KR20170021417A - Transparent display board applicable to large area and flexible substrate and method for manufacturing the same - Google Patents

Transparent display board applicable to large area and flexible substrate and method for manufacturing the same Download PDF

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KR20170021417A
KR20170021417A KR1020150115548A KR20150115548A KR20170021417A KR 20170021417 A KR20170021417 A KR 20170021417A KR 1020150115548 A KR1020150115548 A KR 1020150115548A KR 20150115548 A KR20150115548 A KR 20150115548A KR 20170021417 A KR20170021417 A KR 20170021417A
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electrode
substrate
transparent
electrode pattern
light emitting
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KR1020150115548A
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KR101752559B1 (en
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변도영
최진용
부닷귀엔
장용희
김규석
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엔젯 주식회사
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a transparent electro-optical panel that can be applied to a flexible substrate having a large area and can be easily applied to a flexible substrate having a large area according to the present invention. By forming a fine-width electrode pattern and partially removing the electrode pattern to form a circuit portion, the manufacturing process is simpler than that of a conventional indium tin oxide transparent electrode using a conventional sputtering method, and a large-area and flexible (flexible) And can be easily applied.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent electro-optical panel and a method for manufacturing the same,

The present invention relates to a transparent electro-optical panel which can be applied to a flexible substrate with a large area, and a method of manufacturing the same. More specifically, the present invention relates to a transparent electro-optical panel which is easy to manufacture and can be easily applied to a substrate having a large area and flexibility And a method for manufacturing the same, which can be easily applied to a flexible substrate having a large area.

In general, a means of conveying a guidance message or an advertisement message includes a method of displaying a letter or an image on a signboard or a banner. However, such door panels and banners can only provide limited contents produced in advance, and there is a disadvantage that additional lighting devices must be installed in order to be able to view contents at night.

There is also a method using an electric sign board capable of providing characters or images of various colors using its own light source (LED or the like) and further providing a moving picture. However, such a conventional electric billboard has a disadvantage in that the thickness thereof is thick for the processing of the electric wire on the rear side and the implementation of moving picture. Particularly, the circuit board for driving the LEDs is formed as a multilayer, which contributes to increase the overall thickness of the display board. In addition, the conventional electric signboard is generally covered with a cover for covering the rear surface of the electric wire or the thick film, so that the thickness thereof is increased by the structure for this purpose, and the appearance is not appropriate.

In order to solve such a problem, a letter, a picture or a mark is drawn on an acrylic and then a light source is installed on one side or both sides of the acrylic, so that the transparent electric display board There was an attempt to make. However, since the transparent electric signboard manufactured by this method does not provide moving images and it is reflected in the light source, it is not only dark but also the amount of light received by the acrylic plate differs according to the distance from the light source, Delivery is difficult.

On the other hand, Korean Patent No. 0618942 discloses a transparent electroluminescent panel capable of blinking an LED by forming a transparent electrode on a substrate using indium tin oxide (ITO).

However, the transparent indium tin oxide transparent electrode used in the conventional transparent electric display panel is advantageous in that it is easy to form a thin film, has excellent light transmission characteristics, and has a relatively low electrical resistance. However, an increase in material cost due to an increase in the price of indium, Problems such as market instability and anticipation of depletion, element deterioration due to diffusion of indium, high reduction under hydrogen plasma, bending instability such as cracking in flexible substrate, and the like are raised. In particular, the indium tin oxide thin film for transparent electrode production is not suitable for a large-area thin film process requiring a continuous process because it is manufactured by a sputtering process under a high-temperature vacuum condition.

Patent Document 1. Registration No. 0618942 (2006.09.01)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to solve the problems of the prior art described above. Accordingly, it is an object of the present invention to provide an electrode pattern having a fine structure having a mesh structure using a metal having low resistance, A transparent electro-optical panel which can be easily applied to a large-area and flexible substrate which can be easily applied to a substrate having a large area and flexibility (flexible) compared with an indium tin oxide transparent electrode using a sputtering method of the present invention And a manufacturing method thereof.

Also, since an electrode pattern having a height of about 1.5 mu m can be realized with respect to a 10 mu m line width using a conductive nano ink composition having a high viscosity, it is possible to provide an electrode pattern having a small width with low visibility, And which can be easily applied to a flexible substrate.

