KR20160093236A - Composition of photo sensitive resin including polysiloxane - Google Patents

Abstract

The present invention relates to a photosensitive resin composition used as a pixel defined layer (PDL) partitioning boundaries between respective pixels of an OLED display device and insulating the same and a flattening layer having insulating properties and flatly formed on a power portion of the PDL layer. In addition, the photosensitive resin composition comprises polysiloxane to which residual groups containing organic groups of mono-valent or more and Si-O of a cyclic structure are connected.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition containing a polysiloxane,

The present invention relates to a photosensitive resin composition, and more particularly, to a photosensitive resin composition comprising a polysiloxane for forming an insulating film capable of realizing not only insulating properties of an organic light emitting diode (OLED) display device but also heat resistance and high resolution .

In recent years, in the display industry, an OLED display device that displays an image through an organic light emitting layer that generates light itself without a backlight unit in a liquid crystal display (LCD) in which an image is displayed through a separate light source, such as a backlight unit, . Particularly, the OLED display device has recently been used in a small electronic device such as a smart phone and applied to a large electronic device such as a TV. In addition, since the OLED display device can use a mother substrate on which the organic light emitting layer is deposited as a flexible substrate, attention is paid to a display device capable of bending.

Such an OLED display device includes a PDL (Pixel Defined Layer) layer for isolating the respective pixels and insulating them from each other, and a planarization layer having an insulation characteristic formed in a lower portion of the PDL layer. At this time, the PDL layer is precisely patterned through a photolithography process, and as a material for forming the PDL layer, a photosensitive resin composition containing an acrylic compound excellent in sensitivity only has been conventionally used.

However, since the photosensitive resin composition containing the acrylic compound is unstable at a high temperature of about 250 ° C or higher and has a relatively high dielectric constant, it is somewhat difficult to use it as an insulating film such as the PDL layer. In particular, Absorbing moisture absorption rate is high and can be regarded as a material which should not be used substantially as an insulating film of the OLED.

An object of the present invention is to provide a photosensitive resin composition containing a polysiloxane having improved heat resistance as well as insulating properties, while having a very low moisture absorption rate and further improved sensitivity.

In order to achieve the object of the present invention, a photosensitive resin composition according to an embodiment of the present invention includes a PDL (Pixel Defined Layer) layer for isolating the OLEDs, particularly the active OLED display device, (SiO _3/2 ) represented by the following formula (1) is repeatedly formed to form a planarization layer having insulating properties while being flatly formed on the lower part of the PDL layer by a photolithography process, and a polysiloxane .

(Wherein R < ₁ > is a monovalent or higher-valent organic group and R < ₂ >

As described above, the photosensitive resin composition containing the polysiloxane has a relatively low dielectric constant (2.2 to 4) as siloxane (SiO _3/2 ) is connected to the main chain as in Formula 1, The PDL layer or the planarization layer, which is the main function, can be basically excellent.

In addition, the above-mentioned polysiloxane-containing photosensitive resin composition may have a heat-resistant property on the material property of siloxane (SiO _3/2 ) more excellent than the photosensitive resin composition containing an acrylic compound described in the above-mentioned background art. Specifically, the photosensitive resin composition containing the acrylic compound of the background is unstable even at a high temperature of about 250 DEG C, whereas the photosensitive resin composition containing the polysiloxane of the present invention is free from morphological deformation even at high temperatures up to about 400 DEG C Heat resistance characteristics can be obtained.

In addition, the above-mentioned polysiloxane-containing photosensitive resin composition has a relatively low moisture absorptivity due to the other material properties of siloxane (SiO _3/2 ) which does not easily absorb moisture. Accordingly, when the PLD layer or the planarization layer of the OLED is formed using the photosensitive resin composition, the OLED can be protected from a fatal lightning failure that occurs immediately upon contact with moisture.

When the PDL layer or the planarization layer of the OLED is formed through a photolithography process, the photosensitive resin composition containing the polysiloxane has a strong acid-fastness property to siloxane (SiO _3/2 ) The pattern is completely protected from the etching solution, and the PDL layer or the planarization layer of a pattern having a more precise and stable thickness can be formed.

In addition, the photosensitive resin composition containing the polysiloxane may be generated by a high temperature such as plasma used in the entire process of manufacturing the OLED in a state of being formed with the PDL layer or the planarization layer due to another characteristic of the siloxane (SiO _3/2 ) It is possible to make the gas that can be easily released to the outside. As a result, it is possible to prevent the cause of the malfunction of the generated gas by reacting with the OLED.

A photosensitive resin composition comprising a polysiloxane according to one embodiment of the present invention may comprise a moiety represented by any one of R ₁ of Formula 1 to the formulas (2) and (3).

