KR20160150443A - Silicon wafer crushing device - Google Patents

Abstract

The present invention relates to a silicon wafer crusher capable of uniformly crushing a silicon wafer to fill it with a raw material during an ingot growing process.
The present invention relates to a lower plate on which a silicon wafer is mounted; An upper plate adapted to be engaged with the upper side of the lower plate; A cylinder for raising and lowering the upper plate to collide with the lower plate; And an upper / lower uneven portion provided on the contact surfaces of the upper and lower plates, respectively.

Description

[0001] Silicon wafer crushing device [0002]

The present invention relates to a silicon wafer crusher capable of uniformly crushing a silicon wafer to fill it with a raw material during an ingot growing process.

Generally, silicon wafers are made by melting polycrystalline silicon, growing them into monocrystalline ingots, cutting the ingots, and various surface polishing and deposition processes.

Silicon wafers which do not have desired characteristics due to various factors can be produced during such processes, and techniques for utilizing silicon wafers have been proposed.

Korean Patent No. 786722 discloses a method and system for recycling a silicon wafer to remove a pattern and an oxide film deposited on the surface of a silicon wafer using a sandblast method.

However, there is a problem that it is difficult to guarantee the quality or the quality of the silicon wafer because the conventional technology is a method of directly recycling the silicon wafer.

Therefore, in order to produce silicon wafers of desired characteristics, existing silicon wafers are crushed and used as a raw material in the ingot growing process. In this case, an operator directly shreds a silicon wafer using a hammer.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a conventional silicon wafer piece broken by a hammer; FIG.

When the operator directly crushes the silicon wafer using the hammer, it is crushed into a nonuniform shape of the silicon wafer piece as shown in Fig.

As described above, as the operator breaks the silicon wafer with the hammer, the working efficiency is lowered, and the crushed pieces are discarded in the form of crumbs.

In addition, when pieces of silicon wafer crushed in a nonuniform shape are introduced into a tube-shaped raw material supply device for use as a raw material during the progress of the ingot growing process, there is a problem that it is difficult to supply the raw material smoothly .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a silicon wafer crusher capable of uniformly crushing a silicon wafer to be filled with a raw material during an ingot growing process.

The present invention relates to a lower plate on which a silicon wafer is mounted; An upper plate adapted to be engaged with the upper side of the lower plate; A cylinder for raising and lowering the upper plate to collide with the lower plate; And an upper / lower uneven portion provided on the contact surfaces of the upper and lower plates, respectively.

The silicon wafer crushing apparatus according to the present invention is capable of simultaneously and uniformly crushing a plurality of silicon wafers while the silicon wafer is placed on the lower plate and the upper plate and the lower plate are collided with each other so that the upper / have.

Therefore, by simultaneously crushing a plurality of silicon wafers, it is possible to increase the working efficiency and prevent the wastes from being crushed, thereby improving the productivity.

In addition, a uniform piece of silicon wafer can be smoothly supplied through the raw material supply device while the ingot growing process is in progress, so that it can be reused as a raw material in the ingot growing process.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a view of a conventional silicon wafer piece broken by a hammer;
2 is a view showing a silicon wafer crushing apparatus according to the present invention.
Fig. 3 is a view showing an upper plate and an upper uneven part applied to Fig. 2; Fig.
4 is a view showing a silicon wafer piece broken by a silicon wafer breaking apparatus according to the present invention.

Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings. It should be understood, however, that the scope of the inventive concept of the present embodiment can be determined from the matters disclosed in the present embodiment, and the spirit of the present invention possessed by the present embodiment is not limited to the embodiments in which addition, Variations.

FIG. 2 is a view showing a silicon wafer crushing apparatus according to the present invention, and FIG. 3 is a view showing an upper plate and an upper uneven part applied to FIG.

2 to 3, the silicon wafer crushing apparatus according to the present invention includes upper and lower plates 110 and 120, a cylinder 130, upper / lower convex and concave portions 140 and 150, and a plurality of guides 160 .

The lower plate 110 and the upper plate 120 are flat plate-like frames, and may be made of SUS or Al in the embodiment.

Of course, the upper plate 120 is installed to be engaged with the upper side of the lower plate 110, and a plurality of holes 121, through which the guides 160 can be fitted, are provided at corners of the upper plate 120 do.

