KR20170023800A - Adhesive tape and method for disassembling electronic devices and articles - Google Patents

Abstract

A problem to be solved by the present invention is to provide an adhesive tape which has an excellent adhesive force in a temperature range of 60 캜 or less and abruptly decreases the adhesive force by short-time heating. The present invention is an adhesive tape with a rubber-based pressure-sensitive adhesive layer, a storage elastic modulus G ₁₂₀ at 120 ℃ of the adhesive component contained in the pressure-sensitive adhesive layer is ^{1.0 × 10 3 ㎩~2.0 × 10 5} ㎩, the storage elastic modulus G ₁₂₀ And the ratio [G ₂₃ / G ₁₂₀ ] of the storage elastic modulus G ₂₃ at 23 ° C is 1 to 20.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive tape,

The present invention relates to a pressure-sensitive adhesive sheet usable in various fields including, for example, the manufacture of electronic devices.

BACKGROUND ART [0002] Adhesive tapes have been studied for use in a manufacturing field of various electronic apparatuses including copying machines and multifunction apparatuses having a copying function and a scanning function, for example.

As the adhesive tape, for example, a double-sided adhesive tape having a pressure-sensitive adhesive layer formed on both surfaces of a nonwoven substrate, an interlaminar fracture area ratio of the double-sided adhesive tape is 10% or less and a tensile strength of the double- ) And the TD direction (transverse direction) are both 20 N / 10 mm or more (for example, refer to Patent Document 1).

On the other hand, when the electronic device is used or discarded, the electronic device is manually dismantled, and the components constituting the electronic device are classified and disused or recycled in many cases. Specifically, in the case of the copying machine or the multifunctional apparatus, the transparent top plate and the housing constituting the copying machine or the multifunctional apparatus are manually disassembled and classified by material, and are often discarded or recycled.

However, since the transparent top plate is firmly adhered to the housing on the assumption that the paper medium such as a manuscript, an image, and a book is repeatedly placed on the surface thereof, it is impossible to easily disassemble them by hand there was.

Thus, in the dismantling site of the electronic device, a method of cutting a part of the transparent top plate using a cutting machine or the like has been studied, instead of disassembling the transparent top plate and the housing by hand.

However, the above cutting operation often requires a long time, and the efficiency of disassembling work is lowered, which is not preferable in some cases. In addition, since a part of the transparent top plate is still adhered to a part of the housing, they can not be discerned and discarded, resulting in a cost for the disposal treatment.

In this way, two or more adherends can be firmly adhered under a temperature range of about 60 ° C or lower, particularly about 20 ° C to 60 ° C or so, and by short-term heating, It has been desired to develop an adhesive tape capable of separating two or more adherends adhered.

As adhesive tapes having a property that two or more adherends can be firmly adhered and adherends can be separated from each other by lowering the adhesive force by heating or the like, there can be used, for example, And an adhesive tape which can be disassembled by humidification (see, for example, Patent Document 2)

In the case of the above dismantling method, there are cases where two or more parts (adherend) fixed with the adhesive tape can be easily separated. However, in the above-mentioned dismantling method, since the peripheral region of the component is also affected by heat and moisture, there is a case where breakdown or deterioration of the peripheral region is caused when a weak component is used in the peripheral region. Particularly, in the case where the adherend is a relatively weak and expensive component such as an electronic component or a resin housing constituting an electronic device, the component is broken or deformed due to the influence of heat at the time of disassembly, Recycling could not be performed in some cases.

Japanese Patent Application Laid-Open No. 2001-152111 Japanese Patent Application Laid-Open No. 2014-008450

A problem to be solved by the present invention is to provide a pressure-sensitive adhesive tape which has an extremely excellent adhesive force under a temperature range of 60 캜 or less and abruptly decreases its adhesive force by short-time heating.

A second problem to be solved by the present invention is to provide a method for locally heating an adhesive tape or an area to which the adhesive tape is applied while separating two or more adherends, And to provide a method of disassembling an article capable of suppressing the influence of heat.

The present invention relates to an adhesive tape having a pressure-sensitive adhesive layer (A) containing a rubber-based block copolymer (a), wherein the pressure-sensitive adhesive tape comprises a pressure- the storage elastic modulus G ₁₂₀ is 1.0 × 10 ³ ㎩~2.0 × 10 in the range of ⁵ ㎩, the storage elastic modulus G ₁₂₀ on, storing, as measured by a dynamic viscoelastic spectrum of the 1㎐ 23 ℃ and elastic modulus G ₂₃ G ₂₃ ratio of [ / G ₁₂₀ ] is 1 to 20, and is used for adhering two or more adherends, and is heated by using a halogen lamp when separating the adhered two or more adherends.

The present invention also provides a method for disassembling an article having at least an adherend (c1) and an adherend (c2) adhered to each other by an adhesive tape, wherein the disassembly method is characterized in that an infrared emissivity (A1) and an adherend (b) by irradiating the article with infrared rays from the side where the member (b) is mounted or fixed, and a step (2) of separating the step (a2) from the step (a2).

The adhesive tape of the present invention is limited to a narrow range of the area where the adhesive tape can be applied (the adhesive portion), so that even if the adhesive tape having a narrow width can not be used, And an adhesive force at a level capable of sufficiently securing two or more adherends under a temperature range of about < RTI ID = 0.0 > 60 C < / RTI >

On the other hand, the adhesive tape of the present invention can rapidly lower its adhesive strength by heating to about 120 캜, and as a result, it has the property that it can easily separate two or more adhered adherends.

Further, the dismantling method of the present invention can locally heat the adhesive tape or the area to which the adhesive tape is attached, while preventing failure or deformation of the component in the area where the adhesive tape is not pasted . Therefore, the dismantling method of the present invention can be suitably used on the spot where electronic equipment such as a portable electronic terminal equipped with a relatively weak heat-sensitive component is dismantled.

1 is a conceptual diagram showing a method of measuring surface adhesive strength.
2 is a conceptual view showing an example of a shape of a member;
3 is a side view showing a method of evaluating disassembly;
4 is a conceptual diagram showing a method of irradiating infrared rays when evaluating disassembly.

The adhesive tape of the present invention is an adhesive tape having a pressure-sensitive adhesive layer (A) containing a rubber-based block copolymer (a), wherein the adhesive component contained in the pressure-sensitive adhesive layer (A) as measured by the storage elastic modulus G ₁₂₀ is 1.0 × 10 ³ in a range of ㎩~2.0 × 10 ⁵ ㎩, it said storage modulus being measured by a dynamic viscoelastic spectrum stored in, and 1㎐ 23 ℃ about ₁₂₀ G modulus ratio of G ₂₃ [G ₂₃ / G ₁₂₀ ] is 1 to 20, and is used for bonding two or more adherends, and is heated by using a halogen lamp when separating the adhered two or more adherends.

As the adhesive tape of the present invention, a so-called base-less adhesive tape comprising a single-layered or laminated pressure-sensitive adhesive layer (A), a pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer (A) You can use tape. As the adhesive tape, it is preferable to use an adhesive tape having the above-mentioned pressure-sensitive adhesive layer (A) directly or through another layer on both surfaces of the substrate.

The pressure-sensitive adhesive layer (A) constituting the pressure-sensitive adhesive tape of the present invention is preferably a pressure-sensitive adhesive layer of a rubber-based block copolymer (a) capable of imparting so- Other possible additives, and the like.

As the adhesive component contained in the pressure-sensitive adhesive layer (A), a pressure-sensitive adhesive component having a storage elastic modulus G ₁₂₀ at 120 ° C of 1.0 × 10 ^{3 to} 2.0 × 10 ⁵ Pa at a frequency of 1 Hz is used. By using the pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer (A) containing the pressure-sensitive adhesive component having the storage elastic modulus G ₁₂₀ in the above-mentioned range, it is possible to exhibit a very excellent adhesive force under a temperature range of 60 캜 or less, It is possible to remarkably lower the adhesive force even if heated with a relatively simple heating device for a short period of time and as a result it is possible to easily separate two or more adhered adherends.

The adhesive component preferably has a storage elastic modulus G ₁₂₀ of 1.0 x 10 ³ Pa or more and 1.8 x 10 ⁵ Pa or less, more preferably 5.0 x 10 ³ Pa or more and 1.6 x 10 ⁵ Pa or less, The adhesive force can be remarkably lowered even in the case of heating for a short time by using a relatively simple heating device such as a halogen lamp so that the adhered two or more adherends It is more preferable to obtain a detachable adhesive tape.

As the adhesive component contained in the pressure-sensitive adhesive layer (A), it is preferable to use a pressure-sensitive adhesive component having a storage elastic modulus G 'at 23 ° C of 1.0 × 10 ⁴ Pa or more at a frequency of 1 Hz, preferably 5.0 × 10 ⁴ Pa or more and 2.0 × 10 ⁶ Pa More preferably not less than 8.0 × 10 ^{5 and not} more than 1.5 × 10 ⁶ Pa is a member which is limited to an extremely narrow range of an area to which the adhesive tape is to be applied (an adhesive portion) It is more preferable to provide a level of adhesive force sufficient to fix the member.

