KR20170015083A - Electronic device with multi-band antenna for supporting the carrier aggregation using conductive border member of non-segmented - Google Patents

Abstract

A multi-band antenna according to an embodiment of the present invention, in an electronic device including a cover, a substrate, and an outer conductor, includes a first antenna device for a low band and an intermediate band arranged in one side of the electronic device and including an antenna pattern cooperating with a non-segmented conductor part, and a second antenna device for an intermediate band and high band disposed on the other side of the electronic device and including an antenna pattern cooperating with the non-segmented conductor part. The low band of the first antenna device and the high band of the second antenna device can be adjusted by using a switch. So, carrier-aggregation (CA) can be supported.

Description

TECHNICAL FIELD [0001] The present invention relates to an electronic device including a multi-band antenna for carrier-aggreement (CA) support using a non-segmented outer conductor,

The present application relates to an electronic device including a multi-band antenna for carrier-aggregation (CA) support using a non-segmented outer conductor in an electronic device having an outer conductor (or a conductive frame member).

The popularity of metal design is gradually increasing in portable electronic devices such as smart phones. Such metallic designs are of interest in terms of exterior design and internal robustness of portable electronic devices.

As an example, an outer conductor is used in terms of the external design of the electronic device, and a conductor frame may be embedded in the interior of the electronic device in terms of internal robustness.

Recently, some portable electronic device companies using metal designs are in the process of research and development to use these outer conductors as part of the antenna.

For example, in a conventional antenna using an outer conductor of a portable electronic device, in order to use the outer conductor as a part of the antenna, a gap (or a segment) from which some conductor of the outer conductor exposed to the outside is removed is formed, The outer conductor segmented by this gap can be used as an antenna.

In this case, when the outer conductor is segmented, it is advantageous in terms of implementation and performance of the antenna length. However, when the outer conductor is segmented, it is disfigured in appearance and has a disadvantage that the yield is low in metal processing.

In addition, the development of electronic devices having outer conductors is being performed by various manufacturers. However, most electronic devices use segmented outer conductor structures such as the top two segments, the bottom two segments, and all four segment structures to secure the performance of the antenna.

As an example, the four segment structures can be used as antennas in separate outer conductors in the middle of the top and bottom. However, in the four-segment structure, a separate manufacturing process must be added to the segmented portion when the metal frame is manufactured, which results in a problem of a low productivity and a high defect rate. Accordingly, there is an increasing demand for ensuring antenna performance in an electronic device having a non-segmented outer conductor other than the existing segmented structure.

Meanwhile, as part of the evolution of LTE-Advanced (Long Term Evolution-Advanced) communication system, Carrier Aggregation (CA) technology, which is a core element technology of 3GPP Rel-10 Standardizes technologies that combine two or more carriers to improve the efficient use of the frequency and the maximum data rate.

Among the communication schemes supporting the above-described LTE-Advanced Carrier Aggregation (CA) are 1UL / 2DLs inter-band CA, 1UL / 3DLs inter-band CA, and TDD-FDD CA.

In particular, the downlink data rate is a maximum of 150 Mbps (Category 4 UE) in the case of a two-layer transmission of two receiving antennas of an electronic device, a four-layer transmission of four receiving antennas of an electronic device, And can support up to 300Mbps (Category 6UE) when using 2DL CA. For this, the technique of designing the receiving antenna is becoming important.

In addition, in an electronic device using an outer conductor, receiving antennas are increased in structure, and therefore the problem of isolation between each other must be solved.

Considering the above, a new antenna structure is required for electronic devices using outer conductor for frequency support of each communication company in each country.

The following prior art documents do not disclose a solution to the above-mentioned conventional technical problem.

Korea Patent Publication No. 2012-0102517 Korean Patent Publication No. 2014-0119928

One embodiment of the present invention provides an electronic device comprising a multi-band antenna capable of supporting carrier-aggregation (CA) using segmentless, non-segmented outer conductors in an electronic device having an outer conductor.

According to an embodiment of the present invention, there is provided an electronic device comprising: a first feeding terminal electrically connected to a circuit portion of a substrate incorporated in an electronic device having a peripheral portion; A second feeding terminal electrically connected to the circuit portion of the substrate and electrically separated from the first feeding terminal; A grounding portion disposed on the substrate; An outer conductor continuously disposed along the peripheral portion; A first antenna device including a first antenna pattern portion electrically connected to each of the first feeding terminal and the outer conductor, the first antenna device forming a multiple resonance for covering a first multiband having a plurality of bands; And a second antenna pattern part electrically connected to each of the second feeding terminal and the outer conductor, wherein the second antenna pattern part forms a multiple resonance for covering a second multi- ; And a bypass path for bypassing an interference signal generated by the first antenna device and the second antenna device to a ground portion of the substrate; An electronic device is proposed.

In the solution of this task, one of several concepts described in the following detailed description is provided. The subject matter of the present invention is not intended to identify the core or essential technology of the claimed subject matter, but merely one of the claimed subject matter is described, each of which is specifically set forth in the following detailed description.

According to an embodiment of the present invention, in an electronic device having an outer conductor, it is possible to variously adjust the low band, the middle band and the high band using a segmentless non-segmented outer conductor, As performance gains, carrier-aggregation (CA) can be supported.

