KR20180003928A - Finger sensor application and display device comprising the same - Google Patents

Abstract

According to an embodiment of the present invention, a fingerprint sensing device comprises: a substrate; a groove formed in a region of the substrate to sense a fingerprint; a protective layer arranged inside the groove; and a fingerprint sensor module arranged on the protective layer, wherein the inside of the groove includes an inclined surface and a bottom surface, and the protective layer includes a plurality of beads. According to an embodiment of the present invention, a display device comprises: a substrate including a groove having an inclined surface and a bottom surface; a groove formed in a region of the substrate to sense a fingerprint; a protective layer arranged inside the groove; and a fingerprint sensor module arranged on the protective layer, wherein the protective layer includes a plurality of beads, and the substrate includes an effective region and a non-effective region. The groove is formed in the non-effective region on one surface of the substrate, and a touch electrode is arranged in the effective region on the one surface. Therefore, it is possible to reduce malfunctions and defects of a fingerprint sensor due to the thickness of the fingerprint sensing device.

Description

Technical Field [0001] The present invention relates to a fingerprint sensing device and a display device including the fingerprint sensing device.

Embodiments relate to a fingerprint sensing device and a display device including the fingerprint sensing device.

The fingerprint sensor is a sensor for detecting human fingerprints and is widely used not only for devices such as door locks which have been widely used but also for determining whether to turn on / off or sleep mode of electronic devices in recent years .

The fingerprint sensor can be classified into an ultrasonic wave type, an infrared ray type, and a capacitive type according to its operation principle.

For example, a fingerprint sensor of a capacitive type has a structure in which a first electrode and a second electrode serving as transmission and reception are disposed on a substrate, and the fingerprint is transferred by the transmission and reception of the first electrode and the second electrode, Can be recognized.

When such a fingerprint sensor is applied to a touch window or a display device, the fingerprint sensing characteristic is deteriorated due to the thickness of the substrate.

In addition, the fingerprint sensors disposed on the substrate may be inclined or may not be arranged at a uniform height, thereby lowering the reliability of the fingerprint sensing device.

Accordingly, there is a need for a fingerprint sensing device having a new structure capable of solving such a problem and a display device including the fingerprint sensing device.

Embodiments provide a fingerprint sensing device having improved reliability and a display device including the fingerprint sensing device.

A fingerprint sensing device according to an embodiment includes a substrate; A groove formed in an area for sensing a fingerprint of the substrate; A protective layer disposed inside the groove; And a fingerprint sensor module disposed on the protective layer, wherein the inside of the groove includes an inclined surface and a bottom surface, and the protective layer includes a plurality of beads.

A display device according to an embodiment includes a substrate including a groove having an inclined surface and a bottom surface; A groove formed in an area for sensing a fingerprint of the substrate; A protective layer disposed inside the groove; And a fingerprint sensor module disposed on the protection layer, wherein the protection layer includes a plurality of beads, the substrate includes a valid region and a non-valid region, and the groove is not effective on one side of the substrate And the touch electrode is disposed on the effective area on the one surface.

In the fingerprint sensing device according to the embodiment, the substrate may include grooves, and the protective layer and the fingerprint sensor module may be sequentially disposed inside the groove.

Accordingly, malfunctions and defects of the fingerprint sensor due to the thickness of the fingerprint sensing device can be reduced.

That is, as the groove is formed in the substrate, the thickness of the substrate is reduced, and the distance between the finger and the fingerprint sensor is reduced, thereby improving the reliability of the fingerprint sensor.

Further, since the fingerprint sensor module is disposed inside the groove, the force due to an external impact can be dispersed, so that the reliability of the fingerprint sensing device and the display device including the fingerprint sensing device can be improved.

In this case, the fingerprint sensing device may include a plurality of beads dispersed in the protective layer and the protective layer between the bottom surface of the groove and the fingerprint sensor module.

Accordingly, the protective layer may be disposed at a uniform thickness by the beads.

That is, the protective layer can be disposed at a uniform thickness between the bottom surface and the fingerprint sensor module, the height of the top surface of the fingerprint sensor module disposed on the protection layer can be uniform, The reliability of the display device including the display device can be improved.

1 and 2 are plan views of a substrate according to an embodiment.
3 to 6 are sectional views taken along the line AA 'in FIG.
7 is a cross-sectional view of a fingerprint sensing device in which a protective layer not including beads is disposed between the bottom surface and the fingerprint sensor module.
8 is a view showing a cross-sectional view of a fingerprint sensing device in which a protective layer including less than 10 beads is disposed between the bottom surface and the fingerprint sensor module.
9 is a view showing a cross-sectional view of a fingerprint sensing device in which a protective layer including more than 500 beads is disposed between a floor surface and a fingerprint sensor module.
FIG. 10 is a diagram illustrating a manufacturing process of the fingerprint sensing device according to FIGS. 3 and 4. FIG.
11 to 13 are views showing a cross-sectional view of the fingerprint sensor module.
14 is a plan view of a touch window to which the fingerprint sensing device according to the embodiment is applied.
15 to 17 are views showing a display device in which a touch window and a display panel to which the fingerprint sensor device according to the embodiment is applied are combined.
18 is a diagram showing an example of a display device according to the embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

Also, when a part is referred to as being "connected" to another part, it includes not only a case of being "directly connected" but also a case of being "indirectly connected" with another member in between. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Referring to FIG. 1, a fingerprint sensor cover according to an embodiment may include a substrate 100.

The substrate 100 may be rigid or flexible. For example, the substrate 100 may comprise glass. In detail, the substrate 100 may include at least one of silicon oxide, aluminum oxide, and sodium oxide. In one example, the substrate 100 may include chemically reinforced / semi-tempered glass such as soda lime glass or aluminosilicate glass.

Also, the substrate 100 may be curved with a partially curved surface. That is, the substrate 100 may be partially flat and partially curved with a curved surface. In detail, the end of the substrate 100 may be curved with a curved surface, or may have a curved surface with a curvature.

In addition, the substrate 100 may be a flexible glass plate having flexible characteristics.

In addition, the substrate 100 may be a curved or a bended substrate. That is, the fingerprint sensor cover including the substrate 100 may be formed to have a flexible, curved, or bent characteristic. Therefore, the fingerprint sensor cover according to the embodiment is easy to carry and can be changed into various designs.

Referring to FIG. 2, the substrate 100 may define a valid region AA and a non-valid region UA.

The non-valid area UA may be disposed to surround the valid area AA. The area of the effective area AA may be larger than the area of the non-valid area UA.

