KR20160144854A - Method for fabricating receptacle connector - Google Patents

Abstract

According to an embodiment of the present invention, disclosed is a manufacturing method of a receptacle connector which comprises the following steps of: injection-molding a first insulator including a first contact array and a mid-plate by using a first injection-molding machine; injection-molding a second insulator including the first insulator and a second contact array by using a second injection-molding machine; coupling an RFI pad to the second insulator; and inserting the second insulator into a shell wherein the RFI pad is coupled to the second insulator.

Description

[0001] METHOD FOR FABRICATING RECEPTACLE CONNECTOR [0002]

The present invention relates to a method of manufacturing a receptacle connector. More specifically, the present invention relates to a method of manufacturing a receptacle connector capable of reducing the defect rate of the receptacle connector.

More recently, details of the new USB specification, type-c USB connector, have been published at IDF (Intel Developer Forum). The C-type USB connector has a size similar to that of the USB 2.0 Micro-B and has the advantage of being easy to attach and detach the plug connector regardless of the direction of connection of the plug connector. In addition, the C type USB connector has transmission speed of 10Gbps which is twice as fast as conventional USB 3.0 and can supply power up to 100W, so it is expected to be used in various fields.

The C type USB receptacle connector includes a large number of components such as a first contact array, a second contact array, and a mid plate, and an effective process for manufacturing a C type USB receptacle connector using these components is not provided . Therefore, there is a need for an effective manufacturing process capable of ensuring the performance of the C-type USB receptacle connector.

An embodiment of the present invention aims at reducing the defect rate of the receptacle connector.

Further, one embodiment of the present invention aims to improve the durability of the receptacle connector.

Further, an embodiment of the present invention aims at facilitating taking out of the receptacle connector determined to be defective during manufacturing of the receptacle connector.

A method of manufacturing a receptacle connector according to an embodiment of the present invention includes:

Using a first injection molding machine, a first insulator including a first contact array and a mid plate; Injecting a second insulator comprising the first insulator and the second contact array using a second injection molding machine; Coupling an RFI pad to the second insulator; And inserting a second insulator with the RFI pad coupled into the interior of the shell.

The step of injecting the first insulator may include positioning the first contact array attached to the first carrier and the midplate attached to the second carrier in the first injection molding machine.

The first contact array includes a contact portion for providing a contact with a contact array of a corresponding plug connector and a mounting portion mounted on a PCB, the first carrier being mounted on a mounting portion of the first contact array .

The first contact array may include a plurality of surface mounting contacts and a plurality of deep soldering contacts, and the first carrier may be attached to the mounting portion of the plurality of surface mounting contacts.

The plurality of surface mounting contacts and the plurality of deep soldering contacts may be fixedly connected to each other via a tie.

The step of injecting the first insulator may include cutting a tie connecting the contacts constituting the first contact array to each other through a cut groove formed in at least one of an upper surface and a lower surface of the injected first insulator, ). ≪ / RTI >

Wherein the cutting step includes cutting the tie a plurality of times in regions between each of the contacts making up the first contact array, wherein the first region of the regions between each of the contacts And the tie positioned in the second area adjacent to the first area may not be cut together in the same cutting step.

Wherein the first carrier includes an upper protection terminal located above the uppermost end of the contacts constituting the first contact array and a lower protection terminal located below the lowermost end of the contacts constituting the first contact array Terminal.

When the first contact array and the mid plate are positioned in the first injection molding machine, the first carrier and the second carrier can be positioned facing each other.

The step of injecting the first insulator may include removing the first carrier adhered to the injected first insulator and the first one of the second carriers.

Wherein the step of injecting the second insulator further comprises positioning a first insulator attached to the second carrier and a second contact array attached to a third carrier with the second injection molding machine, When the insulator and the second contact array are located in the second injection molding machine, the second carrier and the third carrier can be positioned facing each other.

The manufacturing method of the receptacle connector may further include removing the second carrier and the third carrier attached to the injected second insulator.

The manufacturing method of the receptacle connector may further include the step of inspecting the injected first insulator for a defect and marking a defect on the second carrier attached to the first insulator identified as defective.

The step of injecting the second insulator includes injecting the second insulator using the injected first insulator and a second contact array attached to the third carrier, May include coupling the RFI pad only to a second insulator that is not badly marked with the second carrier.

Wherein the first contact array is constituted by a plurality of surface mounting contacts and a plurality of deep soldering contacts, wherein the first insulator is provided with a plurality of fixing portions for fixedly supporting each of the mounting portions of the plurality of deep soldering contacts, .

