KR20180065365A - Lighting apparatus using organic light emitting diode and method of fabricating the same - Google Patents

Abstract

A lighting apparatus using an organic light emitting diode and a method of fabricating the same according to the present invention are characterized in that an organic light emitting material and a conductive layer for a cathode are removed by using an etch resist to open an anode contact after depositing the organic light emitting material and the conductive layer for the cathode on the entire surface of a substrate. Then, a cathode contact is opened by ashing the etch resist, the sealing process for the cathode contact is performed using an adhesive, a metal film, and a protective film. The present invention does not use an open mask (metal mask), which has a complicated structure, so that a manufacturing process of the lighting apparatus can be simplified and can be effectively applied to a roll-manufacturing process. The present invention can prevent scratches or damage by particles even when the substrate is wound or unwound for pulse aging by using an ashed etch resist as an anti-scratch layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting diode (OLED)

The present invention relates to an illumination device using an organic light emitting device and a manufacturing method thereof, and more particularly, to an illumination device using an organic light emitting device that simplifies a manufacturing process by patterning an organic light emitting device without using an open mask, .

Currently, fluorescent or incandescent lamps are mainly used as lighting devices. Among these, incandescent lamps have a good color rendering index (CRI) but have a low energy efficiency. Fluorescent lamps have high efficiency, but have low color rendering index and mercury.

The color rendering index is an index representing color reproduction. The color rendering index is compared with a case where a feeling of a color of an object illuminated by a light source is illuminated by a specific light source and a case where it is illuminated by a reference light source. It is an index. The CRI of sunlight is 100.

In order to solve the problem of such a conventional illumination device, a light emitting diode (LED) has recently been proposed as a lighting device. The light emitting diode is composed of an inorganic light emitting material and has the highest luminous efficiency at the blue wavelength band and the luminous efficiency is lowered toward the green wavelength band having the highest red and visibility. Therefore, when white light is emitted by combining a red light emitting diode, a green light emitting diode, and a blue light emitting diode, the emission efficiency is low.

As another alternative, an illumination device using an organic light emitting diode (OLED) is being developed. In an illumination device using a general organic light emitting device, an anode electrode made of ITO is formed on a glass substrate. When an organic light emitting layer and a cathode electrode are formed, and a protective layer and a lamination film are formed on the organic light emitting layer and the cathode electrode, a cover glass substrate attaching and sealing process is performed.

Since the organic luminescent layer and the electrode deposition process, which are two core processes, are mainly performed in a high vacuum atmosphere, a deposition chamber for maintaining a high vacuum is required as many as the number of thin films to be deposited.

Recently, research and development using a flexible substrate instead of a glass substrate has been actively conducted. In this case, the flexible substrate is mainly wound on rollers, installed on the equipment, and uses roll-to-roll equipment for continuous deposition and deposition. However, the total number of processes increases. In particular, in the organic light emitting device process after the anode electrode is formed, an organic light emitting layer, a cathode electrode, and a protective layer are deposited using different open masks (metal masks) for respective layers. In this case, after the deposition using the open mask, a cleaning process is further required each time, an alignment process between the substrate and the open mask is required, and shadowing and pattern tolerance occur at the time of misalignment, .

Further, pulse aging (hereinafter referred to as p-aging) is performed to prevent defects of the organic light emitting diode composed of the organic light emitting layer and the electrode. This applies an aging voltage to the organic light emitting diode to oxidize the electrode to prevent defects. This p-aging proceeds at atmospheric pressure, that is, in the atmosphere, to oxidize the electrode. At this time, the substrate is wound and unwinded to move to the p-aging chamber. In this case, the exposed surface of the organic light emitting diode may be damaged by scratches or the like. This is because the cathode electrode having a small thickness is inadequate for protecting the organic light emitting layer, and there is a great risk that scratches will occur when the substrate contacts with the guide roll or when the substrate is wound. For example, when a substrate is subjected to a pressure in the vertical direction and the particles are present under the metal film at the time of adhering the metal film, the damage occurs to the organic light emitting diode that the particle touches due to the pressing pressure.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an illumination device using an organic light emitting device in which an organic light emitting device is deposited without using an open mask (metal mask), and a manufacturing method thereof.

It is another object of the present invention to provide an illumination device using an organic light emitting device that prevents damage due to scratches or particles after p-aging, and a manufacturing method thereof.

Other objects and features of the present invention will be described in the following description of the invention and the claims.

According to an aspect of the present invention, there is provided an illumination device using an organic light emitting diode, including an illumination part, a substrate divided into first and second contact parts, a first electrode provided on the substrate, And a first protective layer provided on one electrode.

Here, the illumination device using the organic light emitting diode according to an embodiment of the present invention may include an illumination part of the substrate having the first protective layer, an organic light emitting layer provided on the second contact part, a second electrode, And a metal film attached to the upper portion of the substrate through a pressure sensitive adhesive, wherein the pressure sensitive adhesive includes conductive particles, and electrically connects the second electrode and the metal film.

At this time, the first and second contact portions may be located outside the illumination portion.

The first contact electrode may further include a first contact electrode formed on the first contact unit, the first contact electrode extending to the first contact unit.

Here, the organic light emitting layer of the illumination unit and the second protective layer provided on the second electrode may further include a second protective layer for planarizing the surface of the substrate.

At this time, the second passivation layer may be provided up to at least the height of the second electrode, and may be planarized by filling the periphery of the second electrode.

And a second contact electrode provided on the second contact portion and composed of the metal film.

At this time, a protective film provided on the metal film of the illumination unit may further be included.

The conductive particles may be made of nickel, carbon, or a solder ball.

A method of manufacturing an illumination device using an organic light emitting diode according to an embodiment of the present invention includes the steps of forming an organic light emitting layer and a second electrode on the entire surface of a substrate on which a first protective layer is formed, Forming an etch resist on the substrate on which the two electrodes are formed; removing the organic light emitting layer and the second electrode of the first contact portion using the etch resist as a mask; And then attaching the metal film.

The method of manufacturing an illumination device using an organic light emitting diode according to an exemplary embodiment of the present invention includes the steps of forming an etch resist on the substrate and then forming a second protective layer on the illumination unit by ashing the etch resist As shown in FIG.

Alternatively, the manufacturing method of an illumination device using an organic light emitting diode according to an embodiment of the present invention may further include removing the etch resist after removing the organic light emitting layer and the second electrode of the first contact portion .

At this time, the first electrode may extend to the first contact portion to form a first contact electrode.

At this time, the organic light emitting layer and the second electrode of the first contact portion may be removed using the etch resist as a mask to expose the first contact electrode to the outside.

The metal film of the second contact portion may form a second contact electrode.

