KR20170054732A - Optical sensor package - Google Patents

Optical sensor package Download PDF

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Publication number
KR20170054732A
KR20170054732A KR1020150157261A KR20150157261A KR20170054732A KR 20170054732 A KR20170054732 A KR 20170054732A KR 1020150157261 A KR1020150157261 A KR 1020150157261A KR 20150157261 A KR20150157261 A KR 20150157261A KR 20170054732 A KR20170054732 A KR 20170054732A
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KR
South Korea
Prior art keywords
light emitting
light
emitting portion
base substrate
unit
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Application number
KR1020150157261A
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Korean (ko)
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KR101859405B1 (en
Inventor
김태원
정영우
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(주)파트론
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Priority to KR1020150157261A priority Critical patent/KR101859405B1/en
Publication of KR20170054732A publication Critical patent/KR20170054732A/en
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Publication of KR101859405B1 publication Critical patent/KR101859405B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/02Details
    • G01J1/08Arrangements of light sources specially adapted for photometry standard sources, also using luminescent or radioactive material
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/024Detecting, measuring or recording pulse rate or heart rate
    • A61B5/02416Detecting, measuring or recording pulse rate or heart rate using photoplethysmograph signals, e.g. generated by infrared radiation
    • A61B5/02427Details of sensor
    • A61B5/02433Details of sensor for infrared radiation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/10Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
    • G01J1/20Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle
    • G01J1/22Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using a variable element in the light-path, e.g. filter, polarising means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • G01J1/42Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/429Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G06F3/0421Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07DHANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
    • G07D7/00Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
    • G07D7/06Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency using wave or particle radiation
    • G07D7/12Visible light, infrared or ultraviolet radiation

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  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Theoretical Computer Science (AREA)
  • Cardiology (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Human Computer Interaction (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Physiology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

Disclosed is an optical sensor package. The present invention relates to an optical sensor package which provides an ultraviolet ray irradiation function in addition to a proximity sensor or a heartbeat sensor. The present invention also relates to an optical sensor package which provides a function of detecting a counterfeit in addition to a proximity sensor or a heartbeat sensor. The optical sensor package of the present invention includes a base substrate; a first light emitter and a second light emitter coupled to the upper surface of the base substrate; a light receiver coupled to and spaced apart from the first light emitter by a predetermined distance; and a cover portion having a first opening to receive the first light emitter and the second light emitter and a second opening to receive the light receiver and coupled to the base substrate, wherein the first light emitter generates visible light or infrared light having a wavelength of 380 nm to 1000 m, the second light emitter generates ultraviolet light having a wavelength of 100 nm to 380 nm, and the light receiver can selectively sense a wavelength band of light generated by the first light emitter.

Description

[0001] Optical sensor package [0002]

The present invention relates to an optical sensor package, and more particularly to an optical sensor package having a light emitting portion and a light receiving portion.

2. Description of the Related Art Recently, electronic devices that perform complex functions such as smart phones, tablet computers, and wearable devices have become widespread. These electronic devices are equipped with various sensors for measuring the external environment or for wireless communication. Optical sensors are widely used as one of these sensors.

One type of optical sensor may include a light emitting portion and a light receiving portion. In such an optical sensor, at least a part of light generated by the light emitting portion is irradiated to the light receiving portion again to be received. And the size of the received light is analyzed to measure the external environment. Such an optical sensor can be used as a proximity sensor or a heart rate sensor. Korean Patent Registration No. 10-1277314 discloses this type of proximity sensor.

Recently, electronic devices such as smart phones, tablet computers, and wearable devices are required to provide various functions. For example, recent smartphones support electronic payment functions, health care functions, and the like in addition to conventional communication functions. According to this trend, it is required that optical sensors can perform complex functions.

An object of the present invention is to provide an optical sensor package having an ultraviolet ray irradiation function in addition to a proximity sensor or a heart rate sensor.

Another object of the present invention is to provide an optical sensor package having a function of detecting a counterfeit in addition to a proximity sensor or a heartbeat sensor.

According to an aspect of the present invention, there is provided an optical sensor package including a base substrate, a first light emitting portion and a second light emitting portion coupled to an upper surface of the base substrate, And a cover portion formed with a first opening for receiving the first light emitting portion and the second light emitting portion and a second opening for receiving the light receiving portion and being coupled to the base substrate, The light emitting part generates visible light or infrared light having a wavelength of 380 nm to 1000 m and the second light emitting part generates ultraviolet light having a wavelength of 100 nm to 380 nm, As shown in FIG.

In an embodiment of the present invention, the optical filter may further include an optical filter covering the light receiving portion, wherein the optical filter allows light in a wavelength band of 380 nm to 1000 m to pass through and blocks light in a wavelength band of 100 nm to 380 nm .

