KR20170100780A - COATING COMPOSITION OF NANOSOLUTION CONTAINING Cu-S NANOPARTICLE AND PREPARING METHOD OF THE SAME - Google Patents
COATING COMPOSITION OF NANOSOLUTION CONTAINING Cu-S NANOPARTICLE AND PREPARING METHOD OF THE SAME Download PDFInfo
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D143/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Coating compositions based on derivatives of such polymers
- C09D143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
Abstract
Description
The present invention relates to a composition for coating a Cu-S nanoparticle-containing nanocomposite including a solid formed by mixing Cu-S nanoparticles and an epoxy silicone copolymer, and a composition for coating the Cu-S nanoparticle- And a method for producing the same.
Recently, with the emphasis on the cleanliness and harmlessness of the human body, attention has been focused on materials having near-infrared blocking property, anti-electrostatic property, and antibacterial property. In particular, the present invention relates to a method of manufacturing a plastic article comprising a space such as a house, an office, an automobile and the like and a packaging material constituting the space, an electronic product exterior material, an automobile interior material, an architectural interior material, For the substrate, antimicrobial properties are required to prevent near infrared ray shielding property for preventing energy loss, fire generation due to static electricity, antistatic for preventing human body harm, and respiratory disease transmission caused by virus pathogenic bacteria.
In order to satisfy these demands, the prior art has proposed a variety of techniques for improving near-infrared barrier property, antistatic property, and antibacterial property.
In order to improve the near-infrared blocking property, Korean Patent No. 10-0998744 has prepared a shielding film by using a near infrared absorbing dye. In Korean Patent Publication No. 2010-0031034, a low-emissivity (low-E) Silver or the like, which is excellent in electrical conductivity, such as silver, to prevent energy loss.
However, in the case of containing a dye, since the decomposition of dye by light proceeds, durability and light resistance can not be maintained for a long time. In case of coating silver, application is limited due to high price, When the thickness of the coating is increased, the transparency is lowered and the passage of the radio is obstructed. In addition, silver deposition must proceed to a sputtering process, which is problematic in that the sputtering equipment is expensive and the deposition rate is slow, resulting in poor productivity.
As a method for lowering the electrostatic force density of a base material and improving the electrification property, in relation to a method of using a conductor, which is a commonly used technique, Korean Patent Registration No. 10-1163423 discloses a method of sputtering zinc oxide in a vacuum heating apparatus, In Korean Patent Laid-Open Publication No. 2015-0000569, a film having excellent antistatic property was prepared using a mixture in which a conductive nano metal was uniformly distributed in a photosensitive material. In Korean Patent Laid-Open Publication No. 2015-0092013, A conductive thin film or a conductive nanomaterial was coated thereon to increase the conductivity, thereby producing a hybrid thin film excellent in antistatic property.
However, the sputtering of zinc oxide has the effect of lowering the raw material cost compared with the sputtered product, but the problems such as the lowering of the productivity due to the low speed fixing and the deformation of the plastic material due to the high temperature are not improved, The use of nanometals or carbon nanotubes is advantageous in that they have excellent transparency and conductivity, but the price increase is too high compared to the prices of the products and substrates to be applied. In addition, when applied by wet coating instead of sputtering, the dispersibility of the coating liquid is poor and it is difficult to prepare a coating liquid containing a high concentration of solid matter.
In order to improve antimicrobial activity, Korean Patent No. 10-1095491 discloses an antiviral water-based paint prepared by mixing a plant extract with an acrylic resin and a pigment, and in Korean Patent No. 10-1184813, a seaweed extract is mixed Friendly paint with excellent antibacterial properties.
The paints using plant extracts and seaweed extracts have a disadvantage in that the cost of production is low and the initial antimicrobial activity is excellent, but the long term antimicrobial activity is difficult to maintain and the organic solvent is volatilized at a high temperature due to the use of organic solvents.
The above prior arts have problems to be improved yet, and there is a disadvantage that a plurality of technologies must be used in order to simultaneously satisfy the near-infrared blocking property, the antistatic property, and the antibacterial property. When a plurality of technologies are mixedly applied, There is a possibility that not only the impurities but also the physical adhesion between the additives and the physical properties due to the chemical reaction are lowered.