The display may be displayed in the effective area AA and the display may not be displayed in the non-valid area UA disposed around the valid area AA.

For example, a plurality of sensing electrodes may be disposed on the effective area AA. In detail, the first sensing electrode and the second sensing electrode may extend in different directions on the effective area AA. The first sensing electrode and the second sensing electrode may extend in different directions without being in contact with each other.

In addition, a plurality of wiring electrodes may be disposed on the non-effective region UA. In detail, a first wiring electrode connected to the first sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed on the non-effective region UA.

In addition, the position of the input device (e.g., a finger or a stylus pen) can be sensed in at least one of the effective area AA and the non-valid area UA. In detail, when an input device such as a finger is brought into contact with the glass plate 100, a capacitance difference occurs at a portion where the input device is contacted, and a portion where such a difference occurs can be detected as the contact position.

The substrate 100 may include a fingerprint sensing area FA. The area of the fingerprint sensing area FA may be smaller than the area of the non-effective area UA. The position of the fingerprint sensing area FA may overlap the position of the non-valid area UA. That is, the fingerprint sensing area FA may be one area of the non-valid area UA. In detail, the fingerprint sensing area FA may be located on the ineffective area UA.

The fingerprint sensing area FA may be an area for recognizing a fingerprint of a finger or the like.

The fingerprint sensing area FA may be disposed below or above the substrate 100.

Also, the substrate 100 may have a rectangular shape including a long side and a short side, and the fingerprint sensing area FA may be closer to the short side than the long side.

In addition, the area of the fingerprint sensing area FA may be smaller than the area of the substrate 100. In detail, the area of the fingerprint sensing area FA may be about 0.5% to about 5% of the total area of the substrate.

The substrate 100 may include a groove H. [ A groove H may be formed on the ineffective area UA of the substrate 100. [ The groove H may be disposed at a portion of the non-effective region UA of the cover substrate 100. [ For example, the groove H may be disposed at the lower portion or the upper portion in the ineffective region UA of the cover substrate 100. A groove H may be formed on the fingerprint sensing area FA of the substrate 100 in detail.

Although the grooves H are arranged in the lower bezel region of the cover substrate 100, the grooves H may be formed in the upper bezel region of the cover substrate 100 Of course.

The shape of the groove H may be various shapes such as a polygonal shape or a circular shape. Although the grooves H are illustrated as having a rectangular shape in the drawing, it is needless to say that the embodiments are not limited thereto and may be rounded polygonal shapes or circular shapes.

The substrate 100, the decor layer 400, the fingerprint sensor module 500, the bead 600, and the protective layer 700 of the fingerprint sensing device according to the embodiment will be described with reference to FIGS. 3 to 10 .

The fingerprint sensing apparatus according to an embodiment includes a substrate 100, a protective layer 700 disposed on the substrate 100, and a protective layer 700, a protective layer 700, And a fingerprint sensor module 500 disposed on the plurality of beads 600. That is, the protective layer 700 in which the beads 600 are dispersed and the fingerprint sensor module 500 may be sequentially disposed on the substrate 100.

The substrate 100 may include grooves on one of the first and second surfaces 100a and 100b. For example, the substrate 100 may include grooves only on one of the one surface 100a and the other surface 100b.

One side 100a of the substrate 100 may include a groove. For example, one surface 100a of the substrate 100 may have a step in the region where the grooves are formed.

The other surface 100b opposite to the one surface 100a of the substrate 100 may not include a groove. That is, the other surface 100b of the substrate 100 may not have a step. For example, the other surface 100b of the substrate 100 may be planar. In detail, the other surface 100b opposite to the one surface 100a of the substrate 100 may be a surface on which the user's finger contacts. That is, since the finger contacts the other surface 100b opposite to the one surface 100a of the substrate 100, the sense of unity between the effective area and the non-effective area can be improved.

The thickness of the substrate 100 may not be uniform. That is, the thickness of the substrate 100 in the region where the groove is formed and the region where the groove is not formed may be different from each other.

The grooves of the substrate 100 may be disposed in the ineffective area UA. For example, the grooves of the substrate 100 may be disposed only in the ineffective area UA. Accordingly, the thickness of one of the effective areas AA and the non-valid areas UA where grooves are not formed can be uniform as a whole. Meanwhile, the thickness of one of the non-valid areas UA and the other of the other areas including the grooves may be different from the thickness of one of the valid area and the non-valid area. That is, the thickness of the non-effective area may be partially different in the region where the groove is located.

The thickness T1 of the substrate 100 in the region where the grooves are formed may be smaller than the thickness T2 of the substrate 100 in the region where the grooves are not formed.

The thickness T1 of the substrate including the grooves in the ineffective area UA may be smaller than the thickness T2 of the substrate of the effective area AA. Alternatively, the thickness T1 of the substrate including the grooves in the ineffective area UA may be smaller than the thickness T2 of the substrate not including grooves in the ineffective area UA. Here, the thickness T1 of the substrate 100 in the region where the groove is formed may mean that it is measured in the central region of the groove.

The thickness T1 of the substrate 100 in the region where the grooves are disposed may be about 50 mu m to about 300 mu m. For example, the thickness T1 of the substrate 100 in the region where the grooves are disposed may be between about 100 [mu] m and about 300 [mu] m. For example, the thickness T1 of the substrate in the ineffective area UA where the grooves are disposed may be about 150 mu m to about 300 mu m.

If the thickness T1 of the substrate 100 in the region where the grooves are formed is less than about 50 占 퐉, the strength of the substrate 100 may be lowered. When the thickness (T1) of the substrate 100 in the region where the grooves are formed is greater than about 300 mu m, as the thickness of the substrate 100 increases, The distance may be increased and the sensing characteristic of the fingerprint sensor may be deteriorated.

In addition, the thickness T2 of the substrate 100 in the region where the grooves are not arranged may be about 300 mu m to about 1000 mu m. For example, in a region where the grooves are not formed, the thickness T2 of the substrate 100 may be about 300 탆 to about 700 탆. For example, the thickness T2 of the substrate 100 in the region where the grooves are not formed may be about 300 占 퐉 to about 500 占 퐉.

If the thickness T2 of the substrate 100 in the region where the grooves are not formed is less than about 300 占 퐉, the strength of the substrate 100 may be lowered and a crack may be generated when the sensing electrode is formed on the substrate When the thickness T2 of the substrate 100 in the region where the grooves are not formed exceeds about 1000 mu m, the thickness of the substrate 100 increases the overall thickness of the fingerprint sensing device .

