KR20170065973A - Method for forming conductive pattern by direct radiation of electromagnetic wave - Google Patents
Method for forming conductive pattern by direct radiation of electromagnetic wave Download PDFInfo
- Publication number
- KR20170065973A KR20170065973A KR1020150172414A KR20150172414A KR20170065973A KR 20170065973 A KR20170065973 A KR 20170065973A KR 1020150172414 A KR1020150172414 A KR 1020150172414A KR 20150172414 A KR20150172414 A KR 20150172414A KR 20170065973 A KR20170065973 A KR 20170065973A
- Authority
- KR
- South Korea
- Prior art keywords
- forming
- conductive pattern
- polymer
- region
- resin substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 62
- 230000005855 radiation Effects 0.000 title 1
- 239000002952 polymeric resin Substances 0.000 claims abstract description 139
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 239000010410 layer Substances 0.000 claims abstract description 103
- 229910052751 metal Inorganic materials 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims abstract description 100
- 239000011247 coating layer Substances 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 71
- 230000003746 surface roughness Effects 0.000 claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000002904 solvent Substances 0.000 claims abstract description 25
- 239000003495 polar organic solvent Substances 0.000 claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 32
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 24
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 24
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 24
- 229920005668 polycarbonate resin Polymers 0.000 claims description 21
- 239000004431 polycarbonate resin Substances 0.000 claims description 21
- -1 polypropylene Polymers 0.000 claims description 19
- 229910021645 metal ion Inorganic materials 0.000 claims description 15
- 238000007772 electroless plating Methods 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000002082 metal nanoparticle Substances 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229920001283 Polyalkylene terephthalate Polymers 0.000 claims description 2
- 239000004954 Polyphthalamide Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000001680 brushing effect Effects 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000765 poly(2-oxazolines) Polymers 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 2
- 229920006375 polyphtalamide Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 238000000527 sonication Methods 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 abstract description 25
- 230000000996 additive effect Effects 0.000 abstract description 22
- 230000008569 process Effects 0.000 abstract description 16
- 239000000047 product Substances 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 239000003638 chemical reducing agent Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910052596 spinel Inorganic materials 0.000 description 4
- 239000011029 spinel Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004609 Impact Modifier Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005518 polymer electrolyte Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 101710134784 Agnoprotein Proteins 0.000 description 1
- 239000004380 Cholic acid Substances 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a method for forming a conductive pattern by direct irradiation of electromagnetic waves, which makes it possible to form a better fine conductive pattern by a simplified process on various polymer resin products or resin layers without incorporating a special inorganic additive into the polymer resin itself .
The method of forming a conductive pattern by direct irradiation of electromagnetic waves includes the steps of forming a soluble polymer coating layer soluble in a water solvent or a polar organic solvent on a polymer resin substrate; Selectively removing the soluble polymer coating layer of the first region while forming a first region having a predetermined surface roughness by selectively irradiating electromagnetic wave to the polymer resin substrate; Forming a conductive seed on the polymeric resin substrate; Forming a metal layer by plating a polymer resin substrate on which a conductive seed is formed; And removing the soluble polymer coating layer and the metal layer in the second region of the polymer resin substrate not irradiated with electromagnetic waves by treating the polymer resin substrate having the metal layer formed thereon with a water solvent or a polar organic solvent.
Description
The present invention relates to a method for forming a conductive pattern by direct irradiation of electromagnetic waves, which makes it possible to form a better fine conductive pattern by a simplified process on various polymer resin products or resin layers without incorporating a special inorganic additive into the polymer resin itself .
2. Description of the Related Art [0002] With the development of microelectronic technology in recent years, there is a growing demand for a structure in which fine conductive patterns are formed on the surfaces of polymer resin substrates (or products) such as various resin products or resin layers. The conductive patterns and structures on the surface of the polymer resin substrate can be applied to form various objects such as antennas, various sensors, MEMS structures or RFID tags integrated in a cellular phone case such as a smart phone.
In particular, unlike conventional mobile phones, recent portable devices, such as smart phones, require simultaneous communication functions such as communication, Bluetooth, Wi-Fi, or electronic approval, so that a variety of antennas can be mounted on a single smartphone There is a need. In addition, since the design of mobile devices such as smart phones is emphasized, a conductive pattern capable of serving as various antennas is formed on the surface of the polymer resin substrate such as a case of a portable device Are continuously proposed and researched.
As described above, as the interest in the technique of forming the conductive pattern on the surface of the polymer resin substrate increases, several techniques have been proposed. For example, a polymeric resin base material is formed by blending and molding a special inorganic additive (for example, CuCr 2 O 4 having a spinel structure) containing a transition metal such as copper or chromium in a polymer resin chip, A method has been proposed in which a conductive pattern is formed on the polymer resin substrate by directly irradiating an electromagnetic wave such as a laser to a laser irradiation area and then forming a metal layer by plating in the laser irradiation area. In this method, the metal-based layer and the conductive pattern can be formed by exposing the inorganic-additive-derived component in the laser irradiation region to act as a kind of seed for plating.
