KR20170010240A - substrate mounting light emitting diode module and converter - Google Patents

Abstract

A substrate with an LED module and a converter mounted thereon, according to the present invention, comprises: a resin layer; an LED circuit including an element-mounted circuit which is formed on the upper surface of the resin layer and in which an LED lead is soldered, and an L-L circuit in which the LED lead is not soldered; a connection circuit formed on the upper surface of the resin layer and extend integrally with the LED circuit; an LED having the LED lead which is soldered to the LED circuit so as to mount the LED on the LED circuit, and which emits light upon receiving current; a converter which is disposed on the upper surface of the resin layer with the LED circuit formed, electrically connected to the connection circuit, and spaced apart from the LED circuit and the LED, and which includes a semiconductor-mounted circuit in which an element lead is soldered, and a converter-converter circuit in which the element lead is not soldered; and a terminal circuit which is disposed on the upper surface of the resin layer, and spaced apart from the LED circuit and the LED, and which extends integrally with the converter. According to the present invention, it is advantageous in that: production processes and distribution costs are reduced by etching the LED circuit, the converter circuit, the connection circuit, and the terminal circuit on a single substrate, and mounting the LED and the semiconductor element; and circuit parts that are not soldered are applied with a mask ink and coated with a flux coating material, thereby preventing the circuit from being oxidized.

Description

[0001] The present invention relates to an LED module and a converter mounting substrate,

The present invention relates to an LED module and a converter mounting type substrate, and more particularly, to an LED module and a converter mounted on the same surface of a single substrate, in which an LED module and a converter are electrically connected And an LED module and a converter mounting type substrate which do not require a space for accommodating a converter.

As the technology related to light emitting diodes (LEDs) rapidly developed, white LEDs emitting white light by using blue LEDs and phosphors appeared. Such white LEDs are extremely small in size compared to conventional light sources, It is an environmentally friendly illumination light source that does not use mercury and discharge gas and is a promising alternative to existing illumination light sources because it has low power, has a long life span, does not emit harmful waves such as ultraviolet rays, and does not use mercury and discharge gas.

Recently, as the era of low carbon green growth has come, international green environment movement has been developed. In line with these international trends, the Korean government has established a 5-year green growth plan and actively supports it.

Of these low-carbon, green growth sectors, LEDs are in the spotlight as products that meet the trend of low-carbon green growth due to high conversion efficiency of light, low mercury consumption and low carbon dioxide emission.

The LED is widely used for a general lighting, a building decoration, a mood, a vehicle, a traffic light, an indoor and outdoor electric signboard, a guidance light, a warning light, a light source for various security devices, and a light source for sterilizing or disinfecting.

In general, LED lighting equipment is widely used as a main lighting device because it is able to control the brightness of the LED by changing the current supplied based on a constant voltage by converting AC into DC.

Looking at the prior art substrate,

Korean Patent Laid-Open Publication No. 10-2010-0029540 An LED light source having a constant current circuit portion and a light emitting unit mounted on the same substrate, an LED lighting device including the same, and a manufacturing method thereof (March 17, 2010) A metal substrate on which a constant voltage circuit portion for supplying a constant voltage to the light emitting unit is mounted; A light emitting unit including at least one LED chip mounted on a surface of the metal substrate and having a plurality of LED chips mounted thereon; And a constant current circuit unit formed on the surface of the metal substrate and supplying a constant current to the light emitting unit and connected to the plurality of light emitting units one at a time in the same number as the light emitting units, A circuit pattern is formed of a conductive material on the upper surface of the substrate, and the entire surface of the metal substrate except for the electrode, the soldering area, the LED chip mounting area, and the like is coated with a protective film such as solder resist.

The conventional art has a problem that a shape of a metal substrate is not freely formed by a light emitting unit because a plurality of LEDs are mounted as a light emitting unit composed of one unit,

In addition, the above-described conventional technique has a problem that the constant current circuit portion is mounted for each light emitting unit, and the size of the metal substrate is increased due to the constant current circuit portion.

In addition, in the related art, when a circuit to which a protective film such as a solder resist is applied is exposed to the atmosphere, that is, when the protective film is damaged, the circuit is oxidized when the circuit is exposed to the atmosphere.

In addition, since the converter is separate from the metal substrate and is installed inside the control box or inside the body of the LED streetlight, the converter and the metal substrate are separately manufactured, .

