KR20160099064A - Three way valve of exhaust depowder module for semiconductor display manufacturing equipment having direct heating function - Google Patents
Three way valve of exhaust depowder module for semiconductor display manufacturing equipment having direct heating function Download PDFInfo
- Publication number
- KR20160099064A KR20160099064A KR1020160098139A KR20160098139A KR20160099064A KR 20160099064 A KR20160099064 A KR 20160099064A KR 1020160098139 A KR1020160098139 A KR 1020160098139A KR 20160098139 A KR20160098139 A KR 20160098139A KR 20160099064 A KR20160099064 A KR 20160099064A
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- Prior art keywords
- valve
- main body
- exhaust
- way valve
- fixing groove
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 108
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000000843 powder Substances 0.000 claims abstract description 47
- 230000002093 peripheral effect Effects 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 238000012423 maintenance Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 40
- 239000007789 gas Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 14
- 239000006227 byproduct Substances 0.000 description 13
- 238000000151 deposition Methods 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002341 toxic gas Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Valves (AREA)
Abstract
A three-way valve of an exhaust de-powder module for a semiconductor display manufacturing equipment is provided for a hollow exhaust pipe located between a vacuum pump and a scrubber to suppress deposition of powder. The three-way valve includes a main body having a working space formed therein, first and second valve flanges detachably coupled to the main body in the longitudinal direction of the main body, The first, second and third flow paths are formed in the inside of the provided third valve flange and the first, second and third valve flanges, . The opening and closing ball is rotatably provided in the operating space of the main body, and a through hole is formed therein. The through hole is formed to have the same size as the inner diameters of the first, second and third flow paths. The driving member is detachably installed in the main body part, and a pivot pin is provided to rotate the pivoting ball with the tip thereof fixed. The heating member is wound around the outer peripheral surface of at least one of the main body portion of the valve body, and the first, second, and third valve flanges. A safety cover is detachably provided to the valve body to surround the heating member.
Description
[0001] The present invention relates to a three-way valve for an exhaust manifold module for a semiconductor manufacturing plant, and more particularly to a three-way valve for a semiconductor manufacturing plant, and more particularly, to a method of manufacturing a semiconductor or display (LCD, OLED) by chemical vapor deposition (CVD), an ion implantation process, (Diffusion). A reactive gas is introduced into a process chamber such as a dry etching process and the reactive gas is activated by using plasma and heat to repeatedly perform processing such as film forming and processing on the substrate to be processed. The process chamber is typically connected to a vacuum pump to maintain a reduced pressure, and reactive gases and reaction byproducts that do not contribute directly to the reaction are discharged through an exhaust pipe, a vacuum pump, and a scrubber.
Here, the exhaust pipe connecting the process chamber to the vacuum pump and the vacuum pump and the scrubber uses a three-way valve as a connection fitting portion.
In the three-way valve composed of the L port or the T port, the inner diameter of the flow path is smaller than the inner diameter of the exhaust pipe, so that the flow of the reaction byproduct is stagnated and the powder is adhered or deposited on the inner wall of the low- By providing the heating member on the outer circumferential surface of the valve body of the three-way valve, the generation of powder is suppressed by directly or indirectly heating the heating jacket together with the heating member together with the heating member, To a three-way valve of an exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function using a heat insulation jacket having a simple warming function instead of a heating jacket.
The through holes of the opening and closing ball are formed to have the same size as the inner diameters of the first, second and third flow paths of the valve body, To a three-way valve of an exhaust de-powder module for a semiconductor display manufacturing machine with greatly improved function.
Generally, the semiconductor manufacturing process is largely composed of a fabrication process and a post-process (assembly process).
The entire process is a process for fabricating a semiconductor chip having a specific circuit pattern by repeatedly performing a film forming process for depositing a thin film on a wafer in various process chambers and a process for selectively etching the deposited thin film . The post-process refers to a process of assembling a semiconductor chip manufactured in the previous process with a lead frame for a package and assembling the semiconductor chip into a finished semiconductor product.
At this time, in the case of a CVD process and an etching process for depositing a thin film on a wafer or for etching a thin film deposited on a wafer, the process is performed at a high temperature using a noxious gas in the process chamber. During this process, a large amount of various harmful gases, corrosive foreign substances, and gases containing toxic components are generated in the process chamber. That is, only about 30% of the noxious gas is deposited on the surface of the wafer in the chamber, and unreacted reactive gas and reaction by-products are discharged.