However, in such a method for forming a conductive pattern, a special expensive inorganic additive must be used in a considerable amount, resulting in an increase in the overall process cost. In addition, since the inorganic additive needs to be blended with the polymer resin chip itself, such an inorganic additive may deteriorate the physical properties such as the mechanical properties of the polymer resin substrate and the resin product formed therefrom. In addition, the special inorganic additive such as CuCr 2 O 4 of the spinel structure itself has a considerably dark color in many cases. Therefore, it may be an obstacle in realizing a polymer resin base material or a resin product containing it as a desired color have. For example, in order to realize a polymer resin base material containing such an inorganic additive in a desired color, it is necessary to use a larger amount of pigment, and furthermore, it is difficult to realize white color.
Due to such disadvantages, it has been continuously required to develop a technique for forming a minute conductive pattern on various polymer resin products or resin layers by a simplified process without incorporating special inorganic additives into the polymer resin itself .
As one technique capable of satisfying such a demand, an area such as a laser is irradiated with an electromagnetic wave such as laser to have a surface roughness of a certain level or higher, and electroless plating is selectively applied to the area. A technique for forming a metal layer is proposed. According to this, in the electromagnetic wave irradiation region, the conductive pattern having excellent adhesion can be satisfactorily formed due to the surface roughness of the polymer resin, whereas in the electromagnetic wave unirradiated region, the metal layer can not be properly adhered to the smooth polymer resin surface, . Therefore, a fine conductive pattern can be formed in various polymer resin products or a desired region of the resin layer without using a special inorganic additive.
However, in the conventional method of forming a conductive pattern by electromagnetic wave irradiation, when it is desired to form a conductive pattern on a polymer resin product or a resin layer having a certain surface curvature or surface roughness, the metal layer is completely removed in the non- It is difficult to selectively form a good conductive pattern in a desired region. That is, due to the surface curvature or surface roughness of the polymer resin product itself, an adhesive strength of a certain level or more is developed between the metal layer and the polymer resin in the non-electromagnetic wave unirradiated region and is thus difficult to be removed. As a result, Is difficult to form.
The present invention provides a method of forming a conductive pattern by direct irradiation of electromagnetic waves, which enables to selectively form a fine conductive pattern on a polymer resin product or a resin layer without incorporating a special inorganic additive into the polymer resin itself .
The present invention provides a method for producing a polymer electrolyte membrane, comprising: forming a soluble polymer coating layer soluble in a water solvent or a polar organic solvent on a polymer resin substrate; Selectively removing the soluble polymer coating layer of the first region while forming a first region having a predetermined surface roughness by selectively irradiating electromagnetic wave to the polymer resin substrate; Forming a conductive seed on the polymeric resin substrate; Forming a metal layer by plating a polymer resin substrate on which a conductive seed is formed; And a step of treating the polymer resin base material with the metal layer formed thereon with a water solvent or a polar organic solvent to remove the soluble polymer coating layer in the second region of the polymer resin base material not irradiated with electromagnetic waves, Lt; / RTI >
In the conductive pattern forming method, the first region of the polymer resin base may have a surface roughness defined by a center line surface roughness (Ra) of about 500 nm or more, and the second region may have a centerline surface roughness Ra ).
In the conductive pattern forming method, in the step of removing the soluble polymer coating layer, the coating layer is dissolved or removed by a water solvent or a polar organic solvent, and the surface state of the polymer resin substrate of the second region, such as surface curvature and surface roughness The conductive seed and the metal layer on the coating layer can be effectively removed.
According to the present invention, even if a special expensive inorganic additive is used and is not included in the polymer resin base material itself, the surface roughness of the region where the conductive pattern is to be formed by electromagnetic wave irradiation such as laser and the adhesive force to the metal layer are controlled, The conductive pattern can be formed on the polymeric resin substrate.
Therefore, the unit cost of the conductive pattern forming process can be lowered, and the specific inorganic additive can minimize the possibility of deterioration of physical properties such as the mechanical properties of the polymer resin substrate or the product. In addition, since the desired fine conductive pattern can be formed on the polymeric resin substrate without using the special inorganic additive, it is easier to utilize the color of the resin itself and to express the color of the polymeric resin base or product in a desired color.
In addition, in the present invention, the metal layer can be removed more effectively in the electromagnetic wave unirradiated region regardless of the surface state such as surface curvature and surface roughness of the polymer resin substrate to be formed with the conductive pattern through the soluble polymer coating layer and the removing step thereof . Therefore, a better fine conductive pattern can be selectively formed in various polymer resin products having various surface states and shapes or in a desired region on the resin layer.
As a result, by using the conductive pattern forming method and the like of the present invention, conductive patterns for antennas, RFID tags, various sensors, MEMS structures, and the like on various resin products such as a smartphone case can be formed very effectively.
1 is a schematic diagram schematically showing an example of a method of forming a conductive pattern by direct irradiation of electromagnetic waves according to an embodiment of the invention in the order of steps.
2A is a photograph of a surface of a polymer resin substrate (polycarbonate resin substrate) used in Examples and Comparative Examples, respectively.
FIG. 2B is a photograph of the surface of the polymer resin substrate after forming the polyvinylpyrrolidone coating layer in the examples. FIG.
Fig. 2C is a photograph of the surface of the polymer resin substrate in the irradiation region after laser irradiation in the embodiment. Fig.
FIG. 2 (d) is a photograph of the surface of the polymer resin substrate after the formation of the metal layer in the embodiment, wherein the left photograph shows a state in a region where the first polyvinylpyrrolidone coating layer is not formed, and the right photograph shows a polyvinylpyrrolidone coating layer In the area.