Further, as the adhesive component contained in the adhesive layer (A), the storage modulus G stored as measured by a dynamic viscoelastic spectrum of the 1㎐ and 23 ℃ about ₁₂₀ modulus ratio of [G ₂₃ G ₂₃ / G] ₁₂₀ 1 ~ 20. By using the pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer (A) containing the pressure-sensitive adhesive component of the ratio [G ₂₃ / G ₁₂₀ ] in the above range, it is possible to exhibit a very excellent adhesive force under a temperature range of 60 ° C or lower, It is more preferable that a relatively simple heating device such as a lamp is used and the adhered two or more adherends can be separated by remarkably lowering the adhesive force when heated for a short time.

The ratio [G ₂₃ / G ₁₂₀ ] is preferably in the range of 1 to 20, more preferably in the range of 1 to 18, and more preferably in the range of 1 to 15, And it is more preferable to use a comparatively simple heating device such as a halogen lamp to reduce the adhesive strength remarkably when heated for a short time and to separate the adhered two or more adherends.

As the pressure-sensitive adhesive layer (A), the use of softening or melting by heating with a halogen lamp is advantageous in that when the heating is performed for a short time using a relatively simple heating device such as a halogen lamp, To separate the adhered two or more adherends. As the pressure-sensitive adhesive layer (A), it is preferable that the pressure-sensitive adhesive layer (A) is rapidly softened or melted when heated to a temperature exceeding the glass transition temperature of the rubber-based block copolymer (a) contained in the pressure-sensitive adhesive layer (A).

The pressure-sensitive adhesive layer (A) can remarkably lower the adhesive force at a relatively low temperature, as compared with the case of using a heating apparatus other than a halogen lamp, and can cause separation of two or more adhered adherends. Therefore, when separating the two or more adherends, it is difficult to cause deformation, discoloration or breakdown of the adherend due to the influence of heat. Specifically, the pressure-sensitive adhesive layer (A) is preferably heated to 80 to 130 占 폚 when the two or more adherends are separated, more preferably heated to 80 to 125 占 폚, and 90 占 폚 More preferably to 120 deg. The heating is preferably performed for 3 seconds to 20 seconds, and more preferably for 3 seconds to 15 seconds.

Further, the halogen lamp is usually heated up to the above-mentioned favorable temperature range (for example, 80 ° C to 130 ° C) after the power is turned on, and the object can be quickly heated by the radiant heat. Since the pressure-sensitive adhesive layer (A) tends to be softened or melted rapidly in the above-mentioned favorable temperature range, when the pressure-sensitive adhesive layer (A) is heated for a short period of time by using a halogen lamp, the adhesive strength thereof is remarkably decreased, easy.

As described above, the pressure-sensitive adhesive layer (A) is a layer containing an adhesive component such as a rubber-based block copolymer (a) and a tackifying resin that can be used if necessary, and, if necessary, other additives.

As the rubber block copolymer (a), there may be used so-called ABA type block copolymers (triblock copolymers), AB type block copolymers (diblock copolymers), and mixtures thereof.

As the rubber-based block copolymer (a), it is preferable that the mixture of the triblock copolymer and the diblock copolymer is used so that the storage elastic modulus at 23 ° C, the storage elastic modulus at 120 ° C, As a result, a very high adhesive force can be exhibited at a room temperature region of about 23 캜. Further, by heating to about 120 캜, And the adhesive strength can be lowered to such an extent that the adherend can be separated. The diblock copolymer is preferably used in an amount of 10% by mass to 90% by mass relative to the rubber-based block copolymer (a) By mass, more preferably from 15% by mass to 80% by mass, and more preferably from 20% by mass to 75% by mass Especially it preferred.

As the adhesive tape of the present invention, it is preferable to use a tape having a peeling distance of 20 mm or less in the static load holding force test measured at 23 DEG C, and it is preferable that the tape having a tape peeling strength of 10 mm or less is used even in a state where a certain external stress is applied to the adhesive tape. Peeling or the like is difficult to occur.

As the rubber-based block copolymer (a), it is preferable to use a styrenic block copolymer. The styrenic block copolymer refers to a triblock copolymer having a polystyrene unit (a1) and a polyolefin unit, a diblock copolymer, or a mixture thereof.

The polystyrene unit (a1) can increase the elastic modulus of the pressure-sensitive adhesive layer (A) and exhibit a very excellent adhesive force under a temperature range of 60 ° C or less. In addition, when the halogenated lamp is heated for a short time, And contributes to the characteristic that can remarkably decrease.

Examples of the styrenic block copolymer include polystyrene-poly (isopropylene) block copolymer, polystyrene-poly (isopropylene) block-polystyrene copolymer, polystyrene-poly (butadiene) block copolymer, polystyrene- (Butadiene) block-polystyrene copolymers, polystyrene-poly (butadiene / butylene) block copolymers, polystyrene-poly (butadiene / butylene) block-polystyrene copolymers, polystyrene- Poly (ethylene / butylene) block copolymers, polystyrene-poly (ethylene / butylene) block-polystyrene copolymers, polystyrene-poly (ethylene-ethylene / Block copolymers, and polystyrene-poly (ethylene-ethylene / propylene) block-polystyrene copolymers. Among them, it is preferable to use a block copolymer having a polystyrene unit (a1) and a polyisoprene unit (a2) as the styrene block copolymer, and it is preferable to use a block copolymer such as a polystyrene-poly (isopropylene) block copolymer, a polystyrene- (Butadiene) block copolymer and a polystyrene-poly (butadiene) block-polystyrene copolymer can exhibit a very good adhesion force at a temperature of 60 ° C or less and at the same time, a relatively simple heating device such as a halogen lamp Sensitive adhesive tape which is capable of separating two or more adhered adherends by lowering the adhesive strength remarkably when heated for a short period of time.

The rubber-based block copolymer (a) preferably has a weight-average molecular weight in the range of 10,000 to 800,000 for further improving the adhesion strength and the disassembly by heating, and is preferably used in a range of 50,000 to 500,000 More preferably a weight average molecular weight in the range of 150,000 to 450,000 is more preferably used.

As the pressure-sensitive adhesive layer (A), it is preferable to use, in addition to the rubber-based block copolymer (a), a pressure-sensitive adhesive component containing a pressure-

Examples of the tackifier resin include rosin-based tackifying resins, polymerized rosin-based tackifying resins, polymerized rosin ester-based tackifying resins, rosin phenol-based tackifying resins, hydrogenated rosin ester-based tackifying resins, A terpene-based tackifier resin, a terpene-phenol-based tackifier resin, an aliphatic (petroleum resin) tackifier resin, and a C5-based petroleum tackifier resin.

Above all, as the tackifier resin, it is preferable to use a C5 petroleum-based tackifier resin or a terpene phenol-based tackifier resin in order to improve the wettability to the adhered surface. In particular, the terpene-phenol-based pressure-sensitive adhesive resin can impart appropriate flexibility to the pressure-sensitive adhesive layer (A), can impart a very high adhesive force under a temperature range of about 20 to 60 DEG C, It is particularly preferable to use it to obtain a heat-decomposable adhesive tape capable of preventing a time-lapse peeling or the like of the case.

As the above-mentioned C5-series tackifier resin, a resin obtained by polymerizing the remainder obtained by extracting and separating isoprene and cyclopentadiene from C5 fraction (fraction) generally obtained by decomposition of naphtha can be used.

As the terpene phenolic tackifier resin, a resin obtained by copolymerizing terpene monomer and phenol can be used. As the terpene phenol-based tackifier resin, it is preferable to use a resin having a softening point in the range of 105 ° C to 145 ° C to improve the compatibility with the rubber-based block copolymer (a), and as a result, It is preferable to obtain a pressure-sensitive adhesive tape having an exfoliating property capable of giving a very high adhesive force under the region and also capable of preventing peeling off with time when a certain repulsive force is applied to the tape.

The tackifier resin is preferably used in an amount of from 10 parts by mass to 150 parts by mass, more preferably from 15 parts by mass to 100 parts by mass, per 100 parts by mass of the rubber block copolymer (a).

Particularly, the terpene-phenol-based tackifier resin is preferably used in a range of 50 parts by mass to 100 parts by mass with respect to 100 parts by mass of the rubber block copolymer (a), and is used in a range of 65 parts by mass to 80 parts by mass , It is preferable to obtain a heat-decomposable pressure-sensitive adhesive tape having an exfoliating property capable of imparting a very high adhesive force under a temperature range of 60 DEG C or less and also capable of preventing peeling with the passage of time when a certain repulsive force is applied to the tape. The C5-based tackifier resin is preferably used in a range of 10 parts by mass to 100 parts by mass with respect to 100 parts by mass of the rubber-based block copolymer (a), and is preferably used in a range of 20 parts by mass to 50 parts by mass And more preferably in a range of from 25 parts by mass to 50 parts by mass.

