KR20170008055A

KR20170008055A - Cover assembly for protecting a chemical bottle

Info

Publication number: KR20170008055A
Application number: KR1020150099302A
Authority: KR
Inventors: 유재흥; 이진숙
Original assignee: 유재흥; 이진숙
Priority date: 2015-07-13
Filing date: 2015-07-13
Publication date: 2017-01-23
Also published as: KR101746779B1

Abstract

A cover assembly according to an embodiment of the present invention is a cover assembly for protecting a container of a predetermined standard containing chemicals used in a semiconductor process. The cover assembly includes an upper cover, a lower cover, Wherein the upper cover and the lower cover include an area having an inner diameter of 168.2 mm to 171.5 mm so that the container is closely accommodated and the thickness of the upper cover and the lower cover is 0.1 mm to 16.0 mm .

Description

{COVER ASSEMBLY FOR PROTECTING A CHEMICAL BOTTLE}

The present invention relates to a chemical container protective cover assembly, and more particularly, to a chemical container protective cover assembly used in a semiconductor process.

In general, chemicals used in semiconductor manufacturing processes must maintain high purity at all times because their purity is very important. Therefore, glass bottles that are considered to be the safest to maintain high purity are the most used.

The problem here is that the toxic chemical contained in the glass bottle leaks to the outside due to the breakage of the glass bottle and causes direct or indirect contamination of people, equipment, facilities, semiconductor products, etc., There is a great possibility that the skin of the user is directly injured by harmful effects.

In fact, the movements for bonding and removing these glass bottles occur very frequently in a semiconductor manufacturing factory. In such a case, breakage often occurs, which is a problem and has been widely reported by the media.

In recent years, there has been a growing interest in environmental and safety issues. As a result, when a toxic substance is leaked due to cracking of a glass bottle containing a chemical, It is a real necessity to actively respond to the preparation of a countermeasure against it.

Meanwhile, in recent years, attempts have been made to solve the problems of conventional glass bottles by changing the glass bottles to plastic materials. However, in the case of plastic containers, the purity maintenance of the chemical solution by elution is not perfect, Is expected to continue.

As a conventional document which discloses contents preventing the leakage of a chemical solution caused by breakage of a glass when a glass container containing a chemical solution is moved, reference is made to U.S. Patent No. 6,817,485 (November 16, 2004) , Which discloses a method of discharging a high purity chemical from an inner vessel enclosed in a protective pressure vessel.

In this document, a high-purity chemical substance is stably supplied through a liquid discharge pipe disposed inside the inner container, in a state of providing a double structure with a separate protective pressure vessel enclosing the inner container in which the chemical substance is contained , But discloses no structure for the separation of the protective pressure vessel which can expose the inner vessel accommodated in the protective pressure vessel and that the chemical of the protective pressure vessel There is a problem in that no separate measures are disclosed for the method for preventing the leakage of the substance.

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a method and apparatus for cleaning a glass bottle, It is an object to provide a chemical container cover assembly for container protection that minimizes the leakage of chemicals contained in the glass bottle to the outside to prevent adverse effects on the environment.

A cover assembly according to an embodiment of the present invention is a cover assembly for protecting a container of a predetermined standard containing chemicals used in a semiconductor process. The cover assembly includes an upper cover, a lower cover, Wherein the upper cover and the lower cover have an inner diameter of 168.2 mm to 171.5 mm, the container is closely accommodated, and the thickness of the upper cover and the lower cover is 0.1 mm to 16.0 mm.

In addition, the cover assembly according to the embodiment of the present invention may further include a cover connected to the upper side of the upper cover, wherein the cover includes a cap surrounding the upper portion of the container, and a connection portion, .

The connecting portion includes a virgin ring having a cutting groove formed in a circumferential direction and a protruding hole coupled to one end of the virgin ring. The connecting portion of the lid and the upper cover are formed on the connecting portion and the upper cover And can be connected by a coupling protrusion and a coupling groove.

The material of the upper cover, the lower cover or the cover may be selected from the group consisting of Ecozen, Low Density Polyethylene (LDPE), High Density Polyethylene (HDPE), Polypropylene (PP), Polyethylene Terephthalate (PET) , Polycarbonate (PC), acrylonitrile butadiene styrene (ABS), Teflon, and TPE (Thermo Plastic Elastomer).

Here, the binding portion may include a first binding means formed along an arc at a lower end of the upper cover, and a second binding means formed along an arc at an upper end of the lower cover.

One of the first binding means and the second binding means is a protruding binding protrusion and the other is a stepped jaw coupled with the binding protrusion and may further include an O-ring between the binding protrusion and the step jaw .

