required.

Embodiments are intended to provide a fingerprint sensor that can be easily manufactured and has improved reliability.

A fingerprint sensor according to an embodiment includes: a piezoelectric layer; A first substrate disposed on the piezoelectric layer; A first electrode pattern between the piezoelectric layer and the first substrate; A first conductive member between the first electrode pattern and the piezoelectric layer; A second substrate disposed below the piezoelectric layer; A second electrode pattern between the piezoelectric layer and the second substrate; And a second conductive member between the second electrode pattern and the piezoelectric layer, wherein the sizes of the first base and the second base are different.

The fingerprint sensor according to the embodiment may omit the step of forming a via hole or the like in the piezoelectric layer to connect the first electrode on the first substrate to the customized integrated circuit. In detail, the first substrate and the second substrate include a flexible printed circuit board on which electrodes are disposed, and the first substrate is bent and directly connected to the customized integrated circuit, so that the piezoelectric layer forms a hole or the like, It is possible to omit the process of connecting an application-specific integrated circuit.

1 is a perspective view of a fingerprint sensor according to an embodiment.
2 is a perspective view of a piezoelectric element of a fingerprint sensor according to an embodiment.
3 is a plan view of a fingerprint sensor according to an embodiment.
4 is a cross-sectional view for explaining the operation principle of the fingerprint sensor according to the embodiment.
5 is a sectional view of a fingerprint sensor according to an embodiment.
6 is a sectional view for explaining the bending of the first substrate in the fingerprint sensor according to the embodiment.
7 is a cross-sectional view of a display panel to which the fingerprint sensor according to the embodiment is applied.
8 to 11 are views showing various embodiments to which the fingerprint sensor according to the embodiments is applied.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

Also, when a part is referred to as being "connected" to another part, it includes not only a case of being "directly connected" but also a case of being "indirectly connected" with another member in between. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, a fingerprint sensor according to an embodiment will be described with reference to the drawings.

Referring to FIG. 1, a fingerprint sensor according to an embodiment may include a cover substrate 100, a substrate, a piezoelectric member 400, and an electrode.

The cover substrate 100 may be rigid or flexible. Preferably, the cover substrate 1000 may be flexible to be foldable or bending.

For example, the cover substrate 100 may comprise plastic. In detail, the cover substrate 1000 may include reinforced or flexible plastic such as polyimide (PI), polyethylene terephthalate (PET), propylene glycol (PPG) polycarbonate (PC) . ≪ / RTI >

In addition, the cover substrate 100 may include an optically isotropic film. For example, the cover substrate 100 may include a cyclic olefin copolymer (COC), a cyclic olefin polymer (COP), a polycarbonate (PC), a light polymethyl methacrylate (PMMA), or the like .

Sapphire has excellent electrical properties such as dielectric constant, which not only greatly improves the speed of touch reaction but also can easily realize spatial touch such as hovering and is applicable as a cover substrate because of its high surface strength. Here, hovering means a technique of recognizing coordinates even at a small distance from the display.

A decor layer having a color may be disposed on the cover substrate. For example, one area of the cover substrate may be further provided with a decor layer for this color implementation to match the color of the cover substrate with the color of the peripheral component or package of the fingerprint sensor disposed in one area of the cover substrate .

The substrate may be disposed under the cover substrate 100. The substrate may include a first substrate 210 and a second substrate 220. In detail, the substrate 210 may include the first substrate 210 disposed below the cover substrate 100 and the second substrate 220 disposed below the first substrate 210. have.

The first substrate 210 and the second substrate 220 may include plastic. For example, the first substrate 210 and the second substrate 220 may include a resin material such as polyimide (PI). For example, the first substrate 210 and the second substrate 220 may include a printed circuit board. For example, the first substrate 210 and the second substrate 220 may include a flexible printed circuit board (FPCB).

The thickness of the first base material 210 and the second base material 220 may be about 30 탆 or less.

The first substrate 210 and the second substrate 220 may be arranged to have different widths. In detail, the width of the first substrate 210 may be greater than the width of the second substrate 220.

The width and position of the first substrate 210 will be described in detail below.

The piezoelectric member 400 may be disposed below the cover substrate 100. In detail, the piezoelectric member 400 may be disposed below the first substrate 210. In detail, the piezoelectric member 400 may be disposed between the first substrate 210 and the second substrate 220.

