KR20160083190A - Low dielectirc insulating film and display device including the film - Google Patents

Abstract

The present invention relates to a low dielectric insulating film which is manufactured with a binder resin in which a porous supermolecule is introduced into a measuring chain, and a display device including the dielectric insulating film. The organic insulating film of the present invention has a low dielectric constant value, and thus is utilized as a protective layer for protecting a TFT of the display device, a layer insulating film or a bank layer, thereby reducing power consumption. In addition, the adhesive strength for a base is improved, and thus it can be stably attached to the base. The pattern of an organic insulating film can be formed with a low quantity of light, and folding and/or bending stress is low, and thus it can be utilized as a flexible display device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a low dielectric insulating film and a display device including the low dielectric insulating film.

More particularly, the present invention relates to an insulating film having a low dielectric constant value and excellent dispersion characteristics and adhesion characteristics, and a display device including the insulating film.

Flat panel display devices such as organic light emitting diode display devices employing a liquid crystal display (LCD) or an organic light emitting device (OLED) instead of the conventional CRT have been widely used. Thin-film transistors (TFTs) are typically used to implement images in these flat panel displays, and insulating films are used to protect the TFT circuits from other elements.

The capacitance of the insulating film is proportional to the dielectric constant of the material and is inversely proportional to the distance between the two conductors, that is, the thickness of the insulating film. As the parasitic capacitance increases, the RC time is delayed in proportion to this, which not only lowers the switching speed of the device but also increases the power consumption. Therefore, in order to reduce the parasitic capacitance caused by the insulating film formed between the conductors of the display element, it is necessary to use a device having a low dielectric constant value or to increase the thickness of the insulating film. When a material having a low dielectric constant value is used as an insulator used for an insulating film, the parasitic capacitance does not increase even if the thickness of the insulating film is thin, and the on / off ratio is improved to improve the driving characteristic of the TFT.

Conventionally, an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx) has been used as a material of the protective layer or insulating film for protecting the TFT circuit of the display device. However, the dielectric constants of silicon oxide and silicon nitride are relatively high, 3.9 to 7.0, respectively. Therefore, in a display device using such an inorganic material as an insulating film, a large amount of parasitic capacitance is generated, which has a limitation in reducing power consumption. Further, in order to apply these inorganic materials to a display device, a high-temperature process and a vacuum equipment are required, which makes it difficult to apply the process to a plastic substrate.

Therefore, recently, an organic material having a relatively low dielectric constant is used as an insulating film instead of an inorganic material. Generally, a photoactive compound (PAC) which is chemically reacted by light or electron beam is being developed as an organic insulating film material of a display device. A material most widely used as an organic insulating film material is a photoacid binder, which is a linear binder having a thermoplastic substituent derived from acrylic acid. However, since the photoacrylic compound, which has been conventionally used as an organic insulating film material, has a linear structure and causes an increase in polarization, the dielectric constant value of the photoacrylic compound is relatively high, about 3.6.

In addition, since the photoacrylic compound has a weak adhesive force, when used as an organic insulating film, a hydroxyl group (-OH) is attached to the end of the photoacrylic compound to compensate the adhesive force. However, the dipole moment due to the pair of non-covalent electrons present in the hydrophilic functional group, hydroxyl group, increases, thereby increasing the polarization ratio and increasing the dielectric constant value. In addition, there is a problem that the dielectric constant value is increased because the moisture attacks a hydroxyl group which is a hydrophilic functional group to generate a leakage current.

Therefore, in a display device employing a photosensitive acrylic compound as an organic insulating film, in order to reduce power consumption, the thickness of the organic insulating film must be increased to decrease the capacitance. Since the thickness of the organic insulating film is increased, there is a limit to be applied to a thin display device. In addition, since a thick insulating film is adopted, it is difficult to use in a flexible display device because of limitations in folding and bending.

Therefore, polysiloxane resin is used as an organic insulating film material as an organic material having a low dielectric constant value instead of a photosensitive acrylic compound. The polysiloxane resin has a higher modulus value than the acrylic resin, so that the adhesive strength is good. However, when an organic insulating film is produced using a polysiloxane resin, cracks tend to occur at a thickness exceeding a certain thickness due to shrinkage stress generated in the curing process. In particular, when a tough material such as a polysiloxane resin is used, a crack may be generated in the organic insulating film due to folding stress. As a result, a leakage current may be generated, deteriorating the device, and shortening the lifetime of the device.

The present invention is intended to solve the problem that the conventional technique of securing a low dielectric constant and a strong adhesive force can not be solved.

It is an object of the present invention to provide an organic insulating film having a low dielectric constant and good dispersibility and a display device including the organic insulating film.

It is another object of the present invention to provide an organic insulating film and a display device including the same that can reduce power consumption of the device.

Another object of the present invention is to provide an organic insulating film having excellent adhesion to a substrate and a display device including the organic insulating film.

It is still another object of the present invention to provide an organic insulating film having improved processability and good folding and bending properties and a display device including the organic insulating film.

According to an aspect of the present invention, there is provided a low dielectric organic insulating film including a binder resin in which porous supramolecules are introduced into side chains.

For example, the binder resin may be selected from the group consisting of (meth) acrylate resins, urethane resins, polysiloxane resins and copolymers thereof.

The porous supramolecules may be selected from the group consisting of cyclodextrin, cucurbituril, calixarene, polycaprolactone, derivatives thereof, and combinations thereof.

According to another aspect of the present invention, there is provided a method of manufacturing a thin film transistor including a first substrate on which a plurality of signal lines are arranged, a thin film transistor located on the first substrate, an organic insulating film located on the thin film transistor, Wherein the organic insulating film comprises a binder resin in which porous supramolecules are introduced into side chains.

In one exemplary embodiment, the display device of the present invention may further include a second substrate facing the first substrate, and a liquid crystal layer interposed between the first substrate and the second substrate.

The display device of the present invention may further include a second electrode having a plurality of openings corresponding to the first electrode and a protective layer disposed between the first electrode and the second electrode, And may be made of the same material as the organic insulating film.

In another exemplary embodiment, the display device of the present invention further includes a bank layer located on the first electrode, an organic light emitting layer, and a second electrode facing the first electrode, And may be made of the same material.

The organic insulating film of the present invention lowers the dielectric constant value by lowering the density of the thin film by introducing molecules having a pore structure, and molecules of such pore structure are chemically bonded to the binder resin and introduced therein, so that the dispersion characteristics are good. Therefore, it has an advantage that a low dielectric constant value can be uniformly ensured throughout the insulating film.

By adopting a binder material having a low dielectric constant value, the parasitic capacitance in the organic insulating film is reduced, and the load of the power applied to the display panel can be reduced, so that the power consumption of the device can be further reduced.

In addition, the binder material of the present invention is not only excellent in adhesion to a substrate, but also has a dielectric constant sufficiently low even if the thickness of the insulating film is reduced due to a low dielectric constant value. Since the thickness of the insulating film can be reduced in this manner, it can be utilized in a flexible display device requiring folding and bending properties. In addition, it is possible to form a desired pattern even with a small amount of light in the patterning process of the insulating film, thereby ensuring the efficiency of the process.

