KR20170090146A - System and method for runnerless injection molding - Google Patents

System and method for runnerless injection molding Download PDF

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Publication number
KR20170090146A
KR20170090146A KR1020160010644A KR20160010644A KR20170090146A KR 20170090146 A KR20170090146 A KR 20170090146A KR 1020160010644 A KR1020160010644 A KR 1020160010644A KR 20160010644 A KR20160010644 A KR 20160010644A KR 20170090146 A KR20170090146 A KR 20170090146A
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KR
South Korea
Prior art keywords
resin
injection molding
runner plate
mold
plate
Prior art date
Application number
KR1020160010644A
Other languages
Korean (ko)
Inventor
김진태
Original Assignee
(주)뉴티스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)뉴티스 filed Critical (주)뉴티스
Priority to KR1020160010644A priority Critical patent/KR20170090146A/en
Publication of KR20170090146A publication Critical patent/KR20170090146A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D99/00—Subject matter not provided for in other groups of this subclass
    • B29D99/0003—Producing profiled members, e.g. beams

Abstract

The present invention relates to a runnerless injection molding system and an injection molding method using the same. The runnerless injection molding system comprises a movable side mold, a fixed side mold, a runner plate, and a heating plate. In the runner plate, multiple runners and resin moving channels for supplying melted resin to cavities for injection molding of products are formed or mounted. Once the injection process is completed, in order to re-melt the solidified resin, the heating plate heated at a high temperature is brought into contact with an upper portion and/or a lower portion of the runner plate to heat the runner plate to a temperature equal to or greater than the melting point of the resin. The heating plate is separated from the runner plate after the solidified resin in the runners and the resin moving channels is melted, and the runner plate is coupled to the mold to proceed with the following injection process.

Description

[0001] The present invention relates to a runnerless injection molding system and a method of injection molding using the same,

The present invention relates to a runnerless injection molding system. More particularly, the present invention relates to a runnerless injection molding system for heating a runner plate using a heating plate to melt a solidified resin in a runner plate so as to be in an injectable state, and an injection molding method using the same.

The injection-molding mold is composed of a stationary-side mold and a movable-side mold. When the movable-side mold is coupled to the stationary-side mold, a cavity is formed in which the product is formed. The molten resin is injected at a high pressure into a cavity in the mold through a sprue, a runner and a gate to mold the resin product, and when the injected resin is cooled and solidified, And the molded product is extracted by separating from the fixed-side mold.

In a cold runner system, the resin inside the runner is cooled and solidified together with the resin in the cavity, extracted together with the molded product, and the extracted runner portion is removed from the product. On the other hand, a hot runner system is a method of heating the periphery of a runner by a heater in order to prevent the resin in the runner from being cooled and solidified. Usually, the manifold is heated by a heater to maintain the temperature of the runner portion excluding the gate at a high temperature And keeps the resin in the manifold always in a molten state. When the resin is injected from the nozzle into the heated manifold, the resin flows into the cavity of the mold through the internal passage of the manifold in a molten state, and the manifold is precisely temperature-controlled as an extension of the heating cylinder do. Such a hot runner injection molding system has advantages of saving raw material and energy by transferring molten resin to a long distance without loss or change of temperature during melting. In such a hot runner system, a precise product can be molded only when various conditions such as proper distribution of the molten resin injected into the cavity of the mold, maintenance of an appropriate temperature, and stable upward / downward movement of the valve pin are satisfied.

The conventional hot runner system is disadvantageous in that a product requiring compactness or high precision is molded due to structural limitations such as a heater and a temperature sensor being mounted on a runner portion in order to heat the runner portion and control the temperature. Particularly, an injection mold of an ultra-small product such as a light emitting diode (LED) lead frame has a problem that it is difficult to apply the conventional hot runner method in practice due to a large number of highly integrated cavities.

It is an object of the present invention to provide a runnerless injection molding system for rapidly heating a runner plate to melt a solidified resin in a runner plate to make it in an injectable state.

Another object of the present invention is to provide a runnerless injection molding system which is easy to maintain and which has no limit on the unit interval and which is very advantageous for a multi-cavity mold.

It is still another object of the present invention to provide a runnerless injection molding machine which can be applied even to a highly integrated cavity mold in which there is no need to mount a separate heater for heating a runner plate, System.

