KR20170041043A - Device for converting wavelength - Google Patents

Device for converting wavelength Download PDF

Info

Publication number
KR20170041043A
KR20170041043A KR1020150140496A KR20150140496A KR20170041043A KR 20170041043 A KR20170041043 A KR 20170041043A KR 1020150140496 A KR1020150140496 A KR 1020150140496A KR 20150140496 A KR20150140496 A KR 20150140496A KR 20170041043 A KR20170041043 A KR 20170041043A
Authority
KR
South Korea
Prior art keywords
wavelength conversion
substrate
frequency
input light
heat
Prior art date
Application number
KR1020150140496A
Other languages
Korean (ko)
Inventor
구경환
Original Assignee
주식회사 코맥스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코맥스 filed Critical 주식회사 코맥스
Priority to KR1020150140496A priority Critical patent/KR20170041043A/en
Publication of KR20170041043A publication Critical patent/KR20170041043A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
    • H01S5/0608—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch
    • H01S5/0609—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by light, e.g. optical switch acting on an absorbing region, e.g. wavelength convertors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H01S3/2391—Parallel arrangements emitting at different wavelengths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1092—Multi-wavelength lasing

Abstract

A multi-channel wavelength conversion device according to the present invention includes: a substrate; at least one or more optical fibers which are arranged on the substrate and receive input light with a specific wavelength which a pumping light source emits; a wavelength conversion chip which is formed on the substrate and converts a frequency of the input light, and a hot line substrate which is arranged on the wavelength conversion chip and controls a temperature between channels by generating heat by receiving a current. The wavelength conversion chip converts the frequency of the input light into any one of frequencies which are 2 to 4 times larger than the frequency. Accordingly, the present invention can individually control the temperature by bonding the hot line substrate mounting a specific thin film heater.

Description

[0001] The present invention relates to a multi-channel wavelength conversion element,

The present invention relates to a multi-channel wavelength conversion element.

In the case of the multi-channel waveguide alignment method according to the related art, a method of aligning using a multi-core fiber is mainly used.

However, the wavelength conversion chip is very sensitive to temperature, and there is a problem that the matching temperature is slightly different due to the characteristics of the wavelength conversion chip.

Accordingly, in order to control two or more wavelength conversion chips, individual thermoelectric elements have to be used for individual chips.

In addition, in the case of the prior art, since a structure is realized in which one waveguide is implemented in one waveguide, there is a disadvantage in that a plurality of modules must be used when multiple wavelengths are required.

Such conventional technology has a problem that production efficiency and optical alignment are distorted.

In this regard, Korean Patent Laid-Open Publication No. 10-2010-0119055 (entitled Surface Sensor Apparatus Using Wavelength Converting Waveguide) is a pumping light source that emits input light having a specific wavelength into a wavelength conversion element; A wavelength conversion element; A rapeseed channel part for introducing a substance to be detected into the upper part of the wavelength conversion element; A band-pass filter for removing a wavelength component from the pumping light source from output light that is wavelength-converted and output from the wavelength conversion element; And a light receiving unit for measuring the intensity of light passing through the band-pass filter.

In an embodiment of the present invention, a wavelength conversion chip is aligned and fixed by using an optically-aligned optical fiber, a V-groove and a gripper, and a hot-wire substrate equipped with a special thin- Channel multi-channel wavelength conversion device.

It should be understood, however, that the technical scope of the present invention is not limited to the above-described technical problems, and other technical problems may exist.

According to an aspect of the present invention, there is provided a multi-channel wavelength conversion device comprising: a substrate; at least one optical fiber disposed on the substrate and receiving input light having a specific wavelength emitted by the pumping light source; A wavelength conversion chip disposed on a substrate and converting a frequency of the input light; and a heat line substrate disposed on the wavelength conversion chip and generating heat to control temperature between channels, the wavelength conversion chip comprising: And converts the frequency of the input light to any one of frequencies of 2 to 4 times.

The wavelength converting chip converts the frequency of the input light into any one of two to fourfold frequencies.

