KR20160101592A - Electromagnetic shield structure for electronic device - Google Patents

Abstract

According to various embodiments of the present invention, an electronic device comprises: a first cover forming one surface of an electronic device; a second cover forming an opposing surface of the one surface; a printed circuit board (PCB) which is arranged between the first cover and the second cover, and comprises a first surface facing the first cover, a second surface facing the second cover, and a side surface; at least one electronic component arranged on the first surface in proximity to a portion of the side surface; a shield structure comprising a cap arranged between the first cover and the first surface to cover the electronic component, and a side wall extended from a periphery of the cap towards the first surface; a first conductive structure formed on a portion of the side surface of the PCB; and a second conductive structure which is disposed on a portion of the first surface of the PCB, is connected to the first conductive structure, and has a surface directed towards the first cover. The side wall is extended in a first direction non-parallel with the surface, and includes a portion coming in contact with the surface. The portion of the side wall coming in contact with the surface can be overlapped with the second conductive structure when viewed from above the first surface of the PCB.

Description

[0001] ELECTROMAGNETIC SHIELD STRUCTURE FOR ELECTRONIC DEVICE [0002]

Various embodiments of the invention relate to electromagnetic shielding structures for electronic devices.

An electronic device is a portable communication device that enables a user to enjoy multimedia services such as storage of various information, game, and video viewing from a communication function such as voice call or message transmission while the user is carrying it. The electronic device may include, for example, a smart phone, a tablet PC, a PalmPC, a portable game machine, a video / music file player, a cellular phone, a notebook PC and the like.

With the electronic organizer equipped with an electronic organizer and a multimedia function, it is possible to carry out various contents such as a financial service such as a small payment and a game / multimedia service from a communication function such as a voice call with only one portable device. Although the electronic device initially provided voice communication or simple message transmission service, as the electronic / communication technology developed, the electronic device gradually becomes smaller / slimmer and lighter, Security functions, multimedia functions to enjoy games / videos, and simple office processing functions including sending and receiving of the Internet and mail.

In addition, electronic devices support various hardware on a printed circuit board. In particular, in the case of a terminal supporting a mobile communication function, a communication chip supporting a mobile communication function and a process chip for supporting a multimedia are simultaneously integrated on a printed circuit board. In addition, a process chip for supporting the touch screen and various other user functions such as a broadcast receiving module for supporting a broadcast receiving function and a short range communication module for supporting a short distance communication function can be integrated on a printed circuit board.

A printed circuit board mounted on an electric device can be regarded as a type of electronic component element printed with wiring and layout space necessary for mounting a plurality of electronic components.

A technique of mounting and soldering a surface mount type component on such a printed circuit board is called Surface Mounter Technology (SMT). Particularly, among the equipment related to the surface mounting technology, a reflow soldering machine is a device in which a chip is mounted on a printed circuit board on which solder is printed, And then melted to adhere the chip parts. An apparatus for mounting a plurality of electronic components on such a printed circuit board is referred to as an SMD (surface mounting device).

Further, when a plurality of chips and components are mounted on a printed circuit board, hardware for supporting each function generates various noise while performing a switching operation for data processing. At this time, the generated noise acts as noise to other peripheral process chips.

Therefore, a predetermined chip and components are mounted using a shielding unit that can space-isolate predetermined chips and components from external electromagnetic signals. The shielding unit shields against electrical interference signals and shields against signals that are radiated in space.

[0004] However, there is a problem in that it is difficult to secure space such as a component mounting space and a wiring space with respect to the slimness of the electronic device supporting the communication function, the minimization of the bezel, and other additional hardware mounting trends.

This space allocation is very burdensome in terms of electronic device design and technical aspects.

Various embodiments of the present invention provide an electromagnetic shield structure for an electronic device capable of placing components within a limited printed circuit board space and ensuring space for wiring.

Various embodiments of the present invention provide an electromagnetic shield structure for an electronic device capable of ensuring performance such as ESD / EMI while improving component placement and wiring efficiency within a limited printed circuit board space.

An electronic device according to various embodiments of the present invention includes: a first cover defining a first side; A second cover forming an opposing surface of said one surface; A printed circuit board disposed between the first cover and the second cover, the printed circuit board including a first surface facing the first cover, a second surface facing the second cover, and a side surface; At least one electronic component disposed on the first surface adjacent a portion of the side surface; A cap disposed between the first cover and the first surface to cover the at least one electronic component and a shield including a sidewall extending from a periphery of the cover toward the first surface, rescue; A first conductive structure formed on a portion of the side of the PCB; And a second conductive structure coupled to the first conductive structure on a portion of the first side of the PCB and having a surface facing the first cover, the side wall having a non- parallel, extending in a first direction, the portion of the sidewall contacting the surface, the portion of the sidewall contacting the surface of the second portion of the PCB, when viewed from a first side of the PCB, And can overlap with the conductive structure.

The various embodiments of the present invention can reduce the area of the printed circuit board compared to the side shield can SMD (surface mounting device) type by expanding the side plating region in the printed circuit board to use as the shield can connection pad, It is advantageous in that it does not need additional protection design for EMI / ESD compared to SMD type of shielded can top and bottom of printed circuit board, thus maximizing wiring space.

These and other aspects, features and advantages of embodiments of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings.
1 is a diagram illustrating a network environment including an electronic device according to various embodiments.
2 is a front perspective view of an electronic device according to various embodiments.
3 is a rear perspective view of an electronic device according to various embodiments.
4 is a perspective view illustrating a printed circuit board according to various embodiments.
5A is a view for explaining a noise shielding structure generated in a signal line flowing in a substrate according to various embodiments.
5B is a view for explaining a shielding structure of an ESD according to various embodiments.
6 is a diagram comparing a plurality of shielded unit mounting structures according to various embodiments.
7 is a cross-sectional view showing a state in which a shielding unit is mounted on a printed circuit board according to a conventional example.
8 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
9 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
10 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
11A is a cross-sectional view illustrating a shielding unit mounted on a printed circuit board according to various embodiments of the present invention.
11B is a cross-sectional view illustrating another shielding unit mounted on a printed circuit board according to various embodiments of the present invention.
11C is a cross-sectional view illustrating another shielding unit mounted on a printed circuit board according to various embodiments of the present invention.
12 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
13A is a plan view showing a top pad and a side plating portion formed on a printed circuit board according to various embodiments of the present invention.
13B is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
13C is a plan view showing a connecting region of a shielding unit in a part of a top pad and a side plating portion formed on a printed circuit board according to various embodiments of the present invention.
14 is a cross-sectional view showing a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
15 is a cross-sectional view showing a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
16A is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
16B is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.
17 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.
18 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.
19 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.
20 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.
21A is a perspective view showing a printed circuit board on which connection pads are formed according to various embodiments of the present invention.
Fig. 21B is a plan view of Fig. 21A.
Fig. 21C is a cross-sectional view taken along the line AA in Fig.
22A is a perspective view showing a printed circuit board according to various embodiments of the present invention.
FIG. 22B is a plan view of FIG. 22A. FIG.
22C is a cross-sectional view taken along the line BB in Fig. 22B. Fig.
23A is a perspective view illustrating a printed circuit board according to various embodiments of the present invention.
FIG. 23B is a plan view of FIG. 23A. FIG.
Fig. 23C is a cross-sectional view taken along the line CC of Fig. 23B.
24A is a perspective view illustrating a printed circuit board according to various embodiments of the present invention.
24B is a plan view of Fig. 24A.
FIG. 24C is a cross-sectional view taken along the line DD of FIG. 24B.
25 is a top view of a printed circuit board according to various embodiments of the present invention.
26 is a plan view showing a printed circuit board on which a plating section according to various embodiments of the present invention is formed;
27 is a plan view showing a printed circuit board according to various embodiments of the present invention.
28 is an enlarged plan view of a curved surface of a printed circuit board according to various embodiments of the present invention.
29 is a front view showing a state in which a plating section is formed on a curved surface in a printed circuit board according to various embodiments of the present invention.
Figure 30 is a side view of a printed circuit board side according to various embodiments of the present invention.
31 is a side cross-sectional view illustrating a printed circuit board according to various embodiments of the present invention.
32 is a view illustrating a process of mounting a shielding unit on a top pad formed on a printed circuit board according to a conventional example.
33A is a view illustrating a process of mounting a shielding unit on a top pad formed on a printed circuit board according to various embodiments of the present invention.
33B is a view illustrating a process of mounting a shielding unit on a top pad formed on a printed circuit board according to various embodiments of the present invention.
FIG. 34 is a view showing that a top pad is formed using a metal mask on a printed circuit board according to various embodiments of the present invention. FIG.
35 is a view showing a connection state of a top pad and a shielding unit formed on a printed circuit board according to various embodiments of the present invention.
36A is a view showing a connection area of a shielding unit connected to a plurality of formed top-side pads and a plurality of side plating parts on a first surface of a printed circuit board according to various embodiments of the present invention.
36B is a view showing a plurality of top surface pads formed along the second direction on the first surface of the printed circuit board according to various embodiments of the present invention and a connection area of the shielding unit connected to the side surface plating unit.
FIG. 36C is a view showing a plurality of top surface pads formed along the second direction on the first surface of the printed circuit board according to various embodiments of the present invention, and a connection region of the shielding unit connected to the side plating portion.
37 is an exploded perspective view showing an electronic device having a shielding unit mounting structure according to various embodiments of the present invention.
38 is an assembly sectional view illustrating an electronic device having a shielding unit mounting structure according to various embodiments of the present invention.
FIG. 39 is a perspective view showing a state of mounting of a battery pack and a shield structure mounted on a printed circuit board according to various embodiments of the present invention. FIG.
40 is a perspective view showing a state of mounting of a battery pack and a shield structure mounted on a printed circuit board according to various embodiments of the present invention.
41 is a plan view showing a printed circuit board according to various embodiments of the present invention.