And attaching a protective film on the metal film of the illumination unit.

The pressure sensitive adhesive includes conductive particles, and the metal film can be electrically connected to the second electrode by the conductive particles.

As described above, the illumination device using the organic light emitting diode and the method of manufacturing the same according to the embodiment of the present invention can simplify the manufacturing process of the lighting device without using an open mask (metal mask) which is a complicated structure. Thus, the cost can be reduced, and the process and equipment can be simplified, so that various models can be provided without additional cost.

In addition, the illumination device using the organic light emitting diode according to an embodiment of the present invention and the method of manufacturing the same can be applied to a roll-manufacturing process, have. Therefore, the productivity is improved and the manufacturing cost is reduced.

In addition, the illumination device using the organic light emitting diode and the method of manufacturing the same according to an embodiment of the present invention can be used for winding or unwinding a substrate for p-aging by using an ashed resist as an anti-scratch layer, It is possible to prevent damage due to scratches or particles. Therefore, the yield is improved, the manufacturing cost is reduced, and the reliability is secured.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view illustrating a lighting device using an organic light emitting diode according to an exemplary embodiment of the present invention. FIG.
2 is a plan view schematically illustrating a lighting device using an organic light emitting diode according to an embodiment of the present invention.
3 is a schematic cross-sectional view taken along line I-I 'of the lighting apparatus using the organic light emitting diode according to the embodiment of the present invention shown in FIG. 2;
4 is a cross-sectional view exemplarily showing the concept of a roll-making apparatus;
5 is a flowchart sequentially illustrating a method of manufacturing an illumination device using an organic light emitting diode according to an exemplary embodiment of the present invention.
6 is a flowchart sequentially illustrating a method of manufacturing an illumination device using an organic light emitting device according to a comparative example.
7A to 7H are plan views sequentially illustrating a method of manufacturing an illumination device using an organic light emitting diode according to an embodiment of the present invention shown in FIG.
FIG. 8 is an enlarged view of a part of the illumination unit shown in FIG. 7B; FIG.
9A to 9G are sectional views sequentially illustrating a method of manufacturing an illumination device using the organic light emitting diode according to the embodiment of the present invention shown in FIG.
10 is a plan view schematically showing a lighting device using an organic light emitting diode according to another embodiment of the present invention.
11 is a schematic cross-sectional view taken along the line II-II 'of the lighting device using the organic light emitting diode according to another embodiment of the present invention shown in FIG. 10;

Hereinafter, preferred embodiments of the illumination device using the organic light emitting diode according to the present invention and the method of manufacturing the same will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention .

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification. The dimensions and relative sizes of the layers and regions in the figures may be exaggerated for clarity of illustration.

It will be understood that when an element or layer is referred to as being another element or "on" or "on ", it includes both intervening layers or other elements in the middle, do. On the other hand, when a device is referred to as "directly on" or "directly above ", it does not intervene another device or layer in the middle.

The terms spatially relative, "below," "lower," "above," "upper," and the like, And may be used to easily describe the correlation with other elements or components. Spatially relative terms should be understood to include, in addition to the directions shown in the drawings, terms that include the different directions of the elements in use, or in operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprise "and / or" comprising ", as used in the specification, means that the presence of stated elements, Or additions.

FIG. 1 is a cross-sectional view illustrating an illumination device using an organic light emitting diode according to an exemplary embodiment of the present invention. Referring to FIG.

2 is a plan view schematically showing a lighting device using an organic light emitting diode according to an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view taken along line I-I 'of FIG. 2 illustrating an illumination device using the organic light emitting diode according to the embodiment of the present invention. Referring to FIG.

The present invention provides an illumination device using an organic light emitting device made of an organic material rather than an illumination device using an inorganic light emitting device made of an inorganic material.

An organic light emitting device made of an organic light emitting material has a relatively good luminous efficiency of green and red as compared with an inorganic light emitting device. In addition, since the width of the emission peak of red, green, and blue is relatively larger than that of the inorganic light emitting device, the color rendering index of the organic light emitting device is improved and the light of the light emitting device is more similar to the sunlight.

In the following description, the illuminating device of the present invention is described as a flexible illuminating device with ductility, but it may be applied not only to the bent illuminating device of the present invention but also to a general illuminating device that does not bend.

1 to 3, an illumination device 100 using an organic light emitting device according to an embodiment of the present invention includes an organic light emitting device part 101 in which a surface light is emitted, (102). ≪ / RTI >

At this time, an external light extracting layer 145 may be further provided under the organic light emitting diode part 101 to increase the haze.

The external light extraction layer 145 is formed by scattering particles of TiO ₂ or the like dispersed in the resin, and may be attached to the lower portion of the substrate 110 through an adhesive layer (not shown).

The organic light emitting diode unit 101 may include an organic light emitting diode disposed on the substrate 110 and an internal light extraction layer 140 may be further provided between the substrate 110 and the organic light emitting diode.

A planarizing layer (not shown) may further be provided on the inner light extracting layer 140.

At this time, the substrate 110 is electrically connected to the outside through the illumination unit EA and the contact electrodes (pad electrodes) 127 and 128, which emits the actual light and outputs the light to the outside, (Pad portions) CA1 and CA2.

The contact portions CA1 and CA2 may not be covered by the sealing means of the metal film 170 and / or the protective film 175 and may be electrically connected to the outside through the contact electrodes 127 and 128. [ The second contact electrode 128 formed on a part of the metal film 170 is shielded by the protective film 175 so that the first contact electrode 127 and the second contact electrode 128 are electrically connected to each other. It can be electrically connected to the outside.

At this time, the contact portions CA1 and CA2 may be located outside the illumination portion EA. For example, referring to FIG. 2, the contact portions CA1 and CA2 are located outside the upper portion of the illumination portion EA, and the first contact portion CA1 is located on the left side and the second contact portion CA2 is located on the right side . In this case, the module process can be easily performed. However, the present invention is not limited to this arrangement. The metal film 170 may be attached to the entire surface of the illuminating portion EA and the second contact portion CA2 of the substrate 110 excluding the first contact portion CA1 and the protective film 175 may be attached to the contact portions CA1, (EA) of the substrate 110, except for the light-shielding portions CA1 and CA2.

A first electrode 116 and a second electrode 126 are disposed on the substrate 110 and an organic light emitting layer 130 is disposed between the first electrode 116 and the second electrode 126, . In the illumination device 100 having such a structure, as a signal is applied to the first electrode 116 and the second electrode 126 of the organic light emitting device, the organic light emitting layer 130 emits light, thereby outputting light through the illumination unit EA .

