KR20180063596A - Module for recognizing biometric information of finger and electronic device using the same and manufacturing method of module for recognizing biometric information of finger and manufacturing method of transducer - Google Patents

Abstract

The present invention relates to a module for recognizing biometric information of a finger, which allows the characteristics of a transducer to be changed to increase the recognition rate of ultrasound and improve precision for recognition of biometric information of a finger when using ultrasound to recognize the biometric information of a finger; an electronic device using the same; and a manufacturing method of a transducer for the same. The module for recognizing biometric information of a finger comprises a transducer to output ultrasound towards a finger and receive ultrasound reflected from the finger to return; a sound wave control member laminated on the transducer and allowing the transducer to output the ultrasound and the ultrasound transmitted to and received from the transducer to be transferred without loss; and a signal processing unit electrically connected to sense biometric information of the finger in accordance with the received ultrasound.

Description

TECHNICAL FIELD [0001] The present invention relates to a finger biometric information recognition module, an electronic device to which the finger biometric information recognition module is applied, a manufacturing method of the finger biometric information recognition module, and a manufacturing method of the transducer. OF FINGER AND MANUFACTURING METHOD OF TRANSDUCER}

The present invention relates to a finger biometric information recognition module, an electronic device to which the finger biometric information recognition module is applied, a manufacturing method of the finger biometric information recognition module, and a manufacturing method of the transducer. More specifically, by changing the characteristics of the transducer, A finger biometric information recognition module for increasing the recognition rate of the ultrasonic waves and improving the precision with respect to the biometric information recognition of the finger when recognizing the biometric information of the finger, an electronic device to which the finger biometric information is recognized, and a manufacturing method of the finger biometric information recognition module And a method of manufacturing the transducer.

2. Description of the Related Art Generally, a fingerprint recognition sensor is a sensor for detecting fingerprints of a person, and is used to determine whether to turn on / off or sleep mode of an electronic device power source as well as a device such as a door lock which has been widely applied.

Such a fingerprint recognition sensor can be classified into an ultrasonic method using ultrasonic waves, a light method using infrared rays or ultraviolet rays, and a capacitance method using capacitance according to the operation principle of a core element. Among them, the ultrasonic wave method is different from the ultrasonic wave method in that a certain frequency of ultrasonic waves emitted from a plurality of piezoelectric sensors is returned differently due to the difference of the acoustic impedance between the valleys of the fingerprint and the ridges, The fingerprint can be recognized by measuring using the piezoelectric sensor of Fig.

Recently, a finger biometric information recognition module has been developed that detects blood vessels (such as a finger vein) distributed on the fingers of a person beyond the detection of fingerprints. Such a finger biometric information recognition technology can not be falsified or altered, and has high accuracy and is rapidly emerging as a personal authentication means.

However, the finger biometric information recognition module must increase the recognition rate of the biometric information through the module as the importance of the security of the electronic device gradually increases. In particular, since the finger vein is positioned inside the finger compared to the fingerprint, the ultrasonic wave must be stably transmitted to the inside of the finger, and the returning ultrasonic wave must be stably received. Here, when the sensitivity of the piezoelectric sensor is increased to raise the recognition rate of the finger vein, the power consumption of the miniaturized electronic device is increased, the cost of the piezoelectric sensor is increased, and the life of the piezoelectric sensor is shortened. have.

Korean Patent Laid-Open Publication No. 2015-0080812 (entitled Fingerprint Detection Sensor and Electronic Apparatus Including the Same, published on Jan. 10, 2015)

It is an object of the present invention to solve the conventional problems, and it is an object of the present invention to improve the recognition accuracy of the ultrasonic wave when recognizing the biometric information of the finger using the ultrasonic waves by changing the characteristics of the transducer, The present invention also provides a method of manufacturing a finger biometric information recognition module and a method of manufacturing a transducer.

According to a preferred embodiment of the present invention, the finger biometric information recognition module according to the present invention includes finger biometric information for recognizing biometric information including at least one of a finger vein and a fingerprint from a finger to be contacted, A transducer for outputting an ultrasonic wave toward the finger and receiving ultrasonic waves reflected from the finger and returning; A sound wave control member laminated on the transducer so that ultrasonic waves transmitted and received are transmitted without loss; And a signal processing unit for causing the transducer to output ultrasonic waves and for sensing biometric information of the finger in accordance with the ultrasonic waves received and electrically connected to the transducer, A plurality of unit piezoelectric cells spaced apart from each other; And a filler filled between adjacent unit piezoelectric cells, wherein the unit piezoelectric cell includes at least one of an inorganic piezoelectric material and an organic piezoelectric material.

Here, the unit piezoelectric cells are processed into a column shape by a dry etching technique or a micro molding technique.

Here, a plurality of pores communicating with each other are formed in the inorganic piezoelectric material, and the organic piezoelectric material surrounds the outer peripheral surface of the inorganic piezoelectric material or is formed in the pore.

The finger biometric information recognition module according to the present invention is a finger biometric information recognition module for recognizing biometric information including at least one of a finger vein and a fingerprint from a finger to be contacted and outputs an ultrasonic wave toward the finger, A transducer for receiving reflected ultrasound waves; A sound wave control member laminated on the transducer so that ultrasonic waves transmitted and received are transmitted without loss; And a signal processing unit for causing the transducer to output ultrasonic waves and for sensing biometric information of the finger in accordance with an ultrasonic wave that is electrically connected to the transducer and received by the transducer, And a plate-like piezoelectric plate for outputting the piezoelectric plate.

Here, the piezoelectric plate includes aluminum nitride (AlN) or lead titanate zirconate (PZT, PbZrTiO3).

The finger biometric information recognition module according to the present invention further includes an ultrasonic transmission member which is interposed between the transducer and the sound wave control member so that ultrasonic waves are transmitted between the transducer and the sound wave control member.

The finger biometric information recognition module according to the present invention further includes a post member for forming a vacuum state space between the transducer and the signal processing unit to prevent ultrasonic waves from being transmitted to the signal processing unit.

The signal processing unit may include an ultrasonic driver connected to the transducer and applying a driving signal to the transducer so that ultrasonic waves are output from the transducer; An ultrasonic processing unit connected to the transducer for processing ultrasound waves received from the transducer; A multiplexing logic unit for selecting and outputting a specific signal matching the condition among the signals of the ultrasonic processing unit; A signal conversion unit for converting a signal output from the multiplexing logic unit; And a signal processing control unit for controlling the driving signal applied by the ultrasonic driving unit so that the frequency of the ultrasonic wave is adjusted and controlling the operation of the ultrasonic wave processing unit, the multiplexing logic unit, and the signal converting unit in response to the controlled driving signal. .

Here, the ultrasonic wave processing unit may further include a controller for monitoring the received ultrasonic signal to extract a fingerprint or finger vein signal from the received ultrasonic signal and correcting the received ultrasonic signal.

Here, when the signal processing control unit controls the drive signal so that the frequency of the ultrasonic wave output from the transducer indicates the first frequency, the fingerprint and finger vein of the finger are sensed, and the signal processing unit When the signal processing control unit controls the drive signal so that the frequency of the output ultrasonic wave indicates a second frequency higher than the first frequency, the fingerprint of the finger is sensed by the signal processing unit.

The signal processing unit may include: a Hilbert transform unit for Hilbert transforming the signal transformed by the signal transforming unit to generate a transformed signal; A shaping unit for shaping the converted signal generated through the Hilbert transform unit to generate a shaping signal; An image substitution unit for generating a substitution signal by replacing the stereoscopic signal generated through the stereoscopic unit with a three-dimensional image element; An OR combining unit for generating a three-dimensional signal by synthesizing the replacement signals generated through the plurality of image substitution units; And an image acquisition unit for acquiring a final three-dimensional image based on the three-dimensional signal generated through the logic synthesis unit.

The electronic device according to the present invention comprises the above-described finger biometric information recognition module; And a main control unit for controlling the electronic device based on the signal output from the signal processing unit.

The method of manufacturing a transducer according to the present invention is a method of manufacturing a transducer using the dry etching technique, and is a method of manufacturing a thick film for manufacturing a composite piezoelectric thick film using at least one of a group inorganic piezoelectric material and the organic piezoelectric material step; A thick film cutting step of cutting the composite piezoelectric thick film produced through the thick film manufacturing step so that the slit is formed in the composite piezoelectric thick film; And a slit filling step of filling the filler into the compartment slit.

Here, the thick film manufacturing step may include: a step of laminating a template for forming pores in a base; A precursor impregnation step of impregnating the template with the precursor solution of the inorganic piezoelectric material after the step of laminating the template; A drying step of drying the precursor solution of the inorganic piezoelectric material after the step of impregnating the precursor solution; A step of removing the template from the precursor solution of the inorganic piezoelectric material after the drying step; A crystallization step of crystallizing the precursor solution of the dried inorganic piezoelectric material after the step of removing the template; An organic material applying step of applying the organic piezoelectric material to the precursor solution of the inorganic piezoelectric material after the crystallization step; And a thickening step of preparing the composite piezoelectric thick film by mixing and molding the crystallized precursor solution of the inorganic piezoelectric material and the organic piezoelectric material.