The step of injecting the second insulator may include injecting the second insulator such that the molding material of the second injection molding machine is not attached to the mounting portions of the plurality of deep soldering contacts.

The manufacturing method of the receptacle connector may further include inspecting the manufactured receptacle connector by inserting the second insulator into the shell.

The defect inspection of the receptacle connector may include inspection of a mating portion performed through a camera located in front of the receptacle connector, inspection of a vertical flatness of a contact performed through a camera located on a side of the receptacle connector, And a horizontal flatness test of a contact performed through a camera located at a predetermined position.

The step of injecting the second insulator may include injecting the second insulator so that the molding material of the second injection molding machine is not attached to the front portion of the tongue portion of the first insulator.

At least one of the upper surface and the lower surface of the second insulator may have a support groove for fixing the first insulator when the second insulator is injected.

At least one of the upper surface and the lower surface of the second insulator may have a support groove for fixing the second contact array when the second insulator is injected.

The second insulator can be engaged with the shell while the coupling protrusion formed on the upper surface is fastened to the coupling groove formed on the inner surface of the shell.

The step of bonding the RFI pads may include attaching a first sub RFI pad to one side of the tongue portion of the second insulator; And attaching a second sub RFI pad to the other surface of the tongue of the second insulator.

Wherein at least one of the first sub RFI pad and the second sub RFI pad has an engaging groove corresponding to the protrusion of the mid plate protruding out of the second insulator, The protrusions and the coupling grooves may be welded and electrically connected to each other.

A guide groove may be formed in the first insulator to maintain a constant pitch of at least a part of the contacts constituting the first contact array.

The second insulator may be provided with a guide groove for maintaining a constant pitch of at least a part of the contacts constituting the second contact array.

An embodiment of the present invention can reduce the defect rate of the receptacle connector by making the positions of the respective components not to deviate from their original positions when manufacturing the receptacle connector.

Further, an embodiment of the present invention can improve the durability of the receptacle connector.

Further, an embodiment of the present invention can facilitate the taking out of the receptacle connector determined to be defective while manufacturing the receptacle connector.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention.
2 is a view showing a procedure of a method of manufacturing a receptacle connector according to an embodiment of the present invention.
Fig. 3 (a) is a plan view of a first contact array attached to a first carrier, and Fig. 3 (b) is a plan view of a mid plate attached to a second carrier.
4 (a) is a perspective view of a first contact array attached to a first carrier, and Fig. 4 (b) is a side view of a first contact array attached to a first carrier.
5 is a perspective view of the injected first insulator.
6 is a view for explaining the cutting process of the tie in detail.
Fig. 7 is a view for explaining a step of making a bad mark on the second carrier of the first insulator. Fig.
8 (a) is a bottom view of the first insulator, and Fig. 8 (b) is a perspective view of the first insulator viewed from the lower direction.
9 (a) is a front view showing the contacts of the mold and the first contact array of the first injection molding machine when the first insulator is injected, and Fig. 9 (b) Lt; / RTI > is a front view according to another embodiment showing the contacts of the mold of the molding machine and the first contact array.
10 is a rear view showing the molds of the first injection molding machine and the contacts for deep soldering of the first contact array when the first insulator is injected.
11 is a top view of a second contact array attached to a third carrier;
12 is a plan view of a second insulator attached to a second carrier and a third carrier;
Fig. 13 (a) is a perspective view of the second insulator seen from the upper direction, and Fig. 13 (b) is a perspective view of the second insulator viewed from the lower direction.
14 is a view showing a state in which an RFI pad is coupled to a second insulator.
15 (a) is a view for explaining a process of inserting a second insulator into a shell, and FIG. 15 (b) is a perspective view of a receptacle connector according to an embodiment of the present invention.
16 is a sectional view of a plug connector connectable to a receptacle connector according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In this specification, 'forward' means the direction in which the plug connector is positioned to engage with the receptacle connector, and 'rear' means the opposite direction to the front.

1 is a view showing the components of a receptacle connector according to an embodiment of the present invention. The type of the components of the receptacle connector shown in Fig. 1 is one example, and it is apparent to those skilled in the art that some of the components shown in Fig. 1 may be omitted or changed to other components, May be added.

Referring to FIG. 1, a receptacle connector according to an embodiment of the present invention includes a first insulator body 110, a first contact array 130, a mid plate 150, a second insulator body 210, (230), a shell (300), and an RFI pad (400).

