KR20160131600A - Super-resolution lens and microscopic apparatus comprising the same - Google Patents
Super-resolution lens and microscopic apparatus comprising the same Download PDFInfo
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- KR20160131600A KR20160131600A KR1020150064408A KR20150064408A KR20160131600A KR 20160131600 A KR20160131600 A KR 20160131600A KR 1020150064408 A KR1020150064408 A KR 1020150064408A KR 20150064408 A KR20150064408 A KR 20150064408A KR 20160131600 A KR20160131600 A KR 20160131600A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/002—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
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- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
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Abstract
Description
The present invention relates to an ultra-high resolution lens and a microscope apparatus including the same, and more particularly, to an ultra-high resolution lens and a microscope apparatus including the same, which enable observation of objects smaller than the diffraction limit to be more practically and easily observed. will be.
In order to recognize the shape of an object, it is necessary to make an image of the object by using light (electromagnetic wave) scattered from the object. Generally, the light scattered by an object has an Evanescent wave and a Propagating wave component whose characteristics are opposite to each other. The disappearing wave has information about the fine space change rather than the wavelength, but it can not make an image since it mostly disappears at a distance of several tens of nanometers or less on the surface of the material after the generation. Generally, images are created by traveling waves. The sharp attenuation of this decaying wave results in a diffraction limit that limits the resolving power of the optical system.
In an optical system for observing objects of small size, the resolving power is a measure of how clearly and clearly the image obtained through the optical system is. For example, the resolution d of an optical system means that when two objects are separated by a distance d or more, the object can be distinguished as being separated using the optical system.
According to general optical theory, it is known that, in an optical system that forms an image of an object using traveling waves, the resolution can not be reduced by more than half of the wavelength of light used for observing an object, regardless of the use of any optical instrument. Therefore, when a general optical microscope that forms an image of an object by irradiating an object with visible light is used, the resolution is limited to 200 nm or less, which is about half the wavelength of purple light, which is the shortest wavelength of visible light. For smaller viruses, monolayers, or biomaterials such as DNA or neurons, an electron microscope that uses electrons of much shorter wavelengths than visible light should be used.
However, the electron microscope has a disadvantage in that it is more complicated to use than the optical microscope, and the cost is much higher than that of the optical microscope. Furthermore, when the object to be observed is an organism, the organism can be killed by the electron beam, and since the specimen to be observed must be made into a solid so as to withstand the vacuum condition of the electron microscope, the organism and the biomaterial can be observed It is impossible to do.
On the other hand, as an improvement measure to overcome the limit of resolution, a technique has been developed in which an extinction wave to be rapidly attenuated is amplified or an extinction wave is converted into a traveling wave to form an image of an object. For example, a hyper-lens can enlarge an image while converting evanescent waves into propagating waves by using an anisotropic meta material in the form of a cylinder. Since the traveling wave has a small amount of attenuation, it is possible to make a distant image which is enlarged far from the rear of the hyper lens, so that an image of an object smaller than the resolution of the visible light ray can be seen. In this case, since the disappearing wave from the object must be incident on the hyper lens before disappearing, the entire surface of the object and the hyper lens must be within several tens of nanometers.
In the conventional hyper lens, the front surface is concave so as to enlarge the image of the object. At this time, in order to enlarge the image of the observation object, the observation object must be accurately placed on the concave portion of the hyper lens. However, since the above-mentioned hyper lens is manufactured to have a diameter of several micrometers, it is difficult to precisely bring the object to be observed to the concave portion of the hyper lens. Accordingly, conventionally, there has been a problem that practicality and convenience of the hyper lens are deteriorated.
Embodiments of the present invention are an ultra-high resolution lens and a microscope apparatus using a hyper lens, and it is an object of the present invention to provide an ultra-high resolution lens and a microscope apparatus using a hyper lens and an ultra high resolution lens improved in practicality and convenience by improving the difficulty and inconvenience of accurately bringing an object to be observed in a small micrometer- And to provide a microscope device that includes a microscope.
According to an aspect of the present invention, the ultra-high resolution lens includes a hyper lens layer capable of forming an image of the observation object using an annihilation wave of light from an observation object placed on one surface, ; And an ultra-high resolution lens that covers the other surface of the hyper lens layer and supports the hyper lens layer, wherein at least when the object to be observed is placed, the one surface of the hyper lens layer forms a plane .
In this aspect, the hyper lens layer includes: a planar auxiliary lens layer having one outer surface on one side; And a main lens layer formed on the other side of the auxiliary lens layer such that at least a part of the outer surface is concave and the concave portion faces the auxiliary lens layer.
In addition, the concave portion may be hemispherical.
The auxiliary lens layer and the main lens layer may be formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately.
Also, the dielectric layer may be titanium oxide, and the metal layer may be silver (Ag).
