KR20180034092A - Reflective display device using plasmonic and method for manufacturing the same - Google Patents

Abstract

According to the present invention, a reflective display device using plasmon forms a plasmonic layer in which a plurality of mesh holes are provided on a low reflectivity substrate, thereby actively adjusting a wavelength of red, green, and blue colors without a color filter.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflective display device using a plasma-

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a display device, and more particularly, to a reflective display device using plasmonic and a method of manufacturing the same.

The R, G, B (or CMY) color of a conventional liquid crystal display is determined through a color filter of a subpixel unit.

Since the color filter operates in a dye-based stopband wavelength, the efficiency is about 33%, which is a hindrance to high-efficiency display technology.

In addition, a method of completing one pixel by collecting subpixels adds to the complexity of a display device and causes a reduction in the resolution that can be measured by one pixel size.

As described above, attention has been focused on the development of a color tunable display device in accordance with a voltage change applied to the liquid crystal without a color filter causing a reduction in efficiency.

An object of the present invention is to provide a reflection type display device using plasmonic which can actively control wavelengths of red, green and blue without a color filter, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a reflective display device using a plasmonic device, comprising: a low refractive index substrate; a plasmonic layer disposed on the low refractive index substrate and having a plurality of mesh holes; A liquid crystal layer provided between the low refractive index substrate and the upper substrate, and a liquid crystal layer disposed between the low refractive index substrate and the upper substrate, wherein the liquid crystal layer is provided between the low refractive index substrate and the upper substrate, . ≪ / RTI >

The low refractive index substrate may include an airgel substrate.

The refractive index n of the low refractive index substrate may be 1.01 to 1.4.

A bonding layer may be provided on the edges of the plasmonic layer and the alignment layer.

The bonding layer may be provided between an edge part located on the outer periphery of the plurality of mesh holes of the plasmonic layer and an edge part of the alignment film overlapping the edge part.

The bonding layer may be provided between four corner portions of edge portions located on the outer periphery of a plurality of mesh holes of the plasmonic layer and four corner portions of the edge portion of the alignment film overlapping the corner portions.

In addition, the liquid crystal layer may include a liquid crystal material having a birefringence reflective index.

The mesh hole may include a two-dimensional hole shape, a sinusoidal well, a three-dimensional hole shape (i.e., a 3D hole array, a recessed hole array, a protruding hole array, And may be in the form of a 1D grating hole.

According to another aspect of the present invention, there is provided a method of manufacturing a reflective display device using a plasmonic method, comprising: forming a plurality of nanospheres on a silicon substrate; Forming a plurality of mesh holes in the plasmonic layer by removing the nanospheres and a portion of the plasmonic layer on the nanospheres; Separating the separated plasmonic layer from the silicon substrate; bonding the separated plasmonic layer to a low refractive index substrate; forming a transparent conductive layer and an orientation film on the upper substrate; To form a second layer.

The low refractive index substrate may include an airgel substrate.

The refractive index n of the low refractive index substrate may be 1.01 to 1.4.

And bonding the airgel substrate and the upper substrate by forming a bonding layer on the edges of the plasmonic layer and the alignment layer.

In addition, the silicon substrate may be subjected to oxygen plasma cleaning to produce a natural oxide film on the surface of the silicon substrate.

The forming of a plurality of nanospheres on the silicon substrate may include forming a plurality of first nanospheres of a first size on the silicon substrate, And forming a second nano-spheres having a second size smaller than the first size.

The process of forming the second nano-spheres having a second size smaller than the first size by etching the first nano spheres of the first size may be performed by reactive ion etching, ICP etching, A wet etching method or a wet etching method.

The process of removing the nano spheres and the metal deposition layer on the nano spheres may be performed by a lift off method.

The step of separating the plasmonic layer from the silicon substrate may be performed by wet etching the native oxide layer with a buffered oxide etchant (BOE) solution.

The reflective display device and the method of manufacturing the same using the plasmonic according to the present invention have the following effects.

The reflection type display device using the plastic according to the present invention is characterized in that the change width of the resonance wavelength of the plasmonic layer is a resonance wavelength of a plasmonic layer of at least 170 nm capable of producing red, green, It is possible to realize a reflection type color display device because it can be implemented by extending the range of variation.