According to an aspect of the present invention, there is provided a display device comprising: a transparent substrate; a circuit part including a first electrode part and a second electrode part separated from each other on the transparent substrate; And a light emitting element connected to the first electrode portion and the second electrode portion of the circuit portion, wherein the circuit portion includes a metal electrode pattern having a parallel structure or mesh structure having a line width of 0.1 to 40 mu m formed on the transparent substrate, And the first electrode portion and the second electrode portion are formed by partially removing the first electrode portion and the second electrode portion.

The electrode pattern may be formed of a metal such as Au, Ag, Al, Ni, Zn, Cu, Si, or Ti on the transparent substrate. The conductive nano ink composition comprising at least one of the metal nanoparticles is formed by printing.

In addition, it is preferable that the electrode pattern is printed using a non-contact direct printing method using an electric field.

The aspect ratio of the electrode pattern is preferably 1: 0.1 to 1: 1.

In addition, the conductive nano ink composition preferably has a viscosity of 5,000 to 50,000 cP.

In addition, it is preferable that the electrode pattern is partially removed by laser or mechanical processing and is broken.

The light emitting device may further include a pad portion formed in a region connected to the light emitting device of the first electrode portion and the second electrode portion.

The light emitting device may further include a protective layer stacked on the transparent substrate and covering the circuit portion and the light emitting device.

In addition, the protective layer preferably includes a protective substrate laminated on the transparent substrate, and a protective filler filled between the transparent substrate and the protective substrate.

According to another aspect of the present invention, there is provided a method of fabricating an electro-optical device, the method comprising: forming an electrode pattern having a parallel structure or a mesh structure by printing a conductive nano ink composition on a transparent substrate; forming a first electrode part and a second electrode part, Forming a circuit portion having a first electrode; And attaching the light emitting device to the first electrode unit and the second electrode unit of the circuit unit, which can be easily applied to a flexible and large-area substrate.

Also, in the step of forming the electrode pattern, it is preferable that the conductive nano ink composition is printed using a non-contact direct printing method using an electric field.

In addition, in the step of forming the circuit portion, it is preferable that the electrode pattern is partially removed by laser or mechanical processing and is broken.

Further, it is preferable to perform the step of curing the electrode pattern after the step of forming the electrode pattern.

The method may further include forming a pad portion in a region of the first electrode portion and the second electrode portion that is electrically connected to the light emitting device after the step of forming the circuit portion.

The method may further include forming a protective layer on the circuit unit and the light emitting device after connecting the light emitting device to the first electrode unit and the second electrode unit.

The step of forming the protective layer may include a step of applying a protective filler on the transparent substrate on which the circuit unit and the light emitting device are disposed, and a step of bonding the protective substrate to an upper side of the protective filler.

Further, it is preferable to perform a step of curing the protective filler after the step of forming the protective layer.

According to the present invention, by forming a fine-width electrode pattern having a mesh structure using a metal having a low resistance and partially removing the electrode pattern to constitute a circuit portion, There is provided a transparent electro-optical panel which can be easily applied to a large-area and flexible substrate, which can be easily applied to a large-area substrate, and a method of manufacturing the same.

Also, since an electrode pattern having an aspect ratio of about 1: 0.1 to 1: 1 can be realized with respect to a line width of 0.1 to 40 mu m using a conductive nano ink composition having a high viscosity, an electrode pattern having a fine width, There is provided a transparent electric display board which is large in area capable of providing a pattern and can be easily applied to a flexible substrate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a transparent electro-optical panel which can be easily applied to a flexible substrate,
Fig. 2 is a cross-sectional view showing the main structure of a transparent electric display board which can be easily applied to a flexible substrate with a large area according to the present invention. Fig.
FIG. 3 is a process flow chart of a method of manufacturing a transparent electric display panel which can be easily applied to a large-area and flexible substrate according to the present invention,
FIGS. 4 to 7 are views showing the state of a transparent electric display board according to a process step according to a method of manufacturing a transparent electric display board which can be easily applied to a flexible substrate with a large area.