Each of the residues represented by the formulas (2) and (3) can function to lower the dielectric constant so that the insulation property of the PDL layer or the planarization layer formed by the photosensitive resin composition containing the polysiloxane is further improved. Particularly, in the case of the residue of the formula (2) in which two trifluoromethyl groups (CF ₃ ) are connected among the residues represented by the formulas (2) and ( ₃ ), the dielectric constant is further lowered than the residue of the formula (3) .

In addition, each of the residues represented by Chemical Formulas 2 and 3 not only improves the adhesion force so that the PDL layer or the planarization layer formed by the photosensitive resin composition is stably patterned on the electrode or the substrate, but also has a strong acid etching in the photolithography process And may further function to further improve the acid resistance property to the solution.

A photosensitive resin composition comprising a polysiloxane according to another embodiment of the present invention relates to the R ₁ of formula (I) may comprise a moiety of the formula (4).

When the PDL layer or the planarization layer formed by the photosensitive resin composition containing the polysiloxane is formed, the residues represented by the formula (4) may be formed so that some of the double bond portions are opened and other residues can be connected thereto, Or a hardening accelerator or the like, or to adjust the molecular weight through the opened double bond portion to improve the residual film ratio.

A photosensitive resin composition comprising a polysiloxane according to another embodiment of the present invention relates to the R ₁ of formula (I) may comprise a moiety represented by the formula (5).

The moiety represented by the formula (5) serves to improve the transparency of the photosensitive resin composition containing the polysiloxane, thereby increasing the sensitivity to light when the PDL layer or the planarization layer is formed through the photolithography process, So that a pattern can be formed. Particularly, the trifluoromethyl group (CF ₃ ) among the residues represented by the above formula (5) can lower the dielectric constant and the moisture absorptivity, thereby improving the insulating property and allowing the OLED operation to be performed in a more stable state without moisture. In addition, the hydroxyl group in the residue represented by Chemical Formula 5 not only improves the developability in the photolithography process but also functions as a residue to which a photoacid generator (PAC) used in forming a positive pattern can be connected can do.

A photosensitive resin composition comprising a polysiloxane according to another embodiment of the present invention relates to the R ₁ of formula (I) may comprise a moiety represented by the formula (VI).

The moiety represented by the formula (6) further improves transparency, thereby enabling not only the PDL layer or the planarization layer to be more accurately patterned, but also the reactivity in the process can be improved to secure the stability of the formed pattern And so on.

A photosensitive resin composition comprising a polysiloxane according to another embodiment of the present invention can include a moiety represented by any one of R ₂ is the formula 7 to 9 of the general formula (1).

Since the residues represented by any one of formulas (7) to (9) substantially have a structure in which a part of the cyclic structure of Si-O is further included in the photosensitive resin composition containing the polysiloxane, Therefore, it can be stably maintained without deforming even at a high temperature of about 400 ° C or more through its excellent heat resistance characteristics, and can exhibit a lower moisture absorptivity and further improve the acid resistance property, thereby realizing a more precise pattern.

The photosensitive resin composition according to an embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following general formula (10) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (10) are the same as those in the general formulas (2), (4), (5) and (7), respectively.

The photosensitive resin composition according to another embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following formula (11) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (11) are the same as those in the general formulas (3), (4), (5), (6) and (7), respectively.

The photosensitive resin composition according to another embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following general formula (12) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (12) are the same as those in the general formulas (2), (4), (5) and (8), respectively.

The photosensitive resin composition according to another embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following general formula (13) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (13) are the same as those in the general formulas (3), (4), (5), (6) and (8), respectively.

The photosensitive resin composition according to another embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following general formula (14) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (14) are the same as those in the general formulas (2), (4), (5) and (9), respectively.

The photosensitive resin composition according to another embodiment of the present invention may include a polysiloxane in which a plurality of siloxanes (SiO _3/2 ) represented by the following general formula (15) are repeatedly connected.

The residues connected to the siloxane (SiO _3/2 ) in the polysiloxane represented by the general formula (15) are the same as those in the general formulas (3), (4), (5), (6) and (9), respectively.

The photosensitive resin composition according to an embodiment of the present invention may further include a photosensitizer comprising a diazonaphthoquinone compound represented by the following general formulas (16) to (21).

In the above formulas (16) to (21), D is selected from hydrogen and the substituent of the following formula (22) or (23).

