KR20180012377A - Manufacturing method for microfluidic chip using photomask to laser beam machining - Google Patents

Abstract

Disclosed is a method for manufacturing a microfluidic chip using a laser-processed photomask. The present invention provides a method for manufacturing a microfluidic chip comprising: a) step of emitting a laser beam onto a membrane to manufacture a photomask in a shape that is cut and processed to match a structure of a microfluidic chip; b) step of forming a microfluidic chip mold having a microfluidic chip structure embossed using the photomask; and c) step of applying a curable resin to the microfluidic chip mold and curing the mold to manufacture a replica in which the embossed structure of the microfluidic chip mold is engraved, and mounting the replica on a chip substrate to manufacture the microfluidic chip. Therefore, the method of the present invention can manufacture the microfluidic chip having various shapes at low cost so that commercialization and mass production can be achieved.

Description

TECHNICAL FIELD [0001] The present invention relates to a microfluidic chip manufacturing method using a laser-processed photomask,

The present invention relates to a method of manufacturing a microfluidic chip using a laser-processed photomask.

Microfluidic chip, also called lab-on-a-chip (LOC), is a microfluidic chip capable of performing analysis and synthesis operations while transporting trace amounts of biochemical sample solution. And a micro-chamber.

Therefore, the microfluidic chip can analyze and synthesize the sample quickly and efficiently by injecting a very small amount of the analyte into a small chip. In addition, microfluidic chips have been mainly used for the purpose of separating or analyzing specific components of biochemical and chemical samples at the early stage of development. Recently, however, application fields of microfluidic chip have been expanded by microparticle synthesis and cell culture.

More specifically, a microfluidic chip is a microfluidic chip having a microfluidic channel having a diameter of several tens to several hundreds of micrometers and a structure such as a microchamber. The microfluidic chip is not limited to biochemistry or biological, It is applied to various fields and is being researched and utilized.

Generally, a microfluid chip mold is manufactured by a photolithography process in order to manufacture a microfluidic chip having structures such as micrometer-sized microchannels and fine chambers.

Such a microfluidic chip manufacturing process requires high-clean room facilities and expensive photolithographic processing equipment. That is, in order to fabricate a microfluid chip mold for manufacturing a microfluidic chip, a photomask is mounted to form a micrometer-shaped structure by coating a micrometer-thin photo-sensitizer using a spin coater The UV curing reaction is carried out using an Aligner which is a UV curing apparatus. Then, the microfluidic chip mold is obtained by dissolving and removing unreacted photosensitizer.

However, such a conventional manufacturing process requires high-priced equipment in a high-clean room and requires complicated processes at various stages, so that it is difficult to control and is expensive and is not suitable for mass production.

That is, the conventional microfluidic chip manufacturing process requires high-priced equipment, parts, and materials, and thus has a practical limit and difficulty in mass production since it is expensive to manufacture.

Korean Registered Patent No. 10-1183436 (September 10, 2012) Korean Patent Registration No. 10-1283333 (Feb.

It is an object of the present invention to provide an apparatus and a method for manufacturing a microfluidic chip using a laser-processed photomask capable of manufacturing a microfluidic chip at low cost.

The present invention includes the following embodiments in order to achieve the above object.

The method of manufacturing a microfluidic chip according to an embodiment of the present invention includes a) a step of irradiating a laser beam onto a membrane to form a photomask in a shape corresponding to a structure of a microfluidic chip, B) preparing a fluid chip mold, applying a curable resin to the microfluidic chip mold to cure the microfluidic chip mold to produce a replica in which the embossed structure of the microfluidic chip mold is engraved, and mounting the replica on the chip substrate, And c) fabricating the microfluidic chip using the laser-processed photomask.

In addition, in the above embodiment, the step b) includes a step of b-1) a transparent plate for transmitting ultraviolet rays on the upper surface, and a photomask on the upper surface of the resin reservoir filled with the ultraviolet curable resin; (b-2) after step (b-1), irradiating ultraviolet rays from the upper surface of the photomask to cure the ultraviolet-curable resin, and after step (b-2), unreacted ultraviolet- B-4) removing the photomask, b-3) removing the photomask, and b-4) withdrawing the microfluid chip mold in which the UV-curable resin is cured and embedded in the resin reservoir after the step b-3) . ≪ / RTI >

The present invention has the effect of manufacturing a microfluidic chip which can manufacture a photomask by laser processing the membrane, can be manufactured at low cost, can produce a photomask in various shapes, has various shapes, and can be manufactured at low cost .