Prior to the description, components having the same configuration are denoted by the same reference numerals as those in the first embodiment. In other embodiments, configurations different from those of the first embodiment will be described do.

Hereinafter, with reference to the accompanying drawings, a transparent electric display board which can be easily applied to a flexible and large-area substrate according to the first embodiment of the present invention will be described in detail.

1 is a front view of a transparent electronic signboard which can be easily applied to a large-size and flexible substrate according to the present invention, and Fig. 2 shows a main configuration of a transparent electronic signboard which can be easily applied to a flexible substrate 1 is a cross-sectional view of the portion "A" in Fig.

As shown in the drawing, the present invention can be applied to a flexible substrate having a large area, which can be easily applied to a transparent electro-optical panel, which includes a transparent substrate 110, a circuit unit 120, a pad unit 130, (150).

The transparent substrate 110 is made of a transparent material such as glass, plastic, or acrylic having electrical insulation, and may be provided in the form of a film or a substrate.

The circuit unit 120 supplies power to the plurality of light emitting devices 140 disposed on the transparent substrate 110. The first electrode unit 122 and the second electrode unit 122 are electrically separated from each other. 123).

The electrode pattern 121 is partially removed by laser processing or mechanical processing using a sharp tip while the electrode pattern 121 is formed on the transparent substrate 110 in the form of a mesh, 121 may be disconnected to form the first electrode portion 122 and the second electrode portion 123 separated from each other.

The electrode pattern 121 may be formed in a parallel structure as well as a mesh structure having a shape of a square, a hexagon, a circle, or the like.

In the conductive nano ink composition, the conductive nano ink composition may include at least one of gold (Au), silver (Ag), aluminum (Al), nickel (Ni), zinc (Zn), copper (Cu), silicon (Si) ), And may include silver nanoparticles, preferably silver nanoparticles. This is a substitute for indium tin oxide (ITO), which is advantageous in terms of price and can be formed by a simple process. Conventionally, when an electrode is formed of indium tin oxide, a deposition method using a mask is used to form an electrode pattern. However, in this embodiment, since the electrode pattern 121 is formed through the non-contact direct printing method using an electric field, such a vacuum deposition process can be omitted.

In particular, when a conductive nano ink composition is printed by a non-contact direct printing method using an electric field, the nanoparticles are preferably provided as a conductive nanostructure such as nanowires or nanotubes. That is, conductive nanostructures such as nanowires and nanotubes are disorderly arranged without special attention when there is no stimulation factor of the surrounding environment, making patterning difficult. On the other hand, when the electrode pattern 121 is patterned through the non-contact direct printing method using an electric field, if an electric field is generated between the nozzle and the transparent substrate 110 by forming an electric field, the conductive nanostructure can be formed, The nanomaterial is finally aligned on the transparent substrate 110 in the same direction as the printing direction, that is, the direction in which the pattern is to be formed, through which a thin Thereby making it possible to form a line width pattern. This is more pronounced when the conductive nanostructure is a one-dimensional nanostructure.

In addition, the conductive nano ink composition is capable of realizing an electrode pattern 121 having a line width of 0.1 to 40 μm by maintaining a viscosity of 5,000 to 50,000 cP. Preferably 0.1 to 40 mu m, and more preferably 5 to 20 mu m. When the line width exceeds 50 탆, the pattern of the mesh structure is visually recognized from the outside and the visibility is increased.

Further, by using a conductive nano ink composition having a high viscosity, it is possible to realize an aspect ratio (line width: height) within a range of 1: 0.1 to 1: 1, more preferably, an aspect ratio of 1: 0.1 to 0.5 The aspect ratio of 1: 0.15 is effective. In order to improve the electrical conductivity, the cross-sectional area of the electrode pattern 121 must be large. Accordingly, as the aspect ratio within the above range is realized, the cross-sectional area becomes larger and the sheet resistance value becomes lower. The conventional electrode pattern 121 can have an electrode pattern 121 having a height ratio of about 200 nm if the line width is 10 μm. However, the present invention is applicable to an electrode pattern having a height of about 1.5 μm 121) can be realized. As a result, the height of the electrode pattern 121 is about 750 times larger than that of the conventional electrode pattern 121, and the cross-sectional area of the electrode pattern 121 is considerably increased, and the electrical conductivity is remarkably improved.

