KR20180057825A - Optical signal mesurement modure and optical signal detecting device comprising the same - Google Patents

Abstract

An optical signal measuring module in accordance with an embodiment of the present invention, comprises: a cover substrate including one surface and the other surface; a light emitting part disposed on one surface of the cover substrate; a light receiving part disposed on one surface of the cover substrate to be spaced from the light emitting part; a circuit pattern which is disposed on one surface of the cover substrate between the light emitting part and the light receiving part, and is electrically connected to the light emitting part; a molding part which covers the light emitting part; and a plurality of conductive balls disposed on one surface of the cover substrate to electrically connect a main board and the light receiving part. An optical signal detecting device in accordance with an embodiment of the present invention, comprises: a cover substrate including one surface and the other surface; a light emitting part which is disposed on one surface of the cover substrate, and irradiates light toward the other surface of the cover substrate; a light receiving part disposed on one surface of the cover substrate to be spaced from the light emitting part; a circuit pattern which is disposed on one surface of the cover substrate between the light emitting part and the light receiving part, and is electrically connected to the light emitting part; a molding part which covers the light emitting part; a main board disposed on one surface of the cover substrate to be spaced from the cover substrate; a plurality of conductive balls disposed between the cover substrate and the main board to electrically connect the main board and the light receiving part; and a filling part disposed between the conductive balls. According to the present invention, an optical signal can be detected with low power.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical signal measurement module and an optical signal sensing device including the optical signal measurement module.

The present invention relates to an optical signal measurement module capable of detecting an accurate optical signal even at a low power and an optical signal sensing device including the same.

With the development of electronic technology, smart phones with miniaturized PCs became popular. In addition, various wearable devices have recently been released. A wearable device refers to an electronic device in a form that can be worn like a pair of glasses, a watch, a garment, and the like. A wearable device has characteristics that a user can easily use anytime, anywhere.

Therefore, a smart phone or a wearable device can continuously collect personal change in real time.

Also, as interest in personal health grows, healthcare-related industries are growing. In particular, as the age of aging approaches, the demand for prevention of diseases is increasing as the individual's health status is constantly monitored. Accordingly, the smart phone has a function of a pedometer for measuring the amount of activity of an individual. Alternatively, a wearable device such as a smart watch can measure heart rate.

On the other hand, the measurement of the heart rate (pulse rate) is performed by using a piezoelectric type using a piezo element or the like, a pressing type using a magnetic type or film type pressure sensor using a magnetic tunneling junction (MTJ) element, An impedance type, and an optical type using an optical sensor.

In order for the wearable device to constantly monitor the health state of the user, low power is required and accuracy of recognizing biometric information should be high. In addition, miniaturization is required in order to improve the user's convenience.

Embodiments provide an optical signal measurement module capable of sensing an optical signal with a slim and low power, and an optical signal sensing device including the same.

An optical signal measurement module according to an embodiment includes: a cover substrate including a first surface and a second surface; A light emitting unit disposed on one surface of the cover substrate; A light receiving unit disposed on one surface of the cover substrate so as to be spaced apart from the light emitting unit; A circuit pattern disposed on one surface of the cover substrate between the light emitting portion and the light receiving portion, the circuit pattern being electrically connected to the light emitting portion; A molding part surrounding the light emitting part; And a plurality of conductive balls disposed on one side of the cover substrate and arranged to electrically connect the main board and the light receiving unit.

An optical signal sensing apparatus according to an embodiment includes a cover substrate including a first surface and a second surface; A light emitting unit disposed on one surface of the cover substrate and emitting light toward the other surface of the cover substrate; A light receiving unit disposed on one surface of the cover substrate so as to be spaced apart from the light emitting unit; A circuit pattern disposed on one surface of the cover substrate between the light emitting portion and the light receiving portion, the circuit pattern being electrically connected to the light emitting portion; A molding part surrounding the light emitting part; A main board disposed on one surface of the cover board and spaced apart from the cover board; A plurality of conductive balls disposed between the cover substrate and the main board and arranged to electrically connect the main board and the light receiving unit; And a filling part disposed between the plurality of conductive balls.

In an optical signal measurement module and an optical signal sensing device including the optical signal measurement module according to the embodiment, a light emitting portion and a light receiving portion may be directly disposed on one surface of a cover substrate. That is, the light emitting portion of the embodiment can emit light in the direction opposite to the one surface of the cover substrate. Therefore, the sensing distance of the optical signal reaching the light emitting portion, the sensing object, and the light receiving portion can be reduced. Therefore, the embodiment can improve the strength of the light emitting portion and the sensitivity of the light receiving portion with low power.

In addition, the optical signal measuring module and the optical signal sensing device including the optical signal measuring module according to the embodiment may include a conductive ball having a diameter larger than the thickness of the light emitting portion, the light receiving portion, and the light emitting portion on one surface of the cover substrate. Therefore, in the embodiment, a separate circuit board having a cavity for accommodating the light emitting portion can be omitted. Further, in the embodiment, since the light emitting portion is directly disposed on the cover substrate, the circuit substrate for supporting the light emitting portion can be omitted. Therefore, the embodiment can omit both the circuit board having the cavity and the circuit board for supporting the light emitting portion, so that the overall thickness of the optical signal measuring module can be reduced.