Fig. 2E shows a photograph of the surface of the polymer resin substrate after removal of the polyvinylpyrrolidone coating layer in the examples. Fig.
3A is a photograph of the surface of the polymer resin base material in the irradiation region after laser irradiation in Comparative Example 1. Fig.
Fig. 3B shows a photograph of the surface of the polymer resin substrate after the formation of the metal layer and the unirradiated area in Comparative Example 1, which shows that a part of the metal layer in the unirradiated region remained despite the removal of the metal layer.
Fig. 4 is a photograph of the adhesive force evaluation result of the conductive pattern for Example 1. Fig.
A method of forming a conductive pattern by direct irradiation of an electromagnetic wave according to a specific embodiment of the present invention will be described below.
According to one embodiment of the present invention, there is provided a method for producing a polymer electrolyte membrane, comprising: forming a soluble polymer coating layer soluble in a water solvent or a polar organic solvent on a polymer resin substrate; Selectively removing the soluble polymer coating layer of the first region while forming a first region having a predetermined surface roughness by selectively irradiating electromagnetic wave to the polymer resin substrate; Forming a conductive seed on the polymeric resin substrate; Forming a metal layer by plating a polymer resin substrate on which a conductive seed is formed; And a step of treating the polymer resin base material with the metal layer formed thereon with a water solvent or a polar organic solvent to remove the soluble polymer coating layer in the second region of the polymer resin base material not irradiated with electromagnetic waves, / RTI >
According to one embodiment of the present invention, a predetermined soluble polymer coating layer is first formed on a polymer resin substrate, and then an electromagnetic wave such as a laser is irradiated to a first region where a conductive pattern is to be formed. By this electromagnetic wave irradiation, the soluble polymer coating layer is removed in the first region, and a concavo-convex pattern, a constant pattern form or an amorphous form surface structure is formed on the polymer resin base material of the first region, . In this first region, the adhesion between the surface of the polymer resin substrate and the metal layer to be formed by plating in the future can be further improved due to a predetermined surface roughness.
On the other hand, in the second region which is not irradiated with the electromagnetic wave such as laser, the soluble polymer coating layer to be removed in the subsequent step remains as it is, and due to the original surface curvature or roughness of the polymer resin substrate itself, Can exhibit poor adhesion with the metal layer.
As a result, when a conductive seed for promoting plating is formed on the polymer resin substrate and the plating is progressed, a metal layer having good adhesion with the polymer resin base material is well formed in the first region, A metal layer having poor adhesion can be formed on the soluble polymer coating layer. Accordingly, when the polymeric resin substrate is treated with a water solvent or a polar organic solvent to dissolve and remove the soluble polymer coating layer in the second region, the metal layer of the second region existing on the polymer coating layer can be removed together.
In addition, since the soluble polymer coating layer can stabilize metal ions and the like contained in the conductive seed, it is possible to inhibit the conductive seed from being reduced / precipitated and promoting the plating in the metal layer formation step by plating. Therefore, the metal layer of the second region has a poorer adhesion force, and can be more easily removed together with the polymer coating layer.
Therefore, according to one embodiment of the present invention, a metal layer can be formed in the electromagnetic wave unirradiated region through the soluble polymer coating layer and the removing step thereof, irrespective of surface conditions such as surface curvature and surface roughness of the polymer resin substrate to be formed with the conductive pattern It can be removed more effectively. Therefore, a better fine conductive pattern can be selectively formed in various polymer resin products having various surface states and shapes or in a desired region on the resin layer.
In addition, in the method of this embodiment, it is possible to form a good conductive pattern on various polymeric resin substrates by a simpler process without using a special expensive inorganic additive such as CuCr 2 O 4 having a spinel structure have. Therefore, the unit cost of the conductive pattern forming process can be lowered, and the specific inorganic additive can minimize the possibility of deterioration of physical properties such as the mechanical properties of the polymer resin substrate and the product. Furthermore, since it is not necessary to use the special inorganic additive, it is easier to use the color of the resin itself and to express the polymer resin base material or product in a desired color.
Hereinafter, a method of forming a conductive pattern by direct irradiation of electromagnetic waves according to an embodiment will be described in more detail with respect to each process step with reference to the drawings. 1 is a schematic diagram schematically showing an example of a method of forming a conductive pattern by direct irradiation of electromagnetic waves according to an embodiment of the invention in the order of steps.
As shown in (1) and (2) of FIG. 1, in the conductive pattern forming method of one embodiment, a soluble polymer coating layer soluble in a water solvent or a polar organic solvent is first formed on a polymer resin substrate.
At this time, the polymer resin base material can be formed using any thermosetting resin or thermoplastic resin. Specific examples of the polymer resin such as a thermosetting resin or a thermoplastic resin capable of forming such a polymer resin base material include a polyalkylene terephthalate resin such as an ABS resin, a polybutylene terephthalate resin or a polyethylene terephthalate resin, a polycarbonate resin , A polypropylene resin, or a polyphthalamide resin. In addition, a polymer resin base material can be formed using various polymer resins.