The organic light emitting layer 130 may be a light emitting layer that outputs white light. For example, the organic light emitting layer 130 may include a blue light emitting layer, a red light emitting layer, and a green light emitting layer, or may have a tandem structure including a blue light emitting layer and a yellow-green light emitting layer. However, the organic light emitting layer 130 of the present invention is not limited to the above-described structure, and various structures may be applied.

The organic light emitting layer 130 of the present invention includes an electron injection layer and a hole injection layer for injecting electrons and holes respectively into the light emitting layer, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the light emitting layer, Lt; RTI ID = 0.0 > a < / RTI > charge generating layer.

The first protective layer 115a and the organic light emitting layer 130 and the second electrode 126 are covered with the encapsulation means of the adhesive 118 and the metal film 170, 2 is formed only in the contact portion CA2, it is possible to prevent moisture from penetrating into the organic light emitting layer 130 of the illumination portion EA. In addition, since the second passivation layer 115b is formed on the organic light emitting layer 130 and the second electrode 126 of the illuminating unit EA, it is possible to prevent the penetration of moisture through the inside of the adhesive 118. [

Generally, the polymer constituting the organic luminescent material deteriorates rapidly when luminescent material is combined with moisture, and the luminescent efficiency of the organic luminescent layer 130 is lowered. Particularly, when a part of the organic light emitting layer 130 is exposed to the outside in the illumination apparatus 100, moisture is propagated into the illumination apparatus 100 along the organic light emitting layer 130 to lower the light emitting efficiency of the illumination apparatus 100 . The organic light emitting layer 130 and the second electrode 126 are formed only in the illumination portion EA and the second contact portion CA2 covered by the sealing means and the second protective layer 115b Is formed on the organic light emitting layer 130 and the second electrode 126 of the illumination unit EA and the moisture is supplied to the organic light emitting layer 130 of the illumination unit EA of the illumination device 100, To prevent penetration. Particularly, since the protruding portion of the auxiliary electrode 111 is flattened by the second protective layer 115b, even when the substrate 110 is wound or unwinded for p-aging, And can act as an anti-scratch layer that prevents damage due to scratches or particles. Therefore, the yield is improved, the manufacturing cost is reduced, and the reliability is secured.

At this time, the second protective layer 115b may be formed in a manner that the organic light emitting layer 130 and the second electrode 126 are formed in the illumination portion EA and the second contact portion CA2 under the sealing means, in addition to the anti- It is possible to simultaneously perform the mask function of patterning.

At this time, the first electrode 116 including the first contact electrode 127 is disposed on the substrate 110 made of a transparent material. As the substrate 110, a hard material such as glass can be used, but it becomes possible to manufacture the lighting device 100 which can be bent by using a material having flexibility such as plastic. In addition, in the present invention, by using plastic material having ductility as the substrate 110, it becomes possible to perform a process using a roll, thereby making it possible to manufacture the lighting apparatus 100 quickly.

The first electrode 116 including the first contact electrode 127 is formed on the illumination unit EA and the first contact CA1 and may be formed of a transparent conductive material having a high conductivity and a high work function. For example, in the present invention, a tin oxide-based conductive material such as indium tin oxide (ITO) or a zinc oxide-based conductive material such as IZO (Indium Zinc Oxide) may be used as the first electrode 116 including the first contact electrode 127 And a transparent conductive polymer may also be used.

At this time, the first electrode 116 may extend to the first contact CA1 outside the illumination unit EA to constitute the first contact electrode 127. FIG.

The auxiliary electrode 111 may be disposed on the illumination unit EA and the first contact CA1 of the substrate 110 to be electrically connected to the first electrode 116. [ The first electrode 116 has the advantage of transmitting light emitted by being formed of a transparent conductive material. However, the first electrode 116 has a disadvantage that the electrical resistance is very high as compared with the opaque metal. Therefore, when the large-area lighting apparatus 100 is manufactured, the distribution of the current applied to the wide lighting area becomes uneven due to the large resistance of the transparent conductive material, and this non- Thereby making it impossible to emit light having a uniform luminance of.

The auxiliary electrode 111 is arranged in the form of a thin-walled matrix, a mesh, a hexagon, an octagon, a circle, or the like throughout the entire illuminating section EA, So that the large-area lighting apparatus 100 can emit light having a uniform luminance.

3, the auxiliary electrode 111 is disposed below the first electrode 116 including the first contact electrode 127. However, the present invention is not limited thereto, and the auxiliary electrode 111 May be disposed on the first electrode 116 including the first contact electrode 127. The auxiliary electrode 111 disposed on the first contact CA1 is used as a path for transferring the current to the first electrode 116 through the first contact electrode 127, But also serves as a contact electrode to be applied to the electrode 116.

The auxiliary electrode 111 may be made of a conductive metal such as Al, Au, Cu, Ti, W, Mo, or an alloy thereof. The auxiliary electrode 111 may have a two-layer structure including an upper auxiliary electrode 111a and a lower auxiliary electrode 111b, but the present invention is not limited thereto, and may be a single layer.

The first protective layer 115a may be laminated on the illumination portion EA and the second contact portion CA2 of the substrate 110. [ In FIG. 2, the first protective layer 115a is shown as a rectangular frame having a predetermined width, but the present invention is not limited thereto.

The first protective layer 115a disposed in the illumination unit EA is configured to cover the auxiliary electrode 111 and the first electrode 116 thereon. In the light emitting region where the actual light is emitted, the first protective layer 115a Is not disposed. Particularly, the first protective layer 115a of the illumination unit EA is formed so as to surround the auxiliary electrode 111 to reduce the stepped portion by the auxiliary electrode 111, so that the various layers to be formed thereafter are formed stably can do.

The first passivation layer 115a may be made of an inorganic material such as SiOx or SiNx. However, the first protective layer 115a may be composed of an organic material such as photoacryl, or may be composed of a plurality of layers of an inorganic material and an organic material.

The illumination device 100 using the organic light emitting diode according to the embodiment of the present invention includes a substrate 110 on which the first electrode 116 and the first passivation layer 115a are disposed, The organic light emitting layer 130 and the second electrode 126 of the first contact portion CA1 are removed by using an etch resist to deposit the anode contact 130 and the second electrode 126, And is opened.

That is, the illumination device 100 using the organic light emitting device according to the embodiment of the present invention is formed by completely depositing the organic light emitting layer 130 and the second electrode 126 without an open mask, which is a complicated structure, The organic EL layer 130 and the second electrode 126 of the first contact portion CA1 are removed using the second passivation layer 115b to expose the first contact electrode 127 to the outside.