Further, since the microfluidic chip can be produced through the photo-curing reaction using the laser-processed photomask and the microfluid chip mold using the laser-processed photomask, the present invention is advantageous for commercialization and mass production by reducing the manufacturing cost .

In addition, the present invention can manufacture a photomask having a curved surface or a three-dimensional shape as well as a flat shape, and can easily manufacture a three-dimensional microfluidic chip using the same.

In addition, according to the present invention, since the microfluid chip mold and the replica are manufactured by the photo-curing reaction, the photomask and the microfluid chip mold can be reused, thereby reducing the manufacturing cost.

1 is a block diagram showing an apparatus for manufacturing a microfluidic chip using a laser-processed photomask according to the present invention
2 is a flowchart showing a method of manufacturing a microfluidic chip using a laser-processed photomask according to the present invention.
3 is a flowchart showing the step S100 of FIG.
FIG. 4 is a view schematically showing each step of FIG. 3. FIG.
5 is a view showing the second embodiment of the photomask in stages.
6 is a view showing the third embodiment of the photomask in steps.
7 is a flowchart showing the step S200 of FIG.
FIG. 8 is a view schematically showing each step of FIG. 7. FIG.
9 is a diagram showing a second embodiment of the step S200.
10 is a flowchart showing the step S300 of FIG.
FIG. 11 is a view schematically showing each step of FIG. 10. FIG.
12 is a view showing microfluidic chips according to the present invention.

Hereinafter, embodiments and examples of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and is not limited to the embodiments and examples described herein.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. Also, the terms " part, " " absent, "and " means" in the specification mean units of a configuration for processing at least one function or operation and may be implemented by a combination of hardware and / .

1 is an apparatus for manufacturing a microfluidic chip using a laser-processed photomask according to the present invention.

Referring to FIG. 1, the present invention provides a method of manufacturing a microfluidic chip including a membrane, a microfluidic chip mold 630 and a working table 11 for supporting a microfluidic chip, a resin supply device for supplying a curable resin, a curing device 13 for curing resin, A laser device for irradiating the membrane with a laser beam, a perforation device for perforating the replica fabricated by the microfluid chip mold 630, and a plasma device 16 for plasma-treating the surface of the replica.

The resin supply device supplies a curable resin. Here, the curable resin is used in the production of the microfluid chip mold 630 and the replica manufacturing process, and is selected from the ultraviolet curable type, the radiation curable type and the heat curable type.

In particular, the ultraviolet curable resin includes an ultraviolet curable polymer and a photocurable initiator including an acrylate functional group and a methacrylate functional group, and the ultraviolet curable polymer is selected from the group consisting of polyethylene glycol methyl ether acrylate, polyethylene glycol diacrylate and hydroxyethyl methacrylate Lt; / RTI >

The photocuring initiator is at least one of 2-hydroxy-2-methylpropiophenone, monoacylphosphine oxide, and bisacylphosphine oxide.

Here, Photocuring The initiator  UV hardening On polymer  About 1 to 3 weight% . (The reason for the above-mentioned numerical limitation To that effect  Please add a description of

The perforation device punctures the replica provided with the engraved portion of the microfluid chip mold 630 to engrave the relief structure. The concrete action will be described later.

The laser apparatus irradiates the laser beam onto a membrane placed on the work table (11) to cut and cut into a microfluidic chip shape.

The plasma apparatus 16 reforms the surface of the replica to have a hydrophilic property by plasma treatment.

Hereinafter, a method for fabricating a microfluidic chip will be described in detail with reference to the accompanying flowcharts.

FIG. 2 is a flowchart showing a method of manufacturing a microfluidic chip using a laser-processed photomask according to the present invention, FIG. 3 is a flowchart showing step S100 in FIG. 1, and FIG. 4 is a schematic view FIG.

Referring to FIGS. 1 to 4, the present invention includes a step S100 of fabricating a photomask 400 by laser processing a thin membrane, a step S100 of fabricating a microfluid chip mold 630 (S200), and fabricating the microfluid chip (A, A ', A' ', see FIG. 12) using the microfluid chip mold 630 manufactured in the step S200.

