KR20160117729A - ESD function available for high temperature belt semiconductor IC Tray - Google Patents

ESD function available for high temperature belt semiconductor IC Tray Download PDF

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Publication number
KR20160117729A
KR20160117729A KR1020150044742A KR20150044742A KR20160117729A KR 20160117729 A KR20160117729 A KR 20160117729A KR 1020150044742 A KR1020150044742 A KR 1020150044742A KR 20150044742 A KR20150044742 A KR 20150044742A KR 20160117729 A KR20160117729 A KR 20160117729A
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KR
South Korea
Prior art keywords
hole
tray
belt
sewing
pivot hole
Prior art date
Application number
KR1020150044742A
Other languages
Korean (ko)
Inventor
백철균
양현미
Original Assignee
엘에프피(주)
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Priority to KR1020150044742A priority Critical patent/KR20160117729A/en
Publication of KR20160117729A publication Critical patent/KR20160117729A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B13/00—Bundling articles
    • B65B13/02—Applying and securing binding material around articles or groups of articles, e.g. using strings, wires, strips, bands or tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B13/00—Bundling articles
    • B65B13/18—Details of, or auxiliary devices used in, bundling machines or bundling tools
    • B65B13/24—Securing ends of binding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B27/00—Bundling particular articles presenting special problems using string, wire, or narrow tape or band; Baling fibrous material, e.g. peat, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D63/00—Flexible elongated elements, e.g. straps, for bundling or supporting articles
    • B65D63/10—Non-metallic straps, tapes, or bands; Filamentary elements, e.g. strings, threads or wires; Joints between ends thereof
    • B65D63/1018—Joints produced by application of integral securing members, e.g. buckles, wedges, tongue and slot, locking head and teeth or the like

Abstract

The present invention relates to a method for manufacturing a semiconductor IC chip, a method of manufacturing the IC chip, a method of manufacturing the semiconductor IC chip, (Solid, Liquid, Gas) due to contact with IC chips stored in stacked IC trays in the process of moving to or out of the IC tray, and to prevent damages due to the generation of static electricity. De-functional belt,
According to a solving means of the present invention,
"A belt body 10 in which a liquid mixture of water and carbon nanotube (CNT) at a ratio of 10: 1 is applied to the outer circumferential surface and then dried,
A plurality of walls 200 are formed on both sides of the wall 200 so as to have a pivot hole 201 at the center and a downward inclined surface with respect to the pivot hole 201, A through hole 220 is formed in the front of the sewing bar 210 and a hook 231 is formed at the both ends of the through hole 220 in front of the through hole 220. [ A head part 20 integrally provided with a seating part 230 formed in a longitudinal direction and a plate 250 integrally formed in front of the seating part 230,
Is coupled to the pivot hole 201 formed at the center of the wall 200 in the head part 20 so as to be pivotable on the upper side of the seating part 230 and is coupled to the pivot hole 201 at one end, And a locking protrusion 310 is provided at the center of the bottom surface of the lower protrusion 300 so that a locking plate 320 integrally formed with the locking protrusion 300 is provided in front of the locking protrusion 300, Wherein one end of the belt body passes through the through hole and the sewing bar is wrapped around the sewing bar so that the sewing part is formed. High temperature usable diverse belt "as a structural feature,
The present invention having the above-described structure provides an improved high performance for preventing the short circuit of the IC TRAY belt itself by improving the internal and external static elimination effect and the external design, It is possible to apply a wide range of applications and applications, and the inherent physical properties (heat resistance, strength, abrasion resistance, chemical resistance, dimensional stability) of the IC TRAY belt are increased.
On the other hand, unlike conventional belts, they can be economically reused because they can be reused.

Description

(ESD function available for high temperature belt semiconductor IC Tray)

The present invention relates to a method for manufacturing a semiconductor IC chip, a method of manufacturing the IC chip, a method of manufacturing the semiconductor IC chip, (Solid, Liquid, Gas) due to contact with IC chips stored in stacked IC trays in the process of moving to or out of the IC tray, and to prevent damages due to the generation of static electricity. De-functional belt.