In addition, the illumination device 100 using the organic light emitting diode according to the embodiment of the present invention can be manufactured by ashing the etch resist used as a mask for opening the anode contact to open the cathode contact (that is, ) Is exposed to the outside), and the cathode contact and the sealing process are performed using the adhesive 118, the metal film 170, and the protective film 175.

At this time, when using the conventional open mask, different open masks must be applied to the respective layers of the organic light emitting layer 130 and the second electrode 126, so that it is necessary to manufacture a sophisticated mask and a structure. In addition, unlike the sheet-to-sheet process, the roll-to-roll process requires a continuous process as a roll-substrate ledge, which makes the equipment structure complex and difficult to achieve precision.

Therefore, according to the present invention which does not use an open mask, the cost is reduced, and the process and equipment are simplified, and various models can be provided without additional cost. In addition, the organic light emitting device can be patterned with simple equipment without the application of an open mask and an instrument, thereby providing an advantageous effect applicable to a roll-manufacturing process.

That is, the present invention can form a fine pattern without applying complicated masks and tools in a roll-to-roll process as well as a glass process. In the case of the present invention, since only the design information is changed and it is only necessary to input the open mask without changing the open mask, Applicable to products.

As described above, the organic light emitting layer 130 may be a white organic light emitting layer, and may be composed of a red light emitting layer, a blue light emitting layer and a green light emitting layer, or a tandem structure including a blue light emitting layer and a yellow-green light emitting layer. The organic light emitting layer 130 includes an electron injection layer and a hole injection layer for injecting electrons and holes respectively into the light emitting layer, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the light emitting layer, And a charge generation layer for generating a charge generation layer.

The second electrode 126 may be formed of a metal such as Al, Mo, Cu, Ag, or an alloy such as MoTi.

The first electrode 116 of the illumination unit EA and the organic light emitting layer 130 and the second electrode 126 constitute an organic light emitting device. When the first electrode 116 is an anode of an organic light emitting diode and the second electrode 126 is a cathode and current is applied to the first electrode 116 and the second electrode 126, Electrons are injected from the second electrode 126 into the organic light emitting layer 130 and holes are injected from the first electrode 116 into the organic light emitting layer 130. Excitons are generated in the organic light emitting layer 130. As the excitons are decayed, light corresponding to the energy difference between LUMO (Lowest Unoccupied Molecular Orbital) and HOMO (Highest Occupied Molecular Orbital) And diverges in a downward direction (toward the substrate 110 in the drawing).

At this time, since the first passivation layer 115a is disposed above the auxiliary electrode 111 of the illumination unit EA, the organic light emitting layer 130 on the auxiliary electrode 111 does not directly contact the first electrode 116 An organic light emitting diode is not formed on the auxiliary electrode 111. That is, the organic light emitting element in the illumination portion EA is formed only in the light emitting region in the auxiliary electrode 111 in the form of a matrix, for example.

The substrate 110 having the second electrode 126 may be provided with a second protective layer 115b used as an etch resist.

The second passivation layer 115b according to the embodiment of the present invention is formed on the organic light emitting layer 130 and the second electrode 126 of the illumination unit EA as described above, Scratch layer that prevents water from penetrating into the organic light emitting layer 130 of the illumination unit EA and prevents damage due to scratches or particles.

That is, in the present invention, the second protective layer 115b is formed on the organic light emitting layer 130 and the second electrode 126 of the illumination unit EA in addition to the means for sealing the adhesive 118 and the metal film 170 It is possible to prevent the penetration of moisture through the inside of the adhesive 118

The second protective layer 115b is formed to have a thickness of about 5 to 10 mu m to planarize the protruding portion of the auxiliary electrode 111. Therefore, even when the substrate 110 for p-aging is wound or unwound, It is possible to prevent damage due to scratches or particles. That is, the surface of the substrate 110 after the formation of the second electrode 126 is vulnerable to damage by scratches or particles, and movement between chambers is required for p-aging, which is a subsequent process, And proceeds to release the substrate 110. At this time, the pressing pressure is concentrated on the protruding portion of the auxiliary electrode 111, and not only the surface of the second electrode 126 but also the organic light emitting layer 130 is damaged by scratches or particles, resulting in defects. Accordingly, the second electrode 126 and the organic light emitting layer 130 are not damaged by scratches, particles, or the like, without damaging the second electrode 126 and the organic light emitting layer 130, And the second protective layer 115b having a sufficiently thick thickness is formed on the upper portion. The second protective layer 115b may be formed to have a thickness of about 5 to 10 탆 to planarize the projecting portion of the auxiliary electrode 111 and the particles may be buried without scratching the second electrode 126 . Therefore, the second passivation layer 115b should be formed to fill the periphery of the second electrode 126, and at least the height of the second electrode 126 should be formed.

A third protective layer made of an inorganic material such as SiOx or SiNx or a predetermined encapsulant may be additionally provided on the second protective layer 115b. Such an encapsulant may be an epoxy compound, an acrylate compound, an acrylic compound, or the like.

At this time, a pressure sensitive adhesive 118 such as PSA (Pressure Sensitive Adhesive) is applied to the illuminating portion EA and the second contact portion CA2 of the substrate 110 on which the second protective layer 115b is formed, And the metal film 170 is attached to the substrate 110 to seal the illumination device 100. [

A predetermined protective film 175 may be attached on the entire surface of the illumination portion EA of the substrate 110 excluding the contact portions CA1 and CA2.

The pressure-sensitive adhesive 118 may be a photo-curable pressure-sensitive adhesive or a thermosetting pressure-sensitive adhesive.

The adhesive 118 according to an embodiment of the present invention includes the conductive particles 160 and the metal film 170 including the second contact electrodes 128 is electrically connected to the second electrodes 126, respectively.

At this time, the conductive particles 160 may be provided between the second electrode 126 and the metal film 170 in the second contact portion CA2 of the substrate 110 on which the second protective layer 115b is not formed .

As the conductive particles 160, nickel, carbon, solder ball, or the like can be used.

At this time, the first contact electrode 127 extending from the first electrode 116 may be exposed to the outside on the substrate 110 of the first contact CA1. The second contact electrode 128 is formed on a part of the metal film 170. The second contact electrode 128 is electrically connected to the second electrode 126 by the conductive particles 160 in the adhesive 118. [ Can be connected. Therefore, the first contact electrode 127 and the second contact electrode 128 are electrically connected to an external power source to apply a current to the first electrode 116 and the second electrode 126, respectively.

As described above, in the present invention, the substrate 110 made of a plastic film having flexibility is used, and the organic light emitting layer 130 and the second electrode 126 are stacked on top of each other. Therefore, it becomes possible to manufacture the lighting apparatus 100 quickly, and the manufacturing cost can be reduced.