1,2,4-diazonaphthoquinone diazide

1,2, -diazonaphthoquinone diazide

Further, to describe the photosensitive agent described above differently, it is preferable to use a 1,2-quinonediazide compound as a photosensitive compound. Specific examples of the 1,2-quinonediazide compound include 1,2-quinonediazide 4-sulfonic acid ester, 1,2-quinonediazide 5-sulfonic acid ester, 1,2-quinonediazide 6-sulfonic acid ester, have. Such a quinone diazide compound is obtained by reacting a naphthoquinone diazidesulfonic acid halogen compound with a phenol compound under a weak base. Specific examples of the phenol compound include 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, 2,2 'or 4,4'-tetrahydroxybenzophenone, 2 , 3,4,3'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,3,4,2'-tetrahydroxy 4'-methylbenzophenone, 2, 3,4,4'-tetrahydroxy 3'-methoxybenzophenone, 2,3,4,2 'or 2,3,4,6'-pentahydroxybenzophenone, 2,4,6,3' , 2,4,6,4 'or 2,4,6,5'-hexahydroxybenzophenone, 3,4,5,3', 3,4,5,4 'or 3,4,5,5 Bis (p-hydroxyphenyl) methane, tri (p-hydroxyphenyl) methane, 1,1,1-tri (p (2,3,4-trihydroxyphenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris , 4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, 4,4'- ratio And the like, (2,5-dimethyl-4-hydroxyphenyl) -2-hydroxyphenyl methane, it can be used as a mixture thereof alone or in combination.

When the compound is synthesized as described above, the degree of esterification is preferably about 50 to 85%. When the degree of esterification is less than about 50%, the retention rate tends to deteriorate. When the degree of esterification is more than about 85% There may be a tendency.

The amount of the 1,2-quinonediazide compound used is preferably about 5 to 100 parts by weight, more preferably about 10 to 50 parts by weight, based on 100 parts by weight of the acrylic copolymer. When the amount of the 1,2-quinonediazide compound used is less than about 5 parts by weight, the difference in solubility between the exposed portion and the non-exposed portion is small, and pattern formation is difficult. When the amount is more than about 100 parts by weight, The unreacted 1,2-quinonediazide compound remains in a large amount and the solubility of the 1,2-quinonediazide compound in the aqueous alkali solution becomes too low, which may make development difficult.

Also, the photosensitive agent is a diazide-based compound which is prepared by esterifying trihydroxybenzophenone with 2-diazo-1-naphthol-5-sulfonic acid to obtain 2,3,4, -trihydroxybenzophenone- 2-naphthoquinonediazide-5-sulfonate, 2-diazo-1-naphthol-5-sulfonic acid, and 2,3,4,4'-tetrahydroxybenzoate Phenone-1,2-naphthoquinonediazide-5-sulfonate can be used alone or in combination. Here, the diazide photosensitive compound may be prepared by reacting a dihydroxy compound such as polyhydroxybenzophenone with 1,2-naphthoquinone diazide or 2-diazo-1-naphthol-5-sulfonic acid .

Meanwhile, two methods for controlling the photosensitizing rate using the photosensitizer include a method of controlling the amount of the photosensitive compound and a method of controlling the photosensitizer using 2,3,4-trihydroxybenzophenone or 2,3,4,4'-tetrahydro There is a method of controlling the esterification degree of 2-diazo-1-naphthol-5-sulfonic acid. More preferably, the photosensitive agent is 2,3,4,4'-tetrahydroxybenzophenone-1,2-naphthoquinonediazide-5-sulfonate and 2,3,4, -trihydroxybenzophenone -1,2-naphthoquinonediazide-5-sulfonate, and it is preferable that the mixing ratio of the two compounds is about 30 to 70: about 70 to 30 parts by weight.

The photosensitive resin composition according to an embodiment of the present invention may further include a solvent. The solvent is usually selected from the group consisting of tetrahydrofuran, xylene, dichlorobenzene, propylene glycol methyl ether, propylene glycol monomethyl ether acetate, gamma butyrolactone, dimethylformamide, dimethylsulfoxide, Lactone, and the like, or a mixture of two or more thereof. Further, ethyl lactate or 4-butoxyethanol may be added to improve coating properties.

In addition, a silane coupling agent may be used in the photosensitive composition containing a polysiloxane according to an embodiment of the present invention to improve adhesion to a substrate. Examples of the silane coupling agent include a carboxyl group, a methacryloyl group, an isocyanate group, and an epoxy group Specific examples of the silane coupling agent having reactive functional groups include trimethoxysilylbenzoic acid,? -Methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane,? -Isocyanate propyl Triethoxysilane,? -Glycidoxypropyltrimethoxysilane, and 2- (3 ', 4'-epoxycyclohexyl) ethyltrimethoxysilane. The silane coupling agents may be used alone or in admixture of two or more. The silane coupling agent may be adjusted in a proportion of 1% by weight or less based on the entire photosensitive resin composition.