1 is a cross-sectional view schematically showing a liquid crystal display device as an example of a display device including a low dielectric organic insulating film according to an exemplary embodiment of the present invention.
2 is a cross-sectional view schematically showing an organic light emitting diode display device as an example of a display device including a low dielectric organic insulating film according to another exemplary embodiment of the present invention.
3A to 3C are photographs showing peeling off from a substrate according to a cross-cut tape test on an organic insulating film made of an acrylate-based binder resin, wherein the porous supramolecules are each formed of an organic insulating film introduced into the binder resin, An organic insulating film not containing supramolecular superscripts, and an organic insulating film formed by simply mixing porous supramolecules.
4A to 4C are photographs showing peeling off from a substrate according to a cross-cut tape test on an organic insulating film made of a urethane acrylate polysiloxane-based resin. The organic insulating film, the organic insulating film, An organic insulating film not containing porous supramolecules, and an organic insulating film formed by simply mixing porous supramolecules.
FIGS. 5A to 5C are graphs showing the results of measurement of peel strength for an organic insulating film made of an acrylate-based resin, in which an organic insulating film in which porous supramolecules are introduced into a binder resin, An organic insulating film not added, and an organic insulating film formed by simply mixing the porous supramolecules.
6A to 6C are graphs showing the results of measurement of the peel strength of an organic insulating film made of a urethane acrylate polysiloxane-based resin, wherein an organic insulating film in which porous supramolecules are introduced into a binder resin, And an organic insulating film formed by simply mixing the porous supramolecules.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings where necessary.

[Low dielectric organic insulating film]

The low dielectric organic insulating film according to the present invention includes a binder resin in which porous supramolecules are introduced into side chains.

In an exemplary embodiment, the binder resin for producing the organic insulating film may be at least one selected from the group consisting of a (meth) acrylate resin, a urethane resin, a polysiloxane resin and a copolymer thereof. Unless defined otherwise herein, the term "meta (acrylate)" is used to mean both acrylate and (meth) acrylate. Particularly, urethane resin, urethane (meth) acrylate resin, urethane polysiloxane resin and urethane (meth) acrylate polysiloxane resin may be preferably used as the binder resin of the present invention.

When a (meth) acrylate resin is used alone, the dielectric constant value increases when a hydroxy group is introduced to improve the adhesion. However, when a urethane resin, a urethane (meth) acrylate resin, a urethane polysiloxane resin and a urethane (meth) acrylate polysiloxane resin are used, the hydroxyl group can be reduced, and the dielectric constant value can be advantageously reduced.

Illustratively, by using a binder resin in which a urethane resin and / or a polysiloxane resin having excellent toughness are copolymerized with (meth) acrylate resin, the toughness of the organic insulating film can be improved and the adhesion to the substrate The peeling from the substrate can be prevented.

Particularly, the polyurethane contained in the urethane resin, the urethane (meth) acrylate resin, the urethane polysiloxane resin and the urethane (meth) acrylate polysiloxane resin has a urethane bond formed by the addition polymerization reaction of a polyol having a hydroxyl group and an isocyanate group , An amine formed from carbamic acid formed by the reaction of water with isocyanate has urea bond formed by reaction with isocyanate.

A soft segment formed by the polyol used for synthesizing the urethane prepolymer and an adhesive capable of adjusting the flexibility by the hard segment formed by the isocyanate can be obtained. In addition, there is an advantage that a urethane prepolymer is obtained in order to form a urethane bond, and then a moisture hardening step is carried out to produce a binder resin having excellent adhesive strength.

The binder resin can be synthesized from a curable component such as a monomer and / or an oligomer constituting the resin through a photo-curing step, a moisture curing step and a heat curing step. For example, the poly (meth) acrylate constituting the (meth) acrylate resin or the urethane (meth) acrylate resin may be an alkyl (meth) acrylate having 1 to 20 carbon atoms, an alkenyl (di) (Meth) acrylate having 1 to 20 carbon atoms, alkoxy (di) (meth) acrylate having 1 to 20 carbon atoms, alkoxyalkyl (meth) acrylate having 1 to 20 carbon atoms, allyl alkoxylate; (Meth) acrylates selected from the group consisting of cycloalkyl (meth) acrylates having 5 to 8 carbon atoms and N-acryloyl morpholine; Acrylate, epoxy (meth) acrylate, aryl (meth) acrylate, and combinations thereof. Poly (meth) acrylate can be formed by photocuring these (meth) acrylate oligomers and / or oligomers to form crosslinks between these monomers and / or oligomers.

A urethane prepolymer obtained by reacting a polyol and a diisocyanate to form a urethane bond constituting a urethane resin, a urethane (meth) acrylate resin, a urethane polysiloxane resin and a urethane (meth) acrylate polysiloxane resin can be used. The polyol for synthesizing the urethane prepolymer may be a polyol obtained by reacting ethylene oxide or propylene oxide with glycerin, or a polyether polyol such as propylene glycol, tetramethylene glycol or ethylene glycol polyether; And / or polycaprolactone polyol, a polyester polyol obtained by dehydration condensation reaction of glycol or triol in adipic acid which is a dibasic acid, and the like. The diisocyanate compound for synthesizing the urethane prepolymer may be at least one selected from toluene diisocyanate (TDI), methylenediphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI) . After reacting these isocyanates with a polyol to synthesize an urethane prepolymer, a polyurethane bond can be obtained by conducting a moisture curing process.

On the other hand, for example, the monomers for synthesizing the polysiloxane constituting the polysiloxane resin, the urethane (meth) acrylate polysiloxane resin, and the urethane polysiloxane resin include monomers containing a silanol group and / or monomers containing a siloxane group. The monomer compounds containing silanol groups include ethylenically unsaturated alkoxysilanes such as (meth) acrylate alkoxysilanes; And ethylenically unsaturated acyloxysilanes comprising ethylenically unsaturated acetoxysilane such as (meth) acrylate-based acetoxysilane or (meth) acrylatepropyltriacetoxysilane.

Further, the monomer compound containing a siloxane group particularly includes a compound having a linear siloxane group. For example, the monomeric compound having a linear siloxane group may be mono / di / tri / tetra / hexa / octasiloxane substituted with 1 to 10 alkyl groups of 1 to 10 carbon atoms; Mono / di / tri / tetrasiloxane substituted with 1 to 4 alkoxy groups of 1 to 10 carbon atoms; Alkyl alkoxy silane having 1 to 10 carbon atoms, vinyl alkoxy silane, aminoalkyl alkoxy silane, silane substituted with methacryloxy group or mercaptoalkyl group, and the like, but the present invention is not limited thereto.

The monomer for synthesizing the polysiloxane may be thermoset or photopolymerized to obtain a polysiloxane. Illustratively, the unit units constituting the polysiloxane may be connected in a linear form or in a cage form. Alternatively, the polysiloxane may have the form of silsesquioxane.