In addition, the conventional art has a problem in that the structure for electrically connecting the constant current circuit portion to the light emitting unit is deficient and the light emitting unit is not turned on.

In addition, since the conventional technique has a structure in which the constant current circuit portion is mounted on the top surface of the protective film such as a solder resist, there is a problem that the current circuit portion is not electrically connected to the light emitting unit even though the current circuit portion is mounted on the metal substrate.

Further, the above-described conventional technology has a problem that it can not be used in a lighting device for a sink for a long length due to the size of a metal substrate.

In addition, since the metal substrate and the converter are separately assembled and assembled into the finished product of the LED bulb, the conventional technique has a problem in that the production process is increased and the productivity is decreased.

In addition, when the female connector and the male connector for connecting the metal substrate and the converter are separately provided, if the coupling part of the female connector or the male connector is defective, there is a problem that the LED illumination device is not turned on.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a semiconductor device, a semiconductor device, and a method of manufacturing the same, It is not necessary to provide an electrical connection between the LED module and the converter in the production of the finished product, thereby eliminating the need for a separate space for accommodating the converter in the LED lighting and eliminating the problems caused by the electrical connection between the LED module and the converter. There is provided an LED module and a converter mounting type substrate for use in an LED illumination lamp.

The LED module and the converter mounting substrate according to the present invention include a resin layer; An LED circuit formed on an upper surface of the resin layer; A connection circuit formed on the upper surface of the resin layer and extending integrally with the LED circuit; An LED which is formed by an LED lead soldered to the LED circuit so that the LED is mounted on the LED circuit; A converter configured on the top surface of the resin layer in which the LED circuit is formed and electrically connected to the connection circuit and spaced apart from the LED circuit and the LED; And a terminal circuit formed on the upper surface of the resin layer and spaced apart from the LED circuit and the LED and extending integrally to the converter.

Further, the present invention is characterized in that the converter comprises a converter circuit integrally extended to the connection circuit and formed on the upper surface of the resin layer, and a converter circuit which is mounted on the converter circuit and attenuates and absorbs the instantaneous overvoltage or surge current of the applied AC, To a direct current or to convert an applied current into a power supply voltage suitable for an LED illumination or to convert an input current into a current suitable for a light source of an LED illumination.

In addition, the present invention constitutes an element lead which allows the semiconductor element to integrally protrude from the element body and to be soldered to the converter circuit without passing through the converter circuit, so that the semiconductor element is mounted on the converter circuit.

Further, according to the present invention, the LED circuit is constituted by a small-circuit circuit in which an LED lead is soldered and an EL-EL circuit in which an LED lead is not soldered; Wherein the converter circuit is constituted by a semi-sealed circuit in which element leads are soldered and a convolution circuit in which element leads are not soldered; The mask ink is applied to the upper surface of the resin layer in which the circuit and the circuit are not formed except for the portion where the connector is to be soldered in the EL-EL circuit, the cone circuit, the connection circuit and the terminal circuit.

Further, in the present invention, the surface to which the mask ink is applied is coated with a flux coating material.

The present invention has the effect of increasing the productivity by decreasing the process of manufacturing the alloy and the converter substrate by simultaneously etching the LED circuit, the converter circuit, the connection circuit and the terminal circuit on one substrate.

In addition, the present invention has the effect of reducing the production cost and the logistics cost of the converter substrate by mounting the semiconductor elements of the LED and the converter on one substrate at the same time.

Further, the present invention has the effect that the length of the lead of the semiconductor element used in the converter is shortened and precision production is achieved by constituting the converter on the upper surface of the substrate.

In addition, the present invention eliminates the need for components such as a separate connector for electrical connection between the LED module and the converter, and eliminates the problem of defective operation due to electrical connection between the LED module and the converter.

In addition, the present invention is applicable to a circuit except for a portion to be soldered in an LED circuit, a converter circuit, a connection circuit, and a terminal circuit, in which a flux coating material is coated after a mask ink is applied, It has an effect of preventing the oxidation of the catalyst.

In addition, when the present invention is applied to an LED lighting for a sink, a separate converter is not required, so that the length of the main body is shortened and the finishing plate of a long opaque material is not required.

