KR20180036515A - Organic light emitting diode display - Google Patents

Abstract

The present invention relates to an organic light emitting diode display device capable of easily controlling the flow of an adhesive by preventing an adhesive from overflowing to a pad part when an organic light emitting array substrate and a touch electrode array substrate are bonded. The organic light emitting diode display device according to the present invention includes a substrate, a thin film transistor array, an organic light emitting array, a touch electrode array bonded to the organic light emitting array through an adhesive layer, and a plurality of dams located outside a display region.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode (OLED) display, and more particularly, to an organic light emitting diode (OLED) display capable of preventing a pad defect in an organic light emitting display having an in-

The image display device that realizes various information on the screen is the core technology of the information communication age, and it is becoming thinner, lighter, portable, and higher performance. Accordingly, an organic light emitting display device for displaying an image by controlling the amount of light emitted from the organic light emitting layer by using a flat panel display capable of reducing weight and volume, which is a disadvantage of a cathode ray tube (CRT)

In an organic light emitting display, a plurality of pixels are arranged in a matrix form to display an image. Here, each pixel includes a light emitting element and a pixel driving circuit composed of a plurality of transistors that independently drive the light emitting element.

Since the OLED display uses a self-emission type organic light emitting diode, it does not require a separate light source and can form an ultra-slim display. Therefore, an organic light emitting diode has been used in recent years, and a touch electrode array In-cell touch display devices including flexible substrates, in particular, flexible display devices using flexible substrates have been actively studied.

A display device of an in-cell touch structure has a structure in which a lower substrate provided with an organic light emitting element and an upper substrate provided with a touch electrode array are bonded together by an adhesive layer. At this time, a plurality of pad electrodes for applying a signal to the touch electrode array are formed in a non-display area of the lower substrate, and upper pad electrodes connected to the touch electrodes of the upper substrate are coupled together through conductive balls. .

In the display device of the in-cell touch structure, an adhesive is applied when the lower substrate and the upper substrate are attached to each other, and then the upper and lower substrates are bonded together and then cured. There is a problem that the adhesive overflows to the pad electrode of the lower substrate during application of the adhesive. At this time, since the adhesive is formed of an insulating material, if the adhesive covers the pad electrode, the contact failure of the pad electrode is caused.

On the other hand, when the flexible display device is formed, the flexible substrates are attached to the upper and lower substrates, respectively, and the upper and lower substrates are bonded together. Then, the upper substrate and the lower substrate And then irradiating the laser beam with the laser beam. At this time, when the adhesive is applied so as not to cover the flexible substrate, the flexible substrate may be damaged at the time of laser irradiation, and foreign matter may be scattered, thereby causing defects. Further, when the adhesive is applied in an excessive amount, an adhesive is directly adhered to the upper substrate and the lower substrate, so that it is impossible to remove the upper substrate and the lower substrate using a laser.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide an organic light emitting display device capable of easily controlling the flow of an adhesive by preventing an adhesive from overflowing to a pad portion when the organic light emitting array substrate and the touch electrode array substrate are bonded. To solve the problem.

According to an aspect of the present invention, there is provided an organic light emitting display including a substrate defined by a display portion and a non-display portion, a thin film transistor array, an organic light emitting array, an adhesive layer on the organic light emitting array, . At this time, the dam is a multi-layer structure including a lower layer portion and an upper layer portion, and at least one of the lower layer portion and the lower layer portion has an inverted tapered structure.

The dam of the organic light emitting diode display according to the present invention is formed in a plurality of layers so that it is possible to effectively prevent the adhesive from overflowing.

Further, the present invention has the effect of preventing the adhesive from overflowing and minimizing the thickness of the bezel when the dam has a two to five-layer structure.

At this time, the dam may be formed of the same material as the bank layer, the spacer, or the inorganic insulating layer disposed in the display region, and thus the dam can be implemented thickly without further processing. Accordingly, it is possible to effectively prevent the adhesive from overflowing during the laminating process.

Further, the dam of the present invention includes an inverted spacer-like structure, thereby making it possible to further increase the accommodation space of the adhesive layer that can overflow from the display area. Therefore, the dam including the reverse spacer structure according to the present invention can minimize overflow of the adhesive layer.

Further, the dam of the present invention can further increase the height of the dam without requiring additional mask for forming the dam. Therefore, the dam of the present invention has an excellent adhesive overflow prevention effect without any additional process.

FIG. 1 is a plan view of an organic light emitting diode display according to the present invention, and FIG. 2 is a cross-sectional view taken along line I-I 'of FIG.
3 is an enlarged plan view of portion A of Fig.
4 is a cross-sectional view illustrating a pad region including an upper pad portion and a lower pad portion, a display region (A / A), and a dam.
5 is a cross-sectional view illustrating a dam according to another embodiment of the present invention.
6 is a sectional view for explaining a dam according to another embodiment of the present invention.
7 is a plan view for explaining a dam according to another embodiment of the present invention.
8A to 8H are schematic views for explaining a method of manufacturing an organic light emitting diode display according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Like reference numerals throughout the specification denote substantially identical components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description, a detailed description of known technologies or configurations related to the present invention will be omitted when it is determined that the gist of the present invention may be unnecessarily obscured. The component names used in the following description are selected in consideration of easiness of specification, and may be different from the parts names of actual products.

