KR20170079308A - Flow amplifier - Google Patents
Flow amplifier Download PDFInfo
- Publication number
- KR20170079308A KR20170079308A KR1020150189737A KR20150189737A KR20170079308A KR 20170079308 A KR20170079308 A KR 20170079308A KR 1020150189737 A KR1020150189737 A KR 1020150189737A KR 20150189737 A KR20150189737 A KR 20150189737A KR 20170079308 A KR20170079308 A KR 20170079308A
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- KR
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- Prior art keywords
- hole
- discharge
- flow path
- supply fluid
- flow
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
- F15D1/02—Influencing flow of fluids in pipes or conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
- F15D1/00—Influencing flow of fluids
- F15D1/08—Influencing flow of fluids of jets leaving an orifice
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flow rate amplifier, and more particularly, to a flow rate amplifier that amplifies and effectively discharges a discharge flow rate of a discharge fluid containing contaminants generated in a semiconductor processing field.
Description
The present invention relates to a flow amplifier used in the field of semiconductor processing.
A flow amplifier is a device for moving a large amount of ambient air by using a supply fluid as a power source, and a large amount of the supply fluid is discharged together with a discharge fluid flowing into the flow amplifier by a Coanda effect.
Unlike a conventional fan, such a flow amplifier does not have a motor, so there is no problem of vibration or heat generation, and there is no power consumed in the flow amplifier itself.
Therefore, it is widely used as a technology for discharging polluted gas in a technical field where pollution gas is frequently generated, in particular, in the field of semiconductor processing. Such a flow amplifier is disclosed in Korean Patent No. 10-0567433 (hereinafter referred to as Patent Document 1) ) And Korean Patent No. 10-0582235 (hereinafter referred to as " Patent Document 2 ").
In the
The supply fluid flows through the
In this case, generally, the supply fluid uses a high-pressure compressed fluid, whereby the high-pressure supply fluid injected into the
2, the
In other words, the
Further, turbulence can be formed when the left and right supply fluid splits to the left and right of the supply
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to maximize the Coanda effect which acts on the supply fluid by maintaining the pressure and the velocity of the supply fluid supplied to the flow amplifier, And it is an object of the present invention to provide a flow rate amplifier that discharges a large amount of discharge fluid.
According to one aspect of the present invention, a flow rate amplifier includes: a through hole through which a discharge fluid flows; A circulation passage formed in an annular shape surrounding the through-hole; An inflow channel communicating with the circulation channel to introduce a supply fluid into the circulation channel, and being disposed eccentrically with respect to a center axis of the through-hole; And an injection part formed on the circulation flow path and injecting the supply fluid into the through hole, wherein the supply fluid is circulated in one direction along the circulation flow path and is injected into the through hole through the injection part And the circulation flow path is formed such that the cross-sectional area of the circulation flow path becomes smaller toward one direction in which the supply fluid circulates.
In addition, the circulation flow path is formed such that the width of the cross-sectional area becomes smaller toward one direction in which the supply fluid circulates.
In addition, the circulation flow path is formed such that the width of the cross-sectional area becomes smaller toward one direction in which the supply fluid circulates, and the depth of the cross-sectional area becomes shallower toward one direction in which the supply fluid circulates.
In addition, a first expanded portion is formed on the inflow side of the through-hole, through which the discharge fluid flows, and the first expanded portion has a larger diameter toward the inflow side.
In addition, a second expansion part is formed on the discharge side where the discharge fluid is discharged from the through hole, and the diameter of the second expansion part becomes larger toward the discharge side.
In addition, the one direction in which the supply fluid circulates along the circulation channel is a clockwise direction.
According to another aspect of the present invention, there is provided a flow rate amplifier including a first body, a second body coupled to a lower portion of the first body, and an injection portion formed by coupling the first body and the second body, The first body includes a first through-hole formed at the center of the first body, the second body includes a second through-hole formed at the center of the second body, An inlet flow path communicating with the circulation flow path to introduce the supply fluid into the circulation flow path and eccentrically disposed with respect to the central axis of the second through hole; Wherein the first through-hole and the second through-hole communicate with each other to form a through-hole by upward and downward engagement of the first body and the second body, the injection portion is formed on the circulating flow passage, The supply fluid is supplied to the circulation flow path The circulation flow path is formed so that the cross-sectional area of the circulation flow path becomes smaller as the supply fluid circulates in one direction.