Also, the dielectric layer may be silicon (Si), and the metal layer may be silver (Ag).
The dielectric layer of the auxiliary lens layer may be made of a material different from the dielectric layer of the main lens layer.
Also, the metal layer may be silver (Ag), the dielectric layer of the auxiliary lens layer may be titanium oxide, and the dielectric layer of the main lens layer may be a material including silicon (Si).
The dielectric layer of the main lens layer may be an amorphous silicon thin film.
The number of dielectric layers and metal layers of the auxiliary lens layer may be different from the number of dielectric layers and metal layers of the main lens layer.
In addition, the auxiliary lens layer is formed by alternately stacking six dielectric layers and seven metal layers, and the main lens layer may be formed by alternately stacking nine dielectric layers and nine metal layers.
The dielectric layer of the auxiliary lens layer has a thickness of 28 nm, and the dielectric layer and the metal layer of the auxiliary lens layer have a thickness of 15 nm, 33 nm, and 66 nm, respectively. nm. < / RTI >
In addition, the main lens layer may be formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately, and the auxiliary lens layer may be a metal layer of silver (Ag).
The dielectric layer and the metal layer of the main lens layer each have a thickness of 15 nm, and the auxiliary lens layer may have a thickness of 50 nm.
Further, the hyper lens layer comprises a main lens layer which is laminated on the substrate in a flat shape on one side of the one outer surface, the substrate is flexible, and after the observation object is placed on the one surface, The one surface of the hyper lens layer may be bent and bent so as to have a concave curved surface.
In addition, the substrate may be formed of any one of polydimethylsiloxane (PDMS) and polyimide.
Further, the surface of the substrate, which is in contact with the hyper lens layer, may be provided with concavities and convexities.
Also, the main lens layer may be formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately, and the dielectric layer may be a silicon (Si) thin film, and the metal layer may be silver (Ag).
The dielectric layer and the metal layer may each have a thickness of 15 nm.
According to another aspect of the present invention, there is provided a light source device comprising: a light source unit for emitting visible light; An ultra-high resolution lens in which an object to be observed is placed on one surface, and light emitted from the light source is incident on the one surface; And an objective lens for condensing the light emitted from the other surface of the ultra high resolution lens, wherein the ultra high resolution lens forms an image of the observation object using an annihilation wave of light from the observation object, A hyper-lens layer capable of enlarging an image of the object; And a substrate for covering the other surface of the hyper lens layer and supporting the hyper lens layer, wherein at least when the object to be observed is placed, the one surface of the hyper lens layer forms a plane.
In this aspect, the hyper lens layer includes: a planar auxiliary lens layer having one outer surface on one side; And a main lens layer formed on the other side of the auxiliary lens layer such that at least a part of the outer surface is concave and the concave portion faces the auxiliary lens layer.
Further, the hyper lens layer comprises a main lens layer which is laminated on the substrate in a flat shape on one side of the one outer surface, the substrate is flexible, and after the observation object is placed on the one surface, The one surface of the hyper lens layer may be bent and bent so as to have a concave curved surface.
The apparatus may further include a shape-deforming portion for holding the substrate in a bent state.
The effects of the ultra-high resolution lens and the microscope apparatus including the ultra high resolution lens according to the present invention will be described as follows.
According to the embodiments of the present invention, it is possible to observe an observation object having a size smaller than the resolving power of the visible light ray through the hyper lens layer using visible light. At this time, the surface on which the observation object is placed in the hyper lens layer is formed as a plane instead of the curved surface, so that the area on the lens where the observation object can be placed can be enlarged. Therefore, when an ultra-high resolution lens and a microscope including the ultra-high resolution lens are used, it becomes remarkably easy to place the object to be observed on the lens, and thus practicality and convenience can be increased.
1 is a configuration diagram of a microscope apparatus according to an embodiment of the present invention.
Fig. 2 schematically shows a cross-sectional view of an example of the first embodiment of the ultra-high resolution lens of Fig. 1;
3 is a perspective view showing the ultra-high resolution lens of FIG.
Fig. 4 schematically shows a cross-sectional view of another example of the first embodiment of the ultra-high resolution lens of Fig. 1;
Fig. 5 shows a method of manufacturing an ultra-high resolution lens according to the first embodiment.
6A to 6C schematically show cross-sectional views of a second embodiment of the ultra-high resolution lens of FIG.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.
In the following description, the front (front) and rear (rear) can be referred to according to the moving direction of light irradiated from the light source portion. For example, when light moves from the first configuration toward the second configuration, the first configuration may be located in front of the second configuration, and the second configuration may be located behind the first configuration. Further, in one configuration, the side on which light is incident may be referred to as a front side, and the side on which light is emitted may be referred to as a rear side.