The term " on "or " on" of another element encompasses not only the element just above the other element layer but also intervening layers or other elements in the middle. On the other hand, an element or layer is referred to as being "tangential " to another element, indicating that no other element or layer is interposed.

The sizes and thicknesses of the respective components shown in the figures are shown for convenience of explanation, and the present invention is not necessarily limited to the sizes and thicknesses of the components shown.

Hereinafter, an in-cell type organic light emitting display in which the touch electrode array is formed inside the cover window 3000 will be described.

FIG. 1 is a plan view of an organic light emitting diode display according to the present invention, and FIG. 2 is a cross-sectional view taken along line I-I 'of FIG.

1 and 2, the organic light emitting diode display of the present invention includes an organic light emitting diode array 150 and a touch electrode array 230 formed on inner surfaces of a lower substrate 1000 and a cover window 3000, (Not shown). On the other hand, the touch electrode array 230 may be formed on a separate upper substrate without being formed directly on the cover window 3000, and then the upper substrate may be removed by laser irradiation or etching for thinning and flexing, Attach the cover window (3000) to the exposed parts for protection.

Here, the first substrate 120, the first buffer layer 130, the thin film transistor array 140, and the organic light emitting array 150 are sequentially disposed on the lower substrate 1000, and the organic light emitting array 150 is covered Layer 160 is located. A second substrate 210, a second buffer layer 220, and a touch electrode array 230 are disposed on the cover glass 3000. Here, the touch electrode array 230 is positioned to face the organic light emitting array 150. At this time, the surfaces directly contacting with the adhesive layer 400 are the protective layer 160 at the bottom and the touch electrode array 230 at the top. Herein, the protective layer 160 may be referred to as an 'encapsulating layer' in terms of covering the lower organic light emitting array 150 and preventing external moisture or moisture from entering the inside thereof.

In the embodiment of the present invention, the touch electrode array 230 is included on the cover window 3000, but the present invention is not limited thereto. For example, the touch electrode array 230 may be included in the protective layer 160, and the lower substrate 1000 having the touch electrode array 230 may be a structure attached to the upper substrate by the adhesive layer 400 have. The upper substrate may be made of glass or plastic.

A display region (or a display portion) and a non-display region (or a non-display portion) are defined in the first buffer layer 130 and the second buffer layer 220, respectively. The touch electrode array 230, the organic light emitting array 150, Thin film transistors in the thin film transistor array 140 excluding the pad portions are formed in the display region. An upper pad portion 2350 is defined in a part of the non-display region. When the touch electrode is not embedded in the cover window 3000, the pad portion 2350 may be omitted.

Here, the first substrate 120 and the second substrate 210 can prevent the inner array from being damaged in addition to the glass material of the upper substrate and the lower substrate in the laser irradiation or etching process. The first substrate 120 and the second substrate 210 function as the film substrate 1000 and the cover glass 3000 without attaching the lower substrate 1000 and the cover glass 3000 But is not limited thereto.

The first and second substrates 120 and 210 are made of a polymer material such as polyimide or photo acryl.

The first buffer layer 130 and the second buffer layer 220 are formed by successively stacking inorganic layers such as an oxide layer (SiO2) or a nitride layer (SiNx), or alternately stacking different inorganic layers. The first and second buffer layers 130 and 220 are barriers that prevent moisture or outside air from being introduced into the organic light emitting array 150 in a subsequent process of attaching the upper substrate on the lower substrate 1000 Function.

The touch electrode array 230 may be formed on the same surface as the upper pad portion 2350 and the second buffer layer 220.

The upper pad portion 2350 is connected to the lower pad portion of the thin film transistor array 140 by the sealing material 450 including the conductive balls 455 in the top and bottom adhesion process by the adhesive layer 400.

The adhesive layer 400 has a moisture barrier function and is in direct contact with the protective layer 160 covering the organic light emitting array 150. In addition to the functions of the protective layer 160, It prevents outside air from entering and prevents moisture permeation more surely.

At least one dam 2300 is formed in the lower non-display area of the display area A / A or between the lower pad part where the display area A / A and the lower electrode are located. At this time, the dam 2300 is formed on the side of the thin film transistor array 140. When the organic light emitting array 150 and the touch electrode array 230 are vertically bonded by the adhesive layer 400, To prevent the adhesive for overflowing to the outside of the display area (A / A).

The thin film transistor array 140 including the lower pad portion may be formed so that one side thereof protrudes from the touch electrode array 230, but the present invention is not limited thereto. This is for the purpose of providing an IC for transmitting a signal for driving the touch electrode array, the thin film transistor array, or the organic light emitting array in the protruded portion. Though not shown, the IC and the thin film transistor array driving pad, the lower pads include a plurality of lower electrodes, and are connected to the IC by wiring. Then, after the glass is removed, the IC is bonded and connected to an FPCB (Flexible Printed Circuit Board) (not shown) and can be controlled by a controller provided in the FPCB.

The upper pad portion 2350 may be formed on the second buffer layer 220 and may be divided into two portions adjacent to the portion where the lower substrate 1000 is relatively protruded as shown in FIG. In the upper pad units 2350 formed in a divided manner, one of the two outlines is divided into a plurality of upper electrodes for applying or detecting voltages of the first electrodes in the X-axis direction among the touch electrode arrays, And a plurality of upper electrodes for applying or detecting voltages of the second electrodes in the Y-axis direction. In some cases, the pad portion 2350 may be located only on one side protruding from the cover window 3000, as shown in FIG.