The polymer resin base material may be formed only of the above-mentioned polymer resin, but may further include an additive conventionally used for forming a polymer resin product, for example, a UV stabilizer, a heat stabilizer or an impact modifier, if necessary . Such additives may be included in an amount of about 2% by weight or less, or about 0.01 to 2% by weight, based on the weight of the entire polymer resin substrate. However, the polymer resin base material need not contain a special inorganic additive used for forming a conductive pattern by previously known electromagnetic wave irradiation, for example, CuCr 2 O 4 having a spinel structure.
In addition, the soluble polymer coating layer may be suitably coated and formed on the entire surface of the polymer resin substrate. Such a polymer coating layer may exhibit excellent coating properties to the polymer resin substrate, and may be a water solvent such as water or a polar organic Can be formed by using any soluble polymer which exhibits other excellent solubility in a solvent and can be easily removed in a subsequent step.
The kind of the soluble polymer may be appropriately selected by those skilled in the art in consideration of the kind of the polymer resin base material, the solubility in a water solvent or a polar organic solvent, and is not particularly limited. Specific examples of the soluble polymer include a polymer selected from the group consisting of a polyvinylpyrrolidone (PVP) -based polymer, a polyalkylene glycol-based polymer, an acrylic polymer, a polyoxazoline-based polymer, and a polyvinyl alcohol-based polymer Or more.
Such a soluble polymer may have a weight average molecular weight of 1000 to 500000 in view of the coating property to the polymer resin substrate and the solubility in various solvents.
The soluble polymer coating layer may be formed by coating a solution prepared by dissolving the soluble polymer described above in a water solvent or polar organic solvent or the like by a conventional coating method such as dip coating, spin coating or spray coating, Followed by drying.
On the other hand, after the soluble polymer coating layer is formed, a first region having a predetermined surface roughness can be formed by selectively irradiating the polymer resin substrate with electromagnetic waves as shown by 3 in Fig. By irradiation of such electromagnetic waves, the polymer resin base material has a predetermined surface roughness in the first region, and the soluble polymer coating layer can be destroyed by electromagnetic waves and removed.
In the electromagnetic wave irradiation process, a relatively regular pattern or irregular shape such as a hole or a mesh pattern is formed in the first area, or an amorphous surface structure in which a plurality of irregular holes, And the polymer resin substrate of the first region may have a predetermined surface roughness due to the various surface shapes or structures.
In one example, in order to secure a good adhesion between the metal layer (conductive pattern) to be formed in the first region and the surface of the polymer resin base material, the first region of the polymer resin base material may have a thickness of about 500 nm or more, (Ra) of about 1 to 3 占 퐉, and the second region that is not irradiated with electromagnetic waves has a centerline surface roughness (Ra) smaller than the first region, for example, about 400nm Or less, or about 100 nm or less, or a surface roughness (Ra) of a center line surface of about 0 to 90 nm. However, it goes without saying that the surface roughness of the second region may vary depending on the surface characteristics of the original polymer resin substrate.
When the polymer coating layer of the first region is removed by the electromagnetic wave irradiation of the laser or the like and the polymer resin base material of the first region has the above-described surface roughness, a metal layer is formed on the first region in the subsequent plating process , Such a metal layer can be formed and held on the polymer resin substrate with excellent adhesion force, and can be formed into a good conductive pattern. Compared with the first region, the polymeric resin base material of the second region, which is not irradiated with electromagnetic waves such as a laser, remains on the upper surface of the soluble polymer coating layer to be removed as it is, and the metal layer itself is also formed on the first region So that it can be easily removed. As a result, in the subsequent steps, the metal layer of the second region together with the polymer coating layer can be completely (substantially) completely removed completely, and a good conductive pattern can be selectively formed on the polymer resin substrate of the first region.
On the other hand, an electromagnetic wave such as a laser can be irradiated under predetermined conditions to be described later so that the polymer resin base material of the first region can exhibit the above-described surface roughness.
First, in the electromagnetic wave irradiating step, a laser electromagnetic wave can be irradiated and a laser beam having a wavelength of about 248 nm, about 308 nm, about 355 nm, about 532 nm, about 585 nm, about 755 nm, about 1064 nm, about 1070 nm, Or a laser electromagnetic wave having a wavelength of about 10600 nm can be irradiated. In another example, a laser electromagnetic wave having a wavelength in the infrared (IR) region may be irradiated.
The specific conditions at the time of irradiating the laser electromagnetic wave can be adjusted or changed depending on the kind of resin, physical properties, thickness, type and thickness of the metal layer to be formed, or the level of the appropriate adhesive force in consideration thereof. However, under the irradiation condition of an average power of, for example, about 0.1 to 50 W, or about 1 to 30 W, or about 5 to 25 W, so that the polymer resin base material of the first region can have the above-described predetermined surface roughness, It can proceed by irradiating the laser electromagnetic wave.
Further, the laser electromagnetic wave irradiation may be irradiated once at a relatively strong power, but may be irradiated at two or more times at a relatively low power. As the number of times of the laser electromagnetic wave irradiation increases, the surface roughness increases and the structure such as irregularities formed on the surface can change from the hole pattern to the mesh pattern or the amorphous surface structure. It is possible to form an appropriate surface structure on the polymer resin substrate of the first region by controlling the number of times of recovery and the like, and to have an appropriate degree of surface roughness and thus an excellent adhesion with the metal layer.