The present invention relates to a composition for coating a Cu-S nanoparticle-containing nanocomposite including a solid formed by mixing Cu-S nanoparticles and an epoxy silicone copolymer, and a composition for coating the Cu-S nanoparticle- And a method for producing the same.
However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.
The first aspect of the present invention provides a composition for coating a Cu-S nanoparticle-containing nanosized solution, which comprises a Cu-S nanoparticle, an organic solvent, and an acryl-epoxy silicone polymer.
According to a second aspect of the present invention, there is provided a method for producing Cu-S-based nanoparticles, comprising: grinding Cu-S-based particles to form Cu-S-based nanoparticles; And a step of dispersing the Cu-S nanoparticles in a solution in which an organic solvent and an acrylic-epoxy silicone polymer are mixed to obtain a coating solution for nanosuspension. Of the present invention.
The present invention relates to a composition for coating a Cu-S nanoparticle-containing nanosized solution and a method for preparing the composition for coating a nanosized solution, which comprises a Cu-S nanoparticle, an organic solvent, and an acryl-epoxy silicone polymer, Specifically, Cu-S-based particles synthesized by mixing a copper ion salt and a sulfur flame are mechanically pulverized to produce Cu-S-based nanoparticles, and a mixture of an acrylic-epoxy silicone copolymer and an organic solvent There is provided a composition for coating a Cu-S nanoparticle-containing nanosized solution having a solid concentration produced by dispersing the Cu-S nanoparticles.
According to one embodiment of the present invention, a composition for coating a Cu-S nanoparticle-containing nanocomposite may be coated on a substrate selected from the group consisting of plastic, paper, wood, metal, glass, Antistatic property and / or antimicrobial property can be satisfied at the same time, and the above substrate is required to have near infrared (NIR) barrier property, antistatic property and / or antimicrobial property such as functional packaging material, electronic product exterior material, automobile interior material, Applicable to materials.
In addition, the Cu-S nanoparticles according to one embodiment of the present invention can be mass-produced by using an ion-bonding method, have high productivity compared with the capital investment cost, and can exhibit near infrared ray blocking property, antistatic property, Can be improved.
1 is a structural view of Cu-S based particles according to one embodiment of the present invention.
2 is an SEM image of Cu-S-based particles heat-treated at 200 ° C in one embodiment of the present application.
3 is a graph showing the results of XRD analysis of heat-treated Cu-S based particles in one embodiment of the present invention.
FIG. 4 is a graph showing the results of measurement of the transmittance according to the wavelength of heat-treated Cu-S-based particles in one embodiment of the present invention.
FIG. 5 is a photograph of a composition for coating a Cu-S nanoparticle-containing nano solution according to an embodiment of the present invention.
6 is a photograph of a film coated using a composition for coating a Cu-S nanoparticle-containing nanos solution according to an embodiment of the present invention.
7 is a photograph showing antimicrobial activity of the coated film using a composition for coating a Cu-S nanoparticle-containing nanosized solution according to an embodiment of the present invention.
8 is an SEM image of Cu-S-based particles heat-treated at 500 ° C according to a comparative example.
9 is a photograph showing antibacterial activity of the coated film using the composition for coating a Cu-S nanoparticle-containing nanosized solution according to a comparative example.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.
Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.
Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.
Throughout this specification, when an element is referred to as " including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms " about ", " substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) " or " step " used to the extent that it is used throughout the specification does not mean " step for.
Throughout this specification, the term " combination (s) thereof " included in the expression of the machine form means a mixture or combination of one or more elements selected from the group consisting of the constituents described in the expression of the form of a marker, Quot; means at least one selected from the group consisting of the above-mentioned elements.
Throughout this specification, the description of "A and / or B" means "A or B, or A and B".
Hereinafter, embodiments and examples of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to these embodiments and examples and drawings.
The first aspect of the present invention provides a composition for coating a Cu-S nanoparticle-containing nanosized solution, which comprises a Cu-S nanoparticle, an organic solvent, and an acryl-epoxy silicone polymer.