Step S100 is a step of manufacturing a planar, curved, and three-dimensional shaped photomask 400 using a thin membrane capable of elastic deformation due to bending or warping. Here, the flexible photomask 400 of the present invention is manufactured by laser processing a membrane of ultraviolet non-transmissive material so that it can be mass-produced in a laboratory without a high-clean room or photolithography equipment. This method does not require expensive equipments as compared with the conventional method, and thus it is possible to reduce manufacturing cost of a microfluidic chip. A detailed description will be given later with reference to FIG. 3 to FIG.

In operation S200, the microfluid chip mold 630 having at least one of a flat surface, a curved surface, and a three-dimensional shape is manufactured using the photomask 400 manufactured in operation S100. The microfluid chip mold 630 uses the planar, curved, and three-dimensional shaped photomask 400 manufactured in step S100 to fabricate the microfluid chip mold 630 (see FIGS. 7 to 9). A detailed description will be given with reference to Figs. 7 to 9. Fig.

 In operation S300, the microfluid chip is manufactured using the microfluid chip mold 630 manufactured in operation S200. This will be described later with reference to FIG. 10 to FIG.

First, the step S100 will be described with reference to FIG. 3 to FIG. 3 and 4 show a first embodiment of a photomask 400, FIG. 5 shows a second embodiment of a photomask 400 ', FIG. 6 shows a third embodiment of a photomask 400' Respectively. A first embodiment of the photomask 400 will first be described with reference to FIGS. 3 and 4. FIG.

3 and 4, step S100 of the present invention is a step of manufacturing a flexible photomask 400 by irradiating a laser beam. More specifically, step S100 includes step S110 of installing a membrane 200 on one side of the substrate 100, step S120 of processing the structure of the microfluidic chip by irradiating the membrane 200 with a laser beam, And separating the beam processed membrane 200 from the substrate 100.

Step S110 is a step of installing the membrane 200 on the substrate 100. Here, the membrane 200 is made of a material that does not transmit ultraviolet rays. That is, the membrane 200 is made of at least one of paper, plastic, rubber, and inorganic or organic composite materials, and is preferably made of a material capable of bending or being elastically deformed by bending. This is as shown in Fig. 4 (a).

Here, at least one of the adhesive and the double-sided tape is applied on one surface of the membrane 200 that is in close contact with the substrate 100, thereby enhancing the airtightness of the substrate and the substrate in step S200 described later.

Or the membrane 200 may have an adhesive force after the fabrication of the photomask 400 is completed. It should be noted that the present invention is not limited to any of the various applications that can be modified in the present invention.

Step S120 is a step of irradiating the upper side of the membrane 200 with a laser beam to form a predetermined shape. Here, the membrane 200 is made of an ultraviolet ray non-transmissive material as described above. Thus, the laser device 14 processes the membrane 200 to form a region through which ultraviolet light can be transmitted in the entire region of the membrane 200 where ultraviolet rays are blocked. This is as shown in FIGS. 4 (b) and 4 (c).

4B, the laser device 14 is moved such that the start point and the end point of the laser beam are irradiated with the laser beam, and a part of the membrane 200 is cut to form a micro flow path 210 having a predetermined shape, . Here, the fine flow path 210 has a shape (for example, a structure of a microfluidic chip) of a target structure to be manufactured through the photomask 400, as shown in FIG. 4D.

In addition, the micro channel 210 forms a region through which ultraviolet light is transmitted through the membrane 200 in which ultraviolet light is not transmitted.

In step S130, the membrane 200 on which the micro channel 210 is formed is separated from the substrate 100. The membrane 200 in which the micro channel 210 is formed may be a planar flexible membrane capable of producing a depressed or embossed microfluidic chip mold 630 (see FIG. 8) having a shape conforming to the micro channel 210, And corresponds to the photomask 400.

In addition, as described above, the present invention can manufacture a planar flexible photomask 400, and as another embodiment, it is possible to manufacture photomasks 400 'and 400' 'having a curved surface and a three-dimensional shape. A manufacturing method of the double curved flexible photomask will be described with reference to FIG.

5 is a schematic view showing a second embodiment of the flexible photomask manufacturing step according to the present invention.

Referring to FIG. 5, the curved flexible photomask 400 'is formed by cutting a thin membrane 200 made of a non-transparent ultraviolet material using a laser, similar to the above-described flexible photomask 400 It can be incised to have the shape of the target structure.