1 to 3 are various cross-sectional views of an optical signal measurement module according to an embodiment.
4 is a plan view of the optical signal measurement module according to FIG.
5A is a detailed sectional view of a light receiving portion disposed on a cover substrate.
5B is a cross-sectional view illustrating a manufacturing process of the optical signal measurement module according to FIG.
6 and 7 are views showing an example of the arrangement of the light emitting portion and the light receiving portion according to the embodiment.
8 to 11 are views showing an optical signal information sensing apparatus including an optical signal measurement module.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the above-described embodiments, and various changes and modifications may be made without departing from the scope of the present invention.

In addition, the matters described in the attached drawings may be different from those actually implemented by the schematic drawings to easily describe the embodiments of the present invention.

In the meantime, each constituent unit described below is only an example for implementing the present invention. Thus, in other implementations of the present invention, other components may be used without departing from the spirit and scope of the present invention.

Also, the expression " comprising " is intended to merely denote that such elements are present as an expression of " open ", and should not be understood to exclude additional elements.

Also, the expressions such as 'first, second', etc. are used only to distinguish between plural configurations, and do not limit the order or other features among the configurations.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions in the embodiments of the present invention, which may vary depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size. Hereinafter, embodiments will be described with reference to the accompanying drawings.

A general optical signal measurement module mounts a bulk light emitting portion and a light receiving portion on a separate substrate other than the cover substrate. And then the cover is put on the substrate and assembled. Further, the light receiving portion is disposed only on one side of the light emitting portion.

In this case, there is a gap between the light emitting portion and the light receiving portion and the cover substrate, which increases the sensing distance of the optical signal, thereby increasing power consumption. In addition, when the light receiving portion is disposed on one side of the light emitting portion, there is a problem that the light efficiency is lowered because the light receiving direction is unidirectional.

As the distance between the cover substrate, the light emitting portion and the light receiving portion is reduced, the embodiment can reduce the sensing distance of the optical signal, and can measure the optical signal with low power. Further, the light receiving portion can be disposed so as to surround the periphery of the light emitting portion, and the light receiving efficiency can be increased.

Hereinafter, an optical signal measurement module according to an embodiment will be described with reference to FIGS. 1 to 5. FIG.

1 to 3, an optical signal measurement module according to an embodiment includes a cover substrate 100, a light emitting unit 200, light receiving units 300 and 310, circuit patterns 420 and 421 and 422, A portion 610, and conductive balls 410 (411, 412, 413, 414).

The cover substrate 100 protects the light emitting unit 200 and the light receiving unit 300 from external impacts or contaminants.

The cover substrate 100 may include a first surface and a second surface opposite to the first surface.

One surface 100a of the cover substrate may be a surface on which the light emitting unit 200 and the light receiving unit 300 are mounted. Mounting here may include direct contact and indirect contact.

The other surface 100b of the cover substrate may be a surface exposed to the outside. The other surface 100b of the cover substrate can receive a heartbeat signal. That is, the other surface 100b of the cover substrate may be a surface that is in contact with the living body. Here, the contact may include not only a direct contact, but also the separation distance of the region which can be detected by the optical signal. The other surface 100b of the cover substrate may receive various input signals such as a touch signal.

The cover substrate 100 may be rigid or flexible. For example, the cover substrate 100 may comprise glass. In detail, the cover substrate 100 may include at least one of silicon oxide, aluminum oxide, and sodium oxide. In one example, the cover substrate 100 may include chemically reinforced / semi-tempered glass such as soda lime glass or aluminosilicate glass.

Also, the cover substrate 100 may be curved while partially having a curved surface. That is, the cover substrate 100 may be partially flat, and partially curved while having a curved surface. In detail, the end of the cover substrate 100 may be curved with a curved surface or may have a curved surface with a curvature.

In addition, the cover substrate 100 may be a flexible glass plate having flexible characteristics.

In addition, the cover substrate 100 may be a curved or bended substrate. That is, the optical signal measurement module including the cover substrate 100 may be formed to have flexible, curved, or bendable characteristics. Accordingly, the optical signal measurement module and the optical signal sensing device including the optical signal measurement module according to the embodiments are easy to carry and can be changed into various designs. Therefore, the optical signal measurement module according to the embodiment can be included in the wearable device.

The cover substrate 100 may have a thickness of 300 to 700 mu m. For example, the cover substrate 100 may have a thickness of 400 to 600 mu m. For example, the cover substrate 100 may have a thickness of 450 to 550 mu m. When the thickness of the cover substrate 100 is more than about 700 mu m, the thickness of the optical signal measurement module may increase. When the thickness of the cover substrate 100 is less than about 300 mu m, the strength of the cover substrate may be lowered.