A leveling agent may be further added to the photosensitive resin composition according to an embodiment of the present invention as a leveling material for improving the applicability. Examples of the leveling agent include commercially available products such as R-08, R-475, R-30 (manufactured by DIC), BM-1000, BM-1100 (manufactured by BM CHEMIE), Fluoride FC- S-113, S-131, S-141, S-145, and S-143, FC-170C, FC-430 and FC-431 (manufactured by Sumitomo 3M Ltd.) S-382, SC-101, SC-102, SC-103, SC-104, SC-105 and SC-106 (manufactured by Asahi Glass Co., Ltd.) And SH-193, SZ-6032, SF-8428, DC-57 and DC-190 (manufactured by Toray Silicone Co., Ltd.). These leveling agents may be used alone or in combination of two or more. The leveling agent is used in an amount of 1% by weight or less based on the entire photosensitive resin composition.

The polysiloxane-containing photosensitive resin composition according to the present invention thus produced has excellent insulating properties due to the low dielectric constant characteristic of siloxane (SiO _3/2 ), heat resistance characteristics capable of maintaining a stable shape even at about 400 ° C, A PDL layer for isolating the boundary between pixels of the OLED display device and insulating them from each other using a low moisture absorptivity that can not be absorbed well, an acid resistance that can withstand strongly acidic materials, or the like, A highly stable pattern can be basically formed and a fatal defect can be prevented from occurring due to moisture during operation of the OLED.

Particularly, since the photosensitive resin composition has a structure in which an Si-O cyclic structure is further included in some residues, the Si-O cyclic structure is more stable Can exhibit a lower moisture absorption rate while being able to be maintained, and can further improve the acid resistance property, thereby realizing a more precise pattern.

Hereinafter, the photosensitive resin composition according to an embodiment of the present invention will be described in detail with reference to examples and tables. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example 1

54.8 g of triethoxy (2- (4- (trifluoromethyl) cyclohexyl) ethyl) silane for forming the residue represented by the above formula (2), 77.39 g of r-acryloyloxypropyltriethoxysilane for forming the residue represented by the above formula (4) 2, 3, 3, 3-hexafluoro-2 - ((6- (2- (triethoxysilyl) ethyl) decahydro-1,4: 5,8-dimethanonaphthalen -2-yl) methyl) propan-2-ol, the trialkyl (1,3,5,7,9,11,13,15,17-nonaalkyl- 4,6,8,10,12,14,16,18,19,20,21,22-tridecaoxa-1,3,5,7,9,11,13,15,17-nonacylpentacyclo [9.7.1.1 ^{3 , 9 .1 5,15 .1 7,13] docosan} -17-yl) orthosilicate 64.61g, in the diacetone alcohol, 224.64g, and 0.04% by weight for the phosphoric acid 0.129g (charged monomers with stirring at room temperature) water 53 g of dissolved phosphoric acid aqueous solution was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. After 1 hour from the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 110 to 120 DEG C) to obtain a polysiloxane (A1) solution. The solid content concentration of the polysiloxane (A1) solution thus obtained was 40% by weight, and the weight average molecular weight of the polysiloxane (A1) was 5,900.

In 100 parts by weight (solids content) of the polysiloxane (A1) solution, 30 parts by weight of a photosensitizer having an average of three diazonaphthoquinonesulfate groups and five remaining D in the formula (17) 30 parts by weight of propylene glycol monomethyl ether, 0.01 part by weight of FC-4430 as a fluorine surfactant, and 0.01 part by weight of a silicone leveling agent BASF EFKA 占 3600 were added to prepare the photosensitive resin composition [PR1] of the present invention.

Example 2

54.8 g of triethoxy (2- (4- (trifluoromethyl) cyclohexyl) ethyl) silane for forming the residue represented by the above formula (2), 55.28 g of r-acryloyloxypropyltriethoxysilane for forming the residue represented by the above formula (4) 2, 3, 3, 3-hexafluoro-2 - ((6- (2- (triethoxysilyl) ethyl) decahydro-1,4: 5,8-dimethanonaphthalen -2-yl) methyl) propan-2-ol, 54.79 g of triethoxy (2- (4- (trifluoromethyl) cyclohexyl) ethyl) silane for forming the moiety represented by Formula 6, Heptaalkyl-15- (4- (trimethoxysilyl) butyl) -2,4,6,8,10,12,14,16,17, 18,19,20-dodecaoxa-1,3,5,7,9,11,13,15-octasilapentacyclo [9.5.1 ^3,9 .1 ^5,15 .1 ^7,13 ] icosane 72.78 g, diacetone alcohol Was charged, and while stirring at room temperature, 0.146 g of phosphoric acid (0.04% by weight based on the charged monomers) was dissolved in 59 g of water, The solution was added over 10 min. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 L / min and stirred for 40 minutes. Thereafter, the oil bath was heated to 120 DEG C over 30 minutes. After 1 hour from the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 110 to 120 DEG C) to obtain a polysiloxane (A2) solution. The solid content concentration of the polysiloxane (A2) solution thus obtained was 40% by weight, and the weight average molecular weight of the polysiloxane (A2) was 6,000.