1 (a) is an external perspective view of an electronic device including a multi-band antenna according to an embodiment of the present invention.
1 (b) is a schematic diagram of an electronic device including a multi-band antenna according to an embodiment of the present invention.
2 is a perspective view illustrating a first embodiment of a multi-band antenna according to an embodiment of the present invention.
FIG. 3 is a plan view showing a first embodiment of the multi-band antenna of FIG. 2. FIG.
4 is a perspective view showing a second embodiment of a multi-band antenna according to an embodiment of the present invention.
FIG. 5 is a plan view showing a second embodiment of the multi-band antenna of FIG. 3. FIG.
FIG. 6 is an explanatory diagram of a placement condition of a multi-band antenna according to an embodiment of the present invention.
7 (a) and 7 (b) are explanatory diagrams of the structure of a feed line of a second antenna device according to an embodiment of the present invention.
8 (a), 8 (b) and 8 (c) are views showing current paths and frequency bands of the first antenna device according to an embodiment of the present invention.
9 (a) and 9 (b) are views showing current paths of a second antenna device according to an embodiment of the present invention.
10 (a) and 10 (b) are characteristic diagrams of radiation efficiency for each frequency band of a multi-band antenna according to an embodiment of the present invention.

It is to be understood that the present invention is not limited to the embodiments described and that various changes may be made without departing from the concept of the present invention.

Further, in each embodiment of the present invention, the structure, shape and numerical values described as one example are merely examples for facilitating understanding of the technical matters of the present invention, and thus the present invention is not limited thereto. Each of the embodiments of the present invention may be combined with each other in whole or in part so that a variety of new embodiments can be made.

In the drawings referred to in the present invention, components having substantially the same configuration and function as those of the present invention will be denoted by the same reference numerals.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

The present application includes a multi-band antenna capable of supporting LTE-advanced CA (Carrier Aggregation) without degrading communication sensitivity while using a non-segmented outer conductor instead of the lower two segments of the existing four segment structures Electronic devices are proposed.

In general, the antenna of a smart phone is greatly influenced by the set structure. Particularly, in the case of the main antenna disposed at the lower end, the liquid crystal display part on the front part, the ground condition, the vibration motor, the speaker, jack, or USB connector can cause performance degradation, and the radiation performance of the main antenna can be seriously degraded, especially under the outer conductor structure.

In addition, under the outer conductor structure, it is difficult to overcome the narrow band characteristics with the conventional PIFA and loop type antenna structures. In addition, to improve the efficient use and maximum transmission rate of LTE-Advanced communication frequency supporting CA technology, it supports different current communication frequency band and integrates frequency by using frequency integration technology combining two or more carriers. Research and development is needed.

And it becomes more difficult to design an antenna that supports multi-band structure under the outer conductor structure. In order to compensate for this, there is a need to design a new antenna structure, which is different from the conventional antenna structure.

- It has a non-segmented outer conductor structure and is implemented as an LM (Low-Middle Band) antenna device using one side (e.g., left side) outer conductor around the USB port and the other side Can be implemented as an MH (Middle-High Band) antenna device.

- It may have a structure connected to one or more capacitive elements in case of no-segment outer conductor and feeding stage connection.

- It can be connected to system ground through inductor element when connecting USB connector to eliminate performance deterioration due to parasitic resonance of USB port (IO port) under no-segment outer conductor structure.

- It is possible to use a switch device for narrow band characteristics and CA (Carrier Aggregation) support while using a non-segmented outer conductor.

The structure of the present invention described above will be described with reference to Figs. 1 to 10. Fig.

1 (a) is an external perspective view of an electronic device including a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 1 (a), an electronic device 10 including a multi-band antenna according to an embodiment of the present invention includes a segmentless outer conductor 300.

1 (b) is a schematic diagram of an electronic device including a multi-band antenna according to an embodiment of the present invention.

The electronic device 10 of FIG. 1 (b) may be a portable computer such as a portable tablet computer, a mobile phone, a mobile phone having a media player function, a handheld computer, a remote control, a game player, A combination of such devices, or any other suitable portable electronic device.

As shown in Fig. 1 (b), the electronic device 10 may include a circuit portion 11 disposed inside the cover 100 and providing a signal to the feeding end. The circuit unit 11 includes a central processing unit (CPU), a signal processor (ISP), a memory, a communication modem, and an input / output interface to support functions required by the electronic device 10 Further, the circuit portion 11 is electrically connected to the ground (GND) of the substrate 200 so that the ground for providing the reference potential in operation is electrically connected.

As an example, the cover 100, the substrate 200, and the outer conductor 300 may be arranged in order as shown in Fig. 1, but are not limited thereto.

For example, the circuit unit 11 includes an input / output circuit 11A for inputting and outputting data, a storage and processing circuit 11B for storing and processing data, and a wireless communication circuit (not shown) including a short- 11C).

The multi-band antenna may include a first antenna device 500 and a second antenna device 700. The first antenna device 500 and the second antenna device 700 may be connected to each other.

The input / output circuit 11A can be used to input data into the electronic device 10 or output data to an external device of the electronic device 10. [

Output circuit 11A may include input and output devices such as a touch screen and other user input interface and may be coupled to input and output devices such as a button, joystick, click wheel, scrolling wheel, touch pad, keypad, keyboard, microphone, Device. Such a user input device may be provided with an external input command for controlling the operation of the electronic device 10. [

The input / output device may also include display and audio devices such as display and other components that present visual information and status data.

In one example, the display and audio device may further include audio equipment such as a speaker and other devices for generating sound.

And, the input / output device may include audio-video interface equipment such as jacks and other connectors for external headphones and monitors.

The storage and processing circuitry 11B may be any type of storage device such as hard disk drive storage, non-volatile memory (e.g., flash memory or read-only memory), volatile memory (e.g., static or dynamic random- access-memory), and the like. The storage and processing circuit 11B may be used to control the operation of the electronic device 10. [

The storage and processing circuit 11B may include, for example, at least one of a microprocessor, a microcontroller, a digital signal processor, and application specific integrated circuits (ASIC). The storage and processing circuitry 11B can be used in the electronic device 10 to execute software such as an Internet browsing application, a voice-over-internet-protocol (VoIP) phone call application, an email application, a media playback application, have. In addition, in order to support interaction with external equipment, the storage and processing circuitry 11B may be used in the implementation of communication protocols, and the communication protocol that may be implemented using the storage and processing circuitry 11B may include, , A protocol for other short range wireless communication links such as a wireless local area network (WLAN) protocol (e.g., IEEE 802.11 protocol (or WiFi®), Bluetooth® protocol, cellular phone protocol, etc.).