The light emitting unit 200 may be disposed on one surface 100a of the cover substrate 100. [ The cover substrate 100 may be a substrate for supporting the light emitting unit 200.

The light emitting unit 200 may be disposed directly on the cover substrate 100. For example, the upper surface of the light emitting unit 200 may directly contact one surface 100a of the cover substrate 100. [

Alternatively, the upper surface of the light emitting unit 200 may be in indirect contact with the one surface 100a of the cover substrate 100. That is, other materials may be disposed between the light emitting unit 200 and the cover substrate 100. Here, indirect contact means that other components can be disposed, and does not mean that a separate substrate is disposed.

For example, referring to FIG. 1, a circuit pattern 422 may be disposed between a first surface 100a of the cover substrate 100 and an upper surface of the light emitting unit. That is, a circuit pattern for transmitting a signal generated from the light emitting portion may be disposed between one surface 100a of the cover substrate 100 and the upper surface of the light emitting portion. At this time, the circuit pattern 422 may include a transparent conductive material so that electricity can flow without interfering with transmission of light. For example, the circuit pattern 422 may include at least one of indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, Metal oxides such as titanium oxide, gallium aluminum oxide (GAZO), and gallium-doped zinc oxide (GZO).

For example, referring to FIG. 2, an adhesive layer 500 may be disposed between one surface 100a of the cover substrate 100 and an upper surface of the light emitting portion. That is, a transparent adhesive layer 500 may be disposed between one surface 100a of the cover substrate 100 and the upper surface of the light emitting portion to prevent the transmission of light from the cover substrate 100 and to bond the cover substrate and the light emitting portion. For example, the adhesive layer 500 may include an optical transparent adhesive (OCA, OCR). In one example, the adhesive layer 500 may include a transparent and heat-releasing epoxy adhesive material.

That is, in the embodiment, the light emitting unit 200 can be disposed on one surface of the cover substrate, and the distance of movement of the light from the light emitting unit to the sensing target material can be shortened. In detail, the light emitted from the light emitting portion can emit light in a direction opposite to the one surface of the cover substrate, thereby reducing the moving distance of the optical signal. Thus, the embodiment can provide an optical signal measurement module that can be driven with low power.

Further, the embodiment may not require a separate circuit board for supporting the light emitting portion. In addition, a circuit board having a cavity for housing the light emitting portion may not be required. That is, the embodiment can omit the circuit boards for supporting the light emitting portion 200 or for accommodating the light emitting portion, and the overall thickness can be reduced. Further, since adhesion between the cover substrate and the circuit board is not required, adhesion between the circuit board having the cavity for housing the light emitting portion and the circuit board for supporting the light emitting portion may not be required, and the thickness of the adhesive layer may be omitted , The process cost can be reduced, and the process efficiency can be improved.

The light emitting unit 200 may emit light of a specific wavelength band according to a light emission control signal.

The light emitting unit 200 may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), an infrared light emitting diode (LED), and a laser diode.

The light emitting unit 200 can receive power from the power supply unit and emit the supplied energy into light of a specific wavelength. At this time, the light emitting unit 200 may use various materials in order to emit light of a specific wavelength.

A light receiving unit 300 may be disposed on one surface 100a of the cover substrate 100. [ The cover substrate 100 may be a substrate for supporting the light receiving unit 300. That is, the cover substrate 100 may be a substrate capable of supporting the light emitting unit 200 and the light receiving unit 300 at the same time. That is, the light emitting unit and the light receiving unit can be disposed on the same surface of the cover substrate, so that the light emitting unit and the light receiving unit can be protected from external shocks, and the moving distance of the optical signal can be minimized. Therefore, the embodiment can improve the accuracy of the measurement information such as the distribution of the object to be sensed through the optical signal, the state change, and the like.

The light receiving unit 300 may be partially disposed on one surface 100a of the cover substrate 100. [ More specifically, the light receiving unit 300 may be in direct contact with the one surface 100a of the cover substrate 100.

That is, the light receiving unit 300 may be disposed directly on the cover substrate 100 without being separated from the cover substrate 100. Accordingly, the distance between the light receiving unit 300 and the object to be sensed can be shortened. For example, when the subject is a pulse, the distance between the light receiving unit 300 and the blood vessel may be shortened. Accordingly, the light-receiving unit 300 can reduce the distance of the light generated from the light-emitting unit and transmitted to the light-receiving unit 300 through the biological signal. Thus, the embodiment can be driven at low power.

The light receiving unit 300 may be disposed on the same side 100a of the cover substrate 100 so as to be spaced apart from the light emitting unit 200 disposed on one side of the cover substrate 100. [ The light receiving unit 300 may be spaced a predetermined distance from the light emitting unit 200 to entirely surround the peripheral region of the light emitting unit 200 on one surface 100a of the cover substrate 100. [ Accordingly, the light receiving unit 300 can receive light regardless of the direction of the light emitting unit 200. That is, the light receiving unit 300 may be positioned entirely in a direction ranging from 0 ° to 360 ° of the light emitting unit 200. Therefore, the light receiving unit 300 can receive the light emitted from the light emitting unit 200 regardless of the direction, and the amount of received light can be increased. Accordingly, the embodiment can detect an accurate optical signal with low power.