Since the refractive index of the airgel substrate is low by using an airgel substrate having a low refractive index at the time of manufacturing a reflection type display device using plasmonic according to the present invention, , The sensitivity of the refractive index difference of the plasmonic layer is increased and the width of the variation of the reflection spectrum is also increased.

Therefore, the reflective display device using the plastic according to the present invention can realize a reflective display and a transparent display capable of controlling active wavelengths of red, green, and blue.

Further, the present invention can realize a full-color reflective display device of an ultra-low power liquid crystal substrate by using an airgel substrate and a plasmonic layer having a low refractive index.

1 is a cross-sectional view schematically showing a reflective display device using a plasmonic according to the present invention.
2 is a perspective view schematically showing a reflection type display apparatus using a plasmonic according to the present invention.
FIG. 3 is a schematic view showing a part of a reflection type display device using a plasmonic according to the present invention, and is an enlarged view showing a bonding structure of an airgel substrate and a plasmonic layer.
4 is a schematic cross-sectional view of a plasmonic layer of a reflection type display device using a plasmonic according to the present invention.
5 is a flowchart illustrating a manufacturing process of a reflective display device using a plasmonic device according to the present invention.
6A to 6H are process drawings showing a manufacturing process of a plasmonic layer and an airgel substrate in a method of manufacturing a reflective display device using plasmonic according to the present invention.
FIG. 7A is a graph showing a change in color when water is dropped on a plasmonic layer on a silicon substrate in a method of manufacturing a reflective display device using plasmonic according to the present invention. FIG.
FIG. 7B is a graph showing a change in color when water is dropped on a plasmonic layer on an airgel substrate in the method of manufacturing a reflective display device using plasmonic according to the present invention. FIG.
FIG. 8 is a graph schematically illustrating a color change according to a change in refractive index of materials in the method of manufacturing a reflective type display device using plasmonic according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a reflective display device using a plasmonic according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The widths and thicknesses of the layers or regions illustrated in the accompanying drawings are exaggeratedly shown for clarity of the description. Like reference numerals designate like elements throughout the specification.

1 is a cross-sectional view schematically showing a reflective display device using a plasmonic according to the present invention.

1, a reflection type display device using a plasmonic according to the present invention includes a low refractive index substrate 110, a plurality of mesh holes 124 (see FIG. 1) disposed on the airgel substrate 110, And an upper substrate 150 disposed opposite to the lower refractive index substrate 110 with a predetermined gap therebetween, and a lower substrate 120 provided on the upper substrate 150, A transparent conductive layer 160 used as a common electrode, an alignment layer 170 disposed on the transparent conductive layer 160 and a liquid crystal layer 170 interposed between the low refractive index substrate 110 and the upper substrate 150. [ Layer 180 as shown in FIG.

Here, the low refractive index substrate 110 may include an airgel substrate. The refractive index n of the low refractive index substrate may be 1.01 to 1.4.

Here, the aerosol substrate is an organic-inorganic material that reduces the extreme brittleness of existing aerogels and improves the elasticity by adding Urea to a silica airgel manufacturing technique based on methyltrimethoxysilane (MTMS) It is made of hybrid airgel material. The material of the airgel is silica, and the transparency is high because air is contained at a high rate. The airgel substrate 110 has a low refractive index with an n value of about 1.079.

In addition, airgel is a sol-gel compound and has generally low density values and high surface area due to the air holes created to dry the wet gel to occupy the bulk of the volume in the aerogels . And, it can be made of various materials, and it can be said as a metastable substance from a thermodynamic point of view. The structure is formed by chemical transformation and then aged in solution and subjected to heat treatment depending on the kind of the material.

The present invention is not necessarily limited to the airgel substrate 110, and can be considered as a substrate if the substrate material has a low refractive index value of 1.0 to 1.4.

On the other hand, a reason why a substrate having a low refractive index, for example, a material having a low refractive index such as airgel, is used as a substrate material will be described as follows.

Thin metal nano-hole array structures can be used to combine the surface plasmon resonance (SPR) effect on the metal surface and the localized surface plasmon resonance (SPR) effect caused by the nano-holes.