According to an embodiment of the present invention, the first light emitting portion and the second light emitting portion are located apart from each other on the upper surface of the base substrate, and the first opening portion accommodates the first light emitting portion and the second light emitting portion separately At least two openings.

According to an embodiment of the present invention, the first light emitting unit includes two light emitting diodes for the first light emitting unit, the first light emitting unit being spaced apart from the upper surface of the base substrate, The second light emitting portion may be adjacent to one of the two light emitting diodes for the first light emitting portion and may be accommodated in any one of the two openings.

In one embodiment of the present invention, the light receiving unit may be positioned between the light emitting diodes for the two first light emitting units.

The first light emitting unit, the light receiving unit, and the ASIC may be operated by a proximity sensor that measures the proximity of the touch-sensitive member to the touch panel, can do.

In one embodiment of the present invention, the ASIC further includes an ASIC for processing data on the detection result of the light receiving unit, wherein the first light emitting unit, the light receiving unit, and the ASIC operate as a heartbeat sensor for measuring a heart rate of a face- .

In an embodiment of the present invention, the second light emitting unit may be an ultraviolet light emitting diode for counterfeit discrimination.

The optical sensor package according to an embodiment of the present invention may have an ultraviolet ray irradiation function in addition to a proximity sensor or a heart rate sensor. More specifically, it is possible to detect a counterfeit by irradiating ultraviolet rays.

1 is a perspective view of an optical sensor package according to an embodiment of the present invention.
2 is a cross-sectional view of an optical sensor package according to an embodiment of the present invention.
3 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that adding a detailed description of a technique or a configuration already known in the field can make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, an optical sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.

1 is a perspective view of an optical sensor package according to an embodiment of the present invention. 2 is a cross-sectional view of an optical sensor package according to an embodiment of the present invention.

1 and 2, the optical sensor package of the present invention includes a base substrate 100, a first light emitting portion 211, a second light emitting portion 212, a light receiving portion 220, a cover portion 400, 1 molding part 310 and a second molding part 320. As shown in FIG.

The base substrate 100 is formed in a flat plate shape. The base substrate 100 may have a rectangular shape in top and bottom. Electrodes (not shown) may be formed on the upper surface and the lower surface of the base substrate 100, respectively. Each of the electrodes is formed to be exposed to the outside. The electrodes on the upper surface may be coupled to the first light emitting portion 211, the second light emitting portion 212, and the light receiving portion 220. In some cases, the ASIC 230 may be coupled to the upper surface electrode. The bottom electrode can be used to input or output signals or to supply power. The upper and lower electrodes may be electrically connected through a via hole or the like in the base substrate 100. The base substrate 100 may be formed of a printed circuit board (PCB).

The first light emitting portion 211, the second light emitting portion 212, and the light receiving portion 220 are coupled to the upper surface of the base substrate 100, respectively. The light emitting unit 210 and the light receiving unit 220 may be separated from each other on the upper surface of the base substrate 100 with a predetermined distance therebetween. The first light emitting portion 211, the second light emitting portion 212 and the light receiving portion 220 may be electrically connected to the electrodes on the upper surface of the base substrate 100. The first light emitting portion 211, the second light emitting portion 212 or the light receiving portion 220 may be coupled to the ASIC 230 and the ASIC 230 may be coupled to the base substrate 100. FIG.

The first light emitting portion 211 and the second light emitting portion 212 may be formed of light emitting diodes (LEDs) that generate light. The first light emitting portion 211 and the second light emitting portion 212 can generate light of different wavelength bands. Specifically, the first light emitting portion 211 may generate visible light or infrared light having a wavelength of 380 nm to 1000 μm, and the second light emitting portion 212 may generate ultraviolet light having a wavelength of 100 nm to 380 nm.

When the first light emitting portion 211 generates visible light, the first light emitting portion 211 may be used for a heartbeat sensor. In addition, when the first light emitting part 211 generates infrared light, the first light emitting part 211 may be used for a proximity sensor or an infrared communication (IrDA). The second light emitting unit 212 may be used for detecting a counterfeit when the second light emitting unit 212 generates ultraviolet light. However, the use of the light emitting units 211 and 212 is not limited to the above-described examples .

The first light emitting portion 211 and the second light emitting portion 212 may be spaced apart from each other on the base substrate 100. Specifically, the first light emitting portion 211 and the second light emitting portion 212 may be positioned with the light receiving portion 220 interposed therebetween.

The light receiving unit 220 may be formed of a photodiode (PD) that senses light. The light receiving unit 220 may convert the intensity of the received light into an electrical signal and output the electrical signal.