The high-viscosity conductive nano ink composition is a composition used for the electrode pattern 121 having low visibility, and enables the line width and the aspect ratio described above. The conductive nano ink composition having a high viscosity is printed on a transparent substrate 110 using a non-contact direct printing method using an electric field. The conductive nano ink composition can be applied to a large-area transparent substrate 110, And the like.

Since the electrode pattern 121 uses a metal material having a low resistance, it is possible to secure a sheet resistance of less than 10 Ohm / sq in a large area and to be spaced apart by an interval of approximately 100 to 500 μm while being formed with a line width of 0.1 to 40 μm So that a transmittance of 85% or more can be secured.

As described above, the first electrode part 122 and the second electrode part 123 are formed by partially removing the electrode pattern 121 having the fine structure. Therefore, since a transmittance of 85% or more can be ensured while using a metal having excellent electrical conductivity, it can be substituted for a conventional indium tin oxide transparent electrode.

The pad unit 130 is provided for stable connection between the first electrode unit 122 having a fine line width and the second electrode unit 123 and the light emitting device 140, A pad portion 130 having an area corresponding to the terminal of the light emitting device 140 is formed.

The light emitting device 140 may be any type of light emitting device capable of emitting light, such as a light emitting diode (LED), a laser diode, an organic EL, a liquid crystal device (LCD), a field emission device . In this embodiment, an LED having a cathode terminal and a cathode terminal is formed to emit light of a single color, and the circuit unit 120 includes a first electrode unit 122 and a second electrode unit 123 However, when the light emitting device 140 having a plurality of terminals such as a single chip type RGB LED is applied, the electrode unit of the circuit unit 120 should be divided into a number corresponding to the number of terminals of the light emitting device 140 .

The passivation layer 150 may include a protective filler 151 applied to the entire surface of the transparent substrate 110 on which the circuit unit 120 and the light emitting device 140 are formed and the transparent substrate 110 through the protective filler 151, And a protective substrate 152 which is made of a metal. Here, the protective filler 151 may be made of a UV-curable transparent resin, and the protective substrate 152 may be made of a transparent substrate such as glass, plastic, or acrylic.

Hereinafter, the process of manufacturing a transparent electric signboard according to the method of manufacturing a transparent signboard which can be easily applied to a flexible substrate with a large area will be described.

In the drawings, FIG. 3 is a process flow chart of a method for manufacturing a transparent electric signboard which can be easily applied to a flexible substrate with a large area according to the present invention, and FIGS. 4 to 7 show the steps of the present invention, FIG. 3 is a view showing the state of a transparent electric signboard according to a process of manufacturing a transparent signboard.

3, the method for manufacturing a transparent electric display panel which can be applied to a large-sized and flexible substrate easily includes an electrode pattern forming step S110, an electrode pattern curing step S120, (S130), a pad forming step S140, a light emitting device attaching step S150, a protective layer forming step S160, and a protective filler curing step S170.

As shown in FIG. 4, the electrode pattern forming step S110 may be performed by forming gold (Au), silver (Ag), aluminum (Al), nickel (Ni), zinc (Zn) (Cu), silicon (Si), or titanium (Ti) is applied to the conductive nano ink composition using a non-contact direct printing method using an electric field to form a mesh having a line width of 0.1 to 10 μm The electrode pattern 121 is formed.

Here, the conductive nano ink composition forms an electrode pattern 121 with an aspect ratio within a range of 1: 0.1 to 1: 1 while maintaining a viscosity of 5,000 to 50,000 cP. Therefore, the cross-sectional area of the electrode pattern can be ensured while the line width of the electrode pattern 121 is formed to a fine width of 0.1 to 40 mu m. In addition, the lines constituting the electrode pattern 121 are spaced apart by an interval of approximately 100 to 500 mu m to provide a light transmittance of 85% or more and a sheet resistance of 10 Ohm / sq or less.

The electrode pattern curing step S120 is for curing the conductive nano ink composition printed on the transparent substrate 110 and can cure the conductive nano ink composition through heat and photo-curing process.