The piezoelectric member 400 may include various piezoelectric materials. For example, the piezoelectric member 400 may include monocrystalline ceramics, polycrystalline ceramics, a polymer material, a thin film material, or a composite material obtained by combining a polycrystalline material and a polymer material.

The piezoelectric material of the single crystal ceramics may include? -AlPO4,? -SiO2, LiTiO3, LiNbO3, SrxBayNb2O3, Pb5-Ge3O11, Tb2 (MnO4) 3, Li2B4O7, CdS, ZnO, Bi12SiO20 or Bi12GeO20.

The piezoelectric material of the polycrystalline ceramics may include a PZT system, a PT system, a PZT-Complex perovskite system, or BaTiO 3.

The piezoelectric material of the polymer material may include PVDF, P (VDF-TrFe), P (VDFTeFE), or TGS.

The piezoelectric material of the thin film material may include ZnO, CdS, or AlN.

The piezoelectric material of the composite material may include PZT-PVDF, PZT-Silicon Rubber, PZT-Epoxy, PZT-foamed polymer, or PZT-foamed urethane.

The piezoelectric member 400 according to the embodiment may include a piezoelectric material of polycrystalline ceramics. For example, the piezoelectric member 400 according to the embodiment may include a PZT system, a PT system, a PZT-Complex perovskite system, or BaTiO 3.

Referring to FIG. 2, the piezoelectric member 400 may include a plurality of pillars. In detail, the piezoelectric member 400 may include a plurality of piezoelectric columns 410.

The piezoelectric pillars 410 may be spaced apart from each other. That is, the piezoelectric columns 410 may be disposed without contacting each other.

The piezoelectric columns 410 may be arranged with rows and columns. For example, the piezoelectric ribs 410 may extend in a plurality of row directions and a plurality of column directions.

 For example, the piezoelectric columns 410 may be spaced apart by an interval of about 50 mu m or less. A resin material 420 may be disposed between the piezoelectric pillars 410. That is, the resin material 420 may be disposed surrounding the piezoelectric columns 410. That is, the piezoelectric columns 410 can be supported by the resin material 420.

Referring to FIG. 3, a valid area AA and a non-valid area UA may be defined in the fingerprint sensor according to the embodiment.

The valid area AA may be a fingerprint recognition area. In addition, the non-valid area UA disposed around the valid area AA may be an area where fingerprint recognition is not performed.

In detail, when a finger approaches or contacts the valid area AA, the fingerprint can be recognized by the ultrasonic waves transmitted and received in the valid area. The driving principle of the fingerprint sensor will be described in detail below.

The electrode may be disposed on one side of the substrate. In detail, the electrode may include a first electrode 310 and a second electrode 320.

The first electrode 310 may be disposed on one side of the first substrate 210. In detail, the first electrode 310 may be disposed between the first substrate 210 and the piezoelectric member 400.

The second electrode 320 may be disposed on one side of the second substrate 220. In detail, the second electrode 320 may be disposed between the second substrate 220 and the piezoelectric member 400.

The first electrode 310 and the second electrode 320 may be disposed on a region corresponding to the effective region of the piezoelectric member 400.

The first electrode 310 and the second electrode 320 may include a conductive material.

For example, the first electrode 310 and the second electrode 320 may be formed of indium tin oxide, indium zinc oxide, copper oxide, tin oxide ), Zinc oxide, titanium oxide, and the like.

Alternatively, the first electrode 310 and the second electrode 320 may comprise a nanowire, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, a conductive polymer, or a mixture thereof .

Alternatively, the first electrode 310 and the second electrode 320 may include various metals. For example, the sensing electrode 200 may be formed of one selected from the group consisting of Cr, Ni, Cu, Al, Ag, and Mo. Gold (Au), titanium (Ti), and alloys thereof.

Alternatively, the first electrode 310 and the second electrode 320 may be formed in a mesh shape. In detail, at least one of the first electrode 310 and the second electrode 320 may include a plurality of sub-electrodes, and the sub-electrodes may be arranged to intersect with each other in a mesh shape.

Specifically, the first electrode 310 and the second electrode 320 are connected to each other by a plurality of sub-electrodes crossing each other in a mesh shape, and the mesh openings OA between the mesh lines LA and the mesh lines LA, . ≪ / RTI >

The line width of the mesh line LA may be about 0.1 mu m to about 10 mu m. A mesh line having a line width of the mesh line LA of less than about 0.1 mu m may not be possible in the manufacturing process, and if the mesh line LA is more than about 10 mu m, the touch electrode pattern may be visually recognized from the outside, resulting in decreased visibility. In detail, the line width of the mesh line LA may be about 1 탆 to about 5 탆. More specifically, the line width of the mesh line LA may be about 1.5 mu m to about 3 mu m.