Porous Ultra Molecule introduced into the above-mentioned binder resin has an empty space inside, so that the density is very low. The organic insulating film made of the binder resin into which the porous supramolecules are introduced can lower the dielectric constant because the vacant space in the interior is filled with air having a low dielectric constant value.

In other words, by using the binder resin into which the porous supramolecules are introduced according to the present invention as an organic insulating film material, the density of the organic insulating film is lowered. As a result, the dielectric constant of the organic insulating film can be lowered because the polarization ratio of the organic insulating film ultimately becomes smaller. In an exemplary embodiment, the porous supramolecules may be introduced into the side chains of a binder resin having, for example, a linear shape. The introduction of the porous supramolecules into the side chains of the binder resin having a straight line shape can suppress the increase of the polarization ratio and can further lower the dielectric constant value of the organic insulating film.

In addition, porous supramolecules are fairly bulky molecules. Therefore, when the porous supramolecules are introduced into the side chains of the binder resin, the roughness of the substrate is increased due to the bulky supersaturated supramolecules, so that the adhesion to the substrate can be further improved.

In addition, when the porous supramolecules are blended in the binder resin, it is difficult to uniformly disperse the porous supramolecules in the binder resin. Therefore, the organic insulating film formed by simply blending the porous supramolecules with the binder resin has a problem that it can not have a uniform low dielectric constant value throughout the insulating film. On the other hand, since the porous supramolecules of the present invention are bonded to the binder resin and are formed integrally with the binder resin, there is no problem of dispersibility. Therefore, according to the present invention, the organic insulating film made of the binder resin into which the porous supramolecules are introduced can secure a low dielectric constant value uniformly throughout the insulating film.

In an exemplary embodiment, the urethane acrylate polysiloxane-based binder resin into which the porous supramolecules are introduced may have a repeating unit represented by the following formula (I).

(I) wherein R ₁ is hydrogen or a methyl group, R ₂ and R ₃ are each independently a substituted or unsubstituted alkylene having 1 to 20 carbon atoms, a substituted or unsubstituted cycloalkylene having 4 to 20 carbon atoms, and Substituted or unsubstituted arylene having 6 to 20 carbon atoms, R ₄ is selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, A cycloalkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms and an aralkyl group having 6 to 20 carbon atoms, x is an integer of 2 to 10000, A is an integer of 2 to 10,000, Lt; RTI ID = 0.0 > supramolecules &

For example, the porous supramolecule may be introduced in an amount of 5 to 100 parts by weight based on 100 parts by weight of the binder resin. If the content of the porous supramolecules exceeds 100 parts by weight with respect to the binder resin, the density of the binder resin becomes excessively low and the mechanical strength of the organic insulating film may be lowered. On the other hand, if the content of the porous supramolecules is less than 5 parts by weight based on the binder resin, the decrease of the permittivity and / or the improvement of the adhesion to the substrate may be insignificant due to introduction of the porous supramolecules.

In an exemplary embodiment, the porous supramolecules introduced into the side chains of the binder resin are selected from the group consisting of cyclodextrin, cucurbituril, calixarene, polycaprolactone, derivatives thereof, and combinations thereof .

Cyclodextrins, one of the exemplary porous supramolecules introduced into the binder resin, can be obtained from carbohydrates, such as starch, by the action of enzymes, for example, the sugar ring alpha- D-glucopyranoside units are connected in the 1- to 4-positions. For example, cyclodextrins which can be used in accordance with the present invention can use 5-8 alpha-D-glucopyranoside unit units. Particularly, cyclodextrins preferably usable as porous supramolecules include α-cyclodextrin (composed of six sugar rings), β-cyclodextrin (composed of seven sugar rings), γ-cyclodextrin Configuration).

In an exemplary embodiment, the cyclodextrin and / or its derivative that can be introduced into the binder resin as the porous supramolecule according to the present invention can be represented by the following formula (II).

(Wherein R ₅ to R ₇ each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an acyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a hydroxyalkyl group having 1 to 20 carbon atoms , a carboxy group, or a silicon molecule represented by Si _r1r2r3, r1, r2, r3 are each independently a hydrogen atom, an aryl group having 1 to 5 carbon atoms alkyl group, a C 1 -C 5 alkoxy group, or a 6 to 20 carbon atoms in the giim; m is And the number of unit units is an integer of 5 to 8)

In another exemplary embodiment, the other porous supramolecule introduced into the side chain of the binder resin is cucurbituril. Cucurbituril is a porous supramolecule composed of glycoryl (= C ₄ H ₂ N ₄ O ₂ =) linked by methylene bridge (-CH ₂ -). Cucurbituril is named cooker bit [n] uril, depending on the number (n) of glycoluril units as constituent units. The cucurbiturils which can be introduced into the binder resin according to the present invention are cucurbiturils having 4-20 glycerol units (i.e., cooker bit [4-20] uryl), preferably the number of glycoluril units is 5-10 (Ie, Cooker Bits [5-10] us).

As an example of a cucurbituril, cooker bit [6] can be synthesized in the following manner. First, two molecules of urea are reacted with one molecule of dialdehyde to obtain the intermediate glycolurilyl by nucleophilic addition, and the resulting intermediate is condensed with formaldehyde at a temperature of 110 ° C or higher to form Cooker Bits [6 ] Can be synthesized. By lowering the temperature of the condensation reaction, other cucurbiturils having different numbers of glycoluril unit units can be synthesized.

Illustratively, the cucurbituril and / or its derivative may be represented by the following formula (III).

(In the formula (II), R ₈ and R ₉ each independently represent a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an alkynyl group having 2 to 30 carbon atoms, an alkylthio group having 1 to 30 carbon atoms , An alkylcarboxyl group having 1 to 30 carbon atoms, a hydroxyalkyl group having 1 to 30 carbon atoms, an alkylsilyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a haloalkyl group having 1 to 30 carbon atoms, a nitro group, (Hetero) aryl group having 6 to 15 carbon atoms, Y is O, S or NH (lower alkyl) amino group, amino group, aminoalkyl group having 1 to 30 carbon atoms, (hetero) cycloalkyl group having 5 to 30 carbon atoms, N is the number of the glycoluril unit units and is an integer of 4 to 20, preferably an integer of 5 to 10)

According to another exemplary embodiment of the present invention, the compounds that can be used as the porous supramolecules introduced into the side chains of the binder resin are calixarene and derivatives thereof. Carrexalan compounds are compounds in the form of macrocycles or cyclic oligomers in the form of a cup including benzene rings. Calixarene is formed by hydroxalkylation of phenol, resorcinol, pyrogallol, and aldehyde, which are benzene compounds substituted with hydroxy groups, in which a benzene ring substituted with a hydroxy group forms a bridge through a bridge As shown in Fig. Depending on the number of these unit units, the calix [p] arene (p is the number of unit units) is named. In an exemplary embodiment, the calixarene used as a porous supramolecule is calixarene or a derivative thereof having 3 to 10 unit units (i.e., calix [3-10] arene and its derivatives).