The first body may have a rectangular shape, and the second body may have a rectangular shape corresponding to the first body.
In addition, an inflow tube portion is coupled to an upper portion of the first body, a discharge tube portion is coupled to a lower portion of the second body, the inflow tube portion has a rectangular shape corresponding to the rectangular first body, An inlet pipe flange coupled to an upper portion of the body; And an inlet pipe formed at the center of the inlet pipe flange and communicating with the first through hole, wherein the outlet pipe section has a rectangular shape corresponding to the rectangular second body, A discharge pipe flange coupled to the lower portion; And a discharge pipe formed at the center of the discharge pipe flange and communicating with the second through hole.
According to the flow amplifier of the present invention as described above, the following effects can be obtained.
The feed fluid having a high pressure and a high velocity is injected into the through hole through the injection section, thereby maximizing the action of the coanda effect, and thus the flow rate of the discharge fluid can be more efficiently amplified than in the conventional flow amplifier.
Further, since the supply fluid has a high flow rate and a high pressure, even if the length of the through hole is made shorter than that of the conventional flow rate amplifier, it is possible to sufficiently enjoy the Koanda effect acting on the supply fluid. It is possible to easily achieve the amplification of the discharge flow rate of the discharge fluid, so that the noise generated due to the supply fluid flowing along the inner surface of the through hole by the Coanda effect can be reduced.
1 is a cross-sectional view of a conventional flow amplifier;
2 is a plan sectional view of the supply line and the supply fluid flow path of FIG. 1;
3 is a perspective view of a flow amplifier according to a first preferred embodiment of the present invention.
FIG. 4 is an exploded perspective view of FIG. 3; FIG.
5 is a plan view showing the upper surface of the first body of Fig. 3;
6 is a plan view showing a bottom surface of the first body of FIG. 3;
FIG. 7 is a plan view showing the upper surface of the second body of FIG. 3; FIG.
8 is a sectional view of Fig. 3; Fig.
9 is a cross-sectional view of a flow amplifier according to a second preferred embodiment of the present invention.
10 is a graph showing a numerical analysis result of an internal voltage force distribution of a flow amplifier according to a first preferred embodiment of the present invention.
11 is a graph showing a numerical analysis result of an internal flow velocity vector distribution of a flow amplifier according to a first preferred embodiment of the present invention.
12 is a graph showing the result of numerical analysis of an internal voltage force distribution of a flow amplifier according to a second preferred embodiment of the present invention.
13 is a graph showing a numerical analysis result of an internal flow velocity vector distribution of a flow amplifier according to a second preferred embodiment of the present invention.
Fig. 14 is a diagram showing a numerical analysis result of the internal flow velocity distribution on the WW 'cross section in Fig. 13 (d); Fig.
15 is a graph comparing discharge flow rates of discharge fluids of flow amplifiers according to the first and second preferred embodiments of the present invention.
16 is a graph comparing discharge velocities of discharged fluids of flow amplifiers according to the first and second preferred embodiments of the present invention.
The 'discharge fluid' referred to below is a term collectively referred to as a fluid flowing into and discharged from the through-hole of the flow amplifier, and the term 'supply fluid' refers to a fluid supplied / injected into the flow amplifier to amplify the discharge flow rate of the discharge fluid It is. In this case, the supply fluid is preferably a compressed fluid such as compressed air.
The flow rate amplifier according to the first preferred embodiment of the present invention includes a through hole through which a discharge fluid flows, a circulation flow path formed in an annular shape surrounding the through hole, and a circulation flow path communicated with the circulation flow path to introduce the supply fluid into the circulation flow path, And an injection unit formed on the circulating flow path and injecting the supply fluid into the through hole.
The through hole is formed in the inside of the flow amplifier. A discharge fluid flows into the inlet side, a supply fluid is injected through the injection part, and a discharge fluid and a supply fluid are discharged to the discharge side.
The circulation flow path is formed in an annular shape surrounding the through hole, and the inflow path is communicated. In addition, the circulating flow path is provided with an injection section, whereby the supply fluid introduced through the inlet flow path is injected into the through hole through the injection section while circulating along the circulation flow path.
The inflow channel is disposed eccentrically with respect to the center axis of the through-hole, and communicates with the circulation channel to serve as a channel for supplying the supply fluid to the circulation channel.