Also, the thickness T3 of the groove may be about 150 mu m to about 700 mu m. For example, the thickness T3 of the groove may be about 150 占 퐉 to about 400 占 퐉. For example, the thickness of the groove T3 may be from about 250 [mu] m to about 350 [mu] m.

When the groove thickness T3 is less than about 150 mu m, the distance from the fingerprint sensor module disposed in the ineffective area to the touch surface of the substrate increases, and the sensing characteristic of the fingerprint sensing device may be deteriorated.

When the thickness T3 of the groove is more than about 700 mu m, the strength of the substrate may be lowered due to the difference in the thickness of the substrate between the effective region and the non-effective region.

The fingerprint sensor module 500 may be disposed on the ineffective area UA of the substrate 100. For example, the fingerprint sensor module 500 may be disposed on one area of the non-effective area UA of the substrate 100. In detail, the fingerprint sensor module 500 may be disposed on one surface of the substrate 100 including the groove. In more detail, the fingerprint sensor module 500 may be disposed inside the groove.

The width W2 of the fingerprint sensor module 500 may be smaller than the width W1 of the groove. Accordingly, the fingerprint sensor module 500 can be inserted into the groove.

The height of the upper surface of the fingerprint sensor module may be greater than the height of one surface of the substrate in the region where the grooves are not formed. For example, the height of the upper surface of the fingerprint sensor module 500 is larger than the height of the surface 100a of the substrate 100, so that the upper surface of the fingerprint sensor module can be protruded.

The thickness T4 of the fingerprint sensor module 500 may be 700 mu m or less. For example, the thickness T4 of the fingerprint sensor module 500 may be 100 μm to 600 μm. For example, the thickness T4 of the fingerprint sensor module 500 may be between 100 μm and 550 μm.

If the T4 of the fingerprint sensor module 500 is less than about 100 mu m, the durability of the fingerprint sensor module 500 may be lowered and the fingerprint sensor module 500 may be damaged by an external impact, Can be degraded. In addition, when the thickness T4 of the fingerprint sensor module 500 exceeds about 700 mu m, the thickness of the fingerprint sensing device may increase.

Since the fingerprint sensor module 500 is disposed inside the groove of the ineffective area UA having a thickness smaller than the effective area AA, the overall thickness of the fingerprint sensing device can be reduced. Therefore, when a fingerprint or the like comes in contact with the other surface of the substrate 100, the distance that the signal is moved to the fingerprint sensor can be reduced, so that the sensitivity of the fingerprint sensor can be improved, Can be improved.

The passivation layer 700 may be disposed on the ineffective area UA of the substrate 100. For example, the protective layer 700 may be disposed on one region of the ineffective region UA of the substrate 100. In detail, the protective layer 700 may be disposed on one surface of the substrate 100 including the groove. More specifically, the protective layer 700 may be disposed inside the groove.

The protective layer 700 may be disposed between the inside of the groove and the fingerprint sensor module 500.

The protection layer 700 may be disposed between the bottom surface of the groove and the fingerprint sensor module. Further, the protective layer 700 may be disposed between the inclined surface of the groove and the side surface of the fingerprint sensor module.

The width W4 of the passivation layer 700 may be greater than the width W1 of the groove. Accordingly, the protective layer 700 may be entirely formed on the inclined surface and the bottom surface of the groove. Here, the width W4 of the protective layer 700 may be measured at the one surface 100a of the substrate 100. [

The height of the upper surface of the protective layer 700 may be lower than the height of the upper surface of the fingerprint sensor module 500.

The height of the upper surface of the passivation layer 700 may be greater than the height of the one surface 100a of the substrate 100. That is, the thickness of the protective layer 700 may be greater than the thickness T3 of the groove. Accordingly, the protective layer 700 may cover the entire region of the substrate on which the grooves are disposed.

The passivation layer 700 may include at least one of an epoxy compound, an acrylic compound, and a silicon compound.

For example, the protective layer 700 may include a resin. The protective layer 700 may include a photocurable resin or a thermosetting resin. In detail, the protective layer 700 may include at least one of an epoxy resin, an acrylic resin, and a silicone resin.

As the protective layer 700 includes a resin, it may have adhesiveness. Accordingly, it is possible to prevent the finger sensor module 500 from being separated from the fingerprint sensor module 500. In addition, the protective layer 700 may seal the fingerprint sensor module 500, thereby improving the reliability of the fingerprint sensing device. In addition, the protective layer 700 may have fluidity as it includes the resin, so that the gap between the groove and the fingerprint sensor module 500 can be filled.

The beads 600 may be disposed on the ineffective area UA of the substrate 100. [ For example, the beads 600 may be partially disposed in the ineffective area UA of the substrate 100. [ In detail, the beads 600 may be disposed on one surface of the substrate 100 including the grooves. More specifically, the bead 600 may be disposed inside the groove.

The protective layer 700 may include a plurality of beads 600. That is, the beads 600 may be dispersed in the protective layer 700. The plurality of beads 600 may be uniformly dispersed in the protective layer 700.

That is, the plurality of beads 600 may be spaced apart from each other. The spacing of the plurality of beads 600 may correspond to each other or may be similar. For example, the distance between any one of the plurality of beads 600 and the second bead adjacent to the first bead corresponds to or is similar to the distance between the second bead and the adjacent third bead .

The plurality of beads 600 may be disposed between the bottom surface of the groove and the bottom surface of the fingerprint sensor 500.

The plurality of beads 600 dispersed in the protective layer 700 may be included in an amount of 0.001 to 1 volume% with respect to the protective layer 700. For example, the plurality of beads 600 dispersed in the protective layer 700 may be included at 0.01 to 1 volume% with respect to the protective layer 700. For example, the plurality of beads 600 dispersed in the protective layer 700 may be included at 0.01 to 0.5% by volume with respect to the protective layer 700.

The fingerprint sensor module 500 may be supported so that the fingerprint sensor module 500 is not tilted when the plurality of beads 600 dispersed in the protective layer 700 is included in an amount of 0.001 to 1 vol%. Accordingly, the distance between the finger and the fingerprint sensor module can be matched regardless of the position, thereby solving the problem caused by the error in the fingerprint recognition. That is, the reliability of the fingerprint sensing device including the fingerprint sensor module according to the embodiment can be improved.