When a phenol which is a benzene compound substituted with one hydroxy group as an aromatic ring component is used in order to obtain a calixarene compound, it can be synthesized by reacting with formaldehyde to induce a condensation reaction. On the other hand, when two or three hydroxy groups are used as the aromatic ring component, resorcinol and pyrogallol can be synthesized by reacting relatively bulky aldehydes such as acetaldehyde. When these aldehydes react with an aromatic ring component using an acid catalyst (for example, p-toluenesulfonic acid) or a base catalyst, an electrophilic aromatic substitution reaction takes place and successive aromatic substitution reactions And a calixarene compound can be synthesized through a condensation reaction induced.

Illustratively, the calixarene and / or its derivative can be represented by the formula (IV) below.

(Wherein R ₁₀ is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, R ₁₁ is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an acyl group having 2 to 30 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, _R1 , r2, and r3 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, or a silicon atom represented by a carboxyl group having 1 to 20 carbon atoms, an ester group having 1 to 20 carbon atoms, Or an aryl group having 6 to 20 carbon atoms, o is an integer of 3 to 7 in terms of the number of unit units)

Another exemplary porous supramolecule that can be incorporated into the side chains of the binder resin in accordance with the present invention is polycaprolactone or a derivative thereof. Polycaprolactone is a biodegradable polyester compound which can be prepared by ring opening polymerization using a catalyst and heat as a heterocyclic compound, epsilon -caprolactone. As the polycaprolactone derivative which can be introduced into the binder resin according to the present invention as a porous supramolecule, a polycaprolactone dendrimer represented by the following formula (V) is exemplified.

(Wherein R ₁₂ , R ₁₃ , R ₁₄ and R ₁₅ are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an acyl group having 2 to 30 carbon atoms or a silicon atom represented by Si _r1r2r3 , , r2 and r3 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and p is an integer of 2 to 200)

The low-dielectric organic insulating film according to the present invention includes a binder resin in which porous supramolecules are introduced into side chains, for example, and may include other functional additives. The functional additive that can be included in the low dielectric organic insulating film may be selected from a photosensitive agent, a basic component, a surfactant, an adhesion improver, and a light stabilizer.

For example, by adding a photosensitizer to the organic insulating film of the present invention and imparting photosensitivity to the organic insulating film, the step of forming a pattern by applying a separate photoresist on the organic insulating film can be reduced, thereby simplifying the patterning process . Regarding the patterning operation, the organic insulating film material utilizes the property of change in solubility in an appropriate developer such as an aqueous alkali solution after exposure. Unlike the negative type in which an organic developer is used, the positive type has an advantage in that workability is good since an aqueous alkaline solution can be used as a developing solution, and can be easily removed by using a removing liquid after forming an organic insulating film.

In the exemplary embodiment, any photosensitizer that can be blended with the binder resin into which the porous supramolecules are introduced may be any photosensitizer. Illustratively, a photoacid generator (Photoacid Generator, PAG) type photosensitizer may be used as the photosensitizer. For example, as the photosensitizer of the photo acid generators, diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, sulfonium diazomethane, N-sulfonyloxyimide, benzoin sulfonate, Benzyl sulfonate type, sulfone type, glyoxime type, triazine type, and combinations thereof. Particularly preferred are onium salt-based photoacid generators which can be selected from diazonium salts, phosphonium salts, sulfonium salts, iodonium salts and combinations thereof.

For example, the photoacid generator may be blended in an amount of 0.1 to 10 parts by weight, preferably 1 to 10 parts by weight, based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. When the amount of the photoacid generator is less than the above range, chemical changes due to the acid catalysis do not occur and the photosensitive characteristics are hardly imparted. If the content is less than this range, uniform coating of the coating operation becomes difficult and the dielectric constant of the formed organic insulating film rises There is a concern.

The basic compound can be arbitrarily selected from those used as a chemically amplified resist. The basic compounds that can be used include alkyl amines; Alicyclic amines; Heterocyclic amines such as pyridine, imidazole, quinoline, pyrazine, pyrazole, pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine and derivatives; Quaternary ammonium hydroxy; Quaternary ammonium salts of carboxylic acids, and the like. The basic compound may be contained in an amount of 0.01 to 1 part by weight based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. When the content of the basic compound satisfies the above-mentioned range, sufficient heat resistance can be ensured and an organic insulating film having solvent resistance can be formed.

Surfactants are components added to improve coatability and prevent formation of defects. The kind of the surfactant that can be used is not particularly limited, and one or more of a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone surfactant may be used in combination. The surfactant may be contained in the low dielectric organic insulating film in a proportion of 0.01 to 5 parts by weight based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. When the content of the surfactant satisfies the above-described range, the adhesion between the substrate and the low-dielectric organic insulating film can be maximized.

The adhesion improver is a material which improves the adhesion between an inorganic substance serving as a substrate, for example, a silicon compound such as silicon, silicon oxide, or silicon nitride, a metal such as gold, copper, or aluminum and an organic insulating film, . The kind of the adhesiveness improver is not particularly limited, and specific examples include a silane coupling agent and a thiol-based compound, preferably a silane coupling agent.

As the silane coupling agent, a silane coupling agent having at least one reactive substituent selected from the group consisting of a carboxyl group, a (meth) acryloyl group, an isocyanate group, an amino group, a mercapto group, a vinyl group and an epoxy group can be used. In particular, γ-glycidoxypropyltrimethoxysilane or γ-glycidoxypropyltriethoxysilane having an epoxy group having good adhesiveness to a substrate and / or γ-isocyanate having an isocyanate group Propyltriethoxysilane can be used.

The adhesion improver may be contained in the low dielectric organic insulating film in a proportion of 0.1 to 20 parts by weight based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. Thus, in particular, the adhesion between the metal and the organic insulating film can be improved, and the effect of adjusting the taper angle with the substrate can be maximized.

The light stabilizer is a component that improves the light resistance of the low dielectric organic insulating film. Examples of the light stabilizer include, but are not limited to, benzotriazole, triazine, benzophenone, hindered aminoether, hindered amine, and the like. have. The light stabilizer may be contained in the low dielectric organic insulating film in a proportion of, for example, 0.01 to 5 parts by weight based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. In this range, the effect of improving the light resistance can be greatly improved.

Meanwhile, the low-dielectric organic insulating film according to the present invention can be manufactured from a coating composition in which components including a binder resin into which supersaturated supercritical particles and other additives are dispersed are dispersed in a solvent. The solvent contained in the coating composition may be selected from the group consisting of alcoholic, etheric, esteric, acetate, aromatic hydrocarbon, ketone, amide, lactone, and combinations thereof. Illustratively, the solvent in the coating composition may be added in a proportion of 200 to 400 parts by weight based on 100 parts by weight of the binder resin into which the porous supramolecules are introduced. When the content of the solvent satisfies the above-mentioned range, the content and viscosity of the solid content can be appropriately maintained, and sufficient coating properties can be ensured when the organic insulating film is formed, for example, through a coating process.