To this end, a second embodiment of the present invention includes a curved substrate 100 ', a membrane 200' bonded to a curved substrate 100 ', and a laser device 14' for irradiating a laser beam .

Referring to FIG. 5A, the curved substrate 100 'supports a curved membrane. At this time, it is preferable that the membrane 200 'is made of at least one of paper, plastic, rubber, and inorganic or organic composite material which is a thin ultraviolet ray non-transmissive material and is made of a material capable of bending or being elastically deformed by bending. Accordingly, the membrane 200 'may be bent or bent to curved or deform the flat membrane 200, or may be formed on the substrate, or may be formed by adhering the flat membrane 200 to the curved substrate 100' It is also possible.

Here, an adhesive or a double-sided tape may be added so that at least one of the membrane 200 'and the substrate 100' has an adhesive force at a side where it is in contact.

5 (b) to 5 (d), the laser device 14 'irradiates a laser beam onto a membrane 200' bonded to a curved substrate 100 ' . At this time, the laser device 14 'is processed so as to have a fine flow path 210' having a structure shape set on the membrane 200 'by irradiating the starting point where the irradiation of the laser beam starts and the end point irradiated lastly.

Referring to FIG. 5E, the operator separates the processed membrane 200 'of the laser device 14' from the curved substrate 100 '. At this time, the separated membrane 200 'corresponds to a curved flexible photomask 400'. In addition, the curved flexible photomask 400 'can be applied to the curved microfluidic chip mold 630 as it is processed into the shape of the target structure on the curved substrate 100'.

6 is a diagram showing a third embodiment of the step S100. The process of fabricating the three-dimensional photomask will be described step by step.

Referring to FIG. 6, the third embodiment of the step S100 includes a three-dimensional substrate 100 '' having a three-dimensional shape in which a plane and a curved surface are combined, a membrane 200 ' 'And a laser device 14' 'for cutting the membrane 200' '.

Referring to Figure 6 (a), the thin membrane 200 '' is bonded on one side of the three-dimensional substrate 100 ''. Here, either one of the three-dimensional substrate 100 '' and the membrane 200 '' may be provided with an adhesive or a double-sided tape.

Referring to FIG. 6 (b), the laser device 14 '' irradiates the laser beam onto the membrane 200 '' and cuts a part of the region to have a predetermined shape to form the micro channel 210 ''.

Referring to FIG. 6C, the operator separates the membrane 200 '' from the three-dimensional substrate 100 '' upon completion of the machining operation of the micro channel 210 '' with the laser beam. As described above, since the flexible photomask 400 '' of the present invention is processed into the region through which the ultraviolet ray is transmitted in the membrane 200 '' made of ultraviolet ray non-transmissive material, the ultrafine ultrafine microfluidic chip mold 630 Lt; / RTI >

That is, in the present invention, the step S100 may include the step of forming a thin film 200 having at least one of a flat surface, a curved surface and a three-dimensional shape so as to coincide with the substrate 100, 100 ', or 100' 'having a shape of at least one of planar, , 200 ', and 200' ', and irradiating a laser beam to fabricate a flexible photomask (400, 400', or 400 '') in which a microfluid chip is processed into a laser shape of a structure.

The step S200 of fabricating the microfluid chip mold 630 using the flexible photomask manufactured through the step S100 will be described below. The step S200 will be described with reference to FIG. 7 and FIG.

FIG. 7 is a flowchart showing details of step S200, and FIG. 8 is a view schematically showing each step of FIG.

Referring to FIGS. 7 and 8, in operation S200, a photomask 400 is installed on a mold substrate 610, a step S220 of injecting a curable resin, a step S230 of curing the curable resin, (S240) of removing the unreacted resin (400), and extracting the microfluid chip mold (630).

In step S210, a photomask 400 is installed. Here, the mold substrate 610 is planar, and the photomask 400 is manufactured by the first embodiment, and is installed on the upper surface of the resin reservoir 620 fixed on the upper surface of the mold substrate 610.

The resin reservoir 620 includes an injection tube 621 for injecting the curable resin, a discharge tube 621 'for discharging the curable resin, and a transparent plate (not shown) fixed to the upper surface of the body 622, and a mold plate 631 to which a structure embossed inside is adhered.

