KR20180002004A - Substrate carrier transport, sorting and loading/unloading - Google Patents

Abstract

The present invention relates to transporting, sorting, and loading/unloading a substrate carrier. A substrate stocker system includes: a high-density storage chamber including one or more piling units of one or more substrates in a closed position; and one or more low-density containers. The one or more substrates are supported on each carrier, and the each low-density container stores the one or more substrates at an opened position. The substrate stocker system additionally includes: a first robot moving the one or more piling units between the high-density storage chamber and one or more opening stations; and a second robot individually moving the one or more substrates between the one or more opening stations and the one or more low-density containers.

Description

[0001] SUBSTRATE CARRIER TRANSPORT, SORTING AND LOADING / UNLOADING [0002]

This application claims priority from U.S. Provisional Patent Application No. 62 / 412,252, filed October 24, 2016, entitled " Substrate Carrier Transportation, Classification and Loading / Unloading "as Control Number TEC005- U.S. Provisional Patent Application No. 62 / 355,856, filed June 28, 2016 entitled " Substrate Storage and Processing ", which applications are hereby incorporated by reference in their entirety for all purposes .

The disclosure generally relates to substrates and substrate fabrication. To a method, apparatus, and system for transferring a substrate or wafer from one carrier to another carrier, holder, storage, buffer, or the like. More specifically, the transfer can include sorting or unloading the carriers and placing them on different carriers via a station.

In many applications, substrates, wafers, etc. are processed, stored, or otherwise moved within a factory, assembly line, or system. Since the introduction of 300mm wafer semiconductor materials, Front Opening Unified Pods or "FOUPs" have become standard storage and transport methods for substrates and similar materials. FOUPs have been used to isolate and store silicon wafers for use in semiconductor production. The key semiconductor in the design of digital circuits, microprocessors, and transistors requires that these wafers be kept as close to immaculate conditions as the storage units allow. Thus, FOUPs allow wafers to be transported between different machines used for processing and measurement of the wipers.

Conventional FOUPs typically operate to preserve the wafer from the surrounding clean room environment. In conventional semiconductor projects, FOUPs allow the wafer to enter the device through a load port and a shear opening door. Often, the robot handling mechanism can position the wafer into the FOUP, where the wafer is clamped in place by a fin and stored for later use. Today, however, FOUPs are hampered by methods and system designs that can contaminate their contents, chafe the wafer, and delay the loading and unloading of substrate wafer contents as a result of various structures. Therefore, there is a need for an invention that achieves the desired operation of the FOUPs more efficiently and accurately.

The improved Tec-Cell offers these improvements and is thus a new standard in substrate fabrication. Having a number of advantages over the prior art and FOUPs, the tech-cell provides high density, efficient, clean and resilient processing and capability over the prior art. However, the tech-cell system must operate within larger systems and existing infrastructures, and thus interfacing with existing systems, carriers, etc., which may or may not be FOUPs, but other designs and standards, New components, systems, buffers, stations, etc. must be manufactured.

Thus, not only is it possible to provide an improved tech-cell design with the ability to transfer a wafer or substrate, and a group of wafers or substrates between the T-cell system and the device and the FOUPs, but also the wafer from the FOUP or Tech- Systems, methods, and devices that provide improved tech-cell designs with the ability to transfer, process, and manufacture substrates and tech-cells between bare stockers. These processes must be performed in a way that is efficient, clean, and minimizes contamination, and should be provided with zero or no interruption time or interruption to the process. In addition, there is a need to have other processes run concurrently, such as other processes, such as purging, which can provide additional advantages of classification, marking, organizing, or concurrent provisioning . It will then be clear that there is a need to simultaneously provide high density wafer and substrate transport and transport from such carriers to existing systems and methods, as well as be implemented in existing FOUP systems and other systems, High density carriers and storage, including improvements such as identification, classification, etc., can be used efficiently and quickly in existing systems and methods.

A method, apparatus, and system for providing transfer capability between substrate systems are disclosed.

In one embodiment of the present invention, a substrate stocker system is provided, wherein the substrate stocker system comprises one or more stacks of one or more substrates in a closed position, each substrate being supported on a respective carrier -; One or more low density containers, each low density container configured to store one or more substrates in an open position. The substrate stocker system further includes one or more low density containers and one or more opener stations coupled to the high density storage chamber, wherein each opener station receives one or more substrates and one or two Or more of the distance between adjacent ones of the substrates. The substrate stocker system includes a first robot configured to move one or more stacks between a dense storage chamber and one or more opener stations, and a second robot configured to move one or more stacks between one or more opener stations and one or more low- Or a second robot configured to move two or more substrates.

In another embodiment of the present invention, a method of storing and transporting a substrate in a substrate stocker system is provided. The method comprising: transferring a stack of substrates from a high density storage chamber to an opener station via a first robot, the stack of substrates being transported being in a closed position; Opening one or more substrates of the stack being transferred in the opener station, the stack of one or more open substrates being in an open position; And one or more containers of the Equipment Front End Module (EFEM) coupled to the opener station, and one or more open individual substrates to at least one of the low density containers.

The present invention may provide the ability to provide a preferred embodiment for a system or method, such as a transfer station, module or compartment, wherein the FOUP, substrate or wafer carrier, or tech- Method and can be operated by the transfer station to transfer a group of wafers, wafers, tec-cells or objects to a station, system, carrier, compartment, tech-cell or FOUP.

The transfer station may then provide transfer of the wafer, substrate, from any combination between FOUPs, tec-cells, or other carriers. This can be done one by one, or can be performed in groups, and can be done in any order. An example may be a transfer between a FOUP and a tech-cell carrier, and then the tech-cell may be transferred to a high-density configuration or transferred from a high-density configuration. As another example, the transfer can include causing the wafer in the high density teck-cell carrier to be transferred to the FOUP. Note that this may occur in any direction or order.

It is also evident that during transport, other operations such as structuring or sorting of wafers, tech-cells, carriers, etc. can be performed. Additionally, purification, quality control, reading, marking, and any other operations may be evident by the transfer station. This may also include opening the tech-cell so that they can be accessed and transported from the high-density component.

The methods and systems disclosed herein may be implemented by any means for achieving various aspects. Other features will become apparent from the accompanying drawings and the following detailed description.