The light receiving unit 220 can sense light in a wavelength selective manner. Specifically, the light receiving unit 220 may be configured to sense light from the first light emitting unit 211 and not to sense light from the second light emitting unit 212. Accordingly, the light receiving unit 220 may detect visible light or infrared light according to the wavelength band of the light generated by the first light emitting unit 211, but may not detect ultraviolet light.

The wavelength selectivity of the light receiving portion 220 can be achieved by the optical filter 221. The light receiving unit 220 can be covered by the optical filter 221 and sense only the light that has passed through the optical filter 221. [ Specifically, the optical filter 221 allows light in a wavelength band of 380 nm to 1000 μm to pass therethrough and light in a wavelength band of 100 nm to 380 nm to pass through the optical filter 221 . The pass band and the cutoff band of the optical filter 221 may vary according to the wavelength band of light generated by the first light emitting portion 211 and / or the second light emitting portion 212.

The ASIC 230 may process the output signal of the light receiving unit 220 to derive various information. For example, the ASIC 230 derives information from proximity sensing that senses whether an object is located above and proximity to an optical sensor package, or if the tissue of the human body, etc., Heartbeat sensing that senses the heart rate of the inner blood vessel, and the like. However, the functions of the ASIC 230 are not limited to those listed. The wavelength band of the light generated by the light emitting unit 210 may be changed according to the purpose of the ASIC 230 so that the wavelength band received by the light receiving unit 220 may be changed.

The first light emitting unit 211 and the light receiving unit 220 may function as various optical sensors according to the function of the ASIC 230. For example, when the first light emitting unit 211 is a light emitting diode that generates infrared rays and the light receiving unit 220 is a photodiode that senses infrared rays of the first light emitting unit 211, the first light emitting unit 211, The light receiving unit 220 and the ASIC 230 may function as proximity sensors. For example, when the first light emitting portion 211 is a light emitting diode that generates visible light and the light receiving portion 220 is a photodiode that senses visible light of the first light emitting portion 211, The light receiver 211, the light receiving unit 220, and the ASIC 230 may function as proximity sensors.

At the same time, the second light emitting part 212 can function as a counterfeit detection device by irradiating ultraviolet rays. Many countries' currencies are applying fluorescent materials on the surface of currency to prevent counterfeiting. Such a fluorescent material reflects a unique color when light of a specific wavelength (mainly ultraviolet light) is irradiated and can be easily identified. These fluorescent materials are widely used for high-denomination and recently issued currencies because they are harder to counterfeit than hidden pictures or holograms. The second light emitting portion 212 of the present invention irradiates ultraviolet light reacting with the fluorescent material to enable detection of counterfeit by a simple method.

The cover portion 400 has a shielding wall that shields the first opening 410 and the second opening 420 from each other. It is preferable that the shielding wall is shielded from light passing through the light emitting portion 210.

Further, the cover portion 400 is engaged with the base substrate 100. Specifically, the bottom surface of the cover part 400 can be brought into contact with the upper surface of the base substrate 100 and coupled thereto. The lower surface of the cover part 400 and the upper surface of the base substrate 100 are in close contact with each other so that the first opening part 410 and the second opening part 420 are in contact with the lower surface of the cover part 400, Can be minimized. The bottom surface of the cover part 400 can be bonded to the base substrate 100 by an adhesive.

When the cover part 400 is coupled with the base substrate 100, the cover part 400 is surrounded by the upper surface of the coupled part of the light emitting part 210 of the base substrate 100 and the inner surface of the first opening part 410, Space is formed. This inner space is open upward. And the light emitting portions 211 and 212 are accommodated in the inner space. In addition, an inner space surrounded by the upper surface of the coupled portion of the light receiving portion 220 of the base substrate 100 and the inner surface of the second opening 420 is formed. The inner space is opened upward. The light receiving portion 220 is accommodated in the inner space.

A reflective surface (not shown) may be formed on a part of the surface of the cover part 400. Here, the reflecting surface means that the reflectance with respect to the light generated by the light emitting portions 211 and 212 is at least a certain level.

The first molding part 310 and the second molding part 320 are formed around the light emitting parts 211 and 212 and the light receiving part 220 within the first opening part 410 and the second opening part 420, respectively. The surface of the first molding part 310 may be formed as a curved surface so that the light generated by the light emitting parts 211 and 212 may be refracted and condensed. The surface of the second molding part 320 may be curved so as to condense the light to be received by the light receiving part 220. The first molding part 310 and the second molding part 320 may be formed of a light emitting It is preferable that the light emitting portion 211 and 212 are formed of a material having high light transmittance to light. The first molding part 310 and the second molding part 320 may be formed of, for example, a silicone or epoxy resin.