The photomask 400 is provided with an adhesive or a double-sided tape on the outer side for airtightness with the transparent plate 622 bonded to one surface.

Step S220 is a step of injecting the curable resin. The curable resin may be, for example, a liquid acrylate functional group; An ultraviolet curing type polymer containing a methacrylate functional group and a photo-curing initiator. The ultraviolet curable polymer is at least one of polyethylene glycol methyl ether acrylate, polyethylene glycol diacrylate and hydroxyethyl methacrylate.

The photo-curing initiator is preferably at least one of 2-hydroxy-2-methylpropiophenone, monoacylphosphine oxide, and bisacylphosphine oxide.

More preferably, the photocuring initiator comprises 1 to 3% by weight based on the ultraviolet curable polymer.

The injection pipe 621 and the discharge pipe 621 'provided in the resin reservoir 620 are connected to a pipe extending from the resin supply device 12 or the recovery device (not shown) to inject or discharge the curable resin. Therefore, the resin reservoir 620 is filled with the curable resin injected through the injection tube 621. [ At this time, the mold plate 631 is accommodated inside the resin reservoir 620 filled with the curable resin.

Step S230 is a step of irradiating ultraviolet rays to cause a curing reaction. The curing device 13 irradiates ultraviolet rays from the upper surface of the photomask 400. [ Accordingly, the ultraviolet ray cures and solidifies the region of the resin reservoir 620 exposed below the micro flow path 210 of the photomask 400. At this time, the transparent plate 622 transmits ultraviolet rays incident through the micro channel 210 of the photomask 400 to the inside of the resin reservoir 620 with a transparent material. At this time, the transmitted ultraviolet ray causes a curing reaction to solidify the curable resin on the upper surface of the mold plate 631.

Step S240 is a step of removing unreacted curable resin from the photomask 400 and the resin reservoir 620 after irradiating ultraviolet rays for a set time. The operator discharges the unreacted curing resin remaining in the resin reservoir 620 through the discharge pipe 21 '. At this time, the unreacted curable resin is a curable resin filled in a region other than the region exposed through the micro flow path 210.

In step S250, the transparent plate 622 is separated to extract the microfluid chip mold 630 of a positive type. Since the mold plate 631 is accommodated inside the resin reservoir 620, the resin cured on the upper surface thereof is solidified. Therefore, the operator pulls out the inner mold plate 631 after disassembling the resin reservoir 620 (for example, separating the transparent plate 622 located on the upper surface). At this time, an embossed structure 632 is formed on the upper surface of the drawn mold plate 631 in conformity with the shape of the micro channel 210 of the photomask 400. Accordingly, the microfluid chip mold 630 in which the structure embossed in the mold plate 631 is formed is completed.

Herein, the photomask can be reused as the microfluid chip mold is manufactured by the photo-curing reaction.

In addition, it is possible to manufacture a microfluidic chip mold 630 having a curved surface and a three-dimensional shape using the above-described curved flexible photomask 400 'and the three-dimensional photomask 400' '. This can be achieved by forming the transparent plate 622 of the substrate 100 and the polymer reservoir 620 to conform to the photomasks 400, 400 ', and 400' 'in the above process. A second embodiment of the S200 step using a curved, flexible photomask will be described with reference to FIG.

FIG. 9 is a view briefly showing a second embodiment of the step S200.

Referring to FIG. 9A, the curved flexible photomask 400 'is adhered to the upper surface of the transparent plate 622' of the curved resin reservoir 620 '. In this case, the curved flexible photomask 400 'may be provided with an adhesive or an embossing tape.

Referring to FIG. 9 (b), the curing device 13 irradiates ultraviolet rays from above the curved photomask 400 'attached to the resin reservoir 620. At this time, ultraviolet rays are incident inward through the fine flow path 210 'of the photomask 400' and the transparent plate 622 'of the resin reservoir 620'. Therefore, the curable resin is cured on the upper surface of the mold plate 631 'accommodated in the resin reservoir 620'.

Referring to FIG. 9 (c), the photomask 400 'is removed after irradiating ultraviolet rays for a set time. At this time, the resin reservoir 620 'can confirm the relief structure 632' cured inward through the transparent plate 622 '.

