KR20170012527A - Airport Flight Approach Lighting Apparatus - Google Patents

Abstract

The present invention relates to runway edge lights buried in an airport runway and, more specifically, relates to runway edge lights for an airport using energy-saving semiconductor light sources that meet various conditions required for the runway edge lights. To achieve such a technical solution, the present invention comprises: a light-emitting diode (LED) light source for visible light; and a light source for infrared light using a vertical-cavity surface-emitting laser (VCSEL) chip package where single VCSEL unit light sources are arranged and packaged. The present invention may provide runway edge lights using energy-saving semiconductor light sources that meet various conditions required for the runway edge lights.

Description

Airport Flight Approach Lighting Apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an induction lamp purchased in an airport runway, and more particularly to a power-saving semiconductor runway airport runway guide lamp that satisfies various requirements required for an airport runway guide lamp.

A guide light is used to help take-off and landing of an aircraft during take-off and landing of an aircraft. Traditionally, a runway guide light according to the prior art uses a light source. In such a light source, visible light spectrum component and infrared light spectrum component are simultaneously emitted, When the weather conditions are good at take-off and landing, the pilot uses the visible light spectrum to try and make landing and landing adjustments while watching the pilot directly. When the weather conditions deteriorate, the pilot drives the infrared camera in the cockpit and releases The infrared ray is detected and the takeoff and landing is carried out.

In recent years, the need for an induction lamp using an energy-efficient LED light source has arisen, but in an energy-efficient LED (for example, a white light LED), an infrared wavelength band It is hardly practically used because it is hardly released.

In view of the above disadvantages, in recent years, in collaboration with the National Institute of the United States of America and the State University, in order to generate infrared rays that can be detected by an infrared camera by heating a light source using a carbon-based nano material to about 600 to 900 degrees centigrade However, it has not been applied to the field because many problems such as development of high-temperature heating insulation and relatively high power consumption have not been solved yet.

SUMMARY OF THE INVENTION In view of the above problems of the prior art, the present invention provides an energy-efficient airport runway guide lamp that satisfies various requirements required for an airport runway guide lamp.

In order to accomplish the above object, the present invention provides an induction lamp for an airport runway,

LED light source for visible light;

And a light source for infrared rays using a VCSEL chip package in which single VCSEL unit light sources are arranged and packaged.

By using the present invention, it becomes possible to provide a power-saving semiconductor light source and a lamp that satisfy various requirements required for an airport runway guide lamp.

1 shows a VCSEL array chip package for infrared used in an airport runway guide lamp according to the present invention.
2 is a first embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
3 is a second embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
4 is a third embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
5 is a fourth embodiment of a lamp structure of an airport runway guide lamp according to the present invention.
Figure 6 illustrates the application of a lens on top of a VCSEL array chip package in accordance with the present invention.

First, the essential requirements required for an airport runway guide lamp using a power-saving semiconductor light source will be described.

1. The airport runway guide light must emit visible light and infrared light simultaneously as a light wavelength component.

2. The light distribution pattern when viewed from the runway in the air should be such that both the illuminated beam coverage and the optical signal intensity within the irradiated area can be detected by the control station and the cockpit coordinator in the control system.

3. Meet the energy consumption requirements (preferably less than 30W, preferentially less than 45W) required by the United States Federal Aviation Administration (FAA).

In addition to these essential requirements, in addition to the requirements of the luminaire, the light sources are all located within the PARAM-38 (diameter 4.75 inches, about 120 mm) or PAR-56 (diameter 7 inches, about 177 mm) airport runway guidance lamp There is an additional requirement that it must be deployed.

On the other hand, the US Federal Aviation Administration (FAA), when the camera sensor using 1300 ~ 2400 nm spectral range infrared sensor is required to be detectable and the eye safety problem due to laser straightness is satisfied, the laser diode is used as an infrared light source It is defined as usable.

