KR20170079945A - Black back sheet for solar cell, solar cell module comprising the same and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a solar cell black back sheet, a solar cell module including the same, and a manufacturing method thereof. The present application is an encapsulant integral type, comprising: a substrate; An infrared transmitting black pigment layer formed on the substrate; And an encapsulant layer formed on the infrared transmitting black pigment layer, and a method for producing the same. The present application also provides a solar cell module including the black back sheet and a method of manufacturing the solar cell module. According to the present application, the energy efficiency of the solar cell module can be improved and the productivity can be increased.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solar cell module, a solar cell module, a solar cell module,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solar cell black back sheet, a solar cell module including the solar cell, and a method of manufacturing the same. More particularly, the present invention relates to a solar cell black body capable of improving energy efficiency of a solar cell module, A back sheet, a solar cell module including the same, and a manufacturing method thereof.

In recent years, interest in renewable energy and clean energy has increased due to global environmental problems and depletion of fossil fuels. Among them, solar cells using solar light are attracting attention as a representative environmentally friendly energy source capable of solving environmental problems and fossil fuel depletion problems.

Solar cells are devices that convert sunlight into electrical energy, which is exposed to the external environment for a long time to easily absorb sunlight. Accordingly, the solar cell is manufactured in a unit type by performing various packaging for protecting the cell, and this unit is generally called a solar cell module.

Generally, a solar cell module includes a backsheet capable of stably protecting the cell from the external environment. This will be described with reference to FIG.

1 is a cross-sectional view of a conventional solar cell module according to a conventional technology. 1 shows a back sheet according to the prior art.

1, generally, a solar cell module includes a transparent tempered glass 3, a front encapsulant layer 2a, a plurality of solar cell C, a back encapsulant layer 2b, and a back sheet 1 ) Are stacked in this order. The plurality of solar cells C are electrically connected to each other and are packed by the sealing material layers 2a and 2b. That is, as shown in FIG. 1, the solar cell C is packed and fixed between the front sealing material layer 2a and the rear sealing material layer 2b.

An encapsulant such as an ethylene-vinyl acetate copolymer (EVA resin) is mainly used for the encapsulation material layers 2a and 2b. The ethylene-vinyl acetate copolymer (EVA resin) is advantageous for packing (fixing) the solar cell C and is useful as an encapsulating material. The back sheet 1 is attached to the lower surface of the solar cell module, that is, the lower surface of the rear sealing material layer 2b to protect the solar cell C. At this time, the back sheet 1 is adhered to the back sealing material layer 2b through an adhesive or heat laminated and adhered thereto.

The solar cell module is required to have a long life without a reduction in output over a long period of time. For such longevity, the backsheet 1 is required to be able to block moisture and oxygen which adversely affect the cell C, and to prevent deterioration due to ultraviolet rays or the like. Accordingly, the backsheet 1 should be made of a material that can withstand high temperatures, humidity, and ultraviolet rays in order to increase the life span of the solar cell module. Further, the back sheet 1 should be able to be supplied at a low cost considering the manufacturing cost.

Generally, the backsheet 1 comprises a base material 1a and a surface layer 1b formed on both sides of the base material 1a. As the substrate 1a, a heat-resistant polyethylene terephthalate (PET) film is mainly used. As the surface layer 1b, a fluorinated polymer film such as polyvinylidene fluoride (PVDF) is mainly used. The fluorine-based polymer has an excellent durability. For example, Korean Patent No. 10-1022820 and Korean Patent Laid-open No. 10-2011-0020227 disclose techniques related to this.

In addition, solar cell modules installed in buildings have mainly black color. At this time, the black color is realized by the back sheet (1). Specifically, a black pigment is added to the surface layer 1b constituting the back sheet 1 to realize a black color, and carbon black is used as the black pigment.

However, the black back sheet 1 according to the related art has a problem of low energy efficiency. Specifically, the carbon black is useful in realizing a black color, but it has a problem of absorbing light (particularly, infrared rays) and converting it into heat energy (generating heat). At this time, the generated heat raises the temperature of the module and lowers the energy efficiency.

In addition, the manufacturing process of the solar cell module according to the related art has a problem in that productivity is low. Specifically, in manufacturing the solar cell module, a front encapsulant layer 2a is first formed on the transparent tempered glass 3, and a plurality of solar cells C are electrically connected to the front encapsulant layer 2a And then the process goes to a step of laminating the rear sealing material layer 2b on the solar cell C and then joining the black back sheet 1 onto the rear sealing material layer 2b, The manufacturing process is complicated and productivity is low.

Accordingly, the present application is directed to an improved solar cell black back sheet, a solar cell module including the same, and a manufacturing method thereof.

Specifically, the present application aims to provide a solar cell black back sheet which can improve energy efficiency and increase productivity, a solar cell module including the same, and a manufacturing method thereof.

[0002]

materials;

An infrared transmitting black pigment layer formed on the substrate; And

And an encapsulant layer formed on the infrared transmitting black pigment layer.

According to an exemplary aspect, the solar cell black back sheet according to the present application may further include a surface layer formed on the substrate, the surface layer being formed on the opposite side of the surface on which the infrared transmitting black pigment layer is formed. At this time, the surface layer preferably includes an infrared ray reflective pigment and has an infrared ray reflection function.

In addition,

Forming an infrared transmitting black pigment layer on the substrate; And

And forming an encapsulant layer on the infrared transmitting black pigment layer.

According to an exemplary aspect, the method for producing a solar cell black back sheet according to the present application may further include the step of forming a surface layer on the opposite side of the surface on which the infrared transmitting black pigment layer is formed.

In addition, the present application provides a solar cell module including the black back sheet of the present application.

According to an exemplary aspect, a solar cell module according to the present application includes: a front substrate; A front encapsulant layer formed on the front substrate; Solar cell; And a black back sheet, wherein the solar cell has a structure in which it is sealed between a front encapsulant layer and an encapsulant layer formed on the black back sheet.

In addition,

Forming a front encapsulant layer on the front substrate;

Arranging solar cells on the front encapsulant layer; And

And forming a black back sheet of the present invention on the solar cell.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell module according to the present application,

Arranging the solar cell on the black back sheet of the present invention;

Forming a front encapsulant layer on the solar cell; And

And forming a front substrate on the front encapsulant layer.

The present invention also provides a method of manufacturing a solar cell module.

According to the present application, there is provided an improved solar cell black back sheet, a solar cell module including the same, and a manufacturing method thereof.

Specifically, according to the present application, the temperature rise of the solar cell module is prevented by the transmission of the infrared ray (IR), and the energy efficiency is improved. Further, the manufacturing process is simplified and the productivity of the solar cell module is increased.

1 is a cross-sectional view of a conventional solar cell module.
2 is a sectional view of a solar cell black back sheet according to a first embodiment of the present application.
3 is a sectional view of a solar cell black back sheet according to a second embodiment of the present application.
4 is a sectional view of a solar cell black back sheet according to a third embodiment of the present application.
5 is a cross-sectional view of a solar cell module according to an exemplary embodiment of the present application.

Embodiments of the present application will now be described with reference to the accompanying drawings. In the description of the present application, a detailed description of commonly known general functions or configurations will be omitted. The accompanying drawings schematically illustrate the present invention in order to facilitate understanding of the present application, and thus the scope of the present application is not limited thereto. In addition, in the accompanying drawings, portions not related to the description are omitted for clarification of the present application. In the accompanying drawings, the thickness is enlarged in order to clearly illustrate various layers and regions, and the scope of the present application is not limited by the thickness, size and ratio shown in the drawings.

2 shows a solar cell black back sheet (hereinafter abbreviated as "black back sheet") according to the first embodiment of the present application.

The black back sheet 100 according to the present application has an integrally encapsulant structure while implementing black color. That is, the black back sheet 100 according to the present application includes an encapsulant layer 30 for packing and fixing the solar cell C (see FIG. 5) as a component constituting the back sheet 100 itself . At this time, in the present application, the sealing material layer 30 corresponds to the conventional rear sealing material layer 2b (see Fig. 1). In addition, the black back sheet 100 according to the present application includes an infrared transmitting black pigment layer 20 that transmits infrared (IR) while realizing a black color. Therefore, according to the present application, the infrared ray (IR) that causes heat generation is transmitted and the temperature rise of the solar cell module is prevented. Thus, the energy efficiency of the solar cell module is improved.