Hereinafter, an optical sensor package according to another embodiment of the present invention will be described with reference to FIG. 3. The present embodiment will be described focusing on differences from the above-described embodiment.

3 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention.

The first light emitting portion may include two light emitting diodes for the first light emitting portion. The light emitting diodes for the two first light emitting units are located apart from each other. Specifically, the two light emitting diodes for the first light emitting portion are positioned with the light receiving portion interposed therebetween. And the second light emitting portion is located adjacent to any one of the two light emitting diodes for the first light emitting portion.

The first opening may include two openings. One of the two openings receives one light emitting diode for the first light emitting portion and the other receives the other light emitting diode for the first light emitting portion and the second light emitting portion located adjacent thereto.

The embodiments of the optical sensor package of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: base substrate 211: first light emitting portion
212: second light emitting portion 220: light receiving portion
310: first molding part 320: second molding part
400: cover part 410: first opening
420: second opening

Claims (8)

A base substrate;
A first light emitting portion and a second light emitting portion coupled to an upper surface of the base substrate;
A light receiving unit coupled to the upper surface of the base substrate so as to be spaced apart from the first light emitting unit by a predetermined distance;
And a cover portion formed with a first opening for receiving the first light emitting portion and the second light emitting portion and a second opening for receiving the light receiving portion,
The first light emitting unit generates visible light or infrared light having a wavelength of 380 nm to 1000 m,
The second light emitting portion generates ultraviolet light having a wavelength of 100 nm to 380 nm,
Wherein the light receiving unit is capable of selectively sensing a wavelength band of light generated by the first light emitting unit.
The method according to claim 1,
And an optical filter covering the light receiving portion,
Wherein the optical filter passes light in a wavelength band of 380 nm to 1000 m and blocks light in a wavelength band of 100 nm to 380 nm.
The method according to claim 1,
Wherein the first light emitting portion and the second light emitting portion are spaced apart from each other on an upper surface of the base substrate,
Wherein the first opening includes at least two openings separately receiving the first light emitting portion and the second light emitting portion.
The method according to claim 1,
Wherein the first light emitting unit includes two light emitting diodes for the first light emitting unit, the first light emitting unit being spaced apart from the upper surface of the base substrate,
Wherein the first opening includes two openings for separately accommodating the light emitting diodes for the first and second light emitting units,
Wherein the second light emitting portion is located adjacent to any one of the two light emitting diodes for the first light emitting portion and is housed in one of the two openings.
5. The method of claim 4,
And the light receiving portion is located between the light emitting diodes for the two first light emitting portions.
The method according to claim 1,
And an ASIC for processing data on the detection result of the light receiving unit,
Wherein the first light emitting portion, the light receiving portion, and the ASIC operate as a proximity sensor for measuring proximity of a subject to be sensed.
The method according to claim 1,
And an ASIC for processing data on the detection result of the light receiving unit,
Wherein the first light emitting portion, the light receiving portion, and the ASIC are operated as a heartbeat sensor for measuring a heart rate of a subject to be sensed.
The method according to claim 1,
And the second light emitting portion is an ultraviolet light emitting diode for counterfeit discrimination.
KR1020150157261A 2015-11-10 2015-11-10 Optical sensor package KR101859405B1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190010259A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Semiconductor device and detective sensor including the same
KR20190010257A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Detective sensor package
KR20190010255A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Detective sensor package
KR20190009954A (en) * 2017-07-20 2019-01-30 엘지이노텍 주식회사 Sensor package
WO2019172570A1 (en) * 2018-03-05 2019-09-12 주식회사 메딧 Blood glucose monitoring method and wearable blood glucose monitoring device using same
KR102318348B1 (en) * 2020-04-29 2021-10-29 주식회사 에이유이 Ultra-small counterfeit detector

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2453229A1 (en) 2003-12-12 2005-06-12 Cashcode Company Inc. Reflective optical sensor for bill validator

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190009954A (en) * 2017-07-20 2019-01-30 엘지이노텍 주식회사 Sensor package
KR20190010259A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Semiconductor device and detective sensor including the same
KR20190010257A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Detective sensor package
KR20190010255A (en) * 2017-07-21 2019-01-30 엘지이노텍 주식회사 Detective sensor package
WO2019172570A1 (en) * 2018-03-05 2019-09-12 주식회사 메딧 Blood glucose monitoring method and wearable blood glucose monitoring device using same
KR102318348B1 (en) * 2020-04-29 2021-10-29 주식회사 에이유이 Ultra-small counterfeit detector

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