And, the wireless communication circuit 11C may include a radio frequency (RF) transceiver circuit formed from one or more integrated circuits, a power amplifier circuit, a low noise input amplifier, a passive RF component, and other circuitry for handling RF radio signals .

In addition, the wireless communication circuit 11C may include a radio frequency transceiver circuit for handling a plurality of radio frequency communication bands.

Examples of mobile phone standards that may be supported by the electronic device 10 and the wireless communication circuit 11C include GSM (Global System for Mobile Communications) "2G " mobile phone standards, Evolution-Data Optimized (EVDO) Mobile phone standards, "3G" Universal Mobile Telecommunications System (UMTS) mobile phone standards, "3G" Code Division Multiple Access 2000 mobile phone standards, and 3GPP LTE (Long Term Evolution) mobile phone standards. It is applicable here if it is a wireless communication standard and need not be limited to these mobile phone standards.

Particularly, the wireless communication circuit 11C includes the first antenna device 500 and the second antenna device 700 in order to perform multi-band communication for carrier-aggregation (CA) support. And each of the first antenna device 500 and the second antenna device 700 may utilize a non-segmented outer conductor 300 of the electronic device to support the CA, do.

2 is a perspective view illustrating a first embodiment of a multi-band antenna according to an embodiment of the present invention. FIG. 3 is a plan view showing a first embodiment of the multi-band antenna of FIG. 2. FIG.

Referring to FIG. 2, the electronic device 10 may include a peripheral portion, a cover 100, a substrate 200, and an outer conductor 300 disposed continuously along the peripheral portion.

The substrate 200 includes a circuit unit 11 and a grounding unit GND. The circuit unit 11 is disposed inside the cover 100 and includes a grounding unit GND, a first feeding stage 501, The second class front end 701, the first antenna device 500, and the second antenna device 700, respectively.

At this time, the first feeding end 501 and the second feeding end 701 are electrically separated from each other and arranged so as not to interfere with each other.

In addition, the substrate 200 includes a metal region (conductive region) A1 and a nonmetal region (nonconductive region) A2, and at least one circuit portion (11 in Fig. 2) And can provide a signal to the first and second feeding ends 501 and 701 and transmission lines and elements included in the first and second antenna devices can be disposed in the nonmetal region A2 . Here, a ground (GND) for maintaining the reference potential of the substrate 200 may be disposed in the metal region A1.

Here, in each embodiment of the present invention, the metal region A1 of the substrate 200 is described as a ground GND because the entire metal region A1 of the substrate 200 is necessarily grounded (GND) It is not intended to be.

1 to 3, the outer conductor 300 is disposed at the periphery of the electronic device 10, that is, at the outer side edge, and at least a part of the outer conductor 300 has a segmentless conductivity ≪ / RTI >

The outer conductor 300 may be integrally formed with the inner conductive frame disposed inside the electronic device 10, or may be formed independently of the inner conductive frame to be assembled with the electronic device. In one example, the outer conductor 300 may or may not be associated with the body of the electronic device 10.

Here, in the outer conductor 300 according to the embodiment of the present invention, there is no segment at least in the portion functioning as the antenna. Therefore, a segment may exist in a portion that does not function as an antenna.

Thus, in each of the embodiments of the present invention, the outer conductor 300 need not be segmented for functional implementation of the antenna.

2 and 3, a multi-band antenna according to an embodiment of the present invention includes a first antenna device 500 supporting a first multi-band, a second antenna device 700 supporting a second multi-band, .

For example, the first antenna device 500 and the second antenna device 700 may be disposed on opposite sides of each other with an input / output port (IO-port) of the electronic device interposed therebetween. In this case, if the first antenna device 500 and the second antenna device 700 are disposed at both side edge regions of the electronic device and a possible distance is secured within the electronic device for minimizing interference with each other, quot; -port ").

In addition, each of the first antenna device 500 and the second antenna device 700 may be formed using any suitable antenna type, such as a loop antenna structure, a patch antenna structure, an inverted-F ) Antenna structure, and hybrids of these designs, or the like.

At this time, the first multi-band and the second multi-band may include frequency bands that are not overlapped with each other, and may include overlapping frequency bands.

For example, the first multiband may include a low frequency band (700 MHz to 1000 MHz), which is a relatively low frequency band, and an intermediate frequency band (1700 MHz to 2200 MHz), which is higher than the low frequency band. In addition, the second multi-band may include an intermediate (1700 MHz-2200 MHz) and a higher (2300 MHz-2700 MHz) higher intermediate than the mid-range.

At this time, the first and second multi-band need not be limited to the above example, provided they are capable of supporting CA.

First, the first antenna device 500 will be described.

The first antenna device 500 includes a first antenna pattern part A50 electrically connected to each of the first feeding end 501 and the outer conductor 300. The first antenna pattern part A50 ) And the outer conductor 300 may be used to form a multiple resonance for covering the first multi-band having a plurality of bands.

The first antenna pattern part A50 may include a first antenna pattern A51 and a first bridge antenna pattern A52.

The first antenna pattern A51 is disposed along the edge of the cover 100 of the electronic device and has one end electrically connected to each of the first feeding end 501 and the outer conductor 300, The other end is opened, and can have a first electrical length.

In one example, the first antenna pattern A51 has a first electrical length (P11-open end) at the P11 contact of the cover 100 electrically connected to the P21 contact of the substrate 200, As shown in FIG.