Generally, semiconductor IC chips are manufactured through wafer level fabrication processes and chip level assembly processes, and the manufactured semiconductor IC chips are shipped after a predetermined test process.

When a semiconductor IC chip is shipped or moved, a flat tray type IC tray having a cell structure capable of stacking a plurality of IC chips at one time is used. Usually, a plurality of trays are stacked and moved in a bundle A plurality of stacked bundles are banded into bands made of polypropylene.

Such a belt has a structure in which a head portion is provided at one end and the other end is inserted and fixed in a hole formed in the head portion so that the tray can be bound.

Therefore, when the band is bundled, the band is bent, the other end of the band is inserted through the hole of the head portion, and the other end of the band is pulled, so that the binding operation can be completed.

Further, there is a difficulty in controlling the bending force after stacking the conventional tray for transferring or shipping. When the bending is performed with a force exceeding the limit value, the tray often breaks. It is difficult to adjust the tension of the band, .

In addition, due to the characteristics of the semiconductor chip, conventional bands of polypropylene cause the generation of static electricity and have a fatal problem of damaging the semiconductor chip.

Specifically, the first IC TRAY band is generally made of a plastic such as polypropylene, and uses an electrostatic coating agent which is not permanent to an insulator having an electrical value of 1.0E + 15, so that problems have been encountered when reusing the belt.

The insulator has no function of offsetting the charge cloud inside or outside the ESD (Electro Static Discharge).

Electrical values of 1.0E + 06 ~ 1.0E + 09 should be maintained to rapidly cancel internal and external electrical shocks. Solid, Liquid, and Liquid must be stored on the surface of the composition to prevent contamination and migration, There should be no gas form and there should be no change of performance according to the set number of repetitive use and no deformation at high temperature (130 ~ 170 ℃) used in the process.

Korean Patent Publication No. 2004-72951 (Practical Literature 0002) Korean Utility Model No. 2009-12657 Korean Patent Registration No. 1240825

The present invention for the anti-static water (H 2 O), polyurethane (PU), methyl ketone (MEK), methanol fill to (CH 3 OH), toluene (C 7 H 8) serves to solve the above (Carbon nanotube: CNT) is applied to the belt body, which is a synthetic resin material, it is suitable for IC tray and can be used even at high temperature (80 ~ 180 ° C) It is an object of the present invention to provide an anti-fogging coating composition, which is applied to a belt base material, and remarkably prevents surface peeling due to strong chemical catalytic action on the surface.

Another object of the present invention is to provide a semiconductor device which is more complicated and highly dense due to the development of semiconductor technology, uses high energy, rapidly disperses the charge cloud generated thereby, and suppresses contamination.

Next, it is an object of the present invention to reinforce the binding force of the IC tray by allowing the band to be brought into close contact with the edge of the IC tray by making the band flexible when binding the band, and to reuse the IC tray.

In order to achieve the above object,

The present inventors have found that the use of carbon nanotubes or powders of at least one of water (H 2 O), urethane (PU), methyl ethyl ketone (MEK), methanol (CH 3 OH), and toluene (C 7 H 8 ) CNT) at a ratio of 10: 1, and drying the mixture, and a plurality of walls having piercing holes at the center and having downward slopes on both sides with respect to the piercing hole are provided on both sides Wherein a through hole is formed long in front of the sewing bar, and a seating part having a hooking protrusion formed at its both ends in a longitudinal direction is formed at a front side of the through hole, A head portion having a plate integrally formed at the front of the seat portion, and a head portion coupled to the head portion by a pivot hole formed at the center of the wall portion so as to be rotatable above the seat portion And a locking protrusion is provided at the center of the bottom surface of the lower surface of the rotation protrusion and a locking plate integrally provided with a pressing plate at the front of the rotation protrusion, Characterized in that one end of the body passes through the through-hole to wrap the sewing bar to form a sewing section, and a high temperature usable diverse functional belt for a semiconductor IC tray, characterized in that it achieves the above object .

The present invention having the above-described structure provides an improved high performance for preventing the short circuit of the IC TRAY belt itself by improving the internal and external static elimination effect and the external design, It is possible to apply a wide range of applications and applications, and the inherent physical properties (heat resistance, strength, abrasion resistance, chemical resistance, dimensional stability) of the IC TRAY belt are increased.