Illustrative embodiments are shown by way of example and are not limited to aspects of the accompanying drawings, wherein like reference numerals denote similar elements.
FIG. 1A shows a side view of a stocker system in an embodiment of the present invention.
1B shows a side view of a stocker system in an embodiment of the present invention.
2A shows a flow diagram of a method for storing a substrate in an embodiment of the present invention.
Figure 2B shows a flow diagram of a method for storing a substrate in an embodiment of the invention.
FIG. 3A shows a configuration diagram of a stocker system in an embodiment of the present invention.
FIG. 3B shows a configuration diagram of a stocker system in an embodiment of the present invention.
3C shows a configuration diagram of a stocker system in an embodiment of the present invention.
4A shows a flow diagram of a method for opening a substrate in an embodiment of the present invention.
Figure 4B shows a flow diagram of a method for closing a substrate in an embodiment of the present invention.
FIG. 5A shows a top schematic view of a tech-cell stocker in an embodiment of the present invention.
FIG. 5B shows a top schematic view of a tech-cell stocker in an embodiment of the present invention.
6A shows a flow diagram of a method for transferring a substrate in an embodiment of the present invention.
Figure 6B shows a flow diagram of a method for transferring a substrate in an embodiment of the invention.
Figure 7A shows a top schematic diagram illustrating the transfer of a substrate from a stack to an opener in one embodiment of the present invention.
Figure 7B shows a top schematic diagram illustrating the transfer of a substrate from a stack to an opener in one embodiment of the present invention.
Figure 7c shows a top schematic diagram illustrating the transfer of a substrate from a stack to an opener in one embodiment of the invention.
Figure 8A shows a flow diagram of a method for transferring a substrate in an embodiment of the present invention.
Figure 8B shows a flow diagram of a method for transferring a substrate in an embodiment of the invention.
8C shows a flow diagram of a method for transporting a substrate in an embodiment of the present invention.
FIG. 9 shows a top schematic diagram of the tech-cell overhead transport in one embodiment of the present invention.
Figure 10A shows a flow diagram of a method for transferring a substrate in an embodiment of the invention.
Figure 10B shows a flow diagram of a method for transporting a substrate in an embodiment of the present invention.
11A shows a top schematic view of atech-cell transport in one embodiment of the present invention.
11B shows a top schematic view of thetech-cell transport in one embodiment of the present invention.
12A shows a top schematic view of a tech-cell transfer through a robot in one embodiment of the present invention.
12B shows a top schematic view of the tech-cell transfer through the robot in one embodiment of the present invention.
Figure 13 shows a flow diagram of a method for transporting and loading a substrate in an embodiment of the present invention.
Figure 14 illustrates a flow diagram of one embodiment of a method for transporting and loading substrates through different containers in an embodiment of the invention.
15A shows a top schematic view of a tech-cell transfer through a robot and removable components in an embodiment of the present invention.
15B shows a top schematic view of a tech-cell transfer through a robot and removable components in an embodiment of the present invention.
Figures 16a, 16b and 16c are side views of atech-cell in an embodiment of the present invention.
17A and 17B are side views of a tec-cell in an embodiment of the present invention.
Figures 18a, 18b and 18c are side views of a tec-cell in one embodiment of the present invention.
Figures 19a and 19b are side views of a tech-cell in one embodiment of the present invention.
Figures 20a, 20b and 20c illustrate a flow diagram of a method for transporting and loading a substrate in an embodiment of the present invention.
Figures 21A and 21B illustrate side schematic views of a ceiling system in one embodiment of the present invention.
Figures 22A, 22B, 22C and 22D describe a flow diagram of one embodiment of the sealing system of the present invention.
Other features of these embodiments will become apparent from the accompanying drawings and the following detailed description.

Disclosed are a method, apparatus, and system that can be provided as an example embodiment in a method, apparatus, and system for transferring a substrate or wafer from one carrier to another carrier, holder, storage, buffer, More specifically, the transfer can include sorting or unloading the carriers and placing them on different carriers through the station.

In a preferred embodiment, the present invention may provide a method or system, such as a FOUP substrate, a tec-cell, or a transport station, module or compartment, through which the wafer carrier can be entered via a robot or other method. The FOUP substrate, tec-cell or wafer carrier can then be introduced into the system.

The transfer station may then provide for transporting the wafer, substrate, from any combination of FOUPs, tec-cells, or other carriers. This can be done one by one or in groups and can be done in any order. An example may be a transfer between the FOUP and the tech-cell carrier, and then the tech-cell may be transferred to the high-density component. As another example, the transfer can include causing the wafer in the high density teck-cell carrier to be transferred to the FOUP.

It is also evident that during transport, other operations such as structuring or sorting of wafers, tech-cells, carriers, etc. can be performed. In addition, purification, quality control, reading, marking, and any other operations may be evident by the transfer station.

In one embodiment, the present invention provides a high density storage container and transportation related application.

In one embodiment, the present invention can provide a wafer in a high density or collapsed tech-cell, where the tech-cells are open so that they can be accessed and transported.

In some embodiments, the transport station may be in the form of a combination of a tech-cell and a FOUP that includes tech-cell containers and may combine them. This can also be done in the same containers, such as merely transporting the tech-cell container and compartment. For example, two lots merging into one lot can use high density storage like a tech-cell.

In one embodiment, the transfer station of the present invention may be on the first floor. In other embodiments, these may be ceiling based. Note that the transfer station may be a stand-alone or a compartment on a large system or device.

In one embodiment, the transport station may include protection by N2 / CDA / etc in a confined environment.

In one embodiment, the transport station may include an airlock, and other features provided that do not require a clean room environment.

In one embodiment, the present invention may provide for moving wafers from FOUPs to tech-cells (Zoom Pods).

In one embodiment, the present invention can provide an opener, and while in the transfer station, the opener can open high density tech-cell pods and other containers, and the opener can be an effector ). ≪ / RTI > In some embodiments, the effector may be configurable, or an active module, such as a configurable opener pitch, may adapt to the multi-wafer end effector.

In one embodiment, the invention may provide capabilities for other operations, such as stack sorting and reading, and sorting when providing transport.

Transport can provide increased wafer density for storage and increased wafer density for transport in the manufacturing plant.

The transfer station can provide an overall reduced overall system footprint because the wafer can be more dense.