A scrubber for purifying the gas discharged from the process chamber and discharging the gas to the atmosphere is provided at the rear end of the vacuum pump for bringing the process chamber into a vacuum state.
However, the exhaust gas between the process chamber and the vacuum pump is solidified and changed into powder, and the powder is adhered to the exhaust pipe or deposited and fixed so as to increase the exhaust pressure, and when the pump is introduced into the pump, . That is, the reaction byproducts in the gas discharged from the process chamber to the vacuum pump are fixed to the inner wall of the exhaust pipe to cause clogging of the exhaust pipe, and they are bonded to the body of the vacuum pump to damage the vacuum pump.
Efforts to solve this problem have been extensively researched and one of the representative ones has been proposed in which a heating jacket is disposed on the outer surface of the exhaust pipe. However, since this is an indirect heating method, there is a problem in that the removal efficiency of the powder is low, and the conversion to the direct heating method is required.
On the other hand, due to the characteristics of semiconductor or display manufacturing, a scrubber and a preliminary scrubber are installed and operated for production without stopping the operation for 24 hours. Maintenance of the scrubber requires regular maintenance. In the conventional three-way valve, the powder is deposited and fixed on the inner wall of the flow path, so that the flow of the exhaust gas is switched from the scrubber in the linear direction () to the preliminary scrubber () During maintenance, the pressure became abnormally high, making it difficult to perform stable process operations.
On the other hand, FIG. 18 shows a three-way valve (TV) of an exhaust de-powder module for a semiconductor display manufacturing equipment according to the prior art, which is provided in a hollow exhaust pipe positioned between a vacuum pump and a scrubber, have.
As shown in the drawing, the conventional three-way valve TV includes a
At this time, the opening and closing ball OB is rotatably provided in the operating space of the
Since the first and
In order to solve the above problems, a technical object of the present invention is to provide a heating member on the outer circumferential surface of a valve body of a three-way valve, thereby suppressing generation of powder by applying a direct heating method by the heating member, There is provided a three-way valve of an exhaust de-powder module for a semiconductor display manufacturing equipment having a direct heating function capable of extending a cleaning cycle.
Another object of the present invention is to provide a method of effectively reducing powder generation by applying a direct heating method using the heating member as well as an indirect heating method using a conventional heating jacket.
Another object of the present invention is to use a thermal jacket instead of a heating jacket to perform a function of keeping the heat generated in the heating member of the valve body warm.
Another object of the present invention is to provide a valve body in which inner diameters of first, second and third flow paths formed in first, second and third valve flanges of the valve body are formed in the same size, It is possible to obtain an effect of suppressing the generation of powder by not forming a tilted portion in the same size as the inner diameter of the flow path.
SUMMARY OF THE INVENTION [0006]
A three-way valve of an exhaust de-powder module for a semiconductor display manufacturing equipment, provided in a hollow exhaust pipe positioned between a vacuum pump and a scrubber, for suppressing the deposition of powder,
A main body part having a working space formed therein, first and second valve flanges detachably coupled to the main body part in the longitudinal direction of the main body part, and third and fourth valve flanges respectively protruding in a direction perpendicular to the first and second valve flanges, First, second and third flow paths are formed in the inside of the main body portion and the first, second and third valve flanges, respectively, and the first, second and third flow paths are formed in the valve body :
A through hole is formed in the operating space of the main body so as to be rotatable, and the through hole is formed in the same size as the inner diameters of the first,
A driving member detachably installed in the main body portion and having a pivot pin for rotating the front end of the opening /
A heating member wound on an outer peripheral surface of at least one of the main body portion, the first, second and third valve flanges of the valve body, And
And a safety cover detachably provided to the valve body so as to surround the heating member, wherein the heating member directly heats the valve body. The apparatus for manufacturing a semiconductor display having a direct heating function And a three-way valve of an exhaust diaphragm module.
A heating jacket may be further provided to be detachable from the valve body so as to enclose the safety cover from outside and to indirectly heat the valve body.