A photosensitive agent, a propylene glycol monomethyl ether, a fluorinated surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (A2) solution in the same proportion as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR2].

Example 3

In 100 parts by weight (solid content) of the polysiloxane (A2) solution obtained in Example 2, an average of 3 out of 5 D in the formula (17) was replaced with diazonaphthoquinonesulfonate group and the remaining two were replaced with hydrogen, 30 parts by weight of propylene glycol monomethyl ether as a solvent, 0.01 part by weight of FC-4430 as a fluorine surfactant, and 0.01 part by weight of a silicone leveling agent BASF EFKA 占 3600 were added to obtain a photosensitive resin composition [PR3 ].

Example 4

(100 parts by weight (solids content) of the polysiloxane (A2) solution obtained in Example 2) was added with a photosensitizer 20 having an average of three diazonaphthoquinonesulfate groups and five remaining D in the formula 30 parts by weight of propylene glycol monomethyl ether as a solvent, 0.01 part by weight of FC-4430 as a fluorine surfactant, and 0.01 part by weight of a silicone leveling agent BASF EFKA 占 3600 as a solvent were added to the photosensitive resin composition [PR4 ].

Example 5

In 100 parts by weight (solids content) of the polysiloxane (A2) solution obtained in Example 2, an average of 3 out of 5 D in the formula (17) was replaced with a diazonaphthoquinonesulfonate group and the remaining two were substituted with hydrogen, 30 parts by weight of propylene glycol monomethyl ether as a solvent, 0.01 parts by weight of FC-4430 as a fluorine surfactant, and 0.01 part by weight of a silicone leveling agent BASF EFKA 占 3600 were added to the photosensitive resin composition [PR5 ].

Example 6

In 100 parts by weight (solids content) of the polysiloxane (A2) solution obtained in Example 2, an average of 3 out of 5 D in the formula (17) was replaced with diazonaphthoquinonesulfonate group and the remaining two were substituted with hydrogen, 30 parts by weight of propylene glycol monomethyl ether as a solvent, 0.01 part by weight of FC-4430 as a fluorine surfactant, and 0.01 part by weight of a silicone leveling agent BASF EFKA 占 3600 as a solvent were added to the photosensitive resin composition [PR6 ].

Comparative Example 1

165.17 g of perfluorophenyl triethoxysilane, 55.69 g of glycidoxypropyltriethoxysilane, 90.15 g of ((6,6-dimethylbicyclo [3.1.1] heptan-3-yl) methyl) triethoxysilane and 249.24 g of diacetone alcohol were placed in a 1 L three- An aqueous solution of phosphoric acid in which 0.124 g of phosphoric acid (0.04% by weight based on the charged monomers) was dissolved in 45 g of water was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100 占 폚 and the mixture was heated and stirred for 2 hours (internal temperature: 120 占 폚) to obtain a polysiloxane (R1) solution. The solid content concentration of the polysiloxane solution (R1) thus obtained was 40% by weight, and the weight average molecular weight of the polysiloxane (R1) was 4900.

A photoresist, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R1) solution in the same proportion as the polysiloxane (A1) PR7].

Comparative Example 2

In a 1 liter three-necked flask, 132.13 g of perfluorophenyl triethoxysilane, 55.69 g of glycidoxypropyltriethoxysilane, 90.15 g of ((6,6-dimethylbicyclo [3.1.1] heptan-3-yl) methyl) triethoxysilane, 27.64 g of r-acryloyloxypropyltriethoxysilane, 240.93 g of diacetone alcohol And an aqueous solution of phosphoric acid in which 0.122 g of phosphoric acid (0.04% by weight based on the charged monomers) and 45 g of water were dissolved while stirring at room temperature was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 120 DEG C) to obtain a polysiloxane (R2) solution. The solids concentration of the polysiloxane (R2) solution thus obtained was 40 wt%, and the weight average molecular weight of the polysiloxane (R2) was 5700.

A photoresist, a propylene glycol monomethyl ether, a fluorine-based surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R2) solution in the same ratio as the polysiloxane (A1) PR8].