In one embodiment, the transfer station not only increases the throughput of the transportation system, but also can provide reduced wafer latency as the wafer is pre-transferred to the selected module. Thus, this may include allowing the transfer station to enable single and multi-wafer transfer as the transfer station transfers multiple wafers to modules or the like.

Load / unload in one embodiment: The T3k-Cell / Zoom classifies between FOUPs and containers of any type, such as tech-cell high density storage modules, and can be loaded and unloaded with a ZOOM / FOUP port loader ) Or a transport module.

In one embodiment, which may be combined with any other embodiment, the present invention may provide a substrate stocker system, which may include a high density storage chamber comprising one or more high density containers or stacks of one or more substrates Each substrate being supported on a respective carrier, and the dense container or stack being in a closed position. One or more low density containers may be configured such that each low density container is configured to store a carrier such as one or more substrates and FOUPs.

In one embodiment, which may be combined with any other embodiment, the present invention may provide one or more opener stations, where each opener station may receive one or more stacks or containers from at least one high density storage chamber Or receive and receive or receive one or more substrates from a low density container. It is noted that each opener station may include one or more separator modules for modifying one or more distances between the corresponding one or more adjacent substrates within the high-density container or stack.

In one embodiment, which may be combined with any other embodiment, the present invention may provide at least one robot, wherein one or more robots may have one or more robots between the high density storage chamber and one or more opener stations A container or a stack; And is configured to move one or more substrates between one or more high density open position high density containers or stacks and one or more low density containers.

Note that the system itself can be isolated from the ambient atmosphere and the different stations, compartments and areas are internally isolated from others, so that the atmosphere can be kept clean to reduce contamination. It should be noted that after transfer, especially to transfer the substrate less contamination to reduce the damage, the purge gas may be introduced into any area to aid cleanliness.

In one embodiment, which may be combined with any other embodiment, the present invention may be implemented by one or more distances between one or more adjacent substrates of one or more stacks in the closed position, ) ≪ / RTI > standard.

In one embodiment, which may be combined with any other embodiment, the present invention provides a system comprising at least one OHT system; And moving one or more mobile high density containers through the OHT, for example, between the stations, between the stalker itself and other stalkers and processors, as well as between the stalker system and the high density storage chamber, Lt; RTI ID = 0.0 > OHT < / RTI >

In one embodiment, which may be combined with any other embodiment, the present invention may provide for a container load port to be configured to receive and store at least a removable container through the OHT, There may be at least one robot configured to transport the mobile container via the OHT.

In one embodiment, which may be combined with any other embodiment, the present invention may provide different OHT systems or portions of the OHT system to move one or more low density containers from the stocker system and into the stocker system.

In one embodiment, which may be combined with any other embodiment, the present invention may provide a facility front end module (EFEM) that may be coupled to one or more opener stations, Between two or more low density containers, at least one robot is placed in the EFEM to move one or more substrates and carriers from an open position high density carrier.

In one embodiment, which may be combined with any other embodiment, the present invention may provide an EFEM module and may include one or more robots for transporting the mobile container through the OHT from the container load port to the high density storage chamber .

In one embodiment, which may be combined with any other embodiment, the present invention provides a method of transporting a carrier and a substrate stack to an opener station by accessing a mobile container by opening a side of the container at a container load port, Can be provided.

In one embodiment, which may be combined with any other embodiment, the present invention provides an operator loading station configured to allow the transfer of one or more substrates to one or more opener stations and one or more opener stations station); And an automatic loading station configured to enable automatic transfer of one or more substrates and carriers to and from a dense storage chamber.

In one embodiment, which may be combined with any other embodiment, the present invention may provide that the substrate and carrier entering the operator or autoloading station are in a high density container at the open position.

In one embodiment, which may be combined with any other embodiment, the present invention may provide that the substrate and carrier entering the operator or autoloading station are in a dense container at the closed position.

In one embodiment, which may be combined with any other embodiment, the present invention may provide a purged enclosure mounted on a ceiling therein, wherein the enclosed enclosure may include a main OHT track and one or two And a distributed OHT tracker system having one or more branch tracks for storing the above mobile containers.

In one embodiment, which may be combined with any other embodiment, the present invention may provide a method of storing and transporting a substrate in a substrate stocker system.

The method then involves transferring the first closed stack or container of one or more carriers and substrates to the high density storage chamber and at least one opener station or by at least one robot from the high density storage chamber and the at least one opener station The system can provide for opening or closing the stack or container at the opener station, increasing the distance between each carrier and the substrate upon opening, and reducing the distance between each carrier and the substrate at closing; And transporting one or more open individual substrates to at least one or at least one of a low density container, one or more containers of a facility front shear module (EFEM), or an external dock cart .

The method may then include moving the mobile high density container from the container load port and the opener or from the container load port and the opener by at least one robot; Then opening or closing the mobile container; It is further noted that the method may further include transferring the stack or individual carriers and substrates to and from the first high density container and the mobile high density container or from the first high density container and the mobile high density container.

In one embodiment, which may be combined with any other embodiment, the present invention may be implemented by moving one or more substrates at any point within one or more positions within the stack and by any robot or opener station, In a stack or container of one or more substrates. Additionally, in one embodiment, which may be combined with any other embodiment, the present invention may be implemented by one or more than one, such as by changing the position when transporting the carrier and substrate or stack between the first high density container and the mobile high density container, Carrier, and substrate or stack.

Next, in one embodiment, it is noted that the system may provide for moving the mobile high density container from the container load port to the high density storage chamber by at least one robot.

Then, in one embodiment, which may be combined with any other embodiment, the present invention may be applied to one or more containers of a low density container, a facility front end module (EFEM), an outer dock for forming a dense container or a combined stack A combination of a first stack of carrier and substrate and a second stack of carrier and substrate from at least one of the carts, wherein the combined stack has a smaller pitch than the pitch of each of the first and second stacks, The stack is in at least one of a high density removable container that is moved by the OHT or through a container load port to a dock cart or an external system, or a high density container that is stored in a high density storage chamber.

The method then includes forming at least a distributed OHT track stocker system for storing a high density container, wherein the distributed OHT track stocker system is formed within the cleaned enclosure mounted on the seal inside thereof; And transporting the high density container from the high density storage area to the distributed OHT track system.