The plurality of beads 600 may contact the bottom surface and the fingerprint sensor module 500, respectively. For example, the bottom surface of any first bead may contact the bottom surface, and the top surface of the first bead may contact the fingerprint sensor module 500. For example, the bottom surface of the second bead may be in direct contact with the bottom surface, and the top surface of the second bead may be in direct contact with the fingerprint sensor module 500.

That is, the plurality of beads 600 may support the fingerprint sensor module 500 disposed on the bead 600. The fingerprint sensor module 500 may be disposed in the groove without being inclined by the plurality of beads 600.

The size of the bead 600 may correspond to the distance between the bottom surface and the fingerprint sensor module 500. That is, only one bead 600 spaced apart from the bottom surface and the fingerprint sensor module 500 may be disposed. In the fingerprint sensing according to the embodiment, the plurality of beads may not contact each other, and the distance between the fingerprint sensor and the finger may be uniform regardless of the position.

The bottom surface and the lower surface of the fingerprint sensor module 500 may be disposed parallel to each other. Accordingly, the distance between the fingerprint sensor and the finger can be uniform regardless of the position.

The beads 600 may be spherical particles. The plurality of beads 600 may have a corresponding shape. Since the plurality of beads are spherical, they may be uniformly dispersed in the protective layer 700.

The average diameter of the beads 600 may be 10 to 100 占 퐉. For example, the average diameter of the beads 600 may be 10 to 70 μm. For example, the average diameter of the beads 600 may be 10 to 50 占 퐉. The plurality of beads 600 may have a corresponding average diameter. The average diameter of the beads 600 may be selected within the range of 10 to 100 占 퐉 in consideration of the distance between the fingerprint sensor and the finger and the supporting effect of the fingerprint sensor.

When the bead 600 has an average diameter of 10 to 100 mu m, the fingerprint sensor module 500 may be supported so as not to be tilted. Accordingly, the distance between the finger and the fingerprint sensor module can be matched regardless of the position, thereby solving the problem caused by the error in the fingerprint recognition. That is, the fingerprint sensing device including the fingerprint sensor module and the display device including the fingerprint sensing device can be improved in reliability.

10 to 500 beads may be included between the bottom surface and the fingerprint sensor module 500. For example, between the bottom surface and the fingerprint sensor module 500, 50 to 300 beads may be included. For example, between the bottom surface and the fingerprint sensor module 500, 10 to 100 beads may be included. For example, between the bottom surface and the fingerprint sensor module 500, 10 to 50 beads may be included.

When the beads 600 dispersed in the protective layer 700 are contained in an amount of 0.001 to 1 vol% with respect to the protective layer 700 and the average diameter of the beads 600 is 10 to 100 탆, 10 to 500 beads may be included between the bottom surface and the bottom surface of the fingerprint sensor module 500.

When less than 10 beads are disposed between the bottom surface and the fingerprint sensor module 500, the fingerprint sensor module 500 may be inclined. Accordingly, the distance between the finger and the fingerprint sensor module may vary depending on the position, so that an error in the fingerprint recognition may occur. That is, the fingerprint sensing device including the fingerprint sensor module may be degraded in reliability.

Referring to FIG. 7, when the bead is not included between the bottom surface and the fingerprint sensor module, the fingerprint sensor 500 may be inclined in the impregnation process.

The fingerprint sensor module 500 may be tilted along the center of gravity of the fingerprint sensor module 500 because the protective layer 700 has fluidity. Accordingly, the distance d1 between the first end and the second end of the fingerprint sensor module may be different from the distance d2 between the fingerprint sensor module and the bottom surface. Thus, when a finger is positioned on a region corresponding to the first end and a region corresponding to the second end, an error in fingerprint recognition may occur.

Referring to FIG. 8, when less than 10 beads are included between the bottom surface and the fingerprint sensor module, the fingerprint sensor module 500 may be inclined in the impregnation process.

That is, when less than 10 beads are included between the bottom surface and the fingerprint sensor module, a bead 600 enough to uniformly support the fingerprint sensor module is included between the bottom surface and the fingerprint sensor module . Therefore, a problem that the fingerprint sensor module 500 tilts may occur. Accordingly, the distance between the fingerprint sensor module and the bottom surface may be a distance d3 from the first end, and the fingerprint sensor module may contact the bottom surface at the second end. Thus, when a finger is positioned on a region corresponding to the first end and a region corresponding to the second end, an error in fingerprint recognition may occur.

When more than 500 beads are disposed between the bottom surface and the lower surface of the fingerprint sensor module 500, the fingerprint sensor module 500 may be inclined. Accordingly, the distance between the finger and the fingerprint sensor module may vary depending on the position, so that an error in the fingerprint recognition may occur. That is, the fingerprint sensing device including the fingerprint sensor module may be degraded in reliability.

Referring to FIG. 9, when more than 500 beads are included between the bottom surface and the fingerprint sensor module, the fingerprint sensor module 500 may be inclined in the impregnation process.

That is, when more than 500 beads are included between the bottom surface and the fingerprint sensor module, a plurality of beads 600 disposed between the bottom surface and the fingerprint sensor module may partially overlap. Therefore, a problem that the fingerprint sensor module 500 tilts may occur. Accordingly, the distance d4 between the fingerprint sensor module and the bottom surface may be different from the distance d5 from the first end and the distance d5 from the second end. Thus, when a finger is positioned on a region corresponding to the first end and a region corresponding to the second end, an error in fingerprint recognition may occur.

The beads 600 may include at least one of an epoxy compound, an acrylic compound, and a silicon compound.

For example, the bead 600 may comprise a resin. The beads 600 may include a photocurable resin or a thermosetting resin. In detail, the bead 600 may include at least one of an epoxy resin, an acrylic resin, and a silicone resin.

The beads 600 may include a compound corresponding to the protective layer 700. In detail, the beads 600 may include a compound having a composition corresponding to the protective layer 700.

The beads 600 may have a dielectric constant corresponding to the protective layer 700. Therefore, the reliability of the display device including the fingerprint sensor according to the embodiment can be improved. If the dielectric constant of the bead 600 is different from that of the protective layer 700, the fingerprint sensor may be mistaken as a signal in a region where the bead 600 is located. Therefore, the display device according to the embodiment disperses the beads 600 having the same composition and the same dielectric constant as the protective layer 700 in the protective layer 700, It is possible to prevent false recognition.

The groove of the substrate 100 may include an inclined surface and a bottom surface.

Referring to FIG. 3, the inclination angle between the groove and the other surface 100b of the substrate 100 may be reduced toward the central region CA of the groove from the outer area OA of the groove.