1 is a configuration diagram of a
1, the
The light source unit (110) irradiates light toward the ultra high resolution lens (200). The
An
Specifically, the
The
If necessary, the
In the present embodiment, when the observation target S is placed on at least one side of the
Here, the surface FS on which the observation object is placed in the
An
The
Conventionally, in order to observe an object smaller than the diffraction limit of visible light, an electron microscope should be used instead of an optical microscope. In the case of an electron microscope, however, it is expensive and inconvenient to use because it must be accommodated in a vacuum chamber and scanned with an electron beam. According to this embodiment, it is possible to effectively observe an observation object S having a size smaller than the diffraction limit of the visible light ray through the
Furthermore, in the present embodiment, the surface FS on which the object to be observed lies on the
According to one embodiment, the
Specifically, the shape-deforming
The
The
Hereinafter,
2 schematically shows a cross-sectional view of an example of an
2 to 4, the
Specifically, the
According to one embodiment, the
For example, the
As another example, the
3, the
Here, the diameter of the hemisphere forming the concave portion is preferably 100 nm, but the size of the concave portion is not limited thereto. When the diameter of the hemisphere is larger than this diameter, the annihilation wave emitted from the rear surface of the
Meanwhile, the
At this time, the observation object S can be placed in close contact with the front surface of the
According to one example, the distance between two concave portions adjacent to each other among the plurality of concave portions may be substantially equal to the diameter of the hemisphere formed by the concave portion. In this case, the plurality of concave portions formed in the
Since the
Specifically, according to one embodiment, the
2 and 3, the
Alternatively, according to the example shown in FIG. 4, the
Although not shown in the figures, according to another embodiment, the
The
Meanwhile, the
The outer surface of the
The supporting
The
5 shows a method of manufacturing the
Referring to FIG. 5, in order to manufacture the
After forming the
The
The
On the other hand, the method of manufacturing the
Alternatively, a method may be used in which the above-described
6A to 6C schematically show cross-sectional views of a
Referring to FIG. 6A, the
Meanwhile, in this embodiment, the
For example, the
In this embodiment, irregularities may be formed on the surface of the
When the
The
The shape deformation and fixing of the
According to the present embodiment, since the
Although the ultrahigh resolution lens and the microscope apparatus including the ultrahigh resolution lens according to the embodiments of the present invention have been described above as specific embodiments, the present invention is not limited thereto, and the present invention is not limited thereto. Range. ≪ / RTI > Skilled artisans may implement a pattern of features that are not described in a combinatorial and / or permutational manner with the disclosed embodiments, but this is not to depart from the scope of the present invention. It will be apparent to those skilled in the art that various changes and modifications may be readily made without departing from the spirit and scope of the invention as defined by the appended claims.
10: microscope device 110: light source
120: objective lens 130:
140: Shape deforming
210: Hyper lens layer 220:
211:
211m: metal layer of the main lens layer 212: auxiliary lens layer
212d: dielectric layer of the
230: Support member S: Observation object
Claims (23)
And a substrate for covering the other surface of the hyper lens layer and supporting the hyper lens layer,
Wherein the one surface of the hyper lens layer forms a plane when at least the object to be observed is placed.
Wherein the hyper lens layer comprises:
An auxiliary lens layer having a flat plate shape with one outer surface forming the one surface; And
And a main lens layer formed on the other side of the auxiliary lens layer such that at least a part of the outer surface is concave and the concave portion faces the auxiliary lens layer.
Wherein the concave portion is a hemisphere type ultrahigh resolution lens.
Wherein the auxiliary lens layer and the main lens layer are formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately with each other.
Wherein the dielectric layer is titanium oxide, and the metal layer is silver (Ag).
Wherein the dielectric layer is silicon (Si), and the metal layer is silver (Ag).
Wherein the dielectric layer of the auxiliary lens layer is made of a material different from the dielectric layer of the main lens layer.
Wherein the metal layer is silver (Ag)
Wherein the dielectric layer of the auxiliary lens layer is titanium oxide,
Wherein the dielectric layer of the main lens layer is a material containing silicon (Si).
Wherein the dielectric layer of the main lens layer is an amorphous silicon thin film.
Wherein the number of dielectric layers and metal layers of the auxiliary lens layer is different from the number of dielectric layers and metal layers of the main lens layer.
Wherein the auxiliary lens layer is formed by alternately stacking six dielectric layers and seven metal layers,
Wherein the main lens layer is formed by alternately laminating nine dielectric layers and nine metal layers.
Wherein the metal layer of the auxiliary lens layer has a thickness of one of 30 nm, 33 nm, and 66 nm, the dielectric layer of the auxiliary lens layer has a thickness of 28 nm,
The dielectric layer and the metal layer of the main lens layer each have a thickness of 15 nm.
Wherein the main lens layer is formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately,
Wherein the auxiliary lens layer is a metal layer made of silver (Ag).