Here, the upper inner surface of the cap may be provided with a cushioning member which contacts the cap of the container, and at least one cushioning protrusion formed on the inner surface of the upper cover or the lower cover.

The cover assembly for protecting a container according to the present invention as described above has a structure in which the outside of a glass bottle accommodating a chemical substance is constituted by two or more detachable protective members so that breakage of the glass bottle due to impact upon handling or movement by an operator Leakage of the solution to the outside is minimized to prevent adverse effects on the surroundings.

The present invention relates to a photoresist, a DSA (dimentionally stable anode), a BARC, a TARC, an immersion top coating material, a SOD, a SOC, a MFHM, an HMDS, a Thinner (Solvent), a developer, Prevent leakage when the glass bottle containing the high-purity chemical solution is broken.

In addition, the transparent or opaque natural or synthetic resin material that can be processed can be formed of two or more detachable protective members, so that the leakage of chemical substances can be minimized or completely prevented by wrapping the outside of the glass bottle.

1 is a side view of a container protected by a chemical container protective cover assembly according to an embodiment of the present invention.
2 is a side cross-sectional view of a chemical agent container cover assembly according to an embodiment of the present invention, which is worn on a container.
3 is an exploded cross-sectional view of a chemical container cover assembly in accordance with an embodiment of the present invention.
4 is an enlarged cross-sectional view of a lid according to an embodiment of the present invention.
5A is an enlarged cross-sectional view of a binding portion according to an embodiment of the present invention.
5B is an enlarged cross-sectional view of a binding portion according to another embodiment of the present invention.
6 is an exploded cross-sectional view of a cover assembly according to another embodiment of the present invention.

It is to be understood that the specific structural or functional description of embodiments of the present invention disclosed herein is for illustrative purposes only and is not intended to limit the scope of the inventive concept But may be embodied in many different forms and is not limited to the embodiments set forth herein.

The embodiments according to the concept of the present invention can make various changes and can take various forms, so that the embodiments are illustrated in the drawings and described in detail herein. It should be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms disclosed, but includes all modifications, equivalents, or alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms may be named for the purpose of distinguishing one element from another, for example, without departing from the scope of the right according to the concept of the present invention, the first element may be referred to as a second element, The component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like are used to specify that there are features, numbers, steps, operations, elements, parts or combinations thereof described herein, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Each block or step may represent a portion of a module, segment, or code that includes one or more executable instructions for executing the specified logical function (s). It should also be noted that in some alternative embodiments, the functions mentioned in the blocks or steps may occur out of order. For example, two blocks or steps shown in succession may in fact be performed substantially concurrently, or the blocks or steps may sometimes be performed in reverse order according to the corresponding function.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings attached hereto.

1 is a side view of a container protected by a chemical container protective cover assembly according to an embodiment of the present invention.

The chemical agent container 1 shown in FIG. 1 may be a chemical agent container 1 containing a high-purity chemical such as a photoresist or a DSA (Dimensionally Stable Anode) used in a semiconductor process.

In general, the chemical container (1) used in the semiconductor process must be fixed to a certain standard since it is used by being fastened to semiconductor equipment. The size of the chemical container (1) is designed to be filled with a capacity of about 3.7 gallons (gal), about 3.7854 liters. As shown in FIG. 1, the chemical container 1 is manufactured to have a height of 313.5 mm and a maximum diameter of 168 mm to 168.2 mm.

As we have seen, the chemical container 1 is made of glass. The chemical container (1) of Fig. 1 made of a glass container can be broken due to handling debris during transportation, and the contents of the chemical container (1) will leak if broken.

Leakage of the chemical may cause the semiconductor process itself to stop, and most of the time it is harmful chemical to the human body.

2 is a side cross-sectional view of a chemical agent container protective cover assembly according to an embodiment of the present invention worn on a chemical agent container.

3 is an exploded cross-sectional view of a chemical container protective cover assembly according to an embodiment of the present invention.

As shown in FIGS. 2 and 3, the chemical container protection cover assembly according to the embodiment of the present invention is a cover assembly for protecting a chemical container of a predetermined size containing chemicals used in a semiconductor process, The upper cover 100 and the lower cover 200 are connected to each other by a coupling part 300 formed on the upper cover 100 and the lower cover 200, Has a sectional inner diameter of 168.2 mm to 171.5 mm, the chemical container is closely accommodated, and the thickness of the upper cover 100 and the lower cover 200 is 0.1 mm to 16.0 mm.

In addition, the chemical container protective cover assembly according to the embodiment of the present invention further includes a cover 400 connected to the upper side of the upper cover 100.

The upper cover 100 is connected between the lower cover 200 and the cover 400 to surround the upper portion of the chemical container and protects the chemical container. In addition, a handle (not shown) may be formed on the upper portion of the upper cover 100, and two or more knobs (not shown) may be formed on symmetrical positions.