In addition, a predetermined partition (not shown) may be provided between the upper and lower plates 110 and 120 to prevent the silicon wafer from being exposed to the outside even if the silicon wafer is crushed, and the silicon wafer or its entrance / And may be provided on the lower plate 110.

The cylinder 130 is connected to the upper side of the upper plate 120 so that the upper plate 120 can be raised or lowered. In the embodiment, a pneumatic cylinder or a hydraulic cylinder may be used.

The upper and lower convex and concave portions 140 and 150 are provided on the upper surface of the lower plate 110 and the upper and lower convex and concave portions 150 are provided on the lower surface of the upper plate 120, And may be made of a tungsten alloy in the embodiment.

At this time, the upper and lower concave-convex portions 140 and 150 have a plurality of concave and convex portions 141 and 151 arranged at a predetermined distance d. The concave and convex portions 141 and 151 have a pointed shape toward the end, In the embodiment, the vertical cross section of the concavities and convexities 141 and 151 may be variously configured in a triangular shape, a conical shape, or the like, but is not limited thereto.

When the upper and lower plates 110 and 120 are in proximity to each other, the concave and convex portions 141 of the lower concave and convex portion 140 and the concave and convex portions 151 of the upper convex and concave portion 150 are engaged with each other, (140, 150) are arranged such that the concavities (141, 151) are shifted from each other in the vertical direction.

In the embodiment, the upper and lower irregularities 140 and 150 are preferably formed such that the spacing d of the irregularities 141 and 151 is 4 cm or less so that the silicon wafer piece is crushed to at least 2 cm or less. 141, 151) may be adjusted.

The guides 160 are provided to guide the upward / downward movement of the upper plate 120. In the embodiment, the guides 160 are formed as four bars fixed on the corner of the lower plate 110.

Therefore, after the holes 121 of the upper plate 120 are fitted in the guides 160, the upper plate 120 is moved up and down along the guides 160.

In order to prevent excessive collision between the upper and lower concave and convex portions 140 and 150, a separate stopper (not shown) may be formed on the guides 160 so that the holes 121 of the upper plate 120 may be hooked But is not limited thereto.

A process of crushing a silicon wafer by the above-configured silicon wafer crusher will be described below.

The upper plate 120 is guided by the guides 160 and then moved to the next position adjacent to the lower plate 110 by driving the cylinder 130 after the silicon wafer to be reused is placed on the lower uneven portion 140, , And returns.

At this time, the upper / lower convex and concave portions 140 and 150 are strongly collided, and as the concave and convex portions 141 and 151 are meshed with each other, the silicon wafer positioned therebetween is broken. The silicon wafer is crushed to a uniform size by the structure of the biting.

Therefore, it is possible to increase work efficiency and productivity by automating the operation of crushing the silicon wafer.

4 is a view showing a piece of silicon wafer broken by a silicon wafer crusher according to the present invention.

When the silicon wafer is crushed using the silicon wafer crushing apparatus of the present invention, it is crushed into a uniformly shaped silicon wafer crust as shown in FIG. 4, and compared with the pieces of the silicon wafer crushed by the hammer by an existing worker, The volume appears to be much smaller.

As described above, the pieces of silicon wafer which are crushed in a uniform size are collected and supplied smoothly as a raw material during the ingot growing process, whereby the silicon wafer of desired characteristics and quality can be reproduced.

110: lower plate 120: upper plate
130: cylinder 140: lower concave-
150: upper concave / convex portion 160: guide

Claims (5)

A lower plate on which a silicon wafer is mounted;
An upper plate adapted to be engaged with the upper side of the lower plate;
A cylinder for raising and lowering the upper plate to collide with the lower plate; And
And an upper / lower uneven portion provided on the abutting surfaces of the upper and lower plates. The method according to claim 1,
Wherein the upper and lower concave-convex portions are formed so as to have a sharp edge toward the end of each of the concavities and convexities. The method according to claim 1,
Wherein the upper / lower convexo-concave portions are arranged so that the irregularities of the upper and lower convexo-concaves are shifted from each other in the vertical direction. The method according to claim 1,
And the upper / lower convexo-concave portion is formed with a concavo-convex interval of 4 cm or less. 5. The method according to any one of claims 1 to 4,
And a plurality of guides guiding the upward / downward movement of the upper plate.

Images