Comparative Example 3

71.68 g of 2- (perfluorophenyl) ethyl triethoxysilane, 70.30 g of glycidoxypropyltrimethoxysilane, 150.25 g of ((6,6-dimethylbicyclo [3.1.1] heptan-3-yl) methyl) triethoxysilane, 232.62 g of diacetone alcohol , And an aqueous phosphoric acid solution of 0.117 g (0.04% by weight based on the charged monomers) of phosphoric acid dissolved in 45 g of water was added over 10 minutes while stirring at room temperature. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. After 1 hour from the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 120 DEG C) to obtain a polysiloxane (R3). The solid content concentration of the polysiloxane (R3) solution thus obtained was 40% by weight, and the weight average molecular weight of the polysiloxane (R3) was 5300.

A photoresist, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R3) solution in the same proportion as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR9].

Comparative Example 4

Into a 1 L three-necked flask were charged 215.02 g of perfluorophenyl ethyl triethoxysilane, 83.53 g of glycidoxypropyltriethoxysilane, 30.05 g of ((6,6-dimethylbicyclo [3.1.1] heptan-3-yl) methyl) triethoxysilane, 265.86 g of diacetone alcohol , And an aqueous phosphoric acid solution in which 0.131 g of phosphoric acid (0.04% by weight based on the charged monomers) and 31 g of water were dissolved while stirring at room temperature was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100 占 폚 and the mixture was heated and stirred for 2 hours (internal temperature: 120 占 폚) to obtain a polysiloxane (R4) solution. The solid content concentration of the obtained polysiloxane (R4) solution was 42% by weight, and the weight average molecular weight of the polysiloxane (R4) was 6400.

A photosensitive agent, a propylene glycol monomethyl ether, a fluorine-based surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R4) solution in the same proportion as the polysiloxane (A1) PR10].

Comparative Example 5

265.53 g of diacetone alcohol was added to 95.54 g of dec-9-en-1-yl 2- (trimethoxysilyl) acetate, 83.53 g of glycidoxypropyltriethoxysilane, 145.36 g of perfluorophenyl ethyl triethoxysilane, 262.53 g of diacetone alcohol, 0.10 g (0.04% by weight based on the charged monomers) of an aqueous solution of phosphoric acid dissolved in 40 g of water was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 L / min and stirred for 40 minutes. Thereafter, the oil bath was heated to 120 DEG C over 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 120 DEG C) to obtain a polysiloxane (R5) solution. The solids concentration of the polysiloxane (R5) solution thus obtained was 47 wt%, and the weight average molecular weight of the polysiloxane (R5) was 5500. [

A photosensitive agent, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R5) solution in the same proportion as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR11].

Comparative Example 6

239.27 g of diacetone alcohol was added to 90.17 g of ((6,6-dimethylbicyclo [3.1.1] heptan-3-yl) methyl) triethoxysilane, An aqueous solution of phosphoric acid in which 0.12 g of phosphoric acid (0.04% by weight based on the charged monomers) and 43 g of water were dissolved while stirring was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. After 1 hour from the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 120 DEG C) to obtain a polysiloxane (R6) solution. The solid content concentration of the polysiloxane (R6) solution thus obtained was 41% by weight, and the weight average molecular weight of the polysiloxane (R6) was 4,800.

A photoresist, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R6) solution in the same proportion as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR12].

Comparative Example 7

Into a 1 L three-necked flask was placed 125.44 g of 2- (perfluorophenyl) ethyl triethoxysilane, 97.45 g of glycidoxypropyltriethoxysilane, 62.45 g of (perfluoronaphthalen-2-yl) triethoxysilane, ((6,6-dimethylbicyclo [3.1.1] heptan- And 282.47 g of diacetone alcohol were charged, and an aqueous phosphoric acid solution in which 0.149 g of phosphoric acid (0.04% by weight based on the charged monomers) and 43 g of water were dissolved while stirring at room temperature was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 L / min and stirred for 40 minutes. Thereafter, the oil bath was heated to 120 DEG C over 30 minutes. After 1 hour from the start of the temperature rise, the internal temperature of the solution reached 100 DEG C and the resulting mixture was heated and stirred for 2 hours (internal temperature: 120 DEG C) to obtain a polysiloxane (R7) solution. The solid content concentration of the polysiloxane (R7) solution thus obtained was 46% by weight, and the weight average molecular weight of the polysiloxane (R7) was 7,000.

A photoresist, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of this polysiloxane (R7) solution in the same ratio as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR13].