The injection unit is formed on the circulation flow path, and serves as a passage through which the supply fluid circulating along the circulation flow path is injected into the through-hole.
The flow amplifier having the above-described components may be composed of a first body and a second body.
In this case, the first through hole is formed in the first body, and the second through hole is formed in the second body. When the two bodies are coupled up and down, the first and second through-holes communicate with each other to form through-holes.
Further, the inflow channel and the circulation channel may be formed in the second body, and the injection unit may be formed by combining the first and second bodies.
Hereinafter, one embodiment of the flow amplifier according to the first preferred embodiment of the present invention will be described with reference to a case where the flow amplifier is composed of the first body and the second body.
In this case, when the first body and the second body are coupled with each other by the upper and lower parts to form the flow amplifier, the first through-hole and the second through-hole communicate with each other.
Further, the inlet side of the through-hole is a hole extending in the upper side of the first through-hole, and the discharge side of the through-hole is a hole in the lower side of the second through hole.
Hereinafter, a
3 is a perspective view of the flow amplifier according to the first preferred embodiment of the present invention, Fig. 4 is an exploded perspective view of Fig. 3, Fig. 5 is a plan view showing the upper surface of the first body of Fig. 3, 3 is a plan view showing the upper surface of the second body of Fig. 3, Fig. 8 is a sectional view of Fig. 3, and Fig. 9 is a cross- 10 is a graph showing a result of a numerical analysis of the internal voltage force distribution of the flow amplifier according to the first preferred embodiment of the present invention, and FIG. 11 is a graph showing the results of the numerical analysis according to the first preferred embodiment of the present invention 12 is a graph showing the result of numerical analysis of the internal voltage force distribution of the flow amplifier according to the second preferred embodiment of the present invention, and FIG. 13 is a graph showing the result of numerical analysis of the internal- In a second preferred embodiment of the invention FIG. 14 is a view showing a numerical analysis result of the internal flow velocity vector distribution of the flow amplifier, FIG. 14 is a diagram showing a numerical analysis result of the internal flow velocity vector distribution of the WW 'section in FIG. 13 (d) FIG. 16 is a graph comparing the discharge flow rates of the discharge fluids of the flow amplifiers according to the first and second preferred embodiments of the present invention, and FIG. 16 is a graph comparing the discharge flow rates of the discharge fluids of the flow amplifiers according to the first and second preferred embodiments of the present invention. Graph.
3 to 8, the
An
The
The
Therefore, by inserting a bolt (not shown) into the plurality of first bolt holes 151 as described above, the
The
The
The
Accordingly, the bolt (not shown) is inserted into the plurality of third bolt holes 153 as described above, so that the
The
In other words, the
The
4 to 6 and 8, the
The
A plurality of first bolt holes 151 and a plurality of second bolt holes 152 may be formed in the
The
A plurality of second bolt holes 152 may be formed in the
Therefore, by inserting a bolt (not shown) into the plurality of second bolt holes 152, the
As described above, since the overall shapes of the
In detail, the rectangular shape may have the same size as that of the conventional rectangular fan unit, so that the
In other words, the
Therefore, in order to solve the problems caused by the conventional fan unit in the semiconductor processing equipment used in the conventional semiconductor processing field, that is, the problems related to heat generation, vibration and power consumption, the flow amplifier 100) is used instead of the conventional fan unit, the
The first through
The upper portion of the first through
The first bulging
In this case, the first expanded
Due to the shape of the first expanded
In detail, the discharge fluid flowing through the
6, the
4, 7 and 8, the
The
The
The second through
The upper portion of the second through
The second expanded
Due to the above-described second expanded
Specifically, when the discharged fluid is discharged to the
As described above, the second expanded
And the
The
The
In this case, the
The
The
The
Since the
In this case, it is preferable that the circulation direction of the supply fluid circulating along the
The
In the case where the location where the
As shown in FIG. 7, the
The upper surface of the circulating
An
The circulating
In the case of the
In addition, the
As described above, since the cross-sectional area of the
The
Hereinafter, the fluid flow of the
First, the discharge fluid flows into the first and second through
The discharge fluid flows into the through
In order to amplify the discharge flow rate of the discharge fluid as described above, an external supply fluid supply unit (not shown) is operated to supply the supply fluid into the
The supply fluid flows through the
The supply fluid flowing into the
The supply fluid injected into the through
As described above, due to the Coanda effect, the supply fluid flows along the inclined inner surface of the
Accordingly, the flow rate of the discharge fluid flowing into the
That is, since the supply fluid flows along the inclined inner surface of the second
In the fluid flow of the
In detail, in the case of the
In other words, the
In addition, the
Hereinafter, a flow amplifier 100 'according to a second preferred embodiment of the present invention will be described.