The light receiving unit 300 may include at least one of a photodiode, an optical electron multiplier, and a phototransistor. For example, the light receiving unit 300 may be a photodiode deposited in a thin film form. For example, the thickness of the light receiving portion 300 may be 3 占 퐉 or less. For example, the thickness of the light receiving portion 300 may be 2 탆 or less. For example, the thickness of the light receiving portion 300 may be 1.5 占 퐉 or less. Since the light receiving unit 300 is disposed as a thin film on the cover substrate 100, the light receiving unit 300 may be thin and the optical signal measuring module may be lightweight.

The light receiving unit 300 may be closely attached to the cover substrate 100 using at least one of a vacuum deposition method, a sputtering method, a CVD method, and a printing method.

A plurality of circuit patterns 421 and 422 may be disposed on one surface of the cover substrate 100. For example, a plurality of circuit patterns 421 and 422 may be directly in contact with one surface of the cover substrate 100. For example, a plurality of circuit patterns 421 and 422 disposed on one surface of the cover substrate 100 may be formed by bonding an anisotropic conductive film (ACF) to one surface of the cover substrate 100 .

The first circuit pattern 421 may be spaced apart from the second circuit pattern 422. That is, the first circuit pattern 421 may be electrically isolated from the second circuit pattern 422 on the cover substrate 100, which is an insulating substrate.

For example, at least one of the first circuit pattern 421 and the second circuit pattern 422 may include a conductive material. For example, at least one of the first circuit pattern 421 and the second circuit pattern 422 may be formed of any one material selected from among Cu, Ag, Cr, Ti, Sn, Au, Ni, Pd, Lt; / RTI > At least one of the first circuit pattern 421 and the second circuit pattern 422 may be a conventional printed circuit board manufacturing process such as an additive process, a subtractive process, an MSAP Semi Additive Process) and SAP (Semi Additive Process) method. At this time, although the first circuit pattern 421 and the second circuit pattern 422 include a metal material, they may not be seen from outside as they have a fine line width.

At least one circuit pattern of the first circuit pattern 421 and the second circuit pattern 422 may be electrically connected to the light emitting unit 200 by a connecting member 450. The connecting member 450 may include a conductive metal wire. The connecting member 450 may include the same material as at least one of the first circuit pattern 421 and the second circuit pattern 422.

For example, referring to FIG. 1, the first circuit pattern 421 may electrically connect a positive signal of the light emitting unit 200 with the connection member 500. The second circuit pattern 422 may electrically connect the negative signal of the light emitting unit 200.

For example, referring to FIG. 2, the first circuit pattern 421 may electrically connect a positive signal of the light emitting unit 200 with the connection member 500. The second circuit pattern 422 may electrically connect the negative signal of the light emitting unit 200 with the connection member 500.

A plurality of conductive balls 410 may be disposed on one surface 100a of the cover substrate 100. [ The plurality of conductive balls may be spaced apart from each other and disposed directly on one surface 100a of the cover substrate 100. The plurality of conductive balls may include at least one first conductive ball 411 and 412 electrically connected to the light receiving unit 300 and at least one second conductive ball 411 and 412 electrically connected to the circuit patterns 421 and 422, (413, 414).

For example, referring to FIGS. 1 and 2, the first conductive balls 411 and 412 may contact the light receiving unit 300. The first conductive ball 411 may electrically connect a positive signal of the light receiving unit 300 and the first conductive ball 412 may electrically connect a negative signal of the light receiving unit 300.

The second conductive balls 413 and 414 may be in contact with the circuit patterns 421 and 422. The second conductive ball 413 may electrically connect a positive signal of the light emitting unit 200 through the first circuit pattern 421 and the second conductive ball 414 may electrically connect the light emitting unit 200 May be electrically connected through the second circuit pattern 422.

The diameter T1 of the conductive balls 410 may be larger than the thickness T2 of the light emitting unit 200. [

For example, the diameter T1 of the conductive ball may be 300 to 700 mu m. For example, the diameter T1 of the conductive ball may be 300 to 600 mu m. For example, the diameter T1 of the conductive ball may be 400 m to 600 m.

For example, the thickness T2 of the light emitting part 200 may be 400 m or less. For example, the thickness T2 of the light emitting portion 200 may be 200 to 300 mu m.

The conductive balls having a diameter larger than the thickness of the light emitting portion may be disposed on one surface of the cover substrate 100 to secure a space for disposing the light emitting portion 200.