The conductive ball 455 connected to the upper pad portion 2350 is electrically connected to a lower electrode (not shown) formed on the outer side of the thin film transistor array 140. The connection structure of the upper pad portion 2350 and the lower electrode will be described later.

2, an organic light emitting display according to an exemplary embodiment of the present invention includes a lower substrate 1000, a first substrate 120 and a first buffer layer 130 sequentially formed on the lower substrate 1000, A thin film transistor array 140 having pixels formed in a matrix on the first buffer layer 130 and having thin film transistors for each pixel; an organic light emitting array 150 connected to the thin film transistors of the pixels; A protective layer 160 covering the thin film transistor array 140 and the organic light emitting array 150 except for the protective layer 160 and a touch electrode array 230 adhered to the protective layer 160 through an adhesive layer 400, And a cover glass 3000 disposed on the second substrate 210 and including a second buffer layer 220 and a second substrate 210 sequentially formed on the touch electrode array 230.

Here, the cover glass 3000 may be adhered to the second substrate 210 with a separate adhesive layer, or may be attached to the second etch stop layer 210 using mechanical or other methods. It may be placed on the upper side.

The cover glass 3000 serves to prevent and protect the inner array from damage due to the user's direct touch operation. However, in some cases, the cover glass 3000 may not be provided.

The thin film transistor array 140 includes gate lines, data lines, and thin film transistors formed at intersections of the gate lines and the data lines. The lower pad portion forms a pad portion metal (lower electrode) in the gate line and the data line forming process.

The organic light emitting array 150 includes at least a first electrode formed on the pixel, a second electrode formed on an upper layer spaced apart from the first electrode, and an organic light emitting layer formed between the first electrode and the second electrode. Here, the first electrode may be connected to the drain electrode of the thin film transistor.

The first buffer layer 130 and the second buffer layer 220 are provided to prevent oxygen or moisture infiltration from occurring in the organic layers provided in the organic light emitting array 150. For example, It is possible to minimize the permeation of outside air or moisture.

The first buffer layer 130 and the second buffer layer 220 are formed of a plurality of inorganic layers. For example, the plurality of inorganic films may consist of a continuous lamination or an alternating lamination of SiNx or SiO2. The total thickness of each of the first and second buffer layers 130 and 220 is preferably not more than 1 mu m so as not to increase the thickness of the display device.

3 is an enlarged plan view of portion A of Fig.

3, the touch electrode array 230 according to an exemplary embodiment of the present invention includes a first touch electrode 2331 and a second touch electrode 2332 which intersect with each other, 2331, and 2332, respectively. The upper electrode 2351b is formed on the upper pad portion 2350 and the upper electrode 2351b may be connected to the lower electrode formed on the lower pad region (or the pad portion) of the thin film transistor array.

Here, the first and second touch electrodes may include a first electrode pattern 2331 in an island shape, which is physically spaced apart from the first electrode pattern 2331 in a first direction, And a metal bridge 231 for electrically connecting the first electrode patterns 2331. The second touch electrodes are arranged in a direction crossing the first direction and the same as the first electrode patterns 2331 And a connection pattern 2332c connecting the second electrode patterns 2332 of the first electrode pattern 2332 and the second electrode patterns 2332 adjacent to the second electrode pattern 2332 integrally.

Outside the display area A / A, there are provided routing lines 231b and 231c which are provided in the y-axis direction and connect the touch electrodes provided on the touch electrode array 230 to the upper pad unit 2350 have.

4 is a cross-sectional view illustrating a pad region including an upper pad portion and a lower pad portion, a display region (A / A), and a dam. As described above, the lower substrate 1000 and the cover window 3000 may be disposed on one side of the first and second substrates 120 and 210, but they will be omitted for the convenience of explanation.

On the buffer layer 130, a thin film transistor array 140 including a plurality of thin film transistors is formed. The thin film transistor has a semiconductor layer 104 including source and drain regions 109a and 109b on both sides thereof, a gate insulating film 106 covering the semiconductor layer 104, A gate electrode 102 positioned on the insulating film 106 and a first lower passivation layer 112 including contact holes and exposed on the first buffer layer 130 such that source / drain regions 109a and 109b are exposed. And a source electrode 108 and a drain electrode 110 connected to the source / drain regions 109a and 109b. The second lower passivation layer 114 is located on the source electrode 108 and the drain electrode 110 of the thin film transistor.

The organic light emitting array 150 includes a contact hole for etching a part of the lower passivation layer 114 to expose a portion of the drain electrode 110 and a first electrode 116 contacting the drain electrode 110 through the contact hole, A bank layer 124 defining an opening for exposing the first electrode 116 and a positive spacer 126 and an inverse spacer 128 positioned on the bank layer 124, An organic layer 118 including a light emitting layer formed on the first electrode 116 and a second electrode 120 formed on the organic layer 118. A protective layer 160 is disposed on the organic light emitting array 150. The protective layer 160 has a structure in which at least one inorganic material layer and an organic material layer are stacked so as to cross each other, thereby blocking the organic light emitting array 150 from external moisture and the like. However, the protective layer 160 is not limited thereto.

