KR20170023543A - Apparatus For Soldering Shaped Like A Syringe - Google Patents

Apparatus For Soldering Shaped Like A Syringe Download PDF

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Publication number
KR20170023543A
KR20170023543A KR1020150118823A KR20150118823A KR20170023543A KR 20170023543 A KR20170023543 A KR 20170023543A KR 1020150118823 A KR1020150118823 A KR 1020150118823A KR 20150118823 A KR20150118823 A KR 20150118823A KR 20170023543 A KR20170023543 A KR 20170023543A
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KR
South Korea
Prior art keywords
cylinder
cylinder portion
heating
piston
solder
Prior art date
Application number
KR1020150118823A
Other languages
Korean (ko)
Inventor
정승익
Original Assignee
정승익
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정승익 filed Critical 정승익
Priority to KR1020150118823A priority Critical patent/KR20170023543A/en
Publication of KR20170023543A publication Critical patent/KR20170023543A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0006Exothermic brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances
    • B23K3/047Heating appliances electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/082Flux dispensers; Apparatus for applying flux

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to a syringe-type soldering tool enabling syringe-type melted solder to accurately and comfortably be provided to a soldering position. The syringe-type soldering tool comprises: a cylinder portion having a rear portion being opened, having a blow-off hole on a front blocking plate; a piston portion sliding in a manner inserted into the cylinder portion, discharging materials contained inside the cylinder portion through the blow-off hole; and a heating means installed inside the cylinder portion such that, after heating up and liquefying solder inserted into the cylinder portion, the liquefied solder is blown off through the blow-off hole.

Description

[0001] Apparatus For Soldering Shaped Like A Syringe [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus, and more particularly, to a scanning type soldering apparatus that enables accurate and convenient supply of solder to a soldering position in a scanning manner.

In general, soldering work requires soldering iron, lead solder, paste, and the like. The process of bringing the lead solder close to the soldering object and applying heat with the soldering iron to dissolve the lead solder and drop it on the soldering object is a soldering work process.

In educational settings such as academies, high schools, or universities, students actually practice soldering during practice sessions. In general, students are not professionally skilled and can not solder well. There are always the following difficulties for beginners. In other words, the lead and the pharynx are separated from each other and must be held with both hands, so it is difficult to drop an appropriate amount of lead in the correct position. In many cases, soldering is just a process of actually verifying the theory learned. However, due to the error of the solder, a circuit error such as a short circuit was caused, and in spite of being a simple experiment, a lot of time had to be wasted. Increasing proficiency in soldering work for simple theoretical verification can sometimes be seen as inefficient.

In some cases, it is also necessary to provide a means for simply repairing faults in electrical appliances caused by disconnection in a home. This is because it is wasteful to dispose of or to apply for A / S despite a simple malfunction.

Korean Patent Application No. 10-2011-0083177 Korean Patent Application No. 1996-009767

It is an object of the present invention to solve the above problems and to provide a soldering apparatus which can be easily used even for a beginner such as a student or a general public. And more specifically, to provide a soldering mechanism that allows soldering to be performed by dropping a necessary amount of solder at an accurate position.

The above object is also achieved by a cylinder unit having a rear opening and a front diaphragm plate having a spray hole; A piston slidably fitted in the cylinder and discharging a substance contained in the cylinder through the spray hole; And heating means installed inside the cylinder portion so as to heat and liquefy the solder drawn into the cylinder portion and to be ejected through the ejection hole.

According to an aspect of the present invention, the heating means is a heating cylinder which is heated by an electric current and is fitted to an inner wall of the cylinder portion like a lining; A nozzle tube integrally formed at the tip of the heating cylinder and protruding toward the front of the cylinder through the ejection hole; And a power supply unit for supplying current to the heating cylinder.

According to an aspect of the present invention, a handle ring capable of holding a finger can be installed in the cylinder portion.

According to another aspect of the present invention, the piston body includes:

A base made of ceramic material adhered to the inner wall surface of the cylindrical portion of the cylinder portion; And a packing made of Teflon or heat-resistant rubber provided on the circumferential surface of the base.

According to the above configuration, a scanning type soldering mechanism is provided in which a molten solder can be ejected at a precise position by dropping a molten solder in a precise position by using a general syringe to eject the liquid contained therein. The scanning type soldering apparatus of the present invention can help a student or a general practitioner who conducts an electric practice conveniently perform a soldering operation.

1 is a perspective view of a scanning type soldering mechanism according to an embodiment of the present invention.
2 is a sectional view of a scanning type soldering mechanism according to an embodiment of the present invention.
3 is a sectional view of a scanning type soldering apparatus according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings attached hereto. First, one embodiment of the present invention will be described with reference to Figs.

The scanning type soldering apparatus of the present invention has a configuration similar to a general syringe. That is, the brazing mechanism includes a cylinder portion 10 and a piston portion 20 which is fitted in the cylinder portion 10 and performs a piston movement.

The cylinder portion 10 includes a cylinder 11 having an opening at the rear and a diaphragm 14 at the front. At the center of the diaphragm (14), an ejection hole (13) is provided. The cylinder portion 10 is basically made of a heat-resistant material and / or a heat-insulating material. The inner wall surface of the cylinder 11 may be provided with a smooth and heat-resistant material in lining form to facilitate the piston action. Sometimes, it can be smoothed by coating it as a heat resistant material. The outside of the cylinder of the cylinder part can be protected with a heat insulating material such as asbestos and gypsum, so that it is safe even if the heating part is held by hand.

The piston 20 is slidably inserted into the cylinder portion 10 and presses the material injected into the cylinder portion 10 in a direction to discharge the material through the spray hole 13. The piston portion 20 includes a piston body 23 closely fitted to the inner wall of the cylinder 11 of the cylinder portion and a rod 22 connected to the piston body 23 and a grip portion 21 provided at the end of the rod .