As shown in FIG. 5, the circuit part forming step S130 may be performed by removing the electrode patterns 121 partially by machining using a laser L or a sharp tip, The circuit portion 120 having the first electrode portion 122 and the second electrode portion 123 is formed. The first electrode part 122 and the second electrode part 123 of the circuit part 120 can be easily formed by partially removing the electrode pattern 121 of the mesh structure previously formed on the transparent substrate 110 It is easy to manufacture the customized circuit part 120 according to the various demands of the user and the design of the circuit part 120 can be easily changed according to the type and arrangement of the light emitting device 140. [ The step of forming the circuit part S130 may include a step of setting an area to be removed on the electrode pattern 121 in accordance with the arrangement of the light emitting device 140 or the terminal structure and a step of irradiating the area to be removed with a laser, And removing the electrode pattern 121 partially using the resist pattern.

6, in the state before the light emitting device 140 is attached, the pad forming step S140 may be performed by printing a conductive material on a region corresponding to the terminal of the light emitting device 140 to form the light emitting device 140 The conductive nano ink composition may be printed by a non-contact direct printing method using an electric field as in the electrode pattern forming step (S110). However, It is not.

7, the light emitting device 140 may be attached to the pads 130 formed on the first and second electrode units 122 and 123, respectively, The terminal of the light emitting device 140 is electrically connected to the pad unit 130 through a general device mounting process by receiving power from the first electrode unit 122 and the second electrode unit 123. [ So that they can be electrically connected. In FIG. 1, the light emitting devices 140 are arranged in a simple array. However, the present invention is not limited thereto.

2, the light emitting device 140 is connected to the first electrode unit 122 and the second electrode unit 123, and then the circuit unit 120 and the light emitting unit 130 are formed. A step S161 of applying a protective filler 151 on the transparent substrate 110 on which the circuit unit 120 and the light emitting device 140 are disposed and forming the protective layer 150 on the device 140, And attaching the protective substrate 152 to the upper side of the protective filler 151 (S162).

The protective filler curing step S170 is a step of curing the protective filler 151 after the step of forming the protective layer 150 to provide heat or ultraviolet rays according to the characteristics of the protective filler 151, 151 may be cured.

The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

110: transparent substrate, 120: circuit part, 121: electrode pattern,
122: first electrode part, 123: second electrode part, 130: pad part,
140: light emitting element, 150: protective layer, 151: protective filler,
152: protective substrate, L: laser
S110: electrode pattern formation step, S120: electrode pattern curing step,
S130: circuit forming step, S140: pad forming step,
S150: attaching light emitting element, S160: protective layer forming step
S170: Protective filler curing step

Claims (17)