According to one embodiment of the present invention, a composition for coating a Cu-S nanoparticle-containing nanocomposite may be coated on a substrate selected from the group consisting of plastic, paper, wood, metal, glass, Antistatic property and / or antimicrobial property can be satisfied at the same time, and the above substrate is required to have near infrared (NIR) barrier property, antistatic property and / or antimicrobial property such as functional packaging material, electronic product exterior material, automobile interior material, It can be applied to material.
In one embodiment of the present invention, the Cu-S nanoparticles may include particles having a nanometer size formed by pulverizing Cu-S particles, and the Cu-S nanoparticles may be spherical or non-spherical But may not be limited thereto. In one embodiment of the present invention, when the Cu-S nanoparticles are formed into a non-spherical shape, the electromagnetic wave shielding property may be more excellent than when the Cu-S nanoparticles are formed into a spherical shape.
In one embodiment of the present invention, the Cu-S nanoparticles may have a size of about 10 nm to about 100 nm, but the present invention is not limited thereto. For example, the size of the Cu-S nanoparticles may range from about 10 nm to about 100 nm, from about 10 nm to about 80 nm, from about 10 nm to about 60 nm, from about 10 nm to about 40 nm, About 20 nm, about 20 nm to about 100 nm, about 40 nm to about 100 nm, about 60 nm to about 100 nm, or about 80 nm to about 100 nm. For example, when the particle size is greater than about 100 nm, the coating composition of the nanosized solution coating may be poor, stability may be poor, and the sedimentation rate may be accelerated. If the particle size is less than about 10 nm, the aggregation phenomenon easily occurs due to an increase in the total surface energy of the particles, so that the dispersibility and stability can be lowered.
In one embodiment of the present invention, the Cu-S-based nanoparticles may exhibit semiconductor characteristics having a band gap energy of about 1.0 eV to about 1.6 eV. Since the Cu-S nanoparticles have a small band gap energy, the Cu-S nanoparticles are in the form of a semiconductor structure capable of moving electrons according to wavelengths supplied from the outside. Since the heat ray mainly has a wavelength of about 800 nm to about 1,500 nm, energy absorption at a wavelength of about 800 nm to about 1,500 nm is required for electron transfer of Cu-S nanoparticles exhibiting the semiconductor characteristics, The higher the absorption rate, the higher the thermal conductivity. For example, if the band gap energy is less than about 1.0 eV, absorption may occur at a wavelength of about 1,500 nm or more, and if the band gap energy is about 1.5 eV or more, absorption at a wavelength of about 800 nm or less may occur . As described above, since the Cu-S nanoparticles simultaneously reflect and absorb electromagnetic waves, it is possible to achieve electromagnetic wave shielding performance and heat shielding in the near infrared region (NIR) at the same time.
In one embodiment of the present invention, about 1 part by weight to about 30 parts by weight of the Cu-S nanoparticles are added to about 100 parts by weight of the composition for coating the Cu-S nanoparticle-containing nanocomposite But may not be limited thereto. For example, the Cu-S nanoparticles may include about 5 parts by weight to about 30 parts by weight, but the present invention is not limited thereto.
In one embodiment of the present invention, the Cu-S nanoparticles generally have a high surface energy and easily agglomerate. Therefore, the nanosized nanosized nanosized nanostructures having a high concentration of solids at about 5 parts by weight to about 30 parts by weight To prepare the solution coating composition, the dispersibility between the Cu-S nanoparticles and the organic solvent can be improved by adding the acrylic-epoxy silicone copolymer.
In one embodiment of the present invention, about 0.01 part by weight to about 0.1 part by weight of the acryl-epoxy silicone polymer may be contained in about 100 parts by weight of the composition for coating the Cu-S nanoparticle-containing nanosized solution However, the present invention is not limited thereto. For example, when the amount of the acrylic-epoxy silicone polymer is about 0.01 parts by weight or less, the effect of improving dispersibility may not be exhibited. For example, when the amount of the acrylic-epoxy silicone polymer is about 0.1 parts by weight or more, an excessive amount of the acrylic-epoxy silicone polymer may remain in the organic solvent, so that the Cu-S nanoparticles may agglomerate.
