KR20160137712A - Touch Device And Fabricating Method Thereof - Google Patents

Abstract

The present invention relates to a touch device and a method of manufacturing the same, and more particularly, to a touch device and a method of manufacturing the touch device, And a second insulation layer is formed on the first insulation layer by nanoimprinting to form a connection pattern of the second axial electrode pattern so that the connection pattern is imprinted on the second insulation layer So that reliability and yield can be increased and the thickness thereof can be reduced, and a manufacturing method thereof.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch device and a fabrication method thereof,

The present invention relates to a touch device and a method of manufacturing the same, and more particularly, to a touch device and a method of manufacturing the touch device, And a second insulation layer is formed on the first insulation layer by nanoimprinting to form a connection pattern of the second axial electrode pattern so that the connection pattern is imprinted on the second insulation layer So that reliability and yield can be increased and the thickness thereof can be reduced, and a manufacturing method thereof.

Due to the evolution of smart devices, portable electronic devices such as mobile phones and tablet PCs represented by smartphones, as well as intuitive convenience of input to all electronic devices such as TVs, car navigation systems, computers, As a device, a touch device is widely used.

The touch device includes a resistance film type and an electrostatic capacity type. However, since the resistance film type input device has a two-layer structure of film and glass, and the upper film is pressed to contact the lower glass, And has weak drawbacks over time course variations.

On the other hand, the capacitive input device has the advantage of forming a transparent conductive film on a single substrate and having high durability.

As such a capacitive type input device, there is a surface type which detects an input position by detecting an insufficient current flowing when a capacitor is formed in contact with or close to a finger and applying alternating currents on the same phase and a same potential to both ends of a conductive film of transparency There is a capacitive touch sense type.

There is also a projected capacitive touch sense type in which an electrode pattern is extended in a direction intersecting with each other to detect a change in capacitance between electrodes when a finger or the like is touched to detect an input position.

However, such a conventional touch structure has a structure in which an X-axis sensor pattern, an insulating layer, and a Y-axis sensor pattern are laminated on a substrate.

In addition, since the electrode pattern is a fine unit pattern, when the electrode pattern is formed in a positive pattern, defects are likely to occur due to over-patterning in the manufacturing process, and the production yield is lowered.

The height of the electrode protruding from the substrate is increased, and the resistance increases greatly at the electrode pattern boundary, resulting in a malfunction such as short-circuit, and the operation stability and reliability are degraded.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and to provide a method of manufacturing a semiconductor device having a first axis electrode pattern electrically connected to a second axis electrode pattern on an electrode pattern formed with a first axis electrode pattern and a second axis electrode pattern electrically connected to each other, A second insulating layer is formed on the first insulating layer by nanoimprinting to form a connection pattern of the second axial electrode pattern so that the connection pattern is imprinted on the second insulating layer Which can increase the reliability and yield and reduce the thickness of the touch device, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a touch device including a substrate, a first axis connection pattern connecting the first axis electrode pattern formed on the substrate and the first axis electrode pattern, A first insulating layer electrically insulating the first axial electrode pattern formed on the substrate on which the electrode pattern layer is formed from the second axial electrode pattern; and a second insulating layer formed on the first insulating layer, A second insulation layer formed by imprinting a connection pattern mold for a second axis connection pattern connecting the second axis electrode patterns, and a second axis connection pattern formed on the connection pattern mold .

As described above, the touch device and the method of manufacturing the same according to the present invention can minimize the thickness of the entire touch panel by manufacturing the connection electrodes in an embedded form by imprinting instead of the bridge type, The production yield can be increased by minimizing the defects occurring during the formation process and minimizing the height of the connection electrode by minimizing the height of the connection electrode, thereby achieving an excellent effect of solving the problems of malfunction, short-circuit and stability.

1 is a cross-sectional view schematically showing a touch device according to a preferred embodiment of the present invention,
2 is a step-by-step process diagram for manufacturing the touch device of FIG.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

The touch device defined in the present invention includes a touch window formed separately from a window, as well as a touch window formed integrally with the window.

FIG. 1 is a cross-sectional view schematically showing a touch device according to a preferred embodiment of the present invention, and FIG. 2 is a step-by-step process diagram for manufacturing the touch device of FIG.

Referring to FIG. 1, the touch device according to the present invention includes a substrate 10, a first axis connection pattern connecting the first axis electrode pattern formed on the substrate and the first axis electrode pattern, A first insulating layer 30 electrically insulating the first axis electrode pattern formed on the substrate on which the electrode pattern layer is formed from the second axis electrode pattern, A second insulation layer 40 formed on the second axis connection pattern 510 and formed with a connection pattern mold for imprinting a second axis connection pattern connecting between the second axis electrode patterns and a second axis connection pattern 510 formed on the connection pattern mold ). ≪ / RTI >

Here, the first axial electrode pattern may be formed of one selected axial pattern of the X-axis or Y-axis, and the second axial electrode pattern may be formed of the other axial pattern. Therefore, if the first axial electrode pattern is an X-axis electrode pattern, the second axial electrode pattern is a Y-axis electrode pattern, and conversely, if the first axial electrode pattern is a Y-axis electrode pattern, .