According to one embodiment of the present invention, a runnerless injection molding system comprises a plurality of runners for supplying a molten resin into a cavity for injection molding a product, a runner plate formed with resin transfer passages, A heating plate for contacting the runner plate with the lower portion or heating the runner plate to a temperature higher than the melting point of the resin, and a mold coupled with the runner plate to form the cavities. The resin solidified in the runners and the resin transfer passages is heated and melted by the heating plate heated to a high temperature. The heating plate is separated from the runner plate after the coagulated resin in the runners and the resin transfer passages is melted and the runner plate is fastened to the mold to perform a subsequent injection process.

According to another embodiment of the present invention, a cooling channel for cooling the resin injected into the cavities may further be formed in the mold.

According to another embodiment of the present invention, a method of manufacturing an injection molded product using a runnerless injection molding system includes the steps of discharging injection molded products formed in cavities by separating a runner plate and a mold, Melting the resin solidified within the runners and the resin transfer passages by contacting a heated plate heated to a lower portion and / or a lower portion of the runner plate, separating the heated plate from the runner plate, and And inserting the runner plate with the mold to inject the resin into the cavities to mold the injection-molded products. And cooling the resin injected into the cavities by circulating a coolant through the cooling channels formed in the mold.

The injection molding system according to the present invention can be easily maintained and is not limited by the unit interval, which is very advantageous for a multi-cavity mold. In particular, in the case of an ultra-small product such as an LED lead frame, the conventional hot runner system is difficult to use due to a large number of highly integrated cavities. However, since the injection molding system according to the present invention has almost no restriction on the interval between units, It is also applicable to a highly integrated cavity die having a minimized pitch between the die and the die.

1 is a schematic block diagram of a runnerless injection molding system according to an embodiment of the present invention.
2 to 5 illustrate an injection process using the runnerless injection molding system of FIG.
6 and 7 show the state of the resin cooled and solidified by the cooling channel and the cooling channel provided in the runnerless injection molding system of Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The terms used in the present specification are selected in consideration of the functions in the embodiments, and the meaning of the terms may vary depending on the intention of the user or operator, a precedent, or the like. The meanings of the terms used in the following embodiments are defined according to their definitions when they are specifically defined in this specification, and unless otherwise defined, they should be construed in a sense generally recognized by those skilled in the art.

1 is a schematic configuration diagram of an example of a runnerless injection molding system 100 according to an embodiment of the present invention. The system shown in Fig. 1 is only an example, and the present invention is also applicable to a runnerless injection molding system having a configuration different from that shown in Fig. The runnerless injection molding system is constituted by the movable side mold 110, the fixed side mold 120, the runner plate 130, and the heating plate 140. A resin transfer passage 132, a runner 134, and a gate 136 are formed or mounted on the runner plate 130 so that the molten resin supplied from the nozzle 112 is injected into a cavity constituting the shape of the product .

The movable mold 110 and the runner plate 130 are coupled to the stationary mold 120 to form a cavity forming the shape of the injection product. The melted resin is injected from the nozzle 112 of the extruder, passes through the resin transfer passage 132, passes through the runner 134, and passes through the gate 136 to fill the cavity of the product shape. The resin transfer passage 132 serves as a path for sending the molten resin injected from the injector nozzle 112 to the runner 134 and the gate 136 communicates with the runner 134 below the runner 134, 134 is injected into the cavity of the shape of the product.

One or a plurality of heating plates 140 are heated to a high temperature by using, for example, an internally installed heater, and are brought into contact with the upper and / or lower surfaces of the runner plate 130, 130) to the melting point or higher. A temperature sensor may be provided on the heating plate 140 to adjust the temperature of the heating plate 140 to a desired range. The runnerless injection molding system according to the present invention is characterized in that the runner plate 130 or the movable mold 110 is heated by the runner plate 130 so that a separate heater for melting the solidified resin in the runner plate 130 is mounted You do not have to.

An injection process using a runnerless injection molding system according to an embodiment of the present invention will be described with reference to FIGS.

Fig. 2 shows a state in which the injection process is completed, the runner plate 130 and the movable-side mold 110 are separated from the fixed-side mold 120, and the molded product is extracted in the cavity. At this time, the resin in the runner 134 is solidified and solidified.