The black back sheet 100 according to the present application may have, for example, a three-layer structure or a four-layer structure or more. Referring to FIG. 2, a black back sheet 100 according to the present application includes a substrate 10, an infrared transmitting black pigment layer 20 on the substrate 10, and an infrared transmitting black pigment layer 20 on the infrared transmitting black pigment layer 20 And an encapsulant layer 30 formed on the substrate. In the present application, the term " formed on "means that one layer is formed directly on another layer, and another layer is interposed between the two layers.

Further, the respective layers 10, 20, and 30 constituting the black back sheet 100 according to the present application include a coating layer and a film layer. And, in the present application, the term 'film' includes the meaning of a conventional 'sheet'. For example, the encapsulant layer 30 may comprise at least a encapsulant composition including encapsulant, wherein the encapsulant layer 30 is a coating layer formed by coating the encapsulant composition, And a formed film (or sheet) may be bonded and formed. The same applies to the case of the substrate 10 and the infrared transmitting black pigment layer 20.

According to one exemplary embodiment of the present application, the substrate 10 may be composed of a film layer, and in the case of the infrared transmitting black pigment layer 20, a coating layer formed by coating a pigment composition, And a film layer formed by bonding a film (or sheet) formed from the composition. In the case of the encapsulation material layer 30, the encapsulation material layer may be formed of a coating layer formed by coating an encapsulation material composition, or a film layer formed by bonding an encapsulation material film (or sheet).

In the present application, the term " bonding " as used is not particularly limited as long as it has an interlayer bonding force. In the present application, 'joining' includes, for example, bonding by physical processing (for example, fitting with a fine groove-projecting structure or pressing by pressing); Thermal lamination (fusing by hot pressing); And adhesion with an adhesive.

The bonding may be selected from thermal lamination or bonding with an adhesive, according to an exemplary embodiment of the present application. The adhesive may be selected from, for example, olefinic, acrylic, silicone, urethane, epoxy and / or resin adhesives combined therewith. Herein, the composite includes a co-polymer in which two or more kinds selected from the listed resin systems are copolymerized, and / or a blend of at least two kinds selected from the listed resin systems.

3 shows a black back sheet 100 according to a second embodiment of the present application. Referring to FIG. 3, the black back sheet 100 according to the present application may further include a surface layer 40 formed on the base material 10. FIG. In the present application, the surface layer 40 is an optional component, which is formed on the surface of the substrate 10, for example to protect the substrate 10 or to provide the backsheet 100 with durability, weatherability, and / Or moisture barrier properties, and the like. The surface layer 40 is formed on the opposite side of the surface of the substrate 10 on which the infrared transmitting black pigment layer 20 is formed.

4 shows a black back sheet 100 according to a third embodiment of the present application. Referring to FIG. 4, the surface layer 40 may include, for example, an infrared reflective pigment layer 42. That is, an infrared reflective pigment layer 42 is formed on the lower surface of the substrate 10, and the infrared ray is reflected by the solar cell C (see FIG. 5) by the infrared reflective pigment layer 42 and can be reused . In this case, the energy efficiency of the solar cell module can be further improved.

Hereinafter, exemplary configurations of the components constituting the black back sheet 100 according to the present application will be described.

The substrate 10 is not particularly limited as long as it has a supporting force. Various materials known in the art can be used for the base material 10, and it can be suitably selected and used according to required functions and applications. The substrate 10 can be selected from various metal films and / or polymer films in one example. Further, the substrate 10 may be, for example, one single layer selected from a metal film and a polymer film, and may be a multilayer of two or more selected from a metal film and a polymer film. The metal film may be composed of one or more kinds of metal components depending on the application, and specific examples thereof include alloys of aluminum (Al) and aluminum (Al). The polymer film may be a single sheet such as a polyester film, a polyolefin film, an acrylic film, a polyamide film or a polyurethane film, a laminated sheet, or a pneumatic article.

The substrate 10 is selected from a polymer film according to an exemplary embodiment, and the polymer film may include a polyester resin which is advantageous in terms of heat resistance and the like as a base resin. Examples of the polyester resin include at least one selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and polybutylene terephthalate (PBT) But is not limited thereto. The substrate 10 may be selected from polyolefin-based films, according to another exemplary embodiment. At this time, the polyolefin film is, for example, a polypropylene (PP) film. Specific examples of the substrate 10 include a polyethylene terephthalate (PET) film and a polypropylene (PP) film.

Further, the base material 10 may be subjected to an adhesion strengthening treatment for improving adhesion with the infrared transmitting black pigment layer 20 and / or the surface layer 40 described later. For example, high-frequency spark discharge treatment such as corona treatment or plasma treatment is applied to one side or both sides of the substrate 10; Heat treatment; Flame treatment; Anchor treatment; Coupling agent treatment; Surface treatment such as primer treatment or chemical activation treatment using gaseous Lewis acid (ex. BF3), sulfuric acid or high temperature sodium hydroxide can be performed. The surface treatment method may be performed by any well-known means commonly used in the general industrial field. Through the surface treatment as described above, the bonding force with the pigment layer 20 and / or the surface layer 40 can be improved.

In addition, the substrate 10 may have an inorganic deposit layer formed on one side or both sides of the substrate 10 in consideration of additional characteristics such as moisture barrier properties. The kind of the inorganic substance is not particularly limited and can be adopted without limitation as long as it has a moisture barrier property. For example, silicon oxide or aluminum oxide can be used. The method of forming the inorganic deposit layer on one surface or both surfaces of the substrate 10 is not particularly limited and may be, for example, vapor deposition. When the inorganic vapor deposition layer is formed on one side or both sides of the substrate 10 as described above, the inorganic vapor deposition layer may be formed on the surface of the substrate 10, and then the above-described surface treatment may be performed on the vapor deposition layer. That is, in one embodiment of the present application, the spark discharge treatment, the flame treatment, the coupling agent treatment, the anchorage treatment, or the chemical activation treatment described above may be performed to further improve the adhesive force on the deposition layer formed on the substrate 10 have.

The infrared transmitting black pigment layer 20 comprises at least one infrared transmitting black pigment. In the present application, the infrared transmitting black pigment layer 20 is not limited as long as it contains an infrared transmitting black pigment, which can be selected from a coating layer or a film layer. According to an exemplary embodiment, the infrared transmitting black pigment layer 20 may be formed from a pigment composition comprising a base resin and an infrared transmitting black pigment. Specifically, the infrared transmitting black pigment layer 20 may be formed by coating or curing the pigment composition on the substrate 10, or a film formed from the pigment composition may be bonded onto the substrate 10.

The base resin is not limited as long as it has an adhesive property capable of binding an infrared transmitting black pigment. The base resin may be one having excellent weatherability, durability, and / or insulation while having excellent adhesion with the substrate 10 and / or the sealing material layer 30. The base resin may be selected from, for example, a polyester-based or polyolefin-based resin as exemplified above with reference to the base material 10, and may be selected from fluorine-based, acrylic-based, urethane-based, have.

According to one exemplary embodiment of the present application, the base resin may be selected from a polyolefin-based resin or a fluorine-based resin. At this time, the polyolefin series includes olefin homopolymers, copolymers, and mixtures thereof. Specific examples of the polyolefin-based polymer include homopolymers (polyethylene, polypropylene, etc.) such as ethylene, propylene and butylene; Ethylene / propylene copolymer, ethylene / butylene copolymer, ethylene / propylene / butylene copolymer and the like; And mixtures thereof.

In the present application, the fluorine-based resin may contain one or more fluorine (F) elements in the molecule. The fluororesin may be, for example, vinylidene fluoride (VDF), vinyl fluoride (VF), tetrafluoroethylene (TFE), hexafluoropropylene (HFP), chlorotriene Perfluoroethyl vinyl ether (PEVE), perfluoroethyl vinyl ether (PMVE), perfluoroethyl vinyl ether (PEVE), perfluoroethyl vinyl ether perfluoro (ethylvinylether), perfluoropropyl vinyl ether (PPVE), perfluorohexyl vinyl ether (PHVE), perfluoro-2,2-dimethyl-1,3-dioxole -2-methylene-4-methyl-1,3-dioxolane (PMD), and the like, in a polymerized form, or a mixture thereof.