A heat insulating jacket is detachably provided in the valve body instead of the heating jacket to prevent the heat of the valve body from being discharged to the outside.
The heating member includes a main heater coil, a first heater coil, a second heater coil, and a third heater coil integrally connected to each other. The main body portion of the valve body, the first, The first fixing groove, the second fixing groove, and the third fixing groove are formed in the main fixing groove, the first fixing groove, the second fixing groove, and the third fixing groove, the main heater coil, the first heater coil, Two heater coils and a third heater coil may be provided connected to each other.
The scrubber further comprises a preliminary scrubber,
The exhaust gas discharged from the exhaust pipe during maintenance of the scrubber
The preliminary scrubber can be switched to the preliminary scrubber without being sent to the scrubber.
A fixing member is provided over several places so that the heating member is fixedly and detachably fixed to the fixing groove on the outer circumferential surface of the main body portion, and the fixing member can be fixed to the valve body at one end by welding.
A fixing member is provided over several places so that the main heater coil, the first, second, and third heater coils of the heating member are fixedly and detachably fixed from fixing grooves on the outer peripheral surface of the main body portion, Can be fixed to the valve body.
A fixing member is provided over several places so that the main heater coil, the first, second, and third heater coils of the heating member can be fixedly and detachably fixed from fixing grooves on the outer peripheral surface of the main body portion, A nut fixedly welded to a surface of the valve body, and a fixture including a horizontal portion having a long hole and a vertical fixing portion extending at a right angle from one end of the horizontal portion. In order to fix the first, The horizontal portion of the fixing member is in surface contact with the upper surface of the nut when the screw is inserted into the nut through the long hole of the horizontal portion and the vertical fixing portion is in contact with the main heater coil, It can be pressed (pressurized) and fixed.
The main fixing groove, the first fixing groove, the second fixing groove, and the third fixing groove may be epoxy-filled.
The driving member may comprise an actuator.
According to an aspect of the present invention,
A three-way valve of an exhaust de-aerator module for a semiconductor display manufacturing equipment, provided in a hollow exhaust pipe positioned between a vacuum pump and a scrubber, for suppressing deposition and deposition of a powder,
A main body part having a working space formed therein, first and second valve flanges detachably coupled to the main body part in the longitudinal direction of the main body part, and third and fourth valve flanges respectively protruding in a direction perpendicular to the first and second valve flanges, First, second and third flow paths are formed in the inside of the main body portion and the first, second and third valve flanges, respectively, and the first, second and third flow paths are formed in the valve body :
A through hole is formed in the operating space of the main body so as to be rotatable, and the through hole is formed in the same size as the inner diameters of the first,
A drive member detachably installed in the main body portion and having a pivot pin for pivoting the tip end of the pivot pin to be rotatable;
And a safety cover detachably provided to the valve body so as to surround the heating member. The present invention provides a three-way valve for an exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function .
According to the three-way valve of the exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function of the present invention, the chemical vapor deposition method, the ion implantation process, and the diffusion-type doping in manufacturing a semiconductor or a display (LCD, OLED). The present invention is applied to semiconductor display manufacturing equipment for suppressing the deposition of reaction byproducts in the gas discharged from the process chamber such as dry etching and the gas passing through the vacuum pump onto the flow path of the three-way valve and the inner wall of the through- Since the heating member directly heats the valve body by suppressing the generation of powder on the inner wall of the flow path of the three-way valve by providing the heating member in the fixing groove on the outer circumferential surface of the body, Way valve of an exhaust de-powder module for a semiconductor display manufacturing equipment having a heating function.
In addition, not only a direct heating method using the heating member but also an indirect heating method using a conventional heating jacket are applied together to effectively reduce powder generation.
In addition, it is also possible to provide a warming function instead of the heating jacket to prevent the heat of the heating member from being discharged to the outside.
Particularly, the inner diameters of the first, second and third flow paths of the first, second and third valve flanges of the valve body are formed in the same size, and the through holes of the opening / The generation of powder due to stagnation of reaction by-products can be suppressed. In other words, the first flow path, the through hole, and the second flow path are formed in a straight line without inclined portions. Therefore, it is possible to suppress the generation of powder as much as possible in the course of the reaction by-products passing through.