The first insulator body 110 includes a first contact array 130 and a mid plate 150 to form a first insulator 100 (see FIG. 5). The first insulator 100 is formed by molding the first contact array 130 and the mid plate 150 in the first insulator body 110 by an injection molding method. That is, after the first contact array 130 and the mid plate 150 are inserted and fixed in a first injection molding machine (not shown), molding material is injected into the mold of the first injection molding machine to perform injection molding have. At this time, the first insulator body 110 may be formed by curing a molding material injected into the first injection molding machine, for example, a plastic resin.

The material of the first contact array 130 and the mid plate 150 may be, for example, a conductive metal. The contacts 131 of a part of the first contact array 130 may have a surface mount structure and the other portions of the contacts 131 may have a deep soldering structure.

The second insulator body 210 includes the first insulator 100 and the second contact array 230 to form a second insulator 200 (see FIG. 12). The second insulator 200 is formed by molding the second contact array 230 and the first insulator 100 in the second insulator body 210 by an injection molding method. That is, after inserting and fixing the second contact array 230 and the first insulator 100 in a second injection molding machine (not shown), molding material is injected into the mold of the second injection molding machine to perform injection molding . At this time, the second insulator body 210 can be produced by hardening a molding material injected into the second injection molding machine, for example, a plastic resin.

The material of the second contact array 230 may be, for example, a conductive metal. All the contacts 231 of the second contact array 230 may have a surface mount structure.

The first contact array 130 and the second contact array 230 are arranged such that a plurality of contacts 131 and 231 are spaced apart from each other by a predetermined distance in the column direction of the second insulator 200, It can be mounted on a PCB while providing electrical contacts.

Specifically, a rear area of the first contact array 130 and the second contact array 230, which are exposed to the outside through the bottom surface of the second insulator 200, are mounting parts 130a and 230a mounted on the PCB, The front regions of the first contact array 130 and the second contact array 230 exposed frontward of the two insulators 200 are the contact portions 130b and 230b that provide electrical contacts with the contact arrays of the plug connectors.

The mid plate 150 is positioned between the first contact array 130 and the second contact array 230. The mid plate 150 is used to block interference between a signal flowing through the first contact array 130 and a signal flowing through the second contact array 230. For example, the mid plate 150 may cause the signal to flow to ground rather than to the second contact array 230 when the signal flowing through the first contact array 130 is diverted.

In addition, the mid plate 150 may have a coupling protrusion 152. The engaging projections 152 and the corresponding projections 12 of the plug connector 10 shown in Fig. 16 engage with each other to engage the receptacle connector and the plug connector 10 with each other. Specifically, the engaging projections 152 engage with the corresponding projections 12 of the plug connector 10, while engaging or disengaging the plug connector 10, when the plug connector 10 is engaged with or disengaged from the receptacle connector. As shown in FIG. Thereby, the user can be made aware of whether the plug connector 10 is correctly coupled to the receptacle connector or correctly separated from the receptacle connector.

The mid plate 150 is positioned between the first contact array 130 and the second contact array 230 so that the first contact array 130 and the second contact array 230 among the second insulators 200, The second contact array 230 and the mid plate 150 are strengthened in the region (tongue region) where the contact portions 130b and 230b of the first contact array 130, the second contact array 230, It can also play a role.

The shell 300 is made of a metal material and accommodates the second insulator 200 in the rear. In addition, the shell 300 may be mounted on the PCB through the solder 310 while accommodating the second insulator 200 therein.

The RFI pad 400 blocks signal interference that may occur between the contact arrays 130 and 230 during transmission and reception of signals through the first contact array 130 and the second contact array 230. Specifically, if a high-speed signal flows through the first contact array 130 and the second contact array 230, a signal flowing through one of the contacts may affect a signal flowing to the other contact. The RFI pad 400 connected to the ground can prevent the interference between the contacts when the signal flowing through one of the contacts is diverted by flowing the diverted signal to the RFI pad 400 instead of the other contact.

2 is a view showing a procedure of a method of manufacturing a receptacle connector according to an embodiment of the present invention.

First, in step S210, the first insulator 100 including the first contact array 130 and the mid plate 150 is injected using a first injection molding machine. The first injection molding machine includes a mold corresponding to the shape of the first insulator body 110. The first injection molding machine includes molding material in the mold with the first contact array 130 and the mid plate 150 positioned in the mold, For example, after the plastic resin is injected, the first insulator 100 may be injected by an insert molding method.

The first contact array 130 and the mid plate 150 can be positioned in the first injection molding machine using the first carrier 140 and the second carrier 160, Will be described later.