The present disclosure will be described below with reference to the accompanying drawings. The present disclosure is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and detailed description of the invention is set forth. It is to be understood, however, that this disclosure is not intended to be limited to the specific embodiments, but includes all changes and / or equivalents and alternatives falling within the spirit and scope of the disclosure. In connection with the description of the drawings, like reference numerals have been used for like elements.

The use of the term "including" or "including" in the present disclosure indicates the presence of a corresponding function, operation, or element, etc., and does not limit the invention to one or more additional features, operations, or components. Also, in this disclosure, the terms "comprises" or "having ", and the like, specify that the presence of stated features, integers, But do not preclude the presence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

The "or" in the present disclosure includes any and all combinations of words listed together. For example, "A or B" may include A, B, or both A and B.

The terms "first," "second," "first," or "second," and the like in the present disclosure can modify various elements of the disclosure, but do not limit the elements. The expressions do not limit the order and / or importance of the components, etc. The expressions may be used to distinguish one component from another component. For example, the first user device and the second user device both For example, without departing from the scope of the present disclosure, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component . ≪ / RTI >

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this disclosure is used only to describe a specific embodiment and is not intended to limit the disclosure. The singular expressions include plural expressions unless the context clearly dictates otherwise.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the relevant art and are to be interpreted as either ideal or overly formal in the sense of the art unless explicitly defined in this disclosure Do not.

The electronic device according to the present disclosure may be a device including a communication function. For example, the electronic device can be a smartphone, a tablet personal computer, a mobile phone, a videophone, an e-book reader, a desktop personal computer, a laptop Such as a laptop personal computer (PC), a netbook computer, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device Such as a head-mounted-device (HMD) such as electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic app apparel, an electronic tattoo, or a smartwatch.

According to some embodiments, the electronic device may be a smart home appliance with communication capabilities. [0003] Smart household appliances, such as electronic devices, are widely used in the fields of television, digital video disk (DVD) player, audio, refrigerator, air conditioner, vacuum cleaner, oven, microwave oven, washing machine, air cleaner, set- And may include at least one of a box (e.g., Samsung HomeSync ^TM , Apple TV ^TM , or Google TV ^TM ), game consoles, electronic dictionary, electronic key, camcorder, or electronic frame.

According to some embodiments, the electronic device may be a variety of medical devices (e.g., magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT) (global positioning system receiver), EDR (event data recorder), flight data recorder (FDR), automotive infotainment device, marine electronic equipment (eg marine navigation device and gyro compass), avionics, A security device, or an industrial or home robot.

According to some embodiments, the electronic device may be a piece of furniture or a structure / structure including a communication function, an electronic board, an electronic signature receiving device, a projector, (E.g., water, electricity, gas, or radio wave measuring instruments, etc.). An electronic device according to the present disclosure may be one or more of the various devices described above. It should also be apparent to those skilled in the art that the electronic device according to the present disclosure is not limited to the above-described devices.

Hereinafter, an electronic device according to various embodiments will be described with reference to the accompanying drawings. The term user as used in various embodiments may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

1 illustrates a network environment including an electronic device according to various embodiments. Referring to FIG. 1, the electronic device A101 may include a bus A110, a processor A120, a memory A130, an input / output interface A140, a display A150, and a communication interface A160.

The bus A 110 may be a circuit that connects the above-described components to each other and communicates communication (e.g., a control message) between the above-described components.

The processor Al 120 receives an instruction from the other components (e.g., the memory A 130, the input / output interface A 140, the display A 150, the communication interface A 160, etc.) described above via the bus A 110 , It is possible to decode the received command and to execute an operation or data processing according to the decoded command.

The memory A 130 may be received from the processor A 120 or other components (e.g., the input / output interface A 140, the display A 150, the communication interface A 160, and the like) or generated by the processor A 120 or other components Lt; RTI ID = 0.0 > and / or < / RTI > The memory A 130 may include programming modules such as, for example, a kernel A 131, a middleware A 132, an application programming interface (API) A 133, or an application A 134. Each of the above-described programming modules may be composed of software, firmware, hardware, or a combination of at least two of them.

The kernel A131 may include system resources used to execute an operation or function implemented in the other programming modules, for example, the middleware A132, the API A133 or the application A134 : The bus A110, the processor A120, the memory A130, and the like). The kernel A131 may provide an interface for accessing and controlling or managing the individual components of the electronic device A101 in the middleware A132, the API A133 or the application A134 have.

The middleware A 132 can act as an intermediary for the API A 133 or the application A 134 to communicate with the kernel A 131 and exchange data. In addition, the middleware A 132 may associate at least one application of the application A 134 with a system resource of the electronic device A 101, for example, in association with work requests received from the application A 134, (E.g., scheduling or load balancing) using a method such as assigning a priority that can be used to the bus A110, the processor A120, the memory A130, and the like.

The API A133 is an interface for the application A134 to control the functions provided by the kernel A131 or the middleware A 132 and may be an interface such as file control, At least one interface or function (e.g.

According to various embodiments, the application A134 may be an SMS / MMS application, an email application, a calendar application, an alarm application, a health care application (e.g., an application that measures momentum or blood glucose) E.g., applications that provide air pressure, humidity, or temperature information, etc.). Additionally or alternatively, the application A134 may be an application related to the exchange of information between the electronic device A101 and an external electronic device such as the electronic device A104. The application associated with the information exchange may include, for example, a notification relay application for communicating specific information to the external electronic device, or a device management application for managing the external electronic device .

For example, the notification delivery application may transmit notification information generated in another application (e.g., an SMS / MMS application, an email application, a healthcare application, or an environment information application) of the electronic device A101 to an external electronic device Device A 104). Additionally or alternatively, the notification delivery application may receive notification information from, for example, an external electronic device (e.g., electronic device A 104) and provide it to the user. The device management application may be configured to perform a function (e.g., a function) of at least a portion of an external electronic device (e.g., electronic device A 104) in communication with the electronic device A 101 (E. G., Installing, deleting, or otherwise) managing services (e. G., Call services or message services) provided by the external electronic device or applications running on the external electronic device Update).

According to various embodiments, the application A134 may include an application designated according to attributes (e.g., the type of electronic device) of the external electronic device (e.g., electronic device A104). For example, if the external electronic device is an MP3 player, the application A134 may include an application related to music playback. Similarly, if the external electronic device is a mobile medical device, the application A134 may include applications related to healthcare. According to one embodiment, the application A134 may include at least one of an application specified in the electronic device A101 or an application received from an external electronic device (e.g., the server A106 or the electronic device A104).