Fig. 3 shows a state in which the heating plate 140 and the runner plate 130 are engaged and a solidified resin in the runner 134 is melted again. After the molded product is extracted, one or more (preferably two) heating plates 140 move to the runner plate 130 and engage the runner plate 130. The heating plate 140 maintains the heated state at a high temperature and contacts the upper surface and / or the lower surface of the runner plate 130 to rapidly heat the runner plate 130 to a temperature higher than the melting point of the resin. The resin solidified in the runner 134 and the resin passage in the runner plate 130 is heated to a temperature higher than the melting point of the resin by the heating plate 140,

Fig. 4 shows a state in which the heating plate 140 is separated from the runner plate 130 after the resin in the runner plate 130 is melted again by the heating plate 140. Fig. When the runner plate 130 is heated and the resin in the runner plate 130 is melted again, the heating plate 140 is separated from the runner plate 130 and moved to the original position.

5 shows a state in which the movable mold 110 and the runner plate 130 are coupled to the stationary mold 120 again. After the heating plate 140 is separated, the movable mold 110 and the runner plate 130 are again engaged with the stationary mold 120, the molten resin is injected from the nozzle 112, and a subsequent injection molding process is performed It starts.

In the runnerless injection molding system according to the present invention, a separate heating device such as a heater, a temperature sensor, or the like does not need to be installed in the runner plate 130 or the movable mold 110, There is an advantage that it can be applied to arrays. Therefore, the present invention can be applied to injection molding of ultra-small products such as LED lead frames.

According to another embodiment of the present invention, the cooling channel 150 may be provided in the fixed side mold 120 and / or the movable side mold 110 as shown in FIGS. 6 shows a state in which the molten resin is injected into the cavity by the injection process in a state where the movable mold 110 is closed in the fixed mold 120. FIG 7 shows a state in which the refrigerant is circulated in the cooling channel 150 The resin injected into the cavity and the resin in the runner 134 are cooled and solidified. The resin injected into the cavity and the runner plate 130 are rapidly cooled using the cooling channel 150 to obtain a state in which the gate and the product can be separated within a short time. Fig. 7 shows the position where the gate and the product are separated. The fixed side mold 120 and / or the movable side mold 110 can always maintain a low temperature state by using the cooling channel 150 and the rapid cooling of the runner plate 130 immediately after the molten resin is injected into the cavity It is possible.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Therefore, the present invention should be construed as a description of the claims which are intended to cover obvious variations that can be derived from the described embodiments.

100: injection molding system
110: movable side mold
120: Fixed side mold
130: Runner plate
132: resin passage
134: Runner
136: Gate
140: Heating plate
150: cooling channel

Claims (7)

A runner plate having a plurality of runners and resin transfer passages formed therein for supplying the molten resin into the cavity for injection molding the product;
A heating plate for contacting the upper and / or lower portions of the runner plate to heat the runner plate to a melting point or higher of the resin; And
And a mold for forming the cavities,
Wherein the resin solidified in the runners is heated and melted by the heating plate. The runnerless injection molding system according to claim 1, wherein a cooling channel for cooling the resin injected into the cavities is formed in the mold. In the runnerless injection molding system of claim 1, the heating plate is separated from the runner plate after the coagulated resin in the runners and the resin transfer passages are melted and the runner plate is fastened with the mold to perform a subsequent injection process Wherein the runnerless injection molding system comprises: The runnerless injection molding system of claim 1, wherein the injection molded products are light emitting diode (LED) lead frames. A method of manufacturing an injection molded product using the runnerless injection molding system of any one of claims 1 to 4,
Separating the runner plate and the mold to discharge injection molded products formed in the cavities;
Melting the resin solidified in the runners and the resin transfer paths by contacting a heated plate heated to the runner plate to the upper and / or lower portions of the runner plate;
Separating the heating plate from the runner plate; And
And inserting the resin into the cavities to form the injection-molded products by fastening the runner plate to the mold and molding the injection-molded products. The runnerless injection molding method according to claim 5, further comprising circulating a coolant in a cooling channel formed in the mold to cool the resin injected into the cavities. The runnerless injection molding method according to claim 5, wherein the injection-molded products are light-emitting diode (LED) lead frames.
KR1020160010644A 2016-01-28 2016-01-28 System and method for runnerless injection molding KR20170090146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160010644A KR20170090146A (en) 2016-01-28 2016-01-28 System and method for runnerless injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160010644A KR20170090146A (en) 2016-01-28 2016-01-28 System and method for runnerless injection molding

Publications (1)

Publication Number Publication Date
KR20170090146A true KR20170090146A (en) 2017-08-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160010644A KR20170090146A (en) 2016-01-28 2016-01-28 System and method for runnerless injection molding

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