In the irradiation of the electromagnetic wave, for example, traces of electromagnetic wave irradiation may be formed on the polymer resin substrate in a hole shape or the like in accordance with the irradiation interval. However, in order to ensure that the polymer resin base material of the first region already has the above-mentioned appropriate surface roughness, it is preferable that the distance between the center portions of the electromagnetic wave irradiation marks, or the irradiation interval of the electromagnetic wave is about 20 mu m or more, To 70 [micro] m. As a result, the polymer resin base material of the first region can have an appropriate surface roughness, and at the same time, the polymer resin base material and the metal layer can be properly adhered to each other.
On the other hand, as described above, after irradiating the first region with an electromagnetic wave such as a laser, a conductive seed can be formed on the polymer resin substrate as shown by? In Fig. Such a conductive seed can reduce / precipitate and grow on the polymer resin substrate during plating to promote formation of a metal layer by plating. Thus, a better metal layer and a conductive pattern can be suitably formed on the polymer resin substrate of the first region.
However, in the second region, the soluble polymer coating layer can stabilize the metal ions and the like included in the conductive seed, so that the conductive seed can be reduced / precipitated in the plating step to prevent the plating from being promoted. Therefore, the metal layer of the second region has a poorer adhesion force, and can be more easily removed together with the polymer coating layer.
Meanwhile, the conductive seed may include metal nanoparticles, metal ions, or metal complex ions. Further, the metal ion or the metal complex ion is not limited to the metal ion or the metal complex ion, but also the form of the metal complex compound containing the metal ion-containing compound or the metal complex ion containing the metal ion or metal complex ion, May also be used.
The kind of the metal element that can be included in such a conductive seed is not particularly limited as long as it can exhibit conductivity. Examples of the metal element include copper (Cu), platinum (Pt), palladium (Pd), silver (Ag) Nickel, tungsten, titanium, chromium, aluminum, zinc, tin, lead, magnesium, manganese, And iron (Fe), an ion thereof or a complex ion thereof.
In order to form the conductive seed on the polymer resin substrate, a dispersion or solution containing the conductive seeds described above, for example, metal nanoparticles, metal ions or metal complex ions, is applied on the polymer resin substrate, , Drying and / or reduction may be carried out to form a conductive seed in a desired form, for example, a particle form. More specifically, when the dispersion liquid or the like contains metal nanoparticles, it may be precipitated using a difference in solubility and then dried to form a conductive seed in the form of particles. When the dispersion liquid or the like contains a metal ion or a metal complex ion A metal compound or a complex compound thereof, for example, a metal compound such as AgNO 3 , Ag 2 SO 4 , KAg (CN) 2 , or a complex compound), and the like are reduced and dried to prepare a conductive seed .
At this time, the reduction of the metal ion or metal complex ion may be carried out using a conventional reducing agent such as a hypophosphite-based reducing agent such as an alcohol-based reducing agent, an aldehyde-based reducing agent, sodium hypophosphite or its hydrate, a hydrazine- At least one reducing agent selected from the group consisting of a reducing agent, sodium borohydride, and lithium aluminum hydride may be used.
The dispersion or solution may be a liquid medium containing an aqueous polymer solution (for example, a solution of a polyvinyl pyrrolidone polymer or the like) capable of improving the adhesion between the polymer resin substrate and the conductive seed, or a metal ion or a metal complex ion (For example, NH 3 , EDTA, or Rochelle salt), which can stabilize the water-soluble polymer, and the like.
The application of the dispersion or solution of the conductive seed may be performed by a general process for applying the liquid composition to the polymer resin substrate, and may be performed by, for example, dipping, spin coating or spraying.
The conductive seeds formed in this manner can be formed on the entire surface of the polymeric resin substrate including the surface irregularities, patterns or surface structures formed in the first region, promote the good formation of the metal layer in the plating process, And the like.
Meanwhile, referring to (5) of FIG. 1, after the conductive seed is formed on the polymer resin substrate, the polymer resin substrate having the conductive seed formed thereon may be plated to form a metal layer. The metal layer forming step may be performed by electroless plating a conductive metal on the polymer resin substrate, and the method and condition of the electroless plating step may be determined according to conventional methods and conditions.
For example, the plating process is carried out using a plating solution containing a conductive metal constituting a metal layer, for example, a metal source such as copper, a complexing agent, a pH adjusting agent and a reducing agent, A metal layer can be formed on the polymer resin base material. At this time, the metal layer may be formed on the conductive seed while the conductive seed described above grows.
Such a metal layer can be preferably formed with good adhesion to the first region having a predetermined surface roughness. Particularly, the plating can be performed more quickly and efficiently in the first region due to the reduction / precipitation and growth of the conductive seed, and as a result, a metal layer having a better adhesive force can be formed.
On the other hand, in the second region, the metal layer is formed on the soluble polymer coating layer to be removed later and can be easily removed together with the polymer coating layer. Furthermore, the polymer coating layer stabilizes the conductive seed to suppress the reduction / precipitation and growth of metal ions during plating, and thus the plating promotion. As a result, not only the plating speed is slowed in the second region, but also a metal layer showing relatively poor adhesion can be formed.
After the metal layer is formed, the polymeric resin substrate is treated with a water solvent or a polar organic solvent to dissolve and remove the soluble polymer coating layer in the second region not irradiated with electromagnetic waves. As a result, And the conductive pattern can be selectively formed in the remaining first region.