The heat ray substrate is formed on both ends of one end surface and the other end surface, and includes at least one pair of holes for conducting electric current, a plurality of holes formed at one end surface to surround a certain portion of the outer circumferential surface of each hole, And a pair of holes formed on the other end surface and connected to an outer circumferential surface of the pair of holes, and a heat line for receiving heat from the external power source to generate heat.

According to any one of the above-described objects of the present invention, optical alignment and temperature control can be individually performed for a plurality of wavelength conversion chips, thereby reducing the size and manufacturing cost of the product.

1 is a perspective view of a multi-channel wavelength conversion element according to an embodiment of the present invention.
2 is a side view of a multi-channel wavelength conversion element according to an embodiment of the present invention.
3 is a front view and a bottom view of the heat ray substrate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.

Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.

Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.

The present invention relates to a multi-channel wavelength conversion element (1).

The multi-channel wavelength conversion element 1 according to an embodiment of the present invention aligns and fixes the wavelength conversion chip 30 by using an optically aligned optical fiber 20, a V-groove and a gripper, The temperature of the wavelength conversion chip 30 can be controlled individually, and the optical alignment can be minimized.

Hereinafter, the multi-channel wavelength conversion element 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3. FIG.

1 is a perspective view of a multi-channel wavelength conversion element 1 according to an embodiment of the present invention. 2 is a side view of a multi-channel wavelength conversion element 1 according to an embodiment of the present invention. 3 is a front view and a bottom view of the heat ray substrate 40. Fig.

The multi-channel wavelength conversion element 1 according to an embodiment of the present invention includes a substrate 10, at least one optical fiber 20, a wavelength conversion chip 30, and a heat ray substrate 40.

The substrate 10 fixes one or more optical fibers 20 and the wavelength conversion chip 30.

The substrate 10 may be formed of a material such as AlN, LiNbO 3 , Silicon, glass, or the like.

The optical fiber 20 receives the input light having a specific wavelength emitted by the pumping light source and transmits the input light to the wavelength conversion chip 30.

One or more of such optical fibers 20 may be disposed on the substrate 10 and may be coupled such that a certain portion of the optical fiber 20 is in contact with the heat ray substrate 40 and the wavelength conversion chip 30 as described below.

At this time, the wavelength conversion chip 30 can be fixed to the substrate with UV Epoxy or high temperature solder (Indium, AuSn, etc.).

The wavelength conversion chip 30 is disposed on the substrate 10 and converts the frequency of the input light received by the optical fiber 20. The wavelength conversion chip 30 may have a different wavelength for each waveguide.

At this time, the wavelength conversion chip 30 converts the frequency of the input light having a specific wavelength to any one of frequencies two to four times.

On the other hand, the wavelength conversion chip 30 can be manufactured by a proton exchange method, a titanium diffusion method, an ion implantation method, a dielectric etching method, etc., and a detailed description of the manufacturing method will be omitted.

The hot-wire board 40 is disposed on the wavelength conversion chip 30 and generates heat by controlling the current to control the temperature between the channels.

At this time, the hot wire substrate 40 may be a NiCr thin film.

3 (a), one or more pairs of holes 41 may be formed on both ends of one end surface and the other end surface of the heat ray substrate 40.

The pair of holes 41 are formed in a through-hole structure that receives a current from an external power source (not shown) and conducts a current between the upper portion and the lower portion.

3 (a) and 3 (b), three pairs of holes 41 are shown, but the present invention is not limited thereto. More than one hole 41 may be formed to correspond to the number of the optical fibers 20 .

Each of the holes 41 may be formed with a pad 43 for surrounding a certain portion of the outer circumferential surface and connecting an external power source.

On the other hand, a heat ray 45 surrounding the pair of holes 41 may be formed on the other end surface of the heat ray substrate 40. The heat ray 45 generates heat by receiving a current from an external power source.

That is, the heat line 45 may be a thin film heater that generates heat due to a resistance value when a constant current flows. In this case, the heat line 45 may be formed of a material such as NixCr 1 -x .