The input / output interface A 140 transmits commands or data input from a user via an input / output device (e.g., a sensor, a keyboard or a touch screen) to the processor A 120, A130) and transmit it to the communication interface A 160. For example, the input / output interface A 140 may provide the processor A 120 with data on the user's touch input through the touch screen. The input / output interface A 140 may receive commands or data received from the processor A 1200, the memory A 130, and the communication interface A 160 via the bus A 110, for example, Output interface A 140 can output voice data processed through the processor A 120 to a user through a speaker.

The display A 150 may display various information (e.g., multimedia data or text data) to the user.

The communication interface A 160 can connect communication between the electronic device A 101 and an external device (e.g., the electronic device A 104 or the server A 106). For example, the communication interface A 160 may be connected to the network A 162 through wireless communication or wired communication to communicate with the external device. The wireless communication may include, for example, wireless fidelity, Bluetooth, near field communication (NFC), global positioning system (GPS) , WiBro or GSM, etc.). The wired communication may include at least one of, for example, a universal serial bus (USB), a high definition multimedia interface (HDMI), a recommended standard 232 (RS-232) or a plain old telephone service (POTS).

According to various embodiments, the network A 162 may be a telecommunications network. The communication network may include at least one of a computer network, an internet, an internet of things, or a telephone network. According to one embodiment, a protocol (e.g., a transport layer protocol, a data link layer protocol, or a physical layer protocol) for communication between the electronic device A101 and an external device includes an application A134, an application programming interface A133, May be supported by at least one of the middleware A132, the kernel A131, or the communication interface A160.

2 is a front perspective view of an electronic device according to an embodiment of the present invention. 3 is a rear perspective view of an electronic device according to an embodiment of the present invention.

Referring to FIGS. 2 and 3, a touch screen 190 is disposed at the center of the front surface 100a of the electronic device 100. FIG. The touch screen 190 is largely formed to occupy most of the front surface 100a of the electronic device 100. [ 2, an example in which the main screen is displayed on the touch screen 190 is shown. The main home screen is the first screen displayed on the touch screen 190 when the electronic device 100 is powered on. Also, when the electronic device 100 has different pages of different home screens, the main home screen may be the first home screen of the plurality of pages. Short icons (191-1, 191-2, 191-3), main menu change keys (191-4), time, weather, and the like for executing frequently used applications can be displayed on the home screen. The main menu switching key 191-4 displays a menu screen on the touch screen 190. [ A status bar 192 may be provided at the upper portion of the touch screen 190 to indicate the status of the device 100 such as the battery charging status, the intensity of the received signal, and the current time.

A home button 161a, a menu button 161b, and a back button 161c may be formed on the lower portion of the touch screen 190.

The home button 161a displays a main home screen on the touch screen 190. [ For example, when the home screen 161a is touched while the home screen or any other home screen or menu screen other than the main home screen is displayed on the touch screen 190, Can be displayed. In addition, when the home button 191a is touched while applications are being executed on the touch screen 190, the main home screen shown in FIG. 2 may be displayed on the touch screen 190. FIG. The home button 161a may also be used to display recently used applications on the touch screen 190 or to display a task manager.

The menu button 161b provides a connection menu that can be used on the touch screen 190. The connection menu may include a widget addition menu, a background screen change menu, a search menu, an edit menu, a configuration menu, and the like. The back button 161c may display a screen that was executed immediately before the currently executed screen, or may terminate the most recently used application.

A first camera 151, an illuminance sensor 170a, and a proximity sensor 170b may be disposed at the edge of the front surface 100a of the electronic device 100. [ A second camera 152, a flash 153, and a speaker 163 may be disposed on the rear surface 100c of the electronic device 100. [

The side 100b of the electronic device 100 may include a power / reset button 160a, a volume button 161b, a terrestrial DMB antenna 141a for broadcasting reception, one or more microphones 162, . The DMB antenna 141a may be fixed to the apparatus 100 or may be removably formed.

Further, a connector 165 is formed on the lower side surface of the electronic device 100. A plurality of electrodes are formed on the connector 165 and may be connected to an external device by wire. An earphone connection jack 167 may be disposed on the upper side of the electronic device 100. An earphone can be inserted into the earphone connection jack 167. The earphone connection jack 167 may be disposed on the lower side of the electronic device 100.

In the figures to be referred to, a three-dimensional X / Y / Z Cartesian coordinate system is shown wherein the 'Z axis' refers to the vertical direction, the up and down direction of the printed circuit board, and the 'X axis' refers to the first horizontal direction, Refers to the horizontal direction of the substrate, and the 'Y axis' refers to the horizontal direction, which means the vertical direction of the printed circuit board in the second horizontal direction perpendicular to the first horizontal direction.

4 is a perspective view schematically showing a printed circuit board used in the electronic device according to the embodiment.

Referring to FIG. 4, the printed circuit board 20 mounted on the electronic device can be regarded as a type of electronic component element printed with wiring and layout space necessary for mounting a plurality of electronic components. Recently, a multilayer structure has been implemented . The configuration for such a printed circuit board 20 will be easily understood by those skilled in the art.

The printed circuit board 20, which is used as a central component of many electronic devices, is formed on the surface or surface of the electrically insulating substrate or in the interior thereof by using a conductive material . The printed circuit board 20 may serve as a pedestal for mounting various components in the final product and to connect signals of the components to each other.

The electronic device includes at least one printed circuit board (20), so that a plurality of chips or components supporting many functions can be mounted on the printed circuit board (20). The plurality of parts can be mounted on the upper surface 21, the lower surface 22, and the side surface 23 of the printed circuit board 20, respectively. The upper surface 21 and / or the lower surface 22 of the printed circuit board can be mounted using a surface mounting device (SMD). The printed circuit board 20 may be rigid or flexible. In addition, the printed circuit board 20 may be mounted in an electronic device with a type of articulated structure in which a plurality of rigid substrates are connected by a flexible substrate. The printed circuit board may be manufactured by shielding (e.g., plating) a conductive material to shield the noise generated in the printed circuit board on the outer circumference 210.

Hereinafter, a mounting structure mounted on a printed circuit board will be described as an example of a shielding unit, which is a component used for shielding electromagnetic waves, among a plurality of components mounted on the printed circuit board 20 .

With reference to FIG. 5A, noise shielding generated in the printed circuit board will be described.

Referring to FIG. 5A, if there is an internal signal line on the printed circuit board 20, the noise generated in the signal line can be leaked to the outside.

Referring to FIG. 5A, noise may be shielded by plating the side surface of the printed circuit board 20 in order to prevent noise generated from the printed circuit board 20 from flowing out to the outside. And the shielding effect can be provided by the printed circuit board side plating 33. That is, noises generated in the wiring of the printed circuit board 20 can be suppressed from external exposure through the side plating 33 connected to the ground of the substrate. EMI can be improved through a via hole (not shown) (not shown in FIG. 6).

Referring to FIG. 5B, shielding of ESD penetrating into the substrate will be described.

5B, when the signal line (wiring) is provided on the printed circuit board 20, ESD generated from the outside penetrates into the printed circuit board 20, Can be influenced by the internal wiring of the semiconductor device.

Referring to FIG. 5B, the side of the printed circuit board may be plated to prevent the ESD from penetrating into the printed circuit board 20 and affecting the substrate wiring. The ESD can be configured to flow along the side plating section 33 without penetrating into the printed circuit board 20 by the side plating section 33.

As will be described in detail below, a printed circuit board according to various embodiments of the present invention may further include a plating area on a side surface as well as a pad provided on an upper surface and / or a lower surface of the printed circuit board, And at least a part of the side plating portion on the side of the printed circuit board is exposed so as to be exposed at the outermost portion of the substrate so that internal noise shielding and ESD internal penetration generated in the printed circuit board can be prevented.

6 is a diagram for comparing an embodiment of a shielding unit mounted on a printed circuit board. 6, the structure at the upper part of Fig. 6 is the conventional shielding unit mounting structure shown in Fig. 7, and the structure at the lower part of Fig. 6 is the shielding unit mounting structure shown in Fig. 8 shows a mounting structure of the shielding unit of the present invention. FIG. 6 will be referred to and described together with FIGS. 7 to 8. FIG.

Referring to FIGS. 6 and 7, components of the conventional printed circuit board 20 (hereinafter, referred to as 'substrate') may be mounted on the upper and lower surfaces 21 and 22, A substrate on which a plurality of electronic components are mounted will be described as an example. The related components P may be mounted on the substrate 20 in a surrounding manner using a shielding unit S. [ The shielding unit S is spatially shielded from the mounted parts P with respect to the shielding for the electrical interference signal and the signal radiated into the space. The mounting structure of the shielding unit S is a shielding unit side SMD type and a side plating portion 31 (about 50?) Is formed on the side surface 23 of the substrate, and the shielding unit S is a side plating portion 31) by using the SMD method. Conventional substrates may have via holes (about 180?) To shield generated noise. The plurality of mounted components P may be associated with the RF unit, associated with power, or electronic components associated with the processor. Reference numeral 11 denotes a space between the electronic component P and the shielding unit S, and BP denotes a battery pack.

However, since the shielding unit S is connected to the substrate side surface 23, a space (X-axis direction) for mounting the shielding unit is required on the side surface of the substrate, thereby reducing wiring space and mounting space for other components.

Hereinafter, a mounting structure of a shielding unit according to various embodiments of the present invention will be described with reference to the accompanying drawings.

8 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

8, the mounting structure of the shielding unit according to various embodiments of the present invention includes a substrate 20, a pad 330 formed on the upper surface 21 of the substrate 20, And a shielding unit S connected to the pad 330. The shielding unit S may include a shielding unit S, A plurality of parts P may be mounted on the upper surface 21 in an SMD manner and the mounted plurality of parts P may be associated with an RF part, . The shielding unit S may be mounted so as to be wrapped on the parts P in a shape to enclose the parts P. [ The shielding unit S may be connected to the pad 330. The connection position of the shielding unit S may be completely positioned within the area of the pad 330 and may be connected to be slightly shifted toward the side plating part 332 (X axis direction).

The upper surface pad 330 and the side plating portion 332 may be directly connected to each other. The upper surface pad 330 and the side plating portion 332 may be fabricated in the order that the side plating portion 332 is formed after the pad 330 is formed at the time of manufacturing the substrate. In addition, the upper surface pad 330 and the side plating portion 332 may be formed to have different plating thicknesses from each other. The thickness of the side plating part 332 may be smaller than the thickness of the pad 330.

The upper surface pad 330 may be formed on the substrate by a soldering method, or may be formed by a method other than a soldering method.

The shielding unit mounting structure shown in FIG. 8 has a distance d1, that is, a space, as compared with the shielding unit mounting structure shown in FIG. That is, the space occupied by the via hole and the shielding unit can be utilized as a component mounting space. For example, it can be utilized as a mounting space of a battery pack adjacent to the end surface plating unit.

9 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

9, a mounting structure of a shielding unit according to various embodiments of the present invention includes a substrate 20, a pad 340, a side plating portion 342, a shielding unit 340 connected to the pad 340, (S). A plurality of parts P may be mounted on the upper surface 21 in an SMD manner and the mounted plurality of parts P may be associated with an RF part, . The shielding unit S may be mounted so as to be wrapped on the parts P in a shape to enclose the parts P. [ The shielding unit S may be connected to the upper surface pad 340.

The plating section 34 according to various embodiments may include a top pad 340 and a side plating section 342. The upper surface pad 340 and the side plating portion 342 may be directly connected to each other.

The upper surface pad 340 and the side plating portion 342 may have a rectangular cross-sectional shape. The upper surface pad 340 may be substantially coplanar with the upper surface 21 of the substrate and the side plating portion 342 may be substantially identical to the side surface of the shielding unit S And may be formed in a planar state. The side plating part 342 is configured to be substantially flush with the side surface of the shielding unit S so that the side surface of the substrate can be disposed in a substantially planar state with the side surface of the shielding unit S.

The upper surface pad 340 is connected to the shielding unit S, and the EMI / EMC / ESD improvement is enhanced by the side plating unit 342, securing a component wiring space and a support space, and also a mounting structure is excellent .

9, the shape of the shielding unit S connected to the upper surface pad 340 is connected to the upper surface pad in an area corresponding to the thickness of the shielding unit S without being bent or curved in order to maximize utilization of the internal space .

10 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

The shielding unit mounting structure according to various embodiments of the present invention shown in Fig. 10 is different from that of Fig. 9 only in the configuration of the shielding unit, and the rest of the configuration is the same and therefore will not be described. The shielding unit shown in FIG. 11 can be equally applied to a shielded unit-mounted power unit according to various embodiments of the present invention.

Referring to FIG. 10, the shielding unit according to one embodiment may include a shielding frame F and a shielding cover C. The shielding frame (F) and the shielding cover (C) are independently manufactured and can be coupled to each other. The shielding frame F may be vertically disposed in a state of being connected to the upper surface pad 340 on the substrate 20 in the form of a vertical wall type. The shielding cover C may be disposed horizontally in a shape covered with the shielding frame F. The shielding frame F may be connected to the upper surface pad 340 and the shielding cover C may not be connected to the upper surface pad 340. The shielding cover C may be arranged to cover the open upper end of the shielding frame F so as to be shielded from the outside.

11A is a cross-sectional view illustrating a shielding unit mounted on a printed circuit board according to various embodiments of the present invention.

The shielding unit S (shield structure) according to various embodiments is disposed on the electronic part P so as to be wrapped around the electronic part P. The place where the cover s1 and the sidewall s2 meet is stepped, (s3) can be formed. A component such as a coaxial cable can be mounted on the space s3. Reference numeral BP denotes a battery pack. The battery pack BP may be disposed in parallel without being overlapped with the substrate 20, the side plating portion 342, or the shielding unit S. [

11B is a cross-sectional view illustrating another shielding unit mounted on a printed circuit board 20 according to various embodiments of the present invention.

The shielding unit S (shield structure) according to various embodiments is disposed on the electronic part P so as to be wrapped. The cover s1 and the sidewall s2 meet at an inclination, s4) can be formed. A component such as a coaxial cable can be mounted in the space s4. The battery pack BP may be disposed in parallel without being overlapped with the substrate 20, the side plating portion 342, or the shielding unit S. [ The degree of inclination of the inclined load may be determined in consideration of the position of the component P.

11C is a cross-sectional view illustrating another shielding unit mounted on a printed circuit board according to various embodiments of the present invention.

The shielding unit S (shield structure) according to various embodiments is disposed on the electronic part P so as to be wrapped. The side wall s11 may be inclined to form an additional component mounting space s5. A component such as a coaxial cable can be mounted on the space s5. The battery pack BP may be disposed in parallel without being overlapped with the substrate 20, the side plating portion 342, or the shielding unit S. [ Here, the inclination of the side wall s11 may be determined in consideration of the position of the component P.

12 is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

The shielding unit mounting structure according to various embodiments of the present invention shown in FIG. 12 differs from that of FIG. 10 only in the configuration of the shielding unit, and the rest of the configuration is the same. The shielding unit shown in Fig. 12 can be equally applied to a shielded unit-mounted power unit according to various embodiments of the present invention.

Referring to Fig. 12, the shielding unit according to one embodiment may include a shielding frame F and an outer housing T (H2). The shielding frame F and the outer housing H2 may be made of metal. The shielding frame (F) and the outer housing (H2) may be made of one, or may be independently manufactured and joined together. At this time, the outer housing and the shielding frame may be connected to each other through a conductive material to improve bonding strength between them. The shielding frame F may be vertically disposed in a state of being connected to the upper surface pad 340 on the substrate 20 in the form of a vertical wall type. The outer housing (H2) may be horizontally disposed in a shape covered with the shielding frame (F). The shielding frame F may be connected to the upper surface pad 340 and the outer surface housing H2 may not be connected to the upper surface pad 340. [ The exterior housing H2 may be disposed to cover the open upper end of the shielding frame F and to be shielded from the outside, and may be disposed so as to surround the frame F. [ The frame F may be SMD connected to the upper surface pad, or connected to the upper surface pad via a SMD clip, or may be connected to a tape attached to the upper surface pad. Also, a conductive material may be connected to the frame F, or the frame F itself may be connected by the force of the housing H2 without SMD.

13A is a top plan view of a top pad formed in a printed circuit board according to various embodiments of the present invention. 13B is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention. 13C is a plan view showing a connecting region of a shielding unit in a part of a top pad and a side plating portion formed on a printed circuit board according to various embodiments of the present invention.

13A to 13C, a plurality of upper surface pads 340 formed on the substrate 20 according to one embodiment may be formed along the first direction. The upper surface pad 340 may include first and second upper surface pads 340a and 340b spaced apart from each other in a first direction on the outermost side surface of the substrate 20. At least a part of the second upper surface pad 340b may be a part of the upper surface of the side plating part 342. [

When the shielding unit S is connected to the first and second upper surface pads 340a and 340b, the first and second upper surface pads 340a and 340b are indirectly connected to the connection region 340c of the shielding unit S Can be connected. In addition, the shielding unit S may be an exterior housing of a metallic material exposed to the outside of the electronic device.

That is, the upper surface pad 340 may be directly connected to the side plating portion 342 (see FIG. 10), and indirectly connected to the side plating portion 342 by the shielding unit S .

14 is a cross-sectional view showing a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

14, a mounting structure of a shielding unit according to various embodiments of the present invention includes a substrate 20, and an upper surface 21, a side surface 23, and a lower surface 22 of the substrate 20 A plating unit 35, and a shielding unit S connected to the plating unit 350 on the upper surface by an SMD method.

A plurality of parts P may be mounted on the upper surface 21 in an SMD manner and the mounted plurality of parts P may be associated with an RF part, . The shielding unit S may be mounted so as to be wrapped on the parts P in a shape to enclose the parts P. [ The connection position of the shielding unit S may be completely positioned within the area of the top pad 350 or may be connected to be slightly shifted toward the side plating section 352 (X axis direction).

The plating section 35 according to various embodiments may include a top pad 350, a side plating section 352, and a bottom pad 354. The upper surface pad 350, the side surface plating portion 352, and the lower surface pad 354 may be directly / indirectly connected to each other. The upper pad 350, the lower plating pad 352 and the lower pad 354 are formed with the lower pad 354 after the upper pad 350 is formed during the fabrication of the substrate, (352) are formed. However, the order of fabrication is not limited. Each of the upper surface pads 350, the side surface plating portions 352 and the lower surface pads 354 may have substantially the same thickness or different thicknesses. The plating thickness of the side plating part 352 may be greater than the thickness of the upper surface pad 350 and the lower surface pad 354.

The upper surface pad 350 and the side surface plating portion 352 may have a rectangular cross section and the side surface plating portion 352 and the lower surface pad 354 may have a rectangular cross- And the upper surface pad 350 and the lower surface pad 354 may be formed parallel to each other. The upper surface pad 350 may be substantially coplanar with the upper surface 21 of the substrate and the lower surface pad 354 may be substantially coplanar with the lower surface 23 of the substrate. And the side plating portion 352 may be formed to be substantially parallel to the substrate side 23. The top pad 350 is connected to the shielding unit, and the side plating unit 352 improves the EMI / EMC / ESD, secures the component wiring space and support space, and has a good mounting structure.

15 is a cross-sectional view showing a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

15, a mounting structure of a shielding unit according to various embodiments of the present invention includes a substrate 20, and an upper surface 21, a side surface 23, and a lower surface 22 of the substrate 20 A plating unit 36, and a shielding unit S connected to the plating unit 360 on the upper surface by an SMD method. The shielding unit sidewall s2 and the side plating unit 362 may be disposed in the same plane along the substantially vertical direction.

16A is a cross-sectional view illustrating a state in which a shielding unit is mounted on a printed circuit board according to various embodiments of the present invention.

The shielding unit mounting structure according to various embodiments of the present invention shown in FIG. 16A is omitted in FIG. 15 because the remaining components are the same, except that the lower shielding unit S2 is added. The shielding unit mounting structure shown in Fig. 16A is equally applicable to the shielding unit mounting structure according to various embodiments of the present invention.

Referring to FIG. 16A, a shielding unit according to an exemplary embodiment may be mounted on a lower surface pad 364, such as an upper surface pad 360, with a lower shielding unit S2. In other words, the upper shielding unit S and the lower shielding unit S2 can be mounted while sharing one pad 36. [ The upper and lower shielding units S and S2 may be disposed to face each other with respect to the substrate 20. The pad 36 may include a top pad 360 on the top surface of the substrate 20 and a bottom pad 354 on the bottom surface of the substrate 20. Although not shown in the drawings, a plurality of components may be mounted on the bottom surface of the substrate 20, and a plurality of components may be disposed so as to surround the lower shielding unit S2. In addition, the lower shielding unit S2 may be configured as an outer housing exposed to the outside. The lower shielding unit S2 may be connected to the side plating unit 362 to perform the same function as the upper shielding unit S.

Referring to FIG. 16B, the shielding unit according to an embodiment may be mounted on the lower pad 366 formed apart from the side plating portion, such as the upper pad 360, with the lower shielding unit S2. The upper and lower shielding units S and S2 may be disposed to face each other with respect to the substrate 20. In addition, the lower shielding unit S2 may be configured as an outer housing exposed to the outside. The lower shielding unit S2 may be disposed apart from the side plating unit 362 to perform the same function as the upper shielding unit S. [ At this time, the shielding unit may not be overlapped with the battery pack BP, but may be disposed side by side with a slight gap therebetween.

Hereinafter, an electrical connection structure between a shielding unit mounting structure and a peripheral structure will be described with reference to the accompanying drawings.

17 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.

17, at least a part of the shielding unit S is electrically connected to at least a part of the housing H by at least one conductive part 37, in the shielded unit mounting structures according to various embodiments of the present invention. . The conductive part 37 may include parts made of an electrically conductive conductive material, for example, a contact terminal and a conductive balloon. The shielding unit S can provide a structure by which the conductive part 37 can extend the transmission of signals generated in the system ground (GND) or the electric element or other substrate 20 connected to the system ground .

18 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.

18, at least a portion of the side plating portion 38 is electrically connected to at least a portion of the housing H by at least one conductive portion 380, in shielded unit mounting structures according to various embodiments of the present invention. . The conductive part 380 is disposed between the side plating part 38 and the housing H so that the shielding unit S and the side plating part 38 can be electrically connected to the housing H have. The conductive part 380 may include parts made of an electrically conductive conductive material, for example, a contact terminal or the like. The shielding unit S provides a structure that can expand the transmission of signals generated in the system ground GND or an electric element connected to the system ground or other substrate 20 by the conductive portion 380 can do. At least a part of the conductive part 380 may be resilient so as to maintain a close contact state between the side plating part 38 and the housing H. [

19 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.

19, at least a portion of the side plating portion 39 may be electrically connected to at least a portion of the housing H by the conductive portion H1, in the shielded unit mounting structures according to various embodiments of the present invention. have. The conductive portion H1 is disposed between the side plating portion 39 and the housing H so that the side plating portion 39 can be electrically connected to the housing H. [ The conductive portion H1 may be a part of the housing. The conductive portion H1 may be a portion extending integrally from the housing H, for example. The shielding unit S can provide a structure that can expand the transmission of signals generated in the system ground GND and other substrates 20 by the conductive portion H1. Although not shown in the drawing, a connection terminal may further be disposed between the conductive portion H1 and the side plating portion 39. [ The conductive portion H1 may be disposed to be in close contact with the bottom surface of the side plating portion 39 so as to maintain a close contact state between the side plating portion 39 and the housing H. [

20 is a cross-sectional view illustrating a connection structure between a shielding unit and a housing according to various embodiments of the present invention.

20, in a shielding unit mounting structure according to various embodiments of the present invention, at least one housing H is provided on the top of a shielding unit S which is directly or indirectly connected to the side plating portion 39 Or more of the conductive parts H3. The shielding unit (S) may be electrically connected to at least a part of the housing (H) by the at least one conductive part (H3). The conductive portion H3 may include parts made of an electrically conductive conductive material. The shielding unit S can provide a structure capable of expanding the transmission of signals generated in the system ground (GND) or the electric element or other substrate 20 connected to the system ground by the conductive portion H3 .

Hereinafter, a configuration of a printed circuit board having a plating unit according to various embodiments of the present invention will be described with reference to the drawings.

21A is a perspective view illustrating a printed circuit board according to various embodiments of the present invention. Fig. 21B is a plan view of Fig. 21A. Fig. 21C is a cross-sectional view taken along line A-A in Fig. 21B.

21A to 21C, a substrate 20 according to various embodiments of the present invention includes a top surface 21, a plurality of side surfaces 23, pads 401 formed on the top surface 21, And a side plating part 402 formed along the side surface 23. A plurality of components may be mounted on the upper surface 21 and the lower surface 22 of the substrate 20 in the SMD type.

The upper surface pad 401 may include a region to which a shielding unit, for example, a shield can or a housing, is connected. The area may be a connection area.

In addition, the upper surface pad 401 and the side surface plating portion 402 are formed on the substrate 20, but a plurality of the upper surface pad 401 and the side surface plating portion 402 may be spaced apart from each other along the periphery of the substrate 20. As will be described later, the upper surface pad 401 and the side plating unit 402 may be embodied in various shapes. The upper surface pad 401 and the side plating 402 may be arranged in a 1: 1 alignment state (in a one-to-one correspondence relationship with one another), or may not be arranged. 21A to 21C illustrate an embodiment in which the upper surface pad and the side plating portion 1; 1 are arranged in an aligned state.

Hereinafter, embodiments in which the top pad and the side plating portions 1 and 1 are not arranged in an aligned state will be described.

22A is a perspective view showing a printed circuit board on which a plating section according to various embodiments of the present invention is formed. FIG. 22B is a plan view of FIG. 22A. FIG. 22C is a cross-sectional view taken along the line B-B in FIG. 22B.

22A to 22C, a substrate 20 according to various embodiments of the present invention includes a top surface 21, a plurality of side surfaces 23, and top pads 411 provided on the top surface 21 And a side plating unit 412 formed along the side surface 23.

The upper surface pad 411 and the side plating portion 412 may be integrally connected. The upper surface pad 411 may be formed substantially parallel to the upper surface 21 of the substrate or in a coplanar state. The side plating portion 412 may have a predetermined thickness and be formed in a state of being substantially parallel to or coplanar with the substrate side 23. When the side view is formed on the side surface of the substrate, the top end surface of the side plating portion 412 may be at least a part of the top surface pad 411. As the plating thickness of the side plating section 412 is thicker, the upper surface of the side plating section 412 can act as the upper surface pad 411, that is, the area connected to the shielding unit can be expanded.

The upper surface pad 411 may include at least one area to which the shielding unit is connected. The area may be a plurality of connection areas.

The space between the upper surface pads 411 may be formed to prevent excessive overflow of the solder when the shielding unit is disposed and SMD is performed. The upper surface pad 411 and the side surface plating portion 412 are formed on the substrate 20 only one at a time but may be spaced apart from each other along the outer circumference of the substrate 20.

23A is a perspective view showing a printed circuit board on which a plating section according to various embodiments of the present invention is formed; FIG. 23B is a plan view of FIG. 23A. FIG. 23C is a cross-sectional view taken along the line C-C in Fig. 23B. Fig.

23A to 23C, a substrate 20 according to various embodiments of the present invention includes an upper surface 21, a plurality of side surfaces 23, upper surfaces 421 and 422 provided on the upper surface 21, And a side plating portion 422 formed along the side surface 23. After the upper surface pad 421 is formed on the upper surface of the substrate, the side plating portion 422 may be formed on the side surface of the substrate. In addition, at least a part of the upper surface pad 421 formed on the upper surface of the substrate may be formed through side plating.

The substrate may include an upper surface pad 421 and a side plating portion 422. The upper surface pad 421 and the side plating portion 422 may be integrally connected. The upper surface pad 421 may be substantially parallel or coplanar with the upper surface 21 of the substrate. The side plating portion 422 may be formed in a state of being substantially parallel to or coplanar with the substrate side 23. The upper surface pad 421 may be at least one connection region to which the shielding unit is connected. The upper surface pad 421 and the side surface plating portion 422 are formed on the substrate 20 only one at a time and may be spaced apart from each other along the periphery of the substrate 20.

24A is a perspective view showing a printed circuit board on which a plating section according to various embodiments of the present invention is formed; 24B is a plan view of Fig. 24A. FIG. 24C is a cross-sectional view taken along the line D-D in FIG. 24B. FIG.

24A to 24C, a substrate 20 according to various embodiments of the present invention includes a top pad 431 provided on the top surface 21 and a plurality of side plating portions 432 ).

The substrate 20 may include a top pad 431 and a plurality of side plating portions 432. The upper surface pad 431 and the side plating portion 432 may be integrally connected. The upper surface pad 431 may be substantially parallel or coplanar with the upper surface 21 of the substrate. The side plating portion 432 may be formed in a state of being substantially parallel to or coplanar with the substrate side surface 23. The upper surface pad 431 may be a connection region to which the shielding unit is connected. Two side plating parts 412 may be formed at intervals on the upper surface pad 411. The upper surface pad 431 and the side surface plating portion 432 are formed on the substrate 20 only by one and may be spaced apart from each other along the periphery of the substrate 20.

25 is a top view of a printed circuit board according to various embodiments of the present invention.

25, the substrate 20 according to various embodiments of the present invention may include a top pad 441, a connection pad 443, and a side plating portion 442 formed along the side surface 23. The description of the side plating portion is omitted, and is the same as that of the side plating portion 412 shown in Figs. 22A to 22C, and a detailed description thereof will be omitted.

The upper surface pad 441 and the unillustrated side plating portion may be integrally connected. The upper surface pad 441 may be formed substantially parallel to the upper surface 21 of the substrate or in a coplanar state. The upper surface pad 441 may be a region to which the shielding unit is connected. The upper surface pad 441 may include a connection pad 443 to which a shielding unit is connected. In addition, the upper surface pad 441 and the side surface plating portion are illustrated as being formed with only one substrate 20, but may be formed at a plurality of intervals along the outer circumference of the substrate 20.

26 is a plan view showing a printed circuit board in various embodiments of the present invention.

Referring to FIG. 26, a substrate according to various embodiments of the present invention may include a top pad 451, a connection pad 453, and a side plating portion 452 formed along the side surface 23.

The description of the side plating portion is omitted, and is the same as that of the side plating portion 412 shown in FIGS. 22A to 22C, and a detailed description thereof will be omitted.

The upper surface pad 451 and the side plating portion 452 may be integrally connected. The top surface 21 of the substrate on which the top surface pad 451 is located may be at least a part of the periphery. The upper surface pad 451 may be formed substantially parallel to the substrate upper surface 21 or in the same plane state. The upper surface pad 451 may include a region to which the shielding unit is connected. The connection pad 453 may be an area connected to the side plating part 452. The upper surface pad 451 and the side surface plating portion 452 are formed on the substrate 20 only one at a time and may be spaced apart from each other along the periphery of the substrate 20.

27 is a plan view showing a printed circuit board according to various embodiments of the present invention.

Referring to Figure 27, a substrate 20 according to various embodiments of the present invention may include a top pad 461, a connection pad 463, and a side plating 462 formed along side 23 have. A plurality of components may be mounted on the upper surface 21 and the lower surface 22 of the substrate 20 in the SMD type. The detailed description of the side plating portion 462 is omitted, and is the same as that of the side plating portion 412 shown in FIGS. 22A to 22C, and a detailed description thereof will be omitted.

The upper surface pad 461 and the side plating portion 462 may be integrally connected. The top surface 21 of the substrate on which the top surface pad 461 is located may be at least a part of the periphery. The upper surface pad 461 may be formed substantially parallel to the upper surface 21 of the substrate or in a coplanar state. The upper surface pad 461 may include a region to which the shielding unit is connected.

The upper surface pad 461, the connection pad 463 and the side plating portion 462 are illustrated as being formed on the substrate 20 at a plurality of intervals along the periphery of the substrate 20, .

28 is an enlarged plan view of a printed circuit board on which a plating section according to various embodiments of the present invention is formed. 29 is a front view showing a state in which a plating portion is plated on a curved surface in a printed circuit board according to various embodiments of the present invention.

28 and 29, a substrate 50 according to various embodiments of the present invention includes a top surface 51, a bottom surface, and a plurality of side surfaces 53, wherein at least a portion of the side surface 53 May be composed of one or a plurality of curved surfaces (530). Of the substrate side surfaces 53, the side to which the plating part 54 is plated may be formed of a curved surface 530. The curved surface 530 may be formed to be spaced apart or continuously along the side surface 53. The curved surface 530 may be configured to have a curvature. The curvature may be configured to be in the XY plane. The curved surface 530 may be configured to extend in the vertical direction (Z-axis direction).

The at least one curved surface 530 may be formed at the time of manufacturing the substrate 50 or may be formed using a tool such as a drill not shown. The curved surface 530 is formed on the side surface 53 of the substrate 50 so that the plating surface of the plating portion 54 is increased and the plating portion 54 plating can be formed more stably than before. In particular, the curved surface 530 is preferably applied to at least a portion of the substrate side 53 to which the plating portion is plated.

It should be noted that the curved surface 530 may be equally configured to the substrate described in Figures 21-27. According to the above-described substrate configuration, the plating section plated on the curved surface may also be formed to have the pad curved surface 540.

Figure 30 is a side view of a printed circuit board side with a plating portion according to various embodiments of the present invention. 31 is a side sectional view showing a state in which a plating portion is plated on a side of a printed circuit board on which a plating portion according to various embodiments of the present invention is formed;

30 and 31, a substrate 60 according to various embodiments of the present invention includes a top surface 61, a bottom surface 62, and a plurality of side surfaces 63, At least some or all of the curved surfaces 630 may be composed of one or a plurality of curved surfaces 630. Of the substrate side surfaces 63, the side to which the plating portion 64 is plated may be a curved surface 630. The curved surface 630 may extend continuously along the side surface 53. The curved surface 630 may have a curvature. The curvature can be configured to be in the XZ plane. The curved surface 630 may be configured to extend in the longitudinal direction (Y-axis direction).

The at least one curved surface 630 may be manufactured at the time of manufacturing the substrate 60. The curved surface 630 is formed on the side surface 63 of the substrate 60 so that the plating surface of the plating portion 54 is increased and the plating portion 64 plating can be formed more stably than before. In particular, the curved surface 630 is preferably applied to all or at least a portion of the substrate side 63 on which the plating portion is plated.

It should be noted that the curved surface 630 may be equally configured on the substrate on which the plating section described in Figs. 21 to 27 is formed. According to the above-described substrate configuration, the plating portion 64 plated on the curved surface 640 may also have a pad curved surface 640.

32, in the process in which the shielding unit S is connected to the substrate in the SMD manner, the shielding unit S is connected to the leg pad B (to be connected to the top pad 70) And the leg portion B may be connected to the upper surface pad 70 by a solder 71. In this case, The one leg portion B can be connected to one upper surface pad 70. However, the leg portion B of the shielding unit according to the connection structure may be lifted from the upper surface pad 70, and connection failure may occur. Such connection defects need to be improved.

Referring to FIG. 33A, the shielding unit S according to one embodiment may be connected to a plurality of upper surface pads 72 and 74 on one leg portion B. That is, in the step of connecting the shielding unit S to the substrate by the SMD method, a plurality of upper surface pads 72 and 74 formed on the substrate may have one leg portion B and a soldering region 75, respectively . At this time, a lead-free area 73 may be formed between the upper and lower pads 72 and 74, and the amount of lead to be supplied to the lead- The amount of lead provided to each of the upper surface pads 72, 74 connected to the leg portion B can be increased, respectively, as compared with the connection structure shown in Fig. The leg portion B of the shielding unit can be connected to increase the amount of connection with each of the upper surface pads 72 and 74, that is, the connection height (thickness), depending on the increased lead amount, It is possible to prevent a bad connection.

On the other hand, FIG. 33A shows a structure in which two upper surface pads are connected to one leg (connecting portion) of the shielding unit, thereby increasing the thickness of the connection due to an increase in the amount of lead, .

Conversely, referring to FIG. 33B, a similar effect can be obtained when one upper surface pad 70 is connected to the two legs B1, B2 of the shielding unit S. The soldering structure in which the two legs B1 and B2 and the one upper surface pad 70 are connected to each other is effective in preventing the shielding unit from lifting as compared with the soldering structure in which one leg and one upper surface pad are connected. That is, there is a region where the amount of lead to be provided to the leg portion is not provided by the gap of the leg portion, and the amount of lead not provided at that time is connected to the leg portion to increase the amount of lead provided.

34, when a shielding unit (FIG. 33; S) is mounted on the substrate 20 by the SMD method, a plurality of upper surface pads 72, 74 ) Can be formed. One leg portion of the shielding unit may be connected to the plurality of upper surface pads 72 and 74.

At this time, the side plating portions may be configured to be connected to the respective upper surface pads 72 and 74, or may be configured not to be connected.

35, one leg portion B of the shielding unit S may be connected to a plurality of upper surface pads 72 and 74, respectively, and each of the upper surface pads 72 and 74 may include a side plating portion So that each of the upper surface pads 72 and 74 can be connected to each other by the side plating portion. In addition, the upper surface pads 72 and 74 may be connected to each other by a leg portion B.

36A is a view showing a connection area of a shielding unit connected to a plurality of formed top-side pads and a plurality of side plating parts on a first surface of a printed circuit board according to various embodiments of the present invention.

Referring to FIG. 36A, a plurality of upper surface pads 380 and 382 may be formed on the printed circuit board 20 in the second direction (Y direction). For example, two first and second top pads 380 and 382 are shown in the figure. The first and second top pads 380 and 382 formed on the upper surface of the printed circuit board 20 may be connected to the first and second side plating units 381 and 383 formed on the side surface. One leg of the shielding unit may be connected to the first and second top surface pads. Reference numeral 384 may be a connection region of the shielding unit. One of the legs of the shielding unit may connect the first and second upper surface pads 380 and 382.

36B is a view showing a plurality of top surface pads formed along the second direction on the first surface of the printed circuit board according to various embodiments of the present invention and a connection area of the shielding unit connected to the side surface plating unit.

Referring to FIG. 36B, a plurality of upper surface pads 380 and 382 may be formed on the printed circuit board 20 in the second direction (Y direction). For example, two first and second top pads 380 and 382 are shown in the figure. The first and second top pads 380 and 382 formed on the upper surface of the printed circuit board 20 may be connected to a single side plating unit 385 formed on the side surface. One leg of the shielding unit may be connected to the first and second upper surface pads 380 and 382. Reference numeral 386 may be a connection region of the shielding unit. One of the legs of the shielding unit may connect the first and second upper surface pads 380 and 382.

Referring to FIG. 36C, the leg portions of the shielding unit can be connected across the upper surface pads 380, 382, and 385.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a configuration of an electronic device equipped with a shield structure (shielding unit) according to various embodiments of the present invention will be described with reference to the accompanying drawings.

37 and 38, an electronic device according to various embodiments may include first and second covers 390 and 391 forming part of the appearance. The first cover 390 may be formed on one surface of the electronic device, for example, the front surface, and the second cover 391 may be formed on the other surface of the electronic device, for example, the rear surface. Accordingly, the first cover 390 may be referred to as a front cover, and the second cover 391 may be referred to as a rear cover. The second surface 390 may be opposed to the first cover 390 in the opposite direction. The first cover 3900 may include at least one of a metal, a glass, and a polymer material. The second cover 391 may include glass.

A printed circuit board 20 on which a plurality of various electronic components are disposed may be disposed between the first and second covers 390 and 391. The printed circuit board 20 may be supported by an internal support structure 392. The printed circuit board 20 may include a first surface 21 facing the first cover 390 and a second surface 22 and side surfaces 23 facing the second cover 391. At least one or more various electronic components adjacent to a portion of the side surface 23 may be disposed on the printed circuit board first surface 21 and / or the second surface 22, Some of the deployed at least one of the electronic components may be covered by the shield structure (S). Also, at least a portion of the printed circuit board side 23 may be provided with a recess 23a in which at least a portion or all of the first conductive structure 393a is located.