Fig. 4 is a cross-sectional view exemplarily showing the concept of a roll-making apparatus, showing the concept of a roll-making apparatus for producing a flexible lighting apparatus which can be bent.

4, a roll-making apparatus for manufacturing a soft lighting apparatus includes a film supply roll 52 for supplying a plastic film 10, a film recovery roll 54 for recovering the plastic film 10, And a guide roll (56) for guiding the film (10).

The roll-making apparatus further includes a mask supply roll 62 for supplying an open mask 60 (or a metal mask), a mask recovery roll 64 for recovering the open mask 60, and a deposition apparatus (80).

In this configuration, the plastic film 10 used as the substrate of the illumination apparatus is transferred from the film supply roll 52 to the deposition apparatus 80, and at the same time, the open mask 60 is transferred from the mask supply roll 62. [ The organic film or the metal is deposited on a part of the plastic film 10 in the deposition apparatus 80 in a state where the open mask 60 is disposed on the entire surface of the plastic film 10. [

The open mask 60 after the deposition is separated from the plastic film 10 and the plastic film 10 is recovered by the film recovery roll 54 and the open mask 60 is recovered by the mask recovery roll 64 do.

In the case of using the roll-making apparatus having such a structure, the plastic film 10 can be continuously supplied by the film supply roll 52, and the process can be continuously performed, thereby making it possible to manufacture the lighting apparatus quickly. However, the following problems arise in such a roll-making apparatus.

The roll-making apparatus can be used for forming various metal patterns, but it can be particularly useful for forming an organic light emitting layer or a second electrode because the organic light emitting layer or the second electrode is formed in a predetermined region of the substrate Because it can be easily formed by a roll-making process since it is not entirely patterned by the process but is entirely deposited over the whole area of the substrate.

 However, when the organic luminescent material is entirely deposited on the substrate by the roll-making apparatus to form the organic luminescent layer, the side surface of the front-deposited organic luminescent layer is formed at the same level as the side surface of the substrate, . The organic luminescent material is vulnerable to moisture, and when it is combined with moisture, not only rapidly deteriorates but also easily spreads moisture. Therefore, in order to prevent the water from propagating through the organic light emitting layer exposed to the outside to prevent the illumination device from becoming defective, the organic light emitting layer must be prevented from being exposed to the outside during fabrication of the lighting apparatus.

Accordingly, when the organic light emitting material is deposited by blocking the outer region of the substrate, the open mask does not deposit the organic light emitting layer on the outer region of the substrate, and sealing the side of the organic light emitting layer by sealing the outer region with an encapsulant or an adhesive , It is possible to prevent the organic light emitting layer from being exposed to the outside.

4, in the case of forming the organic light emitting layer using the open mask 60, a system for supplying the plastic film 10 (for example, a supply roll, a guide roll, a recovery roll, 60 have to be in line, so that the length of the process line is long and the length of the open mask 60 is also long. In addition, the plastic film 10 and the open mask 60 have to be supplied in synchronization with each other, and they have to be aligned in a continuous process. Moreover, the used open mask 60 had to be cleaned, which made it difficult to clean the open long mask 60.

In other words, although a roll-manufacturing process using an open mask must be used for manufacturing a rapid lighting device, there has been a practical difficulty in manufacturing the lighting device using an actual roll-manufacturing device due to the use of such an open mask.

However, in the present invention, the organic light emitting layer and the second electrode are formed only in the illuminating portion and the second contact portion covered by the sealing means, and the second protective layer is formed on the organic light emitting layer and the second electrode of the illumination portion, It is possible to prevent moisture from penetrating into the illuminating unit through the exposed organic light emitting layer. Therefore, when the lighting apparatus according to the present invention is manufactured, an open mask is not necessary, so that the manufacturing process of the lighting apparatus is simplified, and particularly, it can be easily applied to the roll-manufacturing process.

Hereinafter, a method of manufacturing a lighting apparatus according to an embodiment of the present invention and a lighting apparatus with a general structure will be described, and advantages of the manufacturing process of the lighting apparatus according to an embodiment of the present invention will be described.

5 is a flowchart sequentially illustrating a method of manufacturing an illumination device using an organic light emitting diode according to an embodiment of the present invention.

Referring to FIG. 5, first, an auxiliary electrode and a first electrode are formed on a substrate made of a transparent plastic film having flexibility (S110). Then, inorganic materials are stacked and etched to form a first protective layer (S120). At this time, the auxiliary electrode, the first electrode, and the first passivation layer may be formed by a photolithography process using a photoresist and a photomask in a roll-manufacturing apparatus.

Subsequently, an organic light emitting material is deposited on the entire surface of the substrate using the roll-manufacturing apparatus shown in FIG. 4 to form an organic light emitting layer (S130). In the present invention, since an open mask is not required when depositing the organic luminescent material, an open mask, a mask supply roll, and a mask recovery roll are not required in the roll-manufacturing apparatus shown in Fig.

Thereafter, a metal is deposited on the entire surface of the substrate to form a second electrode (S140).

Then, an etch resist is formed on the substrate on which the second electrode is formed through inkjet or vapor deposition. Thereafter, the organic light emitting layer and the second electrode outside the illumination unit are removed using the etch resist as a mask to expose the first contact electrode in the first contact unit (S150).

Subsequently, the etch resist is ashed to form the second protective layer, and the second electrode is exposed in the second contact portion for the cathode contact (S160).

Then, the metal film is attached and sealed by the adhesive containing the conductive particles, and the second contact electrode of the metal film is electrically connected to the second electrode through the conductive particles. Then, a protective film is attached to the entire surface of the illumination portion of the substrate (S170).

6 is a flowchart sequentially illustrating a manufacturing method of an illumination device using an organic light emitting device according to a comparative example.

Referring to FIG. 6, first, an auxiliary electrode and a first electrode are formed on a substrate made of a transparent plastic film having ductility, and then a first protective layer is formed by stacking and etching inorganic materials (S20).

Subsequently, an organic light emitting material is deposited on the entire surface of the substrate with the first open mask (metal mask) mounted thereon (S30, S40).

Thereafter, the first open mask mounted on the front surface of the substrate is replaced with a new second open mask, and a second electrode is formed by depositing a metal (S50, S60).

Subsequently, the second open mask mounted on the front surface of the substrate is replaced with a new third open mask to form the second and third protective layers (S70, S80).

Thereafter, the illumination device is completed by attaching the metal film with the adhesive (S90).

As described above, since the open mask is not required in the case of manufacturing the illumination apparatus of the present invention by using the roll-making apparatus, the steps of mounting the open mask and replacing the open mask No process is required. Therefore, the lighting apparatus according to the embodiment of the present invention can be manufactured quickly.