The outer region OA of the groove and the central region CA of the groove may be arranged at different inclination angles with respect to the other surface 100b of the substrate 100. [

The outer region OA of the groove may include an inclined surface. The inclination angle of the inclined surface may be between 15 degrees and 70 degrees. For example, the inclination angle of the inclined surface may be 30 degrees to 60 degrees. For example, the inclination angle of the inclined surface may be 35 degrees to 55 degrees.

When the inclination angle of the inclined surface is less than 15 degrees, as the width W1 of the groove increases, the groove may not be disposed inside the ineffective area UA. That is, one end of the groove may be formed in the effective area AA.

Further, when the inclination angle of the inclined surface is more than 70 degrees, the dispersion of the force can be reduced by the reduction of the specific surface area against the external impact. That is, since the force applied to the unit area increases, the rigidity of the substrate may be reduced.

For example, the outer region OA of the groove may include a first inclined face 101 and a second inclined face 102. [ The first inclined surface 101 may have a greater inclination angle than the second inclined surface 102 to the other surface 100b of the substrate 100. [

Although the first inclined plane 101 and the second inclined plane 102 are exemplified in the drawing, since the inclination angle is gradually decreased toward the center area CA, the outer area OA includes a plurality of inclined planes Of course.

The central region CA of the groove may comprise a plane. For example, the central region CA of the groove may comprise a substantial plane close to the plane.

The central region CA of the grooves may be disposed at an angle of about 0 degree to about 2 degrees with respect to the other surface 100b of the substrate 100. [ For example, the central region CA of the grooves may be disposed at an angle of about 0 degree to about 1 degree with respect to the other surface 100b of the substrate 100. [ For example, the central region CA of the grooves may be disposed at an angle of about 0 degrees to about 0.5 degrees with respect to the other surface 100b of the substrate 100. [

That is, the central region CA of the groove may be disposed in parallel with the other surface 100b of the substrate 100. [

The fingerprint sensor 500 may be disposed at a position corresponding to the inside of the groove. For example, the fingerprint sensor 500 may be disposed in an area corresponding to the central area CA of the groove.

As a result, the distance between the touch surface of the finger and the fingerprint sensor is constant, and the malfunction or failure of the fingerprint recognition is prevented, so that the reliability of the fingerprint recognition can be improved.

Referring to FIG. 4, the grooves may include a central region CA and an outer region OA surrounding the central region CA. The outer area OA may include an inclined surface. The inclination angle of the inclined surface may be 38 to 48 degrees. For example, the inclination angle of the inclined surface may be 40 to 46 degrees. For example, the inclination angle of the inclined surface may be 42 to 44 degrees. The inclined surfaces may be disposed at different inclination angles from the bottom surface of the groove. 3, the inclination angle of the inclined surface disposed in the outer area OA may have a certain angle.

5 and 6, the width W1 of the groove may be smaller than the width W5 of the decor layer 400. [ The width W2 of the fingerprint sensor module 500 may be smaller than the width of the decor layer 400 as the decor layer 400 is disposed on a region corresponding to the ineffective area UA.

The central region CA of the groove and the fingerprint sensor may be disposed facing each other with the decor layer 400 interposed therebetween. In detail, the central region CA of the groove and the fingerprint sensor module may be arranged in parallel at an angle of 0 degree with respect to each other.

The decor layer 400 may directly contact the inclined surface and the bottom surface of the groove. The decor layer 400 is disposed in the groove and the protective layer 700 having a plurality of beads dispersed therein is disposed on the decor layer 400. The beads 600 and the protective layer The fingerprint sensor module 500 may be disposed on the fingerprint sensor module 700. Accordingly, the decoy layer 400 can prevent the fingerprint sensor module 500 from being viewed. In addition, the reliability of the fingerprint sensing device including the fingerprint sensor module can be improved by supplementing the decrease in the strength of the substrate 100.

A manufacturing method of the fingerprint sensing device according to the embodiment will be described with reference to FIG.

The protective layer 700 in which the plurality of beads 600 are dispersed may be disposed in the groove of the substrate 100. At this time, the beads 600 may be solid particles, and the protective layer 700 may be a liquid. That is, the beads 600 and the passivation layer 700 may be different phase materials having compositions corresponding to each other.

Next, the fingerprint sensor module 500 may be disposed on the protective layer 700 on which the plurality of beads 600 are dispersed. For example, the fingerprint sensor module 500 may be disposed on the protective layer 700 in which the plurality of beads 600 are dispersed by an impregnation process.

In the fingerprint sensing device according to the embodiment, spherical beads having a size corresponding to the bottom surface of the groove and the fingerprint sensor may be disposed. Accordingly, even when the fingerprint sensor is disposed on the resin having fluidity, the fingerprint sensor can be prevented from tilting, so that the reliability of the fingerprint sensing device can be improved.

11 to 13, a fingerprint sensing module of a multi-angular structure included in the fingerprint sensing device according to the embodiment will be described.

Referring to FIG. 11, the fingerprint sensor module 500 may include a fingerprint sensor 510, a fingerprint sensor chip 520, a printed circuit board 530, a wire 540, and a molding unit 550.

The fingerprint sensor module 500 may be arranged with a fingerprint sensor chip 520 on the fingerprint sensor 510 and a printed circuit board 530 on the fingerprint sensor chip 520 in order.

The fingerprint sensor 510, the fingerprint sensor chip 520, the printed circuit board 530, the wire 540, and the molding part 550 included in the fingerprint sensor module 500 are all connected to the inside As shown in FIG. In detail, the fingerprint sensor module 500 may be disposed on the bottom surface of the groove.

The fingerprint sensor 510 may include a fingerprint sensor electrode.

The fingerprint sensor 510 may be connected to the printed circuit board 530 by a wire 540. For example, the fingerprint sensor 510 may be connected to the printed circuit board 530 by a wire bonding method.

The fingerprint sensor chip 520 may be connected to the printed circuit board 530 by a wire 540. For example, the fingerprint sensor chip 520 may be connected to the printed circuit board 530 by a wire bonding method.

That is, the fingerprint sensor 510 can transmit the fingerprint signal sensed through the fingerprint sensor electrode to the printed circuit board 530 through the wire 540, and the printed circuit board 530 can transmit the fingerprint signal sensed through the wire 540 to the fingerprint sensor chip 520.

The printed circuit board 530 may have a two-layer structure connected to a via hole.