The reverse spacer 128 is formed in an inverted trapezoidal shape (reverse tapered) in cross section. When the inverse spacer 128 is formed on the bank layer 124, the organic layer 118 is not deposited on the side of the inverse spacer 128 and the point where the inverse spacer 128 and the bank layer 124 are in contact with each other , The continuity of the organic layer 118 is partially broken. The passivation layer 160 is formed in a region where the continuity of the organic layer 118 is broken and the passivation layer 160 is formed at a position where the inverse spacer 128 and the bank layer 124 are in contact with each other and the inverse spacer 128 And has an effect of fixing the organic layer 118 because of its excellent adhesion to the side surface. Therefore, when the peeling of the organic layer 118 progresses, the reverse spacer 128 blocks the diffusion of peeling and consequently has an effect that the adhesion of the organic layer 118 is improved.

The touch electrode array 230 includes first and second touch electrodes 2331 and 2332 formed on a buffer layer 220 and a contact hole exposing a portion of the first touch electrode 2331 A first upper passivation layer 232 is formed and then a bridge 231 connecting adjacent first touch electrodes 2331 is formed through the contact hole and a second upper passivation layer 234 is formed thereon Structure, but it is not necessarily limited thereto. The touch electrode array 230 thus formed has a structure in which the touch electrode array 230 is adhered to the protective layer 160 with the adhesive layer 400 interposed therebetween. Accordingly, in the actual display device, the above-described touch electrode array 230 has a vertically inverted structure.

A lower electrode 1081 is formed on the first buffer layer 130 of the pad region P / A. The lower electrode 1081 may be formed on the first lower passivation layer 112 and may be formed to expose the lower electrode 1081 by removing a part of the second lower passivation layer 114, It is not. The lower electrode 1081 may be formed simultaneously with the same material as the gate electrode 102 of the display area A / A or simultaneously with the same material as the source / drain electrodes 108 and 110.

An upper electrode 2351 is formed on the second buffer layer 220 of the pad region P / A. An upper electrode 2351 is formed on the first upper passivation layer 232 and a portion of the second upper passivation layer 234 located on the upper electrode 2351 is removed to expose the upper electrode 2351 But is not limited thereto. Since the upper electrode 2351 has a vertically inverted structure, the upper electrode 2351 is located under the first upper passivation layer 232 in the bonded structure.

The lower electrode 1081 and the upper electrode 2351 are electrically connected by a seal member 450 including a conductive ball 455. The upper electrode 2351 receives a touch signal from the lower electrode 1081. The touch signals are supplied to the touch electrodes 2331 and 2332 through the routing line 231b. At this time, the routing line 231b and the touch electrodes 2331 and 2332 may be formed in different layers and electrically connected through the contact holes, but the present invention is not limited thereto.

At least one dam 2300 is positioned between the display area A / A and the pad area P / A. The dam 2300 prevents the adhesive for forming the adhesive layer 400 applied to the protective layer 160 on the organic light emitting array 150 from overflowing to the pad portion P / A.

The dam 2300 may also be formed in a non-display area on the lower outer side of the display area A / A. A plurality of display areas may be defined on one lower substrate when the organic light emitting display is formed. For example, a plurality of thin film transistor arrays 140 and an organic light emitting array 150 are formed on one lower substrate, a plurality of touch electrode arrays 230 are formed on one upper substrate, Each of the display panels is scribed to complete a plurality of display panels. Accordingly, the pad region P / A may be positioned adjacent to the lower side of the upper and lower display panels, and the adhesive may flow over to the pad region P / A of the adjacent display panel.

The dam 2300 formed in the non-display area on the lower outer side of the display area A / A prevents the adhesive from flowing over the pad area P / A of the adjacent display panel.

The dam 2300 may be formed in multiple layers as shown in FIG. 1 to more effectively prevent the adhesive from overflowing. At this time, the dam 2300 is linearly formed in a horizontal direction. At this time, the dam 2300 is provided at a position corresponding to the bezel region of the display apparatus. At this time, since the bezel can not be expanded indefinitely, the number of the dam 2300 formed can be determined according to the design within the bezel thickness range. At this time, when the dam 2300 has a 2-5 structure, the adhesive can be prevented from overflowing and the thickness of the bezel can be minimized.

According to one embodiment of the present invention, the dam 2300 may be formed to have a two-layer structure. In more detail, the dam 2300 may have a two-layer structure of a lower layer 2301 and an upper layer 2302. The lower layer 2301 may include the same material as the bank layer 124 and may be formed using the same mask as that used when the bank layer 124 is formed. The upper layer portion 2032 may include the same material as the positive spacer 126 and may be formed in the same process as the process of forming the positive spacer 126. [ By forming the dam 2300 at the same time with the same material as the bank layer 124 or the positive spacer 126 as described above, the dam 2300 having a specific height (or thickness) or more (for example, Can be completed.

5 is a sectional view for explaining a dam 3300 according to another embodiment of the present invention. As in FIG. 4, at least one dam 3300 is positioned between the display area A / A and the pad area P / A. In FIG. 5, other components than the dam 3300 are the same as those in FIG. 4, so that descriptions of other components than the dam will be omitted.

The dam 3300 according to another embodiment of the present invention includes a lower layer portion 3301, an intermediate layer portion 3302, and an upper layer portion 3303. The upper layer 3303 of the dam 3300 may have a reverse taper structure like the reverse spacer 128 disposed in the display area A / A. The shape of the dam 3300 is not limited to the above embodiment, but may be formed in a two-layer structure of a lower layer portion 3301 and an upper layer portion 3303, and in some cases, it may be formed as a reverse spacer- .