That is, in the embodiment, the plurality of conductive balls are disposed on the circuit pattern and the light receiving unit disposed on one side of the cover substrate, so that the light emitting unit 200 can be stably disposed on one side of the cover substrate. Therefore, a separate circuit board for mounting the light emitting unit 200 can be omitted. The embodiment can omit the adhesive layer for connecting the circuit board and the circuit board to the cover substrate, so that the overall thickness of the optical signal measurement module can be reduced.

The conductive balls 410 may be solder balls. The solder ball may have a spherical shape. The solder ball may include a conductive material. For example, the solder ball may be any one selected from Cu, Ag, Cr, Ti, Sn, Au, Ni, Pd, Pb and alloys thereof. For example, the solder ball may be an alloy containing tin as a main component.

A molding part 610 may be disposed on one surface 100a of the cover substrate 100. [ The molding part 610 may cover the light emitting part 200. The molding part 610 may cover the light emitting part 200 on one surface 100a of the cover substrate 100. [ The molding part 610 may cover both side surfaces and the lower surface of the light emitting part 200. At this time, the molding part 610 may directly contact both sides of the light emitting part 200, the lower surface, and the one surface 100a of the cover substrate 100. [ Accordingly, the molding part 610 can protect the light emitting part 200. In detail, the molding part 610 can prevent moisture and foreign matter from penetrating into the light emitting part 200, and can protect the light emitting part 200 from an external impact.

The width of the molding part 610 may be greater than the width of the light emitting part 200. The flat area of the molding part 610 may be larger than the flat area of the light emitting part 200. The molding unit 610 may be disposed at a position corresponding to the light emitting unit 200. Accordingly, one surface of the light emitting portion 200 contacts one surface of the cover substrate, and both surfaces of the light emitting portion and the other surface opposite to the one surface can contact the molding portion 610. At this time, the thickness of the molding part 610 may be greater than the thickness of the light emitting part 200. The light emitting unit 200 may be attached to the cover substrate 100 by the molding unit 610.

The molding part 610 may include an epoxy-based material. For example, the molding portion 610 may include an epoxy-based material having excellent heat dissipation. Thus, the durability of the optical signal measurement module of the embodiment can be improved.

The molding part 610 may include a black color. For example, the molding part 610 may include an epoxy molding compound (EMC). For example, the molding part 610 may include silica, an epoxy resin, a phenol resin, and carbon black.

The molding part 610 may contact both sides of the light emitting part 200. The molding unit 610 may transmit light generated through the light emitting unit 200 to the other surface of the cover substrate.

The diameter T1 of the conductive balls 410 (411, 412, 413, 414) may be larger than the thickness of the molding part 610. Accordingly, the conductive ball can secure a space for disposing the molding part 610 surrounding the light emitting part 200 and the light emitting part 200.

Referring to FIG. 3, an optical signal sensing apparatus according to an embodiment will be described.

The optical signal sensing apparatus according to an embodiment may include an optical signal measurement module according to an embodiment and a main board of various electronic devices. Hereinafter, the connection between the optical signal measurement module according to the embodiment and the main board of various electronic devices will be described.

The optical signal measurement module according to the embodiment includes a cover substrate 100, a light emitting portion 200, a light receiving portion 300, 310 and 320, circuit patterns 420 and 421, a molding portion 610, : 411, 412, 413, 414).

The optical signal sensing apparatus according to the embodiment may include the optical signal measurement module described above. That is, the optical signal sensing device according to the embodiment includes the cover substrate 100, the light emitting unit 200, the light receiving units 300 and 310, the circuit patterns 420 and 421, the molding unit 610, (410: 411, 412, 413, 414), a main board (700), and a filling part (620).

The optical signal sensing apparatus according to the embodiment may include the light emitting unit 200, the light receiving unit 300, the circuit pattern 420, and the molding unit 610 disposed on one side of the cover substrate 100 . The light emitting unit 200, the light receiving unit 300, the circuit pattern 420, and the molding unit 610 are the same as the optical signal measuring module described above, and thus a duplicated description will be omitted.

A main board 700 may be disposed on one surface of the cover substrate 100. The main board 700 may be a main board of various electronic devices. For example, the main board 700 may be a main board of a smart phone, or a main board for operating an electronic device such as a smart watch.

The main board 700 may include a memory, a driving element, a sensor, or a module of a sensor.

The main board 700 may be a rigid board. Accordingly, the main board 700 can stably support driving elements such as semiconductor chips. For example, the main board 700 may be made of poly ethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. Alternatively, the main board 700 may be ceramic. Alternatively, the main board 700 may be an organic-inorganic composite substrate or a glass fiber impregnated substrate. Alternatively, the main board 700 may be a thermosetting or thermoplastic polymer substrate. For example, the main board 700 may include an epoxy and a phenol resin. The main board 700 may have insulating properties. The main board 700 may include a solder resist layer.

The main board 700 may include a driving element 430. A driving device 430 may be embedded in the main board 700. Thus, the overall thickness of the optical signal sensing device can be reduced.