The molding part 550 may include an epoxy mold compound. The molding unit 550 prevents damage due to oxidation or the like of the fingerprint sensor 510, the fingerprint sensor chip 520, the printed circuit board 530 and the wire 540, can do.

12, the fingerprint sensor module 500 may include a fingerprint sensor 510, a printed circuit board 530, and a support layer 560. [

A printed circuit board 530 may be disposed on the fingerprint sensor 510 and the supporting layer 560 may be disposed on the printed circuit board 530 in order.

The fingerprint sensor 510, the printed circuit board 530, and the supporting layer 560 included in the fingerprint sensor module 500 may all be disposed inside the groove. In detail, the fingerprint sensor module 500 may be disposed on the bottom surface of the groove.

A portion of the printed circuit board 530 may be disposed in a region corresponding to the groove and another portion may be disposed outside the fingerprint sensing region. At this time, the printed circuit board 530 may extend to the outer region of the groove to transmit a signal received from the fingerprint sensor 510.

The support layer 560 may be a metal. For example, the support layer 560 may be stainless steel (SUS).

13, the fingerprint sensor module 500 may include a fingerprint sensor 510, a printed circuit board 530, and a fingerprint sensor chip 520.

The fingerprint sensor module 500 may be disposed inside the groove.

The fingerprint sensor 510 included in the fingerprint sensor module 500 may be disposed inside the groove.

One end of the printed circuit board 530 may be connected to the other surface of the fingerprint sensor 510. The other end of the printed circuit board 530 may extend outside the groove. The other end of the printed circuit board 530 may be connected to the fingerprint sensor chip 520 in an area outside the groove.

Referring to FIG. 14, the fingerprint sensing apparatus according to the embodiment may include a substrate 100, a sensing electrode 200, a wiring electrode 300, a decor layer 400, and a fingerprint sensor module 500.

The substrate 100 may be rigid or flexible.

For example, the substrate 100 may comprise glass or plastic. In detail, the substrate 100 may include chemically reinforced / semi- toughened glass such as soda lime glass or aluminosilicate glass, or may include polyimide (PI), polyethylene terephthalate (PET) , Propylene glycol (PPG) polycarbonate (PC), or the like, or may include sapphire.

In addition, the substrate 100 may include an optically isotropic film. For example, the substrate 100 may include a cyclic olefin copolymer (COC), a cyclic olefin polymer (COP), a polycarbonate (PC), a light polymethyl methacrylate (PMMA), or the like.

Sapphire has excellent electrical properties such as dielectric constant, which not only greatly improves the speed of touch reaction but also can easily realize spatial touch such as hovering and is applicable as a cover substrate because of its high surface strength. Here, hovering means a technique of recognizing coordinates even at a small distance from the display.

Also, the substrate 100 may be curved with a partially curved surface. That is, the substrate 100 may be partially flat and partially curved with a curved surface. In detail, the end of the substrate 100 may have a curved surface or a curved surface with a curvature that may be bent or curved.

In addition, the substrate 100 may be a flexible substrate having a flexible characteristic.

In addition, the substrate 100 may be a curved or a bended substrate. That is, the touch window including the substrate 100 may be formed to have a flexible, curved, or bent characteristic. Therefore, the touch window including the fingerprint sensing device according to the embodiment is easy to carry and can be changed into various designs.

A touch electrode may be disposed on the substrate 100. The touch electrode may include a sensing electrode 200 and a wiring electrode 300. That is, the substrate 100 may be a supporting substrate.

Alternatively, a separate substrate may be further disposed on the substrate 100. That is, the sensing electrode and the wiring electrode are supported by a separate substrate, and the substrate and the separate substrate may be bonded directly or indirectly through the adhesive layer. As a result, the substrate and the separate substrate can be separately formed, which can be advantageous for mass production of the touch window.

In the substrate 100, a valid region AA and a non-valid region UA may be defined.

The display may be displayed in the effective area AA and the display may not be displayed in the non-valid area UA disposed around the valid area AA.

Also, at least one of the effective area AA and the ineffective area UA may sense the position of an input device (e.g., a finger, a stylus pen, etc.). When an input device such as a finger is brought into contact with such a touch window, a capacitance difference occurs at a portion where the input device is contacted, and a portion where such a difference occurs can be detected as the contact position.

The sensing electrode 200 may be disposed on the substrate 100. For example, the sensing electrode 200 may be disposed on the effective area AA of the substrate 100.

The sensing electrode 200 may include a first sensing electrode 210 and a second sensing electrode 220. The first sensing electrode 210 and the second sensing electrode 220 extend in different directions and may be disposed on the substrate 100.

The first sensing electrode 210 may extend in one direction on the effective area AA of the substrate 100. In detail, the first sensing electrode 210 may be disposed on one side of the substrate 100.

The second sensing electrode 220 may be disposed on one side of the substrate 100 while extending in a direction different from the first direction on the effective area AA of the substrate 100. That is, the first sensing electrode 210 and the second sensing electrode 220 may extend in different directions on the same surface of the substrate 100.

The first sensing electrode 210 and the second sensing electrode 220 may be insulated from each other on the substrate 100. A plurality of first unit sensing electrodes constituting the first sensing electrode 210 are connected to each other and a plurality of second unit sensing electrodes constituting the second sensing electrode 220 are spaced apart from each other . The second unit sensing electrodes are connected to each other by a bridge electrode 230 and an insulating material 250 is disposed on a portion where the bridge electrode 203 is disposed. The first sensing electrode 210, The electrodes 220 can be shorted to each other.

Accordingly, the first sensing electrode 210 and the second sensing electrode 220 are not in contact with each other, but are insulated from each other on the same surface of the cover substrate 100, that is, on the same surface of the effective area AA .

At least one of the first sensing electrode 210 and the second sensing electrode 220 may include a transparent conductive material to allow electricity to flow without disturbing the transmission of light. For example, The electrode may be formed of a metal such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, Oxide. ≪ / RTI > Accordingly, since the transparent material is disposed on the sensing effective region, the degree of freedom in pattern formation of the sensing electrode can be improved.

Alternatively, at least one of the first sensing electrode 210 and the second sensing electrode 220 may be a nanowire, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, a conductive polymer, And mixtures thereof. Accordingly, when manufacturing a touch window in which flexible and / or bending is implemented, the degree of freedom can be improved.

When nanocomposites such as nanowires or carbon nanotubes (CNTs) are used, they may be made of black. The color and reflectance can be controlled while securing the electric conductivity by controlling the content of the nano powder. Accordingly, when manufacturing a touch window in which flexible and / or bending is implemented, the degree of freedom can be improved.