The method of manufacturing a transducer according to the present invention is a method of manufacturing a transducer using the micro molding technique, wherein the inorganic piezoelectric material or the organic piezoelectric material or a mixed material obtained by mixing the inorganic piezoelectric material and the organic piezoelectric material ; Preparing a forming mold having a cell groove corresponding to the unit piezoelectric cell; Implanting the organic piezoelectric material or the inorganic piezoelectric material or the mixed material into the molding die to manufacture a green array in which the unit piezoelectric cells are formed in a base layer; Sintering the green array to produce a sintered array; Separating the green array or the sintered array from the molding mold; And filling the filler between the unit piezoelectric cells adjacent to each other in the sintered array.

The method of manufacturing a transducer according to the present invention includes the steps of removing a base layer from the sintered array in which the filling material is filled so that only the unit piezoelectric cell and the filling material are left in the sintered array; And forming an electrode at both ends of the unit piezoelectric cell. ≪ RTI ID = 0.0 > 11. < / RTI >

A method of manufacturing a finger biometric information recognition module according to the present invention is a method of manufacturing the above-described finger biometric information recognition module by applying the plate-shaped piezoelectric plate, comprising the steps of: preparing a support for stacking upper electrodes; Laminating the upper electrode, the piezoelectric plate and the lower electrode on the sound wave control member in order; Etching the lower electrode so that the plate-shaped lower electrode corresponds to the unit cell; Forming a via hole in the piezoelectric plate, patterning a connection line for applying power to the upper electrode and the separated lower electrode to form the transducer; Depositing the transducer and the support on the signal processing unit such that the signal processing unit and the connection line are electrically connected; And laminating the sound wave control member on the support portion.

The method for manufacturing a finger biometric information recognition module according to the present invention is characterized in that a post member is formed on the signal processing unit before the transducer is stacked on the signal processing unit and the ultrasonic wave is prevented from being transmitted to the signal processing unit Further comprising:

The method for manufacturing a finger biometric information recognition module according to the present invention is a method for manufacturing the finger biometric information recognition module by applying the plate type piezoelectric plate, and the ultrasonic wave transmission / reception module for forming a transmission path of the ultrasonic wave transmitted / Preparing a transfer base material for forming a member; Stacking the upper electrode, the piezoelectric plate, and the lower electrode in order on the transfer base material; Etching the lower electrode so that the plate-shaped lower electrode corresponds to the unit cell; Forming a via hole in the piezoelectric plate, patterning a connection line for applying power to the upper electrode and the separated lower electrode to form the transducer; Laminating the transducer and the transfer base material to the signal processing unit so that the signal processing unit and the connection line are electrically connected; And forming the ultrasonic wave transmission member by processing the transfer base material.

The method of manufacturing a finger biometric information recognition module according to the present invention further includes stacking the sound wave control member on the ultrasonic wave transmission member.

According to the finger biometric information recognition module, the electronic apparatus to which the finger biometric information recognition module is applied, the manufacturing method of the finger biometric information recognition module, and the method of manufacturing the transducer according to the present invention, by changing the characteristics of the transducer, It is possible to increase the recognition rate of the ultrasonic waves and improve the accuracy of the recognition of the biometric information of the finger.

Further, the present invention can stably match the acoustic impedance between the transducer and the finger by changing the characteristics of the transducer, and it is possible to omit a separate matching member.

In addition, the present invention can reduce the horizontal component perpendicular to the traveling direction of the ultrasonic waves among the vibration components generated in the unit piezoelectric cells, and also prevent vibration coupling between adjacent unit piezoelectric cells, It is possible to individually drive and individually receive the piezoelectric cells, and it is possible to improve the transmission characteristics of the ultrasonic waves and the reception characteristics of the ultrasonic waves in the unit piezoelectric cells.

In addition, the present invention can improve the transmission characteristics of ultrasonic waves and the reception characteristics of ultrasonic waves in a unit piezoelectric cell by separating a driving signal of ultrasonic waves and a reception signal of ultrasonic waves in a unit piezoelectric cell.

In addition, the present invention simplifies the manufacturing of the transducer by simplifying the bonding between the inorganic piezoelectric material and the organic piezoelectric material in the unit piezoelectric cell, and also prevents the power of the ultrasonic wave or energy loss of the ultrasonic wave in the unit piezoelectric cell, The penetration rate can be improved.

In addition, the present invention improves the transmission and reception sensitivity of the ultrasonic wave by transmitting both the ultrasonic wave transmitted through the transducer and the sound wave control member and the received ultrasonic wave without energy loss, thereby improving the transmission and reception sensitivity of the ultrasonic wave, the reflectance of the ultrasonic wave, And the acoustic impedance between the transducer and the finger can be stably matched and a separate matching member can be omitted.

In addition, the present invention can stably receive an annihilation wave having a small wavelength and amplitude through a sound wave control member and transmit it stably to a signal processing unit.

In addition, the present invention provides an ultrasonic diagnostic apparatus, which is capable of stably inducing ultrasonic waves input from a sound wave control member in a traveling direction, inducing resonance of ultrasonic waves in a sound wave control member, The transmission of ultrasonic waves can be stabilized.

Further, the present invention can prevent attenuation of ultrasonic waves, stabilize transmission of ultrasonic waves, and stably match acoustic impedances with fingers by filling control-matching members in portions formed through sound wave control members.

Further, according to the present invention, by controlling the frequency of the ultrasonic wave, the finger vein recognition and the fingerprint recognition can be used in combination, and the flow of the finger vein fingerprint and the finger can be precisely captured, You can implement a dimensional image.

Further, the present invention improves the security of fingerprint or finger vein recognition in an electronic device and protects personal information embedded in the electronic device.

In addition, the present invention implements micro-machining in micrometer units for controlling sound in the ultrasonic range, facilitates the manufacture of the sound control member, improves the strength of the structure of the sound control member, Or to increase the yield.

Further, the present invention can simplify the centering between the first signal transmission grooves formed in the sound wave control member, the second signal transmission grooves and the connection lines, and minimize the stacking error, thereby preventing defects of the sound wave control member.

Further, the present invention can reduce the height of the sound wave control member and contribute to downsizing and thinning of the finger biometric information recognition module.

In addition, the present invention relates to an image forming apparatus capable of imaging a finger vein or a fingerprint even when a finger has contaminants (dust, sweat, residual cosmetics, etc.) It is possible to perform finger vein recognition or fingerprint recognition in the signal processing unit, and it is possible to facilitate the design of the finger biometric information recognition module in the electronic device.

Further, the present invention can obtain a high-resolution three-dimensional image with respect to an actual finger vein or a fingerprint. In addition, the feature points of the actual finger vein or fingerprint are extracted and used for registration and authentication of the user, thereby improving the security of the electronic device and realizing high resolution finger vein recognition or fingerprint recognition technology based on low-power ultrasonic waves.

Further, according to the present invention, an annihilation wave that disappears in the echo wave from the finger is transmitted to the transducer through the sound wave control member without energy loss, and the signal processing unit can stably detect the signal of the annihilation wave, A precise image can be obtained in the same ultrasonic source as the conventional one, the performance of the signal processing unit can be lowered, and the power consumption can be lowered.

1 is a cross-sectional view illustrating a state where a first node of a finger is used in an electronic device to which a finger biometric information recognition module according to an embodiment of the present invention is applied.
2 is a cross-sectional view illustrating a state in which a second node of a finger is used in an electronic device to which the finger biometric information recognition module according to an embodiment of the present invention is applied.
3 is a schematic cross-sectional view showing a transducer according to an embodiment of the present invention.
4 is a schematic sectional view showing a sound wave control member according to an embodiment of the present invention.
5 is a configuration diagram showing a signal processing unit according to an embodiment of the present invention.
6 is a configuration diagram showing an additional configuration of the signal processing unit according to an embodiment of the present invention.
7 is a perspective view illustrating a finger biometric information recognition module according to another embodiment of the present invention.
8 is an exploded view illustrating a finger biometric information recognition module according to another embodiment of the present invention.
9 and 10 are cross-sectional views illustrating a combined state of the finger biometric information recognition module according to another embodiment of the present invention.
11 is a view illustrating a method of manufacturing a finger biometric information recognition module according to another embodiment of the present invention.
12 is a flowchart showing a method for manufacturing a transducer according to the first embodiment of the present invention.
13 is a flowchart showing a detailed configuration of a thick film manufacturing step in the method of manufacturing a transducer according to the first embodiment of the present invention.
14 is a view showing a modification of the configuration of the drive slit and the filler in the method of manufacturing the transducer according to the first embodiment of the present invention.
15 is a flowchart showing a method of manufacturing a transducer according to a second embodiment of the present invention.
16 is a view showing a molding die and a unit piezoelectric cell in the material releasing step in the method of manufacturing a transducer according to the second embodiment of the present invention.

Hereinafter, an embodiment of a finger biometric information recognition module, an electronic device having the finger biometric information recognition module, a method of manufacturing a finger biometric information recognition module, and a method of manufacturing a transducer according to the present invention will be described with reference to the accompanying drawings. Here, the present invention is not limited or limited by the examples. Further, in describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

FIG. 1 is a cross-sectional view illustrating a state where a first node of a finger is used in an electronic device according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a state in which a second node of a finger is used in an electronic device according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a transducer according to one embodiment of the present invention, FIG. 4 is a schematic sectional view showing a sound wave control member according to an embodiment of the present invention, and FIG. 5 is a cross- FIG. 6 is a configuration diagram showing an additional configuration of a signal processing unit according to an embodiment of the present invention. FIG.