The conductive ball 410 may electrically connect the light receiving unit 300 disposed on the conductive ball 410 and the driving device 430 embedded in the main board 700. [

A main board may be disposed on one surface of the cover substrate so as to be spaced apart from the cover substrate. At this time, the cover board and the main board may be disposed facing each other. The flat surface area of the cover substrate may be larger than the flat surface area of the main board. A plurality of conductive balls for electrically connecting the main board and the light receiving unit may be disposed between the cover substrate and the main board. At this time, the plurality of conductive balls may be spaced apart from each other. The plurality of conductive balls 410 are electrically connected to at least one first conductive ball electrically connected to the light receiving unit 300 and a circuit pattern 420 for transmitting signals of the light emitting unit 200, And at least one second conductive ball. The first conductive ball and the second conductive ball may be disposed on the same plane.

The upper portion of the first conductive ball may contact the light receiving portion 300 and the lower portion of the first conductive ball may contact the driving element 430. Accordingly, the first conductive ball may electrically connect the light-receiving unit 300 and the driving device 430. FIG.

The driving element 430 may measure a pulse according to the intensity period of the photocurrent signal. The driving element 430 may be an application specific integrated circuit (ASIC).

In detail, the driving element 430 can control the light emitting unit 200 and the light receiving unit 300. The driving device 430 may process a signal corresponding to light incident through the light receiving unit 300 to measure a signal to be sensed. For example, signals can be measured from various sensing objects such as pulse changes, gas leaks, dust distribution, and the like.

That is, in the embodiment, the electrical signal of the light receiving unit and the electrical signal of the light emitting unit can be connected to the main board by the conductive balls 410. Thus, the conductive balls may be replaced with separate circuit boards having vias. In detail, the conductive balls 410 can transmit electrical signals up and down by connecting the cover substrate 100 and the semiconductor chips of the main board 700 by direct contact. That is, the upper part of one conductive ball is directly in contact with the circuit pattern or the light receiving part which can be supported by the cover substrate, and the lower part of the one conductive ball can be in direct contact with the circuit pattern or the driving element of the main board. Thus, the cover board and the main board can be spaced apart from each other with a size corresponding or similar to the diameter of one conductive ball.

The embodiment can omit the circuit board on which the via is formed and the adhesive layer for bonding the cover substrate and the circuit board, so that the process efficiency can be improved and the process cost can be reduced. In addition, the embodiment can omit the flexible circuit board for transmitting the signal generated from the light emitting portion and the light receiving portion to the main board, omitting the flexible circuit board and the adhesive material, thereby improving the process efficiency, Can be reduced.

A filler 620 may be disposed between the plurality of conductive balls spaced apart from each other. The filling part 620 may be filled in the empty space formed by the plurality of conductive balls 410 disposed between the cover substrate 100 and the main board 700. [ Accordingly, the filling part 620 penetrates the light emitting part 200, the light receiving part 300, the conductive ball 410, the circuit pattern 420, and the driving element 430, Can be prevented. Also, the filling part 620 can protect the optical signal measuring module from an external impact.

The filling part 620 may include the same or similar material as the molding part 610. For example, the filling portion 620 may include a transparent material. The filling portion 620 may be a silicon or epoxy-based material having optical transparency. The optical signal measurement module can be stably connected to the main board by the filling unit 620.

4 is a top view of an optical signal measurement module according to an embodiment. As described above, the light emitting unit 200 and the light receiving unit 300 are disposed on one surface of the same cover substrate.

The light emitted from the light emitting unit 200 may be reflected from the sensing target material and may enter the light receiving unit 300. For example, when the optical signal is for sensing biometric information, the emitted light may be reflected from the blood vessel or around the blood vessel to enter the light receiving unit. At this time, since the light emitting unit 200 and the light receiving unit 300 are disposed on the cover substrate, they can be positioned close to the sensing target material. Therefore, driving with low power can be possible. Also, since the light receiving unit 300 surrounds the entire periphery of the light emitting unit 200, the amount of received light can be increased.

The light emitting unit 200 and the light receiving unit 300 may have a corresponding or different shape. For example, the light emitting unit 200 and the light receiving unit 300 may have a rectangular shape. Alternatively, the light emitting unit 200 may have a rectangular shape, and the light receiving unit 300 may have a circular shape. It should be understood that the embodiment is not limited thereto, and that the light receiving unit 300 may include various geometries such as an elliptical shape, a triangular shape, and the like, and a heart shape. That is, the embodiment can provide an optical signal measurement module having various designs.

5A and 5B, a manufacturing process of the optical signal measurement module according to the embodiment will be described.

5A is a detailed sectional view of the light receiving unit 300 disposed on the cover substrate 100. As shown in FIG.

First, with reference to FIG. 5A, a step of disposing the light receiving unit 300 on the cover substrate 100 will be described.

The light receiving unit 300 may be disposed directly on the cover substrate 100 in a thin film form. That is, the embodiment can provide the light receiving unit 300 integrated with the cover substrate 100.

The light receiving unit 300 may include a plurality of layers. For example, the light receiving unit 300 may include a first electrode 301, a P layer 302, an I layer 303, an N layer 304, and a second electrode 305.