In step S220, the second insulator 200 including the first insulator 100 and the second contact array 230 is injected using a second injection molding machine. The second injection molding machine includes a mold corresponding to the shape of the second insulator body 210. The molding material is injected into the mold while the first insulator 100 and the second contact array 230 are positioned in the mold, For example, after injecting the plastic resin, the second insulator 200 may be injected by an insert molding method.

The second contact array 230 can be placed in the second injection molding machine by using the third carrier 240, which will be described later with reference to FIG.

In step S230, the RFI pad 400 is coupled to the injected second insulator 200. The RFI pad 400 may be formed on the rear region of the contact portions 130b and 230b of the first contact array 130 and the second contact array 230, for example, the tongue portion of the second insulator 200 ). ≪ / RTI >

In step S240, the second insulator 200 coupled with the RFI pad 400 is inserted into the interior of the shell 300 to manufacture a receptacle connector.

The method of manufacturing a receptacle connector according to an embodiment of the present invention includes the steps of forming five types of contacts (first contact array 130, second contact array 230, mid plate 150, RFI (The first insulator 100 and the second insulator 200) formed by the injection molding machine (e.g., the pad 400 and the shell 300) and the injection molding machine can be used to effectively manufacture the receptacle connector.

Hereinafter, the injection process of the first insulator 100 and the shape of the first insulator 100 will be described in detail with reference to FIGS. 3 to 10. FIG.

3 (a) is a plan view of the first contact array 130 attached to the first carrier 140, FIG. 3 (b) is a plan view of the mid plate 150 attached to the second carrier 160, 4A is a perspective view of the first contact array 130 attached to the first carrier 140 and FIG. 4B is a side view of the first contact array 130 attached to the first carrier 140. FIG. 4A is a perspective view of the first contact array 130 attached to the first carrier 140, to be.

When the first contact array 130 and the mid plate 150 are placed in the first injection molding machine, the first carrier 140 attached to the first contact array 130 and the first carrier 140 attached to the mid plate 150 2 carrier 160 may be used. The first carrier 140 and the second carrier 160 are positioned in the first injection molding machine when the first contact array 130 and the mid plate 150 are placed in the first injection molding machine, And the mid plate 150, respectively.

Referring to FIG. 3 (a), the first carrier 140 may be attached to the end of the mounting portion 130a of the first contact array 130, as seen in the first carrier 140. Specifically, the first contact array 130 is composed of a plurality of contacts 131, and a part of the contacts 131 of the plurality of contacts 131 are surface mounting contacts 133, The remaining contacts 131 may be contacts 132 for dip soldering. At this time, the first carrier 140 may be attached to the mounting portion 130a of the surface-mounting contacts 133. [

Deep soldering is done in such a way that the contacts penetrate the PCB and the surface mount is the way the surfaces of the contacts and the surface of the PCB are welded so that the ends of the deep soldering contacts 132 extend in the direction towards the PCB, And the end portions of the surface mounting contacts 133 extend in the rearward direction. At this time, by attaching the first carrier 140 to the end portion of the mounting portion 130a of the surface mounting contacts 133, the shape of the first carrier 140 can be simplified. Specifically, in order to attach the end face of the portion 142 (see FIG. 4 (a)) of the first carrier 140 connected to the contacts and the end face of the deep soldering contacts 132 to each other, When the first carrier 140 is connected to the mounting portion 130a of the surface mounting contacts 133, the connecting portion 142 of the connecting portion 140 may be bent upward or downward. However, It is not necessary to bend the bushing 142.

Since the first carrier 140 is attached only to the surface mounting contact 133 excluding the deep soldering contact 132 among the contacts 131 of the first contact array 130, Each contact 131 may be connected to each other by a tie 134 to maintain a constant pitch.

3 (b), a second carrier 160 is attached to the mid plate 150, wherein the first carrier 140 is located behind the first contact array 130, while the second carrier 160 160 may be positioned in front of the mid plate 150. Accordingly, when the first contact array 130 and the mid plate 150 are positioned in the first injection molding machine so as to form the first insulator, the first carrier 140 and the second carrier 160 move in directions opposite to each other Lt; / RTI >

On the other hand, the first carrier 140 includes a contact protection terminal 145 for protecting the first contact array 130. The contact protection terminal 145 prevents the shape of the first contact array 130 from being deformed by collision of the first contact array 130 with another object in the upward direction or the downward direction. 4 (a) and 4 (b), the contact protection terminal 145 is formed to cover the upper portion of the contact 131, which is located above the uppermost end of the contacts 131 constituting the first contact array 130, A terminal 146 and a lower protective terminal 147 located below the lowermost end of the contacts 131 constituting the first contact array 130. [

5 is a perspective view of the injected first insulator 100, FIG. 6 is a view for explaining the cutting process of the tie 134 in detail, and FIG. 7 is a view for explaining the cutting process of the second insulator 100 of the first insulator 100, Fig. 7 is a view for explaining a step of displaying a defective mark on a substrate.