In one embodiment of the present invention, the organic solvent may be selected from the group consisting of benzene, toluene, ethanol, methanol, isopropanol, butanol, ethylene glycol, octanol, and combinations thereof. .
In one embodiment of the present invention, the acrylic-epoxy silicone polymer may include, but is not limited to, an acrylic resin and an epoxy silicone copolymer. The acrylic-epoxy silicone polymer may be obtained by graft copolymerizing or block copolymerizing epoxy silicone with the acrylic resin, but may not be limited thereto.
In one embodiment of the invention, the acrylic resin is selected from the group consisting of methyl methacrylate, methacrylic acid, hydroxyethyl methacrylate, methyl methacrylate, methyl acrylate, and combinations thereof , But may not be limited thereto.
According to a second aspect of the present invention, there is provided a method for producing Cu-S-based nanoparticles, comprising: grinding Cu-S-based particles to form Cu-S-based nanoparticles; And a step of dispersing the Cu-S nanoparticles in a solution in which an organic solvent and an acrylic-epoxy silicone polymer are mixed to obtain a coating solution for nanosuspension. Of the present invention. The second aspect of the present invention relates to a method for preparing a composition for coating a Cu-S nanoparticle-containing nanosuspension according to the first aspect of the present invention, and a detailed description of parts overlapping with the first aspect of the present application is omitted However, the description of the first aspect of the present application may be applied equally to the second aspect of the present invention even if the description thereof is omitted.
In one embodiment of the present invention, Cu-S-based particles synthesized by mixing a copper ion salt and a sulfur flame are mechanically pulverized to produce Cu-S-based nanoparticles, and an acrylic-epoxy silicone copolymer and an organic solvent Wherein the Cu-S nanoparticles are dispersed in a mixed solution to have a solid concentration of about 5 parts by weight to about 30 parts by weight.
In order to prepare Cu-S-based particles according to one embodiment of the present invention, first, a copper ion salt and a sulfur flame are added to a mixture of water and an organic solvent to prepare a Cu-S-based particle. As shown in FIG. 1, the Cu-S-based particles may be a hexagonal system mainly composed of CS 3 and CS 4 structures, but may not be limited thereto. CS 3 and CS 4 in FIG. 1 are respectively in the form of triangular planes and triplets, and can be easily deformed according to external variables such as temperature, pressure and wavelength, and can be used as materials for conductivity and electromagnetic shielding.
In one embodiment of the invention, the copper ion salt may be selected from the group consisting of copper sulphide, cupric chloride, cupric nitrate, copper carbonate, copper acetate, and combinations thereof. But may not be limited.
In one embodiment of the present invention, the sulfur flame may include but is not limited to those selected from the group consisting of sodium sulfide, potassium sulfide, zinc sulfide, iron sulfide, and combinations thereof.
In one embodiment of the invention, the copper ion salt and the sulfur flame may be added to the mixed solution in a weight ratio of about 1: 1 to about 2: 1, but may not be limited thereto.
In one embodiment of the present invention, the water may be at least about 95 parts by weight based on about 100 parts by weight of the mixed solution, but the present invention is not limited thereto. For example, when the water content is about 95 parts by weight or less, the barrier properties, antistatic properties and antimicrobial properties of the Cu-S based particles can not be improved at the same time, and durability may be deteriorated when heat treatment is performed at a high temperature.
In one embodiment of the present invention, the organic solvent may include, but is not limited to, an alcohol solvent such as ethanol, methanol, and butanol. The shape and specific surface area of the particles can be increased by synthesizing the Cu-S based particles using the organic solvent according to one embodiment of the present invention. However, when an excessive amount of the organic solvent is used, for example, the density of the Cu-S-based particles may be lowered and durability may be lowered.
In one embodiment of the present invention, the synthesis of the Cu-S-based particles may be performed at a pH of about 1 to about pH 5, but may not be limited thereto.