Further, in the case of the illuminating device according to the comparative example, after the process for the plastic film provided on the supply roll is completed, the open mask used in the previous process must be cleaned when the plastic film is supplied again to the supply roll again to carry out the process However, in the case of manufacturing a lighting apparatus according to the embodiment of the present invention, such an open mask need not be cleaned. Therefore, when manufacturing a lighting apparatus according to an embodiment of the present invention, a separate apparatus for cleaning is not required, so that not only cost can be saved, but also environmental pollution due to cleaning can be prevented. Moreover, since a cleaning process between the deposition process and the next deposition process is not necessary, a faster process becomes possible.

Furthermore, in the case of the illuminating device according to the comparative example, a separate device for disposing the open mask in front of the substrate is required, whereas in the embodiment of the present invention, such a device is not necessary, so that the manufacturing device can be simplified and cost can be reduced .

7A to 7H are plan views sequentially illustrating a method of manufacturing an illumination device using an organic light emitting diode according to an embodiment of the present invention shown in FIG.

FIG. 8 is an enlarged view of a part of the illumination unit shown in FIG. 7B; FIG.

9A to 9G are cross-sectional views sequentially illustrating a method of manufacturing an illumination device using an organic light emitting diode according to an embodiment of the present invention shown in FIG.

At this time, although the illustrated manufacturing method is exemplified as a process performed in the roll-making apparatus, the present invention is not limited thereto, and can be similarly applied to a general manufacturing apparatus using a substrate such as glass.

7A and 9A, a metal such as Al, Au, Cu, Ti, W, Mo, or an alloy thereof is deposited and etched on the substrate 110 divided into the illumination part and the contact part, An auxiliary electrode 111 made of a single layer or a plurality of layers is formed.

9A illustrates an example in which the auxiliary electrode 111 has a two-layer structure including an upper auxiliary electrode 111a and a lower auxiliary electrode 111b. However, the present invention is not limited thereto.

At this time, the auxiliary electrode 111 may be arranged in a thin matrix (see FIG. 8), a mesh shape, a hexagonal or an octagonal shape, or a circular shape throughout the entire illuminating portion EA.

Thereafter, a transparent conductive material such as ITO or IZO is deposited over the entire surface of the substrate 110 and etched to form the first electrode 116 and the first contact electrode 127 in the illumination portion and the first contact portion. At this time, the first electrode 116 extends to the first contact portion outside the illumination portion to constitute the first contact electrode 127.

7A and 9A illustrate that the auxiliary electrode 111 is formed under the first electrode 116 including the first contact electrode 127. However, the present invention is not limited thereto, The electrode 111 may be formed on the first electrode 116 including the first contact electrode 127. The auxiliary electrode 111 disposed in the first contact portion is used as a path for transmitting current to the first electrode 116 but also serves as a contact electrode for applying external current to the first electrode 116 can do.

7B and 9B, an organic material such as SiNx or SiOx or an organic material such as photo-acrylic is laminated on the illuminating part and the second contact part of the substrate 110. Next, as shown in FIG. Thereafter, the inorganic material or the organic material is etched to form the first passivation layer 115a on the upper portion and the side portion of the auxiliary electrode 111 of the illumination portion, and in a predetermined region of the second contact portion.

The first passivation layer 115a is formed to cover the auxiliary electrode 111 and the first electrode 116 formed on the auxiliary electrode 111. The first passivation layer 115a is formed in the light emitting region where the actual light is emitted, The first protective layer 115a may be formed in a matrix form so as to cover the auxiliary electrode 111 arranged in a matrix form in the light emitting region). In particular, the first protective layer 115a of the illumination unit is formed so as to surround the auxiliary electrode 111 to reduce the stepped portion by the auxiliary electrode 111, so that various layers to be formed thereafter can be stably formed without being broken . In FIG. 7B, the first protective layer 115a is shown as a rectangular frame having a predetermined width, but the present invention is not limited thereto.

Referring to FIGS. 7C, 7D, and 9C, an organic light emitting material and a metal are sequentially deposited over the entire region of the substrate 110 to form an organic light emitting layer 130 and a second electrode 126.

At this time, the organic light emitting layer 130 may be a white organic light emitting layer composed of a red light emitting layer, a blue light emitting layer and a green light emitting layer, or a tandem structure including a blue light emitting layer and a yellow-green light emitting layer. The organic light emitting layer 130 includes an electron injection layer and a hole injection layer for injecting electrons and holes respectively into the light emitting layer, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the light emitting layer, And a charge generation layer for generating a charge generation layer.

The second electrode 126 may be formed of a metal such as Al, Mo, Cu, Ag, or an alloy such as MoTi.

The first electrode 116 of the illumination unit and the organic light emitting layer 130 and the second electrode 126 constitute an organic light emitting device.

Since the first passivation layer 115a is disposed on the auxiliary electrode 111 of the illumination unit, the organic emission layer 130 on the auxiliary electrode 111 does not directly contact the first electrode 116, 111), an organic light emitting device is not formed. That is, the organic light emitting element in the illumination portion is formed only in the light emitting region partitioned by the auxiliary electrode 111 in the form of a matrix, for example (see FIG. 8).

As described above, the illumination device using the organic light emitting diode according to the embodiment of the present invention is formed by completely depositing the organic light emitting layer 130 and the second electrode 126 without an open mask, which is a complicated mechanism, And simplifies the equipment, so that various models can be provided at no additional cost. In addition, the organic light emitting device can be patterned with simple equipment without the application of an open mask and an instrument, thereby providing an advantageous effect applicable to a roll-manufacturing process.

7E and 9D, an etch resist 115 such as a photoresist is formed on the substrate 110 having the organic light emitting layer 130 and the second electrode 126 formed thereon.

At this time, the etch resist 115 may be composed of a first etch resist 115 'having a first thickness and a second etch resist 115' 'having a second thickness. The first thickness is thicker than the second thickness The first etch resist 115 'may be located corresponding to the illumination portion, and the second etch resist 115 "may be located corresponding to the second contact portion. However, the present invention is not limited thereto, and the etch resist 115 may have the same thickness throughout the illumination portion and the second contact portion.

Thus, the etch resist 115 can be formed in the illumination portion and the second contact portion of the substrate 110 through inkjet or vapor deposition.

The organic light emitting layer 130 and the second electrode 126 of the first contact portion and the organic light emitting layer 130 and the second electrode 126 of the second contact portion are removed using the etch resist 115 as a mask. At this time, dry etching such as plasma treatment can be used.

At this time, the organic light emitting layer 130 and the second electrode 126 are removed from the first contact portion, and the first contact electrode 127 is exposed to the outside.