The first bridge antenna pattern A52 is disposed on the cover 100 of the electronic device and has one end electrically connected to one point of the first antenna pattern A51 and the other end electrically connected to the outer conductor 300 As shown in FIG.

For example, the first bridge antenna pattern A52 may be disposed along the edge including the corner of the cover 100 from one point of the first antenna pattern A51 to the P12 contact.

The first antenna device 500 may include a first outer conductor portion 351 and a second outer conductor portion 352.

The first outer conductor portion 351 may be formed of a material having a second electrical length apart from the first point P31 connected to the first feeding end 501 and the first antenna pattern A51, And an outer conductor up to the second point P39.

For example, the first outer conductor portion 351 may extend from the P31 contact (first point) of the outer conductor 300 connected to the P11 contact of the cover 100 to one side by a second electrical length P31-P39 To the P39 contact (second point) at the point where it is separated.

The second outer conductor portion 352 includes the outer conductor 300 from the third point P32 of the outer conductor 300 to the fourth point P33 which is separated by a third electrical length from the third point P32 can do.

For example, the second outer conductor portion 352 may include a P33 contact (fourth P33-P33) at a position separated from the P32 contact (third point) of the outer conductor 300 by a third electrical length (P31-P33) To the outer conductor 300 to the point of intersection.

The second point P39 of the first outer conductor portion 351 is electrically connected to the ground GND of the substrate 200 and the third point P32 of the outer conductor 300 is electrically connected to the ground 1 bridging antenna pattern A52 and the fourth point P33 of the second outer conductor portion 352 may be connected to the bypass path PH52.

At this time, the P39 contact of the outer conductor 300 is connected to the ground (GND) through the P29 contact of the substrate 200, and the P33 contact of the outer conductor 300 is electrically connected to the P23 contact of the substrate 200 . For example, the P23 contact and the P21 contact of the substrate 200 may be disposed with the input / output port (IO-port) of the electronic device interposed therebetween.

The first antenna pattern A51 and the first bridge antenna pattern A52 may be formed on a different layer from the substrate 200 and may be disposed on a rear cover 100 of the electronic device 10 Or may be disposed inside the back cover.

When the first antenna pattern A51 is disposed on the rear cover 100, the first antenna pattern A51 may be disposed at a position favorable to reception sensitivity as shown in FIG. 2. For example, the rear cover Rear can be disposed along the edge of the edge of the cover (100).

Here, in this document, a contact such as a P11 contact and a P21 contact means a connection point for electrical connection between components disposed on different layers.

On the other hand, the electrical connection between the two contacts can be applied to the electrical connection between different layers applied to a conventional electronic device. For example, through a conductor through hole, through a wire, or through a clip.

Next, the second antenna apparatus 700 will be described.

The second antenna device 700 includes a second antenna pattern portion A70 electrically connected to each of the second feeding end 701 and the outer conductor 300. The second antenna pattern portion A70 ) And the outer conductor 300 may be used to form a multiple resonance for covering a second multi-band including a band that does not partially overlap with the first multi-band.

The second antenna device 700 may include a second antenna pattern A71 and a second bridge antenna pattern A72.

The second antenna pattern A71 is disposed on the cover 100 of the electronic device so that one end is electrically connected to the second feeding end 701 and the other end is opened and has a fourth electrical length .

In one example, the second antenna pattern A71 may be arranged to have a fourth electrical length (P14-open end) extending from the P14 contact of the cover 100, which is electrically connected to the P24 contact of the substrate 200 .

The second bridge antenna pattern A72 is disposed on the cover 100 of the electronic device and has one end electrically connected to one point of the second antenna pattern A71 and the other end electrically connected to the outer conductor 300 As shown in FIG.

The second bridge antenna pattern A72 may be disposed along the edge including the corner of the cover 100 from one point of the second antenna pattern A71 to the P15 contact of the cover 100. [

The second antenna device 700 includes a third outer conductor portion 371.

The third outer conductor portion 371 may be formed of a material that is separated from the fifth point P35 of the outer conductor 300 electrically connected to the other end of the second bridge antenna pattern A72 by a fifth electrical length And the outer conductor 300 up to the sixth point P37.

For example, the third outer conductor portion 371 may include an outer conductor (e.g., a conductor) extending from the P35 contact of the outer conductor 300 connected to the P15 contact to the P37 contact at a position separated by a fifth electrical length (P35-P37) 300).

At this time, the P37 contact is electrically connected to the P27 contact of the substrate 200 and connected to the ground (GND).

At this time, the sixth point P37 of the third outer conductor portion 371 may be electrically connected to the ground GND of the substrate 200.

The first antenna device 500 includes a first capacitor circuit part C51 inserted into a transmission line for electrically connecting the first feeding end 501 and the first point P31 of the first outer conductor part 351, ).

For example, the first capacitor circuit portion C51 can be connected via the transmission line L51 between the first feeding end 501 disposed on the substrate 200 and the first feeding end 501 and the P21 contact .

The second antenna device 700 may include a third capacitance C71. The third capacitance C71 may be connected through a transmission line L71 between the second feeding terminal 701 and the P24 contact.

The second antenna device 700 may include a matching circuit portion C70 and the matching circuit portion C70 may be configured such that one end of the second antenna pattern A71 is connected to the bypass path PH52 And the fourth point P33 to form an impedance matching with respect to the high frequency of the second multiband.

The matching circuit unit C70 may include fourth and fifth capacitance units C72 and C73 connected in series with each other.

For example, the fourth and fifth capacitance portions C72 and C73 may be connected in series between the P24 contact of the substrate 200 and the transmission line L52 of the substrate 200 through a transmission line L72 . Here, each of the fourth and fifth capacitance units C72 and C73 may include at least one capacitance element, and each of the fourth and fifth capacitance units C72 and C73 is set for impedance matching with a predetermined frequency band (e.g., a high frequency band) And may include a capacitance element having a capacitance smaller than the capacitance of the second capacitor circuit portion C52.