The fluororesin may be a homopolymer or a copolymer including, for example, vinylidene fluoride (VDF) in a polymerized form; Or vinyl fluoride (VF) in polymerized form; Or a mixture comprising two or more of the above.

The type of the comonomer that can be included in the polymer in the form of the copolymer is not particularly limited, and examples thereof include tetrafluoroethylene (TFE), hexafluoropropylene (HFP), chlorotrifluoro But are not limited to, ethylene (CTFE), trifluoroethylene, hexafluoroisobutylene, perfluorobutyl ethylene, perfluoro (methylvinylether), and perfluoroethyl vinyl ether perfluorohexyl vinyl ether (PHVE), perfluoro-2,2-dimethyl-1,3-dioxole (PDD), and perfluoro-2 Methylene-4-methyl-1,3-dioxolane (PMD), and the like, and examples thereof include at least one of hexafluoropropylene and chlorotrifluoroethylene. However, Limitations include The.

The content of the comonomer contained in the copolymer is not particularly limited and may be, for example, about 0.5 to 50 wt%, 1 to 40 wt%, and 7 wt% based on the total weight of the copolymer % To 40 wt%, 10 wt% to 30 wt%, or 10 wt% to 20 wt%. By controlling the content of the comonomer within the above range, it is possible to induce effective mutual diffusion and low-temperature drying while ensuring the durability and weather resistance of the black backsheet 100, and further improve the adhesion.

The fluorine-based resin may have a melting point of, for example, 80 ° C to 175 ° C, or 120 ° C to 165 ° C. It is possible to prevent the black back sheet 100 from being deformed during use and to adjust the melting point to 175 DEG C or less to control the solubility in the solvent and to prevent the coating The gloss of the surface can be improved.

According to an exemplary embodiment, the fluororesin may include i) a first fluororesin having a melting point of 155 ° C or lower and a softening point of 100 ° C or higher. Such a first fluorocarbon resin has a low melting point and a softening point, so that it can be mixed with other polymers in a high temperature coating process, and the noncrystalline portion increases, so that the first fluorocarbon resin is excellent in compatibility with other polymers.

In addition to the first fluorine-based resin, the fluorine-based resin may further include a second fluorine-based resin having a melting point of 155 ° C or higher and a softening point of 100 ° C or lower. At this time, the second fluororesin may be optionally used as needed. The second fluorinated resin may have a melting point of more than 155 ° C and a softening point of not more than 100 ° C.

The first fluororesin and the second fluororesin correspond to the fluororesin described above. The first fluororesin and the second fluororeshape can be classified according to the melting point and the softening point which are inherent characteristics of the polymer according to the polymerization of the monomer forming the fluororesin. At this time, the first fluorinated resin having a melting point of 155 DEG C or lower or a softening point of 100 DEG C or higher may account for 20 wt% or more, preferably 50 wt% or more, based on the weight of the total fluoropolymer contained in the pigment layer 20 When occupied, the action according to his use may be more advantageous.

The fluorine-based resin may have a weight average molecular weight of 50,000 to 100, and may be, for example, 100,000 to 700,000, or 300,000 to 50,000, but is not limited thereto. In the present specification, the weight average molecular weight is a conversion value of standard polystyrene measured by GPC (Gel Permeation Chromatograph). In embodiments of the present application, excellent solubility and other physical properties can be secured by controlling the weight average molecular weight of the fluorine resin within the above range.

Meanwhile, in the present application, the infrared transmitting black pigment is not limited as long as it can transmit infrared rays (IR) to realize black color. Specifically, the infrared transmitting black pigment is not limited as long as it can transmit infrared rays (IR) having a wavelength of about 650 nm or more, specifically about 650 nm to 1200 nm, for example, and can realize black color on the back sheet 100. Further, in the present application, the infrared transmitting black pigment may be a mixture of one or more pigments. At this time, the infrared transmitting black pigment can realize black color in one kind of pigment itself or black color in combination of two or more kinds of pigments. In addition, in the present application, 'black' does not mean only complete black.

The infrared-transmitting black pigment may use at least one selected from, for example, an inorganic compound, an organic compound, and an inorganic-organic compound. The infrared-transmitting black pigment may be selected from at least one organic pigment selected from Azomethyne series, Perylene series and the like according to an exemplary embodiment of the present application. Specific examples of the infrared-transmitting black pigment include, but are not limited to, azomethine or a perylene black pigment known to be capable of transmitting infrared rays. Such organic pigments can be usefully used in applications filed that effectively transmit infrared (IR) and have black color as such. And is stable to light. Moreover, the infrared transmitting black pigment may be used to purchase a product sold, for example, or the like can be used Chromofine ^® Black A-1103 (azomethine series) and Paliogen ^® Black 0088 (perylene-based).

Also, according to an exemplary embodiment of the present application, the infrared transmitting black pigment layer 20 may comprise from 0.1 to 30 parts by weight of an infrared transmitting black pigment relative to 100 parts by weight of the base resin. At this time, when the content of the infrared ray-transmitting black pigment is less than 0.1 part by weight, infrared ray (IR) transmittance depending on the content thereof and black color hue may be insignificant. When the amount is more than 30 parts by weight, the content of the base resin (polyolefin-based resin, fluorine-based resin, or the like) becomes relatively low, and adhesion and durability may be lowered. In consideration of this point, the infrared transmitting black pigment layer 20 may include, for example, 0.5 to 20 parts by weight, or 1 to 10 parts by weight of the infrared transmitting black pigment with respect to 100 parts by weight of the base resin.

The sealing material layer 30 is not particularly limited. The sealing material layer 30 is included as a component of the black back sheet 100 according to the present application, and it is sufficient that the sealing material layer 30 can stably seal the solar cell C (Fig. 5). The encapsulant layer 30 may be formed on the infrared transmitting black pigment layer 20 as long as it includes an encapsulant having good adhesiveness and good insulating properties.

The encapsulant constituting the encapsulant layer 30 may include, for example, a conventionally used EVA resin, that is, an ethylene-vinyl acetate copolymer. As the encapsulating material, resins other than the EVA resin may be used.

According to an exemplary embodiment of the present application, the encapsulant may be selected from polyolefin series. Hereinafter, the polyolefin system will be described. The polyolefin system described below is not limited to an encapsulant, but may be a description of the entire polyolefin based system described herein. That is, when the base resin constituting the substrate 10, the infrared-transmitting black pigment layer 20, and the surface layer 40 to be described later is selected from the polyolefin series, it includes the polyolefin series described below.

In the present application, the polyolefin system is not particularly limited as long as it is a resin that can be classified as olefin. The polyolefin series includes a modified polyolefin series and a non-modified polyolefin series. Examples of the polyolefin series include ethylene, propylene, isobutylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, Butene, 3-methyl-1-pentene, 4-methyl-1-hexene, 4-methyl- (Alpha) -olefins such as 5-methyl-1-hexene, 3,3-dimethyl-1-pentene, 3,4-dimethyl- ; Dienes such as 1,3-butadiene, 1,4-butadiene and 1,5-hexadiene; Cyclic olefins such as cyclopentene, cyclohexene, norbornene, 5-methylnorbornene, 5-ethylnorbornene, 5-propylnorbornene, 5,6-dimethylnorbornene and 5-benzylnorbornene; Homopolymers and / or copolymers of olefinic monomers of at least one kind.

In addition, the polyolefin system includes polymers that are different in the form of arrangement even though they are made from the same kind of monomer (s). The polyolefin-based polymer includes, for example, polymers polymerized and regulated in random, cross-over, block-form, or different segments. In addition, the polyolefin system includes, for example, an elastomer type through denaturation. At this time, the elastomer type can be usefully applied as an encapsulating material.