1 to 6, an electronic device according to an embodiment of the present invention includes at least one of a finger vein and a fingerprint from a finger F through a finger biometric information recognition module 100 according to an embodiment of the present invention. By recognizing one piece of biometric information, the security of the electronic device can be enhanced.

The electronic device according to an embodiment of the present invention includes a finger biometric information recognition module 100 and a main control unit 200. [

The finger biometric information recognition module 100 recognizes at least one of a finger vein and a fingerprint on a finger F that has been touched using ultrasonic waves. For example, as shown in FIG. 1, the finger biometric information recognition module 100 detects at least one of a finger vein and a fingerprint on a finger F that has been contacted by ultrasonic waves as it senses the first node of the finger F Can be recognized. As another example, the finger biometric information recognition module 100 can recognize the finger vein from the finger F that has been touched using ultrasonic waves as it senses the second segment of the finger F as shown in FIG.

The finger biometric information recognition module 100 will be described in detail in the finger biometric information recognition module 100 according to an embodiment of the present invention.

The main control unit 200 controls the electronic device according to a signal detected by the signal processing unit 20 included in the finger biometric information recognition module 100 described later.

Here, the main control unit 200 is not limited, and the electronic device can be controlled according to a signal detected by the signal processing unit 20 described later. The main control unit 200 may be connected to a signal processing unit 20, which will be described later, through electrodes formed on a flip-chip bonded or perforated via hole.

The electronic apparatus according to an embodiment of the present invention may further include a conversion control unit 300. [ The conversion control unit 300 converts the signal detected by the signal processing unit 20 and transmits the converted signal to the main control unit 200. The detailed configuration of the conversion control unit 300 will be described in detail in addition to the description of the finger biometric information recognition module 100 according to an embodiment of the present invention.

Hereinafter, a finger biometric information recognition module 100 according to an embodiment of the present invention will be described.

The finger biometric information recognition module 100 according to an embodiment of the present invention recognizes at least one of a finger vein and a fingerprint on a finger F that has been touched using ultrasonic waves and includes a transducer 10, (20), and may further include a sound wave control member (40). The finger biometric information recognition module 100 according to an embodiment of the present invention mainly describes recognition of a finger vein.

The transducer 10 outputs an ultrasonic wave toward the finger F and receives ultrasonic waves reflected from the finger F and returned. The transducer 10 may be stacked in the signal processing unit 20 or the conversion control unit 300 in an array.

Here, the transducer 10 may include a plurality of unit piezoelectric cells 13 arranged vertically and horizontally spaced from each other in a two-dimensional plane, and a filler 14 filled between adjacent unit piezoelectric cells 13 . The division slit 13a is formed between the unit piezoelectric cells 13 so that the division slit 13a is filled with the filling material 14.

The transducer 10 further includes a lower electrode 11 electrically connected to one side of the unit piezoelectric cell 13 and an upper electrode 15 electrically connected to the other side of the unit piezoelectric cell 13 can do. For example, the lower electrode 11 may be connected to all of the unit piezoelectric cells 13, and the upper electrode 15 may be connected to the individual unit piezoelectric cells 13 in a one-to-one correspondence. As another example, both the lower electrode 11 and the upper electrode 15 may be connected to the individual unit piezoelectric cells 13 in a one-to-one correspondence.

The unit piezoelectric cell 13 can facilitate image acquisition corresponding to the finger pattern or the fingerprint pattern according to the pitch between the unit piezoelectric cells 13 while improving the characteristics of the ultrasonic signal.

The unit piezoelectric cell 13 may be formed into a column shape by processing a base material by a dry etching technique or a micro molding technique. In particular, the unit piezoelectric cell 13 has a shape of a square column, a hexagonal column, or a cylinder, so that the energy of the ultrasonic wave or the energy of the ultrasonic wave can be maximized. The transducer 10 may be manufactured by a method of manufacturing a transducer to be described later.

In the finger biometric information recognition module 100 according to an embodiment of the present invention, the unit piezoelectric cell 13 may include at least one of an inorganic piezoelectric material and an organic piezoelectric material. In an embodiment of the present invention, the unit piezoelectric cell 13 is described as a mixture of an inorganic piezoelectric material and an organic piezoelectric material.

In order to improve both the ultrasonic wave emission characteristic and the ultrasonic reception characteristic of the unit piezoelectric cell 13, the inorganic piezoelectric material has excellent transmission characteristics of ultrasonic waves, and the organic piezoelectric material has excellent receiving characteristics of ultrasonic waves. And the organic piezoelectric material may be mixed at a predetermined weight ratio.

The inorganic piezoelectric material and the organic piezoelectric material may be mixed at a weight ratio of 1: 9 to 9: 1. As described above, by mixing the inorganic piezoelectric material and the organic piezoelectric material, at least the inorganic piezoelectric material is activated in response to the drive signal of the ultrasonic wave to make the ultrasonic wave transmission characteristic excellent, and at least the organic The piezoelectric material is activated, and the ultrasonic receiving characteristic is excellent.

The inorganic piezoelectric material may be made of aluminum nitride (AlN), zirconate titanate (PZT), barium titanate (BaTiO3) or the like and has a relatively excellent piezoelectric property but is not flexible and has a relatively low ultrasonic detection performance. The organic piezoelectric material may be made of polyvinylidene fluoride (PVDF), a soft material, or a piezoelectric material of a flexible material. The piezoelectric material may have a relatively poor piezoelectric property, but is excellent in flexibility and is excellent in impedance matching with the finger It is advantageous.

The transducer 10 manufactured by mixing the organic piezoelectric material and the inorganic piezoelectric material has a high piezoelectric performance index because it has excellent both the ultrasonic wave transmission characteristic and the ultrasonic wave reception characteristic and the impedance of the finger F The ultrasonic wave can be stably transmitted even if a separate matching member is omitted between the finger F and the transducer 10 due to the matching.

At this time, a plurality of pores (not shown) communicating with the inorganic piezoelectric material are formed in the unit piezoelectric cell 13, and the organic piezoelectric material surrounds the outer peripheral surface of the inorganic piezoelectric material, .

The filling material 14 reduces a horizontal component perpendicular to the traveling direction of the ultrasonic waves among the vibration components generated in the unit piezoelectric cells 13 and also prevents the vibration between adjacent unit piezoelectric cells 13 from being interfered it is possible to prevent coupling.

The signal processing unit 20 causes the transducer 10 to output an ultrasonic wave and is electrically connected to the transducer 10 to sense the finger vein of the finger F according to the ultrasonic wave received. The signal processing unit 20 may sense the finger vein of the finger F using the Doppler effect according to the received ultrasonic waves. The sensing of the finger vein of the finger F includes sensing at least one of the finger vein of the finger F and the fingerprint of the finger F. [

Since the transducer 10 has multiple operating frequencies having excellent piezoelectric characteristics, the signal processing unit 20 can image an arbitrary shape having an ultrafine line width, such as 50 micrometers, in three dimensions. In addition, since the transducer 10 can transmit and receive ultrasonic waves in parallel through the unit piezoelectric cell 13, the signal processing unit 20 can image any three-dimensional shape in depth.

For example, when the signal processing unit 20 controls the drive signal so that the frequency of the ultrasonic wave output from the transducer 10 indicates the first frequency, the first or second node of the finger F is detected The signal processing unit 20 can sense at least one of the fingerprint of the finger F and the finger vein. The driving signal generates an ultrasonic wave in a low frequency range to increase the penetration rate of the ultrasonic waves and smooth the finger vein detection of the finger F. [

As another example, when the signal processing unit 20 controls the drive signal so that the frequency of the ultrasonic wave output from the transducer 10 is greater than the first frequency, the first node of the finger F The signal processing unit 20 can sense the fingerprint of the finger F. [ The driving signal generates an ultrasonic wave in a high frequency region to relatively reduce the penetration rate of the ultrasonic waves and smoothly detect the fingerprint of the finger F. [ The ultrasonic wave in the low frequency region is relatively higher in energy of the ultrasonic wave than in the ultrasonic wave in the high frequency region.

When the ultrasonic wave is outputted from the transducer 10 by controlling the driving signal by the signal processing unit 20, the signal processing unit 20 receives reception information about the ultrasonic wave received from the trend ducer 10 So that a three-dimensional image of at least one of the fingerprint and the finger of the finger F can be realized.

The signal processing unit 20 includes an ultrasonic driving unit 21 connected to the unit piezoelectric cell 13 and applying a driving signal to the unit piezoelectric cell 13 so that ultrasonic waves are output from the unit piezoelectric cell 13, An ultrasonic wave processing unit 22 connected to the unit piezoelectric cell 13 for processing the ultrasonic waves received in the unit piezoelectric cell 13 and a multiplexing unit 22 for selecting and outputting a specific signal satisfying the condition among the signals of the ultrasonic wave processing unit 22, A logic unit 23 and a signal conversion unit 24 for converting a signal output from the multiplexing logic unit 23. [ The ultrasonic wave processing unit 22 may process the received ultrasonic wave including a function of restoring the received ultrasonic wave to its original state.

The ultrasound processing unit 22 may monitor the received ultrasound signal and extract a fingerprint or finger vein signal from the received ultrasound signal to correct the received ultrasound signal.