1 is a plan view of an LED module and a converter mounting type substrate of the present invention;
2 is a sectional view of an LED module and a converter mounting substrate of the present invention;
3 is a cross-sectional view of the substrate before mounting the LED module and the converter of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

The present invention is characterized in that the LED module 50, the converter 60, the connection circuit 70 and the terminal circuit 80 are mounted on one substrate 1, And a connection circuit (not shown) for connecting the terminal circuit 80 to the external power supply, that is, the LED circuit 51, the converter circuit 61, and the LED circuit 51 and the converter circuit 61 70 and the terminal circuit 80 are formed on one substrate 1 and the LED 52 is mounted on the LED circuit 51 and the semiconductor element 62 is mounted on the converter circuit 61 to be used for LED illumination An LED module and a converter mounting type substrate 1.

The substrate 1 is a plate for forming an electronic circuit by applying a copper foil to the resin layer 10 and etching an unnecessary portion of the copper foil and a circuit is formed on the upper surface of the resin layer 10 and an LED module 50 and a converter 60 The resin layer 10 is made of a thermally conductive plastic having a thermal conductivity of about 2 W / mK or more, and is made of a thermally conductive acrylo butadiene styrene (ABS) based resin, a liquid crystal polymer (LCP) based resin, (TPSiV) based resin, a polyimide resin, a polyamide 4,6 (PA 4,6) based resin, a polyphenylene sulfide (PPS) based resin, a thermoplastic one ester Component, or a combination thereof.

The substrate 1 is formed into various shapes at once in a specific shape without any special processing by plastic injection molding or compression molding.

The copper foil on one surface of the resin layer 10 and the resin layer 10 is adhered with a ceramic adhesive having a mixture of a fine ceramic powder and an epoxy bonding resin and the adhesive thickness of the ceramic adhesive is 0.05 to 0.18 mm, Is adhered to the resin layer (10).

When the adhesion thickness of the ceramic adhesive is 0.05 mm or less, adhesion between the resin layer 10 and the copper foil is poor, and when the thickness is 0.18 mm or more, there is a problem in transferring heat generated in the LED 52, 10) and the copper foil.

The ceramic adhesive is prepared by mixing 15 to 40 parts by weight of a ceramic powder to which at least one of boron nitride (BN), aluminum nitride (AlN), silver nano powder, tourmaline, mononite, quartz, By weight.

When the amount of the ceramic powder is less than 15 parts by weight, the amount of the ceramic powder is too small to rapidly transfer the heat of the LED 52 to the resin layer 10. If the amount of the ceramic powder is more than 40 parts by weight, 52 are rapidly transferred to the resin layer 10, but it is difficult to bond the copper foil to the resin layer 10. [

The epoxy-bonding resin functions to bond the resin layer 10 and the copper foil. When the epoxy-bonding resin is 60 parts by weight or less, the amount of epoxy is too small to adhere the copper foil to the resin layer 10, It is easy to adhere the copper foil to the resin layer 10, but the drying time is long.

The ceramic powder absorbs the heat generated by the LED 52 and emits the heat to the resin layer 10 so that the heat of the LED 52 is transferred to the resin layer 10 through the ceramic powder, 10 is prevented from being cooled, thereby preventing the temperature of the LED 52 or the resin layer 10 from rising, and the epoxy bonding resin functions to adhere the resin layer 10 to the copper foil.

An LED module 50 is formed on an upper surface of the substrate 1 and an LED module 50 includes an LED 52 and an LED circuit 51. An LED 52 is connected to an LED lead 53, And the LED circuit 51 has a small configuration of the small-scale circuit 51-1 and the L-elecircuit 51-2. The flux coating material 30, the mask ink 20, (40) are further configured.

The LED module 50 is used as a light source of an illumination lamp. The LED module 50 is formed inside a housing of an LED lamp or the like. The LED module 50 includes an LED 52 that emits light by current, .

The LED module 50 modulates the LED 52 and includes an LED circuit 51 having an electrode circuit for electrically connecting the LED 52 and an LED 52 soldered to the LED circuit 51, An LED lead 53 is mounted on the LED circuit 51. When an electric current is passed through a conductive material which emits light by flowing electric current to a compound such as gallium arsenide and emits light and electrodes are attached to the upper and lower electrodes, Has a structure in which positive charge particles are bonded at the center of the electrode to emit photons of light and serves to connect a plurality of semiconductors and semiconductors coated with a fluorescent material to an external substrate and an LED And a LED 52 on which a lead frame 53 and a frame serving as a braid for fixing the semiconductor package to the substrate 1 are formed.