The incident light induces an electric excitation of the electric dipole by the nano-holes and causes an anti-symmetric surface plasmon resonance phenomenon that proceeds from the metal surface. In addition, the resonance (SPR) that caused the electric dipole in a single nano hole to act as a source interacts with an electrical dipole induced in a nearby neighboring nano hole, changing the net dipole moment, The radiation properties of the monic structure are determined.

As shown in the above figure, the dipole pattern due to the polarization of the nano-holes of the thin metal (Au) polarized by (-) charge and (+) charge parallel to the direction of the electric field (E- Together, the author is excited.

Among the lifting types of electrons induced on the metal surface, when a substrate is induced in an anti-symmetric SPR mode, a substrate (dielectric constant:? 1) - a thin metal layer (Au: metal, dielectric constant:? 2) (SPR) is induced in all the layers, and the charge induced at the substrate-metal interface and the sensing layer-metal interface, depending on the characteristics of the anti-symmetric pattern, (-) charge, but the magnetic field direction of each of the other layers is opposite.

The surface plasmon resonance intensity (absolute value) induced at the interface between the substrate and the metal and between the liquid crystal layer and the metal is the same (ε1 = ε2) when the materials of the substrate and the liquid crystal layer are equal to each other.

However, when the substrate and the liquid crystal layer material are different from each other, a difference in the SPR intensity occurs due to the refractive index (n), which is the optical property of the material of each layer as described below. The SPR anti-symmetric mode, which occurs when the metal layer is thin, is characterized by higher SPR intensity at the interface between the dielectric with higher refractive index and the metal, and the resonance (SPR) penetration into the metal layer While the loss is reduced as the thickness of the metal layer becomes thinner, thereby forming an asymptote toward a point of zero thickness without a cut-off thickness.

As a result, it is possible to produce a dipole moment from a nano-hole without using a prism or an optical fiber by using nanosphere lithography which can be fabricated on a thin metal layer in a large area, If the dipole moments generated in the neighboring holes of the dielectric layer and the anti-symmetric mode of the induced plasmon resonance are used, the resonance intensity (SPR intensity) is applied to the dielectric layer having a higher refractive index It is possible to design a monic structure.

1, a liquid crystal layer 180 having a refractive index of 1.55 to 1.97, a mesh hole 124 of the plasma-mound layer 120, and a low refractive index substrate having a refractive index of about 1.08, that is, an airgel substrate (SPR intensity) is higher in the interface between the liquid crystal layer 180 and the plasmonic layer 120, which is the dielectric refractive index side with higher SPR intensity, The sensitivity of plasmons increases according to the change of the dielectric refractive index, and the SPR wavelength shift is caused by the increase of the plasmonic sensitivity.

For example, as shown in FIG. 2, when a voltage is applied to a display device, a change in tilt angle of a liquid crystal occurs, and an effective refractive index of a liquid crystal interface at which surface plasmon poles are felt (SPR) with higher intensity reacts more sensitively to this different effective refractive index.

As a result, by applying the principle that the SPR intensity is high in the high refractive index side of the SPR anti-symmetric mode, liquid crystal variable display using plasmonics becomes possible.

The bonding layer 130 may be provided on the edges of the plasma display layer 120 and the alignment layer 170.

The bonding layer 130 may be provided between the edges of the plurality of mesh holes 124 of the plasmonic layer 120 and the edges of the alignment layer 170 overlapping the edge portions . At this time, the bonding layer 130 has a band shape having a rim, and may be disposed integrally with the edge portions of the plasmonic layer 120 and the alignment layer 170.

The bonding layer 130 may have four corner portions located at the outer edges of the plurality of mesh holes 124 of the plasmonic layer 120 and an edge portion of the alignment film 170 overlapping the corner portions. And four corners of the portion. At this time, the bonding layer 130 is formed in four pillar shapes, and these four pillar shapes can be disposed at each corner where the plasmonic layer 120 and the alignment layer 170 are disposed to face each other.

In order for the reflection spectrum of the plasmonic layer 120 to realize red, green, and blue within the refractive index range of the liquid crystal layer 180, a minimum 170 nm wavelength change width is required.