Comparative Example 8

Into a 1 L three-necked flask were placed 132.0 g of perfluorophenyl triethoxysilane, 38.03 g of 2,3,5,6-tetrafluoro-4- (trifluoromethyl) phenyl triethoxysilane, ((6,6-dimethylbicyclo [3.1.1] heptan- 60.5 g of dec-9-en-1-yl 2- (trimethoxysilyl) acetate 95.54 g of diacetone alcohol 265.86 g of diacetone alcohol was added, and 0.130 g of phosphoric acid (0.04% by weight based on the charged monomers) Aqueous solution of phosphoric acid was added over 10 minutes. Thereafter, the flask was immersed in an oil bath at 45 DEG C under a nitrogen atmosphere of 0.05 liter per minute, stirred for 40 minutes, and then the oil bath was heated to 120 DEG C over 30 minutes. One hour after the start of the temperature rise, the internal temperature of the solution reached 100 占 폚 and the mixture was heated and stirred for 2 hours (internal temperature: 120 占 폚) to obtain a polysiloxane (R8) solution. The solid content concentration of the polysiloxane (R8) solution thus obtained was 47% by weight, and the weight average molecular weight of the polysiloxane (R8) was 6,200.

A photoresist, a propylene glycol monomethyl ether, a fluorine surfactant and a leveling agent were added to 100 parts by weight (solid content) of the polysiloxane (R8) solution in the same ratio as the polysiloxane (A1) solution in Example 1 to prepare a photosensitive resin composition PR14].

The compositions for Examples 1 to 6 and Comparative Examples 1 to 8 are shown in Table 1 below.

Photosensitive resin Polysiloxane Photosensitive agent Silane coupling agent
(FC-4430) Leveling agent
(EFKA ㄾ) menstruum
(Propylene glycol monomethyl ether) Example 1 [PR1] (A1) 100 parts by weight 30 parts by weight 0.1 part by weight 0.01 part by weight 30 parts by weight Example 2 [PR2] (A2) 100 parts by weight Example 3 [PR3] (A2) 100 parts by weight 10 parts by weight Example 4 [PR4] (A2) 100 parts by weight 20 Central part Example 5 [PR5] (A2) 100 parts by weight 40 parts by weight Example 6 [PR6] (A2) 100 parts by weight 50 parts by weight Comparative Example 1 [PR7] (R1) 100 parts by weight 30 parts by weight Comparative Example 2 [PR8] (R2) 100 parts by weight Comparative Example 3 [PR9] (R3) 100 parts by weight Comparative Example 4 [PR10] (R4) 100 parts by weight Comparative Example 5 [PR11] (R5) 100 parts by weight Comparative Example 6 [PR12] (R6) 100 parts by weight Comparative Example 7 [PR13] (R7) 100 parts by weight Comparative Example 8 [PR14] (R8) 100 parts by weight

The photosensitive resin composition solution obtained from the above Examples and Comparative Examples is subjected to a photolithography process to form a pattern. That is, a glass substrate was used as the transparent substrate used for forming the pattern, and the composition was coated so as to have a thickness of 1.5 占 퐉, followed by heating (prebaking) at 100 占 폚 for 90 seconds, h and i-line were exposed to 80 mJ / cm 2 of the mixed ultraviolet light, developed with tetraammonium hydroxide aqueous solution of 2.38 wt% at 25 캜 for 60 seconds, washed with pure water for 1 minute, By heating in an oven for 30 minutes, a pattern was formed.

Subsequently, various evaluations were carried out in the following manner.

(1) Evaluation of elastic recovery rate

A photosensitive resin composition for the above Examples and Comparative Examples was applied onto a glass substrate to form a thin film having a thickness of 1.5 mu m and the photolithography process was carried out. Thereafter, a micro compression tester (trade name DUH-W201, Shimazu Seisakusho Co., A load of up to 20 mN was loaded by a plane indenter having a diameter of 50 탆 and maintained for 5 seconds and then removed to prepare a load deformation curve at the time of load and a load deformation curve at the time of unloading. At this time, the elastic recovery rate was calculated by the following equation, assuming that the amount of deformation at a load of 20 mN at the time of loading is L1 and the amount of deformation at the time of removal is L2.

Thus, when the amount of deformation L1 is 0.4 탆 or less, the steel has good elasticity. The reference table is as follows.

? 0.2, 0.4?? 0.2, 1.0?? 0.4, 1.0? X

(2) Sensitivity evaluation

A photosensitive resin composition for the above Examples and Comparative Examples was applied onto a glass substrate to form a thin film having a thickness of 1.5 占 퐉 and a photolithography process was carried out. Thereafter, the pattern size was adjusted to an exposure amount of 1: Sensitivity. When the exposure amount is 100 mJ / cm 2 or less, it can be said that the sensitivity is good. The reference table is as follows.