5, when the first carrier 140 is attached to the first contact array 130 and the second carrier 160 is attached to the mid plate 150, The injection takes place.

When the first insulator 100 is injected, the first carrier 140 and the first one of the second carriers 160 are removed. The reason why only the first carrier 140 is removed is that the second insulator 200 is removed from the second carrier 140 by removing the second carrier 140 from the second carrier 140, So that the contact array 230 is placed on top of the first insulator 100.

A cutting groove 101 may be formed in the first insulator 100 corresponding to the position of the tie. When the first insulator 100 is injected, the ties 134 are cut through the cutting grooves 101 formed on at least one of the upper and lower surfaces of the first insulator 100. Since each of the contacts 131 constituting the first insulator 100 performs a function independent of each other, there is no need for the contacts 131 to be connected to each other.

In order to protect the contacts 131 of the first contact array 130, the cutting process may be performed a plurality of times. 6, the ties 134 connect the contacts 131 to each other in the regions 135 between the contacts 131, wherein the ties 134 located in the first region 135a, The ties 134 located in the second region 135b adjacent to the first region 135a are not cut together in the same cutting process. Instead, the ties 134 located in the first area 135a and the ties 134 located in the third area 135c can be cut together in the same cutting step. When the tie 134 located in the first region 135a and the tie 134 located in the second region 135b are cut together, a gap is formed between the first region 135a and the second region 135b This is because the contact 131a, which is positioned at a certain position, is pressurized, so that the shape of the contact 131a, which is not supported at all by the tie 134, can be deformed.

When the first carrier 140 and the tie 134 are removed from the first insulator 100, it can be determined whether the first insulator 100 is defective or not. For example, the first insulator 100 may be inspected with a camera to determine the position of the first contact array 130, the pitch of the contacts of the first contact array 130, the location of the midplate 150, Whether or not it is removed.

If it is determined that the first insulator 100 is defective, the second mark 160 attached to the first insulator 100 may become a bad mark 162, as shown in FIG. In general, a plurality of first carriers 140 and second carriers 160 are continuously connected to each other so that the first insulator 100 is continuously injected, and the first insulator 100 1 carrier 140 is removed. It is difficult to immediately take out the first insulator 100 determined to be defective in the first insulator 100 continuously injected (the second insulators 100 connected to each other for the extraction of the first insulator 100) ), And a failure indication (162) is made on the second carrier (160) attached to the first insulator (100) determined to be defective for the next takeout.

8 (a) is a bottom view of the first insulator 100, and FIG. 8 (b) is a perspective view of the first insulator 100 viewed from the lower direction. 9 (a) is a front view showing the mold of the first injection molding machine and the contacts of the first contact array 130 when the first insulator 100 is injected, and Fig. 9 (b) According to another embodiment showing the contacts of the mold of the first injection molding machine and the first contact array 130 when the mold 100 is injected. 10 is a rear view showing the molds of the first injection molding machine and the deep soldering contacts 132 of the first contact array 130 when the first insulator 100 is injected.

8A and 8B, the first insulator 100 is provided with guide grooves 103 for maintaining the pitches of the contacts of the first contact array 130 at a constant level ) May be provided. When the first insulator 100 is injected, the first injection molding machine may include a mold 900 including a protrusion 910 corresponding to the shape of the guide groove 103. The protrusion 910 may include a molding material It is possible to prevent the contacts 131 of the first contact array 130 from being bent in the left and right directions. For example, as shown in Figs. 8 (a) and 8 (b), when the guide groove 103 is located only in the vicinity of the contact 131 located at the first edge, The protrusion 910 corresponding to the guide groove 103 can be positioned in the mold 900 of the first injection molding machine. Depending on the embodiment, the projections 910 may be positioned between the contacts 131, as shown in Fig. 9 (b).