As the tackifier resin, a tackifier resin in liquid form at room temperature may be used in addition to the above. Examples of the liquid tackifier resin include low molecular weight liquid rubber such as process oil, polyester tackifier resin, and polybutene.

As the pressure-sensitive adhesive layer (A), in addition to the adhesive component, a filler such as an infrared absorber, an antioxidant, an ultraviolet absorber, a filler, a glass or plastic fiber, a thermally expandable balloon, a bead or a metal powder, And the like can be used.

Particularly, when the adhesive tape is heated by using a halogen lamp on the adhesive tape of the present invention, the infrared absorbent can improve the speed at which the adhesive tape is heated, thereby lowering the adhesive force with a shorter heating time, Since it is possible to cause separation of two or more adhered adherends, it is preferable to use them.

Examples of the infrared absorbing agent include inorganic pigments such as carbon black and composite oxide pigments; Known pigments such as phthalocyanine pigments, lake pigments, organic pigments such as polycyclic pigments, and various dyes can be suitably used.

The infrared absorbing agent is preferably contained in a range of 0.01% by mass to 20% by mass with respect to the total amount of the pressure-sensitive adhesive layer (A).

Further, the above-mentioned thermally expandable balloon can be suitably used since the adhesive tape of the present invention is heated to separate two or more adhered adherends with a weaker force.

Examples of the thermally expandable balloons include "Matsumoto Microsphere" (trade name, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.), "Microsphere Xancel" (trade name, manufactured by NIPPONITE Co., Ltd.) (Trade name, manufactured by Dainichiseika Kogyo Co., Ltd.) can be used.

The heat-expandable balloon obtains a pressure-sensitive adhesive tape capable of separating two or more adhered adherends with a weaker force by heating while maintaining an excellent adhesive force under a temperature range of 60 ° C or lower. In the pressure-sensitive adhesive layer (A) Is preferably used in a range of 3% by mass to 50% by mass, more preferably 5% by mass to 30% by mass, and more preferably 10% by mass to 20% by mass, relative to the mass of the adhesive component contained It is particularly preferable to use it in the range.

As the adhesive tape, for example, it is preferable that the thickness of the pressure-sensitive adhesive layer (A) provided on one side of the substrate is 25 m or more, more preferably 60 m to 120 m, To 120 mu m is excellent in cohesive strength and can exhibit a very excellent adhesive force under a temperature range of 60 DEG C or less and at the same time when a relatively simple heating device such as a halogen lamp is used for a short time and heated It is more preferable to obtain a pressure-sensitive adhesive tape capable of remarkably lowering the adhesive strength and separating the adhered two or more adherends.

As the adhesive tape, for example, the total thickness of the pressure-sensitive adhesive layer (A) provided on both sides of the substrate is preferably 50 m or more, more preferably 50 m to 300 m, Mu] m to 250 [mu] m, more preferably in the range of 100 [mu] m to 210 [mu] m, exhibits excellent cohesive force and exhibits excellent adhesive force in a temperature range of 60 DEG C or less, It is more preferable to obtain a pressure-sensitive adhesive tape capable of separating two or more adherends adhered by force.

As the adhesive tape of the present invention, an adhesive tape having the above-mentioned pressure-sensitive adhesive layer (A) can be used either directly or on another side of the base material on one side or both sides of the base material.

As the base material, for example, a non-woven base material or a resin film base material can be used. Above all, as the base material, it is preferable to use a base material (infrared-ray absorbing base material) having excellent infrared ray absorbability.

Examples of the infrared absorbing substrate include an infrared absorbing inorganic filler, an organic dye, an inorganic dye, a dye, a resin film substrate containing a pigment, and a substrate provided with an infrared absorbing layer on the resin film.

Above all, use of a black substrate as the infrared absorptive substrate gives heat absorption property and heat shrink property favorable to the adhesive tape, and even when heated with a relatively simple halogen lamp, a wide range of the adhesive tape , It is possible to raise the temperature in a short time to such an extent as to cause separation of the two or more adherends, so that the irradiation time can be shortened, and as a result, the working efficiency of the step of separating two or more adherends can be remarkably improved Therefore, it is desirable.

On the other hand, in the case where the adhesive tape obtained by using the black base material is irradiated using a local heating device such as a semiconductor laser or the like and the output thereof is not strictly controlled, There is a possibility that the separation of the adherend can not be sufficiently generated, or that only the above-described substrate becomes high temperature, which may cause deformation or the like. Thus, the adhesive tape obtained by using the black base material is preferably used in combination with a heating method using a halogen lamp.

The black base material is not particularly limited as long as it is black. For example, a black ink layer is printed on a resin base material, a resin is blackened with a black pigment to form a film, And the like.

As the base material, it is preferable to use a base material having a thickness of 4 to 100 탆, and it is more preferable to use a base material having a thickness of 10 to 75 탆 to impart good workability of the adhesive tape and good followability to an adherend Do.

As the resin film base material, a polyethylene terephthalate base material or the like can be used. Further, as the resin film base, a material subjected to corona treatment or anchor coating treatment may be used to improve the anchoring property of the pressure-sensitive adhesive layer (A).

The pressure-sensitive adhesive tape of the present invention can be produced, for example, by applying and drying a pressure-sensitive adhesive containing the rubber-based block copolymer (a) or the like on one side or both sides of the substrate using a roll coater or a die coater, ). ≪ / RTI >

The pressure-sensitive adhesive tape is obtained by applying a pressure-sensitive adhesive containing the rubber-based block copolymer (a) or the like to the surface of a release liner in advance using a roll coater or the like and drying the pressure- And then the pressure-sensitive adhesive layer (A) is bonded to one side or both sides of the base material by a transfer method.

The pressure-sensitive adhesive tape of the present invention exhibits very excellent adhesive force under a temperature range of, for example, 60 캜 or less. Therefore, the above adhesive tape can be used suitably for adhesion of various adherends.

The pressure-sensitive adhesive tape preferably has an adhesive strength of 180 N / 20 mm to 40 N / 20 mm in 180 ° peeling adhesion strength from a stainless steel plate at room temperature (23 ° C), for example, To 40 N / 20 mm. It is more preferable that the adherend is firmly adhered to prevent peeling or the like with time.

As a method for producing an article by adhering two or more adherends using the adhesive tape, for example, after one adhesive layer (A) constituting the adhesive tape is attached to the surface of one adherend, The other adherend is affixed to the surface of the other pressure-sensitive adhesive layer (A), and if necessary, they are pressed and the like.

On the other hand, as a method for disassembling the article, for example, a halogen lamp is made to approach or contact with the adhesive tape or the adherend constituting the article, and the adhesive tape is directly or indirectly heated, And the above-mentioned adherend is separated to disassemble the article.

The halogen lamp may be brought into contact with or brought into contact with the adhesive tape at the time of heating, or the adhesive tape may be indirectly heated by bringing a halogen lamp into contact with or contacting the adherend. For example, when the end portion of the adhesive tape extends outward beyond the end portion of the adherend, a halogen lamp may approach or contact the end portion of the adhesive tape.

In the heating step, it is preferable to use a heating apparatus equipped with a halogen lamp to heat the adhesive tape until the temperature of the adhesive tape reaches 80 to 130 DEG C, and it is more preferable to heat the adhesive tape to 85 to 125 DEG C , And it is more preferable to heat it to 90 to 120 占 폚. The heating is preferably performed within 20 seconds, more preferably within 15 seconds, and more preferably within 10 seconds.

Specifically, the heating step using the halogen lamp is a step of setting the temperature of the pressure-sensitive adhesive tape to 100 캜 within 20 seconds, thereby improving the dismantling efficiency of the article and preventing the adherend from being deformed by heat It is preferable.

As a heating device equipped with a halogen lamp, for example, a "parallel light type halogen lamp heater" capable of heating a constant area in a short time, a light collecting type halogen type lamp capable of locally heating can be used, and a parallel light type halogen lamp heater It is possible to shorten the heating time to the above-mentioned time because the wide range can be heated at a time.

The area where the parallel light type halogen lamp heater can be heated at a time is preferably about 10 cm 2 to 500 cm 2. In addition, a heating device such as a parallel light type halogen lamp heater is preferably of a size and a weight that can be carried to improve the efficiency of the disassembling operation of the article. The weight is preferably 3 kg or less, more preferably 2 kg or less, and more preferably 0.1 kg to 1 kg.

The article heated by the above method is easily dismantled by applying little force to the two or more adherends constituting it and by applying a weak force. The adherend can be used for recycling or the like because the surface of the adherend has little remaining of the adhesive tape-derived adhesive.

The adhesive tape of the present invention has a transparent top plate constituting an electronic device such as a copying machine or a multifunctional machine having a copying function and a scanning function, Can be used for fixation.