In addition, the thickness of the mesh line LA may be about 100 nm to about 1000 nm. When the thickness of the mesh wire is less than about 100 nm, the electrode resistance may be increased and the electrical characteristics may be deteriorated. When the thickness of the mesh wire is more than about 1000 nm, the overall thickness of the fingerprint sensor may become thick and the process efficiency may be deteriorated. In detail, the thickness of the mesh line LA may be about 150 nm to about 500 nm. More specifically, the thickness of the mesh line LA may be about 180 nm to about 200 nm.

In addition, the mesh opening may be formed in various shapes. For example, the mesh opening OA may have various shapes such as a square, a diamond, a pentagon, a hexagon, a polygonal shape, or a circular shape. Further, the mesh opening may be formed in a regular shape or a random shape.

By having the first electrode 310 and the second electrode 320 have a mesh shape, it is possible to prevent the pattern of the electrode from being visible on the display region, for example, as an effective region. That is, even if the electrode is formed of metal, the pattern can be made invisible. In addition, the resistance of the fingerprint sensor device can be lowered even if the electrode is applied to a fingerprint sensor device of a large size.

The first electrode 310 may extend in a first direction. In detail, the first electrode 310 may include a plurality of first electrode patterns 311 extending in a first direction.

Also, the second electrode 320 may extend in the second direction. In detail, the second electrode 320 may include a plurality of second electrode patterns 321 extending in the second direction different from the first direction.

The line width LW1 of the first electrode pattern 311 and the line width LW2 of the second electrode pattern 321 may be about 20 mu m to about 70 mu m. In detail, the line width of the first electrode pattern 311 and the second electrode pattern 321 may be about 30 탆 to about 50 탆.

When the line widths of the first electrode pattern 311 and the second electrode pattern 321 are less than about 20 탆, the energy transmitted to the piezoelectric member is reduced, and accordingly, the output is lowered and the fingerprint sensing sensitivity may be lowered . If the line width of the first electrode pattern 311 and the second electrode pattern 321 exceeds about 70 μm, the resolution of the piezoelectric member may be lowered.

In addition, the first electrode patterns 311 may be spaced apart from each other, and the distance d1 between the first electrode patterns 311 may be about 40 μm to 100 μm.

In addition, the second electrode patterns 321 may be spaced apart from each other, and the distance d2 between the second electrode patterns 321 may be about 40 μm to 100 μm.

When the first electrode patterns 311 and the second electrode patterns 321 are spaced apart from each other by less than about 40 탆, the fingerprint sensing sensitivity may be lowered. If the first electrode patterns 311 and the second electrode patterns 321 are more than about 100 탆, Can be lowered.

The first electrode pattern 311 and the second electrode pattern 312 may extend in a direction intersecting with each other. That is, the first electrode pattern 311 and the second electrode pattern 312 extend in the first direction and the second direction, and the first electrode pattern 311 and the second electrode pattern 312 A plurality of node regions N intersecting with each other can be formed.

Although the first electrode pattern 311 and the second electrode pattern 321 are formed in a bar pattern in FIG. 2, the first electrode pattern 311 and the second electrode pattern 321 are not limited thereto, The second electrode pattern 321 may be formed in various shapes such as a polygonal shape such as a square, a diamond, a pentagon, a hexagon, or a circular shape.

The width of the first electrode pattern 311 and the second electrode pattern 321 may be less than the width of the piezoelectric column 410. In detail, the width of the node region N may be equal to or less than the width of the piezoelectric column 410.

In addition, each of the node regions N may be disposed at a position overlapping the piezoelectric column 410. That is, the position of the node region N and the position of the piezoelectric column 410 may overlap. That is, the piezoelectric column 410 may be disposed in a region of the piezoelectric member 400 corresponding to the node region N.

In the node region N, a signal can be transmitted or received by an object approaching or contacting the piezoelectric member 400. In detail, the node region N can transmit and receive ultrasonic signals. That is, the node region N may be a sensor that recognizes a fingerprint according to approach or contact of a finger.