A process for producing a low-dielectric organic insulating film from a binder resin into which porous supramolecules are introduced according to the present invention will be described. First, a coating composition in which a binder resin into which porous supramolecules are introduced and, if necessary, other additives are dispersed in a solvent is coated on a substrate, and the liquid coating composition is pre-baked at a predetermined temperature, Is evaporated to form an organic insulating film. Then, the obtained organic insulating film can be formed into an organic insulating film, a protective layer, and / or a bank layer of a display device by exposing and developing the organic insulating film to form a pattern, and subjecting the organic insulating film having the pattern formed thereon to a post-bake heat treatment .

Specifically, a coating composition in which the binder resin into which the porous supramolecules are introduced and, if necessary, other additives are dispersed in a solvent is coated on a suitable substrate. The substrate to which the coating composition is coated is not particularly limited. For example, the coating composition may be coated on top of a glass substrate, a transparent plastic substrate, a silicon wafer, a silicon oxide wafer or a silicon nitride wafer, or a metal layer such as a source / drain electrode formed on an insulating substrate such as glass or plastic , A protective layer or an interlayer insulating film which may be made of silicon oxide or silicon nitride in the display device.

As a method of coating the coating composition on a suitable substrate, a slit coating method using a slit nozzle such as a spin coating method, a roll coating method, a spray coating method, a bar coating method or a discharging nozzle method coating method such as a central dropping method can be used. A combination of two or more coating methods can be applied. At this time, the thickness of the coated film may vary depending on the coating method, the concentration of the solid content in the photosensitive low dielectric organic insulation film composition, the viscosity, and the like, but it can be applied so as to have a film thickness of 0.5 to 10 mu m after drying.

The coating composition coated on the substrate is then subjected to a pre-bake process. By this process, the solvent is volatilized in the coating composition coated on the substrate, so that a coating film having no fluidity can be obtained. For example, in the case of heating a hot plate, it may be carried out at 60 to 130 ° C for 10 to 300 seconds. In the case of using a heat oven, Lt; RTI ID = 0.0 > 140 C < / RTI >

Next, in the selective exposure step, the obtained organic insulating film is exposed and developed to be patterned. Exemplary exposure processes include excimer laser, deep ultraviolet, ultraviolet, visible, electron, X-ray or g-ray (wavelength 436 nm), h-line (wavelength 405 nm), i- And the like. For this purpose, exposure equipment such as a mask aligner, a stepper, and a scatterer can be used on the organic insulating film that has been pre-baked. The exposure may be performed by contact, proximity, projection exposure or the like. The exposure energy is determined depending on the sensitivity of the prepared organic insulating film, but may be in the range of usually 30 to 200 mJ / cm.

After the exposure process is completed, a substrate coated with an organic insulating film may be dipped in a developer, or a developer may be sprayed onto a substrate to remove an organic insulating film at an exposed portion to form a desired pattern. As the developer, an inorganic alkaline compound such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate and potassium silicate, which is alkaline, or an organic alkali aqueous solution such as triethylamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, Can be used. Illustratively, when manufacturing a liquid crystal display device, tetramethylammonium hydroxide is used in the form of an aqueous solution of 0.1 to 10 parts by weight for metal contamination and metal corrosion, developed at 20 to 30 ° C for 30 to 120 seconds, It is preferable to rinse with ultrapure water for 60 to 120 seconds and dry.

Next, a post-baking process is performed on the patterned photosensitive organic insulating film. Post-baking treatment can be performed using a heating apparatus such as a hot plate or an oven. The post-baking condition can be performed at 150 to 350 ° C for 10 to 180 minutes, thereby obtaining a photosensitive organic insulating film having a final pattern.

According to the present invention, by using the binder resin into which the porous supramolecules are introduced as an organic insulating film material, the density of the organic insulating film is lowered. As a result, the dielectric constant of the organic insulating film can be lowered because the polarization ratio of the organic insulating film ultimately becomes smaller. As a result, the parasitic capacitance of the display element can be reduced, and the load applied to the display panel can be reduced, so that the power consumption of the display element can be reduced. Even if the thickness of the organic insulating film is small, a sufficiently low dielectric constant value can be secured. Therefore, the efficiency of the process can be increased because a light amount is required in the process of patterning the organic insulating film. Further, by adopting a thin organic insulating film, stress due to folding or bending is small, so that it can be utilized in a flexible display device.

In addition, since the porous supramolecules are introduced into the side chains of the binder resin, the roughness is increased and the adhesion to the substrate is improved. Therefore, the low-dielectric organic insulating film containing the binder resin into which the porous supramolecules of the present invention are introduced has the advantage that it can be firmly formed on the elements constituting the display device.

[Display device]

According to the present invention, an organic insulating film made of a binder resin into which porous supramolecules are introduced has a low dielectric constant value. Accordingly, the low dielectric organic insulating film according to the present invention can constitute an organic insulating film, a protective layer and / or a bank layer of a display device in which a thin film transistor (TFT) is formed. Non-limiting examples of such a display device include a liquid crystal display (LCD) or an organic light emitting display device. FIG. 1 schematically shows a fringe field switching mode liquid crystal display as an example.

1, the liquid crystal display 100 includes a first substrate 101 and a second substrate 102 facing each other, and a liquid crystal layer 110 is interposed between the first substrate 101 and the second substrate 102, Respectively. The first substrate 101 and the second substrate 102 may be made of plastic or glass. A plurality of electrodes and wiring are stacked on the first substrate 101.

More specifically, a plurality of gate wirings (not shown) extend in one direction on an upper portion of the first substrate 101, and a plurality of gate wirings A plurality of data wirings 170 are formed in a second direction while defining a plurality of pixel regions P intersecting gate wirings (not shown). A gate pad (not shown) is formed in a non-display region and connected to one end of the data line 170 to form a data pad (not shown) in a non-display region.

The semiconductor layer 126 including the gate electrode 122, the gate insulating film 124, the active layer 126a and the ohmic contact layer 126b, and the source and drain electrodes 132 , And 134 is formed on the surface of the semiconductor substrate. The gate electrode 122 is connected to a gate wiring (not shown) and is formed on the first substrate 101. A gate insulating film 124 made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx) is formed on the gate wiring (not shown) and the gate electrode 122. [

An active layer 126a formed of pure amorphous silicon and an ohmic contact layer 126b formed on the active layer 126a and exposing the center of the active layer 126a and made of an impurity amorphous silicon are formed on the gate insulating film 124 . The active layer 126a and the ohmic contact layer 126b form a semiconductor layer 126. [

Source and drain electrodes 132 and 134 are formed on the semiconductor layer 126 to expose the center of the active layer 126a. The source electrode 132 is located on the semiconductor layer 126 and extends in the data line 170 and the drain electrode 134 is located on the semiconductor layer 126 away from the source electrode 132. The thin film transistor Tr is located in the switching region TrA.

On the gate insulating film 124, a data line 170 extending along the second direction is formed so as to intersect the gate line (not shown). The data line 170 extends from the source electrode 132 of the thin film transistor Tr located in the pixel region P. [ Although not shown in the figure, in one exemplary embodiment, common wirings (not shown) are formed along the second direction parallel to the data wirings 170 on the gate insulating film 124 to form gate wirings ). In an alternative embodiment, the common wiring (not shown) may be formed in the same layer as the gate wiring (not shown) in parallel with the gate wiring (not shown).