The mesh hole 124 may be a two dimensional hole shape, a sinusoidal well, a three dimensional hole shape (i.e., a 3D hole array, a recessed hole array, a protruding hole array, etc.) , And a 1D grating hole shape.

As the material of the plasmonic layer 120, any one or combination of metal materials including aluminum (Al), silver (Ag), and gold (Au) having a reflection characteristic is used.

The plasmonic constituting the plasmonic metal layer 120 is an abbreviated expression of surface plasmon resonance and resonates with the incident electromagnetic wave energy under a specific condition, In other words, the collective charge density oscillation of the electrons at the interface between the metal and the dielectric, and the generated plasmonic wave propagates along the interface between the metal and the dielectric, or propagates in the localized space it can fluctuate.

The plasmonic layer 120 may express a specific color as a reflection spectrum in order to improve the color luminance of the reflective display and enable high resolution. In particular, the plasmonic layer 120 needs to exhibit high sensitivity to a refractive index difference of the liquid crystal layer in order to increase the wavelength variation width.

Since the electromagnetic field concentration excited by the surface plasmon resonance phenomenon is biased toward the high refractive index medium rather than the low refractive index medium, the advance of the surface plasmon polarizer with the liquid crystal layer 180 The refractive index increases when the substrate is used. That is, even the same plasmonic structure can be designed on a substrate having a lower refractive index to increase the variation width of the resonance wavelength according to a certain refractive index change of the liquid crystal layer 180.

The shape of the mesh holes 124 of the plasmonic layer 120 may include a sinusoidal well, a 3D hole array (including a recessed hole array and a protruding hole array), a two- A 2D planar hole array, and a 1D grating structure.

The plurality of mesh holes 124 in the plastic layer 120 are suitably of a two-circle nano-hole shape optimized for red, green, and blue coloring.

In addition, the liquid crystal layer 180 may be composed of a liquid crystal material having a high birefringence reflective index having an n value ranging from 1.55 to 1.97 according to a voltage change applied to a display device. Particularly, when a high birefringence nematic liquid crystal is used, the color range of the reflection spectrum can be expressed in red, green, and blue within a range of refractive index n = 1.55 to 1.97, .

However, the liquid crystal layer 180 is not limited to a liquid crystal material having a low refractive index, and a conventional liquid crystal material may be used as needed.

2 is a perspective view schematically showing a reflection type display apparatus using a plasmonic according to the present invention.

Referring to FIG. 2, red, green, and blue light is emitted from the upper substrate 150, the transparent conductive layer 160, and the transparent conductive layer 160 in a state where no voltage is applied to the power source 190 of the display device. The liquid crystal layer 180 and the plasmonic layer 120 having the n value of about 1.5 are transmitted through the alignment film 170 and the like to be reflected by the alignment layer 170 and the transparent conductive layer and the upper substrate 150). ≪ / RTI >

At this time, the plasmonic layer 120 reflects green light of a certain wavelength band and absorbs red light and blue light.

On the other hand, when a constant voltage V is applied to the power supply unit 190 of the display device, red, green, and blue light are emitted from the upper substrate 150, the transparent conductive layer 160, Refracted through the high refractive index sub-liquid crystal layer 180 having the n value changed to about 1.97, transmitted through the alignment film 170 and the like, tilted at a certain angle, reflected by the plasmonic layer 120, The transparent conductive layer, and the upper substrate 150, as shown in FIG.

At this time, the plasmonic layer 120 reflects only blue light of a certain wavelength band, and absorbs red light and green light.

Thus, by varying the tilt angle and the refractive index of the liquid crystal layer 180, the wavelength band is actively changed by applying a voltage to the liquid crystal layer 180, thereby changing the wavelength band to various colors such as red, green Green, and Blue.

FIG. 3 is a schematic view showing a part of a reflection type display device using a plasmonic according to the present invention, and is an enlarged view showing a bonding structure of an airgel substrate and a plasmonic layer.

4 is a schematic cross-sectional view of a plasmonic layer of a reflection type display device using a plasmonic according to the present invention.