Referring to FIG. 9D, the microfluid chip mold 630 'is housed inside a resin reservoir 620' with a relief structure formed therein. Accordingly, the microfluid chip mold 630 'is drawn out after disassembling the resin reservoir 620'. At this time, the drawn microfluid chip mold 630 'is formed with a structure 632' embossed on the upper surface of the curved mold plate 631 '.

Also, as described above, the present invention can also produce a three-dimensional microfluidic chip mold 630, which can be manufactured as a three-dimensional resin reservoir and photomask 400 ''. This is the same as the curved microfluidic chip mold 630 described above and will not be described.

FIG. 10 is a flow chart showing the step S300 of the present invention, FIG. 11 is a simplified view of each step of FIG. 10, and FIG. 12 is a view showing an example of a microfluidic chip manufactured in the present invention.

Referring to FIGS. 10 to 12, step S300 includes injecting a second curable resin into the microfluidic chip mold 630, step S320 of curing the second curable resin, A step S 340 of removing the replica 640 and a step S340 of forming a sample inlet and a sample outlet from the replica 640 and a step S350 of plasma processing the surface of the replica 640, (Step 660).

Step S310 is a step of injecting or applying a hardening resin to the microfluid chip mold 630. [ 11A, the microfluid chip mold 630 is formed with the relief structure 632 in which the curable resin is solidified by the photo-curing reaction on the upper surface of the mold plate 631 as described above. At this time, the microfluid chip mold 630 is fixed to the upper surface of the work table 11. Therefore, the operator can put the cured resin discharged from the resin supply device 12 or the pipe extending from the resin supply device 12 into the container and then apply it to the upper surface of the microfluid chip mold 630.

11 (b), the second curable resin is applied to the upper surface of the microfluid chip mold 630, which is supplied from the resin supply device 12 and has a relief structure, to a predetermined thickness. At this time, the second curable resin may use at least one of a heat curable polymer solution, an ultraviolet curable polymer solution, and a radiation curable polymer solution.

Alternatively, the second curable resin may be a replica of either a curable polymer material or an elastic rubber material.

Step S320 is a step of curing and reacting the second curable resin. Referring to Fig. 11C, the second curable resin applied to the microfluid chip mold 630 is cured by the curing device 13. At this time, the curing apparatus 13 may be selected from an ultraviolet irradiation apparatus, a radiation irradiation apparatus, and a heating apparatus according to the specifications of the curable resin. Therefore, the curable resin is solidified by the curing reaction on the upper surface of the microfluidic chip mold 630.

In addition, the replica 640 can be made of any one of the curable polymer material and the elastic rubber material, which are applicable as the second curable resin, because the microfluidic chip mold can be reused as it is produced by the photo-curing reaction.

Step S330 is a step of releasing the replica 640 from the microfluid chip mold 630. The replica 640 is a resin material solidified while the curable resin is cured. 11 (d), the operator separates and separates the replica 640 from the upper surface of the microfluid chip mold 630. As a result, At this time, the separated replica 640 is vertically inverted and placed on the work table 11. The replica 640 includes the engraved portion 642 engraved with the relief structure of the microfluid chip mold 630 on the upper surface of the replica body 640 as shown in Figure 11E .

Step S340 is a step of puncturing the sample injection port 643 and the sample discharge port 643 'in the replica 640 placed on the work table 11. The sample inlet 643 and the sample outlet 643 'are formed at the set position of the engraved portion 642 of the replica 640 through the perforator 15 as shown in FIG. 11 (f).

Step S350 is a step of plasma-treating the surface of the replica 640 to have hydrophilicity. In step S340, the operator applies plasma processing to the surface of the replica 640 using the plasma apparatus 16. [ Therefore, the surface of the replica 640 is hydrophilic due to the plasma treatment.

S350 is a step of bonding the replica (640) to the chip substrate (650). The chip substrate 650 is made of (material and characteristics). Thus, the operator, with reference to the (g) 11, and attaching the replica (640) to the chip substrate (650). In this case, as another embodiment, a tube 670 for guiding the sample to the replica 640 bonded to the chip substrate 650 may be further included. Thus, the manufacture of the microfluidic chip is completed.

12, the curved microfluidic chip mold 630 and the three-dimensional microfluidic chip 630 may be formed as described above. However, as shown in FIG. 12, It is possible to manufacture a curved microfluidic chip and a three-dimensional microfluidic chip by using the mold 630. 12 (a) is a planar microfluidic chip, (b) is a curved microfluidic chip, and (c) is a three-dimensional microfluidic chip.