In this process, when the polymer coating layer is dissolved and dissolved as a soluble solvent, the conductive seed and the metal layer on the polymer coating layer can be removed together. Since the process of dissolving and removing the polymer coating layer can be performed without being influenced by the surface curvature and the surface roughness of the polymer resin substrate itself, the metal layer of the second region can be efficiently , (Substantially) completely removed.
The step of removing the polymer coating layer may be carried out by appropriately selecting any water solvent or polar organic solvent in which the soluble polymer exhibits high solubility. Specific examples of such water solvents or polar organic solvents include alcohol-based solvents such as water and ethanol, and ketone-based solvents such as acetone, and various other solvents may be used. For example, when the soluble polymer coating layer is formed of a PVP-based polymer, the step of removing the polymer coating layer may be carried out by washing or rinsing the polymer resin substrate with water, ethanol, or the like.
In order to more effectively remove the soluble polymer coating layer and the metal layer by the treatment of such a water solvent or a polar solvent, the treatment of the water solvent or the polar organic solvent may be performed by sonication, air blowing, Brushing, and the like, by applying a physical force. In a more specific example, the soluble polymer coating layer, the conductive seed, and the metal layer of the second region may be selectively removed by a method such as washing or rinsing with water under ultrasonic irradiation for a predetermined time in water.
The resin structure having the conductive pattern formed by the above method has a first region defined to have a predetermined surface roughness and a second region defined to have a surface roughness smaller than that of the first region are defined; And a conductive seed and a metal layer selectively formed in the first region of the polymer resin substrate.
At this time, the surface roughness of the first and second regions has been described in detail with respect to the method of one embodiment, and a further description thereof will be omitted. As described above, the first region can correspond to an electromagnetic wave irradiated region such as a laser.
The above-described resin structure may be made of various resin products or resin layers such as a smartphone case having a conductive pattern for an antenna, or various resin products or resin layers having conductive patterns such as RFID tags, various sensors or MEMS structures.
As described above, according to the embodiment of the present invention, even if a special expensive inorganic additive is used and is not contained in the polymer resin substrate itself, the surface roughness of the region where the conductive pattern is to be formed by electromagnetic wave irradiation such as a laser, The conductive pattern can be formed on the polymeric resin substrate in a simpler process.
Therefore, the unit cost and the raw material cost of the conductive pattern forming process can be lowered, and the specific inorganic additive can minimize the possibility of deterioration of physical properties such as the mechanical properties of the polymer resin substrate and the product. In addition, since the desired fine conductive pattern can be formed on the polymeric resin substrate without using the special inorganic additive, the hue of the resin itself can be utilized and the color of the polymeric resin base or product can be easily expressed in a desired color.
In addition, through the above-described soluble polymer coating layer and its removing step, the metal layer can be completely removed from the second region more effectively, irrespective of the surface condition such as surface curvature and surface roughness of the polymer resin substrate to be formed with the conductive pattern . As a result, a better fine conductive pattern can be selectively formed in various polymer resin products having various surface states and shapes or a desired region on the resin layer.
As a result, the embodiments of the present invention can form a good micro-conductive pattern on a wider variety of resin products or resin layers even at a lower unit cost and a simplified process, so that a new resin product, etc., And can contribute greatly to realizing various color and shape resin products.
BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. However, this is provided as an example of the invention, and the scope of the invention is not limited thereto in any sense.
Example 1: Formation of a conductive pattern by laser direct irradiation
A polycarbonate resin substrate containing less than 2% by weight in total of a UV stabilizer, a heat stabilizer and an impact modifier, and containing no other inorganic additive or the like was prepared. Fig. 2A shows a surface photograph of the polycarbonate resin substrate used in this embodiment. Referring to FIG. 2A, such a polycarbonate resin substrate had a surface roughness Ra of > 20 mu m.
An aqueous solution containing 0.5% by weight of polyvinylpyrrolidone (product name: Sigma Aldrich, Mw: 40000) was coated on the polycarbonate resin substrate by deep coating, and the mixture was stirred at room temperature for 5 to 10 minutes And dried to form a polyvinylpyrrolidone coating layer. In order to compare the area where the coating layer was formed and the area where the coating layer was not formed, no coating was carried out by the supporting method in the edge area of the resin substrate. 2B shows a photograph of the surface of the polycarbonate resin substrate after formation of such a coating layer. Referring to FIG. 2B, the coating layer formation region and the non-formation region are clearly distinguished from each other, and the coating layer formation is confirmed through this.
On the other hand, after forming a polyvinylpyrrolidone coating layer on the polycarbonate resin substrate, a laser beam having a wavelength of 1064 nm was irradiated to a certain region of the resin substrate once under irradiation condition of 21.4 W average power. At this time, the intervals between the centers of the laser irradiation marks on the polycarbonate resin substrate were adjusted to about 35 탆 by adjusting the irradiation intervals of the laser.
Through this, the laser was formed to have a constant surface roughness on a certain region of the irradiated polycarbonate resin substrate. Fig. 2C shows a photograph of the surface of the polycarbonate resin substrate in the irradiation region after such laser irradiation. Referring to FIG. 2C, it is confirmed that a certain surface roughness is formed in the laser irradiation region, and the polyvinyl pyrrolidone coating layer in the corresponding region is also removed.