8 (a) and 8 (b), the first insulator 100 is provided with a plurality of deep soldering contacts 132 for fixing the mounting portions 130a of the plurality of deep soldering contacts 132, A first portion 105 may be formed. Each of the plurality of fixing portions 105 fixes and supports a plurality of deep soldering contacts 132 so that the ends of the plurality of deep soldering contacts 132 are accurately directed downward. The first injection molding machine may include a mold provided with a plurality of grooves 1010 corresponding to each of the plurality of deep soldering contacts 132. The molding material is injected into the region 1030 between the mold 1000 shown in Fig. 10 and the plurality of deep soldering contacts 132, and the hardened molding material can form the fixing portion 105. [

Hereinafter, the injection process of the second insulator 200 and the shape of the second insulator 200 will be described in detail with reference to FIGS. 11 to 13. FIG.

11 is a plan view of the second contact array 230 attached to the third carrier 240 and Fig. 12 is a plan view of the second insulator 200 attached to the second carrier 160 and the third carrier 240. Fig. to be. Fig. 13 (a) is a perspective view of the second insulator 200 viewed from the upper direction, and Fig. 13 (b) is a perspective view of the second insulator 200 viewed from the lower direction.

11, the second contact array 230 may comprise a plurality of surface-mounting contacts 233, and the second contact array 230 may be attached to the third carrier 240 . Specifically, the third carrier 240 may be attached to the mounting portion 230a of the second contact array 230. In addition, the third carrier 240 may be provided with a contact protection terminal 245 like the first carrier 140.

When the second contact array 230 and the first insulator 100 are placed in the second injection molding machine, the second carrier 160 and the third carrier 240 can be positioned facing each other. 12, it can be seen that the second carrier 160 and the third carrier 240 are located in directions opposite to each other.

13 (a), at least one of the upper surface and the lower surface of the second insulator 200 is provided with a first support 100 for fixing the first insulator 100 when the second insulator 200 is injected, Grooves 203 may be formed. The mold of the second injection molding machine has a protrusion (not shown) corresponding to the shape of the first support groove 203. The protrusions corresponding to the shapes of the first support grooves 203 fixedly support the first insulator 100 so that the shape of the first insulator 100 It can be deformed, or the position can be prevented from being deviated.

At least one of the upper surface and the lower surface of the second insulator 200 may have a second support groove 204 for fixing the second contact array 230 when the second insulator 200 is injected. The mold of the second injection molding machine has a protrusion (not shown) corresponding to the shape of the second support groove 204. The projections corresponding to the shapes of the second support grooves 204 fixedly support the second contact arrays 230 so that the second contact arrays 230 are fixed while the molding material is cured, It is possible to prevent the shape of the light guide plate from being deformed or deviated from its position.

The upper surface of the second insulator 200 is provided with a coupling protrusion 206 and the coupling protrusion 206 can be coupled with a coupling groove formed on the inner surface of the shell 300 to be described later.

13 (a), the second insulator 200 includes a tongue 201 to which a plug connector is coupled. When the second insulator 200 is injected, the molding material is injected into the tongue 201 It can be prevented from being attached to the front portion 202. The front face portion 202 of the tongue 201 is configured such that when the plug connector is coupled to the receptacle connector, the portion of the front end 202 of the tongue portion 201 of the receptacle connector, It is not easy to connect the plug connector to the receptacle connector without generating it). When the molding material for the second insulator 200 is attached to the front portion 202 of the tongue 201, the front portion 202 of the tongue 201 is pressed against the molding material for the first insulator 100 Layer of the second insulator 200, that is, two layers of the molding material for the second insulator 200, the molding material layer for the second insulator 200 can be peeled off by the collision with the plug connector. Thus, the front portion 202 of the tongue 201 is formed solely of the molding material for the first insulator 100 to prevent the front portion 202 of the tongue 201 from being worn.

The guide grooves 205 may be formed on the upper surface of the second insulator 200 to keep the pitches of the contacts of the second contact array 230 at a constant level as described in connection with the first insulator 100. [ The second injection molding machine may have a mold including protrusions corresponding to the shapes of the guide grooves 205 while the molding material for the second insulator 200 is cured while the second contact arrays 230 13 (b), the plurality of fixing portions 105 generated in the injection process of the first insulator 100 are prevented from being bent in the horizontal direction by the second insulator 200, It can be seen that the molding material for the resin is not adhered. This is to simplify the shape of the mold of the second injection molding machine. For example, as described above with reference to Fig. 10, in order to form the plurality of fixing portions 105 corresponding to the mounting portions 130a of the plurality of deep soldering contacts 132, The mold should have grooves 1010 corresponding to a plurality of deep soldering contacts 132, but it is not necessary to provide such grooves in the second injection molding machine.