On the other hand, a first passivation layer 128 is formed to cover the data line 170, the source electrode 132, the drain electrode 134, and the common line (not shown). A drain contact hole 135 is formed in the first passivation layer 128 to expose the drain electrode 134 of the thin film transistor Tr. The first passivation layer 128 may be an organic insulating layer, and may be formed of a low dielectric insulating layer made of a binder resin into which porous supramolecules are introduced according to the present invention. The first passivation layer 164 prevents the ohmic contact layer 126b from being damaged in the process of forming the pixel electrode 140. [

The pixel electrode 140 as a first electrode which is in contact with and electrically connected to the drain electrode 134 of the thin film transistor Tr through the drain contact hole 135 is formed in each pixel region P in the organic And is formed on the first passivation layer 128 which may be composed of an insulating film. The pixel electrode 140 is made of a transparent conductive material and may have a plate shape in each pixel region P. [ For example, the transparent conductive material may be indium-tin-oxide (ITO) or indium-zinc-oxide (IZO). Although not shown, a gate pad electrode and a data pad electrode made of the same transparent conductive material as the pixel electrode 140 are formed in the non-display region above the first passivation layer 128, And is electrically connected to the gate pad through a contact hole (not shown), and the data pad electrode is electrically connected to the data pad through a data pad contact hole (not shown).

A second passivation layer 129 is formed on the pixel electrode 140. The second passivation layer 129 may be an organic insulating layer and may be composed of a low dielectric organic insulating layer according to the present invention in the same manner as the first passivation layer 128 described above.

On the other hand, a common electrode 150 having a plurality of slit-shaped holes (opening portions) 152 is formed on the second protective layer 129 to overlap with the plate-shaped pixel electrode 140. Like the pixel electrode 140, the common electrode 150 as the second electrode may be made of a transparent conductive material such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO). The common electrode 150 is formed on the entire surface of the display region where a plurality of pixel regions P are formed. When a voltage is applied between the pixel electrode 140, which may be a first electrode in a plate form, and the common electrode 150, which may be a second electrode having an opening 152, a fringe field is formed, By driving, the transmission efficiency is improved and a high-quality image is displayed.

Although not shown in the drawings, a black matrix, which is a light shielding member having an opening corresponding to each pixel region P, is formed below the second substrate 102 constituting the color filter substrate, and a lower portion of the black matrix and a black matrix A color filter layer is formed under the second substrate 102 exposed through the opening. The color filter layer (not shown) includes red, green, and blue color filters corresponding to the pixel regions P.

An overcoat layer (not shown) of a material such as polyimide, polyacrylate, or polyurethane is formed between the color filter layer (not shown) and the liquid crystal layer 110 in order to protect the color filter layer (not shown) Can be formed.

As described above, since the organic insulating film of the present invention has a low dielectric constant value, the parasitic capacitance value in the first protective layer 128 and / or the second protective layer 129, which may be formed of the organic insulating film, The power consumption can be reduced. In addition, the thickness of the first protective layer 128 and / or the second protective layer 129 formed from the low dielectric organic insulating film of the present invention may be reduced due to the low dielectric constant. Therefore, the array substrate can be made thinner, and even with a small light amount, it is possible to perform fine pattern work on the protective layers 128 and 129. Further, since it is less stressed against bending and folding, it can be utilized as a flexible display device. Further, according to the present invention, the organic insulating film including the binder resin into which the porous supramolecules are introduced has improved adhesion to a substrate. Therefore, when the organic insulating film to which the organic material of the present invention is applied is used as the first protective layer 128 and / or the second protective layer 129, the protective layers 128 and 129 are not peeled from the substrate And can be firmly attached to the substrate.

Meanwhile, the organic insulating layer according to the present invention can be utilized as a material of an insulating layer such as an interlayer insulating layer, a protective layer, and / or a bank layer of an organic light emitting diode display device. 2 schematically shows an organic light emitting diode display 200 including an organic insulating layer according to another exemplary embodiment of the present invention.

2, in the organic light emitting diode display 200 according to the exemplary embodiment of the present invention, a non-display area NDR is defined around a display area DR and a display area DR, The first substrate 201 and the second substrate 202 are spaced apart from each other by a predetermined distance. The first substrate 201 and / or the second substrate 202 constituting the organic light emitting diode display device 200 may be formed of glass or a flexible plastic.

For example, the first substrate 201 and the second substrate 202 may be formed of polyimide, polyethersulfone, polyetherimide (PEI), and / or polyethyeleneterephthalate (PET) And the like. By adopting such a plastic material, it can be applied as a flexible substrate.

(Not shown), a driving thin film transistor DTr, and an organic light emitting diode E in each pixel region constituting the display region DR of the first substrate 201, which may be a glass or a plastic substrate, The organic light emitting device 210 is disposed. The second substrate 202 is bonded to the first substrate 201 in a direction opposite to the first substrate 201 through an adhesive or a filler sealing material 290 for encapsulation of the first substrate 201 and the organic light- Respectively.

An organic light emitting device 210 including a plurality of electrodes, signal lines, and layers is formed on the first substrate 201, which will be described in detail. The semiconductor layer 226 is formed in each pixel region of the display region DR of the first substrate 201. [ The semiconductor layer 226 is made of silicon and includes an active region 226a forming a central channel and source and drain regions 226b and 226c doped with a high concentration of impurities on both sides of the active region 226a.

A gate insulating film 224 is formed on the semiconductor layer 226. A gate electrode 222 corresponding to the active region 226a of the semiconductor layer 226 and a gate wiring (not shown) extending in one direction are formed in each pixel region in the display region DR, Respectively.

In particular, a first passivation layer 228 is formed on the entire upper surface of the gate electrode 262 and the gate wiring (not shown). The first passivation layer 228 may be an organic insulating layer and may be an organic insulating layer according to the present invention. The first passivation layer 228 and the gate insulating layer 264 below the first passivation layer 228 expose the source and drain regions 226b and 226c located on both sides of the active region 226a constituting the center of the semiconductor layer 226, 1 and 2 semiconductor layer contact holes 227a and 227b.

Although not shown in the figure, on the first passivation layer 228 including the semiconductor layer contact holes 227a and 227b, a data line (not shown) which intersects with a gate wiring (not shown), defines a pixel region, And a power supply wiring (not shown) is formed therebetween. Alternatively, the power supply wiring (not shown) may be formed on the gate insulating film 224 on which the gate wiring (not shown) is formed, being spaced apart from the gate wiring (not shown).

The first and second semiconductor layer contact holes 227a and 267b are spaced apart from each other on the first protective layer 228 including the first and second semiconductor layer contact holes 227a and 227b in the display region DR. Source and drain electrodes 232 and 234 which are in contact with the exposed source and drain regions 226b and 226c are formed.