As the transparent top plate, a transparent top plate provided in a copying machine or a multifunctional apparatus equipped with a general copying function or a scanning function can be used.

As the transparent top plate, for example, a transparent plate-like rigid body made of glass or plastic can be used. As the plastic, for example, an acrylic plate, a polycarbonate plate, or the like can be used.

As the transparent top plate, a plate suitable for the shape of a copying machine or the like to which the transparent top plate is attached may be used. In general, it is preferable to use a square or rectangular plate.

It is preferable that the adhesive tape is attached, for example, along the end portions of two opposing sides, if the transparent top plate is a rectangle. At this time, the adhesive tape may be cut into a double-coated substrate corresponding to the length of the side of the transparent top plate. For example, it is preferable to use a tape having a width of 0.5 mm to 20 mm and a length of 0.1 mm to 2.0 mm desirable.

Further, the adhesive tape of the present invention can be mainly used for fixing members constituting a portable electronic device. The member may be, for example, two or more housings or lens members constituting an electronic device.

As the portable electronic device, for example, a housing having the above-described member and a lens member or one of the other housings are bonded to each other with the adhesive tape interposed therebetween.

The fixing of the member may be performed, for example, by laminating one of the housing or the lens member and the other housing or lens member via the adhesive tape, and then curing the member for a predetermined period of time.

Next, a dismantling method as a second invention will be described.

The dismantling method of the present invention is a dismantling method of an article having at least a adherend (c1) and an adherend (c2) adhered by an adhesive tape, wherein the dismounting method comprises: (C1) and an object (b1) by irradiating infrared rays to the article from the side where the member (b) is mounted or temporarily fixed, and a step And a step (2) of separating the complex (c2).

The dismantling method of the present invention is not merely a method of heating the article by irradiating infrared rays to the article but eliminating the influence of infrared rays on a part of the article which does not require heating, And heating.

Specifically, in the dismantling method of the present invention, the member (b) having the infrared ray emissivity of 50% or less is placed on the surface side of the region where the influence of the infrared rays is desired to be excluded or fixed. On the other hand, the member (b) is not placed on the surface of the portion irradiated with infrared rays.

Next, with respect to the article, infrared rays are irradiated from the side where the member (b) is placed. At this time, the region masked by the member (b) is not substantially heated because it is not affected by infrared rays, and it is hard to cause damage of the component due to the influence of heat.

On the other hand, the region not masked by the member (b) is heated by the influence of infrared rays. The adhesive tape is heated by the infrared ray by causing the area of the article to be provided with the adhesive tape to correspond to the area not masked by the member (b), resulting in a marked deterioration in the adhesive force. As a result, It is possible to cause separation of two or more adherends adhered by the tape.

First, the process [1] will be described.

Step [1] is a step of masking a part of the surface of the article by the member (b).

The member (b) is not mounted on the front surface of the article, but is preferably mounted only on the surface of the area where the influence of heat is required to be minimized.

The member (b) may be mounted on at least one part of the adherend (c1) or the adherend (c2) constituting the article, and the adherend (c1) and the adherend Or the like.

The member (b) may be arbitrarily placed on the surface of the article, but may be formed in accordance with the shape of the article, or may be formed by cutting only an area to be irradiated with infrared rays in advance Or the like) or the like. Specifically, when the adhesive tape is of a so-called frame-like shape, and the infrared ray is irradiated to the area to which the adhesive tape is applied, the member (b) may be irradiated with infrared rays only at the frame- , And a sheet-shaped sheet having only a frame-shaped portion can be used. The member (b) may be used repeatedly.

The member (b) may be simply placed on a part of the article, or it may be temporarily fixed with an adhesive tape or the like.

Next, the step [2] will be described.

The step [2] is a step of separating the adherend (c1) and the adherend (c2) from each other by irradiating infrared rays from the side where the member (b) is placed or fixed.

Specifically, in the step [2], an active energy ray including infrared rays or infrared rays, a laser beam or the like is irradiated.

The infrared rays are transmitted directly or through the adherend (c1), the adherend (c2), or other transparent members constituting the article to arrive at the heat-decomposable adhesive sheet constituting the article, The disassemblable pressure-sensitive adhesive sheet is heated to a predetermined temperature.

The irradiation can be performed using a light source such as a halogen lamp known in the art, but it is preferable to use a commercially available portable halogen heater. This makes it possible to heat and soften the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive tape in a short time, so that the efficiency of the disassembling operation can be remarkably improved.

The irradiation is preferably carried out in a range where the distance between the light source (lamp) such as a halogen lamp heater and the adhesive tape is about 5 mm to 100 mm, more preferably 5 mm to 50 mm, It is more preferable that the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive tape is softened in a short time to improve the efficiency of the disassembly work. Particularly, since the halogen lamp emits infrared rays in a radial direction, the shorter the distance, the shorter the irradiation time.

The irradiation time of the infrared rays is preferably about 2 seconds to 20 seconds, more preferably about 3 seconds to 15 seconds, and particularly preferably about 5 seconds to 15 seconds, in order to improve the dismantling work efficiency.

The infrared ray irradiation is preferably carried out so that the heat-decomposable adhesive sheet constituting the article is heated to 70 to 150 캜, more preferably to 80 캜 to 130 캜, more preferably 85 to 125 Deg.] C to prevent failure or deformation of the adherend (c1) or the adherend (c2), which is relatively weak to heat, so as to enable their recycling.

It is preferable that the adherend (c1) and the adherend (c2) are separated from each other after the irradiation until the temperature of the adhesive tape is lowered. Specifically, the separation is preferably performed within 10 seconds after the irradiation.

As the member (b) used in the dismantling method of the present invention, an infrared emissivity of 50% or less, preferably 40% or less, more preferably 30% or less is used. As a result, it is possible to locally heat the heat-decomposable adhesive sheet or the area to which the heat-decomposable adhesive sheet is applied, while it is also possible to heat the component, for example, Can be prevented.

Here, the infrared emissivity was measured using a sample emitter (TSS-5X, manufactured by Japan Sensors, Inc., measurement method; amount of reflected energy detected by infrared ray irradiation from a constant temperature radiation source and calculation method) 23 占 폚, a measurement wavelength of 2 to 22 占 퐉, a measurement area of? 15 mm, and a measurement distance of 12 mm (fixing method by a foot of a detection head).

Specific examples of the member (b) include a metal member such as aluminum, silver, gold, nickel, copper, and stainless steel, a member in which the metal member and the resin member are laminated, a member having a low infrared emissivity Or the like can be used. Among them, it is preferable to use a non-transparent member having a low infrared ray emissivity as the member (b), and it is preferable to use an aluminum plate, a stainless plate or a copper plate which is relatively inexpensive.

As the member in which the metal member and the resin member are laminated, it is preferable to use air containing the air for the resin member because it serves as a heat insulating layer. Specifically, as the member (b), it is preferable to use a member such as a laminate of the metal member and foam or the like, because it has excellent heat insulating properties. Examples of the foam include polyolefin-based foams and the like.

The shape and thickness of the member (b) can be arbitrarily adjusted in accordance with the shape of the article to be disassembled and the environment in which the disassembling method is performed.

As the member (b), it is preferable to use a member having a thickness that does not conduct heat to the article, and a thickness which does not excessively require a dismounting work space. More specifically, It is preferable to use a material having a thickness of about 10 mm.

As the adhesive tape usable in the present invention, for example, a heat-dissociable adhesive tape capable of firmly adhering two or more adherends and capable of satisfactorily lowering the adhesive force by the influence of heat or the like can be used Specifically, it is preferable to use an adhesive tape having a pressure-sensitive adhesive layer containing a rubber-based block copolymer.

As the adhesive tape, any adhesive tape having the above properties can be used. For example, a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer (A) containing the rubber-based block copolymer (a) The storage elastic modulus G ₁₂₀ measured by the dynamic viscoelastic spectrum at 1 Hz and at 120 캜 of the contained adhesive component is in the range of 1.0 × 10 ³ Pa to 2.0 × 10 ⁵ Pa and the storage elastic modulus G ₁₂₀ is set to 1 Hz and 23 Sensitive adhesive tape having a ratio [G ₂₃ / G ₁₂₀ ] of the storage elastic modulus G ₂₃ of from 1 to 20 as measured by dynamic viscoelastic spectrum at a temperature of 60 ° C has an excellent adhesive force under a temperature range of 60 ° C or lower, And it is preferable to obtain an adhesive tape which abruptly decreases the adhesive force by short-time heating.

As an article that can be disassembled by the dismantling method of the present invention, an article having a configuration in which at least adherend (c1) and adherend (c2) are adhered by the adhesive tape can be mentioned.

Specifically, examples of the article include electronic devices such as portable electronic terminals such as a smart phone and a telephone, personal computers, and information reading devices such as copying machines and multifunctional apparatuses.