3 and 4, a plasmonic layer 120 is formed on the airgel substrate 110, and a plurality of mesh holes 124 are formed on the surface of the plasmonic layer 120.

At this time, the interval p between the plurality of mesh holes 124 may be 200 nm to 400 nm, but the present invention is not limited to these ranges and can be designed to be large or small as necessary.

The diameter d of the mesh hole 124 may be 130 to 250 nm, but it is not limited to these ranges and can be designed to be large or small as necessary.

Further, the depth of the mesh hole 124, that is, the thickness t of the plasma monolayer 120 may be 60 nm to 100 nm, but it is not limited to these ranges and can be designed to be large or small as necessary.

A process of manufacturing a reflective display device using the plasmonic according to the present invention will be described with reference to FIG.

5 is a flowchart illustrating a manufacturing process of a reflective display device using a plasmonic device according to the present invention.

Referring to FIG. 5, a method of manufacturing a reflective type display device using plasmonic according to the present invention includes a first step (S102) of preparing a silicon substrate, an oxygen plasma (O ₂ plasma) cleaning A third step S106 of spin-coating the silicon substrate to form a polystyrene beads monolayer, a second step S104 of performing a reactive ion etching a fifth step S110 of depositing a metal material on the silicon substrate including the etched polystyrene beads monolayer to form a plasmonic layer, A sixth step (S112) of removing a polystyrene beads from the monocrystalline layer to form a plurality of mesh holes in the plasmonic layer, and a sixth step (S112) of forming an airgel substrate e) forming an airgel layer on the airgel substrate, a seventh step (S114) of forming the plasma-generating layer on the airgel substrate, an eighth step (S116) of separating the flosmonic layer from the silicon substrate, ).

(S120) of preparing an upper substrate bonded to the airgel substrate so as to oppose to the airgel substrate after the ninth step, an eleventh step (S122) of forming a transparent conductive layer on the upper substrate, A twelfth step (S124) of forming an alignment layer on the entire transparency layer, a thirteenth step (S126) of joining the airgel substrate and the upper substrate at a predetermined interval, (Step S128) of forming a liquid crystal layer in the space of the liquid crystal display panel.

6A to 6H, the fabrication process of the plasmonic layer and the airgel substrate in the method of manufacturing a reflective display device using plasmonic according to the present invention will be described in detail.

6A to 6H are process drawings showing a manufacturing process of a plasmonic layer and an airgel substrate in a method of manufacturing a reflective display device using plasmonic according to the present invention.

Referring to FIG. 6A, a silicon substrate is first prepared, and then the silicon substrate 101 is subjected to O ₂ plasma cleaning or Piranha cleaning. At this time, contaminants on the silicon substrate 101 are cleaned by O ₂ plasma cleaning or Piranha cleaning, and a native oxide layer 102 Can be generated.

Then, O ₂ plasma cleaning or Piranha cleaning is performed to allow the nanospheres to rise well.

6b, a nano spheres 104, for example, polystyrene beads 104 are spin-coated on a silicon substrate 101 to form a single layer Give it up.

Next, referring to FIG. 6C, a reactive ion etching process is performed to reduce the size of the nano-spheres 104 and adjust the size of the finally formed mesh hole (124 in FIG. 6D) do.

Alternatively, the nano-spheres 104 may be formed by a dry etching method or a wet etching method including reactive ion etching and inductively coupled plasma etching (ICP etching).

In addition to the nano-sphere lithography process, the nano-sphere 104 may be patterned using lithography or direct laser writing including e-beam lithography, photolithography, laser interference lithography Laser engraving lithography, block copolymer lithography, self-assembly techniques including anodic aluminum oxide, or imprinting technology.

6D, a metal material is deposited on the silicon substrate 101 including the etched nanospheres 104 using a deposition method including sputter deposition or electron beam (e-beam evaporation) For example, about 100 nm to form a metal layer (not shown). At this time, the metal layer (not shown) is deposited on the upper surface of the silicon substrate 101 and the upper surface of the nano-spheres, and then a part of the metal layer is removed by a lift-off method. The metal layer (not shown) is not limited to the thickness of 100 nm, but may be formed to have a thickness of more than or equal to the thickness.