Although the embodiments have been described with reference to specific example embodiments, it will be apparent that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the various embodiments. It should be understood by those of ordinary skill in the art that the terms describing a process, product, element, or method may refer to similar alternatives in industry terms. Furthermore, the components, their connections, combinations, relationships, and functions thereof illustrated in the figures are meant to be exemplary only and are not intended to limit the embodiments described herein.

1A is a side view of a tec-cell stocker according to an embodiment of the present invention. The tech-cell stocker is a stocker system having a high density storage chamber with a conventional loader station or a high density loader station, and the loading can be provided within the transport station.

The cell-to-cell stocker includes a first stack 141 of substrates, a second stack 142 of substrates in a container having a side door, and a second stack of substrates 142 in a container having a bottom door or an Overhead Transfer Vehicle (OHT) And a storage chamber 110 that stores one or more Tech-Cells or FOUPs, such as a third stack 143.

Adjacent chamber 120 is an opener station showing stack 151 in a folded configuration and second stack 152 in open configuration. It is noted that the open configuration allows for easy access of the substrate, and that the foldable configuration optimizes storage space constraints. In one embodiment, a stack of open configurations may be transferred from the second chamber 120 to the third chamber 130. The third chamber 130 illustrates a loader station for a conventional FOUP 161 in an open configuration.

Fig. 1B shows a side view of a tec-cell stocker according to another embodiment of the present invention. In some embodiments, the present invention discloses a stocker system having a high density storage chamber 115 having a conventional loader station or a high density loader station. The storage chamber 115 may include a first stack 146 of substrates, a second stack 147 of substrates in a container having doors, and a third stack 148 in a container with an OHT. Thetech-cell stocker 100 further includes a second chamber 135 for storing a FOUP 167, and a stack 166 having an OHT. Thus, the storage chamber 135 includes high density containers in a foldable configuration. It will be apparent to those skilled in the art that a plurality of stacks can be maintained in any configuration within any of the first and second storage chambers. A transfer station (not shown) and a robot (not shown) can provide the ability to provide wafers with any of the above-described forms and in which they can be mounted in the above-described forms.

2A shows a flow diagram of a method for storing a substrate in a stocker system, such as a tec-cell stocker, in an embodiment of the present invention. Step 200 describes the step of transporting the substrate between the opener station and the container of the stocker system. The container generally refers to a moving compartment for storing a stack of substrates, and the opener station is a compartment where the folded substrate is opened. Generally, within a stack, each substrate can be separated by a respective gap from a next adjacent substrate. The size of such a gap is referred to as a ' pitch '.

In one embodiment, the substrate stack of the container may have a first pitch. In one embodiment, the pitch of the opener station may be similar to the first pitch, or may be different from the first pitch, so that it may be suitable for different structures and designs, may match particular objects such as wafers, And can be coupled to any type of robot.

Step 210 describes the step of folding the substrate of the substrate stack within the opener station, wherein the substrate in the folded state has a second pitch that is smaller than the first pitch. Step 220 describes transferring the substrate from the opener station to the storage chamber of the stocker system in a collapsed state.

Steps 208-210 can be performed in any order and it is obvious to those of ordinary skill in the art that the steps may in fact be performed in reverse order to bring the substrate from the storage chamber to the loader station. Additionally, it will be apparent to those of ordinary skill in the art that there may be a number of intermediate steps between the above-described steps 208-210, as well as some additional steps. Examples of intermediate steps and additional steps include, but are not limited to, transferring a substrate support, transferring the entire substrate stack at one time, placing the stack in the container, opening the container door, etc. . The storage chamber store may include stacks, compartments, compartments with doors, and the like.

Figure 2B shows a flow diagram of a method for storing a substrate in a stocker system, such as a tec-cell stocker, in an embodiment of the present invention.

Step 240 describes the step of transferring the substrate from the container to the storage chamber, wherein the pitch of the substrates of the container is much smaller than the SEMI standard pitch. Step 250 describes transferring the substrate to the storage chamber without a container, and step 260, together with the container, describes transferring the substrate to the storage chamber.

As an example, the container is a tech-cell specific container with a pitch of less than 5 mm, for example 1, 2, 3, 4, or 5 mm, which may be smaller than the SEMI standard of 10 mm. It should be noted, however, that one embodiment may use conventional FOUPs and tech-cells with standard pitch. Additionally, one embodiment may use different types of containers at the same time, or for different purposes, for example, a stocker using two types of loader stations, such as a high density container for FOUP and OHT for an operator .

3A shows a schematic diagram of a tech-cell stocker system in an embodiment of the present invention. The cell-cell stocker includes a storage chamber 330 that includes one or more stacks 310 of wafers supported on a carrier such as a tec-cell carrier or stored in a FOUP. The storage chamber 330 may include a robot 340 that may be configured to move one or more wafers or move one or more entire stacks from one location to another location within the storage chamber 330 . In one embodiment of the present invention, each stack 330 generally has the ability to provide a purge gas.

Purge gas is a well known feature for providing clean conditions in the storage chamber of the stocker system. As an example here, N2 gas can be used for purge and can be configured to arrive at each container and substrate equally through a laminar flow.

3B shows a configuration diagram of a tech-cell stocker according to another embodiment of the present invention. The cell-cell stocker includes a storage chamber 331 that includes one or more mobile containers 311 having a container body 351 and a container door 361, respectively. Each removable container 311 may store a wafer stack, a tec-cell, or a FOUP. In one embodiment, one or more containers 311 may be removed from the storage chamber 331 via the robot 341. In one embodiment, the robot 341 may move the entire contents 311 or the individual contents / containers of the container 311 from one place to another. The robot 341 may have an arm for opening the container door (predicting the door to open before reaching the container) and a sensor for opening the door when the robot 341 approaches the door have. In another embodiment of the present invention, each container 311 generally has the ability to provide a purge gas to prevent contamination in the storage chamber 331.

3C shows a configuration diagram of a tech-cell stocker according to an embodiment of the present invention. The tec-cell stocker includes a storage or stocker chamber 332 that may include one or more stacks of tec-cells or wafers 312 in one or more containers 372. In one embodiment, the container 372 may have a shelf, or a side door or a bottom door (such as a FOUP). The storage chamber 332 may include a robot 342 for moving the entire container 372 or the individual contents / containers of the container 372 from one location to another. In another embodiment of the present invention, each container 311 generally has the ability to provide a purge gas to prevent contamination in the storage chamber 332.