5, the lower layer portion 3301 of the dam 3300 may be formed simultaneously with the same material as the bank layer 124, and the middle layer portion 3302 may be formed simultaneously with the same material as the positive spacer 126 And the upper layer 2303 may be formed simultaneously with the same material as the reverse spacer 128. If the lower layer portion 3301, the middle layer portion 3302 and the upper layer portion 3303 are formed simultaneously with the same material as the bank layer 124, the spacer 126 and the inverse spacer 128, 3300 can be formed. However, the method of forming the dam 3303 is merely an example, and is not limited thereto.

The dam 3300 including the inverted spacer-like structure is narrower in width than the upper portion of the upper layer portion 3303. Therefore, when the adhesive layer 400 is overflowed from the dam 3300 closest to the display area A / A, a larger space for accommodating the adhesive layer 400 can be secured. Therefore, the dam including the reverse spacer or the inverted tapered structure according to the present invention can obtain a better adhesive layer overflow prevention effect than the conventional dam.

When the upper layer 3303 is simultaneously formed of the same material as the inverse spacer 128 of the display area A / A as described above, the height of the dam 3303 can be further increased without requiring an additional mask. The dam 3300 according to the embodiment including the lower layer portion 3301, the middle layer portion 3302 and the upper layer portion 3303 has a height corresponding to the bank layer 124, the positive spacer 126 and the reverse spacer 128 So that it is possible to form the dam 3300 having a specific thickness (for example, 4 μm or more) without additional processing. Therefore, the dam 3300 has an excellent adhesive overflow prevention effect, which is greatly superior to the conventional one without adding a process.

6 is a sectional view for explaining a dam 4300 according to another embodiment of the present invention. 4, at least one dam 4300 is positioned between the display area A / A and the pad area P / A. 5, the other components than the dam 3300 are the same as those in FIG. 4, so that the description of other components is omitted.

The protective layer 460 may include at least one inorganic layer and an organic layer. 6, the protective layer 460 overlies the organic light emitting array 150, the positive spacers 126, the inverse spacers 128, and the bank layer 124, which are located on the display area A / A. As shown in FIG. The first protective layer 461 may be made of an inorganic material. A second protective layer 462 made of an organic material is disposed on the first protective layer 461. A third passivation layer 463 is disposed on the second passivation layer 462 to overlap the first passivation layer 461 and the second passivation layer 452. The third passivation layer 463 may be made of the same material as the first passivation layer 461.

The protective layer 460 shown in FIG. 6 includes two inorganic layers 461 and 463 and one organic layer 462, but is not limited thereto. For example, the protective layer may be configured to include two or more organic layers and three or more inorganic layers, in which the inorganic layer and the organic layer are alternately stacked. In order to effectively prevent moisture permeation from the outside, the uppermost layer of the protective layer 460 is preferably an inorganic layer.

The dam 4300 according to another embodiment of the present invention according to FIG. 6 includes a lower layer 4301, an intermediate layer 4302, an upper layer 4303, and a top layer 4304. The lower layer portion 4301 may be formed simultaneously with the same material as the bank layer 124. The middle layer portion 4302 may be formed simultaneously with the same material as the positive spacer 126 and the upper layer portion 4303 may be formed with the reverse spacer 128 And the uppermost layer 4304 may be formed simultaneously with the same material as the first protective layer 461.

Meanwhile, the uppermost layer 4304 may be formed by the same process as that for forming the first passivation layer 461 and the third passivation layer 463, which are inorganic layers. That is, the uppermost layer 4304 may be formed on the upper layer 4303 by the thickness of the first protective layer 461, and then may be further formed by the thickness of the third protective layer 463. When the protective layer 460 includes N (N is a natural number) inorganic layers, the thickness of the top layer 4304 corresponds to the total thickness of the N inorganic layers provided in the protective layer 460 .

Although the dam 4300 shown in Fig. 6 includes four layers, it is not limited thereto. For example, at least one of the lower layer portion 4301, the middle layer portion 4302, the upper layer portion 4303, and the uppermost layer 4304 shown in FIG. Thus, the dam 4300 according to an embodiment of the present invention has an excellent adhesive overflow prevention effect even without a separate mask or process for forming the dam 4300. [

7 is a plan view for explaining a dam according to another embodiment of the present invention.

The protective layer 560 shown in FIG. 7 may be the same as the protective layers 160 and 460 shown in FIGS. 2 and 4 to 6. In particular, referring to FIG. 7, the protective layer 560 includes an inorganic layer 561. As described above, the protective layer 560 may include a plurality of inorganic layers. The protective layer 560 is formed to be larger than the display area A / A to completely cover the display area A / A and cover the edge of the display area A / A, Prevent entry.

The dam region 5300 includes at least one dam. That is, the dams 2300, 3300, and 4300 shown in FIGS. 1 and 3 to 6 may be formed in the dam region 5300. In the dam region 5300, inorganic layers 3304 and 5304 are included. The inorganic layers 3304 and 5304 are made of the same material as the inorganic layer 561 included in the protective layer 560 and can be formed in the same process. 7, the inorganic layers 3304 and 5304 included in the dam region 5300 and the inorganic layer 561 included in the protective layer 560 are spaced apart from each other without overlapping in a plan view . When the inorganic layers 3304 and 5304 included in the dam region 5300 and the inorganic layer 561 included in the protective layer 560 are connected to each other, moisture permeates into the organic light emitting array 150, Can be reduced. Accordingly, the inorganic layers 3304 and 5304 included in the dam region 5300 are formed separately from the inorganic layer 561 included in the protective layer 560 formed to cover the display region A / A.