That is, the present invention can manufacture a photomask 400 '' that can be used in various fields as a simple method at a low cost without using expensive equipment, and the fabrication of the microfluid chip mold 630 and the microfluidic chip It is advantageous that the facility cost for mass production can be made cheap because it is not required to be executed in a high clean room.

While the present invention has been particularly shown and described with reference to specific embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be readily apparent to those skilled in the art that the present invention can be modified and changed without departing from the scope of the present invention.

10: Microfluidic chip manufacturing apparatus 11: Work table
12: Resin feeding device 13: Curing device
14: laser device 15: perforation device
16: plasma apparatus 100, 100 ', 100'': substrate
200, 200 ', 200'': Membranes 210, 210', 210 '':
400, 400 ', 400'': Photomask 600: Microfluidic chip mold device
610: Molded substrate 620: Resin storage tank
621: injection tube 621 ': discharge tube
622: Transparent plate 630: Microfluidic chip mold
631: Mold plate 632: Embossed structure
640: Replica 641: Body
642: engraved portion 643: sample inlet
643 ': sample outlet 650: chip substrate
670: Tube A, A ', A'': Microfluidic chip

Claims (9)

A) a step of irradiating the membrane with a laser beam to produce a photomask which is cut and processed so as to conform to the structure of the microfluidic chip;
B) forming a microfluid chip mold in which the structure of the microfluid chip is embossed using the photomask;
C) applying and curing a curable resin to the microfluidic chip mold to produce a replica having a relief of the embossed structure of the microfluidic chip mold and mounting the replica on a chip substrate to produce a microfluidic chip; A method of manufacturing a microfluidic chip using a laser-processed photomask.
The method of claim 1, wherein step b)
A transparent plate for transmitting ultraviolet rays on the upper surface, and (b-1) a step for mounting the photomask on the upper surface of the resin reservoir filled with the ultraviolet curable resin;
B-2), after the step b-1), irradiating ultraviolet light on the top surface of the photomask to cure the ultraviolet-curable resin;
B-3) removing the photomask after discharging unreacted ultraviolet-curable resin from the inside of the resin reservoir after the step b-2);
And b-4) withdrawing the microfluidic chip mold in which the ultraviolet curable resin is cured and embedded on the inside of the resin reservoir after the step b-3) A method of manufacturing a fluid chip.
The method of claim 1, wherein step c)
C-1) injecting a curable resin into the microfluid chip mold;
C-2) curing the curable resin injected into the microfluidic chip mold to produce the replica;
C-3) separating and separating the replica;
C-4) piercing at least one of the sample inlet and the sample outlet into the replica; And
And c-5) mounting the replica on the chip substrate. The method of manufacturing a microfluidic chip using the laser-processed photomask.
4. The method of claim 3, wherein step c)
And performing plasma processing on the surface of the replica bored in the step c-4).
The microfluidic chip according to claim 1,
The method of manufacturing a microfluidic chip using a laser-processed photomask according to claim 1, wherein the microfluidic chip is made of at least one of planar, curved, and three-dimensional shapes.
The method according to claim 1, wherein in step (c), the curable resin
Wherein the ultraviolet curable resin is at least one of an ultraviolet curable resin, a heat curable resin and a radiation curable resin.
2. The system of claim 1, wherein the replica
The method of manufacturing a microfluidic chip using a laser-processed photomask according to claim 1, wherein the microfluidic chip is manufactured from one of a curable polymer material and an elastic rubber material.
The ultraviolet curable resin composition according to claim 2, wherein the ultraviolet curable resin
An ultraviolet curing type polymer containing an acrylate functional group and a methacrylate functional group, and a photocuring initiator,
Wherein the ultraviolet curable polymer is at least one of polyethylene glycol methyl ether acrylate, polyethylene glycol diacrylate and hydroxyethyl methacrylate,
The photocuring initiator
Wherein the photoresist is at least one selected from the group consisting of 2-hydroxy-2-methylpropiophenone, monoacylphosphine oxide, and bisacylphosphine oxide.
The photopolymerization initiator according to claim 8, wherein the photocurable initiator
Wherein the UV curable polymer is contained in an amount of 1 to 3% by weight based on the ultraviolet curable polymer.

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