1 is a schematic view showing an installation state of a three-way valve of an exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function according to the present invention;
FIG. 2 is a perspective view showing a three-way valve in a state of being coupled with an actuator in FIG. 1; FIG.
Fig. 3 is an exploded perspective view of the opening and closing ball and the second valve flange from the valve body in Fig. 2; Fig.
FIG. 4 is a three-way valve exploded perspective view in which the heating member is coupled to the valve body in FIG. 2; FIG.
Fig. 5 is a three-way valve exploded perspective view in which the heating member is separated from the valve body in Fig. 4; Fig.
FIG. 6 is a perspective view of the three-way valve in FIG. 2; FIG.
Figure 7 is a plan view of Figure 6;
8 and 9 are sectional views taken along line A-A in Fig. 7, Fig. 8 is a state in which the first and second flow paths of the first and second valve flanges are open, Fig. 9 is a cross- 1, 3 euros open;
FIG. 10 is a view showing a part of a valve body in which the main heater coil is fixed by a fixing bracket as an example in FIG. 4;
11 is a front sectional view of Fig. 10; Fig.
FIG. 12 is a view showing a part of a valve body showing another embodiment in which the main heater coil is fixed by a fixing member in FIG. 4; FIG.
13 is a front sectional view of Fig. 10; Fig.
FIG. 14 is a partial cross-sectional view of a three-way valve according to the present invention, in which the first and second flow paths of the first and second valve flanges are open and showing the passage of the exhaust gas.
FIG. 15 is a partial cross-sectional view of a three-way valve according to the present invention, in which the first and third flow paths of the first and third valve flanges are open and showing the passage of the exhaust gas.
FIG. 16 is a photograph of a heating jacket before being coupled to a three-way valve according to the present invention; FIG.
17 is a photograph of a heating jacket coupled to a three-way valve according to the present invention; And
18 is a cross-sectional view of a conventional three-way valve.
Hereinafter, the present invention relates to a three-way valve (TV) of an exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function of the present invention.
FIG. 1 is a view showing an installation state of a three-way valve (TV) of an
The three-way valve TV of the
FIG. 2 shows a three-way valve TV coupled to an actuator AC in FIG. 1, but a structure such as a manual handle may be used instead of an actuator. 3 is a view showing the state in which the opening and closing ball OB and the
4 is an exploded perspective view of a three-way valve (TV) in which the heating member 120 is coupled to the
As shown in Figs. 3 to 9, the three-way valve TV includes a
The opening and closing ball OB is rotatably provided in the
The driving member DM is detachably installed in the
The heating member 120 is wound around the outer peripheral surface of at least one of the
The heating member 120 is preferably wound around the outer peripheral surface of the
The
FIG. 16 is a photograph before the
The heating jacket 141 may be detachably provided to the
The heating member 120 includes the
The fixing
12 and 13, the fixing
The assembling and operating states of the three-way valve (TV) of the
First, the three-way valve TV of the
The
Here, the opening and closing ball OB is rotatably provided in the
14 shows a state in which the first and
15 is a diagram showing a state in which the first and
The heating member 120 composed of the
The fixing
In this state, the
A
Thus, in the present invention, the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
For example, in the detailed description and the accompanying drawings, the three-way valve (TV) of the
It is needless to say that the three-way valve VC can be constructed solely of the
VC: Vacuum pump SR: Scrubber
EP: Exhaust pipe
100: Exhaustion powder module TV: Three way valve
110: valve body 112: main body part
112a: main fixing
114:
114b: first flow path 116: second valve flange
116a: second fixing
118:
118b: Third Euroblock OB: opening and closing ball
OB1: through hole DM: driving member
DM1: Pivot pin 120: Heating element
122: main heater coil 124: first heater coil
126: second heater coil 128: third heater coil
130: Safety cover 140: Heating jacket
141: thermal insulation jacket 150: fixing member
152: screw 154: nut
156:
156b:
Claims (11)
A main body part having a working space formed therein, first and second valve flanges detachably coupled to the main body part in the longitudinal direction of the main body part, and third and fourth valve flanges respectively protruding in a direction perpendicular to the first and second valve flanges, Wherein the first, second and third flow paths are formed in the valve flange and the first, second and third valve flanges, respectively,
A through hole is formed in the operating space of the main body so as to be rotatable, and the through hole is formed in the same size as the inner diameters of the first,
A driving member detachably installed in the main body portion and having a pivot pin for rotating the front end of the opening /
A heating member wound on an outer peripheral surface of at least one of the main body portion, the first, second and third valve flanges of the valve body, And
And a safety cover detachably provided to the valve body so as to surround the heating member, wherein the heating member directly heats the valve body. The apparatus for manufacturing a semiconductor display having a direct heating function 3-way valve of exhaust diaphragm module.