Specific examples of the polyolefin system may be selected from polypropylene (PP) -based and ethylene / -olefin-based copolymers. At this time, the polypropylene (PP) system includes propylene homopolymer (polypropylene) and propylene copolymer. And the propylene copolymer may be a binary copolymer such as propylene / ethylene copolymer and propylene / butylene copolymer; And terpolymers (terpolymers) such as propylene / ethylene / butylene, and the like.

Further, in the present application, the ethylene /? - olefin-based copolymer means a polyolefin comprising a copolymer in which ethylene and? -Olefin are polymerized as a main component. The ethylene /? - olefin-based copolymer is obtained by polymerizing an olefin monomer having three or more carbon atoms or other comonomers containing at least 50 mol% of ethylene as a polymerization unit, as well as a homopolymer (polyethylene) May also refer to copolymers that are included together in units of one or more of the above. The ethylene /? - olefin-based copolymer may contain, for example, 50 to 95 mol% of ethylene as a polymerization unit. The? -Olefin system constituting the ethylene /? - olefin system is as described above.

Examples of the ethylene /? - olefin copolymer include low density ethylene /? - olefin copolymers, medium density ethylene /? - olefin copolymers, high density ethylene /? - olefin copolymers, /? - olefin copolymers, ultrafine low density ethylene /? - olefin copolymers, and linear low density ethylene /? - olefin copolymers, and the like.

Also, the ethylene /? - olefin-based copolymer may be selected from among those having a density of about 0.82 g / cm 3 to 0.96 g / cm 3, or about 0.85 g / cm 3 to 0.92 g / cm 3, but the present invention is not limited thereto . The ethylene /? - olefin copolymer may have a MFR (melt flow rate) of about 1.0 g / 10 min to about 50.0 g / 10 min, a melt flow rate of about 1.0 10 g / 10 min to about 30.0 g / 10 min, about 1.0 g / 10 min to about 10.0 g / 10 min, about 1.0 g / 10 min to 8.0 g / 10 min, Min. ≪ / RTI > When the MFR is in this range, the ethylene /? - olefin copolymer can exhibit excellent moldability and the like.

In describing the density and the MFR (melt flow rate) in the present invention, the ethylene /? - olefin-based copolymer has been exemplified. However, the above-mentioned density and MFR range are limited only by the ethylene / It is not. The MFR is based on a load of 2.16 kg at 190 캜, but is not limited thereto.

As described above, the base resin constituting the substrate 10, the infrared transmitting black pigment layer 20, the sealing material layer 30, and the surface layer 40 in the present application may be a polyolefin resin as described above, (10), (20), (30) and (40).

According to an exemplary form of the present application, in the case of the substrate 10, it may be selected from a polypropylene (PP) system in a polyolefin system. That is, the substrate 10 may be a PET film, but may be selected from, for example, polypropylene (PP) and a propylene copolymer, and more specifically, polypropylene (PP) may be used. Such a polypropylene (PP) system is not only economically advantageous because it is inexpensive, but also has mechanical properties such as tensile strength, surface hardness and impact resistance, barrier properties such as moisture and gas barrier, and chemical resistance And can be useful as the substrate 10.

The infrared transmitting black pigment layer 20, the encapsulant layer 30 and the surface layer 40 may be selected from among polyolefins such as polyethylene (PE) based and ethylene / alpha -olefin based copolymers , They may be useful as the layers 20, 30, 40, advantageously in terms of adhesion and moldability. In addition, in the case of the encapsulant layer 30, it may be selected from an elastomer type polyolefin series.

According to an exemplary embodiment of the present application, it is preferable that the encapsulant layer 30 further includes a silane compound. That is, the sealing material layer 30 preferably contains a polyolefin-based material and a silane compound. In this case, adhesion and sealing properties of the sealing material layer 30 are remarkably improved. Specifically, when the encapsulant layer 30 is a polyolefin-based encapsulant and further includes a silane compound, the adhesive force is remarkably improved, and the solar cell C (see FIG. 5) It has excellent properties as an encapsulating material.

At this time, the silane compound may be added to the polyolefin-based composition constituting the encapsulant layer 30, or may be added to the polyolefin-based polymer. Here, the polymerization can be exemplified by graft polymerization. According to an exemplary embodiment, the sealing material layer 30 may include a polyolefin-based polyolefin-based material in which a silane compound is polymerized, and may include a silane-modified polyolefin-based elastomer.

The sealing material layer 30 is not particularly limited, but may contain 0.001 to 10 parts by weight of a silane compound based on 100 parts by weight of the polyolefin-based resin. If the content of the silane compound is less than 0.001 part by weight, the effect of improving adhesion and sealing properties may be insignificant. When the content of the silane compound is more than 10 parts by weight, the synergistic effect with excess use is not so high, and the viscosity can be increased and the moldability may be somewhat lowered. Considering this point, the silane compound may be contained in an amount of, for example, 0.005 to 5 parts by weight based on 100 parts by weight of the polyolefin-based resin.

In the present application, the silane compound is not limited as long as it is a compound having at least one silane group in the molecule. The silane compound may be at least one selected from an unsaturated silane compound and an aminosilane compound, according to an exemplary form of the present application.

The unsaturated silane compound may be one having at least one unsaturated group in the molecule. The unsaturated silane compound may be selected, for example, from vinylalkoxysilanes having at least one vinyl group in the molecule. Specific examples of the unsaturated silane compound include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentoxysilane, vinyltriethoxysilane, vinyltriethoxysilane, Phenoxysilane, vinyltriacetoxysilane, and the like.

The unsaturated silane compound may be contained in an amount of, for example, 0.005 to 10 parts by weight, or 0.01 to 8.0 parts by weight based on 100 parts by weight of the polyolefin-based resin. In this range, the adhesiveness of the encapsulant layer 30 can be improved to excellent.

The aminosilane compound is not limited as long as it has at least one amine group in the molecule. Here, the amine group may be selected from a primary amine and a secondary amine. The aminosilane compound may be selected from aminoalkoxysilanes according to the specific form of the present application. Specific examples of the aminosilane compound include aminopropyltrimethoxysilane, aminopropyltriethoxysilane, bis [(3-triethoxysilyl) propyl] amine, bis [(3-trimethoxysilyl) Amine, aminopropylmethyldiethoxysilane, aminopropylmethyldimethoxysilane, N- [3- (trimethoxysilyl) propyl] ethylenediamine, aminoethylaminopropyltriethoxysilane, aminoethylaminopropylmethyldimethoxysilane, Aminoethylaminomethyltriethoxysilane, aminoethylaminomethyltriethoxysilane, aminoethylaminomethyltriethoxysilane, aminoethylaminomethyltriethoxysilane, aminoethylaminomethyltriethoxysilane, aminoethylaminomethyldiethoxysilane, diethylenetriaminopropyltrimethoxysilane, diethylenetriaminopropyltriethoxysilane, diethylenetri Aminopropylmethyldimethoxysilane, diethylenaminomethylmethyldiethoxysilane, (N-phenylamino) methyltrimethoxysilane, (N-phenylamino) methyltriethoxysilane (N-phenylamino) methylmethyldimethoxysilane, (N-phenylamino) methylmethyldiethoxysilane, 3- (N-phenylamino) propyltrimethoxysilane, 3- (N-phenylamino) propylmethyldiethoxysilane, N- (N-butyl) -3-aminopropyltrimethoxysilane, glycidyl At least one selected from the group consisting of glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane and the like can be used. These aminosilane compounds may be used alone or in combination of two or more.

The aminosilane compound may be contained in an amount of, for example, 0.001 to 5 parts by weight, or 0.005 to 0.5 parts by weight, based on 100 parts by weight of the polyolefin-based resin. Within this range, the adhesive strength and sealing properties of the encapsulant layer 30 are remarkably improved, and the physical properties of the resin composition are stably maintained and the activity of additives such as heat stabilizers and light stabilizers can be improved have. At this time, when the content of the aminosilane compound is small, the effect of improving the adhesive strength and the sealing property upon use thereof may be insignificant. If the content of the aminosilane compound is excessive, discoloration may occur or a large amount of gel may be formed to adversely affect the contour of the sealing material layer 30. [

The encapsulant layer 30 is preferably a silane compound containing at least one selected from among the unsaturated silane compounds and aminosilane compounds described above. According to one exemplary embodiment, the encapsulant layer 30 comprises at least amino The silane compound is preferably included.