As described above, since the reactive ion etching process and the metal deposition process can utilize the recipe of the stabilized equipment as it is for the semiconductor process using the conventional silicon substrate, reproducibility and mass productivity can be directly produced on the aerogel substrate Respectively.

In addition, since the silicon substrate is used, the RMS roughness of the silver (Ag) deposited along the RMS roughness value of 0.19 nm of a generally known silicon substrate can be fabricated with an untrasmooth plasmonic structure of about 0.65 nm. In particular, plasmonic metal structures with low RMS roughness values can exhibit plasmonic signals that are about 5 to 7 times stronger than those that are not.

Next, the nanosphere 104 and a metal layer (not shown) on the nanosphere 104 are removed by a lift-off method to form a plasmonic layer 120 having a plurality of mesh holes 124. At this time, the mesh hole 124 is formed with two hole sizes of about 250 nm and 140 nm in order to experimentally examine the influence of the size of the nano hole. However, the mesh hole 124 is not limited to the hole size, but may be formed to an appropriate size as required.

6E, a water soluble gel 106 filled in a container 105 is prepared to form an airgel substrate. In this case, in order to manufacture a substrate having a low refractive index, an airgel material having a low refractive index is applied. However, the present invention is not limited thereto. For example, the low refractive index value may be 1.01-1. 4, < / RTI >

6F, the water-soluble gel 106 is cured in an oven to form a wet gel, followed by ashing and washing, followed by supercritical drying to form an airgel substrate 110 ). At this time, the airgel substrate 110 is formed by adding Urea to a silica airgel manufacturing technique based on methyltrimethoxysilane (MTMS) to reduce the extreme brittleness of existing aerogels and improve the elasticity Organic-inorganic hybrid airgel material. In addition, the airgel substrate 110 has a low refractive index with an n value of about 1.079.

Referring to FIG. 6G, a native oxide layer 102 is wet etched with a buffered oxide etchant (BOE) solution in order to separate the polysilicon layer 120 from the silicon substrate 101. Then, And separates the plasmonic layer 120 provided with the plurality of mesh holes 124 from the silicon substrate 101.

Referring to FIG. 6H, the plasmonic layer 120 is bonded onto the airgel substrate 110.

FIG. 7A is a graph showing a change in color when water is dropped on a plasmonic layer on a silicon substrate in a method of manufacturing a reflective display device using plasmonic according to the present invention. FIG.

FIG. 7B is a graph showing a change in color when water is dropped on a plasmonic layer on an airgel substrate in the method of manufacturing a reflective display device using plasmonic according to the present invention. FIG.

7A and 7B, when the same plasmonic layer 120 as that of the silicon substrate is transferred to the airgel substrate 110, a change in the refractive index of the same surrounding material causes a redshift effect on the plasmonic resonance absorption wavelength, Experimental results show that there is a larger color change than at the top.

Particularly, when the color of the air and the water were tested after the plasma monolayer 120 was bonded onto the airgel substrate (n = 1.08) 110, .

FIG. 8 is a graph schematically illustrating a color change according to a change in refractive index of materials in the method of manufacturing a reflective type display device using plasmonic according to the present invention.

FIG. 8 is a diagram showing a reflection spectrum when the mesh hole 124 of the plasmonic layer 120 is in the form of a two-dimensional hole, in which tristimulus values for a standard observer are applied and colors are represented by RGB values .

8, the spacing p between the mesh holes 124 is 220 nm, the thickness t is 60 nm, and the hole diameter d is 130 nm, respectively, so that the refractive index of the liquid crystal layer 180 (n) in the range of 1.55 to 1.97, the coloring range of the reflection spectrum can be expressed close to R, G and B.

As described above, according to the reflective display device using the plastic according to the present invention and the manufacturing method thereof, there are the following effects.

The reflection type display device using the plastic according to the present invention has a resonance wavelength of a plasmonic layer of at least 170 nm capable of emitting red, green, and blue, It is possible to realize a reflection type color display device because it can be implemented by extending the range of variation.