In one embodiment of the present invention, the method may further include a step of drying the solution containing the synthesized Cu-S-based particles, followed by heat treatment, but the present invention is not limited thereto.
In one embodiment of the present invention, the heat treatment of the synthesized Cu-S based particles may be performed at a temperature ranging from about 200 ° C to about 300 ° C, but may not be limited thereto. For example, if the heat treatment temperature is about 300 ° C or higher, the internal structure may collapse due to pyrolysis of the Cu-S-based particles.
In one embodiment of the present invention, the Cu: S atomic ratio of the heat-treated Cu-S-based particles may be about 3 to about 15, but may not be limited thereto. For example, when the atomic ratio is less than about 3 and the content of S is increased, the near-infrared blocking property and the antistatic property can be reduced. For example, if the atomic ratio is greater than about 15, the antimicrobial activity may be reduced.
In order to prepare a composition for coating a Cu-S nanoparticle-containing nanosized solution according to an embodiment of the present invention, the synthesized Cu-S-based particles are mechanically pulverized to prepare nanoparticles having a nanometer size. The prepared Cu-S nanoparticles are dispersed in a mixed solution of an organic solvent and an acrylic-epoxy silicone polymer to prepare a coating solution nano-solution containing Cu-S nanoparticles.
In one embodiment of the present invention, the Cu-S nanoparticles may have a size of about 10 nm to about 100 nm, but the present invention is not limited thereto. For example, the size of the Cu-S nanoparticles may range from about 10 nm to about 100 nm, from about 10 nm to about 80 nm, from about 10 nm to about 60 nm, from about 10 nm to about 40 nm, About 20 nm, about 20 nm to about 100 nm, about 40 nm to about 100 nm, about 60 nm to about 100 nm, or about 80 nm to about 100 nm.
In one embodiment of the present invention, the organic solvent may be selected from the group consisting of benzene, toluene, ethanol, methanol, isopropanol, butanol, ethylene glycol, octanol, and combinations thereof. .
In one embodiment of the present invention, about 1 part by weight to about 30 parts by weight of the Cu-S nanoparticles are added to about 100 parts by weight of the composition for coating the Cu-S nanoparticle-containing nanocomposite But may not be limited thereto. For example, the Cu-S nanoparticles may include about 5 parts by weight to about 30 parts by weight, but the present invention is not limited thereto.
In one embodiment of the present invention, the Cu-S nanoparticles generally have a high surface energy and easily agglomerate. Therefore, the nanosized nanosized nanosized nanostructures having a high concentration of solids at about 5 parts by weight to about 30 parts by weight To prepare the solution coating composition, the dispersibility between the Cu-S nanoparticles and the organic solvent can be improved by adding the acrylic-epoxy silicone copolymer.
In one embodiment of the present invention, about 0.01 part by weight to about 0.1 part by weight of the acryl-epoxy silicone polymer may be contained in about 100 parts by weight of the composition for coating the Cu-S nanoparticle-containing nanosized solution However, the present invention is not limited thereto. For example, when the amount of the acrylic-epoxy silicone polymer is about 0.01 parts by weight or less, the effect of improving dispersibility may not be exhibited. For example, when the amount of the acrylic-epoxy silicone polymer is about 0.1 parts by weight or more, an excessive amount of the acrylic-epoxy silicone polymer may remain in the organic solvent, so that the Cu-S nanoparticles may agglomerate.
In one embodiment of the present invention, the acrylic-epoxy silicone polymer may include, but is not limited to, an acrylic resin and an epoxy silicone copolymer.
In one embodiment of the invention, the acrylic resin is selected from the group consisting of methyl methacrylate, methacrylic acid, hydroxyethyl methacrylate, methyl methacrylate, methyl acrylate, and combinations thereof , But may not be limited thereto.
Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited thereto.
[Characteristic evaluation]
1. Average particle size
The average size of Cu-S nanoparticles was measured using a particle size analyzer (ELS-Z2, Otsuka Electronics Co., Japan).
2. Atomic ratio
After the Cu-S nanoparticles were completely burned to obtain a material, the obtained material was subjected to X-ray fluorescence (XRF) (S4, Bruker Co., Switzerland) The weight (%) was measured. The atomic ratio of Cu: S was calculated using the above measured values.