At least one or more of the node regions N may be formed on the piezoelectric member 400. In detail, a plurality of the node regions (N) may be formed on the piezoelectric member (400). For example, the node region N may be formed with a resolution of about 400 dpi to about 500 dpi with respect to the piezoelectric substrate.

Accordingly, the interval between the node regions N may be about 100 탆 or less. For example, the node region N may include neighboring node regions, and the node regions may be spaced apart by about 100 탆 or less.

For example, the spacing of at least one of the first spacing of the first electrodes 310 forming the node region N and the second spacing of the second spacing 320 is about 100 탆 or less, about 70 Mu m or less, more specifically, about 50 mu m or less.

The resolution of the node regions N may be lowered when the interval of the node regions N exceeds about 50 mu m so that the ultrasonic signals transmitted and received in the node regions N are weakened, The reliability of the fingerprint sensor may be deteriorated.

The node region N can simultaneously perform transmission and reception of ultrasonic signals. In detail, when a finger touches or approaches, an ultrasonic signal can be transmitted in the finger direction in the node region N, and ultrasonic signals reflected from the finger can be received again in the node region N. [ The fingerprint sensor according to the embodiment can recognize the fingerprint of the finger due to such a difference in the transmission and reception signals.

4 is a view for explaining the driving of the fingerprint sensor according to the contact or approach of the finger.

4, a voltage having a resonance frequency of an ultrasonic wave is applied to the first electrode 310 and the second electrode 320 disposed on one surface and the other surface of the piezoelectric member 400 from an external control unit, An ultrasonic signal can be generated in the ultrasonic transducer 400. In detail, when a voltage is applied to the piezoelectric member 400, the piezoelectric members 410 of the piezoelectric member 400 can be deformed, i.e., vibrated, and an ultrasonic signal can be generated by the vibration.

This ultrasonic signal is transmitted to the node N of the piezoelectric element 400 due to the difference in acoustic impedance between the node N and the air of the piezoelectric element 400 from which the ultrasonic signal is emitted, Most of the ultrasonic signal transmitted from the piezoelectric sensor 200 does not pass through the interface between the piezoelectric sensor 200 and the air and is returned to the inside of the piezoelectric member 400.

4, a part of the ultrasonic signal transmitted from the node N of the piezoelectric member 400 passes through the interface between the skin of the finger and the piezoelectric member 400 and proceeds to the inside of the finger Therefore, the strength of the reflected signal is lowered, thereby enabling the fingerprint pattern to be detected.

The fingerprint of a finger can have a pattern in which a number of valleys and floors are repeatedly displayed, and a height difference can be obtained by repeating the valley and the floor. 4, the piezoelectric member 400 does not come into direct contact with the skin at the tongue 710 of the fingerprint, and the piezoelectric member 400 can directly come into contact with the skin at the floor 620 of the fingerprint .

Accordingly, the ultrasonic signal transmitted from the node N of the piezoelectric element 400 corresponding to the tongue 710 of the fingerprint emits only a very small signal to the outside, and almost all of the ultrasonic signal is reflected to the inside, N and the ultrasonic signal emitted from the node N of the piezoelectric element 400 corresponding to the floor 720 of the fingerprint passes through the finger boundary surface in a considerable amount, The intensity of the ultrasound signal decreases relatively greatly.

Therefore, the fingerprint pattern of the finger is detected by measuring the intensity or the reflection coefficient of the reflected signal from which the ultrasonic signal generated from the acoustic impedance difference according to the finger 710 and the floor 720 at each node N is received .

Referring to FIGS. 1 and 5, a conductive member may be further disposed between the electrode and the piezoelectric member 400. In detail, a first conductive member 510 may be disposed between the first electrode 310 and the piezoelectric member 400. A second conductive member 520 may be disposed between the second electrode 320 and the piezoelectric member 400.

The first conductive member 510 and the second conductive member 520 may be disposed on a region corresponding to the effective region of the piezoelectric member 400.

The first conductive member 510 and the second conductive member 520 may include a conductive film. The first conductive member 510 and the second conductive member 520 may include conductive particles. For example, the first conductive member 510 and the second conductive member 520 may include conductive particles having a particle size of about 2 [mu] m to about 10 [

For example, the first conductive member 510 and the second conductive member 520 may include an anisotropic conductive film (ACF).

