KR20160083181A - Moisture permeability resistant adhesive with enhanced transparency and organic light emitting diode display device including the adhesive - Google Patents

Abstract

The present invention relates to an adhesive layer comprising a binder resin, and a hydrolyzable components mixed or combined with the binder resin; and to an organic light emitting diode display device positioned between the substrate which the adhesive layer faces. The adhesive layer according to the present invention has favorable light transmittance by using a transparent material, and has excellent dispersing characteristics. Particularly, the adhesive layer can largely delay penetration of moisture into the organic light emitting device by having a reaction with moisture, thereby suppressing deterioration or breakdown of the organic light emitting device caused by penetration of moisture.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a moisture permeable adhesive having improved transparency and an organic light emitting diode (OLED)

More particularly, the present invention relates to an moisture permeable adhesive having improved transparency and dispersibility, and an organic light emitting diode display including the adhesive.

Called flat panel display has been developed in place of the conventional CRT. Of the display devices applied to such flat panel display devices, organic light emitting diode display devices using organic light emitting devices (OLEDs) have high luminance and low operating voltage characteristics. In addition, unlike a liquid crystal display (LCD), an organic light emitting diode display device emits light in a self-luminous manner, has a high contrast ratio, can realize an ultra-thin display panel, has a short response time, . Furthermore, since the device is stable even at a low temperature and is driven at a low voltage, it is advantageous in that it is easy to manufacture and design a driving circuit. In addition, OLED devices can be fabricated with virtually only deposition equipment and encapsulation equipment, which has the advantage that the manufacturing process is simple.

Fig. 1 schematically shows a conventional organic light emitting diode display device 1. As shown in Fig. A conventional organic light emitting diode display device 1 includes a lower substrate 10 on which an OLED 12 is formed and an upper substrate 20 facing the lower substrate 10 for encapsulation, . The organic light emitting diode 12 includes a switching thin film transistor (not shown), a driving thin film transistor, and an organic light emitting diode.

Components such as the organic light emitting layer and the metal electrode constituting the organic light emitting diode (not shown) react with moisture or oxygen and the characteristics are rapidly degraded. For example, the metal electrode constituting the organic light emitting diode (not shown) may be partially oxidized by moisture and oxygen introduced from the outside, thereby causing a poor electrical connection. There arises a problem that a non-light emitting region such as a dark spot occurs due to poor conduction, a luminance (life) is reduced, and a pixel shrinkage occurs and the yield is lowered.

It is very important to block the inflow of moisture or oxygen from the organic light emitting diode display device 1 to the organic light emitting element 12. [ For this purpose, a passivation layer 14 made of an insulating material is formed on the front surface of the organic light emitting diode 12. However, only the passivation layer 14 covering the entire surface of the organic light emitting element 12 can not completely prevent oxygen and moisture from penetrating into the organic light emitting element 12. [

Therefore, it is necessary to encapsulate between the lower substrate 10 and the upper substrate 20 to prevent water or oxygen from penetrating into the organic light emitting element 12. [ As a method for sealing between the lower substrate 10 and the upper substrate 20, a sealing adhesive 30 such as a face seal adhesive (FSA) is applied to the lower substrate 10 and the upper substrate 20 A method of filling the sealing adhesive 30 between the lower substrate 10 and the upper substrate 20 including the organic light emitting device 14 may be used.

A getter component 32 capable of adsorbing moisture to the binder resin is dispersed in the sealing adhesive 30 such as a face seal adhesive (FSA). Usually, the getter component 32 is made of calcium oxide (CaO) a metal oxide such as magnesium oxide (MgO), aluminum oxide (Al ₂ O _3). Since these metal oxides are reactive with moisture, moisture can be adsorbed. Therefore, if a metal oxide is used as the getter component 32 of the sealing adhesive 30, the moisture introduced from the outside may be chemically reacted with the getter component 32 or a physical drag effect, The penetration into the element 12 can be delayed or prevented. This delay effect can improve the moisture-proof reliability for the organic light-emitting element 12. [

The metal oxide which is the getter component 32 included in the sealing adhesive 30 to prevent water penetration from the organic light emitting diode display device 1 into the organic light emitting diode 12 may be a face seal adhesive (FSA) And dispersed in the constituent binder resin. Since these metal oxides are added to the binder resin in an opaque solid phase state, the transmittance of the sealing adhesive 30 using the binder resin in which the metal oxide is dispersed as the getter component 32 is lowered.

In other words, if the adhesive 30 having the metal oxide dispersed therein is used as the getter component 32 and the entirety between the lower substrate 10 and the upper substrate 20 is coated with the getter component 32, The light transmittance of the sealing adhesive 30 is greatly reduced. Therefore, when the sealing adhesive 30 using the metal oxide as the getter component 32 is used to seal between the substrates 10 and 20, light emitted from the organic light emitting element 12 is emitted to the lower substrate 10, So that the light can be emitted. That is, when the metal oxide is dispersed by the getter material 32 in the sealing adhesive 30 such as the face seal adhesive (FSA), it can be applied only to the organic light emitting diode display device 1 of the bottom emission type.

When a metal oxide is added to the binder as the getter component 32, a nano-sized metal oxide powder is added to the binder resin to secure the transmittance. Even when a nano-sized metal oxide powder is intended to be dispersed in the binder resin, a phenomenon such as entanglement or the like occurs between the nano-dispersions and it is not easy to uniformly disperse the metal oxide in the binder resin. Especially when an adhesive resin or an adhesive resin having a high viscosity is used as the binder resin, it is more difficult to disperse the metal oxide in these high viscosity binder resins. Further, even after dispersing the metal oxide as the getter component 32 into the binder resin, the getter components 32 may be precipitated or the like, which makes it difficult to secure stability and the transmittance sharply decreases.

On the other hand, a pressure sensitive adhesive (PSA) of the adhesive film type is used in the conventional top emission organic light emitting diode display. The barrier pressure-sensitive adhesive (PSA) is a pressure-sensitive adhesive composition comprising a rubber-based binder resin as a main component, and suppresses moisture penetration by utilizing the hydrophobicity of the rubber itself. However, the effect of suppressing the moisture permeation of the barrier pressure-sensitive adhesive is unsatisfactory as compared with the case of using the metal oxide type getter in the organic light emitting diode display device of the conventional bottom emission type. Also, when the metal oxide is used as the getter component in the barrier pressure-sensitive adhesive applied to the upper light emitting type, the transmittance is lowered. Therefore, the adhesive containing the conventional getter component typified by the metal oxide is used in the organic light emitting diode display device of the upper light emitting type It was difficult to use.

SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the problems of the related art described above, and is intended to solve problems of transparency and dispersibility of an adhesive layer filling between substrates in a display device.

That is, an object of the present invention is to provide an organic moisture-impermeable adhesive layer having improved transmittance by using a getter component having transparency and an organic light-emitting diode display device including the adhesive layer.

Another object of the present invention is to provide an adhesive layer which is excellent in dispersion characteristics with respect to a binder resin and can exhibit moisture permeability uniformly over an entire region located between the substrates, and an organic light emitting diode display device including the adhesive layer.

It is another object of the present invention to provide an organic moisture-impermeable adhesive layer which can be applied to both the upper light emitting type and the lower light emitting type, and an organic light emitting diode display including the adhesive layer.

According to one aspect of the present invention having the above-described object, the present invention provides an adhesive comprising a binder resin and a hydrolyzable component, which is combined with the binder resin and is selected from at least one of an organic acid anhydride and an ester compound.

Further, the present invention provides an adhesive in which a hydrolyzable component selected from at least one of an organic acid anhydride and an ester compound is bonded to a binder resin.

The binder resin may be an adhesive which is a rubber-based resin.

The ester compound includes an ester compound having an epoxy group.

For example, the organic acid anhydride has an unsaturated double bond, and the binder resin may have a reactive moiety of a curable unsaturated double bond.

According to another aspect of the present invention, there is provided a light emitting device including a first substrate, a second substrate facing the first substrate, an organic light emitting element located on the first substrate, and a first adhesive layer covering the organic light emitting element , The first adhesive layer comprises a first binder resin and a hydrolyzable component selected from organic acid anhydride and ester compound in combination with the first binder resin.

The present invention also provides a light emitting device comprising a first substrate, a second substrate facing the first substrate, an organic light emitting element located on the first substrate, and a first adhesive layer covering the organic light emitting element, An organic acid anhydride and an ester compound, wherein the hydrolyzable component is bonded to the first binder resin.

In an exemplary embodiment, a second adhesive layer including a second binder resin may be disposed between the first adhesive layer and the second substrate or between the organic light emitting element and the first adhesive layer.

At this time, the second binder resin may be a rubber-based resin.

In the present invention, an organic acid anhydride and / or ester compound having excellent transparency is used as a getter as a component that can be hydrolyzed in reaction with moisture.

These hydrolyzable components used as getters are excellent in transparency, so that they do not deteriorate the transmittance even when they are dispersed in a binder, and can prevent moisture from penetrating into the organic light emitting device through the process of hydrolysis by reacting with water .

In addition, the adhesive layer of the present invention can be applied not only to the top emission type but also to the bottom emission type organic light emitting diode display.

In addition, the hydrolyzable component used as the getter component according to the present invention is excellent in the dispersion property with respect to the binder. Therefore, even when the adhesive layer is applied to the entire region between the two opposed substrates, the getter component can be uniformly dispersed over the entire region to which the adhesive layer is applied, so that the moisture permeability can be exerted uniformly over the entire region between the substrates.

1 is a view schematically showing a conventional organic light emitting diode display device to which a face-sealing type adhesive is applied.
2 is a view schematically showing an organic light emitting diode display device including one adhesive layer with improved transparency and moisture permeability according to a first embodiment of the present invention.
3 is a view schematically showing an organic light emitting diode display device including two adhesive layers with improved transparency and moisture permeability according to a second embodiment of the present invention.
4 is a diagram showing in more detail an organic light emitting diode display device in which an adhesive layer having improved transparency and moisture permeability is disposed between two substrates according to an exemplary embodiment of the present invention.
5 is a graph showing the results of measuring the degree of hygroscopicity of an adhesive in which a transparent organic acid anhydride is blended in a binder resin and an adhesive in which an organic acid anhydride is graft-polymerized to a binder resin according to an exemplary embodiment of the present invention Graph.
6 is a graph showing the results of measurement of mechanical properties before and after moisture absorption for an adhesive in which a transparent ester compound as a getter component is blended with a binder resin according to an exemplary embodiment of the present invention.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings where necessary.

[Moisture permeable adhesive / adhesive layer]

The moisture permeable adhesive layer of the present invention comprises a binder resin and a hydrolyzable component as a getter component.

The binder resin constituting the adhesive layer of the present invention may be any binder resin used in pressure sensitive adhesives, face seal adhesives (FSA), and / or optically clear adhesives (OCA) . For example, the binder resin constituting the adhesive layer of the present invention may be at least one selected from the group consisting of acrylic resins, poly (meth) acrylate resins, vinyl resins, styrene resins, ester resins, rubber resins, epoxy resins, silicone resins such as polysiloxane resins, A polyamide resin, a phenoxy resin, a polyurethane resin, a combination thereof, and a copolymer thereof. However, the present invention is not limited thereto. The term "(meth) acrylate" is used herein to mean both acrylate and methacrylate unless otherwise stated.

In one exemplary embodiment, the binder resin may be a hydrophobic binder resin to inhibit moisture penetration. The hydrophobic binder resin includes, for example, a rubber-based resin. The rubber-based resin that can be used as the binder resin according to the present invention includes polybutadiene (PB), polyisoprene, neoprene, polyisobutylene (PIB) as a copolymer of isobutylene and isoprene, Butadiene rubber, hydrogenated polyisobutylene, styrene-butadiene rubber (SBR), acrylonitrile-butadiene rubber (NBR), hydrogenated NBR, acrylonitrile-butadiene-styrene Acrylonitrile-butadiene-styrene (ABS) rubber, Acrylate-Butadiene Rubber (ABR), Ethylene-Propylene Rubber, Ethylene-Propylene-Diene Rubber, Epichlorohydrin rubbers, and combinations or copolymers thereof, but are not limited thereto.

In an exemplary embodiment, the binder resin may have a reactive moiety having an unsaturated double bond, such as, for example, an acrylate group. For example, a reactive moiety having an unsaturated double bond may be located at either end of the binder resin, or may be connected in a side chain form to the main chain of the binder resin. For example, reactive functional groups such as acrylate groups may be attached to the both ends of the binder resin in the form of linkers.

On the other hand, an unsaturated double bond may be present at the end of the organic acid anhydride, which is one of the hydrolyzable components described later. Therefore, when the binder resin has a reactive moiety having an unsaturated double bond, the organic acid anhydride having an unsaturated double bond by the polymerization initiator can cause a chain polymerization reaction with a reactive moiety having an unsaturated double bond of the binder resin, Thus, the organic acid anhydride can be chemically bonded to the binder resin. The binder resin and the organic acid anhydride, which is one of the hydrolyzable components used as the getter, can be bonded as one molecule without being mixed as separate components, thereby maximizing the dispersibility of the hydrolyzable component to the binder resin.