7, the inorganic layer 5304 of the uppermost layer of the dam region 5300 (corresponding to the upper side of the lower substrate 1000) adjacent to the sealant 450 and the non-display region (Corresponding to the lower side of the substrate 1000) are shown to be spaced apart from each other. In this case, the inorganic material layer 3304 corresponding to the lower side may have the same lamination structure as the inorganic material layer 5304 corresponding to the upper side. The inorganic material layer 5304 of the dam region 5300 adjacent to the sealing material 450 and the inorganic material layer 3304 corresponding to the lower side of the lower substrate 1000 may be bonded to each other in consideration of the spreading property of the adhesive agent 400 Or may have a different layer structure.

The inorganic layer 561 of the protective layer 560 is formed on both sides of the lower substrate 1000 apart from the inorganic layer 561 of the protective layer 560 formed so as to cover the display area A / A dam region 5300 may be provided in the form of a closed loop on the outer side of the protective layer 560. [ The dam area in the form of a closed loop is also spaced apart from the protective layer 560 so that the independent sealing function of the protective layer 560 inside the dam area 5300 can be ensured.

The organic light emitting display device having the dams 2300, 3300, and 4300 according to the present invention as described above has an overflow prevention function when the adhesive for forming the adhesive layer 400 is applied. Therefore, when the adhesive is applied, Not only the possibility of application is reduced but also the adhesive is prevented from overflowing with the pad portion P / A when an excessive amount of adhesive is applied, thereby preventing the contact failure of the lower electrode of the pad portion P / A.

In addition, the organic light emitting display according to the present invention can reduce the possibility of overcoating of the lower substrate, thereby preventing scattering of foreign matter when the lower substrate and the upper substrate are removed during the overcoating process. In addition, since the adhesive does not overflow in the manufacturing process, the lower substrate and the upper substrate can be directly adhered to the adhesive layer to prevent the lower substrate and the upper substrate from being removed.

Hereinafter, a method of manufacturing an organic light emitting diode display according to the present invention will be described with reference to FIGS. 8A to 8F.

Referring to FIG. 8A, a first buffer layer 130 is formed on a lower substrate 1000 and a first substrate 120, and a semiconductor layer 104 is formed on the first buffer layer 130. At this time, the buffer layer 130 and the semiconductor layer 104 are formed using a deposition method such as PECVD (Plasma Vapor Deposition). Then, the semiconductor layer 104 is patterned through a photolithography process and an etching process.

Next, an inorganic insulating material is deposited on the lower substrate 1000 including the semiconductor layer 104 through a deposition method such as PECVD, thereby forming the gate insulating film 106. Next, as shown in FIG. At this time, the gate insulating film 106 may extend to the pad region P / A as well as the display region A / A. A metal layer is deposited thereon by a method such as sputtering and is patterned by a photolithography and etching process to form the gate electrode 102.

The source and drain regions 109a and 109b are formed by implanting impurities into the both sides of the semiconductor layer 104 through ion implantation or the like using the gate electrode 102 as a mask.

Referring to FIG. 8B, a first lower passivation layer 112 is formed on a lower substrate 1000 including a gate electrode 102 and a semiconductor layer 104 through a deposition method such as PECVD. A contact hole is formed in the first lower passivation layer 112 to expose the source / drain regions 109a and 109b through a photolithography process and an etching process. At this time, the first lower passivation layer 112 may also extend to the pad region P / A.

Then, a metal layer for forming the source electrode 110 and the drain electrode 108 is deposited by a method such as sputtering. As the source / drain metal layer, molybdenum (Mo), molybdenum tungsten (MoW), copper (Cu), or the like is used. The source / drain metal layer is patterned by a photolithography process and an etching process, thereby forming a source / drain electrode pattern including the source electrode 110 and the drain electrode 108. At the same time, the lower electrode 1081 is formed in the pad region P / A. Meanwhile, the lower electrode 1081 may be formed by the same process as the gate electrode 102.

Referring to FIG. 8C, on the first lower passivation layer 112, a second lower passivation layer 114 including a contact hole 122 is deposited. At this time, the second lower passivation layer 114 may be formed of an organic insulating material such as acrylic by spin coating or spinless coating. A contact hole 122 exposing the drain electrode 110 is formed in the second passivation layer 114 by a photolithography process and an etching process.

Referring to FIG. 8D, a first electrode 116 is formed on the second lower passivation layer 114.

Specifically, the first electrode 116 may be formed of an opaque conductive material such as aluminum (Al) or a transparent conductive material such as ITO on the second lower passivation layer 114 by a deposition method such as sputtering. The first electrode 116 is electrically connected to the drain electrode 110 of the thin film transistor.

Then, a bank layer 124 is formed on the first electrode 116. The bank layer 124 includes openings such that a portion of the first electrode 116 is exposed. At this time, the lower layer portion 4301 (corresponding to 2301 and 3301 in FIGS. 4 and 5) may be formed simultaneously with the same material as the bank layer 124 in the pad region P / A.