The heating means 30 is installed in the cylinder portion 10 so as to heat and liquefy the solder P injected into the cylinder portion 10 and to be sprayed through the spray hole 13. [ The heating means 30 is preferably a heating element. The solder (P) may be heated at a temperature suitable for use in practice, or at a temperature suitable for use in electrically connecting the disconnected parts in the home, though the melting point differs depending on the application or characteristics. The solder P can be charged by cutting the solder P to a proper length and putting it into the cylinder 11.

Hereinafter, the heating means 30 will be described. The heating means 30 includes a heating cylinder 32 fitted to the inner wall of the cylinder 11 of the cylinder portion in the same manner as the lining provided in the cylinder of the engine and a heating cylinder 32 integrally provided at the front end of the heating cylinder 32, And a nozzle pipe 31 protruding toward the front of the cylinder unit 10 through the nozzle pipe 13. The heating cylinder 32 is heated by an electric force and is capable of applying heat to the material contained in the inner space S. The power supply portion including the electric wire 34 is connected to the heating cylinder 32 to supply electric current to the heating cylinder 32. [ The piston main body 23 is slid along the inner wall surface of the cylinder 11 of the cylinder portion 10 and the heating cylinder inner wall surface 32a provided on the same plane to push the solder P in the melted state It can be jetted through the nozzle hole 33 of the nozzle tube.

The diameter of the nozzle tube 31 becomes smaller toward the end, so that the solder can be dropped by a small amount at an accurate position. According to the drawings, the end portion 31a of the nozzle tube 31 is an inclined surface.

The base body 23 may be made of a ceramic material for heat resistance. A ring-shaped packing 25 made of Teflon or heat-resistant rubber may be provided on the circumferential surface of the base 24 for the sealing function.

A step 12 protrudes radially from the rear end of the cylinder portion 10 so that the piston portion 10 can be pressed by one hand.

Hereinafter, another embodiment of the present invention will be described with reference to FIG.

According to the present embodiment, the cylinder 11 of the cylinder portion 10 is provided with the pull ring 15 to which the fingers can be inserted. A bar-shaped handle 26 is formed at the end of the rod 22 so that the piston 20 can also be gripped by hand. According to the present embodiment, a scanning type soldering mechanism can be used as if a pistol grip and a trigger are used.

According to the present embodiment, the heating means 30 is provided at the tip end of the cylinder portion in a short section. The piston main body 23 is designed not to descend to the heating means 30. According to this embodiment, molten solder is ejected by using the air pressure generated in the cylinder portion 10 as the piston portion 20 is pressed.

In the case where the piston body 23 does not reach the heating means, the shape of the heating means can be changed into various forms. For example, a fin may be projected toward the inner space P to facilitate heating more quickly.

The above description is only an example based on the technical idea of the present invention. Those skilled in the art will recognize that various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims. For example, all embodiments described above may be freely combined and practiced by those skilled in the art, and any combination thereof should be construed as being included within the scope of the present invention.

10: cylinder part 11: cylinder
13: ejection hole 14: diaphragm plate
15: Handle ring 20: Piston part
21: Receiver part 22: Load
23: piston body 25: packing
30: Heating means 31: Nozzle tube
32: heating cylinder 33: nozzle ball
P: solder

Claims (4)

A cylinder portion having a rear opening and a front diaphragm plate having a spray hole;
A piston portion slidably fitted in the cylinder portion to discharge a substance contained in the cylinder portion through the spray hole;
Heating means installed inside the cylinder portion so as to heat and liquefy the solder drawn into the cylinder portion and to be ejected through the ejection hole;
Wherein the first and second openings are spaced apart from each other.
2. The apparatus of claim 1, wherein the heating means comprises:
A heating cylinder which is heated by electric current and is fitted to the inner wall of the cylinder part like a lining;
A nozzle tube integrally formed at the tip of the heating cylinder and protruding toward the front of the cylinder through the ejection hole;
A power supply unit for supplying a current to the heating cylinder;
Wherein the first and second openings are spaced apart from each other.
The method according to claim 1,
Wherein a handle ring is provided on the cylinder portion to hold a finger, and a bar-shaped handle is provided on a rod end portion of the piston portion.
2. The piston according to claim 1, wherein the piston body comprises:
A base made of ceramic material adhered to the inner wall surface of the cylindrical portion of the cylinder portion;
And a packing made of Teflon or heat-resistant rubber provided on a circumferential surface of the base.
KR1020150118823A 2015-08-24 2015-08-24 Apparatus For Soldering Shaped Like A Syringe KR20170023543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150118823A KR20170023543A (en) 2015-08-24 2015-08-24 Apparatus For Soldering Shaped Like A Syringe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150118823A KR20170023543A (en) 2015-08-24 2015-08-24 Apparatus For Soldering Shaped Like A Syringe

Publications (1)

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KR20170023543A true KR20170023543A (en) 2017-03-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112872543A (en) * 2021-01-13 2021-06-01 广州没吃贸易有限公司 Intelligent-manufactured mobile phone communication antenna welding self-positioning device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960009767A (en) 1994-08-31 1996-03-22 배순훈 Ghost Removal Device
KR20110083177A (en) 2010-01-13 2011-07-20 삼성전자주식회사 A method and apparatus of locating a mobile terminal using a received message

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960009767A (en) 1994-08-31 1996-03-22 배순훈 Ghost Removal Device
KR20110083177A (en) 2010-01-13 2011-07-20 삼성전자주식회사 A method and apparatus of locating a mobile terminal using a received message

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112872543A (en) * 2021-01-13 2021-06-01 广州没吃贸易有限公司 Intelligent-manufactured mobile phone communication antenna welding self-positioning device

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