On the other hand, unlike conventional belts, they can be economically reused because they can be reused.

While the present invention has been shown and described with reference to certain preferred embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various changes and modifications may be possible without departing from the scope of the invention.

FIG. 1 is a perspective view showing a fastened state of a high-temperature usable diverse functional belt for a semiconductor IC tray according to the present invention,
FIG. 2 is a perspective view showing a state in which a locking part is separated from a high-temperature usable ESD prevention band using a semiconductor IC tray according to the present invention;
FIG. 3 is a perspective view showing a state in which a head portion and a locking portion are separated from each other in a high temperature-use,
FIG. 4 is a cross-sectional view of a high-temperature usable diverting belt for a semiconductor IC tray according to the present invention, in which a belt body is inserted,
5 is an operating state sectional view showing fastening and disengagement of a locking portion in a high temperature usable diverse functional belt for a semiconductor IC tray according to the present invention,
FIG. 6 is a photograph of the state of use in which the IC tray is fastened to a high-temperature usable diverting belt for use with the semiconductor IC tray of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings and specific configurations and operations thereof, with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a fastening state of a high-temperature usable di-functional belt using a semiconductor IC tray according to the present invention, FIG. 2 is a perspective view showing a state where a locking portion is separated from a high- FIG. 3 is a perspective view showing a state that the head portion and the locking portion are separated from each other in a high temperature usable diverse functional belt using a semiconductor IC tray according to the present invention, FIG. 4 is a perspective view FIG. 5 is an operational sectional view showing the fastening and disengagement of the locking portion in a high temperature usable diverse functional belt for a semiconductor IC tray according to the present invention. FIG. 6 is a cross- Possible to use IC Tray with belt function The use of an integral state is a state picture.

Hereinafter, the configuration of the present invention will be described.

First, the instruction code 10 as indicative of the belt body of the belt body 10 is water (H 2 O), polyurethane (PU), a ketone (MEK), methanol fill to methyl (CH 3 OH), toluene (C 7 H 8 ) and a carbon nanotube (CNT) powder in a ratio of 10: 1 is coated on the outer circumferential surface and dried, and a high temperature suitable for IC tray, that is, 80 It can be used at ~ 180 ℃,

Electrostatic discharge (ESD) of the present invention and a conventional product are compared with each other in Table 1,

Table 1

Figure pat00001

As shown in Table 1, the present invention has a low friction constant static voltage of 50 V or less, whereas a conventional product has a high static friction voltage of 100 V or more. The decay time decayed from V to 1.2 V is 0.01 sec to 0.03 sec, which is remarkably faster than that of the conventional product, and the surface resistance is also shown to be lower than that of the conventional product.

Meanwhile, as shown in Table 2 below, the test results of the environment-friendly products (heavy metal test) were tested by the Korea Testing and Research Institute for Chemical Testing, and it can be confirmed that the heavy metal test is also an eco-friendly product in which the present invention is not detected.

Table 2

Figure pat00002

As shown in Table 2, the present invention has no problem in heavy metal test.

Next, the reference numeral 20 designates a head portion, and the head portion 20, as shown in FIG. 3,

A plurality of walls 200 are formed on both sides of the wall 200 so as to have a pivot hole 201 at the center and a downward inclined surface with respect to the pivot hole 201, A through hole 220 is formed in the front of the sewing bar 210 and a hook 231 is formed at the both ends of the through hole 220 in front of the through hole 220. [ And a plate 250 is integrally provided at the front of the seating part 230. The seating part 230 is formed integrally with the seating part 230 formed in the longitudinal direction.

3, the locking part 30 is fastened to the pivot hole 201 formed in the center of the wall 200 in the head part 20 as shown in FIG. 3, The rotary protrusion 300 is coupled to the pivot hole 201 so as to be rotatable on both sides of the pivot hole 201. The locking protrusion 300 has a locking projection And a pushing plate 320 is integrally provided in front of the pivoting protrusion 300.

2, one end of the belt body 10 passes through the through-hole 220 to enclose the sewing bar 210 to form the sewing part 100, .