Hereinafter, a method of manufacturing a touch device according to a preferred embodiment of the present invention will be described.

 First, an electrode pattern layer having a first axis electrode pattern 210 and a second axis electrode pattern 220 formed on a substrate 10 is formed.

Here, the substrate 10 may be a window substrate formed integrally with a touch panel, or may be a touch panel substrate formed separately from a window. If the substrate is a window substrate, a decorative or various logo And a light blocking layer for blocking light inside can be formed.

The electrode pattern layer 20 includes a first axis electrode pattern 210 and a second axis electrode pattern 220 and a first axis connecting electrode pattern 211 electrically connecting the first axis electrode patterns. A first axis signal line 230 for sensing and transmitting a signal to the first axis electrode pattern, and a second axis signal line 240 for sensing and transmitting a signal to the second axis electrode pattern.

Accordingly, the electrode pattern layer 20 is formed with all the electrode patterns except for the second axis connecting electrode pattern that electrically connects the second axis electrode pattern.

The electrode pattern layer may be formed by depositing ITO and patterned through a photolithography process, and may be formed through printing.

When the electrode pattern layer is formed as described above, the first insulation layer 30 is formed on the substrate on which the electrode pattern layer is formed.

The first insulating layer 30 is formed using an insulating material to electrically isolate the first axial electrode pattern from the second axial electrode pattern. The material of the UV curable resin, the thermosetting resin, A photolithographic process in the state that an insulating film is formed and an insulating layer is formed only in a space between the first axial electrode pattern and the second axial electrode pattern, The electrical insulation between the axial electrode pattern and the second axial electrode pattern is completed.

When the first insulating layer is formed as described above, a second insulating layer 40 is formed on the substrate, and a connection electrode mold 410 is formed through nanoimprinting to form the second shaft connecting electrode.

More specifically, the substrate is etched through a photolithography process in a state where a second insulating film is formed on the electrode pattern portion and the first insulating layer using an insulating material, and imprinting is performed with a stamp having a pattern corresponding to the second axis connecting electrode pattern, A second insulating layer having a connection electrode mold for a biaxial connecting electrode pattern is formed.

Here, the first insulating layer and the second insulating layer may be formed of the same insulating material (such as a UV-curable resin, a thermosetting resin, and the like, a transparent material, a phosphorescent material, , And an insulating material of different physical properties.

For example, the insulating material of the first insulating layer may be composed of an insulating material that adheres to the ITO (metal) with a function of exerting adherence, and the UV insulating material of the second insulating layer does not adhere to the mask.

The thickness of the first insulating layer and the second insulating layer may be 100 nm to several um.

In the process of forming the second insulating layer, a via hole formed between the second axial electrode patterns is formed through a photolithography process using a second insulating layer as a mask, and then the via hole is connected through nanoimprinting using a stamp The connection is patterned.

Therefore, when the second axis connecting electrode pattern is printed, the second axis connecting electrode pattern is formed at the same height as the second insulating layer, so that the thickness can be made slim, and the second axis connecting electrode pattern is formed in a buried form, It is possible to prevent defects due to the pattern and improve the yield and reliability.

When the second insulation layer having the connection electrode mold is formed as described above, the second axis connection electrode 510 and the pad electrode 520 are formed by printing the metal.

More specifically, the metal may be formed only on the connection electrode mold 410 through the printing process, so that the second axis connection electrode may be formed. In addition, the pad electrode 520 may be printed by squeezing to form the pad electrode 520 at the same time .

The metal may be formed of a conductive material such as metal or ITO, and may have a thickness of 500 nm to several um.

 While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

10: substrate 20: electrode pattern layer
30: first insulation layer 40: second insulation layer
510: second shaft connecting electrode

Claims (1)

A substrate;
An electrode pattern layer including a first axial connection pattern connecting the first axial electrode pattern formed on the substrate and the first axial electrode pattern, and a second axial electrode pattern;
A first insulating layer electrically isolating the first axis electrode pattern formed on the substrate having the electrode pattern layer from the second axis electrode pattern;
A second insulation layer formed on the first insulation layer and formed by imprinting a connection pattern mold for a second axis connection pattern connecting between the second axis electrode patterns;
And a second axis connection pattern formed on the connection pattern mold.

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