The first electrode 301 and the second electrode 302 may include a conductive material. For example, the first electrode 301 may include a transparent conductive material. For example, the first electrode 301 may include at least one material selected from the group consisting of indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, Metal oxides such as titanium oxide, gallium aluminum oxide (GAZO), and gallium-doped zinc oxide (GZO).

The thickness of the first electrode 301 may be 300 nm to 500 nm. For example, the thickness of the first electrode 301 may be 350 nm to 450 nm.

For example, the second electrode 302 may include a metal material. For example, chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo). Gold (Au), titanium (Ti), and alloys thereof.

The thickness of the second electrode 302 may be 300 nm to 500 nm. For example, the thickness of the second electrode 302 may be 350 nm to 450 nm.

The first electrode 301 may be an anode and the second electrode 302 may be a cathode.

For example, the P layer 302, the I layer 303, and the N layer 304 may be p-type doped silicon, I-doped or N-doped semiconductor layers. At this time, the silicon may be any one of single crystal silicon, polycrystalline silicon and amorphous silicon.

5B, the circuit patterns 421 and 422 may be disposed on one surface of the cover substrate 100 after the light receiving units 300 and 310 and 320 are disposed on one surface of the cover substrate 100 have. The first circuit pattern 421 and the second circuit pattern 422 may be disposed on one surface of the cover substrate 100.

Next, the light emitting unit 200 may be disposed on one side of the cover substrate 100. At least one circuit pattern of the first circuit pattern 421 and the second circuit pattern 422 may be connected to the light emitting unit 200 through the connection member 450. Alternatively, at least one circuit pattern of the first circuit pattern 421 and the second circuit pattern 422 may be in contact with the light emitting unit 200 and connected thereto.

One end of the circuit pattern and the other end opposite to the one end may extend on one surface of the cover substrate. One end of the circuit pattern may be spaced apart from the light receiving unit 300. At this time, the other end of the circuit pattern may be separated from the light emitting unit 200 or may be in contact with the light emitting unit 200.

Next, a plurality of conductive balls may be disposed on the first circuit pattern 421, the second circuit pattern 422, and the light receiving unit 300, respectively. A molding part 610, which can cover both sides and the bottom surface of the light emitting part 200, may be disposed on the light emitting part 200. The molding part 610 may have a cap shape surrounding the light emitting part 200.

For example, the molding part 610 may cover a part of the light emitting part 200 and the connection member 450. For example, the molding part 610 may partly cover the whole of the light emitting part 200, the connecting member 450, and the circuit pattern. In an embodiment, the conductive ball 410 may be disposed, the molding unit 610 may be disposed, the molding unit 610 may be disposed first, and the conductive ball 410 may be disposed . Accordingly, the conductive ball may not be disposed under the molding part 610.

The molding portion 610 and the light receiving portion 300 disposed on the same side of the cover substrate may be spaced apart from each other.

In addition, the plurality of conductive balls 410 may be dispersed and separated from each other between the cover substrate 100 and the main board. Accordingly, the distance between the cover board 100 and the main board may be similar to the diameter of the conductive balls.

In addition, in the embodiment, the light emitting portion, the light receiving portion, and the conductive ball can be disposed on the cover substrate, so that a plurality of optical signal measurement modules can be simultaneously formed. Specifically, in the embodiment, a plurality of light emitting portions and a plurality of light receiving portions may be formed on a cover substrate, and a plurality of conductive balls may be arranged. Thereafter, in order to shield the light emitted from the light emitting portion, the molding portion including the black resin can be simultaneously disposed on the light emitting portion. Thereafter, the cover substrate may be diced to form each optical signal measurement module. Therefore, the manufacturing process of the optical signal measurement module according to the embodiment can improve the process efficiency and reduce the process cost. In addition, a slim optical signal measurement module can be provided.

6 and 7 are views showing an example of the arrangement of the light emitting portion and the light receiving portion according to the embodiment.

The optical signal sensing apparatus according to the embodiment can detect the information of the object to be sensed according to the voltage (that is, the light receiving voltage) of the light received through the light receiving unit 300. For example, the information to be sensed may include biometric information. The biometric information may include heart rate, oxygen saturation, and the like.

FIG. 6 is a configuration example of the light emitting unit 200 and the light receiving unit 300, which is shown when the optical signal detecting apparatus detects only the heart rate.

7 is a configuration example of the light emitting unit 200 and the light receiving unit 300, which are shown when the optical signal detecting apparatus detects both the heart rate and the oxygen saturation.

Referring to FIG. 6, in order to detect the heart rate, the optical signal sensing apparatus may include at least one light emitting unit 200 and a light receiving unit 300. At this time, at least one light emitting unit 200 may be a green LED.