The flow amplifier 100 'according to the second preferred embodiment of the present invention differs from the
The circulation flow path 121 'of the flow amplifier 100' according to the second preferred embodiment of the present invention is configured such that the width of the cross-sectional area of the circulation flow path 121 'decreases in the one direction in which the supply fluid circulates, , And the cross-sectional area of the circulating flow path 121 'is shallow.
In this case, as described above in the
That is, in the circulating flow path 121 'of the flow amplifier 100' according to the second preferred embodiment of the present invention, the sectional area of the circulating flow path 121 'is shallower toward the upper direction of the
The flow amplifier 100 'according to the second preferred embodiment of the present invention differs from the
10 to 15, the flow of the discharge fluid of the flow amplifier 100 'according to the second preferred embodiment of the present invention is compared with the
10 to 15 are schematic diagrams for explaining the operation of applying the supply fluid to the
10 (a) to 10 (d) show a case where a supply fluid having a pressure of 0.1 Mpa, 0.2 Mpa, 0.3 Mpa and 0.4 Mpa is supplied to the
10 (a) to 10 (d) and 11 (a) to 11 (d) are inner regions of the
The X 'region in FIGS. 12 (a) to 12 (d) and 13 (a) to 13 (d) is an inner region of the
The numerical analysis is the result of measurement using ANSYS CFX, a thermo-fluid analysis software. As a boundary condition of the numerical analysis, 'compressed air' is used as a feed fluid. In the
The
The above-described voltage force distribution in the X region to the Z region increases the pressure of the supply fluid to 0.2 MPa, 0.3 MPa and 0.4 MPa, respectively, as shown in 10 (b) to 10 (d) The distribution of the voltage inside the
As shown in Figs. 11 (a) to 11 (d), the
Accordingly, the supply fluid having a high flow rate along the inner surface of the
The flow amplifier 100 'according to the second preferred embodiment of the present invention is configured such that the 0.1 MPa supply fluid circulates along the circulation flow path 121', as shown in FIG. 12 (a) The voltage of the X 'region increases toward the
However, when the pressure of the supply fluid is increased to 0.2 MPa, 0.3 MPa and 0.4 MPa and supplied to the flow amplifier 100 ', as shown in FIGS. 12 (b) to 12 (d) , And this biased voltage distribution is more prominent when the supply pressure of the supply fluid is 0.4 MPa.
This biased voltage force distribution is caused by the biased Coanda effect as the supply pressure of the supply fluid increases.
Such a biased voltage distribution is obtained by connecting the circulation flow path 121 'of the flow amplifier 100' according to the second preferred embodiment of the present invention and the circulation flow path 121 'of the
In other words, in the case of the flow amplifier 100 'according to the second preferred embodiment of the present invention, the width of the cross-sectional area of the circulating flow path 121' becomes smaller as the supply fluid circulates in the circulating flow path 121 ' The flow rate of the supply fluid injected into the injection section 130 'is higher than that of the
Due to such a biased voltage distribution, the fluid in the region having the high-voltage power flows to the region having the low-voltage power, the supply fluid is rotated clockwise in the circulating flow path 121 ' A helical current flows in the flow amplifier 100 'in the clockwise direction along the inner surface of the through hole 111' of the flow amplifier 100 '.
The helical current is generated in the lower portion of the Y 'region, which is the inner region of the through hole 111', and is formed throughout the entire interior of the
Also, as the supply pressure of the supply fluid becomes higher, the flow velocity distribution inside the flow amplifier 100 'can be clearly divided into the high velocity region and the low velocity region as shown in FIG. Therefore, the higher the supply pressure of the supply fluid is, the stronger the spiral flow is formed, and the flow velocity of the discharge fluid and the supply fluid discharged through the
As described above, the flow amplifier 100 'according to the second preferred embodiment of the present invention forms a spiral flow that rotates clockwise inside the flow amplifier 100' and flows to the
These effects can also be confirmed by the numerical analysis results of FIGS. 15 and 16, whereby the flow amplifier 100 'according to the second preferred embodiment of the present invention amplifies the discharge flow rate of the discharged fluid with higher efficiency .