In an alternative embodiment, the binder resin may contain other types of resins in addition to the aforementioned rubber-based resins as base resins. The resin that can be used in combination with the rubber-based resin may be any non-rubber-based resin that can be used in a pressure sensitive adhesive (PSA), a face seal adhesive (FSA), and / or an optical transparent adhesive (OCA).

The resin which can be used together with the rubber-based resin, which is preferably a base binder resin, may be a curing agent-reactive resin, for example, an epoxy resin having a glycidyl group, for example. The epoxy resin is bisphenol-A type epoxy resin; Bisphenol-F type epoxy resin; Novolac epoxy resins such as phenol novolac epoxy resin, cresol novolac epoxy resin, and bisphenol-A novolac epoxy resin; Aliphatic epoxy resins such as dodecanol glycidyl ether, diglycidyl ester of hexahydrophthalic acid, trimethylopropane triglycidyl ether and the like; Cyclo-aliphatic epoxy resins such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate; Triglycidyl-p-aminophenol, tetraglycidyl diamine diphenyl methane (TGDDM), N, N, N, N-tetraglycidyl- Glycidylamine epoxy resin such as N, N, N-tetraglycidyl-4,4-methylenebis benzylamine; Rubber-modified epoxy resins; Silane-modified epoxy resins, and the like.

Preferably, an epoxy resin having a cyclic structure in the molecular structure, for example, an aromatic group, can be used as the epoxy resin. The epoxy resin having a cyclic structure has an advantage that the water absorption reliability can be improved particularly by the low moisture absorption amount. The epoxy resin having a cyclic structure is preferably a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene modified phenol type epoxy resin, a cresol type epoxy resin, a bisphenol type epoxy resin, , A polyfunctional epoxy resin, a phenol novolac epoxy resin, a triphenol methane type epoxy resin, and an alkyl-modified triphenol methane epoxy resin, but the present invention is not limited thereto.

For example, the rubber-based resin used as the binder resin may be added at a ratio of 90 to 95 parts by weight to the adhesive of the present invention. Unless otherwise specified, the term " parts by weight " as used herein means the weight ratios between the components.

The moisture-permeable adhesive having improved transparency and dispersibility according to the present invention includes a hydrolyzable component dispersed or compounded in the above-mentioned binder resin or as a getter component that can be bonded to the binder resin. As described later, the hydrolyzable component is hydrolyzed by reacting with water. In this sense, the getter is a compound which is combined with or bonded to the binder resin, which is the base component of the adhesive, to convert water into other components through water and chemical reaction It can mean material.

In one exemplary embodiment, the hydrolysable component, which is a getter component, may be a substance that is dispersed in the binder resin, i.e., a material that is separate from the binder resin. In an alternative embodiment, the hydrolysable component, which is a getter component, can chemically bond with the binder resin to constitute a portion of the binder resin, i. E., Constitute one moiety of the binder resin. For example, the hydrolysable component may be an organic acid anhydride and / or an ester compound, in particular a transparent organic acid anhydride and / or an ester compound.

The organic acid anhydride which can be used as the hydrolyzable component is an anhydride in which two acyl groups (RC = O) are linked to the same oxygen atom (carboxylic acid anhydride; , At least one of the two acyl groups may be an anhydride derived from a sulfonic acid (sulfonic acid anhydride; general formula RS (= O) ₂ OS (= O) ₂ R or RC ) ₂ R. For example, a carboxylic acid anhydride may be obtained by dehydration and condensation of one kind of carboxylic acid, or by condensation of two kinds of carboxylic acid (mixed acid anhydride), or from two carboxyl groups in dibasic acid It may be an annular organic acid anhydride resulting from dehydration.

In an exemplary embodiment, the organic acid anhydride, which is one of the hydrolysable components, is a C _{1 -20} alkyl group at each carbon constituting - (C = O) -O- (C = O) - which is an anhydride group derived from a carboxylic acid , An aliphatic acid anhydride to which an alkenyl group of C _{2 -20} is connected, an aliphatic acid anhydride to which an alkoxy group of C _{1 -20} is connected, a ring in which an anhydride group is formed and / or an alicyclic ring connected to the ring are unsubstituted or substituted with C _{1 -20} alkyl group, an acid of the C _{2 -20} alkenyl, C _{1 -20} alkoxy group, C _{4 -8} alicyclic group, C ₄ -C ₂₀ in the aryl group, an aliphatic substituted with C ₄ -C ₂₀ aralkyl group An alicyclic acid anhydride, an anhydride group-forming ring, and / or an aromatic ring connected to the ring may be unsubstituted or substituted with a C _{1 -20} alkyl group, a C _{2 -20} alkenyl group, a C _{1 -20} alkoxy group, a C _{4 -8} alicyclic group, C ₄ -C ₂₀ aryl group, C ₄ -C ₂₀ aralkyl group is an aromatic acid anhydride (aromatic acid anhydride) with the substitution of the Combinations thereof. Particularly, it is preferably an alicyclic acid anhydride and / or an aromatic acid anhydride. These alicyclic acid anhydrides and / or aromatic acid anhydrides may have an unsaturated double bond, so that they can participate in the polymerization chain reaction of the reactive moiety such as the curable unsaturated double bond formed in the binder resin and bind with the binder resin, The dispersibility to the binder resin can be improved.

Alicyclic acid anhydrides of the ring and / or an alicyclic ring which is connected to the ring is optionally substituted with C _{1 -20} alkyl, C _{2 -20} alkenyl, C _{1 -20} of the anhydride groups formed in the alkoxy group, C _{4- 8} alicyclic group, C ₄ -C ₂₀ aryl group, C ₄ -C ₂₀ aralkyl group hexahydrophthalic acid anhydride which is substituted with a (hexahydrophthalic anhydride, HHPA), succinic anhydride (succinic anhydride) of 1, 2, 3, Tetrahydrophthalic anhydride (THPA), maleic anhydride, bicyclo [2.2.1] heptane-2, 3-tetrahydrophthalic anhydride such as 6-tetrahydrophthalic anhydride and 3,4,5,6-tetrahydrophthalic anhydride, Bicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride, ethylenetetracarboxylic dianhydride, cyclobutane-1,2,3,4-tetracarboxylic anhydride, Acid dianhydride (CBDA), and the like, but the present invention is not limited thereto. It is.