4A illustrates a flow diagram of a method for opening a substrate at an opener station of a stocker system, such as a tec-cell stocker system, in accordance with an embodiment of the present invention. As described in one embodiment, step 400 includes, for example, transferring a stack of substrates from a storage chamber to an opener station, wherein the stack of substrates includes a first pitch. Step 410 includes separating / opening the stack of substrates by increasing the gap between adjacent substrates, so that the separated substrate stack includes a second pitch that is larger than the first pitch. Step 420 includes transferring the individual substrates from the opener station to the low density loading station at a second pitch.

It will be clear to one of ordinary skill in the art that the pitch can be varied to expose one or more substrates and allow for a single batch transfer, or a single substrate transfer, in a low density stack as well as a high density stack. have.

4B illustrates a flow diagram of a method of one embodiment for closing a substrate in a tech-cell stocker system in accordance with an embodiment of the present invention. Step 440 includes transferring an individual substrate to form a substrate stack, wherein the substrate stack comprises a first pitch. Step 440 includes folding / closing the substrate stack by reducing the gap between adjacent substrates such that the folded substrate stack has a second pitch that is less than the first pitch. Finally, step 460 includes transferring the folded / closed substrate stack. In one embodiment, the enclosed substrate stack may be transferred to the storage chamber of thetech-cell stocker system.

Figure 5A shows a top schematic view of a tech-cell stocker system in an embodiment of the present invention. The tec-cell stocker system includes a door for storing a folded / closed substrate stack, a first robot (not shown) for moving the stack from the container 540 to the opener station 520 to create an open substrate stack 550 And a storage chamber 510 including one or more high density containers 540, each having one or more high density containers 545, 545, respectively. In the open state, individual substrates / wafers in stack 550 can be moved by second robot 555 to another container 560, such as FOUPs with load port 530 from opener 550. The first and second robots 545 and 555 may be moved between one or more stacks or between one or more containers 560 or may be used to move the storage chamber 520 into a folded substrate stack It will be apparent to those of ordinary skill in the art that it can be configured to perform a reverse process.

FIG. 5B shows a top schematic view of a tech-cell stocker in an embodiment of the present invention. The cell-to-cell stocker includes a storage chamber 510 that includes one or more containers 541 with doors, at least one stack from a container 541 to a plurality of opener stations 520, At least one robot 546 for moving at least one of the opener stations 520 to at least one of the opener stations 520 and one or more containers 561 such as a FOUP having a load port 530 from one or more opener stations 520, (EFEM) coupled to a load port 530 that includes an EFEM robot 556 for moving the wafer 551. The EFEM robot 556 includes an EFEM robot 556,

It should be noted that in the figures and embodiments, and in any other figures and embodiments, there may be any order or any plurality of individual stations, structures, robots, and the like.

6A illustrates a flow diagram of a method of one embodiment for transferring individual substrates in a tec-cell stocker system. Step 600 includes transferring the folded / folded substrate stack from the storage chamber to the opener station, wherein the closed substrate stack comprises the first pitch. Step 66 includes separating / opening the substrate stack at the opener station by increasing the gap between the corresponding adjacent substrates so that the separated substrate has a second pitch that is greater than the first pitch. Process 620 describes a step of transferring a separate substrate from an opener station to a container such as a FOUP.

6B depicts a flow diagram of a method of one embodiment for transferring individual substrates in a tec-cell stocker system. Step 640 describes the step of transferring one or more closed substrate stacks from the storage chamber to one or more opener stations, wherein one or more of the closed substrate stacks have a pitch much smaller than the pitch of the SEMI standard . Step 650 describes the step of separating the substrates of one or more stacks by increasing the gap between corresponding adjacent substrates. Step 660 describes the step of transporting individual substrates of one or more stacks through a EFEM robot to a container such as a FOUP.

Figure 7a shows a schematic diagram of the transport of a substrate stack in a tec-cell stocker in one embodiment of the present invention. 7A illustrates transfer of a substrate stack from a container 740 to an opener station 750 via a robot 740 and at an opener station 750 the substrate is in a closed state. 7A then shows an empty container 710 with a side door 770 and a robot 730 is shown having a stack of substrates separated by a distance or separation 760, To the opener station (729).

FIG. 7B shows a top schematic diagram of the transport of a substrate stack in a tec-cell stocker, in an embodiment of the invention. Here, Fig. 7 (a) shows a container 771 having a door 776 that can be opened by a robot 731 having an effect. 7B then shows a closed substrate stack 741 that is removed from the container 771 by a robot with an effector 736 for transfer to the opener station. FIG. 7B shows an empty container 77 and a stack 721 in an open state.

Figure 7C shows a top schematic view of the transport of a substrate stack in a tec-cell stocker in one embodiment of the invention. 7C shows a container 772 having an OHT, and the contents of the container are transferred to the opener station (not shown) by the robot 732. [ 7C then shows an overhead compartment wall 777 that is removed via any method, such as OHT, so that the stack is empty in the open state. Next, FIG. 7C (c) shows the stack 722 including the open and separated substrates.

8A illustrates a flow diagram of a method of one embodiment for transferring a substrate in a tec-cell stocker system. Step 800 describes the step of receiving a substrate stack closed from the storage chamber. Step 810 describes the step of transferring the received stack to the opener station to produce a stack of discrete substrates having a larger pitch.

8B depicts a flow diagram of a method of one embodiment for transferring a substrate in a tec-cell stocker system. Step 830 describes the step of opening the compartment door in the storage chamber to accommodate the closed substrate stack. Step 840 describes the step of transferring the closed substrate stack to the opener station to create an open substrate stack having a pitch that is greater than the pitch of the open substrate stack.

Figure 8C illustrates a flow diagram of a method of one embodiment for transferring a substrate. Step 860 describes the step of transporting the container with the closed substrate stack to the opener station. In one embodiment, the container may be provided with an OHT. Step 870 describes the step of opening the container and process 880 describes the step of separating / opening the closed substrate stack, wherein the separated substrate stack has a larger pitch than the pitch of the closed substrate stack .