The first conductive member 510 may be disposed between the first electrode 310 and the piezoelectric member 400 to bond the first electrode 310 to the piezoelectric member 400. The first conductive member 510 may be disposed on the piezoelectric member 400 to connect the plurality of piezoelectric columns 410 of the piezoelectric member 400 to each other.

The second conductive member 520 may be disposed between the second electrode 320 and the piezoelectric member 400 to bond the second electrode 320 to the piezoelectric member 400. The second conductive member 520 may be disposed on the piezoelectric member 400 to connect the plurality of piezoelectric columns 410 of the piezoelectric member 400 to each other.

That is, the first conductive member 510 and the second conductive member 520 can simultaneously perform an adhesive role and an electrical connection.

An application-specific integrated circuit (ASIC) 600 may be disposed under the second substrate 220. In detail, the customized integrated circuit 600 disposed in contact with the second base 220 may be disposed under the second base 220.

The application specific integrated circuit 600 may include an active surface and an inactive surface. In detail, the custom integrated circuit 600 may include an active surface that includes circuitry and an inactive surface that does not include circuitry.

For example, the active surface of the application specific integrated circuit 600 may include a processing circuit and / or a sensor, or may include a sensing device or the like disposed on or within the application specific integrated circuit 600.

The application specific integrated circuit 600 may include a substrate such as silicon (Si), gallium arsenide, silicon carbide (SiC) graphene, or any organic semiconductor material.

In addition, at least one circuit may be disposed on the substrate or inside the substrate.

For example, the circuit on top of the substrate or within the substrate may comprise a gate array standard cell, for example, the circuit may be configured to perform a particular operation . And may further include a plurality of input terminals and a plurality of output terminals connected to the gate array or the standard cell. The input terminal may be connected to the first substrate 210 and the second substrate 220, and the output terminal may be connected to an external main board.

Referring to FIGS. 5 and 6, the first substrate 210 and the second substrate 220 may be connected to the customized integrated circuit 600. In detail, the first substrate 210 and the second substrate 220 may be electrically connected to the customized integrated circuit 600.

In detail, the lower surface of the second substrate 220 may be disposed in contact with the customized integrated circuit 600.

The width W1 of the first base material 210 and the width W2 of the second base material 220 may be different from each other. In detail, the width W1 of the first base material 210 may be greater than the width W2 of the second base material 220. Here, the width may be defined as at least one of the width and the width of the substrate.

The first substrate 210 may be bent in one direction and connected to the custom integrated circuit 600.

For example, the first substrate 210 may include an electrode portion 211 and a connection portion 212. The first electrode 310 may be disposed on the electrode 211. In addition, the connection unit 212 may be connected to the custom-built integrated circuit 600.

In detail, referring to FIG. 6, the connecting portion 212 may be bent in one direction. In detail, the connection portion 212 may be bent in the direction of the top surface of the customized integrated circuit 600. That is, the connection portion 212 may be bent in the direction of the top surface of the custom-built integrated circuit 600 and may be connected to the top surface of the custom-built integrated circuit 600 and connected thereto.

Thus, the customized integrated circuit 600 may be connected to the first substrate 210 and the second substrate 220

The fingerprint sensor according to the embodiment may omit the step of forming a via hole or the like in the piezoelectric layer to connect the first electrode on the first substrate to the customized integrated circuit. In detail, the first substrate and the second substrate include a flexible printed circuit board on which electrodes are disposed, and the first substrate is bent and directly connected to the customized integrated circuit, so that the piezoelectric layer forms a hole or the like, It is possible to omit the process of connecting an application-specific integrated circuit.

The fingerprint sensor according to the embodiment can be applied to a display panel in combination with a display panel or the like.

Referring to FIG. 7, the display panel according to the embodiment may include a cover substrate 100, a display panel 900, and a fingerprint sensor.

Since the cover substrate 100 and the fingerprint sensor are similar to those described above, the following description will be omitted.

The display panel 900 may be disposed below the cover substrate 100. The display panel 900 and the cover substrate 100 may be adhered to each other through an adhesive layer 800 such as an optical transparent adhesive.

The display panel 900 may include a first substrate 910 and a second substrate 920.

When the display panel 900 is a liquid crystal display panel, the display panel 900 includes a first substrate 910 including a thin film transistor (TFT) and a pixel electrode, a second substrate 910 including color filter layers, The liquid crystal layer 920 may be bonded together with the liquid crystal layer interposed therebetween.