Aromatic acid anhydrides anhydride group is formed of a ring and / or an alkenyl group, an alkoxy group, a C _4-8 C _{1 -20} of the aromatic ring is substituted connected to the ring or C _{1 -20} alkyl, C _{2 -20} of the alicyclic group, C ₄ -C ₂₀ aryl group, C ₄ anhydride which is substituted with an aralkyl _{-C 20 (phthalic anhydride, PA)} , 5- norbornene-2,3-dicarboxylic acid anhydride (5 norbornene-2,3-dicarboxylic anhydride, ethylene glycol bis-anhydro trimellitate, glycerin bis-anhydro trimellitate monoacetate, pyromellitic acid Pyromellitic dianhydride (PMDA), 3,3 ', 4,4'-oxydiphtalic dianhydride (ODPA), 3,3', 4,4 ' (3,3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride (DSDA), 4,4'-biphthalic acid (hexafluoroisobutyronitrile 3,6 ', 4,4'-benzophenonetetracarboxylic acid dianhydride (3,3', 4,4'-benzophenone (3,3 ', 4,4'-biphenylylene dianhydride tetracarboxylic dianhydride (BTDA), 3,4,3 ', 4'-biphenyltetracarboxylic dianhydride (BPDA), benzoquinone tetracarboxylic dianhydride ( Benzoquinonetetracarboxylic dianhydride), and the like, but is not limited thereto.

The organic acid anhydride reacts with moisture to form two carboxyl groups as shown in the following reaction scheme 1, and thus functions as a getter that absorbs moisture.

Scheme 1

In an exemplary embodiment, the organic acid anhydride used as the getter component may be compounded with the binder resin and added as a separate compound from the binder resin. In another exemplary embodiment, if a reactive moiety of a curable unsaturated double bond, such as an acrylate group, is present in the binder resin, the organic acid anhydride having an unsaturated double bond is covalently bonded to the chain initiated by the reactive moiety of the binder resin Can be bonded to the binder resin by polymerization reaction. When the organic acid anhydride constitutes a single moiety of the binder resin, the binder resin and the organic acid anhydride can chemically exist as one molecule, and thus the dispersing property of the organic acid anhydride to the binder resin can be improved.

An organic acid anhydride having an unsaturated double bond is maleic anhydride, tetrahydrophthalic acid anhydride, or fatty acid anhydride groups are connected to C alkenyl group of _{2 -20, 2 -20} alkenyl C as 3-dodecyl succinic anhydride and octenyl succinic anhydride Cycloaliphatic acid anhydrides and / or aromatic acid anhydrides, which are substituted with groups.

On the other hand, other hydrolyzable components that can be used as the getter component in addition to the organic acid anhydrides described above are transparent ester compounds. For example, the ester compound may be an aliphatic ester compound, an alicyclic ester compound, an aromatic ester compound, and / or an epoxy ester compound. By way of example, an ester compound that can be used as getter elements in accordance with the present invention, each alkyl group of C _{1 -20} to both ends of an ester group, a cycloaliphatic C _{4 -8} jokgi, C _{4 -} of _C20 aryl group, C _{4 - C20} An aralkyl group, or an epoxy group of the compound

In the exemplary embodiment, one of the ester compounds of the hydrolyzable component is used as the getter component is an alkyl group of the ester group C _{1 -20} in both ends of the C _{4 -8} alicyclic group, and / or C _{4 - C20} aryl group of the May have an epoxy group connected thereto. If an ester group, which is one of the hydrolysable components, has an epoxy group at both ends, the epoxy group reacts with the curing agent to cure, and the modulus of the finally synthesized adhesive can be controlled to increase the adhesive strength.

In addition, alicyclic and / or C ₄ alkyl group on both ends C _{1 -20, -8} of the C ₄ ester group _- When introducing an epoxy group which is connected through _C20 aryl group, the polar group in the molecule of the ester can be canceled have. Thus, for example, when an ester compound having an epoxy group connected to both ends of an ester group through these substituents is used as a getter, compatibility with a rubber-based resin which can be used as a non-polar base binder resin is improved, The dispersibility of the ester compound to the resin can be improved.

In addition, when an ester compound having an epoxy group is used as a getter, the epoxy group is cured by a curing agent component to be described later and functions as a crosslinker. The epoxy group as a crosslinking agent can be crosslinked with the binder resin, and thus an ester compound having an epoxy group can be bonded to the binder resin. Therefore, the ester compound having an epoxy group can improve the dispersibility with respect to the binder resin.

The ester compound reacts with water to be hydrolyzed into an alcohol and a carboxylic acid as shown in Reaction Scheme 2 below, and functions as a getter that absorbs moisture.

Scheme 2

The hydrolyzable component as the getter component which can be selected from the above-mentioned organic acid anhydride and / or ester compound may be added in an amount of 1 to 50 parts by weight, preferably 5 to 30 parts by weight, in the adhesive. When the content of the hydrolyzable component is less than the above range, the effect of delaying the penetration of water is insignificant, and if the content of the hydrolyzable component is more than this range, the properties such as adhesive strength and strength of the adhesive may be deteriorated.

The adhesive of the present invention may contain other functional additives besides the above-mentioned binder resin and the hydrolyzable component which is a getter component. For example, when the binder resin has a reactive moiety having an unsaturated double bond and an organic acid anhydride having an unsaturated double bond as a hydrolyzable component is selected, the reactive moiety of the binder resin and the unsaturated double bond of the organic acid anhydride are chain- A polymerization initiator capable of inducing a polymerization reaction may be used. The polymerization initiator is not particularly limited, but a photopolymerization initiator can be preferably used. Photopolymerization initiators include, but are not limited to, acetophenone, benzophenone, thioxanthone, benzoin, and triazine photoinitiators. For example, a product sold as Irgacure as a photopolymerization initiator can be used.

The polymerization initiator may be added to the adhesive of the present invention in an amount of 0.01 to 5 parts by weight, preferably 0.1 to 3 parts by weight, in the adhesive. If the content of the polymerization initiator is less than this range, the curing reaction rate becomes too slow or the polymerization initiating reaction can not be performed. On the other hand, if the content of the polymerization initiator is too large, yellowing of the adhesive may be caused due to the ring property of the polymerization initiator not participating in the curing reaction.

Further, when an epoxy resin is mixed with the binder resin or an ester compound having an epoxy group at both ends is used as the hydrolyzable component, a curing agent component capable of curing the epoxy may be added to the moisture permeable adhesive of the present invention. Any curing agent component capable of curing the epoxy group in the epoxy resin or the ester compound may be used. Preferably, a transparent curing agent component that does not lower the transparency of the adhesive can be used.