9 shows a top configuration diagram of a tech-cell stocker system 900 in a temporal example of the present invention. Here, the OHT system 910 is described for one or more tech-cell modules 920 stored in the storage chamber 930. In one embodiment, thetech-cell module 920 may be a removable container configured to store a substrate stack in a collapsed state. The OHT system 910 may be configured to perform handover of one or more TEC-cell modules 920 from top to bottom. In addition, their contents, such as the tech-cell module and the substrate, can be moved or manipulated by the robot, for example the robot can be moved to another container, such as the FOUP 940 and to an opener station, Or buffer station. In one embodiment, the FOUP may also use the OHT system 950.

It should also be noted that it may be internal to the system, for example a storage area, area or compartment, which may or may not be isolated, where the gas or equipment may be stored, delivered, Otherwise, you can provide an area for the system. There may also be a dedicated OHT transport station such as 970, as well as robots in the opener station such as the opener station 971, as well as auxiliary robots for transport from the OHT to or from the OHT, such as the robot 981. There may also be a buffer station inside the system, and containers, substrates, carriers, etc. may be retained within the system for machine backlogs, for transport backlogs, or for any other reason. It is noted that any feature may be shared over any of the embodiments.

In one embodiment, the high density container may be advanced into the stocker 900 by the OHT 910. [ The container may be advanced into the transfer station 970 and then the transfer station 970 may include the opener system and then be individually accessible by the robot after opening as well as the carrier and substrate stacks , Then they can enter the container held in the opener station 971 and then the robot 982, which can represent a plurality of robots, can move the container held in the opener station 971 into the high density storage area 920 Can be deployed. The substrate and carrier can then be accessed by the robot 981 and then transferred to a second, third, or any arbitrary location having similar aspects, such as an OHT 950 with a FOUP or a dense container 940 Lt; RTI ID = 0.0 > station. ≪ / RTI >

Note that the robot 981 may be a single robot or a plurality of robots. In certain embodiments, the robots may have different effects, and the robots may be designed to be simply transferred, moved, or configured into a container such as a FOUP or a low density container, or a high density container, such as a tech- It is possible to move the stack, or move the single carrier and the substrate individually. It should also be noted that, in some embodiments, a robot may have arms that are interchangeable or adjustable so that the same robot can interact with all of the above described systems and elements.

10A illustrates a flow diagram of a method of one embodiment for transferring a substrate in a tec-cell stocker system. Here, step 1000 includes providing a stocker including an opener station and an OHT station. Step 1010 includes transferring an individual substrate through the opener station, and step 1020 includes transferring the mobile container through the OHT station. In one embodiment, the first mobile container is delivered to the opener station via the OHT station, and then the substrate of the mobile container is opened at the opener station, after which the individual substrates are transported between the opener station and the load port. It should be noted that the load port can be airtight and can provide all standard connections, so that transfer takes place in a sterilized environment with no limited contamination or contamination.

10B depicts a flow diagram of a method of one embodiment for transferring a substrate from a tec-cell stocker. Here, step 1040 includes providing a stocker, wherein the stocker is configured to store the substrate in a stack having a smaller pitch than the SEMI standard, and the stocker includes an operator loading station and an autoloading station. The operator loading station is a port / terminal accessible by a human manual entry. The operator loading station is a port that can be accessed by a machine transfer mechanism. Step 1050 includes transferring the individual substrates through the operator loading station, and step 1060 includes transferring the containers through the automatic loading station. It should be noted that this can be done in part as described above.

FIG. 11A shows a top schematic view of the tech-cell transport in a tech-cell stocker in one embodiment of the present invention. Here, a stacker is described that includes a storage chamber 1100 that includes one or more removable containers 1120 (with OHTs) for storing one or more substrates in a combination of low density and high density stations. In one embodiment, the stocker includes a stand-alone load port with or without EFEM for single substrate transfer from opener station 1172 to one or more FOUPs 1175. In another embodiment, the operator can access the container load port 1165 for container transfer, and the storage robot 1170 can pick up the container and transfer it to the storage chamber 1100. It should be noted that the load port 1165 may be manually or automatically accessed to access a buffer or other system that provides a wafer, tec-cell, or other material.

11B shows a top schematic view of the tech-cell transport in a tech-cell stocker in one embodiment of the present invention. Thetech-cell stocker includes a storage chamber 1180 that includes one or more removable containers 1181 (with OHT) of a closed substrate. Here, EFEM load port 1182 is described for container transfer as well as for individual substrate transfer. The EFEM robot 1183 may transport the container 1181 to the container load port 1182 and the storage robot 1184 may pick up the container from the container load port 1182 and move the storage area 1180 ) Or to any other area of the chamber.

12A shows a top schematic view of the tech-cell transport in a tech-cell stocker in one embodiment of the present invention. The cell-cell stocker may include a storage chamber 1200 having one or more containers 1210 in combination with a low density and high density loader station, a bare stack (with or without compartments / doors), and / Independent load port 1220 without EFEM or with EFEM for single substrate transport in some embodiments. Note that an operator or other mechanism may access the container load port 1210 to accommodate the container. In one embodiment, at the container load port 1220, the container can be opened and the storage robot 1230 can pick up the entire stack and transfer it to the storage chamber 1200.

FIG. 12B shows a top schematic view of atech-cell transport in atech-cell stocker in one embodiment of the present invention. EFEM is described for individual substrate transport and container transport. At the container load port 1240, the container may be opened and the EFEM robot 1250 may pick up the entire stack 1255 and transport it to the opener station 1260. In one embodiment, the entire stack 1255 may be transferred to the storage chamber 1270 by the storage robot 1280. In another embodiment, upon opening of the substrate stack 1255 at the opener station 1260, the EFEM individual robot 1250 can transport the individual substrates from the opener station 1260 to the FOUP or other container 1290. [

Figure 13 illustrates a flow diagram of a method of one embodiment for transporting and loading substrates in a tec-cell stocker. Here, step 1300 begins with providing a stocker, wherein the stocker is configured to store the substrate in a stack having a smaller pitch than the SEMI standard, the stocker being configured for a loading station configured for individual substrate transfer, Wherein the stocker comprises an integral loading station having a portion configured for individual substrate transfer and a portion configured for container transfer. Step 1310 describes transferring an individual substrate through a portion configured for individual substrate transfer or a loading station, and Step 1320 initiates transferring the container through a portion configured for container transfer or a loading station do. In one embodiment, two loading stations, one with a robot for single substrate handling and the other with a robot for container handling, can be replaced or provide auxiliary services to the OHT system as described above . Also, for any purpose or need, there can be any number of stations, robots.