Hereinafter, the operation of the present invention will be described.

First, the fastened state is shown in FIG. 1, and the fastened state is as shown in FIG.

As shown in FIGS. 1 and 2, one end of the belt body 10 is covered with a sewing bar 210 to form a sewing part 100. 2, the pivoting protrusion 300 of the locking portion 30 is fastened to the pivot hole 201 of the head portion 20, and then the belt body 10 And the other end of the non-sewn portion of the locking portion 30 is inserted from the lower side to the upper side of the through hole 220 to be pulled toward the plate 250. Then, as shown in FIG. 5, the pressing plate 320 of the locking portion 30 is pressed The locking protrusion 310 provided on the bottom surface of the lower protrusion 300 of the locking portion 30 tightly presses the belt body 10 to be fastened.

As shown in FIG. 5, when the pushing plate 320 is rotated to place the locking unit 30 on the belt body 10 as shown in FIG. 4, the belt body 10 can be easily removed.

When the above operation is performed, the IC tray is fastened as shown in FIG.

The present invention having the above-described structure provides an improved high performance for preventing the short circuit of the IC TRAY belt itself by improving the internal and external static elimination effect and the external design, It is possible to apply a wide range of applications and applications, and the inherent physical properties (heat resistance, strength, abrasion resistance, chemical resistance, dimensional stability) of the IC TRAY belt are increased.

On the other hand, unlike conventional belts, they can be economically reused because they can be reused.

10: Belt body 20: Head part
30: locking part 100: sewing part
200: wall 201: revolving hole
210: sewing bar 220: through-hole
230: seat part 231:
250: Plate 300: Rotation projection
310: locking protrusion 320:

Claims (1)

Water (H 2 O), polyurethane (PU), ketones fill to methyl (MEK), methanol (CH 3 OH), toluene (C 7 H 8) of any one or more materials with the powder of the CNT (carbon nanotube: CNT ) At a ratio of 10: 1 to the outer surface of a belt body 10,
A plurality of walls 200 are formed on both sides of the wall 200 so as to have a pivot hole 201 at the center and a downward inclined surface with respect to the pivot hole 201, A through hole 220 is formed in the front of the sewing bar 210 and a hook 231 is formed at the both ends of the through hole 220 in front of the through hole 220. [ A head part 20 integrally provided with a seating part 230 formed in a longitudinal direction and a plate 250 integrally formed in front of the seating part 230,
Is coupled to the pivot hole 201 formed at the center of the wall 200 in the head part 20 so as to be pivotable on the upper side of the seating part 230 and is coupled to the pivot hole 201 at one end, And a locking protrusion 310 is provided at the center of the bottom surface of the lower protrusion 300 so that a locking plate 320 integrally formed with the locking protrusion 300 is provided in front of the locking protrusion 300, Wherein one end of the belt body passes through the through hole and the sewing bar is wrapped around the sewing bar so that the sewing part is formed. Eesudi functional belt available at high temperature.
.
KR1020150044742A 2015-03-31 2015-03-31 ESD function available for high temperature belt semiconductor IC Tray KR20160117729A (en)

Priority Applications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110371478A (en) * 2019-08-07 2019-10-25 沈阳飞机工业（集团）有限公司 A kind of conducting wire beaming device and its application method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040072951A (en) 2003-02-11 2004-08-19 이재선 Reuse cable tie
KR20090012657A (en) 2007-07-31 2009-02-04 에스케이 텔레콤주식회사 Method and system for performing video call using of communication terminal without camera
KR101240825B1 (en) 2011-11-30 2013-03-11 김호식 Reusable tie-band

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040072951A (en) 2003-02-11 2004-08-19 이재선 Reuse cable tie
KR20090012657A (en) 2007-07-31 2009-02-04 에스케이 텔레콤주식회사 Method and system for performing video call using of communication terminal without camera
KR101240825B1 (en) 2011-11-30 2013-03-11 김호식 Reusable tie-band

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110371478A (en) * 2019-08-07 2019-10-25 沈阳飞机工业（集团）有限公司 A kind of conducting wire beaming device and its application method

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