Then, the polycarbonate resin substrate was immersed in an aqueous solution containing Pd ions for about 5 minutes to form a conductive seed containing Pd on the substrate. Subsequently, the substrate was washed with deionized water and electroless plating was performed using copper as a conductive metal. In this electroless plating, the plating solution used was copper sulfate, a complex salt, Rochelle salt, a sodium hydroxide aqueous solution as a pH adjusting agent, and formaldehyde as a reducing agent, and electroless plating was performed at room temperature for about 1 hour to form a metal layer .
FIG. 2D shows a surface photograph of the polycarbonate resin substrate after the formation of the entire metal layer. 2D is a surface photograph showing a state where a metal layer is formed in an area where the first polyvinyl pyrrolidone coating layer is not formed, and a right picture is a surface photograph showing a state in which a metal layer is formed in a region where the coating layer is formed to be. When these were compared, a good metal layer was formed in regions where surface roughness was formed by laser irradiation on both sides. However, it was confirmed that in the region where the polyvinylpyrrolidone coating layer was not formed from the beginning, the conductive seed promoted some plating even in the region where the laser was not irradiated, and the plating of a small scale progressed (some metal layer was formed). In contrast, in the region where the polyvinyl pyrrolidone coating layer was formed, it was confirmed that the conductive seed did not promote the plating in the region where the laser was not irradiated, and thus the metal layer was not formed.
Thereafter, the substrate was immersed in deionized water and irradiated with ultrasonic waves for 20 minutes to dissolve and remove the polyvinyl pyrrolidone coating layer in the non-laser irradiated region, and the metal layer was removed therefrom. FIG. 2E is a photograph of the surface after removing the polyvinyl pyrrolidone coating layer. Referring to FIG. 2E, it was confirmed in Example 1 that no metal layer remained at all in the non-laser irradiated region from which the polyvinyl pyrrolidone coating layer was removed, and it was confirmed that a good metal layer selectively formed only in the laser irradiated region . On the other hand, when a metal layer is formed without forming a coating layer of polyvinyl pyrrolidone, as shown in the left photograph of FIG. 2D, a part of metal remains in the non-laser-irradiated region, .
Example 2: Formation of a conductive pattern by laser direct irradiation
A metal layer was formed in the same manner as in Example 1, except that polyvinylpyrrolidone having a molecular weight (Mw) of 100,000 was used instead of polyvinylpyrrolidone having a molecular weight (Mw) of 40000 to form a coating layer.
As a result of confirming through surface photographs after formation of the metal layer, it was confirmed that a good metal layer was selectively formed in the laser irradiation area in Example 2, the laser beam was not irradiated, and the metal layer remained in the region where the polyvinyl pyrrolidone coating layer was removed thereafter .
Comparative Example 1: Formation of a conductive pattern by laser direct irradiation
The same polycarbonate resin substrate as in Example 1 was prepared. A laser having a wavelength of 1064 nm was irradiated to a certain region of the polycarbonate resin substrate once under irradiation condition of 21.4 W average power. At this time, the intervals between the centers of the laser irradiation marks on the polycarbonate resin substrate were adjusted to about 35 탆 by adjusting the irradiation intervals of the laser. Through this, the laser was formed to have a constant surface roughness on a certain region of the irradiated polycarbonate resin substrate.
Fig. 3A shows a photograph of the surface of the polycarbonate resin substrate in the irradiation region after such laser irradiation. Referring to FIG. 3A, it is confirmed that a certain surface roughness is formed in the laser irradiation area.
Then, the polycarbonate resin substrate was immersed in an aqueous solution containing Pd ions for about 5 minutes to form a conductive seed containing Pd on the substrate. Subsequently, the substrate was washed with deionized water and electroless plating was performed using copper as a conductive metal. In this electroless plating, the plating solution used was copper sulfate, a complex salt, Rochelle salt, a sodium hydroxide aqueous solution as a pH adjusting agent, and formaldehyde as a reducing agent, and electroless plating was performed at room temperature for about 1 hour to form a metal layer .
Thereafter, the substrate was immersed in deionized water, irradiated with ultrasonic waves for 20 minutes, and then subjected to gas blowing to selectively remove the metal layer in the non-laser irradiated region. 3B is a photograph of the surface after removing the metal layer. Referring to these drawings, it is confirmed that, in the comparative example 1, since the resin substrate having the surface roughness is used as shown in Fig. 2A, the metal layer can not be properly removed in the laser non-irradiated area.
Test Example 1: Evaluation of surface roughness
In Examples 1 and 2 and Comparative Example 1, the surface roughness was measured on a laser-irradiated polycarbonate resin substrate in a certain region. The surface roughness was measured by using an optical profiler (Nano view E1000, Nanosystem, Korea). The centerline average roughness (Ra) of 0.2 mm X 0.3 mm area was measured. In this way, the surface roughness of the six different points of the laser irradiation area was measured, and the measured values were averaged and reported as Ra values in Table 1 below.