More specifically, the finger F is composed of the epidermis and the dermis, and in the case of the finger vein, it is located in the subcutaneous tissue. Here, the transducer 10 shows a state in which the unit piezoelectric cells 13 are arranged longitudinally and laterally in a two-dimensional plane.

The transducer 10 transmits an ultrasonic signal to the finger F and receives an ultrasonic signal reflected from the finger F. [ In the valley portion of the fingerprint, ultrasound signals reflected from the air layer, the epidermis, the dermis, and the femoral artery are sequentially received with a delay of a predetermined time, and the ridges of the dermis , Ultrasound signals reflected from the finger veins are sequentially received with a predetermined time delay. Then, image data can be formed using a delay and sum method of the received ultrasonic signals. At this time, the signal distortion due to the air layer occurs at the valleys of the fingerprint. Therefore, the ultrasound processing unit 22 separates and extracts the finger vein bone and finger information and the finger vein information from the received ultrasound signals, It is possible to correct the ultrasound signal and to easily form a three-dimensional image based on the extracted information.

The signal converting unit 24 may convert the two-dimensional analog signal output from the multiplexing logic unit 23 into a two-dimensional digital signal.

The signal processing unit 20 controls the driving signal applied by the ultrasonic driving unit 21 so that the frequency of the ultrasonic wave is adjusted and controls the ultrasonic wave processing unit 22 and the multiplexing / And a signal processing control unit (25) for controlling the operation of the signal conversion unit (24). For example, the signal processing control unit 25 may control an ASIC (Application Specific Integrated Circuit) semiconductor included in the signal processing unit 20. [

At this time, the signal processing control unit 25 forms a drive pattern of the unit piezoelectric cell 13 to output ultrasonic waves in response to the drive signal, (13). Here, the unit piezoelectric cell 13 corresponding to the drive pattern is not overlapped with the unit piezoelectric cell 13 corresponding to the reception pattern, thereby preventing signal superposition in the unit piezoelectric cell 13, So that it is possible to transmit and receive signals with high accuracy in the unit piezoelectric cell 13.

The signal processing unit 20 includes a Hilbert transform unit 31 that generates a transform signal by Hilbert transforming the signal transformed by the signal transform unit 24 and a transform unit 31 that transforms the transform signal generated through the Hilbert transform unit 31 An image substitution unit 33 for generating a substitution signal by replacing the stereoscopic signal generated through the stereotyping unit 32 with a three-dimensional image element, A logical combination unit 34 for generating a three-dimensional signal by synthesizing substitution signals generated through the image substitution unit 33, and a final three-dimensional image based on the three-dimensional signal generated through the logical combination unit 34 And an image acquiring unit 35 for acquiring an image.

The final three-dimensional image obtained through the image acquiring unit 35 can be displayed on the electronic device by authenticating the user by controlling the electronic device by the main control unit 200. [

In more detail, in one embodiment of the present invention, the signal processing unit 20 generates, based on the first frequency band or the second frequency band, two different frequencies A and B as shown in FIG. 6 And a high-resolution three-dimensional image can be realized.

If the signal processing controller 25 controls the driving signal so that the frequency of the ultrasonic wave output from the transducer indicates a primary frequency originating signal and a secondary frequency originating signal larger than the primary frequency originating signal, The signal processing unit 20 synthesizes the first reception information corresponding to the primary frequency originating signal and the second reception information corresponding to the secondary frequency originating signal to realize a three-dimensional image.

The Hilbert transform unit 31 includes a first Hilbert transform unit 31a for Hilbert transforming the first signal transformed by the signal transforming unit 24 to generate a first transformed signal corresponding to the first received information, And a second Hilbert transform unit 31b for Hilbert transforming the second signal transformed by the signal transforming unit 24 to generate a second transformed signal corresponding to the second received information.

The shaping unit 32 includes a first shaping unit 32a for shaping a first transform signal generated through the first Hilbert transform unit 31a to generate a first shaping signal, And a second shaping unit 32b for shaping the second converted signal generated through the second shaping unit 31b to generate a second shaping signal.

The image replacing unit 33 includes a first image replacing unit 33a for generating a first replacement signal by replacing the first formatting signal generated by the first formatting unit 32a with a three- And a second image replacing unit 33b for generating a second replacement signal by replacing the second shaping signal generated by the second shaping unit 32b with a three-dimensional image element.

The logical combination unit 34 combines the first replacement signal generated through the first image replacement unit 33a and the second replacement signal generated through the second image conversion unit 33b to generate a three-dimensional digital signal Respectively.

The signal processing unit 20 is a signal synthesis technique optimized for the unit piezoelectric cells 13 arranged two-dimensionally, thereby realizing a low-power, high-efficiency three-dimensional image algorithm. The signal processing unit 20 collects hybrid fine patterns having a line width of 50 microns or a line width of 100 microns in parallel to enable high-speed three-dimensional imaging, and the unit piezoelectric cells 13 The driving unit and the receiving unit can be integrally controlled.

As described above, in the finger biometric information recognition module 100 according to the embodiment of the present invention, the transducer 10 can implement a hybrid ultrasonic device array having multiple operating frequencies in addition to the signal processing unit 20. [ Then, an arbitrary shape having a fine line width of 50 micron class which is superior to the conventional one can be three-dimensionally imaged with a high-frequency ultrasonic device. In addition, imaging of arbitrary three-dimensional shapes having a depth through a low-frequency received in parallel can be activated to activate an imaging function using an ultrasonic wave, a three-dimensional finger vein imaging can be easily implemented, have.

The finger biometric information recognition module 100 according to an embodiment of the present invention may further include a sound wave control member 40.

The sound wave control member 40 is stacked on the transducer 10. The sound wave control member 40 allows ultrasonic energy transmitted and received by the transducer 10 to be transmitted without loss.

The sound wave control member 40 may exhibit a waveguide structure that transmits ultrasonic energy transmitted and received by the unit piezoelectric cell 13 without loss.

The sound wave control member 40 absorbs the near-field ultrasonic waves with respect to the generated ultrasonic waves in a specific frequency range, and resonates and transmits ultrasound energy using characteristics such as resonant tunneling.

Accordingly, the sound wave control member 40 can transmit ultrasound energy without loss, and can perform imaging with respect to an ultrasonic wave having a wavelength or less.

The sound wave control member 40 may be a Helmholtz resonator array structure, a surface resonant effect in doubly negative or single negative-mass metamaterials, a FabryPerot (FP) resonant, a near-zero mass, or a resonant tunneling method of an anisotropic meta material.

The sound wave control member 40 includes a first signal transmission groove 41 formed on one side of the transducer 10 facing the transducer 10 and a second signal transmission groove 41 formed on the other side of the sound wave control member 40, And a connection line 43 connecting the first signal transmission groove 41 and the second signal transmission groove 42. The first signal transmission groove 41 is formed on one side of the sound wave control member 40 and the second signal transmission groove 42 is formed on the other side of the sound wave control member 40 do.

At this time, the control member (45) is filled in the sound wave control member (40). In other words, the acoustic impedance between the transducer 10 and the finger F is matched to the first signal transmission groove 41, the second signal transmission groove 42 and the connection line 43 The control matching member 45 is filled.

The control mating member 45 may be used when the sound wave control member 40 operates in the liquid. In other words, the control mating member 45 is configured to substantially match the acoustic impedance of the finger F or the acoustic impedance of the blood or tissue in the finger to substantially prevent the energy loss of the ultrasonic waves transmitted and received by the transducer 10 So that they have the same acoustic impedance.

The control matching member 45 can increase the transmittance of ultrasonic waves in the sound wave control member 40.

The first signal transmission groove 41 and the second signal transmission groove 42 may have the same diameter and the first signal transmission groove 41 may be formed in the first signal transmission groove 41 and the second signal transmission groove 42, May be formed larger than the diameter.

The sound wave control member 40 may further include a buffer space 44 formed on the connection line 43 with a diameter different from that of the connection line 43. For example, the buffer space 44 may have a diameter greater than the diameter of the connection line 43. The control space 45 is filled in the buffer space 44.

The sound wave control member 40 may be manufactured by at least one selected from a MEMS process, a NEMS process, a 3D printing process, a nanoimprinting process, and an injection process.

The finger biometric information recognition module 100 according to an embodiment of the present invention may further include a contact member 50 stacked on the sound wave control member 40 so that the finger F is brought into contact.

The contact member (50) is in contact with the finger (F). The contact member 50 may be made of glass, aluminum, sapphire, plastic, or the like. The contact member 50 transmits the ultrasonic waves to the finger F and transmits the ultrasonic waves coming back from the finger F to the transducer 10 side.

The contact member 50 may be formed integrally with a touch screen device provided in an electronic device or a display device for outputting a screen. The contact member 50 may be used as a cover attached to a front surface of a touch screen device or a display device.

The finger biometric information recognition module 100 according to an embodiment of the present invention may further include a transmission matching member 60 laminated and supported between the sound wave control member 40 and the contact member 50. [ The contact member 50 and the transmission matching member 60 match the acoustic impedance between the transducer 10 and the finger F. [

For example, the transmission matching member 60 may facilitate the transmission of ultrasonic waves through the second signal transmission groove 42 between the sound wave control member 40 and the contact member 50. It is possible to prevent an air layer between the control member 45 and the contact member 50 from being formed in more detail and facilitate the transmission of ultrasonic waves.

As another example, the transmission matching member 60 may bond the sound wave control member 40 and the contact member 50 to each other.