The
In this case, instead of the fan unit used in the conventional semiconductor processing equipment, the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Or modified.
100, 100 ':
110b, 110b ':
111a, 111a ': first through
112b, 112b ':
113b, 113b ':
123, 123 ':
130, 130 ': injection part 151: first bolt hole
152: second bolt hole 153: third bolt hole
200: inlet pipe 210: inlet pipe flange
220: inlet pipe 300: exhaust pipe
310: exhaust pipe flange 320: exhaust pipe
Claims (9)
A circulation passage formed in an annular shape surrounding the through-hole;
An inflow channel communicating with the circulation channel to introduce a supply fluid into the circulation channel, and being disposed eccentrically with respect to a center axis of the through-hole; And
And an injection part formed on the circulating flow path and injecting the supply fluid into the through hole,
The supply fluid circulates in one direction along the circulation flow path and is injected into the through-hole through the injection part,
Wherein the circulation flow path is formed such that the cross-sectional area of the circulation flow path becomes smaller in one direction in which the supply fluid circulates.
Wherein the circulation flow path is formed such that a width of a cross-sectional area of the circulation flow path becomes smaller toward one direction in which the supply fluid circulates.
Wherein the circulation flow path is formed such that the width of the cross-sectional area becomes smaller toward one direction in which the supply fluid circulates, and the depth of the cross-sectional area becomes shallower toward one direction in which the supply fluid circulates.
Wherein a first expansion part is formed on an inflow side of the through-hole to which the discharge fluid flows, and the first expansion part has a larger diameter toward the inflow side.
Wherein a second expansion part is formed on the discharge side where the discharge fluid is discharged from the through hole, and the diameter of the second expansion part becomes larger toward the discharge side.
Wherein one direction in which the supply fluid is circulated along the circulation flow passage is a clockwise direction.
The first body includes a first through hole formed at the center of the first body,
The second body includes a second through-hole formed at the center of the second body, a circulation channel formed in an annular shape surrounding the second through-hole, And an inflow passage which is introduced into the flow path and is disposed eccentrically with respect to the central axis of the second through hole,
The first through hole and the second through hole are communicated with each other to form a through hole by upward and downward coupling of the first body and the second body, the injection portion is formed on the circulating flow passage,
The supply fluid circulates in one direction along the circulation flow path and is injected into the through-hole through the injection part,
Wherein the circulation flow path is formed such that the cross-sectional area of the circulation flow path becomes smaller in one direction in which the supply fluid circulates.
Wherein the first body has a rectangular shape and the second body has a rectangular shape corresponding to the first body.
An inflow tube portion is coupled to an upper portion of the first body, a discharge tube portion is coupled to a lower portion of the second body,
Wherein the inflow tube portion has a rectangular shape corresponding to the rectangular first body and is connected to an upper portion of the first body; And an inflow pipe formed at the center of the inflow tube flange and communicating with the first through hole,
Wherein the discharge pipe portion has a rectangular shape corresponding to the rectangular second body and has a discharge pipe flange coupled to a lower portion of the second body; And a discharge pipe formed at the center of the discharge pipe flange and communicating with the second through hole.
Priority Applications (1)
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KR1020150189737A KR20170079308A (en) | 2015-12-30 | 2015-12-30 | Flow amplifier |
Applications Claiming Priority (1)
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KR1020150189737A KR20170079308A (en) | 2015-12-30 | 2015-12-30 | Flow amplifier |
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KR20170079308A true KR20170079308A (en) | 2017-07-10 |
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KR1020150189737A KR20170079308A (en) | 2015-12-30 | 2015-12-30 | Flow amplifier |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102065569B1 (en) * | 2019-08-16 | 2020-01-13 | 나명환 | An air amplification apparatus for kitchen range hood |
KR20220156307A (en) * | 2021-05-18 | 2022-11-25 | (주)씨에스피 | Flow control apparatus |
-
2015
- 2015-12-30 KR KR1020150189737A patent/KR20170079308A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102065569B1 (en) * | 2019-08-16 | 2020-01-13 | 나명환 | An air amplification apparatus for kitchen range hood |
KR20220156307A (en) * | 2021-05-18 | 2022-11-25 | (주)씨에스피 | Flow control apparatus |
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