Next, the bypass path PH52 will be described.

The bypass path PH52 can bypass the mutual interference signal by the first antenna device 500 and the second antenna device 700 to the ground GND of the substrate 200. [

The bypass path PH52 may be disposed between the first antenna device 500 and the second antenna device 700 and may be disposed between the first antenna device 500 and the second antenna device 700, The outer conductor 300 and the ground GND of the substrate 200 are alternately connected to each other so that a signal from each of the first antenna device 500 and the second antenna device 700 is applied to the substrate 200 can be bypassed to the ground (GND).

The bypass path PH52 may include a second capacitor circuit portion C52 and the second capacitor circuit portion C52 may include the second outer conductor portion 352 and the fourth outer conductor portion 372 , And has a capacitance for bypassing a signal from the first antenna device 500 to the ground. The grounding part GND has a capacitance for bypassing a signal from the first antenna device 500 to ground.

For example, the second capacitor circuit portion C52 is connected between the P23 contact of the substrate 200 and the ground GND of the substrate 200 through a transmission line L52. Here, the second capacitor circuit part C52 may include at least one capacitance element, and may include a capacitance element having a large capacity enough to alternately ground the AC signal.

FIG. 4 is a perspective view showing a second embodiment of a multi-band antenna according to an embodiment of the present invention, and FIG. 5 is a plan view showing a second embodiment of the multi-band antenna of FIG.

4 and 5 are views for explaining a second embodiment of a multi-band antenna according to an embodiment of the present invention, and similar or similar items as those described with reference to Figs. 1 to 3, The description may be omitted.

The second antenna device 700 includes a third outer conductor portion 371 and a fourth outer conductor portion 372. Since the third outer conductor portion 371 is as described above with reference to FIGS. 2 and 3, a description thereof will be omitted.

The fourth outer conductor portion 372 includes the outer conductor 300 from the fifth point P35 of the outer conductor 300 to the seventh point P36 which is separated by a sixth electrical length from the fifth point P35 can do.

For example, the fourth outer conductor portion 372 may include the outer conductor 300 from the P35 contact (fifth point) to the P36 contact (seventh point) which is separated by a sixth electrical length (P35-P36) Lt; / RTI >

At this time, the seventh point P36 of the fourth outer conductor portion 371 may be connected to the second feeding end 701 of the substrate 200 through the switch SW3.

Referring to FIGS. 4 and 5, the first antenna device 500 may include at least one switch for adjusting a current path and a frequency band. For example, the case of including the first switch SW1 and the second switch SW2 will be described.

The first switch SW1 and the second switch SW2 may be disposed on the substrate 200. In this case, the first switch SW1 is connected to one end and the ground GND of the substrate 200 And one end of the first switch SW1 is electrically connected to the first outer conductor portion 351 through the P38A contact of the outer conductor 300 and the P28A contact of the substrate 200. [ Here, the P38A contact of the outer conductor 300 can be positioned between the P31 contact and the P39 contact.

The second switch SW2 includes one end and the other end connected to the ground GND of the substrate 200. One end of the second switch SW2 is connected to the P28B contact, 300 to the first outer conductor portion 351 through the P38B contact. Here, the P38B contact of the outer conductor 300 can be positioned between the P38A contact and the P39 contact.

For example, when the first switch SW1 is in the OFF state and the second switch SW2 is in the ON state, the current path is connected to the ground (GND) terminal of the substrate 200 through the P39 contact of the first outer conductor portion 351 (GND) of the substrate 200 through the P38B contact of the first outer conductor portion 351 instead of being formed of the first antenna device 500) can be adjusted to be high (see Figs. 8A and 8B, B20- > B5).

When the second switch SW2 is in the OFF state and the first switch SW1 is in the ON state, the current path is connected to the ground GND of the substrate 200 through the P39 contact of the first outer conductor portion 351, (GND) of the substrate 200 through the P38A contact of the first outer conductor portion 351 instead of being formed of the first antenna device 351, 500) can be adjusted to be higher (see FIG. 8B, FIG. 8C, B20 or B5 - > B8).

Referring to FIGS. 4 and 5, the second antenna device 700 may include at least one switch for adjusting a current path and a frequency band. For example, the case of including the third switch SW3 will be described.

The third switch SW3 may be disposed on the substrate 200. In this case, the third switch SW3 includes one end and the other end connected to the P24 contact, and the other end of the third switch SW3 And is electrically connected to the outer conductor 300 through the P26 contact and the P36 contact of the substrate 200. Here, the P36 contact may be located between the P33 contact and the P35 contact.

For example, when the third switch SW3 is in the on state, a new current path through the third switch SW3 is formed, so that the second antenna device 700 can cover the new frequency band. For example, one current path may include a second class front end 701, a third capacitance C71, a third switch SW3, 26 and P36 contacts, third and fourth outer conductor portions 371 and 372, P37 0.0 > and P27 < / RTI > contacts.

Accordingly, a relatively short current path is generated, and the frequency band can be adjusted to be high by the third switch SW3 (see Figs. 9A and 9B, B30- > B7)

In addition, another current path includes the second class front end 701, the third capacitance portion C71, the third switch SW3, the P26 contact and the P36 contact, the fifth outer conductor portion 373, P33 and P23 Contact and the second capacitor circuit portion C52 in this order and the current signal is bypassed to the grounding portion GND by the second capacitor circuit portion C52, It does not affect the antenna device 50.

At this time, the fifth outer conductor portion 373 corresponds to the outer conductor portion between the P36 contact and the P33 contact in the outer conductor 300. [

FIG. 6 is an explanatory diagram of a placement condition of a multi-band antenna according to an embodiment of the present invention.