Since the refractive index of the airgel substrate is low by using an airgel substrate having a low refractive index at the time of manufacturing a reflection type display device using plasmonic according to the present invention, , The sensitivity of the refractive index difference of the plasmonic layer is increased and the width of the variation of the reflection spectrum is also increased.

Therefore, the reflective display device using the plastic according to the present invention can realize a reflective display and a transparent display capable of controlling active wavelengths of red, green, and blue.

Further, the present invention can realize a full-color reflective display device of an ultra-low power liquid crystal substrate by using an airgel substrate and a plasmonic layer having a low refractive index.

The reflective display device using the plasmonic according to the present invention and the manufacturing method thereof have been described with reference to the embodiments shown in the drawings for the sake of understanding. However, it is to be understood that those skilled in the art It will be understood that various modifications and equivalent embodiments are possible. Accordingly, the true scope of the present invention should be determined by the appended claims.

110: Airgel substrate 120: Plasmonic layer
124: mesh hole 150: upper substrate
160: transparency layer 170: alignment layer
180: liquid crystal layer 190: bonding layer

Claims (16)

A low refractive index substrate;
A plasmonic layer disposed on the airgel substrate and having a plurality of mesh holes;
An upper substrate disposed opposite to the airgel substrate with a predetermined gap therebetween;
A transparent conductive layer provided on the upper substrate;
An alignment layer disposed on the transparent conductive layer; And
And a liquid crystal layer provided between the low refractive index substrate and the upper substrate. The reflective display device according to claim 1, wherein the low refractive index substrate is an airgel substrate. The reflective display device according to claim 1, wherein the low refractive index substrate has a refractive index (n) of 1.01 to 1.4. The reflective display device according to claim 1, wherein the plasmonic layer and the bonding layer are provided at the edges of the alignment layer. The reflective display device according to claim 1, wherein the bonding layer is provided between an edge portion located on the outer periphery of a plurality of mesh holes of the plasmonic layer and an edge portion of the alignment film overlapping the edge portion, . The plasma display device according to claim 1, wherein the bonding layer is formed between four corner portions of edge portions located on the outer periphery of the plurality of mesh holes of the plasma-generating layer, and four corner portions of the edge portion of the alignment film overlapping the corner portions A reflective display device using a plasmonic device. 2. The method of claim 1, wherein the mesh hole is a two-dimensional hole, a sinusoidal well, a three-dimensional hole shape (i.e., a 3D hole array, a recessed hole array, And a grating hole (1D grating hole). Cleaning the silicon substrate;
Forming a plurality of nanospheres on the silicon substrate;
Forming a metal layer on the silicon substrate including the nanospheres;
Removing the nano spheres and metal layer portions on the nano spheres to form a plasmonic layer having a plurality of mesh holes;
Separating the plasmonic layer from the silicon substrate;
Bonding the separated plasmonic layer onto a low refractive index substrate;
Forming a transparent conductive layer and an alignment layer on the upper substrate; And
And forming a liquid crystal layer between the upper substrate and the low refractive index substrate. The method as claimed in claim 8, further comprising the step of forming a bonding layer on the edges of the plasmonic layer and the alignment layer to bond the airgel substrate and the upper substrate. The method of claim 8, wherein the low refractive index substrate is an airgel substrate. The method according to claim 8, wherein the low refractive index substrate has a refractive index (n) of 1.01 to 1.4. The method of claim 8, wherein the silicon substrate is subjected to oxygen plasma cleaning to produce a native oxide film on the surface of the silicon substrate. The method of claim 8, wherein forming the plurality of nanospheres on the silicon substrate comprises: forming a plurality of first nanospheres of a first size on the silicon substrate; And forming a second nanosphere having a second size smaller than the first size by etching the first nanospheres of the first nanospheres. 14. The method of claim 13, wherein the process of forming the second nanospheres having a second size smaller than the first size by etching the first nanospheres of the first size is performed using reactive ion etching, (ICP etching) using a plasma etching method or a wet etching method. 9. The method of claim 8, wherein removing the nanospheres and the metal layer over the nanospheres is performed by a lift-off method. The method of claim 8, wherein the step of separating the plasmonic layer from the silicon substrate comprises wet etching the native oxide layer with a buffered oxide etchant (BOE) solution.

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