3. Crystal structure
The crystal structure of Cu-S nanoparticles was evaluated using X-ray diffraction (XRD) (Smart Apex II, Bruker Co., USA).
4. Band gap Energy measurement
The absorption wavelength of Cu-S nanoparticles was measured using a fourier transform infrared spectrometer (FT-IR) (IFS-66/6, Bruker Co., Switzerland) The band-gap energy was measured using the following equation after measuring the wavelength with the highest absorption rate.
Here, h : Planck's constant (4.135667 × 10 -15 eVs), c: light speed (3 × 10 8 m / s), and λ: absorption wavelength (nm).
5. Dispersibility
The dispersibility of samples containing Cu-S nanoparticles was measured using a Z-potential energy meter (Dean-Z2, Otsuka Electronics, Japan) (?) And defective (X), respectively:
Excellent (?): 50 mV or more, normal (?): 20 mV to 50 mV, and defective (x): 20 mV or less.
6. Near infrared Barrier property
Absorbance of the sample was measured at a wavelength of 800 nm to 1,200 nm using a near infrared ray spectrometer (Cary 5000, Agilent Technologies Inc., USA) and the energy barrier property was evaluated as excellent (?), Normal (?), Evaluation:
Excellent (∘): 65% or more, normal (Δ): 50% to 65%, and poor (×): 50% or less.
7. Antistatic
The antistatic property of the sample was measured under the conditions of 23 ° C, 60% relative humidity and 500 V using a non-surface resistance meter (Hewlett-Packard USA, USA) , And defective (X):
Good (○): 1 × 10 8 Ω · cm or less, ordinary (△): 1 × 10 8 Ω · cm to 1 × 10 12 Ω · cm, Bad (×): 1 × 10 12 Ω · cm or more (measurement Not included).
8. Antimicrobial activity
According to JIS Z 2801 evaluation method, Escher The antimicrobial activity was measured by the area ratio of the remaining bacteria after culturing at 25 ° C for 24 hours. The antimicrobial activity was evaluated as good (.smallcircle.), normal (.DELTA.), , And defective (X):
Excellent (∘): Antimicrobial activity 70% or more, Normal (△): Antimicrobial activity 50% to 70%, Bad (×): Antimicrobial activity 50% or less.
[ Example One]
100 g of copper sulfate and 70 g of sodium sulfide were sufficiently dissolved in 500 mL of pure water at 30 DEG C, respectively, and mixed and stirred for 60 minutes to synthesize Cu-S-based particles. The aqueous solution containing the synthesized Cu-S-based particles at pH 1 was dried at 50 ° C for 60 minutes and then heat-treated at 200 ° C for 150 minutes. S-type nanoparticles (10 wt%) were prepared by thoroughly mixing toluene (89.95 wt%) with an acryl-epoxy silicone polymer (0.05 wt%) and then using an glass ball mill to limit the average particle size to 90 nm wt%) was added to prepare a nano solution for coating.
The coating nano solution prepared above was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm using a gravure coater. At this time, the atomic ratio of Cu: S of the Cu-S nanoparticles contained in the coating solution was 4.9.
FIG. 2 is an SEM image (1,000 times magnification) of Cu-S-based particles heat-treated at 200 ° C. according to the present embodiment, and FIG. 3 is a crystal structure of heat-treated Cu-S- And at 50 °, the intrinsic peak of Cu-S-based particles was observed. FIG. 4 shows the results of measuring the transmittance of the heat-treated Cu-S based on the wavelength. The band gap energy of the Cu-S based on 1,100 nm was 1.13 eV and the energy barrier property was excellent at 78% .
FIG. 5 is a photograph of a composition for coating a Cu-S nanoparticle-containing nanosized solution prepared according to the present embodiment, wherein the composition for coating a Cu-S nanoparticle-containing nanosized solution was measured with a Z- The energy value was -5 mV and the dispersibility was excellent.