Specifically, the bank layer 124 is formed on the entire surface of the lower substrate 1000 on which the first electrode 116 is formed by applying a photosensitive organic insulating material on the entire surface of the lower substrate 1000 through a coating method such as spin-spin coating or spin coating. By patterning the bank layer 124 by a photolithography process and an etching process, an opening and a lower layer portion 4301 for exposing the first electrode 116 are formed.

The organic insulating layer for forming the spacers is formed on the bank layer 124 and the opening through a coating method such as spin-spin or spin coating in the same manner as the bank layer 124 to form a spacer. The positive insulating spacer 126 is formed by patterning the organic insulating layer by a photolithography process and a patterning process. At this time, the middle layer portion 4302 (corresponding to 2302 and 3302 in FIGS. 4 and 5) may be formed simultaneously with the same material as the spacer 126 in the pad region P / A.

Then, an inverse spacer 128 is formed on the bank layer 124 in the region where the spacer 126 is not formed. The inverse spacer 128 may be formed by applying a light-sensitive organic insulating material to form an organic insulating layer as described above, and patterning it by a photolithography process and a patterning process. At this time, an upper layer 4303 (corresponding to 3303 in FIG. 5) may be formed simultaneously with the same material as the inverse spacer 128 in the pad region P / A.

Referring to FIG. 8E, an organic layer 118 and a second electrode 120 are sequentially formed on a lower substrate 1000 on which a bank layer 124 defining an opening is formed.

An organic layer 118 including an electron injection layer (EIL), an electron transport layer (ETL), a light emitting layer, a hole transport layer (HTL), and a hole injection layer (HIL) is formed on the first electrode 116 by a thermal deposition method, Or a combination thereof. The organic layer 118 includes a plurality of organic light emitting layers as a minimum unit, and a common layer such as an electron transporting layer and a hole transporting layer may be formed on the upper and lower portions of the organic layer 118. In some cases, A charge generation layer and / or a common layer may be further provided between the organic light emitting layer layers.

Thereafter, the second electrode 120 is formed on the substrate 100 on which the organic layer 118 is formed.

The second electrode 120 may have a multi-layer structure using a transparent conductive material or a metal material, or may have a multi-layer structure using a transparent conductive material and a metallic material.

Then, a protective layer (see 460 in FIG. 8F) is formed on the second electrode 120 and at a position corresponding to the display area A / A. The protective layer 460 has a structure in which at least one inorganic film and an organic film are crossed and laminated, and may be formed by an ALD (Atomic Layer Deposition) method or the like.

Referring to FIG. 8E, a first passivation layer 461 made of an inorganic material is formed on the second electrode 120. At the same time, the uppermost layer 4304 is formed of the same material as the first protective layer 461 in the pad region P / A. Since the uppermost layer 4304 is formed by the same process as the first protective layer 461, the thickness of the uppermost layer 4304 and the thickness of the first protective layer 461 may be the same. As shown in FIG. 8E, the inorganic layer constituting the uppermost layer 4304 may be independently formed in each of the plurality of dams 4300, but is not limited thereto. For example, the inorganic layer constituting the uppermost layer 4304 is formed so as to cover the upper layer 4303 of the plurality of dams 4300 at a time, and also on the upper part of the second lower passivation layer 114 between the dams 4300 .

Next, referring to FIG. 8F, a second passivation layer 462 is formed on the first passivation layer 461. The second passivation layer 462 is made of an organic material and functions to flatten the top of the first passivation layer 461. The thickness of the second protective layer 462 is preferably larger than the diameter of the fine particles managed in the process so as to cover the fine particles introduced in the process of the organic light emitting array 150 and the like. The second protective layer 462 may be a polymer. The second passivation layer 462 covers at least the display area A / A and lies on the inner side of the first passivation layer 461 in a plan view.

Next, a third passivation layer 463 is formed on the second passivation layer 462. The third protective layer 463 may be made of an inorganic material such as the first protective layer 461. At the same time, the uppermost layer 4304 can be formed thicker with the same material as the third protective layer 463 in the pad region P / A. Since the uppermost layer 4304 is formed by the same process as the first and third protective layers 461 and 463, the thickness of the uppermost layer 4304 is different from the thickness of the first protective layer 461 and the thickness 463) of the first and second layers. On the other hand, the inorganic layer may not be formed in the pad region P / A during the formation of the third passivation layer 463. In this case, as shown in FIG. 6, the thickness of the uppermost layer 4304 may be the same as the thickness of the first protective layer 461.

As described above, since each layer constituting the dam 4300 is formed in the same process as the layer disposed on the display area A / A, the height of the dam 4300 can be increased more . Therefore, the dam 4300 of the present invention has an excellent adhesive overflow prevention effect even without a process to be added as compared with the prior art.

Next, as shown in FIG. 8G, a touch electrode array 230 is formed on an upper substrate (not shown). A first upper passivation layer 232 is formed on the first and second touch electrodes 2331 and 2332 and a bridge 231 is provided between the first touch electrodes 2331. Also, the upper pad electrode 2351 and the routing line 231b of the pad region P / A may be formed simultaneously with the same process as that of the bridge 231. [ A second upper passivation layer 234 is formed on the entire surface of the upper substrate including the upper pad electrode 2351 and a second upper passivation layer 234 is formed on the upper pad electrode 2351 of the pad region P / Exposed.