The dielectric layer and the metal layer of the main lens layer each have a thickness of 15 nm,
Wherein the auxiliary lens layer has a thickness of 50 nm.
Wherein the hyper lens layer is composed of a main lens layer laminated on the substrate in a flat form so that one outer surface forms the one surface,
Wherein the substrate is flexible and is fixed in a bent state such that the one surface of the hyper lens layer becomes a concave surface after the observation object is placed on the one surface.
Wherein the substrate is made of any one of polydimethylsiloxane (PDMS) and polyimide.
And an uneven surface is formed on the surface of the substrate which is in contact with the hyper lens layer.
Wherein the main lens layer is formed by stacking a plurality of dielectric layers and a plurality of metal layers alternately,
Wherein the dielectric layer is a silicon (Si) thin film, and the metal layer is silver (Ag).
The dielectric layer and the metal layer each have a thickness of 15 nm.
An ultra-high resolution lens in which an object to be observed is placed on one surface and light emitted from the light source is incident on the one surface; And
And an objective lens for condensing light emitted from the other surface of the ultra high resolution lens,
The ultra-high resolution lens includes:
A hyper lens layer capable of forming an image of the observation object using an annihilation wave of light from the observation object and enlarging an image of the observation object; And
And a substrate for covering the other surface of the hyper lens layer and supporting the hyper lens layer,
Wherein the one surface of the hyper lens layer forms a plane when at least the object to be observed is placed.
Wherein the hyper lens layer comprises:
An auxiliary lens layer having a flat plate shape with one outer surface forming the one surface; And
Wherein at least a part of the outer surface is concave and the concave portion is laminated on the other side of the auxiliary lens layer so as to face the auxiliary lens layer.
Wherein the hyper lens layer is composed of a main lens layer laminated on the substrate in a flat form so that one outer surface forms the one surface,
Wherein the substrate is flexible and is bent and bent so that the one surface of the hyper lens layer becomes a concave surface after the observation object is placed on the one surface.
And a shape deforming unit for holding the substrate in a bent state.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108152941A (en) * | 2017-11-20 | 2018-06-12 | 北京航空航天大学 | High speed optical super-resolution imaging system and method based on micro-nano lens array |
KR20180078714A (en) * | 2016-12-30 | 2018-07-10 | 한국과학기술원 | Super-resolution microscopy and method for generating image using the same |
CN110584713A (en) * | 2019-09-29 | 2019-12-20 | 深圳先进技术研究院 | Super-resolution ultrasonic microscope |
US11150387B2 (en) | 2017-08-11 | 2021-10-19 | Korea Advanced Institute Of Science And Technology | Planar metalens and cover glass including the same |
US11818473B2 (en) | 2020-06-05 | 2023-11-14 | Korea Advanced Institute Of Science And Technology | Ultrathin camera device using microlens array, and multi-functional imaging method using the same |
WO2024101631A1 (en) * | 2022-11-09 | 2024-05-16 | 아이빔테크놀로지 주식회사 | Time-lapse imaging method and device capable of maintaining focus |
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KR20110060404A (en) | 2009-11-30 | 2011-06-08 | 한국전자통신연구원 | Radio wave lens and method of manufacturing the same |
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JP2010249739A (en) * | 2009-04-17 | 2010-11-04 | Hitachi Ltd | Hyper lens and optical microscope system using the same |
JP2013004159A (en) | 2011-06-22 | 2013-01-07 | Sony Corp | Objective lens, lens manufacturing method, and optical drive device |
DE102013203628B4 (en) * | 2013-03-04 | 2020-06-10 | Leica Microsystems Cms Gmbh | Immersion objective for microscopes and its use |
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KR20110060404A (en) | 2009-11-30 | 2011-06-08 | 한국전자통신연구원 | Radio wave lens and method of manufacturing the same |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180078714A (en) * | 2016-12-30 | 2018-07-10 | 한국과학기술원 | Super-resolution microscopy and method for generating image using the same |
US11150387B2 (en) | 2017-08-11 | 2021-10-19 | Korea Advanced Institute Of Science And Technology | Planar metalens and cover glass including the same |
CN108152941A (en) * | 2017-11-20 | 2018-06-12 | 北京航空航天大学 | High speed optical super-resolution imaging system and method based on micro-nano lens array |
CN110584713A (en) * | 2019-09-29 | 2019-12-20 | 深圳先进技术研究院 | Super-resolution ultrasonic microscope |
US11818473B2 (en) | 2020-06-05 | 2023-11-14 | Korea Advanced Institute Of Science And Technology | Ultrathin camera device using microlens array, and multi-functional imaging method using the same |
WO2024101631A1 (en) * | 2022-11-09 | 2024-05-16 | 아이빔테크놀로지 주식회사 | Time-lapse imaging method and device capable of maintaining focus |
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