According to another exemplary embodiment, it is preferable that the encapsulant layer 30 includes both an unsaturated silane compound and an aminosilane compound as a silane compound. When both materials are included in this manner, they have an excellent adhesive force as compared with the case where only one of them is contained. The unsaturated silane compound and the aminosilane compound may be contained at a weight ratio of, for example, 100: 0.5 to 30. In one example, the aminosilane compound may be contained in an amount of 0.5 to 30 parts by weight based on 100 parts by weight of the unsaturated silane compound. That is, the encapsulant layer 30 contains both an unsaturated silane compound and an aminosilane compound as a silane compound, and can be contained at a weight ratio of unsaturated silane compound: aminosilane compound = 100: 0.5 to 30.

As mentioned above, the silane compound may be contained in a polymerized form in the polyolefin-based resin. That is, the sealing material layer 30 may include a silane-modified polyolefin-based resin as the polyolefin-based resin. Specifically, the encapsulant layer 30 may be formed from a resin composition comprising a polyolefin resin, a silane compound, and a radical initiator. At this time, the silane compound can be grafted to the polyolefin-based resin by the radical initiator.

The method for producing the silane-modified polyolefin-based resin is not particularly limited. This can be produced, for example, by adding a resin composition comprising a polyolefin-based resin and a silane compound to a reactor, and then grafting and extruding the resultant in the presence of a radical initiator, for example, through heat melting. At this time, as described above, the silane compound is at least one selected from an unsaturated silane compound and an aminosilane compound, and the amount of the silane compound used is the same as described above.

The radical initiator is not particularly limited as long as it is capable of initiating a reaction in which the silane compound grafts to the polyolefin-based resin. Such a radical initiator may be used in an amount of, for example, 0.001 to 5 parts by weight based on 100 parts by weight of the polyolefin-based resin.

The radical initiator may be selected from those capable of initiating radical polymerization of the vinyl group, and specific examples thereof include one or more kinds selected from the group consisting of organic peroxides, hydroperoxides and azo compounds . More specifically, the radical initiator may be at least one selected from the group consisting of t-bubulylcumylperoxide, di-t-butylperoxide, di-cumylperoxide, 2,5-dimethyl-2,5-di (t-butylperoxy) , And dialkyl peroxides such as 5-dimethyl-2,5-di (t-butylperoxy) -3-hexyne; Hydroperoxides such as cumene hydroperoxide, diisopropylbenzene hydroperoxide, 2,5-dimethyl-2,5-di (hydroperoxy) hexane, and t-butyl hydroperoxide; Diacyl peroxides such as bis-3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, benzoyl peroxide, o-methylbenzoyl peroxide and 2,4-dichlorobenzoyl peroxide; butyl peroxy isobutyrate, t-butyl peroxyacetate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxypivalate, t-butyl peroxyoctoate, t- Butyl peroxybenzoate, di-t-butylperoxy phthalate, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, 2,5-dimethyl- (Benzoyl peroxy) -3-hexyne; And ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; Lauryl peroxide; And azo compounds such as azobisisobutyronitrile and azobis (2,4-dimethylvaleronitrile), and the like, but the present invention is not limited thereto.

Further, in the production of the silane-modified polyolefin-based resin, the polyolefin-based resin may be selected from, for example, an ethylene / alpha -olefin-based copolymer among those exemplified above. At this time, in the case of the ethylene /? - olefin-based copolymer having a large number of side chains, the ethylene /? -Olefin-based copolymer having a low density and a small side chain has mostly high density. In addition, the more side chains, the higher the efficiency of grafting. Accordingly, depending on the exemplary embodiment of the present application, a low density ethylene /? - olefin copolymer having many side chains can be used as the polyolefin resin to which the silane compound is grafted. Thereby enhancing the efficiency of grafting and further improving the adhesive strength of the sealing material layer 30.

The silane-modified polyolefin-based resin, that is, the graft copolymer of the polyolefin-based resin and the silane compound, has a main chain including polymerized units of an olefin-based monomer; And a branched chain bonded to the main chain, wherein the branch may comprise a silane compound as described above. At this time, the main chain constituting the silane-modified polyolefin-based resin may be selected from, for example, an ethylene / alpha -olefin-based copolymer. As described above, the ethylene /? - olefin-based copolymer is a copolymer of ethylene and an? -Olefin-based copolymer, and the? -Olefin constituting the copolymer is, for example, ethylene, propylene, isobutylene, Hexene, 1-hexene, 1-hexene, 1-octene, 1-nonene, 1-butene, 3-methyl-1-pentene, 4-methyl-1-hexene, -Dimethyl-1-pentene, 4,4-dimethyl-1-pentene, vinylcyclohexane, and the like. Such an ethylene /? - olefin-based copolymer may have the density and / or the MFR as illustrated above.

According to the exemplary embodiment of the present application, the resin composition for forming the encapsulant layer 30, that is, the encapsulant composition may further include other resin components in addition to the silane-modified polyolefin-based resin. At this time, the other resin component is exemplified by a non-modified polyolefin-based resin. Specifically, the sealing material composition may be a mixture of a silane-modified polyolefin-based resin and a non-modified polyolefin-based resin as the base resin. The specific kind of the non-modified polyolefin-based resin is not particularly limited and may be selected, for example, from a non-modified ethylene /? - olefin-based copolymer. As the non-modified polyolefin-based resin, for example, an ethylene / alpha -olefin-based copolymer belonging to the same category as the ethylene / alpha -olefin-based copolymer used in the production of the silane-modified polyolefin-based resin may be used.

At this time, the silane-modified polyolefin-based resin and the non-modified polyolefin-based resin may be used in an appropriate amount. If the amount of the unmodified polyolefin-based resin is too large, the adhesive force and the sealing property expressed by the silane-modified polyolefin-based resin may become rather small. When the amount of the unmodified polyolefin-based resin is too small, the silane-modified polyolefin-based resin is relatively large, and the moldability may be deteriorated due to, for example, initial adhesive property increase (or high viscosity). Taking this into consideration, the non-modified polyolefin-based resin may be used in an amount of, for example, 0.01 to 3,000 parts by weight, 0.1 to 2,000 parts by weight, or 10 to 1,000 parts by weight per 100 parts by weight of the silane- But is not limited thereto.

The surface layer 40 is an optional component, which may have various functions as described above. The surface layer 40 may be selected from a functional layer capable of imparting, for example, the protection, durability, weatherability, and / or moisture barrier properties of the substrate 10.

According to an exemplary embodiment of the present application, the surface layer 40 may be formed from a resin composition. The resin composition constituting the surface layer 40 may be at least one selected from a polyolefin-based resin and a fluorine-based resin as a base resin. The types of such polyolefin-based and fluorine-based resins are as described above. The surface layer 40 may include a fluororesin in one example.

Also, the surface layer 40 may include a pigment. At this time, the pigment is not particularly limited, and may be at least one selected from color pigments, light reflective pigments, and the like. The pigment may be, for example, a color pigment capable of realizing white or black color; And a light reflecting pigment capable of reflecting infrared rays (IR). The pigments can be selected, for example, from infrared reflective pigments. As such an infrared reflective pigment, for example, titanium oxide (TiO 2) or the like can be used. At this time, titanium oxide (TiO2) can realize white color while reflecting infrared rays.

According to another exemplary embodiment, the pigment that may be included in the surface layer 40 may be selected from an infrared reflective black pigment. In this case, the infrared reflective black pigment can reflect infrared rays while realizing a black color. For example, the infrared reflective black pigment may be an inorganic pigment containing chromium (Cr) and iron (Fe) Cr) and an iron (Fe) element, and the like. In addition, the infrared reflective black pigment can be purchased and used. For example, products such as Sicopal® manufactured by BASF AG, Germany can be used. For example, Sicopal® Black K0095 and the like can be used.