As the adherend constituting the article, a plate-shaped rigid body can be used as the adherend (c1) and the adherend (c2) that can be separated by the dismantling method of the present invention. For example, A transparent top plate and a housing constituting the transparent top plate. Either or both of the adherend (c1) and the adherend (c2) may be discarded after being separated by the above dismantling method, or may be reused as a recycling member.

As the transparent top plate, for example, a transparent plate-like rigid body made of glass or plastic can be used. As the plastic, for example, an acrylic plate, a polycarbonate plate, or the like can be used.

As the transparent top plate, a plate suitable for the shape of a copying machine or the like to which the transparent top plate is attached may be used. In general, it is preferable to use a square or rectangular plate.

It is preferable that the adhesive tape is attached, for example, along the end portions of two opposing sides, if the transparent top plate is a rectangle. At this time, the adhesive tape may be cut into a double-layered substrate corresponding to the length of the side of the transparent top plate. For example, it is preferable to use a tape having a width of 0.5 to 20 mm and a length of 0.1 to 2.0 m .

As the adherend (c1) and adherend (c2), two or more housings, lens members, and the like can be mentioned as long as the article to be disassembled is a portable electronic terminal.

As the portable electronic device, for example, a housing having the above-described member and a lens member or one of the other housings are bonded to each other with the adhesive tape interposed therebetween.

The fixing of the member may be performed, for example, by laminating one of the housing or the lens member and the other housing or lens member via the adhesive tape, and then curing the member for a predetermined period of time.

Examples will be described in detail below.

(Production Example 1)

A styrene-butadiene block copolymer S having a weight average molecular weight of 300,000 (a mixture of a triblock copolymer and a diblock copolymer) The proportion of the diblock copolymer to the total amount of the mixture is 20% 100 parts by mass of a polystyrene unit in the copolymer in an amount of 20 mass% and a mass ratio of polybutadiene unit of 80 mass%) and 40 parts by mass of a C5 petroleum tackifier resin (softening point 100 deg. C, number average molecular weight 885) The mixture was dissolved in toluene to obtain a pressure-sensitive adhesive (a-1).

The pressure-sensitive adhesive (a-1) was applied to the surface of the release liner so that the thickness after drying was 100 占 퐉 using an applicator, and dried at 85 占 폚 for 5 minutes to form a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer was laminated on both sides of a base material provided with a black ink layer having a thickness of 4 占 퐉 on both sides of a 38 占 퐉 -thick polyethylene terephthalate film, and then pressed at 4 kgf / cm2 to laminate the adhesive tape 1 did.

Two pieces of the adhesive tape 1 were cut in a strip shape having a length of 50 and a width of 5 mm. The cut adhesive tape thus cut was attached to both ends of a long side of a transparent glass plate having a length of 50 mm, a width of 40 mm, and a thickness of 0.4 mm as an adherend.

Subsequently, a polymeric allotional resin plate made of a white acrylonitrile-butadiene styrene resin and a polycarbonate resin having a length of 100 mm, a width of 100 mm and a thickness of 2 mm, which is a rectangular parallelepiped, And pressed for 10 seconds at 80 N / cm < 2 > using a press machine, and then the pressurized state was released and left standing at 85 DEG C for 24 hours.

(Production Example 2)

600 parts by mass of a Pallet GS-1000 (manufactured by Soken Chemical & Engineering Co., Ltd., polymethylmethacrylate, 30 mass% solution), an infrared absorptive dye CIR- 6.4 parts by mass of RL (diimonium salt compound, manufactured by Nippon Carboxyl Co., Ltd.), 400 parts by mass of methyl ethyl ketone and 400 parts by mass of toluene was applied to a polyethylene terephthalate film having a thickness of 38 탆, The adhesive tape 2 and the article 2 were produced in the same manner as in Production Example 1, except that a substrate having an infrared absorbing layer obtained by drying and coating was applied.

(Production Example 3)

Except that a polyethylene terephthalate film (PET film) having a thickness of 38 mu m having no black ink layer was used in place of the polyethylene terephthalate film having a black ink layer used in Production Example 1, Tape 3 and article 3 were produced.

(Production Example 4)

A pressure-sensitive adhesive (a-2) obtained by mixing 0.5 parts by mass of "carbon black" (infrared absorbent) produced by Evonik Degussa Japan, which is not an adhesive component with the pressure-sensitive adhesive (a-1) Except for this, the adhesive tape 4 and the article 4 were produced in the same manner as in Production Example 3.

(Production Example 5)

Styrene-butadiene block copolymer T having a weight average molecular weight of 300,000 instead of styrene-butadiene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer, the ratio of the diblock copolymer to the total amount of the mixture Of the styrene-butadiene block copolymer was 20 mass%, the mass ratio of the polystyrene unit to the total styrene-butadiene block copolymer was 15 mass%, and the mass ratio of the polybutadiene unit was 85 mass%). An adhesive tape 5 and an article 5 were produced.

(Production Example 6)

Butadiene block copolymer U having a weight average molecular weight of 320,000 instead of styrene-butadiene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer, the ratio of the diblock copolymer to the total amount of the mixture Butadiene block copolymer was 20% by mass and the mass ratio of polybutadiene units was 80% by mass) was used instead of the styrene-butadiene block copolymer An adhesive tape 6 and an article 6 were produced.

(Production Example 7)

Styrene-butadiene block copolymer V having a weight average molecular weight of 400,000 instead of styrene-butadiene block copolymer S (a mixture of a triblock copolymer and a diblock copolymer, the ratio of the above-mentioned diblock copolymer to the total amount of the mixture Butadiene block copolymer was 10 mass% and the mass ratio of polybutadiene unit was 90 mass%) was used in place of the styrene-butadiene block copolymer Adhesive tape 7 and article 7 were produced.

(Production Example 8)

Adhesive tape 8 and article 8 were produced in the same manner as in Production Example 3 except that the amount of the C5 petroleum-based tackifying resin (softening point 100 캜, number average molecular weight 885) was changed from 40 mass parts to 20 mass parts.

(Production Example 9)

Styrene-butadiene block copolymer X having a weight average molecular weight of 300,000 (a mixture of a triblock copolymer and a diblock copolymer) in place of the styrene-butadiene block copolymer S, the ratio of the diblock copolymer to the total amount of the mixture Of the styrene-butadiene block copolymer is 30 mass%, and the mass ratio of the polybutadiene unit is 70 mass%), and 100 mass parts of the C5 petroleum-based tackifier resin Sensitive adhesive tape 9 and an article 9 were produced in the same manner as in Production Example 1, except that 65 parts by mass of a terpene phenol-based tackifier resin (softening point 115 캜, molecular weight 1000) was used.

(Production Example 10)

 Except that a polyethylene terephthalate film having a thickness of 25 占 퐉 in which a black pigment had been introduced was used in place of the polyethylene terephthalate film having a black ink layer used in Production Example 9, .

(Production Example 11)

Adhesive tape 11 and article 11 were produced in the same manner as in Production Example 9, except that the amount of the terpene phenol-based tackifier resin (softening point 115 캜, molecular weight 1000) used in Production Example 9 was changed from 65 mass parts to 75 mass parts did.

(Production Example 12)

The pressure-sensitive adhesive used in Production Example 9 was used in place of the pressure-sensitive adhesive used in Production Example 9, and the pressure-sensitive adhesive used in Production Example 9 was Matsumoto Microsphere F-48 (manufactured by Matsumoto Yushi Seiyaku K.K.) having a thermal expansion coefficient of 370% A pressure-sensitive adhesive tape was prepared in the same manner as in Production Example 9, except that the pressure-sensitive adhesive obtained by mixing the pressure-sensitive adhesive composition obtained by mixing the pressure-sensitive adhesive composition obtained in Example 1 with a pressure-sensitive adhesive having an initial temperature of 90 ° C to 100 ° C, a maximum expansion temperature of 125 ° C to 135 ° C, 12 and an article 12 were produced. The above-mentioned Matsumoto Microsphere F-48 was used in an amount of 15 parts by mass based on the adhesive component (sum of the styrene-butadiene block copolymer W and the terpene phenol-based tackifier resin).

(Comparative Production Example 1)

Styrene-butadiene block copolymer W having a weight-average molecular weight of 1,000,000 (a mixture of a triblock copolymer and a diblock copolymer) in place of the styrene-butadiene block copolymer S, the ratio of the diblock copolymer to the total amount of the mixture Butadiene block copolymer was 30 mass% and the mass ratio of polybutadiene unit was 70 mass%) was used in place of the styrene-butadiene block copolymer An adhesive tape 13 and an article 13 were produced.

(Comparative Production Example 2)

(Preparation of pressure-sensitive adhesive (a-3)) [

A reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel and a nitrogen gas inlet was charged with 44.9 parts by mass of butyl acrylate, 50 parts by mass of 2-ethylhexyl acrylate, 2 parts by mass of acrylic acid, -Hydroxybutyl acrylate as a polymerization initiator and 0.1 part by mass of 2,2'-azobisisobutylnitrile as a polymerization initiator were dissolved in 100 parts by mass of ethyl acetate and polymerized at 70 DEG C for 10 hours to obtain an acrylic resin having a weight average molecular weight of 800,000 To obtain a copolymer X solution.