The operation of the finger biometric information recognition module 100 according to an embodiment of the present invention will now be described.

The finger biometric information recognition module 100 according to an embodiment of the present invention may be configured such that the signal processing unit 20, the transducer 10, the sound wave control member 40 and the contact member 50 are sequentially stacked . At this time, the control member (45) is filled in the sound wave control member (40).

The size of the blood vessel is 200 to 1000 microns with respect to the finger vein pattern of the finger F and the interval between the valleys adjacent to the fingerprint pattern of the finger F is about 200 microns to 300 microns, Requires about 50 microns. Here, although the impedance of the inorganic piezoelectric material is about 30 Mrayl, the organic piezoelectric material has an impedance characteristic similar to that of the finger F (about 1.5 Mrayl), so that even if a separate matching member is omitted, Receiving characteristic of the ultrasonic wave can be maintained in the ultrasonic transducer 10.

 Then, the transducer 10 measures using the magnitude of the transmission wave determined by the impedance (the density of the object and the sound wave propagation velocity of the object) and the magnitude of the echo wave returning from the finger F.

The ultrasonic waves generated from the transducer 10 and the echo waves returning from the finger F are almost 100% (90% to 100% or 95% to 100%) by resonance while passing through the sound wave control member 40 And has a frequency to be transmitted.

In addition, a three-dimensional image can be implemented using the time delay value in the echo wave input to the transducer 10 or the conversion of the echo wave through the signal processing unit 20. In an embodiment of the present invention, the extinguishing wave passes through the sound wave control member 40 and is transmitted to the transducer 10 without loss of ultrasonic energy, thereby facilitating the implementation of a three-dimensional image.

Based on the above description, the conversion control unit 300 delivers the signal sensed by the signal processing unit 20 to the main control unit 200. [ The conversion control unit 300 may convert the signal converted by the signal conversion unit 24 into an output signal that can be output from the electronic device and transmit the converted signal to the main control unit 200.

The conversion control unit 300 may be connected to the signal processing unit 20 and the main control unit 200 through electrodes formed in the flip chip bonding or perforated via holes, respectively.

Although not shown, the conversion control unit 300 may implement a high-resolution three-dimensional image by compositing reception information for two different frequency regions A and B instead of the signal processing unit 20. Accordingly, the conversion control unit 300 may be configured so that the Hilbert transform unit 31, the shaping unit 32, the image substitution unit 33, and the logical sum unit 34, and an image acquisition unit 35. [

The final three-dimensional signal obtained through the image obtaining unit 35 may be displayed on the electronic device by authenticating the user by controlling the electronic device by the main control unit 200.

Accordingly, the conversion control unit 300 can also realize a low-power, high-efficiency three-dimensional image algorithm as a signal synthesis technique optimized for the unit piezoelectric cells 13 arranged two-dimensionally.

Hereinafter, the finger biometric information recognition module 100 according to another embodiment of the present invention will be described.

FIG. 7 is a perspective view illustrating a finger biometric information recognition module according to another embodiment of the present invention, FIG. 8 is an exploded view illustrating a finger biometric information recognition module according to another embodiment of the present invention, FIGS. 9 and 10 FIG. 5 is a cross-sectional view illustrating a combined state of the finger biometric information recognition module according to another embodiment of the present invention.

Referring to FIGS. 1 to 6 and 7 to 10, the finger biometric information recognition module 100 according to another embodiment of the present invention may be configured such that the finger biometric information recognition module 100 includes at least one of a finger vein and a fingerprint A finger biometric information recognition module for recognizing biometric information, comprising: a transducer (10) for outputting an ultrasonic wave toward the finger (F) and receiving an ultrasonic wave reflected from the finger (F) And a signal processing unit (20) for outputting an ultrasonic wave and electrically connected to the transducer (10) and sensing the biometric information of the finger (F) according to the received ultrasonic waves. And a sound wave control member (40) stacked on the transducer (10) so as to be transmitted.

The signal processing unit 20 and the sound wave control member 40 according to another embodiment of the present invention may have the same configuration as that of the signal processing unit 20 and the sound wave control member 40 according to the embodiment of the present invention And a description thereof will be omitted.

At this time, the transducer 10 may include a plate-shaped piezoelectric plate 16 for outputting ultrasonic waves toward the finger F. The piezoelectric plate 16 may include aluminum nitride (AlN) or lead titanate zirconate (PZT, PbZrTiO3).

The transducer 10 further includes a lower electrode 11 electrically connected to one side of the piezoelectric plate 16 and an upper electrode 15 electrically connected to the other side of the piezoelectric plate 16 can do. In another embodiment of the present invention, the lower electrodes 11 are connected to the piezoelectric plate 16 in a state where the lower electrodes 11 are arranged vertically and horizontally in a two-dimensional plane corresponding to the unit cells, And is connected to the piezoelectric plate.

The finger biometric information recognition module 100 according to another embodiment of the present invention includes the transducer 10 and the sound wave control member 40 so that ultrasonic waves are transmitted between the transducer 10 and the sound wave control member 40 The ultrasonic transducer 70 may further include an ultrasonic transducer 70 which is interposed between the ultrasonic transducer 70 and the ultrasonic transducer 70. Here, the supporter 71 may be stacked and supported on the ultrasonic wave transmitting member 70. The support portion 71 improves the coupling force between the transducer 10 and the ultrasonic wave transmitting member 70 and can stably support the transducer 10 from the ultrasonic wave transmitting member 70.

The ultrasonic wave transmission member 70 may be formed with a transmission hole through which ultrasonic waves are transmitted corresponding to the unit cell or the piezoelectric plate 16. The ultrasonic wave transmitting member 70 may exhibit a waveguide structure that transmits the ultrasonic energy transmitted and received by the piezoelectric plate 16 without loss. The ultrasonic wave transmitting member 70 may absorb near-field ultrasonic waves with respect to the generated ultrasonic waves in a specific frequency range, resonate with ultrasonic waves using characteristics such as resonance tunneling, and transmit the ultrasonic waves.

At this time, the hole formed in the ultrasonic wave transmission member 70 is filled with the impedance layer 72 to reduce the difference in acoustic impedance between the finger F and the transducer 10, The acoustic impedance between the transducers 10 can be matched.

The finger biometric information recognition module 100 according to another embodiment of the present invention may include a vacuum state between the transducer 10 and the signal processing unit 40 to prevent ultrasonic waves from being transmitted to the signal processing unit 20 And a post member 80 for forming a space of the base member 80. The post member 80 can be stacked and fixed to the signal processing unit 20 via the bonding portion 81. [ The bonding portion 81 may exhibit conductivity for electric conduction, but may not be conductive.

Here, the post member 80 is formed with a space portion 82 corresponding to the unit cell or the piezoelectric plate 16. When the transducer 10, the post member 80 and the signal processing unit 20 are laminated together, the space portion 82 forms a vacuum state so that ultrasonic waves generated in the transducer 10 Or the ultrasonic wave received by the transducer 10 is prevented from being transmitted to the signal processing unit 20, and the signal processing unit 20 can be protected from the ultrasonic signal. In addition, the post member 80 and the adhesive portion 81 may have a buffer function to prevent ultrasonic waves from being transmitted to the signal processing unit 20.

The space portion 82 may be formed in the bonding portion 81 corresponding to the shape of the post member 80.

Reference numeral 73 denotes a protective layer 73 for protecting the ultrasonic wave transmission member 70 when the finger biometric information recognition module 100 according to another embodiment of the present invention is manufactured. The protective layer 73 may be removed from the ultrasonic wave transmission member 70 in the course of manufacturing the finger biometric information recognition module 100.

Hereinafter, a method of manufacturing the finger biometric information recognition module 100 according to another embodiment of the present invention will be described.

11 is a view illustrating a method of manufacturing a finger biometric information recognition module according to another embodiment of the present invention.

Referring to FIG. 11, a method for manufacturing a finger biometric information recognition module according to another embodiment of the present invention is a method for manufacturing a finger biometric information recognition module according to another embodiment of the present invention.

For example, in the method of manufacturing a finger biometric information recognition module according to another embodiment of the present invention, the transducer 10 and the ultrasonic wave transmission member 70 may be laminated to the signal processing unit 20.

First, a transfer base material 70a for forming the ultrasonic wave transmission member 70 is prepared. At this time, the support part 71 and the protective layer 73 may be formed on the upper and lower surfaces of the transfer base material 70a. The supporting portion 71 may be formed on the upper surface of the transfer base material 70a.

The upper electrode 15, the piezoelectric plate 16, and the lower electrode 11 are laminated in a plate form on the transfer base material 70a. The upper electrode 15, the piezoelectric plate 16, and the lower electrode 11 are sequentially stacked and fixed on the transfer base material 70a.

Next, the lower electrode 11 is etched so that the plate-shaped lower electrode 11 is separated from the unit cell. Etching of the lower electrode 11 may be performed by various types of wet etching or dry etching.

Next, a via hole is formed in the piezoelectric plate 16 for electrical connection with the upper electrode 15, and a connection for applying power to the upper electrode 15 and the separated lower electrode 11, respectively, The line 111 is patterned to form the transducer 10.

Next, the transducer 10 integrally formed on the transfer base material 70a is laminated on the signal processing unit 20 so that the signal processing unit 20 and the connection line 111 are electrically connected.