Test Example 2: Evaluation of adhesion of conductive pattern
In the above Examples 1 and 2 and Comparative Example 1, a tape (3M Scotch Tape # 3) having an adhesive force of 4.0 to 6.0 N / 10 mm width in the standard method of ISO 2409 was formed in the region where the metal layer and the conductive pattern were formed after forming the conductive pattern. 371) were used for the cross-cut test. At this time, the metal layer was cut into a 10 × 10 grid (interval of about 2 mm or less), and the adhesion or adhesion between the substrate and the metal layer was evaluated by measuring the area of the metal layer to be peeled off from the tape. For reference, FIG. 4 shows a photograph of the adhesive force evaluation result for Example 1.
As a result of the evaluation, it was evaluated according to the following ISO class criterion according to the peeled area of the conductive pattern.
1. Class 0 Grade: 0% of the area of the conductive pattern to be peeled off of the conductive pattern;
2.
3. Class 2 Grade: Peeling area of the conductive pattern is more than 5% and not more than 15% of the area of the conductive pattern to be evaluated;
4. Class 3 Grade: The peeled area of the conductive pattern is more than 15% and not more than 35% of the area of the conductive pattern to be evaluated;
5. Class 4 Grade: Peeling area of the conductive pattern is more than 35% but not more than 65% of the area of the conductive pattern to be evaluated;
6. Class 5 Grade: The area of exfoliation of the conductive pattern exceeds 65% of the area of the conductive pattern to be evaluated;
In addition, in Examples 1 and 2 and Comparative Example 1, after the conductive pattern was formed, the uniformity of the metal layer (conductive pattern) was evaluated based on the following criteria.
1. O: When observed with the naked eye, uniformly colored metal layers (plated thin films) were formed in all regions where surface roughness was formed by laser irradiation, and voids were not observed when observed with an optical microscope.
2.?: When observed with the naked eye, a uniformly colored metal layer (plated thin film) was formed in all areas where surface roughness was formed by laser irradiation, but when the surface of the metal layer was observed with an optical microscope, some voids were confirmed .
3. X: When a metal layer (plating thin film) of a uniform color was not formed in at least a part of the region where the surface roughness was formed by laser irradiation and when the surface of the metal layer was observed with an optical microscope, The voids of.
The above evaluation results are shown in Table 1 below.
Uniformity
According to the above Table 1, it was confirmed that a good conductive pattern having an adhesive strength and uniformity equal to or higher than that of the comparative example was formed in the laser irradiation portion. In addition, as described above, in the embodiment, the metal layer does not remain at all in the laser non-irradiated portion, so that the conductive pattern is formed only in the desired region regardless of the surface state of the resin substrate. It was confirmed that some metal layer remained in the non-irradiated portion.
Claims (14)
Selectively removing the soluble polymer coating layer of the first region while forming a first region having a predetermined surface roughness by selectively irradiating electromagnetic wave to the polymer resin substrate;
Forming a conductive seed on the polymeric resin substrate;
Forming a metal layer by plating a polymer resin substrate on which a conductive seed is formed; And
Forming a conductive pattern by direct irradiation of an electromagnetic wave comprising the step of treating the polymer resin base material having the metal layer formed thereon with a water solvent or a polar organic solvent to remove the soluble polymer coating layer in the second region of the polymer resin base material not irradiated with electromagnetic waves Way.
Applying a dispersion or solution containing metal nanoparticles, metal ions or metal complex ions onto the polymer resin substrate; And
Wherein the metal nanoparticles are precipitated and dried, or the metal ions or metal complex ions are reduced and dried to form a conductive seed in the form of particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150172414A KR101752887B1 (en) | 2015-12-04 | 2015-12-04 | Method for forming conductive pattern by direct radiation of electromagnetic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150172414A KR101752887B1 (en) | 2015-12-04 | 2015-12-04 | Method for forming conductive pattern by direct radiation of electromagnetic wave |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170065973A true KR20170065973A (en) | 2017-06-14 |
| KR101752887B1 KR101752887B1 (en) | 2017-06-30 |
Family
ID=59218284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150172414A KR101752887B1 (en) | 2015-12-04 | 2015-12-04 | Method for forming conductive pattern by direct radiation of electromagnetic wave |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101752887B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021240305A1 (en) * | 2020-05-29 | 2021-12-02 | Stmicroelectronics S.R.L. | Method of manufacturing semiconductor devices and corresponding semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3715866B2 (en) * | 2000-04-27 | 2005-11-16 | 三共化成株式会社 | 3D circuit board manufacturing method and 3D circuit board |
-
2015
- 2015-12-04 KR KR1020150172414A patent/KR101752887B1/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021240305A1 (en) * | 2020-05-29 | 2021-12-02 | Stmicroelectronics S.R.L. | Method of manufacturing semiconductor devices and corresponding semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101752887B1 (en) | 2017-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101831885B1 (en) | Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon | |
| JP6545854B2 (en) | Method of manufacturing porous copper foil and porous copper foil using the same | |
| CN109689931B (en) | Method for producing plated member and plated member | |
| TWI820152B (en) | Method for manufacturing shaped body with metal pattern | |
| KR101752887B1 (en) | Method for forming conductive pattern by direct radiation of electromagnetic wave | |
| KR20170048011A (en) | Resin structure and preparing method thereof | |
| KR102010472B1 (en) | Method for forming conductive pattern by direct radiation of electromagnetic wave | |
| KR101584716B1 (en) | Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon | |
| JPWO2020003881A1 (en) | Method for producing molded body having metal pattern | |
| JP2022126318A (en) | antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |