KR20160116438A - Heat conduction tape to horizontality and preparation method thereof - Google Patents

Abstract

The present invention relates to a horizontal thermoelectric tape and a method for manufacturing the same, and more specifically, to a horizontal thermoelectric tape having a superior electromagnetic wave-shielding effect and a superior heat dissipation effect, and to a method for manufacturing the same. The horizontal thermoelectric tape and the method for manufacturing the same according to the present invention can have an electromagnetic wave-shielding effect by effectively transferring and removing heat generated in electronic devices. More particularly, the horizontal thermoelectric tape can increase the heat dissipation efficiency and simplify the manufacturing process thereof, by simplifying the double layer structure of a conventional horizontal thermoelectric tape including an adhesive layer and a heat dissipation layer, and by coating a heat dissipation agent directly on a conductive substrate. Also, by using a non-deposited conductive substrate to manufacture the horizontal thermoelectric tape, the horizontal thermoelectric tape having superior heat conductivity can be manufactured.

Description

TECHNICAL FIELD [0001] The present invention relates to a horizontal thermoelectric tape and a manufacturing method thereof,

The present invention relates to a horizontal thermoelectric tape and a method of manufacturing the same, and more particularly, to a horizontal thermoelectric tape excellent in electromagnetic wave shielding ability and heat radiation effect and a method of manufacturing the same.

Generally, when an electronic product is driven, heat is generated inside the electronic device included in the electronic product. When the heat generated as described above is not emitted to the outside as quickly as possible, heat affects the electronic device, The result of failing to perform the function is generated. There is a possibility that noise or malfunction may be caused in peripheral parts or devices due to such heat, and further, there is a problem that the level of the product can be shortened.

Particularly, as electronic products are aimed at high performance, high functionality, and light weight shortening, there is a necessity to increase the capacity and integration of electronic devices accordingly, and how to effectively discharge the heat generated from parts of such electronic products And the key factors that influence quality.

Conventionally, as means for solving the above-mentioned problems, there have been proposed various methods such as a fin fan cooling method, a Peltier cooling method, a liquid-jet cooling method, an immersion cooling method, a heat pipe ) Cooling system. However, there is a demand for a cooling device and a heat dissipating device for electronic devices that are in the trend of slimmer and miniaturized electronic products.

Recently, the use of notebooks and mobile phones has been expanding due to the development of the electronic communication industry. With the trend of ultra lightness and thinning of these products, a method of removing heat by attaching a heat insulating tape to these products has been preferred.

Prior Art Document 1 relates to an electromagnetic shielding adhesive tape, wherein the electromagnetic shielding adhesive tape comprises a resin film layer; A first adhesive layer laminated with a resin film layer on the electromagnetic interference shielding layer, the electromagnetic interference shielding layer being bonded to one surface of the resin film layer; A second adhesive layer; And an electroconductive metal layer provided between the first adhesive layer and the second adhesive layer.

According to Prior Art 2, an electromagnetic interference (EMI) shielding heat shrinkable material and an article (e.g., a tape or the like), an EMI shielding heat shrinkable tape discloses a heat shrinkable tape including a heat shrinkable layer and an EMI shielding layer .

However, the conventional heat radiation tape product has a problem in that the adhesive layer and the heat dissipation layer are separated from each other, resulting in poor heat dissipation efficiency and a complicated manufacturing process. In addition, the conventional heat-radiating tape has a problem in that the heat conduction tape is not excellent because the conductive base is made by vapor deposition.

Korean Patent Publication No. 10-2013-0106283 (Disclosure Date: September 27, 2013) Korean Patent Publication No. 10-2014-0009204 (published on January 22, 2014)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a heat dissipation device, a heat dissipation device, and a heat dissipation device which shield electromagnetic waves generated in a specific device and electronic devices at a specific site, To provide a horizontal thermoelectric tape excellent in adhesion and a method of manufacturing the same.

To this end, the present invention provides a thermally conductive horizontal thermoelectric tape for shielding electromagnetic waves generated from electronic devices and transferring heat generated from electromagnetic waves to the outside, comprising: (a) one kind selected from the group consisting of aluminum and copper A conductive base portion having an average thickness of 15 mu m to 30 mu m including a metal thin film of And (b) a heat-radiating adhesive layer formed on the lower surface of the conductive substrate portion and having an average thickness of 10 to 20 占 퐉.

In a preferred embodiment of the present invention, the metal thin film of the conductive substrate portion may be a copper thin film.

In one preferred embodiment of the present invention, the copper foil may be one selected from the group consisting of an electrolytic copper foil and a rolled copper foil.

In a preferred embodiment of the present invention, the copper foil may be a rolled copper foil.

In a preferred embodiment of the present invention, the heat-radiating adhesive layer may include a pressure-sensitive adhesive and graphite powder.

In a preferred embodiment of the present invention, the graphite may be in the form of a powder having a diameter of 10 mu m to 20 mu m.

In a preferred embodiment of the present invention, the graphite may be included in an amount of 5 to 15 parts by weight based on 100 parts by weight of the pressure-sensitive adhesive.

In one preferred embodiment of the present invention, the heat-resistant adhesive layer may further include at least one selected from the group consisting of a flame retardant and a curing agent.

In a preferred embodiment of the present invention, the flame retardant may include at least one member selected from the group consisting of an aluminum hydroxide (AlOH) flame retardant, a magnesium hydroxide (MgOH) flame retardant, and a phosphorus flame retardant.

In one preferred embodiment of the present invention, the curing agent may include at least one selected from the group consisting of isocyanates, amines, and epoxies.

In a preferred embodiment of the present invention, a PET layer may be further formed on the upper surface of the conductive substrate portion.

In a preferred embodiment of the present invention, the thermal conductivity of the horizontal thermoelectric tape is 130 W / Mk to 160 W / Mk, and the adhesive force may be 1000 gf / 25 mm to 2500 gf / 25 mm.

Another aspect of the present invention is a method for manufacturing a semiconductor device comprising the steps of: preparing a conductive substrate portion including a metal thin film having a thickness of 15 mu m to 30 mu m; And a second step of forming a heat-radiating adhesive layer on the lower surface of the conductive substrate portion.

The horizontal thermoelectric tape and the method of manufacturing the same according to the present invention can effectively transmit and remove heat generated in an electronic device and exhibit an electromagnetic wave shielding effect. Further, the two-layer structure of the adhesive layer and the heat dissipation layer of the existing horizontal thermoelectric tape can be simplified to a single layer to attain thinness, and at the same time, a desired level of adhesion and thermal conductivity can be exhibited. The efficiency can be increased and the manufacturing process can be simplified.

1 is a cross-sectional view of a horizontal thermoelectric tape according to the present invention.

Accordingly, the present inventors have made intensive researches to overcome the problems of the prior arts, and as a result, the present inventors have found that a two-layer structure of a pressure sensitive adhesive and a heat dissipation layer of a horizontal thermotransfer tape can be simplified to a single layer to thin a thin film, It is possible to produce a horizontal thermotransfer tape, and it is possible to produce a horizontal thermotransfer tape excellent in thermal conductivity and adhesive force, and the present invention has been completed.

To this end, the present invention provides a thermally conductive horizontal thermoelectric tape for shielding an electromagnetic wave generated from an electronic device and transferring heat generated from the electromagnetic wave to the outside, comprising: (a) 1 A conductive substrate portion having an average thickness of 15 mu m to 30 mu m including the metal thin film of the species; And (b) a heat-radiating adhesive layer formed on the lower surface of the conductive substrate portion and having an average thickness of 10 to 20 占 퐉. Hereinafter, the present invention will be described in more detail by constituent elements.

In the horizontal thermoelectric tape according to the present invention, the conductive base portion shields electromagnetic waves generated from electronic devices in the horizontal thermoelectric tape, and is provided to transmit heat generated from the electromagnetic waves to the outside, The substrate portion may have a thickness of 15 탆 to 30 탆, and may include one kind of metal thin film selected from the group consisting of aluminum and copper.

At this time, when the thickness of the metal thin film is less than 15 탆, the electromagnetic shielding effect may be deteriorated. When the thickness of the metal thin film is more than 30 탆, it is difficult to thin the product, and the thermal conductivity and adhesive strength may be lowered .

The metal thin film may be one selected from the group consisting of aluminum and copper, and may be preferably a copper thin film. The copper thin film has an excellent thermal conductivity as compared with the case of using an aluminum thin film, and it is preferable to use a copper thin film as a metal thin film included in the conductive substrate portion.

At this time, the copper foil may be one selected from the group consisting of an electrolytic copper foil and a rolled copper foil, and the copper foil may be a rolled copper foil. The electrolytic copper foil is a copper foil manufactured by the electroplating method. The rolled copper foil is used by surface treatment of the rolled copper foil. When rolled copper foil is used, the surface roughness is higher than that of the electrolytic copper foil, It is possible to manufacture a horizontal thermoelectric tape having high heat dissipation efficiency and excellent electromagnetic wave shielding function when a rolled copper foil is used.

The horizontal thermoelectric tape according to the present invention includes a heat radiation adhesive layer formed on the lower surface of the conductive substrate portion and having a thickness of 10 mu m to 20 mu m. The heat-radiating adhesive layer may include a pressure-sensitive adhesive and graphite. The pressure-sensitive adhesive may preferably be composed of an acrylic pressure-sensitive adhesive or a silicone pressure-sensitive adhesive. When the graphite is used as a heat-dissipating powder, the surface of the heat-dissipating tape is smooth and has a good effect on the appearance, and the smoothness of the surface of the heat- It is possible to prevent the heat-radiating tape itself from being damaged due to the surface. Further, the peel-off of the heat-radiating adhesive layer and the conductive substrate portion can be prevented, and the adhesive ability can be further improved, and the adhesive force of the external force acting on the horizontal thermoelectric tape is also excellent.

Although there is no particular limitation on the size of the graphite, it is preferable that the graphite is in the form of a powder having a diameter of 10 mu m to 20 mu m. When the diameter is less than 10 탆, the heat radiation effect may be deteriorated, and when the diameter exceeds 20 탆, the surface may be roughened

At this time, the heat-resistant adhesive layer may contain 5 to 15 parts by weight of graphite relative to 100 parts by weight of the pressure-sensitive adhesive. When the graphite is contained in an amount of less than 5 parts by weight based on 100 parts by weight of the pressure-sensitive adhesive, the heat-conductive pressure-sensitive adhesive layer may have a low thermal conductivity.

In the horizontal thermoelectric tape according to the present invention, the heat-radiating adhesive layer may further include at least one selected from the group consisting of a flame retardant and a curing agent.

At this time, the flame retardant is also referred to as a flame retardant and may be added to prevent combustion of the heat-resistant adhesive layer and to prevent the generation of noxious gas during combustion. The flame retardant may include at least one member selected from the group consisting of an aluminum hydroxide (AlOH) flame retardant, a magnesium hydroxide (MgOH) flame retardant, and a phosphorus flame retardant.

Also, the curing agent is included to improve the hardness of the heat-sealable adhesive layer, and the curable agent may include at least one member selected from the group consisting of isocyanate, amine and epoxy.

The horizontal thermoelectric tape according to the present invention may further include a PET layer on the upper surface of the conductive substrate portion. The PET layer is provided for protecting the horizontal thermoelectric tape according to the present invention from external impurities and is detachable. The PET layer may be any transparent polymer thin film capable of achieving the above object, but it is preferable to use a PET thin film.

In the horizontal thermoelectric tape according to the present invention, the horizontal thermoelectric tape has the above-described structure and thus has excellent thermal conductivity and adhesion so that heat generated in the electronic device can be effectively transmitted and removed, and an electromagnetic wave shielding effect can be obtained. More specifically, the thermal conductivity of the horizontal thermoelectric tape may be 130 W / Mk to 160 W / Mk and the adhesive strength may be 1000 gf / 25 mm to 2500 gf / 25 mm, more preferably 140 W / Mk ~ 160 W / Mk, and the adhesive force may be from 2000 gf / 25 mm to 2500 gf / 25 mm.

The present invention also provides a method of manufacturing a semiconductor device, comprising the steps of: preparing a conductive substrate portion including a metal thin film having a thickness of 15 mu m to 30 mu m; And a second step of forming a heat-radiating adhesive layer on the lower surface of the conductive substrate portion. Hereinafter, the present invention will be described in more detail by step.

In the method of manufacturing a horizontal thermoelectric couple tape according to the present invention, the first step is a step of preparing a conductive substrate portion including a metal thin film having a thickness of 15 탆 to 30 탆, wherein the metal thin film is selected from the group consisting of aluminum and copper And may preferably be a copper thin film. The copper thin film has an excellent thermal conductivity as compared with the case of using an aluminum thin film, and it is preferable to use a copper thin film as a metal thin film included in the conductive substrate portion.

At this time, the copper foil may be one selected from the group consisting of an electrolytic copper foil and a rolled copper foil, and the copper foil may be a rolled copper foil. The electrolytic copper foil is a copper foil manufactured by the electroplating method. The rolled copper foil is used by surface treatment of the rolled copper foil. When rolled copper foil is used, the surface roughness is higher than that of the electrolytic copper foil, It is possible to manufacture a horizontal thermoelectric tape having high heat dissipation efficiency and excellent electromagnetic wave shielding function when a rolled copper foil is used.

If the thickness of the metal thin film is 15 탆 or less, the thermal conductivity may be lowered. If the thickness of the metal thin film is more than 30 탆, the product may not be thinned, and the thermal conductivity and adhesion may be decreased.

In the method of manufacturing a horizontal thermoelectric couple tape according to the present invention, the step 2 is a step of forming a heat radiation adhesive layer on the lower surface of the conductive substrate portion, wherein the heat radiation adhesive layer includes a pressure- And tackiness can be simultaneously exhibited, so that the thickness of the horizontal thermoelectric tape manufactured according to the present invention can be reduced.

At this time, the pressure sensitive adhesive may preferably be an acrylic pressure sensitive adhesive or a silicone pressure sensitive adhesive. When the graphite powder is used as a heat-dissipating powder, the surface of the heat-dissipating adhesive tape is smooth and has a good effect on the appearance of the heat-dissipating and adhesive layer. , And it is possible to prevent the heat radiation tape itself from being damaged due to the smooth surface. Further, the peel-off of the heat-radiating adhesive layer and the conductive substrate portion can be prevented, and the adhesive ability can be further improved, and the adhesive force of the external force acting on the horizontal thermoelectric tape is also excellent.

Although the size of the graphite powder is not particularly limited, it is preferable that the graphite powder has a diameter of 10 탆 to 20 탆. When the diameter is less than 10 탆, the heat radiation effect may be deteriorated, and when the diameter exceeds 20 탆, the surface may be roughened

At this time, the graphite powder may be included in an amount of 5 to 15 parts by weight based on 100 parts by weight of the pressure-sensitive adhesive. When the graphite powder is contained in an amount of less than 5 parts by weight based on 100 parts by weight of the pressure sensitive adhesive, the thermal conductivity may be lowered. When the graphite powder is more than 15 parts by weight, the adhesive strength may be lowered.

At this time, the heat-radiating adhesive layer may be applied in a thickness of 10 μm to 20 μm, and the heat-radiating adhesive layer may be applied to one side of the conductive substrate portion by one method selected from the group consisting of comma coating and gravure coating can do.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[ Example ]

Example  One: The Metal thin film  conductivity The base portion  use

The acrylic pressure-sensitive adhesive having a solid content of 45% and the graphite powder having a diameter of 10 to 20 탆 as heat-dissipating powder were mixed in an amount of 7 parts by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive, Lt; / RTI > A curing agent was added during stirring, and an amine curing agent was added as a curing agent. After that, it was stabilized at room temperature of about 20 to 30 DEG C for about 30 to 60 minutes for defoaming, thereby preparing a heat-insulating adhesive.

A copper foil (Metal foil, Iljin) was used as the electrolytic copper foil thin film having a thickness of 18 탆 in the conductive substrate portion. And PET of the same size was attached to the upper layer of the conductive substrate portion.

Thereafter, the heat radiation adhesive was applied to the conductive base portion using a comma coater. At this time, since the coating thickness was decreased by the evaporation of the solvent portion after drying, the coating was carried out by 40% higher than the desired thickness. Thereafter, the mixture was allowed to stand in a stabilization chamber at a temperature of 40 to 60 ° C for 24 hours to stabilize the polymer in the heat-sealed adhesive portion. Thereafter, the release film was laminated so that the horizontal thermoelectric tape could be attached to the adherend. Thus, the final product, which is a horizontal thermoelectric tape, had a thickness of 18 mu m for the heat-sensitive adhesive, a thickness of 18 mu m for the conductive base, and a total thickness of 36 to 38 mu m. 1 is a view illustrating a horizontal thermoelectric tape having a heat-resistant adhesive layer on a lower surface of a conductive substrate according to the first embodiment of the present invention. 1, reference numeral 100 denotes a PET layer, 200 denotes a conductive substrate portion including a metal thin film, and 300 denotes a heat dissipation adhesive layer.

Example  2: Rolled copper foil Metal thin film  conductivity As the substrate portion  use( Rolled copper foil  16.5 탆)

A horizontal thermotransfer tape was prepared in the same manner as in Example 1, except that a rolled copper foil (Japanese film) metal thin film having a thickness of 16.5 탆 was used as the conductive substrate portion.

Example  3: Graphite  The content of the powder was measured using an acrylic adhesive 100 Weight portion  Contrast 11 By weight  mix

A horizontal thermotransfer tape was prepared in the same manner as in Example 1, except that the graphite powder was mixed in an amount of 11 parts by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive.

Example  4: Rolled copper foil Metal thin film  conductivity As the substrate portion  use( Rolled copper foil  16.5 占 퐉) Graphite  The content of the powder was measured using an acrylic adhesive 100 Weight portion  Contrast 11 By weight  mix

(Japanese-made) metal thin film having a thickness of 16.5 占 퐉 was used as the conductive substrate portion, and 11 parts by weight of the graphite powder was mixed with 100 parts by weight of the acrylic pressure-sensitive adhesive. In this way, A thermoelectric tape was produced.

Example  5: Aluminum series Metal thin film  conductivity As the substrate portion  use

The acrylic pressure-sensitive adhesive having a solid content of 45% and the grape art filler having a diameter of 5 to 15 占 퐉 as heat-dissipating powder were mixed so that the amount thereof was 11.1 parts by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive, Lt; / RTI > A flame retardant and a curing agent were added during the stirring, aluminum hydroxide as a flame retardant and an amine curing agent as a curing agent. After that, it was stabilized at room temperature of about 20 to 30 DEG C for about 30 to 60 minutes for defoaming, thereby preparing a heat-insulating adhesive.

The conductive substrate portion was not deposited, and an aluminum product (metal foil Samhwa, Hanhwa aluminum product) was used as a metal foil having a thickness of 100 탆. PET was attached to the upper layer of the conductive substrate portion.

Thereafter, the heat radiation adhesive was applied to the conductive base portion using a comma coater. In this case, since the thickness of the coating is reduced by evaporation of the solvent after drying, the coating is coated with 40% higher than the desired thickness. Thereafter, the mixture was allowed to stand in a stabilization chamber at a temperature of 40 to 60 ° C for 24 hours to stabilize the polymer in the heat-sealed adhesive portion. Thereafter, the release film was laminated so that the horizontal thermoelectric tape could be attached to the adherend. Thus, the final product as a horizontal thermoelectric tape had a total thickness of 35 μm, a thickness of the conductive base part of 100 μm, and a PET coating layer of 15 μm including a bonding layer.

The conductive substrate portion Heat-sealable adhesive layer PET layer Metal thin film Thickness (㎛) adhesive Graphite Diameter (탆) Content (Adhesive: graphite) Thickness (㎛) Thickness (㎛) Example 1 The 18 Acrylic powder 10-20 100: 7 18 15 Example 2 Rolled copper foil 16.5 Acrylic powder 10-20 100: 7 18 15 Example 3 The 18 Acrylic powder 10-20 100: 11 18 15 Example 4 Rolled copper foil 16.5 Acrylic powder 10-20 100: 11 18 15 Example 5 Aluminum rolled thin film 100 Acrylic powder 5 to 15 100: 11.1 15 15

Experimental Example

Experimental Example  One: Example  Measure thermal conductivity and adhesion of 1 to 4

Experiments to measure the thermal conductivity of Examples 1 to 4 according to the present invention were conducted by an external agency (KAIST). The measurement method was measured by laser flash method. At this time, the measurement equipment was NETZSCH's LFA equipment. The measurement results thereof are shown in Table 1 below.

In addition, the adhesion of Examples 1 to 4 according to the present invention was measured by a 180 degree peel test method according to KS T1028 using an H5KT adhesive strength measuring device of Tinius Olsen, and the results are shown in Table 2 below.

division Thermal conductivity (W / Mk) Adhesion (gf / 25mm) Example 1 138 1000 ~ 1500 Example 2 141 2000 to 2500 Example 3 143 1000 ~ 1500 Example 4 153 2000 to 2500 Example 5 100 1600-1700

As shown in Table 1, it was confirmed that as the content of the graphite powder in the heat-radiating adhesive layer was increased, the thermal conductivity was improved. Further, it was confirmed that the thinner the thickness of the conductive base portion, the better the thermal conductivity. However, when the content of the graphite powder in the heat-sealable adhesive layer is increased, there is a problem that the adhesive strength may be lowered.

In this case, when a rolled copper foil is used, an excellent adhesive force may be exhibited as compared with the case of using an electrolytic copper foil. Therefore, the adhesive force may not be lowered due to an increase in the content of graphite powder in the heat- It is possible to show excellent thermal conductivity and adhesion.

In the case of Example 5 according to the present invention, it was confirmed that an aluminum thin film having a thickness of 100 μm was used, and in this case, the thermal conductivity was significantly lower than that of the present invention. Therefore, it can be seen that the horizontal thermoelectric tape according to the present invention uses a rolled copper foil having a thickness of 15 탆 to 30 탆 as the conductive substrate portion, and exhibits excellent thermal conductivity and adhesiveness when the ratio of the pressure-sensitive adhesive and graphite is 100: 11 .

100: PET layer
200: conductive substrate part
300: Heat-resisting adhesive layer

Claims (13)

A horizontal thermoelectric tape having a thermally conductive property for shielding electromagnetic waves generated from electronic devices and transferring heat generated from electromagnetic waves to the outside,
(a) a conductive substrate portion having an average thickness of 15 mu m to 30 mu m including one kind of metal thin film selected from the group consisting of aluminum and copper; And
(b) a heat-radiating adhesive layer formed on the lower surface of the conductive substrate portion and having an average thickness of 10 to 20 占 퐉.
The method according to claim 1,
Wherein the metal thin film of the conductive substrate portion is a copper thin film.
3. The method of claim 2,
Wherein the copper thin film is one selected from the group consisting of an electrolytic copper foil and a rolled copper foil.
The method of claim 3,
Wherein the copper thin film is a rolled copper foil.
The method according to claim 1,
Wherein the heat-radiating adhesive layer comprises a pressure-sensitive adhesive and graphite.
6. The method of claim 5,
Wherein said graphite is in the form of a powder having an average diameter of from 10 탆 to 20 탆.
6. The method of claim 5,
Wherein the heat-radiating adhesive layer comprises 5 to 15 parts by weight of graphite relative to 100 parts by weight of the pressure-sensitive adhesive.
The method according to claim 1,
Wherein the heat-radiating adhesive layer further comprises at least one selected from the group consisting of a flame retardant and a curing agent.
9. The method of claim 8,
Wherein the flame retardant comprises at least one selected from the group consisting of an aluminum hydroxide (AlOH) flame retardant, a magnesium hydroxide (MgOH) flame retardant, and a phosphorus flame retardant.
9. The method of claim 8,
Wherein the curing agent comprises at least one selected from the group consisting of isocyanates, amines, and epoxies.
The method according to claim 1,
And a PET layer on the upper surface of the conductive substrate portion.
The method according to claim 1,
Wherein the horizontal thermoelectric tape has a thermal conductivity of 130 W / Mk to 160 W / Mk and an adhesive strength of 1000 gf / 25 mm to 2500 gf / 25 mm.
Preparing a conductive substrate portion including a metal thin film having a thickness of 15 mu m to 30 mu m; And
And forming a heat-radiating adhesive layer on the lower surface of the conductive substrate portion.

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