Next, referring to FIGS. 7F and 9E, the etch resist is ashing to remove the second etch resist having the second thickness, and at the same time, the protective layer 115b made of the first etch resist is formed. At this time, the second etch resist formed on the second contact portion is removed, and the second electrode 126 below the second etch resist is exposed to the outside.

As such, the etch resist is ashed to form the second passivation layer 115b, and the second electrode 126 is exposed in the second contact portion for the cathode contact.

Next, referring to FIGS. 7G and 9F, a pressure-sensitive adhesive 118 made of a photocurable adhesive material or a thermosetting adhesive material is applied on the substrate 110. Next, After the metal film 170 is placed thereon, the metal film 170 is attached by curing the pressure-sensitive adhesive 118.

At this time, the means for sealing the adhesive 118 and the metal film 170 may be attached to the illuminating portion and the second contact portion of the substrate 110 on which the second electrode 126 is formed.

The adhesive 118 according to an embodiment of the present invention includes the conductive particles 160 and the metal film 170 including the second contact electrodes 128 is electrically connected to the second electrodes 126, respectively.

7H and 9G, the illumination device can be completed by attaching a predetermined protective film 175 to the entire surface of the illumination part of the substrate 110 excluding the contact part.

As described above, the first contact electrode 127 connected to the first electrode 116 may be exposed to the outside on the substrate 110 of the first contact portion. The second contact electrode 128 is formed on a part of the metal film 170 and can be electrically connected to the second electrode 126 by the conductive particles 160 in the adhesive 118. Therefore, the first contact electrode 127 and the second contact electrode 128 are electrically connected to an external power source to apply a current to the first electrode 116 and the second electrode 126, respectively.

In this case, as described above, the etch resist of the present invention may have the same thickness throughout the illumination portion and the second contact portion of the substrate, rather than the multi-step difference. If the etch resist is formed so as to have a single step, It may be omitted. In addition, the entirety of the etch resist may be removed through ashing, which will be described in detail through another embodiment of the present invention.

10 is a plan view schematically showing a lighting apparatus using an organic light emitting diode according to another embodiment of the present invention.

11 is a schematic cross-sectional view taken along the line II-II 'of the illumination device using the organic light emitting diode according to another embodiment of the present invention shown in FIG.

In this case, the illumination device using the organic light emitting diode according to another embodiment of the present invention shown in FIGS. 10 and 11 may include the organic light emitting device according to the embodiment of the present invention, And has substantially the same configuration as that of the illumination device used.

That is, the illumination device using the organic light emitting device according to another embodiment of the present invention may include an organic light emitting device part for emitting light and a sealing part for sealing the organic light emitting device part.

10 and 11, the substrate 210 includes an illumination unit EA that emits light and outputs the light to the outside, and a contact electrode (a pad electrode) 210. The organic light emitting device includes an organic light emitting diode And contact portions CA1 and CA2 electrically connected to the outside through the contact portions 227 and 228 to apply a signal to the illumination portion EA.

The contact portions CA1 and CA2 may not be covered by the sealing means of the metal film 270 and / or the protective film 275 and may be electrically connected to the outside through the contact electrodes 227 and 228. [ The second contact electrode 228 formed on a part of the metal film 270 is shielded by the protective film 275 so that the first contact electrode 227 is exposed to the outside and electrically connected to the outside. It can be electrically connected to the outside.

At this time, the contact portions CA1 and CA2 may be located outside the illumination portion EA. 10, the contact portions CA1 and CA2 are located outside the upper portion of the illumination portion EA, and the first contact portion CA1 is located on the left side and the second contact portion CA2 is located on the right side of the second contact portion CA2 . In this case, the module process can be easily performed. However, the present invention is not limited to this arrangement. The metal film 270 may be attached to the entire surface of the illuminating portion EA and the second contact portion CA2 of the substrate 210 excluding the first contact portion CA1 and the protective film 275 may be attached to the contact portions CA1, (EA) of the substrate 210, except for the light-shielding portions CA1 and CA2.

A first electrode 216 and a second electrode 226 are disposed on the substrate 210 and an organic light emitting layer 230 is disposed between the first electrode 216 and the second electrode 226, .

The first protective layer 215a and the organic light emitting layer 230 and the second electrode 226 are covered with the encapsulation means of the adhesive agent 218 and the metal film 270, 2 is formed only in the contact portion CA2, it is possible to prevent moisture from penetrating into the organic light emitting layer 130 of the illumination portion EA.

At this time, the first electrode 216 including the first contact electrode 227 is disposed on the substrate 210 made of a transparent material. As the substrate 210, a hard material such as glass can be used, but it becomes possible to manufacture the lighting device 200 which can be bent by using a material having flexibility such as plastic. In addition, in the present invention, by using plastic material having ductility as the substrate 210, it becomes possible to perform a process using a roll, thereby making it possible to manufacture the lighting apparatus 200 quickly.

The first electrode 216 including the first contact electrode 227 is formed on the illumination unit EA and the first contact CA1 and may be formed of a transparent conductive material having a high conductivity and a high work function.

At this time, the first electrode 216 may extend to the first contact CA1 outside the illumination unit EA to form the first contact electrode 227.

An auxiliary electrode 211 may be disposed on the illumination unit EA and the first contact CA1 of the substrate 210 to be electrically connected to the first electrode 216. [

The auxiliary electrode 211 is arranged in the form of a thin-walled matrix, a mesh, a hexagon, an octagon, a circle, or the like throughout the entire illuminating section EA, So that the large-area lighting apparatus 200 can emit light having a uniform luminance.

11, the auxiliary electrode 211 is disposed below the first electrode 216 including the first contact electrode 227. However, the present invention is not limited thereto, and the auxiliary electrode 211 May be disposed on top of the first electrode 216 including the first contact electrode 227. The auxiliary electrode 211 disposed in the first contact CA1 is used as a current path for supplying the current to the first electrode 216 through the first contact electrode 227, And may serve as a contact electrode to be applied to the electrode 216.

The auxiliary electrode 211 may be formed of a metal having good conductivity such as Al, Au, Cu, Ti, W, Mo, or an alloy thereof. The auxiliary electrode 211 may have a two-layer structure including an upper auxiliary electrode 211a and a lower auxiliary electrode 211b. However, the present invention is not limited thereto and may be a single layer.

The first protective layer 215a may be laminated on the illuminating portion EA and the second contact portion CA2 of the substrate 210. [ In FIG. 10, the first protective layer 215a is shown as a rectangular frame having a predetermined width, but the present invention is not limited thereto.