For example, the curing agent component which may be added to the adhesive of the present invention is optionally substituted with the hexahydrophthalic anhydride, bicyclo-substituted with an alkyl group of C _{1 -10} [2.2.1] heptane-2,3-dicarboxylic acid Anhydride-based curing agents selected from at least one type of anhydride; N-aminoethyl piperazine, isophorone diamine (IPDA) and an epoxy adduct type curing agent obtained by an addition reaction of an amine compound with an epoxy, etc. Amine-based curing agents; Imidazole-based curing agents which are unsubstituted or substituted with C _{1 -20} alkyl groups, C _{4 -20} aryl groups, and imidazole and trimellitic acid adducts; And a latent curing agent used for cationic polymerization of epoxy may be used alone or in combination.

The latent curing agent used for the cationic polymerization of epoxy is an aromatic omnium salt containing non-nucleophilic anions such as BF ₄ ^- , PF ₆ ^- , AsF ₆ ^- , SbF ₆ ^- . For example, such a latent curing agent may be N-benzylpyrazine such as N-benzylpyrazium hexafluoroantimonate, N-benzylpyrazinium hexafluorophosphate, Benzyl-3-cyanopyrazinium hexafluorophosphate, N-crotyl-N, N'-dimethyl-4-methylanilinium hexafluoroantimonate (N -crotyl-N, N-dimethyl-4-methylanilinium hexafluoro anionate) and the like. Alternatively, the curing agent may be added in an amount of 1 to 5 parts by weight in the adhesive of the present invention.

In addition, the adhesive of the present invention may contain a functional ingredient such as a coupling agent such as a silane-based coupling agent, a titanium-based coupling agent and / or a zirconium-based coupling agent, or a surfactant so as to improve the adhesion to the object to be adhered . These functional components may be added in a proportion of, for example, 1 to 10 parts by weight, preferably 1 to 5 parts by weight, to improve the physical properties of the adhesive.

In addition, the adhesive of the present invention includes an appropriate plasticizer component to lower the modulus value of the adhesive. Plasticizer components that may be used include any component that can lower the modulus of the adhesive. For example, the plasticizer component may be a dioctyl phthalate (DOP) type, a dioctylaminate (DOA) type, a tricresylphosphate (TCP), a dioctyl azoleate (DOZ) type, an ester (Esther) type, a polyisoprene type And combinations thereof. The plasticizer component may be added in an amount of 3 to 10 parts by weight in the adhesive. If the content of the plasticizer component is lower than this range, the modulus value of the adhesive becomes excessively high and it may be vulnerable to an external impact. On the other hand, if the plasticizer component is higher than the above range, the adhesive strength may be weakened, resulting in poor adhesion.

In an exemplary embodiment, the hydrolyzable component, which is an organic acid anhydride and / or an ester compound, is added to the liquid binder resin as a getter component, and then the hydrolyzable component is uniformly dispersed in the binder resin using a dispersion process. Particularly, when the rubber-based resin which can be used as the base binder resin has a reactive moiety such as an acrylate group and an organic acid anhydride having an unsaturated double bond as a hydrolyzable component and / or an ester compound having an epoxy group as a hydrolyzable component The hydrolyzable component can be bonded to the binder resin or can be uniformly dispersed in the binder resin by canceling the polarity with the binder resin by the polymerization initiator or the curing agent.

[Organic light-emitting diode display device]

According to the present invention, the hydrolyzable component blended with the binder resin or bonded to the binder resin can react with moisture to delay moisture penetration, and does not lower the light transmittance as a transparent component. Therefore, the adhesive of the present invention can be utilized, for example, as an impermeable adhesive layer for sealing between substrates of an organic light emitting diode display.

Fig. 2 schematically shows an organic light-emitting diode display device having an adhesive layer comprising a hydrolyzable component combined with a binder resin or combined with a binder resin according to a first embodiment of the present invention. In the organic light emitting diode display device 100A according to the first embodiment of the present invention, the first substrate 101 and the second substrate 102 face each other with a predetermined gap therebetween. The first substrate 101 and / or the second substrate 102 constituting the organic light emitting diode display device 100A may be formed of glass or a flexible plastic.

For example, the first substrate 101 and / or the second substrate 102 may be formed of a material selected from the group consisting of polyimide, polyethersulfone, polyetherimide (PEI), and polyethyleneterephthalate (PET) And the like. By adopting such a plastic material, it can be applied as a flexible substrate. The second substrate 102, which is an encapsulation substrate, may also be in the form of a barrier film of inorganic-organic-organic material.

An organic light emitting diode (OLED) 110 is disposed on the upper surface of a first substrate 101 as a base substrate. A passivation layer 160 covers the entire surface of the organic light emitting diode 110 to prevent moisture from penetrating into the organic light emitting diode 110.

The second substrate 102 as an encapsulation substrate is bonded to the first substrate 101 through the adhesive layer 210 to encapsulate the organic light emitting device 110 formed on the first substrate 101. According to the first embodiment of the present invention, the adhesive layer 210 is made of, for example, a rubber resin alone or in combination with a rubber resin and an epoxy resin, a binder resin 212, 212 which is coupled to the hydrolyzable component (214). The hydrolyzable component 214 is the aforementioned organic acid anhydride and / or ester compound. For example, the adhesive layer 210 is laminated and formed between the first substrate 101 and the second substrate 102 through a process such as a hot roll lamination process or a process such as screen printing and covers the organic light emitting device 110 The first substrate 101 and the second substrate 102 may be bonded together.

The adhesive layer 210 according to the first embodiment of the present invention is a kind of 'getter adhesive layer' containing a hydrolyzable component 212 which is a transparent getter component dispersed or bonded to the binder resin 212. The hydrolysable component (212) is hydrolyzed by reaction with externally introduced water. In other words, the externally introduced moisture reacts with the hydrolyzable component of the adhesive layer 210 and is converted into a part of the hydrolyzate.

As described above, the adhesive layer 210 constituting the organic light emitting diode display device 100A according to the first embodiment of the present invention can delay moisture infiltration for a considerable period of time by converting the moisture introduced from the outside into other components. As a result, the moisture introduced from the outside takes a considerable period of time to pass through the adhesive layer 210, so that moisture infiltration into the organic light emitting device 110 can be minimized. Therefore, it is possible to prevent deterioration of metal electrodes and organic materials in the organic light emitting element 110 due to moisture penetration.