Referring to FIG. 6, in relation to the first antenna device 500, the distance D1 between the P31 contact and the P33, the length D2 of the first bridge antenna pattern A52, the distance between the P31 contact and the contact P32 The length D4 of the first antenna pattern A51 and the separation distance D5 between the P33 contact and the P39 contact can be determined in consideration of the wavelength of the frequency band to be used.

For example, in the case of 900 MHz included in the low band (700 MHz to 1000 MHz), D1 is? / 8, D2 is? / 11, D3 is? / 30, D4 is? / 8, Lt; RTI ID = 0.0 > lambda / 4, < / RTI >

In this manner, also in relation to the second antenna device 700, the length of the third outer conductor portion 371 corresponding to the separation distance between the P37 contact and the P35 contact, the distance between the P35 contact and the P36 contact The length of the fourth outer conductor portion 371 and the length of the fifth outer conductor portion 373 corresponding to the distance between the P36 contact and the P33 contact may be determined in consideration of the wavelength of the frequency band to be used.

7 (a) and 7 (b) are explanatory diagrams of the structure of a feed line of a second antenna device according to an embodiment of the present invention.

7A and 7B, in the second antenna device 700, the transmission line L71 between the P24 contact of the substrate 200 and the third capacitance C71 is connected to a pre- &thetas;). Here, the inclination [theta] may be greater than zero and less than 50 degrees with respect to the horizontal imaginary line, and may be, for example, 45 degrees.

On the other hand, in the transmission line, the current intensity is strongly increased along the interface between the second antenna pattern A71 and the second bridge antenna pattern A72 of the second antenna device 700 and the ground GND of the substrate 200 The antenna patterns A71 and A72 of the second antenna device 700 and the outer conductor 300 can be strongly formed in the vicinity of the opposite corners.

At this time, when the transmission line L71 is arranged obliquely, the bandwidth can be improved if the current distribution intensity is strongly formed at the interface of the ground GND.

8 (a), 8 (b) and 8 (c) are views showing current paths and frequency bands of the first antenna device according to an embodiment of the present invention.

A description will be given of the case where the first and second switches SW1 and SW2 of the first antenna device 500 are both in the off state with reference to Figs. 4 and 8 (a), 8 (b) and 8 .

First, when a current signal is supplied through the first feeding terminal 501 of the first antenna device 500, one current path passes through the first capacitance portion C51, the P21 and the P11 contact, , And this current path is the same as the current path in Fig. 2 and Fig. This current path corresponds to the first midrange band f_M1.

At this time, the first middle band f_M1 may include B3 (1710MHz-1880MHz), B2 (1850MHz-1990MHz), and B1 (1920MHz-2170MHz) among the above middle frequencies (1700MHz-2200MHz).

Here, the first bridge antenna pattern A52 can function as a stub for bandwidth extension, and is formed to have a length shorter than the length of the first antenna pattern A51, and the length of the first midpoint band f_M1 It can perform the function of expanding the bandwidth.

The case where both the first and second switches SW1 and SW2 of the first antenna device 500 are in the OFF state will be described with reference to Figs. 4 and 8A.

In this case, the current path is formed to the ground GND of the substrate 200 via the first outer conductor portion 351, P39 and P29 via the first capacitance portion C51, P21 and P31 contacts, The path is the same as the current path in FIG. 2 and FIG. This current path corresponds to the first low-pass band f_L1.

At this time, the first low-band band f_L1 may include B20 (791 MHz-862 MHz) of the low band (700 MHz-1000 MHz).

At this time, the second capacitor conductor portion 352, the P33 and P23 contacts are further connected via the first capacitance portion C51, P21 and P31 contacts, and a current signal is applied to the substrate 200 through the second capacitor circuit portion C52 And grounded (GND). And thus can be bypassed to ground without affecting the second antenna device 70 by the second capacitor circuit portion C52. Such a current path can be equally applied to all of FIGS. 8 (a), 8 (b) and 8 (c).

At this time, the capacitance of the second capacitor circuit portion C52 may be large enough to ground the AC signal alternately. Accordingly, the isolation between the first antenna device 500 and the second antenna device 700 can be improved since the current signal is bypassed to the ground by the second capacitor circuit part C52.

Next, a case where the first and second switches SW1 and SW2 of the first antenna device 500 are in the off and on states will be described with reference to Figs. 4 and 8 (b).

In this case, the current path is grounded via the first outer conductor portion 351, P38B and P28B via the first capacitance portion C51, P21 and P31 contacts, which current path is connected to the second low- . Here, the second low frequency band f_L2 is a higher frequency band than the first low frequency band f_L1.

At this time, the second low-band band f_L2 may include B5 (824 MHz-894 MHz) of the low band (700 MHz-1000 MHz).

Next, the case where the first and second switches SW1 and SW2 of the first antenna device 500 are on and off will be described with reference to Figs. 4 and 8 (c).

In this case, the current path is grounded through the first outer conductor portion 351, P38A and P28A via the first capacitance portion C51, P21 and P31 contacts, which current path is connected to the third low- . Here, the third low-pass band f_L3 is lower than the second low-pass band f_L2.

At this time, the third low-band band f_L3 may include B8 (880MHz-960MHz) of the low band (700MHz-1000MHz).

9 (a) and 9 (b) are views showing current paths of a second antenna device according to an embodiment of the present invention.

A case where the third switch SW3 of the second antenna device 500 is in the off state will be described with reference to Figs. 4 and 9 (a) and 9 (b).

First, when a current signal is supplied through the second feeding terminal 701 of the second antenna device 700, one current path passes through the third capacitance portion C71, P24 and P14 contacts to form a second bridge antenna pattern A72), through the P15 and P35 contacts, and through the third outer conductor portion 371, P37 and P27 contacts. This current path corresponds to the second midrange band f_M2. Such a current path can be applied equally to all of FIGS. 9 (a) and 9 (b).