The first protective layer 215a disposed in the illumination unit EA is configured to cover the auxiliary electrode 211 and the first electrode 212 thereon. In the light emitting region where the actual light is emitted, the first protective layer 215a Is not disposed. In particular, the first protective layer 215a of the illumination unit EA is formed so as to surround the auxiliary electrode 211 so as to reduce the stepped portion by the auxiliary electrode 211, so that the various layers to be formed thereafter are formed stably can do.

The first passivation layer 215a may be formed of an inorganic material such as SiOx or SiNx. However, the first protective layer 215a may be composed of an organic material such as photoacryl, or may be composed of a plurality of layers of an inorganic material and an organic material.

In this case, the illumination device 200 using the organic light emitting diode according to another embodiment of the present invention may include a substrate 200 on which the first electrode 216 and the first passivation layer 215a are disposed, as in the above- The organic light emitting layer 230 and the second electrode 226 are removed from the first contact portion CA1 using an etch resist after the organic light emitting layer 230 and the second electrode 226 are deposited on the upper surface And an anode contact is opened.

That is, the organic light emitting layer 230 and the second electrode 226 are entirely deposited on the organic light emitting device 200 using the organic light emitting device according to another embodiment of the present invention, The organic light emitting layer 230 and the second electrode 226 of the first contact CA1 are removed to expose the first contact electrode 227 to the outside.

In addition, the illumination device 200 using the organic light emitting diode according to another embodiment of the present invention may be configured such that the etch resist used as a mask for opening the anode contact is removed to open the cathode contact (that is, 228 are exposed to the outside), and the cathode contact and the sealing process are performed using the adhesive agent 218, the metal film 270, and the protective film 275.

As described above, the organic light emitting layer 230 may be a white organic light emitting layer, and may be composed of a red light emitting layer, a blue light emitting layer, and a green light emitting layer, or a tandem structure including a blue light emitting layer and a yellow-green light emitting layer. The organic light emitting layer 230 includes an electron injection layer and a hole injection layer for injecting electrons and holes respectively into the light emitting layer, an electron transport layer and a hole transport layer for transporting the injected electrons and holes to the light emitting layer, And a charge generation layer for generating a charge generation layer.

The second electrode 226 may be formed of a metal such as Al, Mo, Cu, Ag, or an alloy such as MoTi.

At this time, an adhesive agent 218 such as PSA is applied to the illumination part EA and the second contact part CA2 of the substrate 210 on which the second electrode 226 is formed, and the metal film 270 is disposed thereon, The metal film 270 is attached to the substrate 210 to seal the lighting device 200.

A predetermined protective film 275 may be attached on the entire surface of the illumination unit EA of the substrate 210 excluding the contact units CA1 and CA2.

The pressure-sensitive adhesive 218 may be a photo-curable pressure-sensitive adhesive or a thermosetting pressure-sensitive adhesive.

The adhesive agent 218 according to another embodiment of the present invention includes the conductive particles 260 and the metal film 270 including the second contact electrodes 228 is electrically connected to the second electrode (Not shown).

At this time, the conductive particles 260 may be provided between the second electrode 226 and the metal film 270 in the second contact CA2 of the substrate 210. [

As the conductive particles 260, nickel, carbon, solder ball, or the like can be used.

At this time, the first contact electrode 227 extended from the first electrode 216 may be exposed to the outside on the substrate 210 of the first contact CA1. The second contact electrode 228 is formed on a part of the metal film 270. The second contact electrode 228 is electrically connected to the second electrode 226 by the conductive particles 260 in the adhesive 218. [ Can be connected. Accordingly, the first contact electrode 227 and the second contact electrode 228 are electrically connected to an external power source to apply a current to the first electrode 216 and the second electrode 226, respectively.

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

100, 200: illumination device 110, 210:
115, 115 ', 115 ": etch resist 115a, 215a: first protective layer
115b: second protective layer 116, 216: first electrode
118, 218: Pressure sensitive adhesive 126, 226:
127, 227: first contact electrodes 128, 228: second contact electrodes
130, 230: organic light emitting layer 160, 260:
170, 270: metal film 175, 275: protective film

Claims (16)

A substrate divided into first and second contact portions;
A first electrode provided on the substrate;
A first protective layer provided on the first electrode;
An organic light emitting layer and a second electrode provided on the illumination part and the second contact part of the substrate provided with the first protective layer; And
And a metal film attached to the upper portion of the substrate of the second contact portion through the adhesive,
Wherein the pressure-sensitive adhesive includes conductive particles, and electrically connects the second electrode and the metal film. The illumination device according to claim 1, wherein the first and second contact portions are located outside the illumination portion. The illumination device of claim 2, further comprising a first contact electrode formed on the first contact unit, the first contact electrode extending to the first contact unit. The illumination device of claim 3, further comprising a second passivation layer provided on the organic light emitting layer and the second electrode of the illumination unit to planarize the surface of the substrate. 5. The illumination device of claim 4, wherein the second passivation layer is provided at least up to the height of the second electrode to fill the periphery of the second electrode to planarize. 3. The illumination device of claim 2, further comprising a second contact electrode provided on the second contact portion and composed of the metal film. The illumination device of claim 6, further comprising a protective film provided on the metal film of the illumination unit. The lighting apparatus according to claim 1, wherein the conductive particles are made of nickel, carbon, or solder balls. Forming a first electrode on the substrate divided into the illumination portion and the first and second contact portions;
Forming a first passivation layer on the substrate on which the first electrode is formed;
Forming an organic light emitting layer and a second electrode on the entire surface of the substrate on which the first passivation layer is formed;
Forming an etch resist on the substrate on which the organic light emitting layer and the second electrode are formed;
Removing the organic light emitting layer and the second electrode of the first contact portion using the etch resist as a mask; And
And attaching the metal film to the upper portion of the substrate of the illumination unit and the second contact unit via a pressure-sensitive adhesive. 10. The method according to claim 9, further comprising, after forming an etch resist on the substrate, ashing the etch resist to form a second protective layer on the illumination unit. 10. The method of claim 9, further comprising removing the etch resist after removing the organic light emitting layer and the second electrode of the first contact portion. The method according to any one of claims 10 and 11, wherein the first electrode extends to the first contact portion to form a first contact electrode. The manufacturing method of an illumination device according to claim 12, wherein the organic light emitting layer and the second electrode of the first contact portion are removed using the etch resist as a mask to expose the first contact electrode to the outside. 10. The method of claim 9, wherein the metal film of the second contact portion forms a second contact electrode. The method according to claim 9, further comprising the step of attaching a protective film on the metal film of the illumination unit. 10. The method according to claim 9, wherein the pressure-sensitive adhesive comprises conductive particles, and the metal film is electrically connected to the second electrode by the conductive particles.

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