The shield structure may be defined in the same or similar meaning as the shielding unit already described. The shield structure S includes a cover s1 disposed between the first cover 390 and the first surface 21 and a cover s1 extending from the periphery of the cover s1 toward the first surface 21 And may include at least one sidewall s2. The electronic component is enclosed by the cover s1 and sidewalls s2 bent downward from the edge of the cover s1. The shield structure S includes a conductive material, for example, a metallic material.

The printed circuit board 20 according to various embodiments may have a first side 21 and a second side 22 and a side 23 and a first conductive structure 393a May be formed. The first conductive structure may be defined in technical terms that may include a side plating portion. At least one second conductive structure may be formed on at least a portion of the first surface of the substrate by the printing tool. The second conductive structure may be connected to the first conductive structure and have a surface facing the first cover. The first and second conductive structures may be formed to have different thicknesses from each other. The first conductive structure may have a first thickness and the second conductive structure may have a second thickness. The first thickness may be less than the second thickness. The first thickness may be about 50 탆, and the second thickness may be about 400 탆.

The second conductive structure may be formed in various shapes. For example, the second conductive structure may be formed in a linear or alphabetic letter T shape. In addition, the second conductive structure may extend in a second direction from a portion of the side of the printed circuit board, and a width of the second direction may be larger than a value of the second thickness.

The first conductive structure is formed to be connected to the second conductive structure and may extend from the edge of the first surface of the printed circuit board to the edge of the second surface.

The sidewall of the shield structure may include a portion contacting the surface while extending in a non-parallel first direction with the surface. The contacting portion may be formed on at least one side surface. The contacting portion may be disposed on the first surface of the printed circuit board so as to overlap with the second conductive structure. Further, the contacting portion may be arranged to be aligned with a portion of the side of the printed circuit board when viewed from the first side of the printed circuit board. The surface may be perpendicular to the first direction.

39 and 40, at least a portion of the shield structure according to various embodiments may be disposed adjacent to the battery pack. In addition, at least a part of the side of the printed circuit board may be disposed adjacent to the battery pack. In addition, the first conductive structure may be disposed adjacent to the battery pack, specifically, between the side surface and the battery pack. The battery pack may be arranged in parallel to the shield structure without overlapping with the shield structure. In addition, at least one or more shield structures according to various embodiments may be disposed along the periphery of the battery pack.

41 is a plan view showing a printed circuit board according to various embodiments of the present invention.

Referring to FIG. 41, the top pad 30 electrically connected to the side plating portion (not shown in FIG. 6) may or may not be connected to the electrical signal of the substrate 20. When the upper surface pad 30 is electrically connected to the printed circuit board 20, it may be directly connected to the GND of the printed circuit board 20 or may be connected to a specific signal through at least one electromagnetic part or coupling. However, the upper surface pads 30 may be electrically connected to each other through the shielding unit. When the top pad 20 is directly connected to the GND of the printed circuit board 20, the GND is extended to lower the DCR of the GND to stabilize the signal level and improve the heat spread. When the upper surface pad 30 is connected to the printed circuit board 20 through an electromagnetic part, for example, a capacitor 300, or connected through a coupling, And the AC voltage can be limited to a certain frequency value to be transmitted to the shielding unit. When the shielding unit is connected to an external metal region, the amount of AC transferred inside the PCB can be reduced to prevent an electric shock. In the case of electric shock, when the shielding unit is prevented from being connected to the external metal region through the existing insulating tape, space is required as much as the insulating tape. However, when DC and some AC are limited to the electric devices as described above, The thickness of the terminal can be reduced. In addition, when the upper surface pad 30 is connected to the printed circuit board 20 by an electromagnetic part, for example, an inductor, it can perform the same role by limiting some frequency values of the AC. Reference numeral S1 denotes a space in which the component is mounted on the printed circuit board.

The various embodiments of the disclosure set forth in this specification and the drawings are illustrative only and are not intended to limit the scope of the disclosure in any way to facilitate the understanding of the disclosure of the disclosure and the understanding of the disclosure. Accordingly, the scope of the present disclosure should be construed as being included within the scope of the present disclosure in addition to the embodiments disclosed herein, all changes or modifications derived from the technical idea of the present disclosure.

Claims (25)

In an electronic device,
A first cover forming one surface of the electronic device;
A second cover forming an opposing surface of said one surface;
A printed circuit board disposed between the first cover and the second cover, the printed circuit board including a first surface facing the first cover, a second surface facing the second cover, and a side surface;
At least one electronic component disposed on the first surface adjacent a portion of the side surface;
A cap disposed between the first cover and the first surface to cover the at least one electronic component and a shield including a sidewall extending from a periphery of the cover toward the first surface, rescue;
A first conductive structure formed on a portion of the side of the PCB; And
A second conductive structure coupled to the first conductive structure on a portion of the first side of the PCB and having a surface facing the first cover,
Wherein the sidewall includes a portion that is in contact with the surface while extending in a first direction that is nonparallel to the surface,
Wherein the portion of the sidewall contacting the surface overlaps the second conductive structure when viewed from above the PCB. 2. The apparatus of claim 1, wherein a portion of the sidewall contacting the surface is aligned with a portion of a side of the PCB when viewed from a first side of the PCB. The apparatus of claim 1, wherein the shield structure comprises a conductive material. 2. The apparatus of claim 1, wherein the first direction is perpendicular to the surface. The apparatus of claim 1, wherein the first cover comprises at least one of the metallic, glass, or polymeric material, and the second cover comprises glass. 2. The apparatus of claim 1, wherein the second conductive structure comprises a T-shape. The apparatus of claim 1, further comprising a battery disposed adjacent a portion of a side of the PCB. 8. The apparatus of claim 7, wherein the first conductive structure is located between the battery and a portion of a side of the PCB. 2. The apparatus of claim 1, wherein the first conductive structure has a first thickness, the sidewall of the shield structure has a second thickness, and wherein the first thickness is less than the second thickness. 10. The method of claim 9, wherein the second conductive structure extends in a second direction from a portion of a side of the PCB, and a value of a width of the second conductive structure in the second direction is greater than a value of the second thickness Characterized in that. 2. The apparatus of claim 1, wherein the first conductive structure extends from an edge of a portion of a first side of the PCB to an edge of a portion of a second side of the PCB. 12. The apparatus of claim 11, wherein at least one of the first conductive structure or the second conductive structure comprises a plating layer. The apparatus of claim 1, wherein the connecting portion of the cover and the side wall of the shield structure comprises a groove or recess extending along an edge of the cover. 2. The apparatus of claim 1, wherein a portion of the side of the PCB comprises a recess, and wherein at least a portion of the first conductive structure is located within the recess. 2. The apparatus of claim 1, further comprising a third conductive structure on a portion of a second side of the PCB, the third conductive structure being connected to the first conductive structure and having a surface facing the second cover. 16. The electronic device of claim 15, further comprising: a cap disposed between the second cover and the second surface; and a sidewall extending from the periphery of the cover toward the second surface, further comprising another shield structure comprising a sidewall. 2. The apparatus of claim 1, wherein the shield structure is electrically connected to at least a portion of the electronics exterior housing using a conductive portion. The apparatus of claim 1, wherein the first conductive structure is electrically connected to at least a portion of the housing of the electronic device using a conductive portion. The apparatus of claim 1, wherein the substrate side on which the first conductive structure is formed comprises at least one curved surface. 20. The apparatus of claim 19, wherein the curved surface has a curvature and the curvature is provided in an XY plane. 20. The apparatus of claim 19, wherein the curved surface has a curvature and the curvature is provided in an XZ plane. 2. The apparatus of claim 1, wherein the second conductive structure is formed in a plurality of areas, and each of the second conductive structures includes a region for preventing lead overflow. 2. The device of claim 1, wherein the shield structure comprises a plurality of leg portions connected to a second conductive structure, wherein the one leg portion connects to a plurality of second conductive structures, Devices not connected. 2. The apparatus of claim 1, wherein the second conductive structure is formed on the substrate in a plurality, wherein each second conductive structure is connected to or not connected to the first conductive structure. The apparatus of claim 1, wherein a plurality of the second conductive structures are formed, wherein each of the second conductive structures is directly connected to the first conductive structure or indirectly connected thereto by the shield structure.

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