At this time, the second middle band f_M2 may include B3 (1710MHz-1880MHz), B2 (1850MHz-1990MHz), and B1 (1920MHz-2170MHz) among the above middle frequencies (1700MHz-2200MHz).

In addition, another current path passes through the third capacitance portion C71, the P24 and P14 contacts, the second bridge antenna pattern A72, the P15 and P35 contacts, and the fourth and fifth outer conductor portions 372 and 373 ), P33 and P23 contacts, a current signal is formed through the second capacitor circuit portion C52 to the ground (GND) of the substrate 200.

Accordingly, since the current signal is bypassed to the ground GND of the substrate 200 by the second capacitor circuit portion C52, isolation between the first antenna device 500 and the second antenna device 700 Isolation can be improved.

Next, when a current signal is supplied through the second feeding terminal 701 of the second antenna device 700, another current path is passed through the third capacitance portion C71, the P24 and the P14 contact, (A71). This current path corresponds to the first high frequency band f_H1.

At this time, the first high frequency band f_H1 may include B30 (2305MHz-2360MHz) among the high frequencies (2,300MHz-2,700MHz).

A case where the third switch SW3 of the second antenna device 500 is in the on state will be described with reference to Figs. 4 and 9 (a) and 9 (b).

First, when a current signal is supplied through the second feeding terminal 701 of the second antenna device 700, one current path connects the third capacitance C71, the third switch SW3, the P26, and the P36 contacts Through the fifth outer conductor portion 373, P33 and P23 contacts, and then flows through the second capacitor circuit portion C52.

Further, the other current path is formed by grounding via the third and fourth outer conductor portions 372 and 371, P37 and P27 contacts via the third capacitance C71, the third switch SW3, the P26 and P36 contacts, do. This current path corresponds to the second high-band (f_H2).

At this time, the second high frequency band f_H2 may include B7 (2500MHz-2690MHz) among the high frequencies (2300MHz-2700MHz).

10 (a) and 10 (b) are characteristic diagrams of radiation efficiency for each frequency band of a multi-band antenna according to an embodiment of the present invention.

10 (a) is a radiation efficiency characteristic diagram for each frequency band for the first antenna device 500, and FIG. 10 (b) is a radiation efficiency characteristic diagram for each frequency band for the second antenna device 700. FIG.

10A, an existing graph G10 having G10 is a characteristic graph of an existing electronic device, a graph G21 is a characteristic graph when the first and second switches SW1 and SW2 are off, Only the second switch SW2 is in the ON state, and the G23 graph is the characteristic graph in the ON state only the first switch SW1.

Referring to the graph shown in FIG. 10A, the first antenna device 500 covers the middle band B3, B2, B1 of approximately 1700 MHz to 2200 MHz corresponding to the first midrange f_M1 And it is also shown that a plurality of low-band bands B20, B5 and B8 can be covered by the first antenna device 500 at 700 MHz to 1000 MHz according to the first and second switches SW1 and SW2 have.

In FIG. 10 (b), the existing GEP is a characteristic graph of an existing electronic device. The G31 graph is a characteristic graph when the third switch SW3 is in the off state. The G32 graph shows that the third switch SW3 In the ON state.

Referring to the graph shown in FIG. 10B, middle band B3, B2, B1 of approximately 1700 MHz to 2200 MHz corresponding to the second center f_M2 is covered by the second antenna device 700 And it is also shown that a plurality of high frequency bands B30 and B7 can be covered by the second antenna device 700 at 2300 MHz to 2700 MHz according to the third switch SW3.

According to the embodiments of the present invention as described above, in the electronic device having the outer conductor, the low-frequency, middle-frequency, and high-frequency bands can be variously adjusted by using the non- The antenna performance can be secured and carrier-aggregation (CA) can be supported, and 1UL / 2DLs or 1UL / 3DLS can be implemented.

100: cover
200: substrate
300: outer conductor
500: first antenna device
700: second antenna device

Claims (16)