Accordingly, the present invention provides an airport runway guide lamp that satisfies the above requirements by using a semiconductor light source for infrared rays having high energy efficiency and excellent optical characteristics in addition to the LED for visible light.

That is, in the guide light of the present invention, the light source used in the conventional white steady burning lamp (PAR-38) or the green threshold lamp (PAR-56) Instead, a VCSEL (Vertical-Cavity Surface-Emitting Laser) using a semiconductor system (for example, a III-V light source such as a III-V light source) is used as an infrared light source that is hardly emitted from an LED light source, (VCSEL light source) array that uses InAlGaAs, InGaAs, InAlAs, InGaAsP, GaInAsSb, and InSb for the -V family of semiconductor InP bases) to meet various requirements of the guide lights required by the FAA.

As a result, in the present invention, a single VCSEL (Vertical-Cavity Surface-Emitting Laser) unit light source as an infrared light source is arranged in a constant array to satisfy the optical power condition, the beam pattern and the driving power condition in the infrared region required for runway guidance, I will.

In addition, since the VCSEL used in the present invention has a high optical efficiency and an appropriate optical power, particularly a surface light emitting structure, the beam divergence angle is circularly symmetric, so that the full width half maximum (FWHM) It is maintained at about 10 degrees so that it has a light emission angle similar to the beam pattern reference required in airport guidance and the like and is easily sensed by the infrared camera.

In addition, a laser with a collimation lens applied to a general laser or a semiconductor laser has a high power density per unit area even at a long distance because of its good linearity. However, when the VCSEL has a FWHM of about 10 degrees and propagates a certain distance, . For example, for a VCSEL of a 10-degree FWHM beam at 100 m propagation distance when the power density of a normal laser with a good linearity is 1 mW / cm ² , the area of the FWHM power is about 1,000 m ² and the power density per cm ² Is one-tenth of ⁷ (one in 10 million), so it is not a problem for eye-safe for airport officials and pilots.

Now, let's look at this in the more realistic real-world working area, with shorter distances and narrower beam divergence angles required by the Federal Aviation Administration.

Assuming that the laser power has an FWHM (Performance Requirements Full-Width Angle Angle) beam divergence angle of +/- 8 ° at 1 W, the beam area area at a propagation distance of about 4 m is about 10,000 cm ² As a result, the power density of the laser is about 0.1 mW / cm ² , which is considerably deteriorated. Ultimately, this is not only a very small value of about 1/10 of the maximum permissible exposure (MPE) value defined for the visual acuity protection condition at a wavelength of 1550 nm, but also about 1 mW, is because normal 0.39 cm ² because it is the optical power entering the retina of the eye is 39% of the value (0.1 mW / cm ²⁾ calculation on the optical power actually entering the retina is even smaller, airport personnel, and the eyes of the pilot Eye-safe. ≪ / RTI > In addition, installation and maintenance personnel of lighting apparatus at airports are encouraged to use eyeglasses with highly trained licenses to ensure that their eye safety during operation is guaranteed even more .

On the other hand, even if the beam pattern condition required for the control tower and the pilot is slightly different from the FWHM of about 10 degrees (for example, 8 degrees) depending on the airport conditions, the beam from the VCSEL is arrayed close to the circular symmetric condition And a necessary beam pattern can be easily controlled by applying an appropriate transmission lens.

In addition, the VCSEL is superior in reliability and lifetime characteristics to any other light source. In other words, if the VCSEL technology is applied to a suitable array and the lamp is configured appropriately in the PAR-38 or PAR-56 luminaires together with the visible light LED, the infrared wavelength band, the beam pattern implementation required by the Federal Aviation Administration (FAA) Both low power consumption and small size implementations are possible.

On the other hand, documents issued by the FAA, the most widely used document in the United States, require a beam divergence angle of about 8 degrees in the case of infrared rays, but a circular symmetric beam in the case of visible light LED light sources (FWHM) should be about +/- 4 to 8 degrees for the divergence angle. The visible light LED has a Lambertian beam pattern with a half-width of about 120 degrees without a lens, but it is about 4 to 10 The half-width lens is widely known to be commercialized (Any Casting in Korea or Narrow Beam Angle lens in Taiwan's LED Link) .