In addition, since the hydrolyzable component contained in the getter component is transparent, the light transmittance of the adhesive layer 210 does not decrease. Therefore, light generated in the organic light emitting diode 110 constituting the organic light emitting diode display device 100A according to the first embodiment of the present invention is incident on the second substrate 102 as well as the first substrate 101, The luminance is not lowered even if the light is emitted toward the light source. The organic light emitting diode display device 100A according to the first embodiment of the present invention is applied to the lower light emitting type organic light emitting diode display device 10 (see FIG. 1) It can be applied to both the light emitting type and the top light emitting type.

On the other hand, an adhesive layer separate from the adhesive layer containing a hydrolyzable component as a getter component may be included in the organic light emitting diode display. Fig. 3 shows an organic light emitting diode display device having two adhesive layers according to a second embodiment of the present invention. As shown in the figure, in the organic light emitting diode display device 100B according to the second embodiment of the present invention, the first substrate 110 as a base substrate and the second substrate 102 as an encapsulating substrate face each other. The first substrate 101 and / or the second substrate 102 constituting the organic light emitting diode display device 100B may be formed of glass or a flexible plastic.

An organic light emitting diode (OLED) 110 is formed on an upper surface of the first substrate 101. The passivation layer 160 covers the entire surface of the organic light emitting diode 110 to prevent moisture penetration into the organic light emitting diode 110. A second substrate 102 as an encapsulating substrate is encapsulated on the first substrate 101 through the first adhesive layer 210 and the second adhesive layer 220 to encapsulate the organic light emitting device 110 formed on the first substrate 101. [ .

According to the second embodiment of the present invention, two adhesive layers 210 and 220 are positioned between the first substrate 101 and the second substrate 102. [ The first adhesive layer 210 may be formed of, for example, a rubber-based resin, a first binder resin 212 in which a rubber-based resin and an epoxy resin are blended, and a second binder resin 212 in combination with the first binder resin 212, And a hydrolysable component (214) bonded to the substrate. The hydrolyzable component 214 is the aforementioned organic acid anhydride and / or ester compound.

The first adhesive layer 210 according to the second embodiment of the present invention is a kind of 'getter adhesive layer' including the hydrolyzable component 214 which is a transparent getter component dispersed or bonded to the first binder resin 212. The hydrolyzable component 214 is hydrolyzed by reaction with externally introduced water.

The second adhesive layer 220 positioned between the first substrate 101 and the first adhesive layer 102 may be formed of a pressure sensitive adhesive (PSA), a face seal adhesive (FSA), an optical transparent adhesive OCA), and the like. For example, the second binder resin 222 may be composed of a hydrophobic binder resin such as a rubber-based resin. In this case, the second adhesive layer 220 may be a 'barrier adhesive layer' configured to suppress moisture penetration.

The first adhesive layer 210 and the second adhesive layer 220 are laminated and formed between the first substrate 101 and the second substrate 102 through a process such as hot roll lamination or a process such as screen printing, The first substrate 101 and the second substrate 102 on the outer side of the first substrate 110 may be bonded together. The second adhesive layer 220 is formed on the first substrate 101 on which the organic light emitting element 110 is located and the first adhesive layer 210 is formed on the second adhesive layer 220. The first adhesive layer 210 may be formed on the first substrate 101 on which the organic light emitting element 110 is located and the second adhesive layer 220 may be formed on the first adhesive layer 210. [ have.

In the organic light emitting diode display device 100B according to the second embodiment of the present invention, the moisture introduced from the outside or introduced from the second adhesive layer 220 reacts with the hydrolyzable component of the first adhesive layer 210, The moisture penetration into the organic light emitting element 110 can be delayed. Therefore, it is possible to prevent deterioration of metal electrodes and organic materials in the organic light emitting element 110 due to moisture penetration.

In addition, since the hydrolyzable component contained in the getter component is transparent, the light transmittance of the first adhesive layer 210 and the second adhesive layer 220 is not lowered. As in the first embodiment, the organic light emitting diode display device 100B according to the second embodiment of the present invention can be applied to both the bottom emission type and the top emission type.

Subsequently, according to the present invention, the structure of the organic light emitting diode display device in which the hydrolyzable component as the getter component is blended with the binder resin or the adhesive layer bonded to the binder resin fills the space between the first substrate and the second substrate . FIG. 4 is a diagram illustrating an organic light emitting diode display device in which an adhesive layer having improved transparency and moisture permeability is disposed between substrates according to the present invention, for example, an upper light emitting type.

The organic light emitting diode display 100 according to the present invention has a non-display area NDR defined around the display area DR and the display area DR, 2 substrates 102 are spaced apart from each other by a predetermined distance. The first substrate 101 and / or the second substrate 102 constituting the organic light emitting diode display device 100 may be formed of glass or a flexible plastic. The first substrate 101 and / or the second substrate 102 may be made of polyimide, polyethersulfone, polyetherimide (PEI), and polyethyleneterephthalate (PET) .

Organic materials and metal electrodes constituting the organic light emitting diode (E) constituting the organic light emitting diode display device (100) are particularly vulnerable to moisture or oxygen. Accordingly, between the first substrate 101 and the organic light emitting element 110 and / or between the second substrate 102 and the adhesive layer 210 to encapsulate the organic light emitting diode display device 100 with the outside, For example, a multi-buffer layer of inorganic layer-organic layer-inorganic layer may be interposed as a barrier film. Alternatively, a barrier film composed of such a multi-buffer layer may be used as the second substrate 102 which is an encapsulating substrate.

(Not shown), a driving thin film transistor DTr, and an organic light emitting diode E in each pixel constituting the display region DR of the first substrate 101, which may be a glass or a plastic substrate, The organic light emitting device 110 is formed. Meanwhile, the second substrate 102 is bonded together through the adhesive layer 210 for encapsulation of the organic light emitting diode (E). The adhesive layer 210 includes a binder resin 212 and a hydrolyzable component 214 which is blended with the binder resin 212 or is a getter component bonded to the binder resin 212. Hydrolyzable component 214 is an organic acid anhydride and / or an ester compound.

A switching thin film transistor (not shown) connected to a gate line (not shown) and a data line (not shown) is formed in the display region DR of the first substrate 101 And a driving thin film transistor DTr connected to one electrode of a switching thin film transistor (not shown) and a power supply wiring (not shown) is formed. For example, the driving thin film transistor DTr includes a gate electrode 112, a gate insulating film 114, a semiconductor layer composed of an active layer 116a of pure amorphous silicon and an ohmic contact layer 116b of impurity amorphous silicon 116, and source and drain electrodes 122, 124 that are spaced apart from each other. Though not shown in the drawing, a switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr.

In FIG. 4, the switching thin film transistor (not shown) and the driving thin film transistor DTr have a bottom gate structure including the semiconductor layer 116 made of pure water and impurity amorphous silicon. However, The transistor (not shown) and the driving thin film transistor DTr may include a semiconductor layer (not shown) of polysilicon and may be configured to have a top gate structure.