Next, 30 parts by mass of a polymerized rosin ester-based tackifier resin D-135 (manufactured by Arakawa Chemical Industries, Ltd.) was added to 100 parts by mass of the acrylic copolymer X, and ethyl acetate was added thereto, 45% by mass of an acrylic pressure-sensitive adhesive was obtained.

1.1 parts by mass of "Coronate L-45" (isocyanate-based crosslinking agent, solid content 45% by mass) manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to 100 parts by mass of the acrylic pressure- 3) was applied onto a separator using an applicator so that the thickness after drying was 100 占 퐉 and dried at 85 占 폚 for 5 minutes to form an acrylic pressure-sensitive adhesive layer.

Next, the acrylic pressure-sensitive adhesive layer was laminated on both sides of a 38 占 퐉 -thick polyethylene terephthalate film provided on the surface with a black ink layer having a thickness of 4 占 퐉 and pressed at 4 kgf / cm2 to laminate the adhesive tape 14 did.

An article 14 was produced in the same manner as in Production Example 1 except that the above adhesive tape was used in place of Production Example 1.

(Comparative Production Example 3)

Except that a 38 占 퐉 -thick polyethylene terephthalate film having a thickness of 4 占 퐉 and a black ink layer having a thickness of 4 占 퐉 was used instead of the polyethylene terephthalate film having a thickness of 4 占 퐉 and having no black ink layer , And the adhesive tape 15 and the article 15 were produced in the same manner as in Comparative Production Example 2.

(Comparative Production Example 4)

(Preparation of pressure-sensitive adhesive (a-4)) [

In a reaction vessel equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel and a nitrogen gas inlet, 100 parts by mass of the monomer combination of the combination shown in Table 1 and 0.2 parts by mass of 2,2'-azobisisobutylnitrile as a polymerization initiator were dissolved in ethyl acetate 100 And the mixture was polymerized at 80 DEG C for 8 hours to obtain an acrylic copolymer Y solution.

Next, to 100 parts by mass of the acrylic copolymer Y, 10 parts by mass of rosin ester-based resin A-100 (manufactured by Arakawa Chemical Industries, Ltd.), 10 parts by mass of polymerized rosin ester-based tackifier resin D-135 20 parts by mass, manufactured by Kyoeisha Chemical Co., Ltd.) was added and diluted and mixed with toluene to obtain a pressure-sensitive adhesive (a-4) having a nonvolatile content of 45% by mass.

1.1 parts by mass of "Coronate L-45" (isocyanate-based crosslinking agent, solid content 45% by mass) manufactured by Nippon Polyurethane Industry Co., Ltd.) was added to 100 parts by mass of the pressure-sensitive adhesive (a-4) Using an applicator, it was coated on a separator so that the thickness after drying was 100 占 퐉, and dried at 85 占 폚 for 5 minutes to form a pressure-sensitive adhesive layer.

Next, the pressure-sensitive adhesive layer was laminated on both sides of a 38 占 퐉 -thick polyethylene terephthalate film provided on the surface with a black ink layer having a thickness of 4 占 퐉, and pressed at 4 kgf / cm2 to laminate the adhesive tape 16 .

An article 16 was produced in the same manner as in Production Example 1 except that the adhesive tape 16 was used in place of the adhesive tape 1. [

(Example 1)

Three pieces of the article 1 obtained in Production Example 1 were prepared, and a parallel light type halogen lamp heater (manufactured by Hittec Co., Ltd., two halogen lamp tubes each having a length of 10 cm was mounted under the environment of 23 캜 and the wavelength of light generated from the halogen lamp: near infrared A distance from a light source of 2 mu m, a rated voltage of 100 V, a rated power consumption of 850 W, a portable type, a weight of 0.7 kg, a collective irradiatable area of about 200 cm 2) to a glass plate constituting the article was set to 10 mm.

Next, the three articles 1 were heated using the heater for 5 seconds, 10 seconds, and 15 seconds, respectively. The temperature of the adhesive tape when heated for 5 seconds was about 90 deg. C, the temperature of the adhesive tape when heated for 10 seconds was about 105 deg. C, and the temperature of the adhesive tape when heated for 15 seconds was about 120 deg. .

After heating, each article 1 was left under 23 캜 for 5 seconds, and a force was applied with a finger in the front end direction of the glass plate to separate the glass plate constituting the article 1 from the article.

(Example 2)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 2 obtained in Preparation Example 2 was used in place of the article 1.

(Example 3)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 3 obtained in Preparation Example 3 was used in place of the above-mentioned article 1.

(Example 4)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 4 obtained in Production Example 4 was used in place of the above-mentioned article 1.

(Example 5)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 5 obtained in Preparation Example 5 was used in place of the above-mentioned article 1.

(Example 6)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 6 obtained in Preparation Example 6 was used in place of the above-mentioned article 1. [

(Example 7)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 7 obtained in Preparation Example 7 was used in place of the above-mentioned Article 1.

(Example 8)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 8 obtained in Preparation Example 8 was used in place of the above-mentioned article 1.

(Example 9)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 9 obtained in Production Example 9 was used in place of the above-mentioned article 1.

(Example 10)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 10 obtained in Production Example 10 was used in place of the above-mentioned Article 1.

(Example 11)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 11 obtained in Production Example 11 was used in place of the above-mentioned article 1.

(Example 12)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 12 obtained in Preparation Example 12 was used in place of the above-mentioned Article 1.

(Comparative Example 1)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 13 obtained in Comparative Production Example 1 was used in place of the article 1.

(Comparative Example 2)

Heating and stripping were carried out in the same manner as in Example 1, except that the article 14 obtained in Comparative Production Example 2 was used in place of the above-mentioned article 1.

(Comparative Example 3)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 15 obtained in Comparative Production Example 3 was used in place of the above-mentioned article 1.

(Comparative Example 4)

Heating and stripping were carried out in the same manner as in Example 1 except that the article 16 obtained in Comparative Production Example 4 was used in place of the article 1.

(Comparative Example 5)

A parallel type halogen lamp heater used in Example 1 (manufactured by Hittech Co., Ltd., two halogen lamp tubes having a length of 10 cm were mounted, the wavelength of light generated from a halogen lamp: near infrared region 2 μm, rated voltage 100 V, rated power consumption 850 W, (4 W of output, 940 nm of wavelength, 250 kg of weight, and a collectively irradiable area of about 0.1 cm 2 (local heating)) at a scanning speed of 500 mm / min The article 1 was heated and peeled off in the same manner as in Example 1, except that it was used under the conditions.

(Comparative Example 6)

A parallel halogen lamp heater used in Example 9 (manufactured by Hittech Co., Ltd., two halogen lamp tubes having a length of 10 cm was mounted, the wavelength of light generated from the halogen lamp: near infrared region 2 μm, rated voltage 100 V, rated power consumption 850 W, (4 W of output, 940 nm of wavelength, 250 kg of weight, and a collectively irradiable area of about 0.1 cm 2 (local heating)) at a scanning speed of 500 mm / min Heating and peeling of the article 9 were carried out in the same manner as in Example 9. The results are shown in Table 1. < tb > < TABLE >

(Comparative Example 7)

A parallel type halogen lamp heater used in Example 1 (manufactured by Hittech Co., Ltd., two halogen lamp tubes having a length of 10 cm were mounted, the wavelength of light generated from a halogen lamp: near infrared region 2 μm, rated voltage 100 V, rated power consumption 850 W, , Weight 0.7 kg, and collectively irradiable area of about 200 cm 2), the article 1 was heated and peeled off in the same manner as in Example 1 except that a dryer set at 120 ° C was used.

(Comparative Example 8)

A parallel type halogen lamp heater used in Example 9 (two halogen lamp tubes each having a length of 10 cm, manufactured by Hittech Co., Ltd.) was mounted and the wavelength of light generated from the halogen lamp: near infrared region 2 m, rated voltage 100 V, rated power consumption 850 W, Heating and peeling of the article 9 were carried out in the same manner as in Example 9 except that a dryer set at 120 占 폚 was used in place of the dry-type, portable type, weight 0.7 kg,

[Measurement of dynamic viscoelasticity of pressure-sensitive adhesive layer]

(Total of the rubber-based block copolymer or the acrylic copolymer and the tackifier resin) used in the production of the pressure-sensitive adhesive tape obtained in the production example and the comparative production example was measured using an applicator so that the thickness after drying was 100 占 퐉, , And dried at 85 캜 for 5 minutes to form a plurality of pressure-sensitive adhesive layers each having a thickness of 100 탆.