Here, the signal processing unit 20 is laminated with a post member 80 which prevents ultrasonic waves from being transmitted to the signal processing unit 20. The transducer 10 integrally formed with the transfer base material 70a in a vacuum atmosphere to form the vacuum part of the space part 82 is inserted into the post member 80 stacked on the signal processing unit 20, .

Finally, the ultrasound transmitting member 70 is formed by processing the transfer base material 70a. The ultrasonic wave transmitting member 70 can be formed through the transfer base material 70a by removing the protective layer 73 as well as puncturing the transfer hole into the transfer base material 70a.

In addition, the sound wave control member 40 may be laminated on the ultrasonic wave transmission member 70.

The finger biometric information recognition module according to another embodiment of the present invention can be manufactured through the above-described series of processes.

As another example, in the method of manufacturing the finger biometric information recognition module according to another embodiment of the present invention, the transducer 10 and the sound wave control member 40 may be laminated to the signal processing unit 20.

First, a base for stacking the upper electrode 15 is prepared.

The upper electrode 15, the piezoelectric plate 16, and the lower electrode 11 are laminated in a plate form on the base. The upper electrode 15, the piezoelectric plate 16, and the lower electrode 11 are sequentially laminated and fixed to the sound wave control member 40.

Next, the lower electrode 11 is etched so that the plate-shaped lower electrode 11 is separated from the unit cell. Etching of the lower electrode 11 may be performed by various types of wet etching or dry etching.

Next, a via hole is formed in the piezoelectric plate 16 for electrical connection with the upper electrode 15, and a connection for applying power to the upper electrode 15 and the separated lower electrode 11, respectively, The line 111 is patterned to form the transducer 10.

Next, the transducer 10 is laminated to the signal processing unit 20 so that the signal processing unit 20 and the connection line 111 are electrically connected.

Here, the signal processing unit 20 is laminated with a post member 80 which prevents ultrasonic waves from being transmitted to the signal processing unit 20. The space portion 82 is formed by laminating the transducer 10 on the post member 80 stacked on the signal processing unit 20 in a vacuum atmosphere so as to form a vacuum state, Thereby forming a vacuum state.

Finally, the sound wave control member 40 is laminated on the transducer 10.

The finger biometric information recognition module according to another embodiment of the present invention can be manufactured through the above-described series of processes.

Here, the base may be separately prepared and separated from the transducer 10 before the sound wave control member 40 is laminated to the transducer 10.

Further, the base may be provided with the sound wave control member 40. At this time, the support portion 71 and the protection layer 73 may be formed on the upper and lower surfaces of the sound wave control member 40. The support portion 71 may be formed on the upper surface of the sound wave control member 40. Then, the step of laminating the sound wave control member 40 on the transducer 10, which is the last step, is omitted.

Hereinafter, a method of manufacturing a transducer according to a first embodiment of the present invention will be described.

FIG. 12 is a flowchart illustrating a method of manufacturing a transducer according to a first embodiment of the present invention, and FIG. 13 is a detailed view of a step of manufacturing a thick film in the method of manufacturing a transducer according to the first embodiment of the present invention 14 is a view showing a modification of the configuration of the drive slit and the filler in the method of manufacturing the transducer according to the first embodiment of the present invention.

Referring to FIGS. 1 to 6 and 12 to 14, a method of manufacturing a transducer according to the first embodiment of the present invention includes forming the unit piezoelectric cell 13 using a dry etching technique, (10).

The manufacturing method of the transducer according to the first embodiment of the present invention includes a thick film manufacturing step S11 for manufacturing the composite piezoelectric thick film 10a by mixing the inorganic piezoelectric material and the organic piezoelectric material, A thick film cutting step S12 for cutting the composite piezoelectric thick film 10a manufactured through the thick film manufacturing step S11 such that the partition slit 13a is formed in the partition slit 13a by etching; And a slit filling step (S13) of filling the filler (14). In the slit filling step S13, the filling material 14 may be sintered.

Here, the thick film manufacturing step S11 may form the composite piezoelectric thick film 10a by forming pores in the inorganic piezoelectric material, and then mixing the inorganic piezoelectric material with pores and the organic piezoelectric material.

The thick film manufacturing step S11 includes a step of laminating a template for forming pores (not shown) on a base, a step of laminating the template with the precursor solution of the inorganic piezoelectric material after the step of laminating the template (S11a) A drying step S11c of drying the precursor solution of the inorganic piezoelectric material after the step of impregnating the precursor solution S11b, the step of drying the precursor solution of the inorganic piezoelectric material S11c, the step of drying the inorganic piezoelectric material S11c, (S11d) for removing the template from the precursor solution of the inorganic piezoelectric material; a crystallization step (S11e) for crystallizing the precursor solution of the inorganic piezoelectric material that has been dried after the step of removing the template (S11d) (S11f) of injecting the organic piezoelectric material into the precursor solution of the inorganic piezoelectric material which has been crystallized after the crystallization step (S11e), and a step (S11d) of mixing the crystallized precursor solution of the inorganic piezoelectric material and the organic piezoelectric material castle And it may comprise a thickening step (S11g) for producing the composite piezoelectric thick film (10a).

The precursor solution of the inorganic piezoelectric material dried by the step of removing the template (S11d) forms pores (not shown) like the final inorganic piezoelectric material to form a porous body.

In addition, in the step of applying the organic material (S11f), the organic piezoelectric material is injected into the precursor solution of the inorganic piezoelectric material dried according to a predetermined mixing ratio of the inorganic piezoelectric material and the organic piezoelectric material. In addition, the organic piezoelectric material may be formed by surrounding the outer circumferential surface of the dried precursor solution of the inorganic piezoelectric material or by forming it in the pores (not shown) by passing through the organic material applying step S11f and the thickening step S11g .

In the method of manufacturing a transducer according to the first embodiment of the present invention, as the thick film cutting step S12 is performed, the composite piezoelectric thick film 10a has a plurality of unit piezoelectric cells 13 spaced apart from each other in a base layer And the divisional slit 13a is formed between the adjacent unit piezoelectric cells 13. In this case, After the slit filling step S13, the transducer 10 can be completed by removing the base layer.

In the first embodiment of the present invention, the unit piezoelectric cell 13 has a smaller diameter toward the free end from the base layer, thereby increasing the number of the unit piezoelectric cells 13 per unit area and improving the resolution of the ultrasonic waves have.

In the first embodiment of the present invention, a high-resolution ultrasonic transducer 10 can be realized with a resolution of 500 dpi or higher.

In the modification of the first embodiment of the present invention, the thick film cutting step S12 and the slit filling step S13 are repeatedly performed twice or more while repeating the thick film cutting step S12, 13 can be prevented from falling off.

The manufacturing method of the transducer according to the modified example of the first embodiment of the present invention comprises the thick film manufacturing step S11 and the step of forming the composite piezoelectric thick film 10a by the etching technique corresponding to the unit piezoelectric cell 13 A first filling step (S13a) of filling the filling material (14) with the dividing slit (13a) formed by the first cutting step (S12a), and a second filling step A second cutting step (S12b) of cutting the composite piezoelectric thick film (10a) by an etching technique in a second order corresponding to the first cutting step (13), and a second cutting step (S12b) And a second filling step (S13b) of filling the piezoelectric vibrating piece (14), and further, a third cutting step (3b) of cutting the composite piezoelectric thick film (10a) by an etching technique in a third order corresponding to the unit piezoelectric cell (12) filling the filler (14) with the dividing slit (13a) formed by the third cutting step (S12c) A (S13c) may further include.

Here, the manufacturing method of the transducer according to the modified example of the first embodiment of the present invention is characterized in that after the second filling step (S13b) or the third filling step (S13c), the base layer is removed and the transducer 10) can be finally completed.

The method of manufacturing a transducer according to the first embodiment of the present invention may further include an electrode forming step (S3).

The electrode forming step S3 forms the lower electrode 11 and the upper electrode 15 on both sides of the composite piezoelectric thick film 10a in order to apply power to the transducer 10.

The electrode forming step S3 includes a lower electrode forming step S31 of forming the lower electrode 11 on one side of the composite piezoelectric thick film 10a and a lower electrode forming step S31 of forming a lower electrode 11 on the other side of the composite piezoelectric thick film 10a. And an upper electrode forming step (S32) for forming the electrode (15).

For example, the lower electrode forming step S31 and the upper electrode forming step S32 may be performed after the slit filling step S13, respectively.

As another example, the lower electrode forming step S31 and the upper electrode forming step S32 may be performed after the thick film forming step S11, respectively.

As another example, any one of the lower electrode forming step (S31) and the upper electrode forming step (S32) is performed after the thick film forming step (S11), and the lower electrode forming step (S31) And the other of the forming step S32 may be performed after the slit filling step S13.

The transducer 10 manufactured according to the first embodiment of the present invention can be connected to the signal processing unit 20 or the conversion control unit 300 in a completed state.

The transducer 10 manufactured in accordance with the first embodiment of the present invention can be manufactured by connecting the composite piezoelectric thick film 10a to the signal processing unit 20 or the conversion control unit 300, The cutting step S12 and the slit filling step S13 may be performed.

Hereinafter, a method of manufacturing a transducer according to a second embodiment of the present invention will be described.

FIG. 15 is a flowchart showing a manufacturing method of a transducer according to a second embodiment of the present invention, and FIG. 16 is a flowchart illustrating a method of manufacturing a transducer according to a second embodiment of the present invention, Fig.