Now, a method of making an induction lamp using a combination of an LED light source for a visible ray and a VCSEL light source for an infrared ray according to the present invention will be described with reference to the drawings.

Existing Green Threshold PAR-56 or White Steady Burning PAR-38 Instead, in order to provide a highly efficient directing lamp in the present invention, the present invention takes into consideration that the LED light source rarely emits infrared rays together with the high efficiency LED light source of visible light, The VCSEL is provided with an array structure, and the guide lamp is packaged.

Here, in order to simultaneously satisfy the optical power characteristic range (eye safety + infrared camera detection) required for airport guidance and the like and the beam pattern condition, the VCSEL array structure used in the present invention is the same as shown in FIG. 1 (1) for forming an array structure through a rectangular array mask formed by repeating a VCSEL single chip (5) structure at 5 x 5 to 30 x 30 by utilizing a semiconductor device manufacturing process, This array chip 1 is used in the form of a VCSEL array chip package which is mounted in a TO can (2).

Such array chips are formed by repeating the same single devices, and all the semiconductor processes are manufactured through one single chip fabrication, array chip fabrication, or almost the same process only with masks in the process.

A glass window 3 for protecting the array chip 1 while transmitting infrared light is provided on the upper portion of the VCSEL array chip package and a glass window 3 and an array chip 1 There is a stem 4 to be installed.

The VCSEL array chip 1 may not be a square array as shown in FIG. 1 and may have various structures. For example, instead of a 10 x 10 square array structure, a 9 x 11 rectangular array structure is also possible.

Considering the required light output (preferably about 0.5 W of pure optical output power) and beam pattern conditions, the LEDs are placed first in the metal PCB in the space of the PAR-38 and PAR-56, A VCSEL array chip TO can package is mounted and an FR4 PCB is mounted on a substrate having a good thermal conductivity using an appropriate TIM (Thermal Interface Material) material, And a VCSEL array chip package for infrared LEDs and infrared rays will be placed in the PAR-38 and PAR-56 appliances provided with the power supply.

For example, as shown in FIG. 2, visible light-emitting LEDs 7 are arranged in a columnar shape on a metal PCB 6 and a single VCSEL array chip package 8 for infrared rays are arranged on an FR4 PCB 9 It is also possible that LEDs 7 are arranged on one side and a single infrared VCSEL array chip package 8 on the other side is arranged on the FR4 PCB 9 as in Fig. The VCSEL array chip packages 8 are arranged on the FR4 PCB 9 in the center by arranging the infrared light sources in a plurality of packages of less than 2 and less than 10 by reducing the array chip size as shown in FIG. (FIG. 5) in which the VCSEL array chip packages 8 are arranged on the FR4 PCB 9 (FIG. 4 and FIG. 5 show the use of two packages).

In order to maintain the output and the beam pattern customized according to the signal control conditions of the airport and the infrared camera sensing sensitivity in the VCSEL array chip package structure, in the present invention, preferably, the single chip 5 of the infrared VCSEL light source, The active area size is within 5 to 50 μm, the spacing between single chips 5 is about 5 to 250 μm, and the array chip size is 5 × 5 in case of single chip spacing In the case of a maximum of 30 x 30 arrays, about 155 um x 75 um to 7550 um x 7550 um according to a single chip interval. However, in reality, the most widely used array chip size is about 1000 um x 1000 um to 2000 um x 2000 um.

1, the VCSEL array chip package has a structure in which it is mounted in a TO Can type package of a TOF6 to TO9 type stem 4 and a glass window 3 type widely used in optical communication Cooling by TEC (Thermo Electric Cooler) is preferable. However, if the optical output of the VCSEL array provides the necessary output for induction when it is driven without TEC according to the airport conditions, .