Then, as shown in FIG. 8H, the lower substrate 1000 and the upper substrate are bonded together by facing each other. At this time, the lower electrode 1081 and the upper electrode 2351 of the pad region P / A are joined together by the sealing material 450 including the conductive ball 455, and the display region A / A is bonded to the adhesive layer 400 As shown in Fig.

A plurality of these display panels may be formed on one lower substrate 1000. In this case, the display panel is separated through the scribing process.

Finally, the lower substrate 1000 and the upper substrate are removed by laser irradiation. In some cases, a cover window 3000 may be attached to the area where the upper substrate is positioned, and a film substrate may be further attached to the area where the lower substrate 1000 is located. Meanwhile, the first and second substrates 120 and 210 may serve as the film substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

1000: lower substrate 120: first substrate
130: first buffer layer 140: thin film transistor array
150: organic light emitting array 160, 460: protective layer
112: first lower passivation layer 114: second lower passivation layer
1081: lower electrode 2351: upper electrode
2300, 3300, 4300: dam 2301, 3301, 4301: lower layer
2302, 3302, 4302: middle layer portion 2301, 3303, 4303: upper layer portion
400: adhesive layer 124: bank
126: positive spacer 128: reverse spacer
232: first upper passivation layer 234: second upper passivation layer

Claims (21)

A substrate defined by a display portion and a non-display portion,
A thin film transistor array positioned on a display portion of the substrate,
An organic light emitting array positioned on the thin film transistor array,
A touch electrode array bonded to the organic light emitting array through an adhesive layer,
A pad portion located at a non-display portion outside the display region and including a plurality of pad electrodes for supplying a touch signal to the touch electrode array;
And a dam disposed on the non-display portion and including a plurality of dams, wherein the dam includes at least two or more material layers. The method according to claim 1,
Wherein the dam is positioned in a first non-display portion having the pad portion. 3. The method of claim 2,
Wherein the dam is positioned between the display portion and the pad portion. 3. The method of claim 2,
And the dam is further located in the second non-display portion without the pad portion. 5. The method of claim 4,
And the second non-display portion faces the first non-display portion with the display portion interposed therebetween. The OLED display of claim 1, wherein the dam extends in one direction in a reverse tapered shape and is spaced apart from the display unit so as not to overlap with the display unit. The method according to claim 6,
Wherein the dam includes a plurality of dams spaced from each other and arranged parallel to each other. The method according to claim 1,
The organic light-
A first electrode connected to a source or a drain electrode of the thin film transistor provided in the thin film transistor array,
A bank layer that defines a pixel region of the organic light emitting array and exposes the first electrode,
A spacer located on the bank layer or an inverse spacer having a reverse taper shape,
An organic layer including a light emitting layer disposed on the first electrode,
And a second electrode disposed on the organic layer. 9. The method of claim 8,
Wherein the dam includes a lower layer portion and an upper layer portion,
Wherein the lower layer portion includes the same material as the bank layer and is formed simultaneously with the bank layer,
Wherein the upper layer includes the same material as the spacer or the reverse spacer and is formed simultaneously with the spacer or the reverse spacer. A substrate defined by a display portion and a non-display portion,
A thin film transistor array positioned on a display portion of the substrate,
An organic light emitting array positioned on the thin film transistor array,
An encapsulating layer located on the organic light emitting array,
An adhesive layer positioned on the sealing layer,
A pad portion including a plurality of pad electrodes located in a non-display portion outside the display portion,
And at least one dam located in the non-display portion,
Wherein the dam includes a lower layer portion and an upper layer portion, and the upper layer portion or the lower layer portion has a reverse tapered structure. 11. The method of claim 10,
Wherein the lower layer portion includes an organic material, and the upper layer portion includes an inorganic material. 12. The method of claim 11,
Wherein the upper layer includes a plurality of inorganic layers made of different inorganic materials. 12. The method of claim 11,
Wherein the sealing layer includes an inorganic sealing layer made of an inorganic material, and the inorganic encapsulating layer and the upper layer are spaced apart from each other so as not to overlap with each other. 11. The method of claim 10,
The non-display portion includes a first non-display portion and a second non-display portion, the first non-display portion includes the pad portion, and the second non-display portion faces the first non- In addition,
Wherein the dam includes a first dam portion positioned between the pad portion and the display portion. 15. The method of claim 14,
And the dam further comprises a second dam positioned at the second non-display portion. 11. The method of claim 10,
The organic light-
A first electrode connected to a source or a drain electrode of the thin film transistor provided in the thin film transistor array,
A bank layer that defines a pixel region of the organic light emitting array and exposes the first electrode,
A positive spacer located on the bank layer and an inverse spacer having an inverted taper shape,
An organic layer including a light emitting layer positioned on the first electrode, and
And a second electrode disposed on the organic layer. 17. The method of claim 16,
And the lower layer portion of the dam is made of the same material as the bank layer. 17. The method of claim 16,
Wherein the upper portion of the dam has a reverse tapered structure and is made of the same material as the reverse spacer. 19. The method of claim 18,
Wherein the dam further comprises an inorganic material layer on the upper layer. 17. The method of claim 16,
Wherein the dam further comprises an intermediate layer between the lower layer portion and the upper layer portion. 21. The method of claim 20,
Wherein the middle layer is made of the same material as the positive spacers.

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