Referring to FIGS. 1 to 6 and FIGS. 15 and 16, a method of manufacturing a transducer according to a second embodiment of the present invention includes forming the unit piezoelectric cell 13 using a micro molding technique, (10).

A method of manufacturing a transducer according to a second embodiment of the present invention includes a material preparing step S21, a forming mold preparing step S22, a green array manufacturing step S25, a sintering array manufacturing step S26, An array forming step S27, and an array filling step S28, and may further include a base layer removing step S29 and an electrode forming step S3.

The material preparation step (S21) prepares a mixed material obtained by mixing the inorganic piezoelectric material or the organic piezoelectric material or the inorganic piezoelectric material and the organic piezoelectric material. The inorganic piezoelectric material or the organic piezoelectric material or the mixed material may exhibit a liquid or paste state. Here, the inorganic piezoelectric material may form pores (not shown) through the steps from the lamination step S11a to the crystallization step S11e during the thick film preparation step S11 described above.

In the forming mold preparation step S22, a molding mold 400 having cell grooves 411 corresponding to the unit piezoelectric cells 13 is prepared. The forming mold 400 includes a first mold 410 in which the cell groove 411 corresponding to the unit piezoelectric cell 13 is recessed and a second mold 410 in which the organic piezoelectric material or the inorganic piezoelectric material or the mixed material is injected And a second mold 420 through which a hole 421 is formed. The first mold 410 and the second mold 420 are stacked and supported, and the second mold 420 is movable up and down relative to the first mold 410. A base groove 412 may be formed in at least one of the first mold 410 and the second mold 420 to form a base layer 12 in which the unit piezoelectric cells 13 are arranged. have.

The forming mold preparing step S22 includes a master preparing step S23 of preparing a master mold of a hard material corresponding to a state in which the unit piezoelectric cells 13 are arranged apart from one another in the base layer 12, And a soft manufacturing step (S24) of making a soft mold of a soft material or a soft material using the master mold. Here, the soft mold may have the same shape as the first mold 410 in which the cell grooves 411 corresponding to the unit piezoelectric cells 13 of the forming mold 400 are recessed.

The master mold is made of a rigid material such as silicon, so that a protrusion shape corresponding to the unit piezoelectric cell 13 can be easily manufactured. The soft mold is made of a soft material such as silicone oil (PDMS, polydimethylsiloxane) or a flexible material, The cell groove 411 can be stably manufactured corresponding to the shape of the protrusion formed on the master mold.

The green array manufacturing step S25 may be performed by injecting the organic piezoelectric material or the inorganic piezoelectric material or the mixed material into the molding die 400 to form a green array in which the unit piezoelectric cell 13 is formed in the base layer 12 10b. The green array manufacturing step S25 may include forming the organic piezoelectric material or the inorganic piezoelectric material or the mixed material in the injection hole 421 while the first mold 410 and the second mold 420 are bonded together, The green array 10b can be manufactured by injecting the injected material into the cell grooves 411 and the base grooves 412. [

The sintered array manufacturing step (S26) sinters the green array (10b) to produce a sintered array. The sintered array manufacturing step S26 may sinter the green array 10b using various sintering techniques.

The array shaping step S27 separates the green array 10b or the sintered array from the shaping mold 400.

The array filling step (S27) fills the filler (14) between the unit piezoelectric cells (13) adjacent to each other in the sintered array. The filler 14 is sintered to be integrated with the unit piezoelectric cell 13.

The base layer removal step S29 removes the base layer from the sintered array in which the filler material 14 is filled so that the unit piezoelectric cell 13 and the filler material 14 are left in the sintered array.

The electrode forming step S3 includes forming the lower electrode 11 and the upper electrode 15 on both sides of the sintered array from which the base layer 12 is removed to apply power to the transducer 10, do.

The electrode forming step S3 includes a lower electrode forming step S31 for forming the lower electrode 11 on one side of the sintered array from which the base layer 12 is removed, And an upper electrode forming step (S32) for forming the upper electrode (15) on the other side of the sintered array.

For example, the lower electrode forming step S31 and the upper electrode forming step S32 may be performed after the base layer removing step S29, respectively.

As another example, the lower electrode forming step S31 and the upper electrode forming step S32 may be performed after the array filling step S27, respectively.

As another example, any one of the lower electrode forming step (S31) and the upper electrode forming step (S32) is performed after the array filling step (S27), and the lower electrode forming step (S31) The other of the forming step S32 may be performed after the base layer removing step S29.

A method of manufacturing a transducer according to a second embodiment of the present invention includes fabricating the sintered array in which the unit cell 12 is formed with the scarf unit piezoelectric cells 13 and filling the sintered array with the filler material 14, The transducer 10 can be manufactured. The transducer 10 manufactured according to the second embodiment of the present invention can be connected to the signal processing unit 20 or the conversion control unit 300 in a completed state.

In the second embodiment of the present invention, the cell groove 411 formed in the molding die 400 has a smaller diameter as it goes inward from the inlet, so that the diameter of the unit piezoelectric cell 13 decreases from the base layer toward the free end . Thus, the number of the unit piezoelectric cells 13 per unit area can be increased and the resolution of the ultrasonic waves can be improved.

In the second embodiment of the present invention, the resolution of the ultrasonic wave can be 500 dpi or more to realize the high-resolution ultrasonic transducer 10.

According to the finger biometric information recognition module, the electronic device to which the finger biometric information recognition module is applied, the manufacturing method of the finger biometric information recognition module, and the manufacturing method of the transducer, the characteristics of the transducer 10 are changed, It is possible to enhance the recognition rate of the ultrasonic waves and improve the precision of the fingerprint recognition of the finger F when recognizing the biometric information such as finger vein or fingerprint of the finger F. [

In addition, the acoustic impedance between the transducer 10 and the finger F can be stably matched through the characteristic change of the transducer 10, and a separate matching member can be omitted.

In addition, it is possible to reduce a horizontal component perpendicular to the traveling direction of ultrasonic waves among the vibration components generated in the unit piezoelectric cells 13, and to prevent vibration coupling between adjacent unit piezoelectric cells 13 It is possible to individually drive and individually receive the unit piezoelectric cell 13, and it is possible to simultaneously improve the ultrasonic wave transmitting characteristic and the ultrasonic receiving characteristic in the unit piezoelectric cell 13.

In addition, by separating the driving signal of the ultrasonic wave from the receiving signal of the ultrasonic wave in the unit piezoelectric cell 13, the ultrasonic wave transmitting characteristic and the ultrasonic receiving characteristic of the unit piezoelectric cell 13 can be improved at the same time.

In addition, it is possible to simplify the manufacturing of the transducer 10 by simplifying the coupling between the inorganic piezoelectric material and the organic piezoelectric material in the unit piezoelectric cell 13, and further, the power of the ultrasonic wave in the unit piezoelectric cell 13 It is possible to prevent the energy loss of the ultrasonic wave and improve the skin penetration rate of the ultrasonic wave.

In addition, since both the ultrasonic wave transmitted through the transducer 10 and the ultrasonic wave control member 40 and the received ultrasonic wave are transmitted without energy loss, the transmission and reception sensitivity of the ultrasonic wave is improved, and the transmittance of the ultrasonic wave, The acoustic impedance between the transducer 10 and the finger F can be stably matched and a separate matching member can be omitted.

In addition, an annihilation wave having a small wavelength and amplitude can be stably received by the transducer 10 through the sound wave control member 40, and can be stably transmitted to the signal processing unit 20.

In addition, the ultrasonic waves input from the sound wave control member 40 are guided stably in the traveling direction, the resonance of the ultrasonic waves is induced in the sound wave control member 40, and the inputted ultrasonic waves are all transmitted without energy loss, The transmission of ultrasonic waves between the member 50 and the signal processing unit 20 can be stabilized.

The control matching member 45 is filled in a portion formed through the sound wave control member 40 to prevent attenuation of the ultrasonic wave, stabilize the transmission of the ultrasonic waves, and stably match the acoustic impedance with the finger .

In addition, by adjusting the frequency of the ultrasonic wave, the finger vein recognition and the fingerprint recognition can be used in combination, and the flow of the finger vein, fingerprint, etc. of the finger F can be precisely captured, ) Can implement a three-dimensional image of a finger vein or fingerprint.

In addition, it is possible to improve the security of the fingerprint or finger vein in the electronic device and to protect the personal information embedded in the electronic device.

Further, micrometric fine processing for controlling the sound in the ultrasonic wave region is implemented, the manufacture of the sound wave control member 40 is facilitated, the strength of the structure of the sound wave control member 40 is improved , The holding force or the supporting force of the structure can be increased.

It is also possible to simplify the centering between the first signal transmission groove 41 formed in the sound wave control member 40, the second signal transmission groove 42 and the connection line 43, It is possible to prevent the sound wave control member 40 from being defective.

In addition, the height of the sound wave control member 40 can be reduced, contributing to miniaturization and thinning of the finger biometric information recognition module 100.

It is also possible to image a finger vein or a fingerprint even if the finger F has contaminants (dust, sweat, residual cosmetics, etc.), and the material of the contact member 50 It is possible to recognize finger veins or fingerprints in the signal processing unit 20 irrespective of whether the fingerprint recognition unit 100 is made of aluminum, sapphire, plastic, or the like.