Wherein the first fixing groove, the second fixing groove, and the third fixing groove are filled with epoxy. The three-way valve of the exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function.
A main body part having a working space formed therein, first and second valve flanges detachably coupled to the main body part in the longitudinal direction of the main body part, and third and fourth valve flanges respectively protruding in a direction perpendicular to the first and second valve flanges, First, second and third flow paths are formed in the inside of the main body portion and the first, second and third valve flanges, respectively, and the first, second and third flow paths are formed in the valve body :
A through hole is formed in the operating space of the main body so as to be rotatable, and the through hole is formed in the same size as the inner diameters of the first,
A drive member detachably installed in the main body portion and having a pivot pin for pivoting the tip end of the pivot pin to be rotatable;
And a safety cover detachably provided on the valve body. The three-way valve of an exhaust de-powder module for a semiconductor display manufacturing facility having a direct heating function.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20150129103 | 2015-09-11 | ||
| KR1020150129103 | 2015-09-11 |
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| Publication Number | Publication Date |
|---|---|
| KR20160099064A true KR20160099064A (en) | 2016-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160098139A KR20160099064A (en) | 2015-09-11 | 2016-08-01 | Three way valve of exhaust depowder module for semiconductor display manufacturing equipment having direct heating function |
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| KR (1) | KR20160099064A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101888819B1 (en) | 2017-04-20 | 2018-08-16 | 동주에이피 주식회사 | Heater Embedded Type Valve |
| KR102027150B1 (en) * | 2019-05-02 | 2019-10-01 | (주)엠아이 | Multidirectional valve with embedded heater |
| KR102031517B1 (en) * | 2019-04-11 | 2019-10-11 | 송범식 | Ball valve unit with temperature control |
| KR20190119845A (en) * | 2018-04-13 | 2019-10-23 | 이재연 | Three-way Ball Valve for High temperature gas |
| KR102109330B1 (en) | 2018-12-18 | 2020-05-12 | 동주에이피 주식회사 | Heating Pipe Module |
| KR102161842B1 (en) | 2019-05-29 | 2020-10-05 | 주식회사 다원물산 | Heating apparatus for three way valve of exhaust depowder module |
| KR20200120461A (en) * | 2019-07-19 | 2020-10-21 | 송범식 | Ball valve unit with temperature control |
-
2016
- 2016-08-01 KR KR1020160098139A patent/KR20160099064A/en active Search and Examination
Non-Patent Citations (1)
| Title |
|---|
| 특허등록번호 제10-0967395호(발명의 명칭: 반도체 제조 장비용 배기 디파우더 모듈, 특허권자: 주식회사 엠아이, 등록일자: 2010.06.24) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101888819B1 (en) | 2017-04-20 | 2018-08-16 | 동주에이피 주식회사 | Heater Embedded Type Valve |
| KR20190119845A (en) * | 2018-04-13 | 2019-10-23 | 이재연 | Three-way Ball Valve for High temperature gas |
| KR102109330B1 (en) | 2018-12-18 | 2020-05-12 | 동주에이피 주식회사 | Heating Pipe Module |
| KR102031517B1 (en) * | 2019-04-11 | 2019-10-11 | 송범식 | Ball valve unit with temperature control |
| KR102027150B1 (en) * | 2019-05-02 | 2019-10-01 | (주)엠아이 | Multidirectional valve with embedded heater |
| KR102161842B1 (en) | 2019-05-29 | 2020-10-05 | 주식회사 다원물산 | Heating apparatus for three way valve of exhaust depowder module |
| KR20200120461A (en) * | 2019-07-19 | 2020-10-21 | 송범식 | Ball valve unit with temperature control |
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