The LED 52 is integrally formed on the LED body and does not extend through the LED circuit 51 but is soldered to the LED circuit 51 to mount the LED 52 on the LED circuit 51, .

The LED circuit 51 is formed in a circuit pattern so as to be suitable for an LED illumination lamp and is connected to an LED 52 mounted on and formed of copper on the upper surface of the resin layer 10 so as to supply power to the power source, As shown in FIG.

The LED circuit 51 includes a small-circuit circuit 51-1 in which the LED lead 53 is soldered and an EL-EL circuit 51-2 in which the LED lead 53 is not soldered, that is, an LED circuit The circuit 51-1 and the LED 52 which are soldered and welded to the LED lead 53 which is mounted integrally on the frame of the LED 52 on which the LED 52 is mounted are not mounted And an EL-elecircuit 51-2 for connecting between the LED 52 and the adjacent LED 52. [

Since the LED circuit 51 is formed by etching the copper foil, the LED circuit 51 is integrally formed on the upper surface of the substrate 1 of the resin layer 10 and is mixed with the fine ceramic powder and the epoxy bonding resin, do.

When the current is high and the voltage is low, the LED circuit 51 is affected by the temperature and other influences. Therefore, when the width of the circuit conductor is reduced or the thickness thereof is reduced and when the current is low and the voltage is high, The converter circuit 61, the connection circuit 70 and the terminal circuit 80 also determine the size of the circuit conductor under the same conditions as the LED circuit 51. [

The connection circuit 70 connects the LED circuit 51 and the converter circuit 61 to apply the current of the converter 60 to the LED module 50 and is connected to the LED circuit 51 And the connection circuit 70 is formed integrally on the upper surface of the substrate 1 of the resin layer 10 and is made of a mixture of fine ceramic powder and epoxy bonding resin And bonded with a ceramic adhesive.

The converter 60 is formed on the upper surface of the resin layer 10 constituted by the LED circuit 51 and is electrically connected to the connection circuit 70 and is spaced apart from the LED circuit 51 and the LED 52, 50 on the upper surface of the resin layer 10,

The converter 60 is connected to the LED module 50 or the LED 52 by the connection circuit 70 to supply power to the LED 52 and to convert the AC current into a DC current suitable for the LED illumination, 50, that is, the converter circuit 61 for driving the LED 52 is constructed.

The converter 60 supplies a direct current to the LED 52 and is electrically connected to the terminal circuit 80 so that the terminal circuit 80 is electrically connected to the power source formed on the outside of the LED illumination lamp do.

The converter 60 includes a converter circuit 61 integrally extended to the connection circuit 70 and formed on the upper surface of the resin layer 10 and an alternating current transient overvoltage or surge applied to the converter circuit 61. [ ) Of a plurality of semiconductor devices 62 for converting attenuated and absorbed currents, converting applied AC into DC, converting an applied current to a power supply voltage suitable for LED illumination, or converting an input current into a current suitable for a light source of LED illumination ).

That is, the converter circuit 61 is composed of a surge absorber for overvoltage protection, a varistor for overvoltage protection, and attenuates and absorbs an instantaneous overvoltage or surge current generated from the applied alternating current, A bridge rectifier composed of a diode or the like to constitute a circuit for converting an AC current into a DC current or a circuit for converting a capacitor and a resistor ), A circuit for generating a power supply voltage to allow the LED light to operate properly, or a circuit for converting an applied current into a current suitable for a light source of an LED light, such as a resistor, (Diac), a silicon controlled rectifier (SCR), a capacitor C ondenser, and resistance to prevent the LED current from being turned on by the low voltage, or by a voltage regulator or the like to attenuate the ripple remaining in the applied direct current And a circuit for attenuating flicker.

The semiconductor device 62 integrally protrudes from a frame and a frame serving as a brace for fixing the semiconductor package to the substrate 1 and serves to connect the semiconductor to the external substrate. The semiconductor device 62 is made of a ferroalloy or a copper alloy A device lead 63 is formed which is made of a metal wire and does not penetrate the converter circuit 61 but is solder welded to the converter circuit 61 so that the semiconductor device 62 is mounted on the converter circuit 61.