6 (a), the light emitting unit 200 may be disposed in a central region of the upper surface of the second substrate 420, and the light receiving unit 300 may be disposed on the other surface of the cover substrate 100, It can surround the central region. That is, the light emitting unit and the light receiving unit may be arranged in the vertical direction. At this time, the light emitting unit 200 may be disposed at a position corresponding to the inside of the groove of the cover substrate 100.

6 (b) and 6 (c), the light emitting unit 200 may be disposed in a central region of the upper surface of the second substrate 420, And may surround the central region on the other surface of the substrate 100. At this time, the plurality of light emitting units 200 may be disposed at positions corresponding to the inside of the grooves of the cover substrate 100. The plurality of light emitting units 200 may all be green LEDs.

The light emitting unit may be arranged in a horizontal direction as shown in FIG. 6 (b).

The light emitting portion may be arranged in a vertical direction as shown in FIG. 6 (c).

Referring to FIG. 7, the optical signal sensing apparatus may include a plurality of light emitting units 200 and at least one light receiving unit 300 to detect both the heart rate and the degree of coral saturation.

Referring to FIGS. 7A and 7B, light emitting units 200 including a plurality of green light emitting units 201a and 201b, a red light emitting unit 202 and an infrared light emitting unit 203, The light receiving portion 300 of FIG.

Referring to FIG. 7 (c), a plurality of green light emitting units 201a, 201b, 201c, and 201d and one light receiving unit 300 are included.

That is, in the embodiment, the amount of light received through the light receiving unit can be increased by disposing the light receiving unit with a structure surrounding the light emitting unit, and an optimal sensing environment can be provided by utilizing the multi-directional optical path.

8 to 11 are diagrams illustrating various optical signal sensing devices including an optical signal measurement module. Here, the optical signal sensing device may include various electronic devices having various functions such as biometric information measurement. For example, embodiments can detect changes or distributions of various materials such as dust, gas, etc. using an optical signal.

Figure 8 relates to a mobile device comprising an optical signal measurement module. For example, the optical signal measurement module according to the embodiment may be included in a smart phone.

Figure 9 relates to a wearable device including an optical signal measurement module. For example, the optical signal measurement module according to the embodiment may be included in a smart watch, earphone, and smart clothing.

Figure 10 relates to a medical device comprising an optical signal measurement module. For example, the optical signal measurement module according to the embodiment can be used in various medical instruments for measuring the heart rate and the like.

Figure 11 relates to a vehicle handle comprising an optical signal measurement module. For example, since the optical signal measurement module according to the embodiment is provided in the steering wheel for a vehicle, it can safely protect the driver.

It is needless to say that the optical signal measurement module may be included in various electronic devices such as a mouse or a handle of a fitness instrument, which are exposed to a palm or a wrist, though it is not shown in the drawing.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

Claims (11)

A cover substrate including a first surface and a second surface;
A light emitting unit disposed on one surface of the cover substrate;
A light receiving unit disposed on one surface of the cover substrate so as to be spaced apart from the light emitting unit;
A circuit pattern disposed on one surface of the cover substrate between the light emitting portion and the light receiving portion, the circuit pattern being electrically connected to the light emitting portion;
A molding part surrounding the light emitting part; And
And a plurality of conductive balls disposed on one surface of the cover substrate and arranged to electrically connect the main board and the light receiving unit. The method according to claim 1,
Wherein the plurality of conductive balls include:
At least one first conductive ball electrically connected to the light receiving unit; And
And at least one second conductive ball electrically connected to the circuit pattern. 3. The method of claim 2,
The first conductive ball is in contact with the circuit pattern,
And the second conductive ball is in contact with the light receiving portion. The method according to claim 1,
Wherein the circuit pattern is disposed between one surface of the cover substrate and the light emitting portion. The method according to claim 1,
And a transparent adhesive layer between one surface of the cover substrate and the light emitting portion. The method according to claim 1,
And the molding portion is in direct contact with one surface of the cover substrate. The method according to claim 1,
Wherein the molding portion is black. The method according to claim 1,
Wherein the diameter of the conductive ball is larger than the thickness of the light emitting portion. A cover substrate including a first surface and a second surface;
A light emitting unit disposed on one surface of the cover substrate and emitting light toward the other surface of the cover substrate;
A light receiving unit disposed on one surface of the cover substrate so as to be spaced apart from the light emitting unit;
A circuit pattern disposed on one surface of the cover substrate between the light emitting portion and the light receiving portion, the circuit pattern being electrically connected to the light emitting portion;
A molding part surrounding the light emitting part;
A main board disposed on one surface of the cover board and spaced apart from the cover board;
A plurality of conductive balls disposed between the cover substrate and the main board and arranged to electrically connect the main board and the light receiving unit; And
And a filling part disposed between the plurality of conductive balls. 10. The method of claim 9,
Wherein the plurality of conductive balls are spaced apart from each other,
At least one first conductive ball electrically connected to the light receiving unit; And
And at least one second conductive ball electrically connected to the circuit pattern. 10. The method of claim 9,
Wherein the main board includes a driving element,
Wherein the first conductive ball is electrically connected to the driving element.

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