The lower cover 200 surrounds the lower part of the chemical container and completely closes the bottom surface of the upper part of the chemical container and extends to the end of the container and is sealed through the upper cover 100 and the coupling part 300. A transparent display window (not shown) for checking the level of the container can be formed in the lower cover 200 in the height direction.

The upper cover 100 and the lower cover 200 may be formed to have inner diameters of 168.2 mm to 171.5 mm in cross-sectional inner diameter. The binding portion 300 to which the upper cover 100 and the lower cover 200 are connected is formed in a portion having the largest outer diameter of the container in each portion of the chemical container.

If the inner diameter of the upper cover 100 and the lower cover 200 is less than 168.2 mm, the chemical container can not be inserted into the standard (one gallon container) of the chemical container used in the semiconductor process, , The chemical container can be easily inserted, but the chemical container is shaken inside the cover assembly, so that there is a risk of breakage.

If the cover assembly is to be removed again when mounted on a semiconductor process line, it will take time to separate the cover assembly from the chemical container and the chemical container may eventually break down during the separation.

The upper cover 100 and the lower cover 200 may be made of a plastic material such as Ecozen, Low Density Polyethylene (HDPE), High Density Polyethylene (HDPE), Polypropylene (PP), Polyethylene terephthalate (PET), acrylic resin, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), Teflon, and TPE (Thermo Plastic Elastomer). The cover 400 to be described below may also be a material such as the upper cover 100 or the lower cover 200.

Such a material is a material that is not easily dissolved by the chemicals stored in the container even if breakage of the chemical container occurs, and is a plastic having a relatively large difference in solubility from the chemical used in the semiconductor process.

The thickness of the upper cover 100 and the lower cover 200 may be 0.1 mm to 16.0 mm. If the thickness of the upper cover 100 and the lower cover 200 is less than 0.1 mm, the chemicals may be leaked by the glass fragments caused by the breakage of the chemical container. If the thickness exceeds 16.0 mm, It is not possible to mount chemical containers on semiconductor process lines without separation.

The binding portion 300 is a region to which the upper cover 100 and the lower cover 20 are connected. The binding portion 300 includes a first binding means formed along an arc at a lower end of the upper cover 100 and a second binding means formed along an arc at an upper end of the lower cover.

The binding unit 300 will be described in detail with reference to FIGS. 5A and 5B.

The lid 400 is connected to the upper side of the upper cover 100 to seal the upper part of the chemical container. The cover 400 includes a cap 410 surrounding an upper portion of the chemical container and a connection portion 420 that is an area where the upper cover 100 is connected.

4 is an enlarged cross-sectional view of a lid according to an embodiment of the present invention.

4, the lid 400 includes a cap 410 and a connecting part 420. The connecting part 420 includes a virgin ring 422 having a cutting groove 423 cut in a circumferential direction, And a protruding hole 424 coupled to one end of the virgin ring 422. The connection part 420 is formed with a coupling protrusion 425 and can be coupled with and fixed to the coupling groove 125 formed at the upper end of the upper cover 100. Conversely, And a binding protrusion may be formed on the upper cover 100. [

When a force is applied to the protruding hole 424 in the state where the protruding hole 424 formed in the connection part 420 is held by the finger, the virgin ring 422 is removed by the cutting groove 423 formed in the circumferential direction The upper cover 100 and the cover 400 are separated.

The lid 400 has a cap 410 attached to the lid portion of the chemical container to protect the lid 400 from the risk of leaking. When the lid 400 is used, It is possible to separate the upper cover 100 from the upper cover 100 more easily.

The connecting portion 420 may be formed with a connecting portion lead 426 so that the upper end portion of the upper cover 100 can be hermetically accommodated. (100) is connected, it is prevented from being depressed or easily separated in the direction of the container, and the shape can be maintained.

5A is an enlarged cross-sectional view of a binding portion according to an embodiment of the present invention.

The binding unit 300 is formed in a structure in which the first binding unit formed at the lower end of the upper cover 100 and the second binding unit formed at the upper end of the lower cover 200 are coupled to each other, One of the second binding means may be a protruding coupling protrusion 320 and the other may be a stepped jaw 310 coupled to the coupling protrusion 320. [ And may further include an O-ring 330 between the step jaw 310 and the coupling protrusion 320.

5A, the binding unit 300 according to the embodiment of the present invention includes the stepped jaw 310 as the first binding unit and the binding protrusion 320 as the second binding unit. However, The present invention is not necessarily limited thereto.

The stepped jaw 310 has a jaw shape protruding outwardly and the coupling protrusion 320 has an oblique cross section so that the coupling of the upper cover 100 and the lower cover 200 is easy, .