Next, test pieces comprising a pressure-sensitive adhesive layer having a thickness of 2 mm were prepared by superposing the pressure-sensitive adhesive layers obtained using the same pressure-sensitive adhesive.

A parallel plate having a diameter of 7.9 mm was mounted on a viscoelasticity tester (Ares 2kSTD) manufactured by T.A. Instrument Japan. (G ₂₃ ) at 23 캜 under the conditions of a frequency of 1 Hz, a temperature range of -60 to 150 캜, and a temperature raising rate of 2 캜 / min. The test piece was put into a parallel plate with a compressive load of 40 to 60 g, And a storage elastic modulus (G ₁₂₀ ) at 120 캜.

[Storage modulus (G ₂₃ ) at 23 ° C and ratio of storage modulus (G ₁₂₀ ) at 120 ° C]

The ratio of the storage modulus (G ₂₃ ) at 23 캜 to the storage modulus (G ₁₂₀ ) at 120 캜 measured by the above method was calculated.

[Evaluation method of adhesive strength (surface adhesion force)]

The adhesive tape obtained in Production Example and Comparative Production Example under the environment of 23 占 폚 was cut into a square frame having one side (outer shape) of 14 mm in length and 2 mm in width.

The cut adhesive tape 2 thus cut was attached to a transparent acrylic plate 1 having a length of 15 mm, a width of 15 mm and a thickness of 2 mm and being a rectangular parallelepiped. At that time, the test piece 1 was prepared in such a manner that one side of the cut adhesive tape 2 cut off was pasted so as to correspond to 15 mm on one side of the acrylic plate 1. [

Next, a polycarbonate plate (3) having a length of 20 mm, a width of 50 mm and a thickness of 1 mm having a hole with a diameter of 10 mm and a surface of the test piece (1) on the adhesive tape side were pasted , And pressed at 80 N / cm 2 for 10 seconds by using a press machine. The pressurized state was then released, and the test piece 2 was produced by standing at 23 캜 for 1 hour.

Next, a tensile tester (Tensilon RTA-100 manufactured by A & D Corp., compression mode) equipped with a stainless steel probe 4 having a diameter of 8 mm was prepared. The test piece 1 is peeled off from the polycarbonate plate 3 when the probe 4 passes through the hole of the SUS plate 3 constituting the test piece 2 and a force is applied to the test piece 1 constituting the test piece 2 (N / cm < 2 >) at a temperature of 23 DEG C and 120 DEG C, respectively. The speed at which the probe 4 pressed the test piece 1 was set at 10 mm / min.

[Evaluation method of adhesive strength (180 degree peeling adhesive strength)]

The adhesive force peeling at 180 degrees was measured according to JIS Z 0237. Specifically, the release liner on one side of the pressure-sensitive adhesive tape obtained in Examples and Comparative Examples was peeled off and the pressure-sensitive adhesive layer was bonded with a polyethylene terephthalate film (PET film) having a thickness of 25 占 퐉.

The adhesive tape thus bonded was cut to a width of 20 mm and then the release liner on the other side was peeled off and the pressure sensitive adhesive layer was applied to a transparent polycarbonate plate to obtain a test piece 3.

The test piece 3 was allowed to stand under the environment of 23 ° C and 50% RH for 30 minutes, and then subjected to tensile tester Tensilon tensile tester (manufactured and sold by A & D Company, type: RTM-100) at 23 ° C. and 120 ° C. Adhesive strength of the double-faced pressure-sensitive adhesive tape constituting the test piece 3 was peeled off from the polycarbonate plate at a rate of 300 mm / min in the direction of 180 degrees.

[Method for evaluating static load holding force]

One side of the pressure-sensitive adhesive tape was bonded with a polyethylene terephthalate film having a thickness of 25 占 퐉 and cut to a width of 10 mm and a length of 70 mm to prepare a test tape. A range of 50 mm in length of the test tapes was attached to a stainless steel plate, and the test tape was subjected to one reciprocating pressing using a 2 kg roller to adhere them. The adhered material was allowed to stand in an atmosphere of 23 ° C and 50% RH for 1 hour, then a load of 300 g was applied in a direction of 90 ° with respect to the peeling direction. After leaving for 3 hours, the peeling distance Were measured and evaluated according to the following criteria. The method of evaluating the static load holding force described above is a substitutional evaluation method in which a deformation stress is externally applied to the test tape for a long period of time. The longer the stripping distance, the better the static load holding force is. The values in the table indicate the peeling distance (mm) after 3 hours of standing.

[Evaluation of thermal decomposition property in a short time]

Evaluation of ease of peeling upon heating and peeling by the methods described in Examples and Comparative Examples was evaluated according to the following criteria.

&Amp; cir &: The glass plate can be separated from the article by simply pressing the glass plate constituting the article with the index finger in the front end direction thereof

A: The glass plate constituting the article could be separated from the article by pushing it in with its thumb in the direction of its front end.

DELTA: Glass plate constituting the article was held in the hand, and the glass plate could be separated from the article by pulling forcefully in the direction of the front end thereof

X: The glass plate could not be separated from the article even if the glass plate constituting the article was held in the hand and stretched strongly in the direction of the front end, and the glass plate could not be moved at all

[Portability of heating apparatus]

Portability of the heating apparatuses used in Examples and Comparative Examples was evaluated according to the following criteria.

○: Weight less than 5.0 kg, can be carried with one hand

X: Weight is over 5.0 kg, and can not be carried with one hand

[Table 1]

[Table 2]

[Table 3]

[Table 4]

[Production of member (masking member)] [

[Production Example 1]

Two rectangular cavity portions each having a length of 50 mm and a width of 5 mm were formed at intervals of 30 mm on the roughly central portion of an aluminum plate (infrared ray emissivity: 4%) having a length of 100 mm, a width of 100 mm and a thickness of 1 mm (B1) (see Fig. 2).

The infrared ray emissivity of the member b1 was measured using a radiation emissometer (TSS-5X, manufactured by Japan Sensors, Inc., measurement method; reflection energy amount detection and calculation method by infrared radiation from a constant temperature radiation source) Temperature and environmental temperature of 23 占 폚, a measurement wavelength of 2 to 22 占 퐉, a measurement area of? 15 mm, and a measurement distance of 12 mm (fixing method by a foot of a detection head). Specifically, an infrared radiation source (a hemispherical solid body furnace) mounted on the above-mentioned emissivity measuring instrument is provided on the surface of the member b1, and when measured under the above conditions, Value was taken as the infrared emissivity.

[Production Example 2]

A member b2 was formed by forming two square rectangular cavities each having a length of 50 mm and a width of 5 mm at an interval of 30 mm at a substantially central portion of a copper plate having a length of 100 mm, a width of 100 mm and a thickness of 1 mm and a 2% .

[Production Example 3]

A rectangular cavity having a length of 50 mm and a width of 5 mm was formed in a substantially central portion of a stainless steel plate (infrared ray emissivity 25%) obtained by polishing the surface of a stainless steel plate (SUS304) having a length of 100 mm, a width of 100 mm, Two members were formed at intervals, and the member (b3) was used.

[Production Example 4]

On a surface of a polished aluminum plate (infrared emissivity: 4%) having a length of 100 mm, a width of 100 mm, and a thickness of 1 mm, polyethylene foam having a thickness of 200 占 퐉 was laminated, Two members each having a rectangular cavity portion at intervals of 30 mm were defined as member b4.

[Comparative Production Example 1]

(Length of 50 mm and width of 50 mm) was formed in a substantially central portion of a white polymeralloy resin plate (consisting of acrylonitrile-butadiene-styrene resin and polycarbonate resin and having an infrared emissivity of 90%) having a length of 100 mm, a width of 100 mm and a thickness of 1 mm Two members of 5 mm square rectangular cavities were formed at intervals of 30 mm as the member b5.

[Comparative Production Example 2]

A rectangular plate having a length of 50 mm and a width of 5 mm was formed in a substantially central portion of a polymer alloy resin plate (infrared ray emissivity: 98%) composed of a black acrylonitrile-butadiene-styrene resin having a length of 100 mm, a width of 100 mm and a thickness of 1 mm The member b6 was formed by forming two cavities at intervals of 30 mm.

[Manufacturing method of articles]

[Example 13]

The same adhesive tape as the adhesive tape 1 used in Production Example 1 was cut into strips each having a length of 50 mm and a width of 5 mm to obtain two adhesive tape pieces.

The two pieces of adhesive tape pieces were attached to both ends of a long side of a transparent glass plate (adherend 1) having a length of 50 mm, a width of 40 mm, and a thickness of 0.4 mm.

Subsequently, a white polymeralloy resin plate (adherend 2, made of acrylonitrile-butadiene-styrene resin and polycarbonate resin) having a length of 100 mm, a width of 100 mm and a thickness of 1 mm and a rectangular parallelepiped Two sheets of the adhesive tape constituting the test piece were pasted to each other and pressed at 80 N / cm 2 for 10 seconds by using a press machine. After the pressurized state was released and left at 85 캜 for 24 hours, An article (13) in which a glass plate, the adhesive tape piece and the polymer alloy resin plate were laminated was produced.