A first feeding terminal electrically connected to a circuit portion of a substrate incorporated in an electronic device having a peripheral portion;
A second feeding terminal electrically connected to the circuit portion of the substrate and electrically separated from the first feeding terminal;
A grounding portion disposed on the substrate;
An outer conductor continuously disposed along the peripheral portion;
A first antenna device including a first antenna pattern portion electrically connected to each of the first feeding terminal and the outer conductor, the first antenna device forming a multiple resonance for covering a first multiband having a plurality of bands;
And a second antenna pattern part electrically connected to each of the second feeding terminal and the outer conductor, wherein the second antenna pattern part forms a multiple resonance for covering a second multi- ; And
A bypass path for bypassing an interference signal generated by the first antenna device and the second antenna device to a ground portion of the substrate;
≪ / RTI >
2. The antenna of claim 1,
A first antenna pattern disposed along an edge of the cover of the electronic device, the first antenna pattern having one end electrically connected to each of the first feed end and the outer conductor, and the other end opened, the first antenna pattern having a first electrical length; And
A first bridge antenna pattern disposed on a cover of the electronic device, the first bridge antenna pattern having one end electrically connected to one point of the first antenna pattern and the other end electrically connected to the outer conductor;
Lt; / RTI >
3. The apparatus of claim 2, wherein the first antenna device
A first outer conductor portion including an outer conductor extending from a first point connected to the first feeding end and the first antenna pattern to a second point spaced apart from the first point by a second electrical length; And
A second outer conductor including an outer conductor extending from a third point of the outer conductor to a fourth point spaced apart by a third electrical length; Lt; / RTI >
Wherein a second point of the first outer conductor portion is electrically connected to a ground portion of the substrate, a third point of the outer conductor is connected to the other end of the first bridge antenna pattern, Is connected to the bypass path.
4. The antenna of claim 3, wherein the second antenna pattern portion
A second antenna pattern disposed on the cover of the electronic device, the second antenna pattern having one end electrically connected to the second feed end, the other end opened, and arranged to have a fourth electrical length; And
A second bridge antenna pattern disposed on the cover of the electronic device and having one end electrically connected to one point of the second antenna pattern and the other end electrically connected to the outline conductor;
Lt; / RTI >
5. The apparatus of claim 4, wherein the second antenna device
A third outer conductor section including an outer conductor extending from a fifth point of the outer conductor electrically connected to the other end of the second bridge antenna pattern to a sixth point spaced apart from the fifth point by a fifth electrical length; And
A fourth outer conductor portion including an outer conductor extending from a fifth point of the outer conductor to a seventh point spaced apart from the fifth point by a sixth electrical length; Lt; / RTI >
The sixth point of the third outer conductor portion is electrically connected to the ground portion of the substrate and the seventh point of the fourth outer conductor portion is connected to the second secondary front end of the substrate through the switch.
5. The apparatus of claim 4, wherein the second antenna device
And a matching circuit disposed between one end of the second antenna pattern and a fourth point to which the bypass path is connected to form an impedance match with respect to a higher one of the second multiple bands.
7. The apparatus of claim 6, wherein the first antenna device
Further comprising a first capacitor circuit part inserted in a transmission line electrically connecting the first feed end and a first point of the first outer conductor part,
The bypass path includes:
A second capacitor having a capacitance for bypassing a signal from the first antenna device to the ground, the second capacitor being disposed between one of the outer conductors between the second outer conductor section and the fourth outer conductor section and the ground section, An electronic device comprising a circuit portion.
8. The matching circuit according to claim 7,
And fourth and fifth capacitance portions connected in series with each other,
Wherein each of the fourth and fifth capacitance portions includes a capacitance element having a capacitance smaller than a capacitance of the second capacitor circuit portion
Electronic device.
A first feeding terminal electrically connected to a circuit portion of a substrate incorporated in an electronic device having a peripheral portion;
A second feeding terminal electrically connected to the circuit portion of the substrate and electrically separated from the first feeding terminal;
A grounding portion disposed on the substrate;
An outer conductor continuously disposed along the peripheral portion;
And a first antenna pattern portion electrically connected to each of the first feed terminal and the outer conductor, wherein the first antenna pattern portion and the outer conductor are used to cover a first multi-band having a plurality of bands, A first antenna device for forming resonance;
And a second antenna pattern portion electrically connected to each of the second feed terminal and the outer conductor, wherein the second antenna pattern portion and the outer conductor are used to form a second multi- A second antenna device for forming multiple resonances for covering the resonator; And
The first antenna device and the second antenna device are alternately connected to the ground conductor of the substrate so that signals from the first antenna device and the second antenna device can be transmitted to the ground part of the substrate, Bypass path to pass;
≪ / RTI >
The apparatus of claim 9, wherein the first antenna pattern unit comprises:
A first antenna pattern disposed along an edge of the cover of the electronic device, the first antenna pattern having one end electrically connected to each of the first feed end and the outer conductor, and the other end opened, the first antenna pattern having a first electrical length; And
A first bridge antenna pattern disposed on a cover of the electronic device, the first bridge antenna pattern having one end electrically connected to one point of the first antenna pattern and the other end electrically connected to the outer conductor;
Lt; / RTI >
11. The apparatus of claim 10, wherein the first antenna device
A first outer conductor portion including an outer conductor extending from a first point connected to the first feeding end and the first antenna pattern to a second point spaced apart from the first point by a second electrical length; And
A second outer conductor including an outer conductor extending from a third point of the outer conductor to a fourth point spaced apart by a third electrical length; Lt; / RTI >
Wherein a second point of the first outer conductor portion is electrically connected to a ground portion of the substrate, a third point of the outer conductor is connected to the other end of the first bridge antenna pattern, Is connected to the bypass path.
12. The antenna of claim 11, wherein the second antenna pattern portion
A second antenna pattern disposed on the cover of the electronic device, the second antenna pattern having one end electrically connected to the second feed end, the other end opened, and arranged to have a fourth electrical length; And
A second bridge antenna pattern disposed on the cover of the electronic device and having one end electrically connected to one point of the second antenna pattern and the other end electrically connected to the outline conductor;
Lt; / RTI >
13. The apparatus of claim 12, wherein the second antenna device
A third outer conductor section including an outer conductor extending from a fifth point of the outer conductor electrically connected to the other end of the second bridge antenna pattern to a sixth point spaced apart from the fifth point by a fifth electrical length; And
A fourth outer conductor portion including an outer conductor extending from a fifth point of the outer conductor to a seventh point spaced apart from the fifth point by a sixth electrical length; Lt; / RTI >
The sixth point of the third outer conductor portion is electrically connected to the ground portion of the substrate and the seventh point of the fourth outer conductor portion is connected to the second secondary front end of the substrate through the switch.
14. The apparatus of claim 13, wherein the second antenna device
And a matching circuit disposed between one end of the second antenna pattern and a fourth point to which the bypass path is connected to form an impedance match with respect to a higher one of the second multiple bands.
14. The apparatus of claim 13, wherein the first antenna device
Further comprising a first capacitor circuit part inserted in a transmission line electrically connecting the first feed end and a first point of the first outer conductor part,
The bypass path includes:
A second capacitor having a capacitance for bypassing a signal from the first antenna device to the ground, the second capacitor being disposed between one of the outer conductors between the second outer conductor section and the fourth outer conductor section and the ground section, An electronic device comprising a circuit portion.
16. The apparatus of claim 15, wherein the first antenna device
And at least one switch for adjusting the current path and the frequency band.

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