In addition, a high-resolution three-dimensional image can be acquired with respect to an actual finger vein or a fingerprint. In addition, the feature points of the actual finger vein or fingerprint are extracted and used for registration and authentication of the user, thereby improving the security of the electronic device and realizing high resolution finger vein recognition or fingerprint recognition technology based on low-power ultrasonic waves.

In the signal processing unit 20, an annihilation wave that disappears in the echo wave in the finger F is transmitted to the transducer 10 without energy loss through the sound wave control member 40, Signal can be stably sensed to improve the resolution of an image. In the same ultrasound source as the conventional one, it is possible to obtain a more precise image than in the past, to lower the performance of the signal processing unit 20, have.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Modify or modify the Software.

F: finger 100: finger biometric information recognition module 200: main control unit
300: conversion control unit 10: transducer 10a: composite piezoelectric thick film
10b: green array. 11: lower electrode 111: connection line
12: base layer 13: unit piezoelectric cell 14:
15: upper electrode 16: piezoelectric plate 20: signal processing unit
21: ultrasonic driving unit 22: ultrasonic processing unit 23: multiplexing logic unit
24: signal conversion unit 25: signal processing control unit 31: Hilbert transform unit
32: shaping unit 33: image replacing unit 34:
35: image acquisition unit 40: sound wave control member 41: first signal transmission unit
42: second signal transfer unit 43: connection line 44: buffer space
45: control registration member 50: contact member 60: transmission matching member
70: Ultrasonic wave transmission member 70a: Transmission base material 71: Support
72: Impedance layer 80: Post 81: Adhesive part
82: Space part 400: Molding mold 410: First mold
411: cell groove 412: base groove 420: second mold
421: Inlet hole S11: Thick film manufacturing step S11a: Template stacking step
S11b: impregnating the precursor solution S11c: drying step S11d: removing the template
S11e: crystallization step S11f: organic material applying step S11g: thickening step
S12: Thick film cutting step S12a: First cutting step S12b: Second cutting step
S12c: Third cutting step S13: Slit filling step S13a: First filling step
S13b: second filling step S13c: third filling step S21: material preparing step
S22: Molding mold preparing step S23: Master preparing step S24: Soft manufacturing step
S25: green array manufacturing step S26: sintering array manufacturing step
S27: array demolding step S28: array filling step
S29: base layer removing step S3: electrode forming step
S31: Lower electrode forming step S32: Upper electrode forming step

Claims (16)

A finger biometric information recognition module for recognizing biometric information including at least one of a finger vein and a fingerprint from a finger to be contacted,
A transducer outputting an ultrasonic wave toward the finger and receiving ultrasonic waves reflected from the finger and returning;
A sound wave control member laminated on the transducer so that ultrasonic waves transmitted and received are transmitted without loss; And
And a signal processing unit for causing the transducer to output ultrasonic waves and sensing biometric information of the finger in accordance with the ultrasonic wave received in electrical connection with the transducer,
The transducer includes:
A plurality of unit piezoelectric cells arranged longitudinally and laterally in a two-dimensional plane; And
And a filling material filled between the unit piezoelectric cells adjacent to each other,
Wherein the unit piezoelectric cell includes at least one of an inorganic piezoelectric material and an organic piezoelectric material. The method according to claim 1,
Wherein the unit piezoelectric cell comprises:
Wherein the base material is processed by a dry etching technique or a micro molding technique to exhibit columnar shapes. The method according to claim 1,
A plurality of pores communicating with each other are formed in the inorganic piezoelectric material,
Wherein the organic piezoelectric material surrounds an outer circumferential surface of the inorganic piezoelectric material or is formed in the pore. A finger biometric information recognition module for recognizing biometric information including at least one of a finger vein and a fingerprint from a finger to be contacted,
A transducer outputting an ultrasonic wave toward the finger and receiving ultrasonic waves reflected from the finger and returning;
A sound wave control member laminated on the transducer so that ultrasonic waves transmitted and received are transmitted without loss; And
And a signal processing unit for causing the transducer to output ultrasonic waves and sensing biometric information of the finger in accordance with the ultrasonic wave received in electrical connection with the transducer,
The transducer includes:
And a plate-shaped piezoelectric plate for outputting ultrasonic waves toward the finger. 5. The method of claim 4,
Further comprising an ultrasonic transmission member interposed between the transducer and the sound wave control member so that ultrasonic waves are transmitted between the transducer and the sound wave control member. 6. The method according to any one of claims 1 to 5,
Further comprising: a post member for forming a vacuum space between the transducer and the signal processing unit to prevent ultrasonic waves from being transmitted to the signal processing unit. 6. The method according to any one of claims 1 to 5,
The signal processing unit includes:
An ultrasonic driver connected to the transducer for applying a driving signal to the transducer so that ultrasonic waves are output from the transducer;
An ultrasonic processing unit connected to the transducer for processing ultrasound waves received from the transducer;
A multiplexing logic unit for selecting and outputting a specific signal matching the condition among the signals of the ultrasonic processing unit;
A signal conversion unit for converting a signal output from the multiplexing logic unit; And
And a signal processing control unit for controlling the driving signal applied by the ultrasonic driving unit so that the frequency of the ultrasonic wave is adjusted and controlling the operation of the ultrasonic wave processing unit, the multiplexing logic unit, and the signal converting unit in response to the controlled driving signal And the fingerprint information of the finger. 8. The method of claim 7,
In the ultrasonic wave processing unit,
Further comprising monitoring the received ultrasonic signal to extract a fingerprint or a finger vein signal from the received ultrasonic signal and correcting the received ultrasonic signal. 8. The method of claim 7,
When the signal processing control unit controls the driving signal so that the frequency of the ultrasonic wave output from the transducer indicates the first frequency, the signal processing unit detects the fingerprint and finger vein of the finger,
Characterized in that the signal processing unit controls the fingerprint of the finger when the signal processing control unit controls the drive signal so that the frequency of the ultrasonic wave output from the transducer indicates a second frequency greater than the first frequency Finger biometric information recognition module. 8. The method of claim 7,
The signal processing unit includes:
A Hilbert transform unit for Hilbert transforming the signal transformed by the signal transforming unit to generate a transformed signal;
A shaping unit for shaping the converted signal generated through the Hilbert transform unit to generate a shaping signal;
An image substitution unit for generating a substitution signal by replacing the stereoscopic signal generated through the stereoscopic unit with a three-dimensional image element;
An OR combining unit for generating a three-dimensional signal by synthesizing the replacement signals generated through the plurality of image substitution units; And
And an image acquisition unit for acquiring a final three-dimensional image based on the three-dimensional signal generated through the logic synthesis unit. A finger biometric information recognition module according to any one of claims 1 to 5; And
And a main control unit for controlling the electronic device based on a signal output from the signal processing unit. A method for manufacturing the transducer according to claim 1,
A thick film manufacturing step of manufacturing a composite piezoelectric thick film using at least one of the inorganic piezoelectric material and the organic piezoelectric material;
A thick film cutting step of cutting the composite piezoelectric thick film produced through the thick film manufacturing step so that the slit is formed in the composite piezoelectric thick film; And
And a slit filling step of filling the filler into the compartment slit. 13. The method of claim 12,
In the thick film manufacturing step,
A step of laminating a template for forming pores in the base;
A precursor impregnation step of impregnating the template with the precursor solution of the inorganic piezoelectric material after the step of laminating the template;
A drying step of drying the precursor solution of the inorganic piezoelectric material after the step of impregnating the precursor solution;
A step of removing the template from the precursor solution of the inorganic piezoelectric material after the drying step;
A crystallization step of crystallizing the precursor solution of the dried inorganic piezoelectric material after the step of removing the template;
An organic material applying step of applying the organic piezoelectric material to the precursor solution of the inorganic piezoelectric material after the crystallization step; And
And a thickening step of preparing the composite piezoelectric thick film by mixing and molding the crystallized precursor solution of the inorganic piezoelectric material and the organic piezoelectric material. A method for manufacturing the transducer according to claim 1,
Preparing a mixed material obtained by mixing the inorganic piezoelectric material or the organic piezoelectric material or the inorganic piezoelectric material and the organic piezoelectric material;
Preparing a forming mold having a cell groove corresponding to the unit piezoelectric cell;
Implanting the organic piezoelectric material or the inorganic piezoelectric material or the mixed material into the molding die to manufacture a green array in which the unit piezoelectric cells are formed in a base layer;
Sintering the green array to produce a sintered array;
Separating the green array or the sintered array from the molding mold; And
And filling the filler between the adjacent unit piezoelectric cells in the sintered array. 15. The method of claim 14,
Removing the base layer from the sintered array in which the filling material is filled so that only the unit piezoelectric cell and the filling material are left in the sintered array; And
And forming an electrode at both ends of the unit piezoelectric cell. ≪ RTI ID = 0.0 > 11. < / RTI > A method for manufacturing the finger biometric information recognition module according to claim 4,
Preparing a base for stacking the upper electrode;
Stacking the upper electrode, the piezoelectric plate, and the lower electrode in order on the base;
Etching the lower electrode so that the plate-shaped lower electrode corresponds to the unit cell;
Forming a via hole in the piezoelectric plate, patterning a connection line for applying power to the upper electrode and the separated lower electrode to form the transducer; And
And stacking the transducer and the base on the signal processing unit so that the signal processing unit and the connection line are electrically connected to each other.

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