In building the lamp of the present invention, a hybrid type module in which an infrared semiconductor VCSEL array chip package is installed together with a visible light LED package is mounted on the same PCB on the same heat sink to form the same lamp fixture (PAR-38 It is also possible to attach the adaptive heat sink to the VCSEL array chip package separately using a thermal grease or a thermal pad, It is also possible to use a screw or a clamp to fix the heat sink to the same PCB or the same FR4 PCB.

In order to precisely match the beam pattern required in the airport guidance, etc., it is also possible to have a structure in which the lens 10 is attached to the upper part of the VCSEL light source array chip of each VCSEL array chip built-in Ti can package as shown in FIG. 6 It is also possible to apply it to the outside).

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

For example, in the above description, a VCSEL array chip package formed by arranging a single VCSEL unit light source in the form of an array as shown in FIG. 1 is used. However, in the present invention, instead of arranging the single VCSEL unit light sources in an array form, VCSEL chip packages formed by arranging them are also possible.

Claims (15)

In the takeoff and landing light of an airport runway,
An LED package including LEDs emitting visible light;
A lens for an LED attached to an upper portion of the LED to precisely match a beam pattern range required for a visible light source in an airport runway take off and landing induction,
A VCSEL chip package that emits infrared rays in the range of 1300 to 2400 nm and arranges and packages a single VCSEL unit light source;
A substrate for visible light on which the LED package is disposed;
An infrared ray substrate on which the VCSEL chip package is disposed;
A power supply for supplying power to the LED package and the VCSEL chip package;
A substrate for visible light, a substrate for infrared rays, and an apparatus in which the power supply device is disposed,
The VCSEL chip package may include a glass window for transmitting the infrared light of the infrared semiconductor laser package to protect the VCSEL chip package and a tiocan can type having the glass window and the stem on which the VCSEL chip package is installed Take-off light of airport runway which is built in package. The method according to claim 1,
Wherein the VCSEL chip package is a VCSEL array chip package in which the VCSEL unit light sources are arrayed and packaged. The method according to claim 1,
Wherein the LED is a white light LED or a green light LED. The method according to claim 1,
Wherein said mechanism is a PAR-38 mechanism. The method according to claim 1,
Wherein said device is a PAR-56 device. 3. The method of claim 2,
Wherein the structure of the VCSEL array chip is a structure in which the chips of the single VCSEL unit light source are arranged in a rectangular array of 5 x 5 to 30 x 30. The method according to claim 6,
Wherein an active area of the single VCSEL unit light source chip is 5 to 50 μm or less and an interval of the single VCSEL unit light source chips is 5 to 250 μm. 3. The method of claim 2,
Further comprising a lens for a VCSEL array chip package attached to an upper portion of the VCSEL array chip package in order to precisely match a beam pattern range required for an infrared light source in takeoff and landing of an airport runway or the like. 9. The method of claim 8,
Wherein the VCSEL array chip package performs TEC cooling. The method according to claim 1,
Wherein the visible light ray substrate and the infrared ray substrate are the same PCB. The method according to claim 1,
Wherein the adaptive heat sink is separately attached to the VCSEL chip package using thermal grease or a thermal pad. The method according to claim 1,
Wherein the substrate for visible light is a metal PCB. 13. The method of claim 12,
Wherein the substrate for infrared rays is an FR4 PCB, and the FR4 PCB is attached to an upper surface of the metal PCB. The method according to claim 1,
Wherein at least one VCSEL chip package is disposed on the substrate for visible light and the LED packages are arranged on the substrate for visible light around the substrate for infrared light, Take off landing light of airport runway. The method according to claim 1,
Characterized in that the infrared substrate is disposed on one side of the visible light ray substrate and at least one VCSEL chip package is disposed on the infrared ray substrate and the LED packages are disposed on the other visible light ray substrate. Takeoff landing lights.

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