The display panel 900 may include a thin film transistor, a color filter, and a black matrix formed on a first substrate 910, and a second substrate 920 may be adhered to the first substrate 910 with a liquid crystal layer interposed therebetween Or a liquid crystal display panel having a COT (color filter on transistor) structure. That is, a thin film transistor may be formed on the first substrate 910, a protective film may be formed on the thin film transistor, and a color filter layer may be formed on the protective film. In addition, a pixel electrode that is in contact with the thin film transistor is formed on the first substrate 910. At this time, in order to improve the aperture ratio and simplify the mask process, the black matrix may be omitted, and the common electrode may be formed to serve also as the black matrix.

In addition, when the display panel 900 is a liquid crystal display panel, the display device may further include a backlight unit for providing light from the back surface of the display panel 900.

When the display panel 900 is an organic light emitting display panel, the display panel 900 includes a self-luminous element that does not require a separate light source. In the display panel 900, a thin film transistor is formed on a first substrate 910, and an organic light emitting element which is in contact with the thin film transistor is formed. The organic light emitting device may include an anode, a cathode, and an organic light emitting layer formed between the anode and the cathode. The organic light emitting device may further include a second substrate 920 serving as an encapsulation substrate for encapsulation.

The fingerprint sensor described above may be disposed below the display panel 900. [

The fingerprint sensor according to the embodiments can be applied to the locking device. For example, the fingerprint sensor according to the embodiments can be applied to electronic products and the like as a locking device.

In detail, as shown in Fig. 8, the fingerprint sensor according to the embodiments can be applied to the lock of the door lock by being coupled to the door lock. Or may be applied to a locking device of a mobile phone in combination with a mobile phone as shown in FIG.

Alternatively, the fingerprint sensor according to the embodiments may be applied to a power supply apparatus. For example, the fingerprint sensor according to the embodiments can be applied to household appliances, vehicles, and the like.

In detail, as shown in FIG. 10, it can be coupled to a home appliance such as an air conditioner and applied as a power supply device. Alternatively, it may be applied to a vehicle or the like as shown in Fig. 11 and applied to a starting device of a vehicle, a power supply device such as car audio.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (10)

A piezoelectric member;
A first substrate disposed on the piezoelectric member;
A plurality of first electrode patterns disposed between the piezoelectric member and the first substrate;
A first conductive member between the first electrode pattern and the piezoelectric layer;
A second substrate disposed below the piezoelectric member;
A plurality of second electrode patterns disposed between the piezoelectric member and the second substrate;
And a second conductive member between the second electrode pattern and the piezoelectric member,
Wherein the size of the first substrate and the size of the second substrate are different from each other. The method according to claim 1,
Further comprising an application specific integrated circuit (ASIC) disposed below the second substrate,
Wherein the first substrate and the second substrate are placed in contact with the customized integrated circuit. 3. The method of claim 2,
Wherein the size of the first substrate is larger than the size of the second substrate. The method of claim 3,
Wherein the first substrate and the second substrate comprise a printed circuit board. The method according to claim 1,
Wherein the first electrode pattern extends in a first direction,
Wherein the second electrode pattern extends in a second direction intersecting with the first direction,
Wherein the first electrode pattern and the second electrode pattern form a node region crossing each other. The method of claim 3,
Wherein the first substrate is disposed in a bent manner in a side surface and a bottom surface side of the piezoelectric layer on an upper surface of the piezoelectric member. The method of claim 3,
In the first substrate,
An electrode portion on which the first electrode pattern is disposed; And
And a connection portion connected to the customized integrated circuit,
Wherein the connection portion is bent from the electrode portion in the direction of the second substrate. 8. The method of claim 7,
Wherein the first conductive member is disposed between the electrode portion and the piezoelectric layer. 6. The method of claim 5,
Wherein the node region is disposed at a position overlapping the piezoelectric column. A cover substrate;
A display panel disposed below the cover base; And
And a fingerprint sensor disposed under the display panel,
Wherein the fingerprint sensor comprises:
A piezoelectric member;
A first substrate disposed on the piezoelectric member;
A plurality of first electrode patterns disposed between the piezoelectric member and the first substrate;
A first conductive member between the first electrode pattern and the piezoelectric layer;
A second substrate disposed below the piezoelectric member;
A plurality of second electrode patterns disposed between the piezoelectric member and the second substrate;
And a second conductive member between the second electrode pattern and the piezoelectric member,
Wherein the size of the first substrate and the size of the second substrate are different from each other.

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