In this case, the switching thin film transistor and the driving thin film transistor may include a semiconductor layer composed of an active layer of pure polysilicon and source and drain regions of polysilicon doped with impurities on both sides thereof, a gate insulating film, a gate formed over the active layer, An interlayer insulating film having an electrode and a semiconductor contact hole exposing the source and drain regions, and source and drain electrodes formed in contact with the source and drain regions through the semiconductor layer contact hole, respectively, and spaced apart from each other.

A protective layer 130 having a drain contact hole 126 exposing the drain electrode 124 of the driving thin film transistor DTr is formed on a switching thin film transistor (not shown) and a driving thin film transistor DTr . The passivation layer 130 may be formed of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), and may be made of an insulating material such as an organic material such as a photoacid to selectively planarize .

An organic light emitting diode E connected to the drain electrode 124 is formed through a drain contact hole 126 formed in the upper portion of the passivation layer 130. The organic light emitting diode E includes a first electrode 152 formed in contact with the drain electrode 124 of the driving thin film transistor DTr through the drain contact hole 126 formed in the upper portion of the passivation layer 130, Respectively. A bank 153 is formed on the first electrode 152 so as to overlap the rim of the first electrode 152 at the boundary of each pixel region and expose the central portion of the first electrode 152.

An organic light emitting layer 154 is formed on the first electrode 152 in each pixel region surrounded by the bank 153. A second electrode 156 is formed on the organic light emitting layer 154 in front of the display region DR. Respectively. One of the first electrode 152 and the second electrode 156 constituting the organic light emitting diode E is a hole injection electrode and the other is an electron injection electrode.

On the other hand, the organic light emitting layer 154 includes a low molecular organic material or a light emitting layer made of a polymer organic material such as PEDOT. The organic light emitting layer 154 may have a single layer structure of a light emitting layer but may be formed of a hole injection layer (HIL), a hole transporting layer (HTL), an electron transporting layer (ETL) Layer structure including at least one of an electron injection layer (EIL).

A passivation layer 160 is formed on the front surface of the organic light emitting diode 110. Since the passivation layer 160 is formed on the front surface of the organic light emitting diode 110, the organic light emitting diode E, particularly the organic light emitting diode, The moisture permeation into the light emitting layer 154 can be suppressed.

In one exemplary embodiment, the passivation layer 160 may be a single-layer structure comprised of an inorganic insulating material such as silicon oxide / silicon nitride. In another exemplary embodiment, the passivation layer 160 includes a first inorganic layer stacked on top of the second electrode 156 using an inorganic insulating material, such as silicon oxide / silicon nitride, and a second inorganic layer, such as an olefinic resin, An organic layer laminated on the first inorganic layer using a polymer material such as a fluororesin, polyethylene terephthalate (PET), and polysiloxane, and an inorganic insulating material such as silicon oxide / silicon nitride, Layer structure such as a second inorganic layer. Accordingly, the organic light emitting device 110 is formed on the surface of the first substrate 101 facing the second substrate 102.

An organic acid anhydride and / or an ester compound, which is a hydrolyzable component, is mixed with a binder resin between one substrate 101 on which the organic light emitting element 110 is located and the second substrate 102 as an encapsulation substrate, The moisture permeable adhesive layer 210 bonded to the resin is located. The moisture introduced into the organic light emitting diode display device 100 reacts with the hydrolyzable component in the adhesive layer 210 and is converted into other components. The moisture can not penetrate into the organic light emitting diode 110 even if moisture is introduced into the organic light emitting diode display 100. Therefore, deterioration of components constituting the organic light emitting diode 110 can be prevented by moisture penetration . In the case of using the conventional metal oxide as a getter, the present invention is applied only to the organic light emitting diode display device 10 (see FIG. 1) of the bottom emission type. However, since the getter component having excellent light transmittance is used, And the organic light emitting diode display device 100 of the top emission type.

Hereinafter, the present invention will be described in more detail with reference to exemplary embodiments, but the present invention is not limited thereto.

Example  1: Organic acid anhydride By getter  Manufacture of used adhesive layer

5% by weight of 2-octene-1-succinic anhydride, which is a transparent liquid organic acid anhydride, as a hydrolyzable getter was blended in a polyisobutadiene (PIB) resin as a rubber resin to prepare a getter adhesive layer as a single adhesive layer glue).

In addition, a barrier adhesive made of only a polyisobutadiene resin, which is a rubber-based resin, was applied to the getter adhesive layer prepared above to form a double adhesive layer of the getter adhesive-barrier adhesive layer (adhesive for two layers)

Example  2: Organic acid anhydride By getter  Manufacture of used adhesive layer

The procedure of Example 1 was repeated except that 2-octene-1-succinic anhydride was blended in an amount of 10% by weight in total adhesive as compared with Example 1 to obtain an adhesive layer composed of only a single getter adhesive layer and a double layer composed of a getter adhesive layer- An adhesive layer was prepared.

Example  3: ester compound By getter  Manufacture of used adhesive layer

Compared with Example 1, polyisobutadiene resin and epoxy resin were blended as a binder resin, and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, which is a transparent liquid ester compound, was obtained as a hydrolyzable getter The procedure of Example 1 was repeated except that the total adhesive layer was blended at 10% by weight to prepare a single adhesive layer composed of only the getter adhesive layer.

Example  4: ester compound By getter  Manufacture of used adhesive layer

Compared with Example 1, polyisobutadiene resin and epoxy resin were blended as a binder resin, and 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, which is a transparent liquid ester compound, was obtained as a hydrolyzable getter The procedure of Example 1 was repeated except that 30% by weight of the adhesive layer was blended in the entire adhesive layer to prepare a single adhesive layer composed of only the getter adhesive layer.

Comparative Example  One: CaO To By getter  Manufacture of used adhesive layer

The procedure of Example 1 was repeated except that an opaque solid CaO having an average particle size of less than 100 nm as the getter component was blended in an amount of 5% by weight in the total adhesive layer as compared with Example 1, and a single adhesive layer composed of only the getter adhesive layer, A double adhesive layer composed of a barrier adhesive layer was prepared.

Comparative Example  2: CaO To By getter  Manufacture of used adhesive layer

The procedure of Example 1 was repeated, except that an opaque solid CaO having an average particle size of less than 100 nm as the getter component was blended in an amount of 10% by weight in the total adhesive layer as compared with Example 1, and an adhesive layer composed of only the getter adhesive layer and a getter adhesive layer- A double adhesive layer composed of an adhesive layer was prepared.