Alternatively, at least one of the first sensing electrode 210 and the second sensing electrode 220 may include various metals. For example, the sensing electrode 200 may be formed of one selected from the group consisting of Cr, Ni, Cu, Al, Ag, and Mo. Gold (Au), titanium (Ti), and alloys thereof.

Also, at least one of the first sensing electrode 210 and the second sensing electrode 220 may be arranged in a mesh shape.

Since the sensing electrode has a mesh shape, the pattern of the sensing electrode can be made invisible on the effective area AA. That is, even if the sensing electrode is formed of metal, the pattern can be made invisible. In addition, the resistance of the touch window can be lowered even when the sensing electrode is applied to a touch window of a large size. In addition, the sensing electrode and the wiring electrode can be patterned simultaneously using the same material.

The wiring electrode 300 may be disposed on the substrate 100. In detail, the wiring electrode 300 may be disposed on at least one of the effective region AA and the ineffective region UA of the substrate 100. Preferably, the wiring electrode 300 may be disposed on the ineffective area UA of the substrate 100.

The wiring electrode 300 may include a first wiring electrode 310 and a second wiring electrode 320. For example, the wiring electrode 300 includes a first wiring electrode 310 connected to the first sensing electrode 210 and a second wiring electrode 320 connected to the second sensing electrode 220 can do.

The first wiring electrode 310 and the second wiring electrode 320 are disposed on the ineffective area UA of the cover substrate 100 and the first wiring electrode 310 and the second wiring electrode 320 are disposed on the non- One end of the second sensing electrode 320 may be connected to the first sensing electrode 210 and the second sensing electrode 220, respectively, and the other end may be connected to the circuit board. As the circuit board, various types of circuit boards can be used. For example, a flexible printed circuit board (FPCB) or the like can be applied.

The first wiring electrode 310 and the second wiring electrode 320 may include a conductive material. For example, the wiring electrode 300 may include a material corresponding to or similar to the sensing electrode 200 described above.

A decor layer 400 may be disposed on the ineffective area UA of the substrate 100. The decor layer 400 is formed by applying a material having a predetermined color so that the wiring electrode disposed on the ineffective area UA and the printed circuit board connecting the wiring electrode to an external circuit, .

The decor layer 400 may have a color suitable for a desired appearance. For example, the decor layer 400 may include black or white pigment, and may represent black or white. Or a film or the like can be used to realize various color colors such as white or black, red, and blue.

The decor layer 400 may be formed of a film. Accordingly, when the substrate 100 is flexible or includes a curved surface, the decor layer can be easily disposed on one side of the substrate 100. [ Also, it is possible to prevent the decoloration of the decor layer 400, thereby improving the reliability of the fingerprint sensing device and the display device including the same.

A desired logo or the like may be formed on the decor layer 400 by various methods. Such a decor layer can be formed by vapor deposition, printing, wet coating or the like.

The decor layer 400 may be disposed in more than one layer. For example, a first decor layer may be disposed on the ineffective area UA of the cover substrate, and a second decor layer may be disposed on the first decor layer.

The decor layer 400 may be disposed between the substrate 100 and the fingerprint sensor 500. Accordingly, the decoupling layer 400 can improve the reliability of the fingerprint sensing device including the fingerprint sensor by compensating for the decrease in the strength of the substrate 100.

The fingerprint sensor module 500 may be disposed on the substrate 100. That is, the fingerprint sensor module 500 may be disposed on the substrate 100 corresponding to the substrate 100 on which the touch electrodes are disposed. For example, the touch electrode and the fingerprint sensor module 500 may be disposed on one side of the substrate 100.

14, the touch window according to the embodiment can be arranged in various types.

Another type of touch window may include a substrate and a first substrate, and may include a first sensing electrode on the substrate, and a second sensing electrode on the substrate.

In detail, a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the substrate, and a second sensing electrode is formed on one surface of the first substrate, 2 sensing electrode and a second wiring electrode connected to the second sensing electrode may be disposed.

Alternatively, the sensing electrode may not be disposed on the substrate, and the sensing electrode may be disposed on both sides of the first substrate.

In detail, a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the first substrate, and a second sensing electrode is formed on the other surface of the first substrate, And a second wiring electrode connected to the second sensing electrode.

Another type of touch window may include a substrate, a first substrate and a second substrate, and a first sensing electrode on the first substrate and a second sensing electrode on the second substrate.

In detail, a first sensing electrode extending in one direction and a first wiring electrode connected to the first sensing electrode are disposed on one surface of the first substrate, and a second sensing electrode is formed on one surface of the second substrate in a direction different from the one direction And a second wiring electrode connected to the second sensing electrode.

Another type of touch window may include a substrate 100, a first sensing electrode on the substrate, and a second sensing electrode.

The first sensing electrode and the second sensing electrode may be disposed on the same side of the substrate 100. For example, the first sensing electrode and the second sensing electrode may be spaced apart from each other on the same surface of the substrate.

The first wiring electrode may include a first wiring electrode connected to the first sensing electrode and a second wiring electrode connected to the second sensing electrode. The first wiring electrode is disposed on the effective region and the non-effective region of the substrate , And the second wiring electrode may be disposed on a non-effective region of the substrate.

The touch window described above can be applied to a display device in combination with a display panel. For example, the touch window may be coupled to the display panel by an adhesive layer.

Referring to FIG. 15, the display device according to the embodiment may include a touch window disposed on the display panel 900.

15, the display device may be formed by combining the substrate 100 and the display panel 900. Referring to FIG. The substrate 100 and the display panel 900 may be bonded to each other through an adhesive layer 800. For example, the substrate 100 and the display panel 900 may be bonded to each other through an adhesive layer 800 including an optical transparent adhesive (OCA, OCR).

The display panel 900 may include a first substrate 910 and a second substrate 920.

When the display panel 900 is a liquid crystal display panel, the display panel 900 includes a first substrate 910 including a thin film transistor (TFT) and a pixel electrode, a second substrate 910 including color filter layers, The substrate 920 may be formed as a structure in which the liquid crystal layer is sandwiched between the substrates.

In addition, the display panel 900 may include a thin film transistor, a color filter, and a black matrix formed on a first substrate 910 and a second substrate 920 between the first substrate 910 Or a liquid crystal display panel of a color filter on transistor (COT) structure. That is, a thin film transistor may be formed on the first substrate 910, a protective film may be formed on the thin film transistor, and a color filter layer may be formed on the protective film. In addition, a pixel electrode that is in contact with the thin film transistor is formed on the first substrate 910. At this time, in order to improve the aperture ratio and simplify the mask process, the black matrix may be omitted, and the common electrode may be formed to serve also as the black matrix.