The semiconductor device 62 may be a known integrated circuit (IC), a resistor, a capacitor, a diode, a transistor, a photocoupler, Silicon Controlled Rectifire (SCR), Bridge Rectifier. A surge absorber, a phase control trigger Diac, a voltage regulator, and the like, and attenuates and absorbs the instantaneous overvoltage or surge current formed in the converter 60 It is a device used for a circuit protecting the circuit of an LED lighting or the like, and is a device having a relatively small volume, that is, a precision device.

The converter circuit 61 is constituted by a circuit for attenuating and absorbing an instantaneous overvoltage or a surge current of an applied alternating current, a circuit for converting an applied alternating current into a direct current, a capacitor and a resistor A circuit for converting the applied current into a current suitable for the LED illumination, a circuit for preventing the LED illumination from being turned on by the low voltage, In circuit 61-1 in which the element leads 63 are soldered in a circuit or the like for attenuating flicker by attenuating ripples remaining in the element lead 63 and a con- cave circuit 61-2 in which the element leads 63 are not soldered, The converter circuit 61 is constituted by the element lead 63 in which the semiconductor element 62 is mounted and protruded integrally with the frame of the semiconductor element 62 and the half-sealed circuit 61-1 Semiconductor device 6 And a con- verter circuit 61-2 for connecting between the converter 60 and the neighboring converter 60 without mounting the inverter 60 to the inverter 60. [

Since the converter circuit 61 is formed by etching the copper foil, the converter circuit 61 is integrally formed on the upper surface of the substrate 1 of the resin layer 10 and is mixed with fine ceramic powder and epoxy bonding resin and adhered with a ceramic adhesive do.

The terminal circuit 80 is formed on the upper surface of the resin layer 10 and is spaced apart from the LED circuit 51 and the LED 52 and integrally extended to the converter 60, The terminal circuit 80 is integrally formed on the upper surface of the substrate 1 of the resin layer 10 and mixed with the fine ceramic powder and the epoxy bonding resin and adhered with the ceramic adhesive.

A circuit except for the portion where the connector is to be soldered in the EL-EL circuit 51-2, the cone circuit 61-2, the connecting circuit 70 and the terminal circuit 80, and a resin layer 10 is an upper surface of the mask ink 20 which is a part to be soldered in the coating or the LED circuit 51 and a part of the solder in the converter circuit 61, The upper surface of the resin layer 10 in which the circuits and circuits are not formed except for the portions where the connectors are to be soldered in the connecting circuit 70-1 and the connecting circuit 70 and the terminal circuit 80 is formed by applying the mask ink 20, Mask ink 20 is applied to all the surfaces except the portion to be soldered on the upper surface of the resin layer 10. [

The mask ink 20 protects the circuit by coating a permanent ink, which is a persistent petroleum compound having durability under a physical and chemical environment, on a copper foil circuit, and simultaneously protects the circuit with hot solder air leveling (HSAL) This is a solder prevention film to prevent the solder bridge phenomenon between the circuit and the circuit in the soldering process performed during mounting.

The portion where the LED 52, the converter 60 and the connector are coupled to each other, that is, the portion where the LED lead 53, the element lead 63 and the connector are not soldered on the upper surface of the resin layer 10, The mask ink 20 which is a curable ink is applied and the remaining portion thereof is exposed and the portion to which the mask ink 20 is applied is set such that the flux 20 is coated with the flux coating material 20, (30) coating the upper portion of the mask ink (20) with the flux coating material (30).

The soldering portion where the LED 52 is coupled to the surface of the resin layer 10 constituted by the LED circuit 51, the converter circuit 61, the connecting circuit 70 and the terminal circuit 80 is exposed, The circuit 20 on which the mask ink 20 is applied and the mask ink 20 is applied and the surface to which the mask ink 20 is applied is coated with the flux coating material 30 and the flux 20 is coated on the surface of the resin layer 10, The coating material 30 is prevented from being exposed to the atmosphere.

The flux coating material 30 is soldered to protect the top surface of the resin layer 10 from being oxidized in the air in case the circuit is exposed to the atmosphere after the ultraviolet ray curable ink or the mask ink 20 is cured, The mask ink 20 is coated on the portion to which the mask ink 20 is applied.

A circuit in which the mask ink 20 is not applied, that is, a circuit to be soldered, a portion where the connector is soldered in the small-circuit 51-1, the half-circuit 61-1 and the terminal circuit 80 The circuit of the solder mask 40 is applied and the solder mask 40 is mounted on the small-circuit circuit 51-1 and the converter 60 on the semi-closed circuit 61-1 Is applied to the soldering portion to connect the connector to the mounting and terminal circuit 80 so that the soldering portion is not oxidized even if exposed to the atmosphere.