The surface layer 40 may be formed from a resin composition containing a fluorine resin and an infrared ray reflective pigment according to one exemplary embodiment. Accordingly, the surface layer 40 may be composed of an infrared reflective pigment layer 42 that reflects infrared rays (IR) as shown in FIG. At this time, the pigment may be contained in an amount of, for example, 5 to 80 parts by weight based on 100 parts by weight of the fluororesin. The surface layer 40 is formed by coating the resin composition on the surface of the substrate 10, that is, on the opposite side of the surface on which the infrared-transmitting black pigment layer 20 is formed, or a film (or sheet) As shown in Fig.

On the other hand, the substrate 10, the infrared transmitting black pigment layer 20, the sealing material layer 30, and the surface layer 40 may each contain an additive or the like as required. The additive is not particularly limited. The additive may be at least one selected from, for example, a light stabilizer, a heat stabilizer, an ultraviolet (UV) absorbent, an inorganic filler, and an antioxidant. The content of the additive may be appropriately adjusted according to the intended use and the kind thereof. The additives may be appropriately adjusted within a range of, for example, 0.001 to 10 parts by weight with respect to 100 parts by weight of the base resin of each layer 10, 20, 30, 40, but are not limited thereto.

The light stabilizer may be one or more selected from amine compounds and piperidine compounds, for example, which can prevent photooxidation. The heat stabilizer may be, for example, bis (2,4-bis (1,1-dimethylethyl) -6-methylphenyl] Tetrakis (2,4-di-tert-butylphenyl) [1,1-biphenyl] -4,4'-diyl bisphosphonate and bis (2,4-di-tert- butylphenyl) pentaerythritol diphosphite Phosphorus-based thermal stabilizers; And a lactone type heat stabilizer such as the reaction product of 8-hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene. The UV absorber may be at least one selected from benzophenone, benzotriazole, acrylonitrile, metal complex salt, amine, titanium oxide and zinc oxide. The inorganic filler may be used, for example, to reinforce the mechanical strength of the base layer 10, and one or more selected from among silica, titanium oxide, magnesium oxide, aluminum oxide, and the like may be used. As the antioxidant, those known in the art can be used.

In addition, in the present application, the thickness of each of the layers 10, 20, 30, 40 is not particularly limited. The thickness of each of the layers 10, 20, 30, and 40 can be appropriately selected in consideration of the desired physical properties, the type and installation position of the solar cell module, weight reduction, workability, and the like.

The base material 10 may have a thickness of 20 to 2 mm, for example, in consideration of barrier properties (such as moisture barrier properties), heat resistance, mechanical strength (tensile strength, etc.), dimensional stability, flexibility, and / Thickness range. The substrate 10 may have a thickness of, for example, 50 탆 to 1000 탆, or 80 탆 to 300 탆, but is not limited thereto.

The infrared transmitting black pigment layer 20 may have a thickness of, for example, 0.1 탆 to 500 탆, or 1 탆 to 300 탆, or 50 탆 to 200 탆, for example, in consideration of infrared transmittance, But is not limited thereto.

The encapsulant layer 30 may have a thickness of 10 to 2,000 mu m or 50 to 200 mu m in consideration of adhesion, sealing performance, type and thickness of the solar cell C, light weight and / 1500 占 퐉, or 100 占 퐉 to 1250 占 퐉, but is not limited thereto.

The surface layer 40 may have a thickness of, for example, 0.1 占 퐉 or less, specifically 0.1 占 퐉 to 500 占 퐉 depending on the purpose. The surface layer 40 may have a thickness of 0.5 탆 to 300 탆 in consideration of, for example, adhesive strength, infrared reflectivity, light weight and / or workability, but is not limited thereto.

The black back sheet 100 according to the present application may further include other functional layers in addition to the layers 10, 20, 30, 40 as described above. For example, it may further include at least one selected from a primer layer for improving the interlayer bonding force, an insulating layer for insulating (electric resistance), and other functional layers. For example, the distance between the substrate 10 and the infrared transmitting black pigment layer 20, between the substrate 10 and the surface layer 40, and / or between the infrared transmitting black pigment layer 20 and the sealing material layer 30 A primer layer for improving the interlayer coupling force can be formed. The resin adhesive constituting the primer layer may be selected from, for example, ethylene vinyl acetate (EVA), polyolefin (low density linear polyethylene), acrylic, urethane, epoxy resin and the like.

On the other hand, the method of manufacturing the black back sheet 100 according to the present application includes the steps of forming an infrared transmitting black pigment layer 20 on a substrate 10 according to a first aspect of the present application; And forming an encapsulant layer (30) on the infrared transmitting black pigment layer (20). According to a second aspect of the present application, the method may further include the step of forming the surface layer 40 on the opposite side of the surface of the substrate 10 on which the infrared transmitting black pigment layer 20 is formed. The order of forming each layer is not limited.

For example, in the case of the first embodiment of the present application, the infrared transmitting black pigment layer 20 is formed on the substrate 10, and then the process proceeds to the step of forming the sealing material layer 30 thereon, The sealing material layer 30 may be first formed on the black pigment layer 20 and then bonded to the substrate 10. In the case of the second embodiment of the present application, first, an infrared transmitting black pigment layer 20 is formed on one side of the substrate 10, a surface layer 40 is formed on the opposite side of the black pigment layer 20, The sealing material layer 30 may be formed on the substrate 20.

According to an exemplary embodiment of the present application, each layer can be bonded simultaneously with extrusion through an extrusion process. In this case, the process of the black back sheet 100 is further simplified. For example, in the case of the first embodiment of the present application, a laminate in which an infrared transmitting black pigment layer 20 is laminated on a substrate 10 is produced by extrusion, and in the process of extrusion of the encapsulant layer 30 , The sealing material layer 30 may be extruded so as to be bonded onto the infrared transmitting black pigment layer 20. In the second embodiment of the present application, a laminate in which an infrared transmitting black pigment layer 20 and a surface layer 40 are laminated on both sides of a substrate 10 is produced by extrusion, and extrusion of the encapsulant layer 30 In the manufacturing process, the encapsulant layer 30 may be extruded so as to be bonded onto the infrared transmitting black pigment layer 20.

Further, in forming each of the layers 10, 20, 30, and 40, the resin composition used is as described above. The respective layers 10, 20, 30, and 40 may be formed by coating each resin composition as described above, or by bonding a resin film formed from each resin composition.

The black back sheet 100 according to the present invention described above can improve the energy efficiency while realizing the black color of the solar cell module. That is, the black color is realized by the infrared transmitting black pigment layer 20. Infrared rays (IR), which is a cause of heat generation, are transmitted and the temperature rise of the solar cell module is prevented. Thus, the energy efficiency of the solar cell module is improved.

In addition, according to an exemplary embodiment of the present application, when the surface layer 40 includes the infrared reflective pigment layer 42, that is, when the infrared reflective pigment layer 42 is formed on the lower surface of the substrate 10, The infrared ray IR is reflected by the infrared ray reflective pigment layer 42 to the solar cell C (see FIG. 5). Accordingly, the light in the infrared region is reused, and the energy efficiency of the solar cell module can be further improved.

In addition, the black back sheet 100 according to the present application has excellent physical properties in terms of adhesion and sealing properties. For example, when the sealing material layer 30 further comprises a silane compound, that is, when the silane-modified polyolefin resin as described above is contained, it has excellent adhesion and sealing properties, And other physical properties such as long-term durability are improved.

In addition, the black back sheet 100 according to the present application has an excellent sealing performance, a good workability, and the like as a seal material integrated structure. That is, the manufacturing process can be remarkably shortened in manufacturing the solar cell module. A detailed description thereof will be given by explaining the solar cell module and the manufacturing method thereof according to the present application.

Hereinafter, a solar cell module and a manufacturing method thereof according to the present application will be described.

The solar cell module according to the present application includes the black back sheet 100 of the present application as described above. The solar cell module according to the present application is not particularly limited as long as it includes the back sheet 100 of the present application as described above, and any structure is included in the present application.

5 is a cross-sectional view of a solar cell module according to an exemplary embodiment of the present application.

Referring to FIG. 5, the solar cell module according to the present application includes a front substrate 210, a front encapsulant layer 220, a solar cell C, and the above- (100).