In addition, when the display panel 900 is a liquid crystal display panel, the display device may further include a backlight unit for providing light from the back surface of the display panel 900.

When the display panel 900 is an organic light emitting display panel, the display panel 900 includes a self-luminous element that does not require a separate light source. In the display panel 900, a thin film transistor is formed on a first substrate 910, and an organic light emitting element which is in contact with the thin film transistor is formed. The organic light emitting device may include an anode, a cathode, and an organic light emitting layer formed between the anode and the cathode. Further, the organic light emitting device may further include a second substrate 920 serving as an encapsulation substrate for encapsulation.

Referring to FIG. 16, the display device according to the embodiment may include a touch window formed integrally with the display panel 900. That is, the substrate supporting at least one sensing electrode may be omitted.

In detail, at least one sensing electrode may be disposed on at least one surface of the display panel 900. That is, at least one sensing electrode may be formed on at least one surface of the first substrate 910 or the second substrate 920.

At this time, at least one sensing electrode may be formed on the upper surface of the substrate disposed above.

Referring to FIG. 16, a first sensing electrode 210 may be disposed on one surface of the substrate 100. Also, a first wiring connected to the first sensing electrode 210 may be disposed. The second sensing electrode 220 may be disposed on one surface of the display panel 700. In addition, a second wiring connected to the second sensing electrode 220 may be disposed.

An adhesive layer 800 may be disposed between the substrate 100 and the display panel 900 so that the substrate and the display panel 900 may be bonded to each other.

Further, the substrate 100 may further include a polarizer. The polarizing plate may be a linear polarizing plate or an external light reflection preventing polarizing plate. For example, when the display panel 900 is a liquid crystal display panel, the polarizer may be a linear polarizer. In addition, when the display panel 900 is an organic light emitting display panel, the polarizing plate may be an external light reflection preventing polarizer.

The display device according to the embodiment may omit at least one substrate supporting the sensing electrode. This makes it possible to form a display device which is thin and light.

Referring to FIG. 17, the display device according to the embodiment may include a touch window formed integrally with the display panel 900. That is, the substrate supporting at least one sensing electrode may be omitted.

For example, a sensing electrode serving as a sensor for sensing a touch disposed in the effective area and a wiring for applying an electrical signal to the sensing electrode may be formed on the inner side of the display panel. In detail, at least one sensing electrode or at least one wiring may be formed inside the display panel.

The display panel includes a first substrate 910 and a second substrate 920. At least one of the first sensing electrode 210 and the second sensing electrode 220 is disposed between the first substrate 910 and the second substrate 920. That is, at least one sensing electrode may be disposed on at least one surface of the first substrate 910 or the second substrate 920.

Referring to FIG. 17, a first sensing electrode 210 may be disposed on one surface of the substrate 100. Also, a first wiring connected to the first sensing electrode 210 may be disposed. Further, a second sensing electrode 220 and a second wiring may be formed between the first substrate 910 and the second substrate 920. That is, the second sensing electrode 220 and the second wiring may be disposed inside the display panel, and the first sensing electrode 210 and the first wiring may be disposed outside the display panel.

The second sensing electrode 220 and the second wiring may be disposed on the upper surface of the first substrate 910 or the rear surface of the second substrate 920.

Further, the substrate 100 may further include a polarizer.

When the display panel is a liquid crystal display panel, when the second sensing electrode is formed on the upper surface of the first substrate 910, the sensing electrode may be formed with a thin film transistor (TFT) have. When the second sensing electrode is formed on the back surface of the second substrate 920, a color filter layer may be formed on the sensing electrode, or a sensing electrode may be formed on the color filter layer. When the display panel is an organic light emitting display panel, when the second sensing electrode is formed on the upper surface of the first substrate 910, the second sensing electrode may be formed with a thin film transistor or an organic light emitting diode .

The display device according to the embodiment may omit at least one substrate supporting the sensing electrode. This makes it possible to form a display device which is thin and light. Further, the sensing electrode and the wiring are formed together with the element formed on the display panel, thereby simplifying the process and reducing the cost.

Hereinafter, an example of a display device to which the fingerprint sensor device according to the above-described embodiments is applied will be described with reference to FIG.

Referring to Fig. 18, a mobile terminal is shown as an example of a display device. The mobile terminal may include a valid area AA and a non-valid area UA. The effective area AA senses a touch signal by touching a finger or the like, and a command icon pattern part and a logo are formed on the non-valid area.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (11)

Board;
A groove formed in an area for sensing a fingerprint of the substrate;
A protective layer disposed inside the groove; And
And a fingerprint sensor module disposed on the protection layer
Wherein the inside of the groove includes an inclined surface and a bottom surface,
Wherein the protective layer comprises a plurality of beads. The method according to claim 1,
The beads are spherical,
Wherein the average diameter of the beads is 10 to 100 占 퐉. 3. The fingerprint sensing device of claim 2, further comprising 10 to 500 beads between the bottom surface and the fingerprint sensor module. The method according to claim 1,
The plurality of beads being spaced apart from each other,
Each bead contacting the bottom surface and the fingerprint sensor module. The method according to claim 1,
Wherein the bottom surface and the bottom surface of the fingerprint sensor module are disposed parallel to each other. The method according to claim 1,
Wherein a distance between the bottom surface and a bottom surface of the fingerprint sensor module corresponds to a size of the bead. The method according to claim 1,
And a decoupling layer disposed between the bottom surface and the protection layer. The method according to claim 1,
Wherein the intermediate layer comprises at least one of an epoxy compound, an acrylic compound and a silicone compound. A substrate including a groove having an inclined surface and a bottom surface;
A groove formed in an area for sensing a fingerprint of the substrate;
A protective layer disposed inside the groove; And
And a fingerprint sensor module disposed on the protection layer,
Wherein the protective layer comprises a plurality of beads,
Wherein the substrate comprises a valid region and a non-valid region,
Wherein the groove is formed on a non-effective region on one side of the substrate,
And the touch electrode is disposed on the effective area on the one surface. 10. The method of claim 9,
The beads are spherical,
And the average diameter of the beads is 10 to 100 占 퐉. 11. The method of claim 10,
And between 10 and 500 beads between the bottom surface and the fingerprint sensor module.

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