A semiconductor layer 226 including source and drain electrodes 232 and 234 and source and drain regions 226b and 226c in contact with the electrodes 232 and 234; The gate electrode 224 and the gate electrode 222 constitute a driving thin film transistor DTr. Although not shown in the figure, a data wiring is formed which intersects the gate wiring (not shown) to define the pixel region. The switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr and is connected to the driving thin film transistor DTr.

2, the top gate type in which the semiconductor layer 226 is made of polysilicon is shown as an example of the driving thin film transistor DTr and the switching thin film transistor (not shown). However, Or may be formed of a bottom gate type made of amorphous silicon.

The second protective layer 229 is formed on the entire surface of the first substrate 201 including the driving thin film transistor DTr and the switching thin film transistor (not shown) in the display region DR. A drain contact hole 235 is formed in the second passivation layer 229. The first electrode 252 constituting the organic light emitting diode E is connected to the drain of the driving thin film transistor DTr through the drain contact hole 235. [ And can be in electrical contact with the electrode 234. The second protective layer 229 may be formed of an organic insulating material to have a flat surface, for example, an organic insulating layer according to the present invention.

The first electrode 252, the organic light-emitting layer 254, and the organic light-emitting layer 252 constituting the organic light-emitting diode E are formed on the second protective layer 229, And a second electrode 256 are sequentially formed. The first electrode 252 is connected to the drain electrode 234 of the driving thin film transistor DTr.

Illustratively, the first electrode 252 is an anode electrode, and indium-tin-oxide (ITO), which is a relatively high work function value material, can be used. Meanwhile, the second electrode 256 may be a cathode electrode, and may be made of aluminum (Al) or aluminum alloy (AlNd), which is a material having a relatively low work function value.

The organic light emitting layer 254 stacked between the first electrode 252 and the second electrode 256 may be a single layer made of a light emitting material. In an alternative embodiment, the organic light emitting layer 254 may be formed using a hole injection layer (HIL), a hole transporting layer (HTL), an emitting material layer (EML), an electron transporting layer ) And an electron injection layer (EIL), thereby maximizing the luminous efficiency.

Accordingly, when a predetermined voltage is applied to the first electrode 252 and the second electrode 256 according to a color signal selected by the organic light emitting diode 210, the holes injected from the first electrode 252 and the holes injected from the second electrode 256 256 are transported to the organic light emitting layer 254 to form an exciton. When the exciton transitions from the excited state to the ground state, light is generated and emitted in the form of visible light. At this time, in the case of the bottom emission type, the emitted light passes through the transparent first electrode 252 and goes out to the outside, so that the organic light emitting device 210 realizes an arbitrary image.

The first electrode 252 is formed for each pixel region, and a bank layer 253 is located between the first electrodes 252 formed for each pixel region. The bank layer 253 may be in the form of an organic insulating film, and the organic insulating film according to the present invention may constitute the bank layer 253. For example, the bank layer 253 is formed so as to overlap the rim of the first electrode 252 in the form of surrounding each pixel, and may have a lattice shape having a plurality of openings as a whole in the display region DR. That is, the bank layer 253 is formed as a matrix type of a lattice structure as a whole over the first substrate 201, and the first electrode 252 is divided into pixel regions with the bank layer 253 as a boundary portion for each pixel region .

Alternatively, the passivation layer 280 may be formed on the front surface of the organic light emitting device 210. The passivation layer 280 may be formed on the entire surface of the organic light emitting diode 210 so that the organic light emitting diode E can be prevented from penetrating into the organic light emitting diode 25, The moisture permeation into the organic light emitting layer 254 can be suppressed.

In one exemplary embodiment, the passivation layer 280 may be a single layer structure composed of an inorganic insulating material such as silicon oxide or silicon nitride. In another exemplary embodiment, the passivation layer 280 includes a first inorganic layer (not shown) stacked on top of the second electrode 256 using an inorganic insulating material such as silicon oxide or silicon nitride, An organic layer (not shown) laminated on the first inorganic layer (not shown) by using a polymer material such as epoxy resin, fluororesin, polyethylene terephthalate (PET) or polysiloxane, And a second inorganic layer (not shown) stacked on top of an organic layer (not shown) using an inorganic insulating material.

In the display device 200 according to the second embodiment, the organic insulating film having a low dielectric constant can constitute the first protective layer 228, the second protective layer 229 and / or the bank layer 253. The power consumption of the organic light emitting diode 210 can be reduced and the thickness of the first protective layer 228, the second protective layer 229 and / or the bank layer 253 can be reduced, It can match. Particularly, when forming the pattern of the first protective layer 228, since a sufficiently fine pattern can be formed even with a small amount of light, it can be applied to a display device of high picture quality, and stress to bending and folding is less, Can be utilized.

Further, according to the present invention, the organic insulating film including the binder resin into which the porous supramolecules are introduced has improved adhesion to a substrate. Therefore, when the organic insulating film to which the organic material of the present invention is applied is used as the first protective layer 228, the second protective layer 229, and / or the bank layer 253, the protective layers 228 and 229 ) And / or the bank layer 253 can be firmly attached to the substrate without peeling from the substrate.

Hereinafter, the present invention will be described in detail with reference to exemplary embodiments, but the present invention is not limited to the technical idea described in the embodiments.

Example  One: Porosity Superscript  Introduced Acrylate series  Organic insulating film manufacturing

An acrylate-based organic insulating film having cucurbituril introduced as porous supramolecules was prepared.

Example  2: Porosity Superscript  Introduced Urethane acrylate polysiloxane series  Organic insulating film manufacturing

A urethane acrylate polysiloxane-based organic insulating film having cucurbituril introduced therein as a porous supramolecule was prepared.

Comparative Example  One: Porosity Superscript  Non-added Acrylate series  Organic insulating film manufacturing

The procedures of Example 1 were repeated except that the supersaturated superscripts were not added and only the acrylate-based binder was used to prepare an acrylic organic insulating film.

Comparative Example  2: Porosity Superscript  Blended Acrylate series  Organic insulating film manufacturing

The procedures of Example 1 were repeated, except that the porous supramolecules were simply blended with the acrylate-based binder resin as compared with Example 1 to prepare an acrylic-based organic insulating film.

Comparative Example  3: Porosity Superscript  Non-added Urethane acrylate polysiloxane series  Organic insulating film manufacturing

The procedure of Example 2 was repeated, except that the urea acrylate polysiloxane binder was used instead of the supersaturated supramolecules to prepare an organic insulating film.

Comparative Example  4: Porosity Superscript  Blended Urethane acrylate polysiloxane series  Organic insulating film manufacturing

As compared with Example 2, the procedure of Example 2 was repeated except that the porous supramolecules were not added and the porous supramolecules were simply blended in the urethane acrylate polysiloxane-based binder resin to prepare an organic insulating film.

Experimental Example  1: Measurement of dielectric constant

The capacitance of each of the organic insulating films prepared in the above Examples and Comparative Examples was measured and the dielectric constant of the organic insulating film was measured. The dielectric constant of each photosensitive organic insulating film was measured using the following equation for measuring the capacitance.