At this time, the front substrate 210 may protect the front side (upper side in the drawing) of the solar cell C while providing a light receiving surface. The front substrate 210 may be formed of any material having excellent light transmittance. The front substrate 210 is a transparent substrate favorable for light incidence, and may be selected from a rigid substrate such as glass (for example, tempered glass) or a transparent plastic plate.

The front encapsulant layer 220 can pack and fix the solar cell C, which is formed on the front substrate 210 as illustrated in FIG. That is, the front encapsulant layer 220 is formed between the front substrate 210 and the solar cell C, and it is a pair with the encapsulant layer 30 constituting the transparent back sheet 100 of the present application The solar cell C is sealed.

In the present application, the sealing material constituting the front sealing material layer 220 is not limited. The encapsulating material constituting the front encapsulant layer 220 is not particularly limited as long as it has adhesiveness. For example, the encapsulating material may include an EVA resin, that is, an ethylene-vinyl acetate copolymer.

The sealing material constituting the front sealing material layer 220 may be another adhesive resin. The front encapsulant layer 220 may include, for example, a polyolefin. Such a polyolefin system is as described for the encapsulant layer 30 of the black back sheet 100 according to the present application. The sealing material constituting the front sealing material layer 220 may be the same as the sealing material layer 30 constituting the black back sheet 100 of the present application. Specifically, the front sealing material layer 220 may be selected from a modified polyolefin-based resin and a non-modified polyolefin-based resin as main components of the sealing material. In one example, the encapsulating material of the front encapsulant layer 220 may include the silane-modified polyolefin-based resin as described above.

The plurality of solar cells C are arranged between the front encapsulant layer 220 and the black back sheet 100. That is, the solar cell C is packed and fixed (encapsulated) in a state where a plurality of cells are arranged between the front encapsulant layer 220 and the encapsulant layer 30 formed on the black back sheet 100. The solar cells C are electrically connected to each other.

In the present application, the solar cell (C) is not particularly limited. The solar cell C may be selected from a crystalline solar cell and a thin film solar cell. In addition, in the present application, the solar cell C includes a front electrode type, a rear electrode type, and a combination thereof.

The black back sheet 100 of the present invention is formed on the back side (lower side in the drawing) of the solar cell C as described above. As described above, the black back sheet 100 of the present application includes the encapsulant layer 30 as an integral part of the encapsulation material, and the encapsulant layer 30 is formed in contact with the back surface of the solar cell C do. That is, the encapsulant layer 30 constituting the black back sheet 100 of the present application constitutes the back sealant layer of the solar cell module.

A method of manufacturing a solar cell module according to the present invention includes: a first step of forming a front encapsulant layer 220 on a front substrate 210; A second step of arranging the solar cell C on the front encapsulant layer 220; And a third step of forming the black back sheet 100 of the present invention on the solar cell C as shown in FIG.

In this case, the first step may include bonding the encapsulating material (or sheet) to the front substrate 210 or coating the encapsulating resin composition on the front substrate 210 to form the front encapsulating material layer 220 . The encapsulant film (or the encapsulant resin composition) for forming the front encapsulant layer 220 may include at least one encapsulant selected from EVA resin and polyolefin series as described above.

The second step may be performed by various methods as long as a plurality of solar cells C are arranged and electrically connected.

The third step is to stack the black back sheet 100 on the solar cell C so that the solar cell C and the sealing material layer 30 of the black back sheet 100 are in contact with each other, . The bonding may be, for example, thermal lamination (hot pressing). The thermal lamination may be conducted at a temperature of, for example, 90 ° C to 230 ° C, or 110 ° C to 200 ° C for 1 minute to 30 minutes, or 1 minute to 10 minutes, but is not limited thereto.

According to a specific embodiment, the solar cell module is manufactured by sequentially laminating a front substrate 210, a front encapsulant layer 220, an electrically connected solar cell C, and a black back sheet 100, They can be heated and laminated while being vacuum-sucked together.

According to the present application as described above, a solar cell module can be easily manufactured by a simpler process than the conventional process. That is, after the solar cell C is arranged, the solar cell C can be made excellent by the joining of the black back sheet 100 without forming the back sealing material layer 2b (see Fig. 1) It can be sealed with an adhesive force.

More specifically, according to the present application, the process of forming the rear sealing material layer 2b (see FIG. 1) is dispensed with in comparison with the conventional method, and the overall manufacturing process of the solar cell module is simplified, and productivity is improved. Further, between the front encapsulant layer 220 and the black back sheet 100, there is an excellent adhesive force for the above-mentioned reasons, and also has excellent sealing property, insulation property and long-term durability.

According to another aspect of the present invention, there is provided a method of manufacturing a solar cell module, comprising the steps of: arranging a solar cell C on a black back sheet 100 of the present invention; Forming a front encapsulant layer (220) on the solar cell (C); And forming a front substrate 210 on the front encapsulant layer 220. The manufacture of the solar cell module can be variously modified if the black back sheet 100 of the present application is used.

Hereinafter, the production examples, examples and comparative examples of the present application are exemplified. The following preparations and examples are provided by way of example only to aid in understanding the present application, and thus the technical scope of the present application is not limited thereto. And the following comparative example does not mean the prior art, which is illustrated for comparison with the embodiment.

≪ Preparation Example > Preparation of silane-modified ethylene / alpha -olefin copolymer

100 parts by weight of an ethylene /? - olefin copolymer (PE) having a density of 0.870 g / cm 3 and an MFR of 5 g / 10 min under a load of 2.16 kg at 190 占 폚, 2 parts by weight of vinyltrimethoxysilane , 0.01 part by weight of aminopropyltrimethoxysilane (APTMS) and 2, 5-bis (tert-butylperoxy) -2,5-bis (hereinafter referred to as "modified POE (hereinafter referred to as " modified POE ") was extruded by grafting reaction at 220 DEG C by heating and melt- Quot;).

<Back Sheet Production>

[Example 1]

Ethylene /? - olefin copolymer (hereinafter referred to as "unmodified PO") having an ethylene content of 0.870 g / cm 3 and a MFR of 190 g / cm 2 and a load of 2.16 kg at 5 g / 10 min. The modified POE according to Preparation Example 1 and the unmodified PO were mixed in a weight ratio of 1: 2, and then 1000 ppm of a light stabilizer (Uvinul 5050H), 1000 ppm of a UV absorber (TINUVIN UV531) (Irganox 1010) and 500 ppm of antioxidant 2 (Irgafos 168) were added to a hopper of a film forming machine having a twin screw extruder (? 19 mm) and a T die (width: 200 mm) At a temperature of 180 캜 and a take-off speed of 3 m / min to produce a film-like encapsulant having a thickness of about 500 탆.

Further, a polyethylene phthalate film (hereinafter, referred to as "PET film") having a thickness of 50 μm was prepared. An infrared transmitting black pigment layer was formed on one side of the PET film and a white fluororesin layer (infrared reflecting white surface layer) was formed on the other side of the PET film.

The infrared transmitting black pigment layer was obtained by obtaining a pigment composition containing 5 parts by weight of an infrared ray transmitting black pigment with respect to 100 parts by weight of an ethylene homopolymer (PE), molding the pigment composition into a film, . At this time, Chromofine 占 Black A-1103 of azo methyne series was used as the infrared transmitting black pigment. The white fluororesin layer was formed by coating a fluororesin composition containing 5 parts by weight of TiO2 with respect to 100 parts by weight of polyvinylidene fluoride (PVDF).

Next, the prepared encapsulant was laminated on the infrared transmitting black pigment layer, and then laminated by a vacuum laminator at 150 DEG C for 15 minutes and 30 seconds to obtain a PVDF coating layer (IR reflective white) // PET film // A four-layer encapsulant monolithic black back sheet including a PE film (IR transparent black) // encapsulant (POE) was prepared.

[Example 2]

In contrast to Example 1, except that an EVA resin sheet was used in place of the modified POE as the sealing material, and an azo methyne series was used instead of the perylene series as the infrared transmitting black pigment Respectively.