FIG. 6 is a photograph of a PET film coated using a composition for coating a Cu-S nanoparticle with a nanocrystal-containing solution prepared according to the present embodiment. The film had a surface resistance of 1 × 10 6 Ω · cm, And as shown in Fig. 7, the antimicrobial activity was also excellent at over 99%.
[ Comparative Example One]
Cu-S type particles were synthesized under the same conditions as in Example 1, and the synthesized Cu-S type particles were dried at 50 ° C. for 60 minutes and then heat-treated at 500 ° C. for 150 minutes. Respectively. A coating solution containing 10 wt% of Cu-S nanoparticles was prepared and coated on a PET film in the same manner as in Example 1. The atomic ratio of Cu: S of the Cu-S nanoparticles contained in the coating solution was 15.6.
FIG. 8 is an SEM image (1,000 times magnification) of Cu-S-based particles heat-treated at 500 ° C. according to Comparative Example 1. The surface resistance of the film coated with the composition of the Cu-S nanoparticle-containing nanosized solution prepared according to Comparative Example 1 was 10 x 10 < 9 > OMEGA .cm, and the antistatic property was normal. The dispersibility (-35 mV) and the near infrared barrier property of a composition for coating a nano solution were also evaluated to be normal (60%). However, as shown in Fig. 9, the antibacterial activity was poor.
[ Example 2 to 5, and Comparative Example 2 to 5]
A composition for coating a Cu-S nanoparticle-containing nanosized solution was prepared in the same manner as in Example 1, and the synthesis conditions are shown in Table 1 below.
[Table 1]
The results of the characteristics of the Cu-S particles and the Cu-S nanoparticle-containing nanosized solution coating compositions prepared as the present and comparative examples are shown in Table 2 below.
[Table 2]
It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.
Claims (12)
A composition for coating a Cu-S nanoparticle-containing nanosolution.
Wherein the Cu-S nanoparticles have a size of 10 nm to 100 nm.
Wherein the organic solvent comprises one selected from the group consisting of benzene, toluene, ethanol, methanol, isopropanol, butanol, ethylene glycol, octanol, and combinations thereof. / RTI >
Wherein the acryl-epoxy silicone polymer comprises a copolymer of an acrylic resin and an epoxy silicone.
Wherein the acrylic resin includes one selected from the group consisting of methyl methacrylate, methacrylic acid, hydroxyethyl methacrylate, methyl methacrylate, methyl acrylate, and combinations thereof. A composition for coating a nanoparticle-containing nanosolution.
Wherein 0.01 to 0.1 parts by weight of the acrylic-epoxy silicone polymer is contained in 100 parts by weight of the composition for coating a Cu-S nanoparticle-containing nanosized solution, and 1 part by weight of the Cu-S- To 30 parts by weight of a Cu-S based nanoparticle-containing nano solution.
Dispersing the Cu-S nanoparticles in a solution mixed with an organic solvent and an acrylic-epoxy silicone polymer to obtain a coating nano solution
Containing nanoparticle-containing nanocomposite coating composition.
Wherein the organic solvent comprises one selected from the group consisting of benzene, toluene, ethanol, methanol, isopropanol, butanol, ethylene glycol, octanol, and combinations thereof. ≪ / RTI >
Wherein the Cu-S based particles are prepared by adding a copper ion salt and a sulfur flame to a mixture of water and an organic solvent to prepare a solution containing the synthesized Cu-S based particles, followed by drying and heat treatment. A method for preparing a composition for coating a Cu-S nanoparticle-containing nanosized solution.
Wherein the acrylic-epoxy silicone polymer comprises a copolymer of an acrylic resin and an epoxy silicone.
Wherein the acrylic resin includes one selected from the group consisting of methyl methacrylate, methacrylic acid, hydroxyethyl methacrylate, methyl methacrylate, methyl acrylate, and combinations thereof. A method for preparing a nanoparticle-containing nanosized solution coating composition.
Wherein 0.01 to 0.1 parts by weight of the acrylic-epoxy silicone polymer is contained in 100 parts by weight of the composition for coating a Cu-S nanoparticle-containing nanosized solution, and 1 part by weight of the Cu-S- To 30 parts by weight based on the total weight of the composition.
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