A transparent substrate;
A circuit part including a first electrode part and a second electrode part separated from each other on the transparent substrate; And
And a light emitting device connected to the first electrode unit and the second electrode unit of the circuit unit,
Wherein the circuit part forms a first electrode part and a second electrode part separated from each other by partially removing the metal electrode pattern of a parallel structure or mesh structure having a fine line width of 0.1 to 40 탆 formed on the transparent substrate And can be easily applied to a flexible substrate. The method according to claim 1,
The electrode pattern may include at least one of gold (Au), silver (Ag), aluminum (Al), nickel (Ni), zinc (Zn), copper (Cu), silicon (Si), or titanium Wherein the transparent nano ink composition is formed by printing a conductive nano ink composition containing any one of metal nanoparticles. 3. The method of claim 2,
Wherein the electrode pattern is printed using a non-contact direct printing method using an electric field, and which can be easily applied to a flexible and large-area substrate. 3. The method of claim 2,
Wherein the electrode pattern has an aspect ratio of 1: 0.1 to 1: 1, and can be easily applied to a flexible substrate with a large area. 5. The method of claim 4,
Wherein the conductive nano ink composition has a viscosity of 5,000 to 50,000 cP. The transparent electroconductive plate can be easily applied to a flexible and large-area substrate. The method according to claim 1,
Wherein the electrode pattern is partly removed by laser processing or mechanical processing using a sharp tip, and is broken. The transparent electric display panel can be easily applied to a flexible substrate with a large area. The method according to claim 1,
And a pad portion formed in a region connected to the light emitting element of the first electrode portion and the second electrode portion, respectively, and which can be easily applied to a flexible and large-area substrate. The method according to claim 1,
And a protection layer which is laminated on the transparent substrate and covers the circuit portion and the light emitting device, and which can be easily applied to a flexible and large-area substrate. 9. The method of claim 8,
Wherein the protective layer comprises a protective substrate laminated on a transparent substrate, and a protective filler filled between the transparent substrate and the protective substrate, the transparent electric display panel being easily applicable to a large-area flexible substrate. Printing a conductive nano ink composition on a transparent substrate to form an electrode pattern of a parallel structure or a mesh structure;
Forming a circuit part having a first electrode part and a second electrode part separated from each other by partially removing the electrode pattern; And
And attaching a light emitting element to the first electrode unit and the second electrode unit of the circuit unit, the method being applicable to a large-area and flexible substrate. 11. The method of claim 10,
Wherein the conductive nano ink composition is printed using a non-contact direct printing method using an electric field in the step of forming the electrode pattern, wherein the conductive nano ink composition can be easily applied to a flexible and large-area substrate. 11. The method of claim 10,
Wherein the electrode pattern is partially removed by mechanical working using a laser or a sharp tip to form a circuit section, and the electrode pattern is cut off. (Method for manufacturing electric sign board). 11. The method of claim 10,
And curing the electrode pattern after the step of forming the electrode pattern. The method for manufacturing a transparent electric signboard according to claim 1, 11. The method of claim 10,
And forming a pad portion in a region of the first electrode portion and the second electrode portion that is electrically connected to the light emitting device after the step of forming the circuit portion, A method for manufacturing a transparent electric sign board. 11. The method of claim 10,
Forming a protective layer on the circuit unit and the light emitting device after connecting the light emitting device to the first electrode unit and the second electrode unit; Gt; 16. The method of claim 15,
The step of forming the protective layer may include a step of applying a protective filler on the transparent substrate on which the circuit unit and the light emitting device are disposed, and a step of attaching the protective substrate to the upper side of the protective filler. A method for manufacturing a transparent electric sign board which can be easily applied to a flexible substrate. 16. The method of claim 15,
And curing the protective filler after the step of forming the protective layer, wherein the protective filler is cured.
KR1020150115548A 2015-08-17 2015-08-17 Transparent display board applicable to large area and flexible substrate and method for manufacturing the same KR101752559B1 (en)

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JP2020501190A (en) * 2017-09-26 2020-01-16 エルジー・ケム・リミテッド Transparent light emitting device display
JP2020519966A (en) * 2017-09-26 2020-07-02 エルジー・ケム・リミテッド Electrode substrate for transparent light emitting device display and method for manufacturing the same
CN113594050A (en) * 2021-07-28 2021-11-02 江西华创触控科技有限公司 Method for repairing circuit substrate and transparent display screen
US11223001B2 (en) 2018-08-24 2022-01-11 Lg Chem, Ltd. Electrode substrate for transparent light-emitting diode display device, and transparent light-emitting diode display device comprising same

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JP2001217078A (en) 2000-02-03 2001-08-10 Matsushita Electric Ind Co Ltd Organic light emitting element and manufacturing method

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KR100618942B1 (en) 2005-11-08 2006-09-01 김성규 Transparent display board

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Publication number Priority date Publication date Assignee Title
JP2020501190A (en) * 2017-09-26 2020-01-16 エルジー・ケム・リミテッド Transparent light emitting device display
JP2020519966A (en) * 2017-09-26 2020-07-02 エルジー・ケム・リミテッド Electrode substrate for transparent light emitting device display and method for manufacturing the same
US10854786B2 (en) 2017-09-26 2020-12-01 Lg Chem, Ltd. Transparent light emitting device display
US11171259B2 (en) 2017-09-26 2021-11-09 Lg Chem, Ltd. Electrode substrate for transparent light-emitting diode display and method for manufacturing same
US11223001B2 (en) 2018-08-24 2022-01-11 Lg Chem, Ltd. Electrode substrate for transparent light-emitting diode display device, and transparent light-emitting diode display device comprising same
CN113594050A (en) * 2021-07-28 2021-11-02 江西华创触控科技有限公司 Method for repairing circuit substrate and transparent display screen

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