Figure 14 illustrates a flow diagram of a method of one embodiment for transporting and loading to different containers. Here, step 1400 includes forming an EFEM comprising a loading station for a low density container and a loading station for a high density container, wherein the EFEM comprises a robot for handling an individual substrate in a low density container, And a robot for handling the substrate stack, wherein the EFEM is configured to interface with one or more opener stations. Step 1410 describes the step of transporting the substrate between the opener station and the loading station. Step 1420 describes transferring the substrate between loading stations via the opener station.

It will be apparent to those of ordinary skill in the art that the EFEM may be different for different types of containers and FOUPs, etc., so that the EFEM can meet the intended use or be actively adapted for use in different containers . It should also be noted that it is also used as a wider capability than the OHT and may be added in place of the OHT, among other methods or systems.

15A shows a top schematic view of a tech-cell transfer through a robot and mobile components in a tech-cell stocker, in an embodiment of the invention. Here, a stocker having a storage chamber 1500 with a removable container 1510 is described, wherein each container may comprise a stack, or at least one bare wafer, or may be empty. The container 1520 may be removed from the chamber 1500 to be serviced, moved, or provided in another system. In an embodiment, each container 1510 may have a door to isolate it from the external environment when removed from the chamber 1500, so that the containers can be removed without contamination and during continuous use.

FIG. 15B shows a top schematic view of a tech-cell transfer through a robot and removable components, in an embodiment of the invention. Here, the storage chamber 1550 includes one or more containers 1560 with OHTs.

Figures 16a, 16b and 16c are side views of atech-cell in an embodiment of the present invention.

16A shows a stack 1600 of one or more substrates supported on each of thetech-cell carriers. Here, a sorter (not shown) implemented through a robot may be configured to move the wafer from the first position 1610 to the second position 1620 in the stack 1600.

16B shows moving a wafer from a first position to a second position for sorting, but with a stack of different parts or orders. It is noted that this movement of the wafers for sorting can be performed in any robot, any order or any process, and the wafers can move between any number of positions, stacks and directions. In one embodiment, the sorter can sort the wafers by moving each carrier. In addition, the classification may be performed only for the wafers in the open state in each stack.

Figure 16c shows a random classifier, in which the opener is open to all slots, but in other embodiments, some slots may need to be opened.

17A and 17B are side views of a tech-cell including a container for storage in one embodiment of the invention.

17A shows thetech-cell carrier and substrate stack 1710, which is compacted in a tec-cell dense configuration and stored in a storage container 1720. Fig. It is noted that the wafer, tec-cell, carrier, and stack may be any number of any.

17B shows a substrate 1730 being transferred from the FOUP to thetech-cell carrier 1740, and the substrate is shown as being in the open position.

Next, FIG. 17B (b) shows the stack 1710 in a closed position on thetech-cell carriers.

Figure 17b (c) shows the stack 1710 stored in the container 1720 in the closed position. It is noted that the stack 1710 can be moved to the container 1720 in any known manner.

Figures 18a, 18b and 18c are side views of a tec-cell in one embodiment of the present invention.

Figure 18A shows first and second wafer stacks 1830 and 1835 in their respective FOUPs where the first and second stacks 1830 and 1835 are shown as a single stack 1810 on a large capacity tech- They can be combined together to be laminated.

FIG. 18B illustrates the combined wafer stack 1810 described above, for example, stack 1830 and stack 1835 may be combined into a stack by a robot or other method. It is noted that the stack may have a higher density such that the distance between the carrier and the substrate is shorter or the pitch is smaller than the previous individual stacks.

FIG. 18C shows stack 1810 in combination with a high-density form located within a dense container or storage 1820.

Figures 19a and 19b are side views of a tec-cell in one embodiment of the present invention.

FIG. 19A is a schematic diagram of an embodiment of a high-density stack 1910 that may be converted to a high-density stack 1910 and placed on ate-cell container 1920, which may then be placed in atech-cell container 1920, which may include an OHT or any other transport capabilities. Lt; RTI ID = 0.0 > 1930 < / RTI >

19B illustrates first and second stacks 1935 and 1936 that may be combined into one stack 1915 of tech-cell dense carriers and may be inserted into a container 1925 that may have OHT or other transport capabilities Lt; / RTI >

Figures 20a and 20b describe a flow diagram of a method of one embodiment for transferring and loading substrates in a tec-cell.

FIG. 20A illustrates a process 2000 that includes storing a carrier stack in a container, wherein the carrier is configured to support the substrate.

FIG. 20B illustrates a process 2020 that includes integrating two or more substrate sets to form a combined substrate stack, wherein the combined substrate stack is more than two or three or more substrate sets of pitches. It has a small pitch. Process 2030 includes storing the combined substrate stack in a container.

Figure 20C includes a process 2050 that includes forming a carrier or substrate stack. Process 2060 includes placing a stack in a container, and process 2070 includes transporting or storing the container.

Figures 21a and 21b illustrate a side schematic view of a seal-based transport mechanism of a tec-cell stocker system in one embodiment of the present invention. Figures 21a and 21b can describe a stocker with a distributed OHT stack.

Figures 21 (a) and 21 (a) describe an OHT tracker system as a storage system for a tec-cell container. The main OHT track 2110 can be formed such that one or more containers can be stored in one or more of the branch tracks 2166 and moved horizontally through the main OHT track 2110. In one embodiment, the container stores a high density tech-cell container. In another embodiment, the container stores the FOUP.

21A and 21B can describe an OHT track stocker system as a storage system 2161 wherein the main OHT track 2111 is a high density storage track 2166 ). In one embodiment, there may be a laminar flow of purge gas in the storage system 2161 for contaminant removal. Accordingly, the storage system 2161 may be a clean enclosure mounted on a seal that seals the distributed OHT track system.

Figures 22a, 22b, 22c and 22d describe a flow diagram of one embodiment of a sealing based transport system of the present invention, for FOUP and high density tech-cell, as well as for using OHT stocker as transient storage.

22A illustrates at least one process 2200 for a distributed OHT track stocker system for storing containers.

FIG. 22B illustrates at least one process 2220 for forming a stocker, wherein the stocker includes a distributed OHT track system in a clean enclosure mounted on the seal.

22C depicts at least one process 2240 for transferring a container from a stocker to a distributed OHT track system, and process 2250 includes transferring the container to a processing system.