5B is an enlarged cross-sectional view of a binding portion according to another embodiment of the present invention.

5B, the binding unit 300 'includes a first binding unit formed at a lower end of the upper cover 100 and a second binding unit formed at a lower end of the lower cover 200, similarly to the previous embodiment, .

The first binding means is formed at the lower end of the upper cover 100 and has a protrusion and a groove formed therein. The first binding means is a structure for receiving and securing the second binding means formed at the upper end of the lower cover 200 Body 310 'and a binding lead 330'.

The second binding means is formed at the upper end of the lower cover 200 and has protrusions and grooves as in the first binding means. The second binding means is formed by the housing binding body 310 ' And an insertion coupling body 320 'inserted into the insertion coupling body 320'.

That is, the binding portion 300 'according to another embodiment of the present invention is coupled to the protruding portion and the groove formed corresponding to the receiving binding body 310' and the insertion binding body 320 ' 'To prevent the upper cover 100 from being pushed in the container direction.

6 is an exploded cross-sectional view of a cover assembly according to another embodiment of the present invention.

As shown in FIG. 6, a plurality of buffer protrusions 150 and 250 may be formed on the inner surface of the upper cover 100 and the lower cover 200 of the cover assembly according to another embodiment of the present invention. The buffering protrusions 150 and 250 function to prevent the movement of the container due to the minute gap that may be formed between the chemical container and the cover assembly.

It also serves to mitigate the impact between the chemical container and the cover assembly.

The upper surface of the cap 410 may be provided with a buffer member 450 for contacting the cap of the chemical container to mitigate the impact applied to the cap.

As a result, the buffering protrusions 150 and 250 and the buffering member 450 can be prevented from moving up and down the chemical container in the cover assembly, thereby preventing or mitigating the impact that may be caused between the chemical container and the cover assembly.

1 through 3, the chemical container 1 is inserted into the lower cover 200. As shown in FIG. The upper cover 100 is formed on the upper cover 100 and the second binding means formed on the lower cover 200 by approaching the upper cover 100 from the upper portion of the chemical container 1 in a state where the lower cover 200 is inserted A force is applied in the insertion direction of the upper cover 100 so that the first binding means is hermetically fixed. The lid 400 connected to the upper portion of the upper cover 100 may be connected in advance.

When the binding portion 300 between the upper cover 100 and the lower cover 200 is hermetically fixed, a sealing tape (not shown) may be wound along the outer surface of the binding portion 300 to seal it again. Such a sealing tape may be, but is not necessarily limited to, a masking tape.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation inlamaccording to the specific embodiments of the invention. It will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the appended claims.

100 upper cover 200 lower cover
300 binding portion 310 stepped chin
320 coupling protrusion 330 O-ring
400 cover 410 cap
420 connection

Claims

1. A cover assembly for protecting a container of a predetermined standard containing a chemical used in a semiconductor process,
And a binding portion formed in a region where the upper cover and the lower cover are connected,
Wherein the upper cover and the lower cover include an area having an inner diameter of 168.2 mm to 171.5 mm and the container is closely accommodated and the thickness of the upper cover and the lower cover is 0.1 mm to 16.0 mm. .

The method according to claim 1,
And a lid connected to the upper side of the upper cover,
The cover comprising: a cap surrounding an upper portion of the container; And
And a connection portion that is an area to which the cover and the upper cover are connected.

3. The method of claim 2,
Wherein the connecting portion comprises a virgin ring having a cut groove cut in a circumferential direction; And
And a protruding hole coupled to one end of the virgin ring,
Wherein the connecting portion of the cover and the upper cover are connected to the connecting portion and the coupling protrusion formed on the upper cover by a coupling groove.

3. The method of claim 2,
The material of the upper cover, the lower cover or the cover is selected from the group consisting of Ecozen, Low Density Polyethylene (LDPE), High Density Polyethylene (HDPE), Polypropylene (PP), Polyethylene Terephthalate (PET) Wherein the cover assembly comprises any one selected from the group consisting of carbonates (PC), acrylonitrile butadiene styrene (ABS), Teflon, and TPE (Thermo Plastic Elastomer).

The method according to claim 1,
Wherein the binding portion includes a first binding means formed along an arc at a lower end of the upper cover and a second binding means formed along an arc at an upper end of the lower cover.

6. The method of claim 5,
Wherein one of the first binding means and the second binding means is a protruded binding protrusion and the other is a stepped jaw coupled with the binding protrusion and further includes an O ring between the binding protrusion and the step jaw Cover assembly.

3. The method of claim 2,
A cushioning member contacting the cap of the container is attached to the upper inner surface of the cap,
And at least one buffer protrusion formed on the inner surface of the upper cover or the lower cover.