When the injection of the second insulator 200 is completed, the second carrier 160 and the third carrier 240 attached to the second insulator 200 are removed. 7, since the second carrier 160 of the first insulator 100 determined to be defective has the defective indication 162, it is possible to prevent the defective indication 162 from being attached to the second carrier 160 The second insulator 200 can be taken out and discarded.

The RFI pad 400 is coupled to the second insulator 200 that is taken out and not discarded. 14 is a view showing a state in which the RFI pad 400 is coupled to the second insulator 200. FIG.

As shown in FIG. 14, the RFI pad 400 may include a first sub RFI pad 410 and a second sub RFI pad 430. The first sub RFI pad 410 and the second sub RFI pad 430 are respectively provided with engaging grooves 412 and 440 for engaging with the engaging protrusions 154 of the mid plate 150 protruding from the tongue of the second insulator 200, 432 may be formed.

The first engaging groove 412 of the first sub RFI pad 410 may be attached to one surface of the second insulator 200, for example, the upper surface, while receiving the engaging projection 154. As shown in the figure, the first engaging groove 412 can be embodied with a surface structure that is concave toward the inside facing the engaging projection 154 and convex toward the outside. However, depending on the implementation, the first engagement groove 412 may have the form of a through-hole. When the first engaging groove 412 is a through hole, the engaging projection 154 will be exposed to the outside through the through hole.

After the first sub RFI pad 410 is mounted to the second insulator 200, the second engaging groove 432 of the second sub RFI pad 430 is engaged with the engaging projection 154 or the outwardly convex first engaging groove 432. [ For example, the lower surface of the second insulator 200 while receiving the second insulator 412. As shown, the second engagement groove 432 may have the form of a through-hole. However, depending on the embodiment, the second engagement groove 432 may be recessed inward and may be embodied in a surface structure of an outwardly convex shape.

The engaging projections 154 may be welded to the first engaging grooves 412 or the second engaging grooves 432 to be electrically connected to each other.

15A is a view for explaining the process of inserting the second insulator 200 into the shell 300. When the RFI pad 400 is coupled to the second insulator 200, The second insulator 200 is inserted into the interior of the shell 300 from the rear so that the manufacture of the receptacle connector 500 shown in Fig. 15 (b) can be completed.

The engaging projections 206 (see Fig. 13 (a)) formed on the upper surface of the second insulator 200 can be engaged with the inner side surfaces of the shell 300 and fastened to each other.

When the receptacle connector 500 is manufactured by inserting the second insulator 200 into the inside of the shell 300, a defect inspection of the manufactured receptacle connector 500 can be further performed. The failure inspection for the receptacle connector 500 may be performed by, for example, a mating portion inspection performed through a camera located in front of the receptacle connector 500, a vertical flatness of the contact performed through the camera located on the side of the receptacle connector 500 And a horizontal flatness test of a contact performed through a camera located at the rear of the receptacle connector 500. Here, the mating part inspection is a test for discriminating whether or not the respective components constituting the receptacle connector 5000 are well assembled with each other, and the vertical flatness inspection is performed to determine whether there is a vertically oriented contact among the contacts 131 and 231 And the horizontal flatness inspection is an inspection for judging whether or not a contact bent in the right and left direction among the contacts 131 and 231 exists.

An embodiment of the present invention can reduce the defect rate of the receptacle connector by making the positions of the respective components not to deviate from their original positions when manufacturing the receptacle connector. In addition, an embodiment of the present invention can improve the durability of the receptacle connector and facilitate the taking out of the receptacle connector determined to be defective during manufacturing of the receptacle connector.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100: first insulator 110: first insulator body
130: first contact array 130a:
130b: contact part 131: contact
132: Deep soldering contact 133: Surface mounting contact
134: Tie 140: First carrier
145: Contact protection terminal 150: Mid plate
160: second carrier 200: second insulator
210: second insulator body 230: second contact array
230a: mounting portion 230b: contact portion
231: Contact 233: Contact for deep soldering
240: third carrier 245: contact protection terminal
300: Shell 400: RFI pad
500: receptacle connector

Claims (16)