22D depicts at least one process 2280 for transporting a container between a processing system and a distributed OHT trackstocker system.

A number of embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the claimed invention. In addition, the logic flows shown in the Figures do not require the specific order shown, or sequential order, to achieve the desired result. Moreover, other steps may be provided or steps may be removed from the described flows, and other components may be added to or removed from the described systems. Accordingly, other embodiments are within the scope of the following claims.

The various systems, methods, and apparatus described herein may be implemented as a machine-readable medium and / or a machine-accessible medium compatible with a data processing system (e.g., a computer system), and / Can be considered.

The structures and modules of the figures may be shown as being separate and communicating only with some specific structures and not communicating with others. The structures may be merged with one another, may perform overlapping functions, and may communicate with other structures not shown in the drawings. Accordingly, the specification and / or drawings are to be regarded in an illustrative rather than a restrictive sense.

Claims (20)

As a substrate stocker system,
A dense storage chamber comprising one or more dense containers or one or more substrate stacks, each substrate being supported on a respective carrier, the dense container or stack being in a closed position;
One or more low density containers each low density container configured to store one or more substrates and carriers;
One or more opener stations - each opener station is adapted to deliver or receive one or more stacks or containers from at least one high-density storage chamber, and to deliver or receive one or more substrates from the low- Each opener station including one or more separator modules for changing one or more distances between the corresponding one or more adjacent substrates in the dense container or stack;
At least one robot - one or more robots:
Moving one or more containers or stacks between the dense storage chamber and the one or more opener stations; And
Density container or stack of one or more high density open positions and one or more substrates between the one or more low density containers,
≪ / RTI > The method according to claim 1,
Each low density container is a front opening unified pod (FOUP)
Substrate stocker system. The method according to claim 1,
One or more distances between one or more adjacent substrates of one or more stacks in the closed position may be less than the critical distance defined by the Semiconductor Equipment and Materials International (SEMI)
Substrate stocker system. The method according to claim 1,
Further comprising a first OHT system and one or more OHT stations for moving one or more removable dense containers through the OHT, between the stalker system exterior and the dense storage chamber.
Substrate stocker system. 5. The method of claim 4,
Further comprising a container load port configured to receive and store at least the removable container through the OHT, wherein the first robot is configured to transport the removable container from the container load port to the dense storage chamber via the OHT,
Substrate stocker system. The method according to claim 1,
Further comprising a second OHT system for moving one or more low density containers to and from the stocker system,
Substrate stocker system. The method according to claim 1,
Further comprising an Equipment Front End Module (EFEM) coupled to the one or more opener stations, wherein the second robot, between the one or more opener stations and the one or more low density containers, Lt; RTI ID = 0.0 > EFEM < / RTI > module for transferring one or more substrates and carriers from a high density carrier of &
Substrate stocker system. 8. The method of claim 7,
Wherein the EFEM module further comprises a third robot for transferring the removable container from the container load port to the high density storage chamber via the OHT,
Substrate stocker system. 9. The method of claim 8,
The third robot is configured to access the mobile container by opening the side of the container at the container load port and to transport the carrier and substrate stack to the opener station.
Substrate stocker system. The method according to claim 1,
An operator loading station configured to enable transfer of one or more substrates and carriers to said one or more opener stations and from said one or more opener stations; And
An automatic loading station configured to enable automatic transfer of one or more substrates and carriers to and from the high-density storage chamber
≪ / RTI > 11. The method of claim 10,
Wherein the substrate and carrier entering the operator loading station or the autoloading station are in a high density container in an open position,
Substrate stocker system. 11. The method of claim 10,
Wherein the substrate and carrier entering the operator loading station or the autoloading station are in a high density container in a closed position,
Substrate stocker system. The method according to claim 1,
Further comprising a purged enclosure mounted on the internal sealing thereof,
The cleaned enclosure comprising a distributed OHT tracker system having a main OHT track and one or more branch tracks for storing one or more removable containers.
Substrate stocker system. A method of storing and transporting a substrate in a substrate stocker system,
Transporting a first closed stack or container of one or more carriers and substrates to at least one opener station or from a dense storage chamber and at least one opener station by at least one robot;
Opening or closing the stack or container at the opener station, the opening increasing the distances between the respective carriers and the substrate, and closing reducing the distances between the respective carriers and the substrate; And
Transferring one or more open individual substrates to at least one or at least one of a low density container, one or more containers of a facility front shear module (EFEM), or an external dock cart
≪ / RTI > A method of storing and transporting substrates in a substrate stocker system. 15. The method of claim 14,
Moving the mobile high density container from the container load port and the opener or from the container load port and the opener by at least one robot;
Opening or closing the mobile container;
Further comprising transferring stacks or individual carriers and substrates to or from said first high density container and said mobile high density container,
A method for storing and transporting substrates in a substrate stocker system. 15. The method of claim 14,
Further comprising the step of classifying one or more substrates within each stack or container by moving one or more of the substrates in one or more locations within the stack,
A method for storing and transporting substrates in a substrate stocker system. 16. The method of claim 15,
Further comprising the step of classifying one or more carriers and a substrate or stack by changing position when transporting the carrier and the substrate or stack between the first high density container and the mobile high density container.
A method for storing and transporting substrates in a substrate stocker system. 15. The method of claim 14,
Moving the removable high density container from the container load port to the high density storage chamber by at least one robot,
A method for storing and transporting substrates in a substrate stocker system. 15. The method of claim 14,
To form a combined stack, a first stack of carrier and substrate and a second stack of carrier and substrate from at least one of a low density container, one or more containers of a facility front shear module (EFEM), a high density container or an external dock cart, Wherein the combined stack has a smaller pitch than the pitch of each of the first and second stacks,
Wherein the combined stack is in at least one of a dense mobile container that is moved through a container load port or by an OHT to a dock cart or an external system, or a dense container stored within the dense storage chamber,
A method for storing and transporting substrates in a substrate stocker system. 18. The method of claim 17,
Forming a distributed OHT track stocker system for storing a high density container, wherein the distributed OHT track stocker system is formed in a cleaned enclosure mounted on a seal inside thereof; And
Further comprising: transferring the high density container from the high density storage area to the distributed OHT track system.
A method for storing and transporting substrates in a substrate stocker system.

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