Specifically, an infrared transmitting black pigment layer and a white fluororesin layer were formed on both sides of the PET film. At this time, Chromofine 占 Black A-1103 of azo methyne series was used as an infrared transmitting black pigment. Then, an EVA sheet of about 300 탆 was laminated on the infrared transmitting black pigment layer, and then laminated by thermal lamination to obtain a PVDF coating layer (IR reflective white) // PET film // PE film (IR transparent black) // encapsulating material ) Was prepared as a four-layered bag-integrated black backsheet.

[Comparative Example 1]

The procedure of Example 1 was repeated except that carbon black was used in place of the infrared transmitting black pigment. Specifically, a black pigment layer and a white fluororesin layer were formed on both sides of a PET film, and the black pigment layer was formed by thermally laminating a resin film containing 5 parts by weight of carbon black to 100 parts by weight of an ethylene homopolymer (PE) Respectively. (Non-modified POE) was laminated on the black pigment layer in the same manner as in Example 1 to obtain a PVDF coating layer (white) // PET film // PE film (carbon black) // encapsulant (POE) A four-layered encapsulant monolithic black backsheet was prepared.

[Comparative Example 2]

The procedure of Example 2 was repeated, except that carbon black was used in place of the infrared transmitting black pigment. Specifically, a black pigment layer and a white fluororesin layer were formed on both sides of a PET film, and the black pigment layer was formed by thermally laminating a resin film containing 5 parts by weight of carbon black to 100 parts by weight of an ethylene homopolymer (PE) Respectively. Then, an encapsulating material (EVA sheet) was thermally laminated on the black pigment layer in the same manner as in Example 2 to obtain a PVDF coating layer (white) // PET film // PE film (carbon black) // encapsulating material Thereby producing a four-layered encapsulant monolithic black backsheet.

The IR reflectance, the volume resistivity, and the adhesive force of the black back sheet specimens according to each of the Examples and Comparative Examples were evaluated. The results are shown in Table 1 below. At this time, in Table 1 below, the reflectance shows an average value at the IR wavelength band (about 650 to 1,200 nm). In the following [Table 1], the adhesive force represents the adhesive force between the sealing material and the glass.

A black back sheet according to each of Examples and Comparative Examples was modularized into a crystalline solar cell to produce a module, and the energy conversion efficiency was evaluated. At this time, in the following [Table 1], the energy conversion efficiency is expressed by evaluating the relative values of the other specimens with the standard (100) as the module to which the embodiment 1 is applied.

IR reflectance (%) Resistance (Ω · cm) Adhesion (to glass) (N / 15mm) Energy Conversion Efficiency (%) Example 1 50 1.1 × 10 ¹⁵ 48 100 Comparative Example 1 4 1.0 × 10 ¹⁵ 48 84 Example 2 50 0.8 × 10 ¹⁵ 43 98 Comparative Example 2 4 0.8 × 10 ¹⁵ 43 83

As shown in Table 1, it can be seen that the black back sheet according to the embodiments effectively reflects infrared (IR). On the other hand, in the case of the comparative examples using carbon black, it can be seen that the IR reflectance is very low due to absorption of infrared rays (IR).

In addition, when the black back sheet according to the embodiments is applied to the module, it can be seen that the energy change efficiency is evaluated to be high. When POE is used as an encapsulant, it can be seen that the result is better in resistance (insulation) and adhesion than in the case of using EVA.

10: substrate 20: infrared transmitting black pigment layer
30: sealing material layer 40: surface layer
100: back sheet 210: front substrate
220: Front sealing material layer C: Solar cell

Claims (25)

materials;
An infrared transmitting black pigment layer formed on the substrate; And
And an encapsulant layer formed on the infrared transmitting black pigment layer.
The method according to claim 1,
And a surface layer formed on the substrate and formed on the opposite side of the surface on which the infrared transmitting black pigment layer is formed.
The method according to claim 1,
Wherein the infrared transmitting black pigment layer comprises at least one organic pigment selected from azomethine series and perylene series.
The method according to claim 1,
Wherein the infrared transmitting black pigment layer comprises a resin and an infrared transmitting black pigment.
5. The method of claim 4,
Wherein the resin comprises a polyolefin-based resin.
5. The method of claim 4,
Wherein the infrared transmitting black pigment layer comprises 0.1 to 30 parts by weight of an infrared ray transmitting black pigment per 100 parts by weight of the resin.
The method according to claim 1,
Wherein the sealing material layer comprises a polyolefin resin and a silane compound.
8. The method of claim 7,
Wherein the silane compound is at least one selected from an unsaturated silane compound and an aminosilane compound.
8. The method of claim 7,
Wherein the silane compound comprises at least one selected from vinyl alkoxy silane and aminoalkoxy silane.
9. The method of claim 8,
The silane compound may be at least one selected from the group consisting of aminopropyltrimethoxysilane, aminopropyltriethoxysilane, bis [(3-triethoxysilyl) propyl] amine, bis [(3-trimethoxysilyl) Aminoethylaminopropylmethyldimethoxysilane, aminoethylaminopropylmethyldimethoxysilane, aminoethylaminopropylmethyldimethoxysilane, aminoethylaminopropylmethyldimethoxysilane, aminoethylaminopropylmethyldimethoxysilane, N- [3- (trimethoxysilyl) propyl] Aminoethylaminomethyltriethoxysilane, aminoethylaminomethylmethyldiethoxysilane, diethylenetriaminopropyltrimethoxysilane, diethylenetriaminopropyltriethoxysilane, diethylenetriaminopropylmethyldimethoxysilane, diethylenetriaminopropyltrimethoxysilane, , (N-phenylamino) methyltrimethoxysilane, (N-phenylamino) methyltriethoxysilane, (N-phenylamino) methylmethyl 3- (N-phenylamino) propyltrimethoxysilane, 3- (N-phenylamino) propyltrimethoxysilane, 3- Amino) propylmethyldimethoxysilane, 3- (N-phenylamino) propylmethyldiethoxysilane, N- (N-butyl) -3-aminopropyltrimethoxysilane, glycidoxypropyltrimethoxysilane and glycine Wherein the black back sheet comprises at least one selected from the group consisting of isopropyl triethoxysilane.
The method according to claim 1,
Wherein the sealing material layer comprises a silane-modified polyolefin-based resin.
The method according to claim 1,
Wherein the sealing material layer comprises a silane-modified polyolefin-based resin and a non-modified polyolefin-based resin.
3. The method of claim 2,
Wherein the surface layer comprises an infrared reflective pigment.
3. The method of claim 2,
Wherein the surface layer comprises a fluorine-based resin.
3. The method of claim 2,
Wherein the surface layer comprises a fluororesin and a pigment.
16. The method of claim 15,
Wherein the pigment comprises an infrared reflective pigment that implements white or black color.
Forming an infrared transmitting black pigment layer on the substrate; And
And forming an encapsulant layer on the infrared transmitting black pigment layer.
18. The method of claim 17,
And forming a surface layer on the opposite side of the surface of the substrate on which the infrared transmitting black pigment layer is formed.
The method according to claim 17 or 18,
Wherein the infrared transmitting black pigment layer is formed using a pigment composition comprising a resin and an infrared transmitting black pigment.
20. The method of claim 19,
Wherein the infrared transmitting black pigment comprises at least one organic pigment selected from azomethine series and perylene series.
A solar cell module comprising a black back sheet according to any one of claims 1 to 16.
22. The method of claim 21,
In the solar cell module,
A front substrate;
A front encapsulant layer formed on the front substrate;
Solar cell; And
Black back sheet,
Wherein the solar cell is encapsulated between a front encapsulant layer and an encapsulant layer formed on the black back sheet.
23. The method of claim 22,
Wherein the front encapsulant layer comprises at least one encapsulant selected from ethylene-vinyl acetate copolymer (EVA resin) and polyolefin-based encapsulants.
Forming a front encapsulant layer on the front substrate;
Arranging solar cells on the front encapsulant layer; And
Forming a black back sheet according to any one of claims 1 to 16 on the solar cell.
16. A method of manufacturing a solar cell, comprising: arranging a solar cell on a black back sheet according to any one of claims 1 to 16;
Forming a front encapsulant layer on the solar cell; And
And forming a front substrate on the front encapsulant layer.

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