?> 80 mJ / cm 2, 100 mJ / cm 2? 80 mJ / cm 2, 200 mJ / cm 2? 100 mJ /

(3) Evaluation of resolution

The photolithography process was performed on the photosensitive resin compositions of the examples and comparative examples to confirm the formation of fine patterns. At this time, when a pattern of 10 to 15 mu m is formed, it can be said that it is good. The reference table is as follows.

10 >&gt;, 10 < 0 &lt; 15, 15 &

(4) Evaluation of dielectric constant

The photosensitive resin composition for the embodiments and the comparative examples was coated on the substrate on which the ITO electrode was wired to form a thin film having a thickness of 1.5 占 퐉 and a photolithography process was carried out. Then, platinum was deposited on the thin film, And the dielectric constant is measured. When the dielectric constant is 3.6 to 3.8, it can be said that it is good. The reference table is as follows.

3.6?, 3.6?? <3.8, 3.8?? <4.2, X? 4.2

(5) Evaluation of heat resistance

In the case of not using a photomask, a cured film was formed in the same manner as in the photolithography process for the photosensitive resin composition for the above Examples and Comparative Examples, and then the obtained sample was subjected to initial decomposition The temperature was measured. When the temperature is 250 to 270 ° C, it can be said to be good. The reference table is as follows.

? 270, 270?? 250, 250? 220, 220? X

(6) Evaluation of residual film ratio

The photosensitive resin composition for the above Examples and Comparative Examples was applied onto a glass substrate to form a thin film having a thickness of 1.5 mu m, and then a photolithography process was performed. Then, a contact type thickness meter (DEKTAK 6M, manufacturer VECCO, USA) was used And the thickness before and after development was measured to measure the residual film ratio. A residual film ratio of 70% or more can be said to be good. The reference table is as follows.

≥ 80%, 80%> ≥ 70%, 70%> △ ≥ 60%, 60%> X

The evaluation results of the above examples and comparative examples for the items (1) to (6) are shown in Table 2 below.

PR composition Elastic recovery rate Sensitivity resolution permittivity Heat resistance Residual film ratio Example 1 ◎ ◎ ○ ○ ◎ ◎ Example 2 ◎ ◎ ◎ ○ ◎ ◎ Example 3 ○ x x ○ ○ x Example 4 ○ ○ ○ ○ ○ ○ Example 5 ○ ○ ○ ○ ○ ◎ Example 6 ○ △ x ○ ○ ◎ Comparative Example 1 x △ △ ○ ○ x Comparative Example 2 △ ○ ○ ○ ○ △ Comparative Example 3 △ △ ○ ○ ○ △ Comparative Example 4 △ x △ ○ ○ ○ Comparative Example 5 △ x x ○ ○ ○ Comparative Example 6 ○ △ ○ ○ ○ △ Comparative Example 7 ○ △ △ ○ ○ △ Comparative Example 8 ○ x x ○ ○ ○

?: Very good,?: Good,?: Fair, x: poor

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (5)

A binder resin comprising a polysiloxane in which at least two siloxanes (SiO _3/2 ) represented by the following formula (1) are repeatedly connected; And
A photosensitive resin composition for an OLED display device comprising an excess solvent.
[Chemical Formula 1]

(Wherein R &lt; ₁ &gt; is a monovalent or higher-valent organic group and R &lt; ₂ &gt; The photosensitive resin composition for an OLED display device according to claim 1, wherein R ₂ in the formula (1) comprises at least one of residues represented by the following formulas (2) to (4).
(2)

(3)

[Chemical Formula 4]

The photosensitive resin composition for an OLED display device according to claim 1, wherein R ₁ in the formula ( ₁₎ comprises at least one of residues represented by the following formulas (5) to (9).
[Chemical Formula 5]

[Chemical Formula 6]

(7)

[Chemical Formula 8]

[Chemical Formula 9]

The photosensitive resin composition for an OLED display device according to claim 1, wherein the polysiloxane comprises a plurality of siloxanes (SiO _3/2 ) represented by at least one of the following formulas (10) to (15) repeatedly connected.
[Chemical formula 10]

(11)

[Chemical Formula 12]

[Chemical Formula 13]

[Chemical Formula 14]

[Chemical Formula 15]

The photosensitive resin composition according to claim 1, further comprising a photosensitizer comprising a diazonaphthoquinone compound represented by the following general formulas (16) to (21).
[Chemical Formula 16]

[Chemical Formula 17]

[Chemical Formula 18]

[Chemical Formula 19]

[Chemical Formula 20]

[Chemical Formula 21]

In the above formulas (16) to (21), D is selected from hydrogen and the substituent of the following formula (22) or (23).
[Chemical Formula 22]
1,2,4-diazonaphthoquinone diazide

(23)
1,2, -diazonaphthoquinone diazide