Comparative Example  3: In the binder Graft  The Maleic acid  Production of adhesive layer using anhydride

A single adhesive layer was prepared using a binder resin in which maleic anhydride was grafted to polypropylene, which is a rubber-based resin.

Experimental Example  1: Comparison of properties of adhesive layer

Ca test was carried out on the adhesive layer prepared in each of Examples 1-4 and Comparative Example 1-2 as the dispersibility, the transmittance (50 nm thickness) and the water absorption retarding effect. The dispersibility and the transmittance were measured for a getter adhesive layer of one layer.

In order to carry out the Ca test, Ca was deposited at about 100-200 mm in the center of the square glass substrate, and Ca deposited on the side of the glass substrate was spaced about 7 mm. Subsequently, the adhesive layer prepared in each of Examples and Comparative Examples was coated on a glass substrate on which Ca was deposited, and the glass substrate was covered thereon. The time from the penetration of water into Ca through the side surface of the adhesive layer at high temperature / high humidity (60 DEG C / relative humidity 90%) until Ca became transparent was measured. The measurement results according to this experimental example are shown in Table 1 below. According to the examples, the adhesive layer using the hydrolyzable component as a getter was excellent in dispersibility and excellent in transmittance. In addition, it was confirmed that the moisture permeation was delayed for a considerable time in the adhesive layer using the hydrolyzable component as a getter.

Comparison of properties of adhesive layer Dispersibility Transmittance (%) Ca test (time) Getter (1st floor) Getter - Barrier (2nd floor) Example 1 No aggregation 99 100 134 Example 2 No aggregation 98 150 192 Example 3 No aggregation 99 300 - Example 4 No aggregation 98 500 - Comparative Example 1 Lump 96 Initial reaction Initial reaction Comparative Example 2 Lump 92 Initial reaction Initial reaction

Experimental Example  2: Absorption  Character rating

According to Example 1, the adhesive layer containing 2-octen-1-yl-succinic anhydride as a transparent getter in a PIB binder resin and the moisture absorbing layer comprising an adhesive layer containing a resin in which maleic anhydride was grafted onto polypropylene according to Comparative Example 3 The properties were evaluated. Each sample was divided by a small amount in an Al dish and allowed to stand at 20 ° C and a relative humidity of 100%, and the weight of the sample was measured by a dessicator. The results of the measurement according to the present experimental example are shown in Fig. In Comparative Example 3, the adhesive layer in which the organic acid anhydride was grafted onto the binder resin significantly deteriorated the moisture absorption effect, whereas the adhesive layer in which the organic acid anhydride was blended in the binder resin exhibited good moisture absorption properties. Even when moisture absorption proceeded, the transparency of the adhesive layer was not changed.

Experimental Example  3: After the moisture absorption of the adhesive layer Tensile strength and Elongation  Measure

The tensile strength and the elongation of the adhesive layer before and after the water absorption were measured on the adhesive layer containing 30 wt% of the ester compound having epoxy groups on both sides as the getter component, according to Example 4. A sample of an adhesive layer before and after moisture absorption was placed on a release film and a Dog bone sample (25 mm X 4.5 mm X 0.9 mm) was prepared. The tensile strength of the sample was measured at 200 mm / min, and the tensile strength and elongation were measured using a universal test machine (UTM). The measurement results are shown in Table 2 and FIG. The tensile strength and the elongation ratio of the adhesive layer before and after the moisture absorption were not greatly different from each other, and it was confirmed that even if moisture was absorbed by using the hydrolyzable component as a getter component, there was no problem with the strength and elongation of the adhesive layer.

The tensile strength and elongation of the adhesive layer before moisture absorption and the adhesive layer after moisture absorption Sample Tensile strength (Kgf / cm2) Elongation (%)
After moisture absorption Sample 1 > 19.86 > 778 Sample 2 > 18.72 > 746 Sample 3 > 18.72 > 750 Average > 19.10 > 758 Before moisture absorption Sample 1 > 18.72 > 742 Sample 2 > 18.35 > 777 Average > 18.54 > 859

Although the present invention has been described based on the exemplary embodiments and examples of the present invention, the present invention is not limited to the technical ideas described in the foregoing embodiments and examples. Those skilled in the art will appreciate that various modifications and changes may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims. It will be apparent, however, that such modifications and changes are all within the scope of the present invention.

100, 100A, 100B: organic light emitting diode display device
101: first substrate 102: second substrate
110: organic light emitting device 210: (first) adhesive layer
212: (first) binder resin 214: hydrolyzable component
220: second adhesive layer 222: second binder resin
DR: Display area NDR: Non-display area
DTr: driving thin film transistor E: organic light emitting diode

Claims (12)

Binder resin; And
A hydrolyzable component selected from at least one organic acid anhydride and an ester compound,
≪ / RTI >
Wherein the hydrolyzable component selected from at least one of organic acid anhydride and ester compound is bonded to the binder resin.
3. The method according to claim 1 or 2,
Wherein the binder resin is a rubber-based resin.
3. The method according to claim 1 or 2,
Wherein the ester compound is an ester compound having an epoxy group.
3. The method of claim 2,
Wherein the organic acid anhydride has an unsaturated double bond, and the binder resin has a reactive moiety of a curable unsaturated double bond.
A first substrate;
A second substrate facing the first substrate;
An organic light emitting diode (OLED) disposed on the first substrate; And
And a first adhesive layer covering the organic light emitting element,
Wherein the first adhesive layer comprises a first binder resin and a hydrolyzable component blended with the first binder resin and selected from at least one of an organic acid anhydride and an ester compound
Organic light emitting diode display.
A first substrate;
A second substrate facing the first substrate;
An organic light emitting diode (OLED) disposed on the first substrate; And
And a first adhesive layer covering the organic light emitting element,
Wherein the first adhesive layer has a hydrolyzable component selected from at least one of an organic acid anhydride and an ester compound bonded to the first binder resin
Organic light emitting diode display.
8. The method according to claim 6 or 7,
Wherein the binder resin is a rubber-based resin.
8. The method according to claim 6 or 7,
Wherein the ester compound is an ester compound having an epoxy group.
8. The method of claim 7,
Wherein the organic acid anhydride has an unsaturated double bond, and the binder resin has a reactive moiety of a curable unsaturated double bond.
8. The method according to claim 6 or 7,
Wherein a second adhesive layer including a second binder resin is positioned between the first adhesive layer and the second substrate or between the organic light emitting element and the first adhesive layer.
12. The method of claim 11,
And the second binder resin is a rubber-based resin.

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