In the equation, C represents a capacitance, ε _s represents a dielectric constant of each organic insulating film material, and ε ₀ is a dielectric constant in free space of 8.854 × 10 ^-2 . and d is the distance between the conductors, which is the thickness of the organic insulating film. A molybdenum dot pattern electrode was used as the lower electrode, and an aluminum square pattern electrode was used as the upper electrode. The dielectric constant measurement results of the respective photosensitive organic insulating films measured according to this Experimental Example are shown in Table 1 below. It was confirmed that when the porous supramolecules were introduced into the binder resin, the permittivity was greatly lowered when the porous supramolecules were not introduced and when the porous supramolecules were simply mixed with the binder resin.

Experimental Example  2: Adhesion test

The adhesive strengths of the organic insulating films prepared in Examples and Comparative Examples were measured. First, a cross-cut tape test was conducted to investigate the significant difference in adhesive strength of the respective organic insulating films to the substrate. Each organic insulating film was coated to a thickness of 3 탆 on a glass substrate having a thickness of 630 nm and a titanium film was deposited to a thickness of 0.5 탆 on the organic insulating film to prepare a sample. Pressure cooker test (PCT) was performed at 2 atm, 120 ° C and 100% relative humidity. The samples were repeated 4 times for 6 hours each for a total of 24 hours. In order to perform the cross-cut tape test, each sample was formed with a 5 x 5 square pattern at equal intervals of 2 mm using a cutter. 3M transparent double-sided tape was attached to the specimen, and the pattern was repeated.

FIG. 3B is an organic insulating film using only an acrylate-based binder (Comparative Example 1); FIG. 3C is a view showing an example of an acrylate-based binder resin Shows a cross-cut tape test result for an organic insulating film (Comparative Example 2) in which porous molecules are simply mixed. 4A is an organic insulating film (Example 2) in which porous supramolecules are introduced into a urethane acrylate polysiloxane-based binder resin, FIG. 4B is an organic insulating film (Comparative Example 3) using only urethane acrylate polysiloxane- Shows a cross-cut tape test result for an organic insulating film (Comparative Example 4) in which a porous molecule is simply mixed with a urethane acrylate polysiloxane-based binder resin. The measurement results are also shown in Table 1 below. According to the embodiment, the organic insulating film in which the porous supramolecules are introduced into the binder resin is not peeled off from the glass substrate. However, according to the comparative example, when only the binder is used or when the porous supramolecules are simply blended, It was confirmed that the glass substrate was peeled from the interface between the glass substrate and the glass substrate.

Subsequently, the peeling strengths of the organic insulating films prepared in Examples and Comparative Examples were measured by peeling test. Each organic insulating film was applied to a 630 nm thick glass substrate to a thickness of 3 mu m, and the strength of each organic insulating film when peeling from the glass substrate was measured.

5A is an organic insulating film (Comparative Example 1) using only acrylate-based binder resin, FIG. 5C is an organic insulating film containing an acrylate-based binder resin (Comparative Example 2) obtained by simply mixing the porous molecules with the organic insulating film (Comparative Example 2). 6A is an organic insulating film (Example 2) in which porous supramolecules are introduced into a urethane acrylate polysiloxane-based binder resin, FIG. 6B is an organic insulating film (Comparative Example 3) using only urethane acrylate polysiloxane- Is a graph showing the results of measuring the peel strength for an organic insulating film (Comparative Example 4) in which a porous molecule was simply mixed with a urethane acrylate polysiloxane-based binder resin. The measurement results are also shown in Table 1 below. It was confirmed that the strength of the organic insulating film introduced into the binder resin of the porous supramolecules greatly increased and the adhesion of the organic insulating film introduced into the binder resin of the porous supramolecules was greatly improved.

Permittivity and adhesion test of organic insulating film permittivity Cross-Cut Peel strength (N / m) Example 1
(Introduction of porous supramolecules into acrylic resin) 3.01 ± 0.2 No peeling 411 Example 2
(Introduction of supersaturated supramolecules into urethane acrylsiloxane resin 2.66 ± 0.3 No peeling 550 Comparative Example 1 (acrylic resin) 3.38 ± 0.1 Slightly scraped 339 Comparative Example 2
(Simple compounding of supersaturated supramolecules in acrylic resin) 3.21 ± 1.3 About 5% 336 Comparative Example 3 (urethane acryl siloxane resin) 3.12 ± 0.1 Slightly scraped 116 Comparative Example 4
(Simple compounding of supersaturated supramolecules in urethane acrylic siloxane resin) 2.98 ± 1.0 Slightly scraped 106

Although the present invention has been described based on the exemplary embodiments and examples of the present invention, the present invention is not limited to the technical ideas described in the above-described embodiments and examples. Those skilled in the art will appreciate that various modifications and changes may be made without departing from the scope of the present invention. It will be apparent, however, that the scope of the present invention includes all such variations and modifications as come within the scope of the appended claims.

100, 200: display device 101, 201: first substrate
102, 202: second substrate 110: liquid crystal layer
122, 222: gate electrodes 124, 224: gate insulating film
126, 226: semiconductor layer 128, 228: first protective layer
129, 229: second protection layer 132, 232: source electrode
134, 234: drain electrode 140: pixel electrode
150: common electrode 210: organic light emitting element
252: first electrode 253: bank layer
254: organic light emitting layer 256: second electrode
280: Passivation layer Tr: Thin film transistor
TrA: switching region P: pixel region
DR: Display area NDR: Non-display area
DTr: driving thin film transistor E: organic light emitting diode

Claims (9)

And a binder resin in which the porous supramolecules are introduced into side chains.
The method according to claim 1,
Wherein the binder resin is selected from the group consisting of a (meth) acrylate resin, a urethane resin, a polysiloxane resin and a copolymer thereof.
The method according to claim 1,
Wherein the porous supramolecules are selected from the group consisting of cyclodextrin, cucurbituril, calixarene, polycaprolactone, derivatives thereof, and combinations thereof.
A first substrate on which a plurality of signal lines are arranged;
A thin film transistor located on the first substrate;
An organic insulating film located on the thin film transistor; And
And a first electrode located on the organic insulating film,
Wherein the organic insulating film comprises a binder resin in which porous supramolecules are introduced into side chains.
5. The method of claim 4,
Wherein the binder resin is selected from the group consisting of a (meth) acrylate resin, a urethane resin, a polysiloxane resin, and a copolymer thereof.
5. The method of claim 4,
Wherein the porous supramolecules are selected from the group consisting of cyclodextrin, cucurbituril, calixarene, polycaprolactone, derivatives thereof, and combinations thereof.
The method according to any one of claims 4 to 6,
A second substrate facing the first substrate, and a liquid crystal layer interposed between the first substrate and the second substrate.
8. The method of claim 7,
A second electrode having a plurality of openings corresponding to the first electrode, and a protective layer disposed between the first electrode and the second electrode, wherein the protective layer is formed of a material Device.
The method according to any one of claims 4 to 6,
A bank layer located on the first electrode, an organic light emitting layer, and a second electrode facing the first electrode,
Wherein the bank layer is made of the same material as the organic insulating film.

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