Using a first injection molding machine, a first insulator including a first contact array and a mid plate;
Injecting a second insulator comprising the first insulator and the second contact array using a second injection molding machine;
Coupling an RFI pad to the second insulator; And
And inserting a second insulator having the RFI pad coupled thereto into the interior of the shell.
The method according to claim 1,
Wherein the step of injecting the first insulator comprises:
Positioning the first contact array attached to the first carrier and the midplate attached to the second carrier in the first injection molding machine; And
Injecting the molding material into the first injection molding machine and injecting the first insulator,
The first contact array includes:
A plurality of surface mounting contacts and a plurality of deep soldering contacts,
Wherein the first carrier comprises:
Wherein the plurality of surface mounting contacts are attached to the mounting portions of the plurality of surface mounting contacts.
3. The method of claim 2,
Wherein the plurality of surface mounting contacts and the plurality of deep soldering contacts are fixedly connected to each other via a tie.
The method of claim 3,
Wherein the step of injecting the first insulator comprises:
And cutting the tie connecting the contacts constituting the first contact array to each other through the cut groove formed in at least one of the upper surface and the lower surface of the injected first insulator A method of manufacturing a receptacle connector.
5. The method of claim 4,
Wherein the cutting step comprises:
And cutting the tie a plurality of times in regions between each of the contacts making up the first contact array,
The tie positioned in the first region of the regions between the contacts and the tie located in the second region adjacent to the first region are not cut together in the same cutting process. Gt;
3. The method of claim 2,
Wherein the first carrier comprises:
And a contact protection terminal composed of an upper protection terminal located above the uppermost end of the contacts constituting the first contact array and a lower protection terminal located below the lowermost end of the contacts constituting the first contact array Wherein the receptacle connector is made of a metal.
3. The method of claim 2,
Wherein positioning the first injection molding machine comprises:
Positioning the first carrier and the second carrier opposite each other,
A method of manufacturing the receptacle connector,
And removing the first carrier attached to the injected first insulator and the first one of the second carriers. ≪ Desc / Clms Page number 19 >
8. The method of claim 7,
Wherein the step of injecting the second insulator comprises:
Further comprising placing a first insulator attached to the second carrier and a second contact array attached to the third carrier in the second injection molding machine such that the second carrier and the third carrier face each other,
A method of manufacturing the receptacle connector,
And removing the second carrier and the third carrier attached to the injected second insulator.
8. The method of claim 7,
A method of manufacturing the receptacle connector,
Further comprising the step of inspecting the injected first insulator for a defect and indicating a defect to the second carrier attached to the first insulator identified to be defective.
The method according to claim 1,
The first contact array includes:
A plurality of surface mounting contacts and a plurality of deep soldering contacts,
In the first insulator,
A plurality of fixing portions for fixing each of the mounting portions of the plurality of deep soldering contacts is formed,
Wherein the step of injecting the second insulator comprises:
And injecting the second insulator so that the molding material of the second injection molding machine is not attached to the mounting portions of the plurality of deep soldering contacts.
The method according to claim 1,
A method of manufacturing the receptacle connector,
Inserting the second insulator into the shell to inspect the manufactured receptacle connector for defects,
In the defect inspection for the receptacle connector,
A vertical flatness inspection of a contact performed through a camera positioned on a side of the receptacle connector and a horizontal operation of a contact performed through a camera located at a rear side of the receptacle connector are performed through a camera located in front of the receptacle connector, And flatness inspection of the receptacle connector.
The method according to claim 1,
Wherein the step of injecting the second insulator comprises:
And injecting the second insulator so that a molding material of the second injection molding machine is not attached to a front portion of a tongue portion of the first insulator.
The method according to claim 1,
At least one of the upper surface and the lower surface of the second insulator,
A support groove for fixing the first insulator is formed when the second insulator is injected,
At least one of the upper surface and the lower surface of the second insulator,
And a support groove for fixing the second contact array is formed at the time of injection of the second insulator.
The method according to claim 1,
The second insulator includes:
And the coupling protrusion formed on the upper surface is fitted to the inner side surface of the shell and is coupled to the shell.
The method according to claim 1,
The step of coupling the RFI pad comprises:
Attaching a first sub-RFI pad to one side of the tongue portion of the second insulator; And
Attaching a second sub RFI pad to the other surface of the tongue portion of the second insulator,
Wherein at least one of the first sub-RFI pad and the second sub-
And an engaging groove corresponding to a protrusion of the mid plate projecting outward from the second insulator,
Wherein when the protrusion is received in the coupling groove, the protrusion and the coupling groove are welded and electrically connected to each other.
The method according to claim 1,
In the first insulator,
A guide groove is formed for maintaining a constant pitch of at least a part of the contacts constituting the first contact array,
In the second insulator,
Wherein a guide groove is formed for maintaining a pitch of at least a part of the contacts constituting the second contact array constant.

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