Next, the member (b1) obtained in Production Example 1 was placed on the upper surface of the transparent glass plate constituting the article (13). At this time, the shape of the adhesive tape piece and the shape of the cavity portion of the member (b1) are matched so that the infrared ray is irradiated to the adhesive tape piece constituting the article (13).

Next, a portable halogen heater (100 V power output) manufactured by Hittech Co., Ltd. was installed at a position where the distance to the heat-decomposable adhesive sheet constituting the article 13 was 15 mm under the environment of 23 ° C, Light was irradiated to the infrared wavelength region for 5 seconds from the side where the member b1 was placed.

After the irradiation, the article (13) was allowed to stand in an environment of 23 deg. C for 5 seconds.

Next, a transparent glass plate (adherend 1) constituting the article 13 is peeled off in the front end direction with respect to the horizontal stand while the polymer alloy resin plate constituting the article 13 is fixed on the horizontal stand I tried to put out.

[Example 14]

The article was disassembled in the same manner as in Example 1 except that the member b2 was used instead of the member b1 as the masking member.

[Example 15]

The article was disassembled in the same manner as in Example 1 except that the member b3 was used in place of the member b1 as the masking member.

[Example 16]

A transparent acrylic plate having a length of 50 mm, a width of 40 mm and a thickness of 1 mm was used as the adherend 1 instead of a transparent glass plate having a length of 50 mm, a width of 40 mm and a thickness of 0.4 mm and a transparent acrylic plate having a length of 100 mm , 100 mm in width and 100 mm in thickness and 1 mm in thickness, was prepared in the same manner as in Example 1 except that a white polymeralloy resin plate (consisting of acrylonitrile-butadiene-styrene resin and polycarbonate resin) An article 16 was produced in the same manner as in Example 1 except that a black acrylonitrile-butadiene-styrene resin plate (ABS resin plate) was used, and the article 16 was disassembled.

[Example 17]

The article was disassembled in the same manner as in Example 4 except that the member b2 was used instead of the member b1 as the masking member.

[Example 18]

The article was disassembled in the same manner as in Example 1 except that the same adhesive tape as the adhesive tape 5 used in Production Example 5 was used in place of the adhesive tape 1.

[Example 19]

Except that the member b2 was used in place of the member b1 as the masking member and the same adhesive tape as the adhesive tape 5 used in Production Example 5 was used in place of the adhesive tape 1, The item was dismantled.

[Example 20]

The article was disassembled in the same manner as in Example 1 except that the member b4 was used in place of the member b1 as the masking member.

[Example 21]

The article was disassembled in the same manner as in Example 1 except that the member b5 was used in place of the member b1 as the masking member.

[Example 22]

The article was disassembled in the same manner as in Example 1 except that the member b6 was used in place of the member b1 as the masking member.

[Evaluation of surface adhesion before infrared irradiation]

The pressure-sensitive adhesive tape used in Examples and Comparative Examples was cut into a square frame having a length of 14 mm and a width of 2 mm under the environment of 23 占 폚.

The cut adhesive sheet thus cut was attached to a transparent acrylic plate having a length of 15 mm, a width of 15 mm and a thickness of 2 mm and being a rectangular parallelepiped. At that time, one piece of the cut adhesive tape cut off was pasted so as to correspond to 15 mm on one side of the transparent acrylic plate.

Next, a stainless steel plate (SUS304) having a length of 20 mm, a width of 50 mm and a thickness of 1 mm having a hole with a diameter of 10 mm and a surface of the test piece 1 on the side of the adhesive tape were stuck at the center, After pressurizing at 80 N / cm 2 for 10 seconds using a press machine, the pressurized state was released and the test piece 2 was prepared by standing at 23 캜 for 1 hour.

Next, a tensile tester (Tensilon RTA-100 manufactured by A & D Corporation, compression mode) equipped with a probe made of stainless steel having a diameter of 8 mm was prepared. When the probe passes through a hole of a stainless steel plate (SUS304) constituting the test piece 2 and a force is applied to the test piece 1 constituting the test piece 2, the strength when the test piece 1 is peeled from the polycarbonate plate (N / Cm < 2 >) were measured under the temperature environment of 23 DEG C and 120 DEG C, respectively (see Fig. 1). The speed at which the probe pressed the test piece 1 was set at 10 mm / min.

[Evaluation of Disassembly after Infrared Irradiation 1]

The ease of disassembly when the articles were disassembled by the methods described in Examples and Comparative Examples was evaluated according to the following criteria.

Evaluation standard

A: The transparent glass plate constituting the article, the polymer alloy resin plate or the ABS resin plate could be separated by pressing the transparent glass plate constituting the article with a single thumb in the front end direction of the article

?: The transparent glass plate constituting the article, the polymer alloy resin plate or the ABS resin plate could be separated by holding the transparent glass plate constituting the article with one hand and pulling it in the front end direction of the article

X: The transparent glass plate constituting the article, the polymer alloy resin plate or the ABS resin plate can not be separated even if the transparent glass plate constituting the article is held with one hand and stretched in the direction of the front end of the article, Can not move to alloy resin board or ABS resin board

[Evaluation of Disassembly after Infrared Irradiation 2]

The surface state of the transparent glass plate, the polymer alloy resin plate or the ABS resin plate after the above [Evaluation 1 of disassembly after irradiation with infrared ray] was checked with naked eyes, and the disassembly property was evaluated according to the following criteria.

Evaluation standard

○: No adherend was observed, no damage, no deformation or discoloration at all.

&Amp; cir &: It was confirmed that the surface of a part of the adherend melted and damaged.

[Table 5]

[Table 6]

[Table 7]

1: transparent acrylic plate
2: Cut adhesive tape
3: Polycarbonate plate or stainless steel plate (SUS304)
4: Probe
5: Transparent glass plate
6: Adhesive tape piece
7: polymer allodynic resin plate
8: masking member
9: Halogen lamp

Claims (14)

(A) containing a rubber-based block copolymer (a), wherein a storage elastic modulus G ₁₂₀ measured by a dynamic viscoelastic spectrum at 1 Hz and 120 ° C of an adhesive component contained in the pressure-sensitive adhesive layer (A) G ₂₃ / G ₁₂₀ ] of the storage elastic modulus G ₂₃ measured in a dynamic viscoelastic spectrum at 1 Hz and 23 캜 with respect to the storage elastic modulus G ₁₂₀ in the range of 1.0 × 10 ³ Pa to 2.0 × 10 ⁵ Pa, Is 1 to 20 and is used for bonding two or more adherends and is heated by a halogen lamp before or after separating the adhered two or more adherends. The method according to claim 1,
Wherein the heating performed using the halogen lamp is a heating performed using a parallel light type halogen lamp heater. 3. The method according to claim 1 or 2,
Wherein the pressure-sensitive adhesive layer (A) is provided on each side of the substrate, and the thickness of the pressure-sensitive adhesive layer (A) is 25 占 퐉 or more. 4. The method according to any one of claims 1 to 3,
Wherein the substrate is an infrared absorbing substrate. A method for disassembling an article having a structure in which two or more adherends are bonded by the adhesive tape according to any one of claims 1 to 4, wherein the halogen lamp is brought into close contact with or brought into contact with the adhesive tape or the adherend , And the adhesive tape is heated to separate the two or more adherends. 6. The method of claim 5,
Wherein the heating step using the halogen lamp is a step of setting the temperature of the adhesive tape to 100 캜 within 20 seconds. The method according to claim 5 or 6,
Wherein the heating performed using the halogen lamp is performed using a parallel light type halogen lamp heater. An electronic device having a configuration in which two or more components constituting an electronic device are bonded by the adhesive tape according to any one of claims 1 to 4. An electronic device disassembling method characterized by separating the two or more parts by bringing the halogen lamp into contact with or contacting the adhesive tape constituting the electronic device according to claim 8 or heating the adhesive tape . The portable electronic terminal according to any one of claims 1 to 4, wherein the housing, the lens member, or the other housing is adhered by the adhesive tape. A method of disassembling a portable electronic terminal, characterized in that the halogen lamp is brought into contact with or brought into contact with the adhesive tape constituting the portable electronic terminal according to claim 10 or the housing or lens member, Way. A method for disassembling an article having at least an adherend (c1) and an adherend (c2) adhered to each other by an adhesive tape, the dismounting method comprising: a step of disposing a member having an infrared emissivity of 50% (C1) and an adherend (c1) by irradiating infrared rays onto the article from the side where the member (b) is mounted or fixed, c2) from the surface of the substrate (2). 13. The method of claim 12,
The step [2] is a step of heating the adhesive tape to 70 [deg.] C to 150 [deg.] C by infrared radiation. 13. The method of claim 12,
Wherein the adhesive tape is the adhesive tape according to any one of claims 1 to 5.

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