According to one embodiment of the present invention, optical alignment and temperature control can be separately performed for the plurality of wavelength conversion chips 30. [

Accordingly, the size and manufacturing cost of the product can be reduced.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

1: Multi-channel wavelength conversion element
10: substrate
20: Optical fiber
30: Wavelength conversion chip
40: Hot wire board
41: hole
43: Pad
45: Heat line

Claims (2)

In the multi-channel wavelength conversion element,
Board,
At least one optical fiber disposed on the substrate and receiving input light having a specific wavelength emitted by the pumping light source,
A heat ray substrate disposed on the substrate for generating a heat by receiving a current to control a temperature between the channels,
And a wavelength conversion chip disposed on the heat ray substrate and converting a frequency of the input light,
Wherein the wavelength converting chip converts the frequency of the input light to any one of a frequency of 2 to 4 times the frequency of the input light. The method according to claim 1,
The heat-
One or more pairs of holes formed on both ends of the end face and the end face for conducting electric current,
A pad formed on the one end surface to surround a certain portion of the outer circumferential surface of each hole and connected to an external power source,
And a heat line formed to connect outer peripheral surfaces of a pair of holes formed in the other end surface and generating heat by receiving a current from the external power source.
KR1020150140496A 2015-10-06 2015-10-06 Device for converting wavelength KR20170041043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150140496A KR20170041043A (en) 2015-10-06 2015-10-06 Device for converting wavelength

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150140496A KR20170041043A (en) 2015-10-06 2015-10-06 Device for converting wavelength

Publications (1)

Publication Number Publication Date
KR20170041043A true KR20170041043A (en) 2017-04-14

Family

ID=58579429

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150140496A KR20170041043A (en) 2015-10-06 2015-10-06 Device for converting wavelength

Country Status (1)

Country Link
KR (1) KR20170041043A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974262A (en) * 1995-09-06 1997-03-18 Toyo Commun Equip Co Ltd Insulating pad for surface mount use and surface mounting
JP2004001801A (en) * 2002-05-30 2004-01-08 Toppan Printing Co Ltd Plastic envelope

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974262A (en) * 1995-09-06 1997-03-18 Toyo Commun Equip Co Ltd Insulating pad for surface mount use and surface mounting
JP2004001801A (en) * 2002-05-30 2004-01-08 Toppan Printing Co Ltd Plastic envelope

Similar Documents

Publication Publication Date Title
US20200183109A1 (en) Method and system for an optical coupler for silicon photonics devices
US8992100B2 (en) Bidirectional optical transmission and receiving device
US9086552B2 (en) Optical module
CN109964158B (en) Optical component assembly with vertical mounting structure for multi-angle optical path alignment and optical subassembly using same
TWI636287B (en) Optical fiber strip, active optical module and active optical cable
JP4060023B2 (en) Optical waveguide transceiver module
JP2004200399A (en) Optical module and its manufacturing method
US9297967B2 (en) Device for converting signal
US20180120507A1 (en) Device and method for detecting optical signal
CN104678517B (en) A kind of integrated semiconductor optical device
US5066097A (en) Connector for an optical cable
KR20170041043A (en) Device for converting wavelength
WO2015024489A1 (en) Photoelectric converter and optoelectronic connection device
KR101227039B1 (en) Optical power monitoring module
JP2012242694A (en) Optical fiber socket
KR101226704B1 (en) Optical power monitoring module using tilt angle
JP2019008105A5 (en)
JP6500336B2 (en) Optical waveguide type module device and manufacturing method
TWI546580B (en) Optical transmission module and optical assembly
KR101216732B1 (en) Optical power monitoring module using the thin flexible pcb, and the manufacturing method
KR20170041044A (en) Device for converting wavelength
KR20130052015A (en) Opto-electronic assembly for a line card
KR102113817B1 (en) Optical module
KR101501140B1 (en) Planar Lightwave Circuit Module Having an Improved Structure of an Optical Power Monitor
TWI578052B (en) Fiber connector circuit board and fiber connector

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application