The solder mask 40 is electrically connected to the LEDs 52 and the converter 60 in the circuits of the portions where the connectors are soldered in the small-circuit 51-1, the half-circuit 61-1, And the solder portion to be soldered with the connector are coated with the solder mask 40 so that the circuit of the soldered portion is not exposed to the atmosphere so that the circuit of the soldered portion is not oxidized in the atmosphere .

The solder mask 40 is formed on the upper surface of the resin layer 10 to protect a portion that does not require soldering and to protect the solder-resist, the photo-sensitive soldering resist ).

The solder 90 is printed on the cream-like solder 90 in advance by soldering the LED lead to the small-circuit circuit and bonding the semiconductor element to the semi-sealed circuit and soldering to the resin layer substrate, Reflow soldering for joining and bonding the resin layer substrate to the surface of the circulating solder 90 by wave soldering and forcibly circulating warm air in the furnace to raise the temperature of the resin layer substrate It can be carried out in a hot air soldering method in which soldering is performed.

Therefore, the LED circuit 51, the converter circuit 61, the connection circuit 70 and the terminal circuit 80 are simultaneously etched on one substrate 1, and the LEDs 52, The manufacturing process and the cost of the production are reduced by mounting the semiconductor element 62 at the same time and the length of the element lead 63 of the semiconductor element 62 of the converter 60 is short, And the converter 60 are connected to each other, and the circuit portion which is not soldered is prevented from being oxidized by the application of the mask ink 20 and the coating of the flux coating 30.

In addition, in the case of an LED lamp for a sink that places the converter on the edge of the inside of the body, the application of the present invention enables the use of a relatively small volume of the integrated circuit and the semiconductor device, And the length of the main body is reduced by the length of the finishing plate.

Although the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

Therefore, the scope of the present invention should not be construed as being limited to the embodiments described, but should be determined by equivalents to the appended claims, as well as the appended claims.

1: substrate 10: resin layer
20: mask ink 30: flux coating material
40: solder mask 50: LED module
51: LED circuit 51-1: small-circuit
51-2: El-El Circuit 52: LED
53: LED lead 60: converter
61: Converter circuit 61-1: Semi-
61-2: Cone circuit 62: Semiconductor element
63: element lead 70: connection circuit
80: terminal circuit 90: solder

Claims (5)

A resin layer;
An LED circuit formed on an upper surface of the resin layer;
A connection circuit formed on the upper surface of the resin layer and extending integrally with the LED circuit;
An LED which is formed by an LED lead soldered to the LED circuit so that the LED is mounted on the LED circuit;
A converter configured on the top surface of the resin layer in which the LED circuit is formed and electrically connected to the connection circuit and spaced apart from the LED circuit and the LED;
And a terminal circuit formed on an upper surface of the resin layer and spaced apart from the LED circuit and the LED and extending integrally to the converter.
The method according to claim 1,
The converter is integrally connected to the connection circuit and is mounted on the converter circuit and the converter circuit formed on the upper surface of the resin layer. The converter attenuates and absorbs the instantaneous overvoltage or surge current of the applied alternating current and converts the applied alternating current into direct current Or a plurality of semiconductor elements for converting an applied current into a power supply voltage suitable for an LED illumination or converting an input current into a current suitable for a light source of an LED illumination.
3. The method of claim 2,
Wherein the semiconductor device comprises an element lead which integrally protrudes from the element body and does not penetrate the converter circuit but is soldered to the converter circuit so that the semiconductor element is mounted on the converter circuit.
The method of claim 3,
Wherein the LED circuit comprises a small-circuit circuit in which an LED lead is soldered and an EL-EL circuit in which an LED lead is not soldered;
Wherein the converter circuit is constituted by a semi-sealed circuit in which element leads are soldered and a convolution circuit in which element leads are not soldered;
The upper surface of the resin layer on which the circuit and the circuit are not formed is coated with the mask ink, except for the part where the connector is to be soldered in the EL-EL circuit, the cone circuit, the connection circuit and the terminal circuit. Type substrate.
5. The method of claim 4,
Wherein the surface to which the mask ink is applied is coated with a flux coating material.

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