KR20160061473A - Organic Light Emitting Display Device - Google Patents

Abstract

The present invention relates to an organic light emitting display device including a substrate, a protective film, a barrier film, an adhesive member, and a crack preventing line. The protective film protects devices located on the substrate. The barrier film is located on the substrate and bonded to the substrate by the adhesive member. The crack preventing line is located at an outer edge part of the substrate. The durability, reliability, and productivity of the device can be improved, and a process margin can be obtained while a post-process is performed.

Description

[0001] The present invention relates to an organic light emitting display device,

The present invention relates to an organic light emitting display.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes. An organic electroluminescent device is a device in which electrons and holes are injected into the light emitting layer from an electron injection cathode and an anode, respectively, and excitons, in which injected electrons and holes are combined, And emits light when it is dropped to the ground state.

An organic electroluminescent display device uses a organic electroluminescent device to form a display panel. The display panel may be implemented by top emission, bottom emission or dual emission depending on the direction in which the light is emitted, and may be implemented by a passive matrix type Passive Matrix) and active matrix (Active Matrix).

Organic electroluminescent display devices have been implemented in various forms, such as providing curved surfaces, artificially or mechanically bending them. A method of fabricating such an organic light emitting display device includes a step of forming a plurality of display panels on a mother substrate of a flexible (e.g., plastic) cell, and dividing the display panel by cells along the scribing line do.

However, when the cutting process is performed on the conventional structure, the outside air such as moisture penetrates into the display area due to the crack (or damage) of the edge portion of the display panel, and as a result, the lifetime, reliability and fairness of the device are deteriorated And improvement thereof is required.

SUMMARY OF THE INVENTION The present invention for solving the problems of the background art described above is to provide an organic electroluminescent display device capable of improving lifetime, reliability and processability of a device and securing a process margin in a post process.

According to an aspect of the present invention, there is provided an organic light emitting display including a substrate, a protective film, a barrier film, an adhesive member, and a crack prevention line. The passivation layer protects the devices located on the substrate. The barrier film is placed on the substrate and is adhered to the substrate by an adhesive member. The crack prevention line is located at the edge of the outer edge of the substrate.

The anti-crack line may be located on the surface of at least one protective film or may be located below the at least one protective film.

The anti-crack line may be selected from one or more of the materials used in the thin film manufacturing process.

The crack preventing line may include a first crack preventing line located corresponding to an end of the bonding member.

The crack preventing line may include a second crack preventing line located further outward than the end of the bonding member.

The crack preventing line may include a third crack preventing line located further inside than the end of the bonding member.

The crack preventing line is located at a position corresponding to an end of the adhesive member and is located below the at least one protective film. The first crack preventing line is located outside the end of the adhesive member. A crack prevention line, and a third crack prevention line located on the inner side of the end of the adhesive member and on the surface of the at least one protective film.

The present invention has the effect of preventing and improving the problem that outer cracks of the display panel are propagated to the inside of the display area, thereby improving lifetime, reliability and fairness of the device. In addition, the present invention provides a line that can prevent cracking by using a material used in a manufacturing process of a display panel, so that a process margin can be secured in a post-process.

1 is a schematic block diagram of an organic light emitting display device.
Fig. 2 is an exemplary circuit configuration of a subpixel. Fig.
3 is a plan view showing a problem occurring in a process of cutting a display panel formed on a mother substrate on a cell-by-cell basis.
Fig. 4 is a photograph showing the crack occurrence portion of Fig. 3; Fig.
5 is a cross-sectional view showing an outer edge portion of a cell normally cut in the cutting process of FIG. 3;
6 is a cross-sectional view showing an outer edge portion of a cell that is abnormally cut in the cutting process of FIG. 3;
7 is a plan view of a cell of a display panel according to a first embodiment of the present invention.
8 is a cross-sectional exemplary view showing the outer edge portion of the display panel shown in Fig.
9 is a plan view illustrating a cell of a display panel according to a second embodiment of the present invention.
10 is an exemplary cross-sectional view showing an outer edge portion of the display panel shown in Fig.
11 is a plan view of a cell of a display panel according to a third embodiment of the present invention.
Fig. 12 is a cross-sectional exemplary view showing an outer edge portion of the display panel shown in Fig. 10; Fig.
13 is a cross-sectional exemplary view showing an outer edge portion of a display panel according to a first modification of the embodiments of the present invention.
14 is an exemplary view showing a cross-section of an edge portion of a display panel according to a second modification of the embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Embodiment 1 >

FIG. 1 is a schematic block diagram of an organic light emitting display device, and FIG. 2 is an exemplary circuit configuration of a subpixel.

1, the organic light emitting display includes an image processor 110, a timing controller 120, a data driver 130, a gate driver 140, and a display panel 150, .

The image processing unit 110 outputs a data enable signal DE together with a data signal DATA supplied from the outside. The image processing unit 110 may output at least one of a vertical synchronizing signal, a horizontal synchronizing signal, and a clock signal in addition to the data enable signal DE, but these signals are omitted for convenience of explanation.

The timing controller 120 receives a data signal DATA from a video processor 110 in addition to a data enable signal DE or a driving signal including a vertical synchronizing signal, a horizontal synchronizing signal, and a clock signal. The timing controller 120 includes a gate timing control signal GDC for controlling the operation timing of the gate driver 140 and a data timing control signal DDC for controlling the operation timing of the data driver 130, .

The data driver 130 samples and latches the data signal DATA supplied from the timing controller 120 in response to the data timing control signal DDC supplied from the timing controller 120 and converts the sampled data signal into a gamma reference voltage . The data driver 130 outputs the data signal DATA through the data lines DL1 to DLn. The data driver 130 is formed in the form of an IC (Integrated Circuit).

The gate driver 140 outputs the gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120. The gate driver 140 outputs a gate signal through the gate lines GL1 to GLm. The gate driver 140 may be formed in the form of an IC (Integrated Circuit) or a gate in panel structure in the display panel 150.

The display panel 150 displays an image corresponding to the data signal DATA and the gate signal supplied from the data driver 130 and the gate driver 140. The display panel 150 includes sub-pixels SP for displaying an image.

The subpixels are formed in a top emission mode, a bottom emission mode, or a dual emission mode depending on the structure. The subpixels SP include a red subpixel, a green subpixel, and a blue subpixel or a white subpixel, a red subpixel, a green subpixel, and a blue subpixel. The subpixels SP may have one or more different emission areas depending on the emission characteristics.

As shown in FIG. 2, one sub-pixel includes a switching transistor SW, a driving transistor DR, a capacitor Cst, a compensation circuit CC, and an organic light emitting diode OLED. The organic light emitting diode OLED operates to emit light in accordance with the driving current generated by the driving transistor DR.

The switching transistor SW operates in response to a gate signal supplied through the first gate line GL1 so that a data signal supplied through the first data line DL1 is stored as a data voltage in the capacitor Cst. The driving transistor DR operates so that a driving current flows between the first power supply line VDD and the second power supply line VSS in accordance with the data voltage stored in the capacitor Cst. The compensation circuit CC is a circuit for compensating the threshold voltage and the like of the driving transistor DR.

The compensation circuit CC consists of one or more thin film transistors and a capacitor. The configuration of the compensation circuit (CC) is very various according to the compensation method, and a detailed illustration and description thereof are omitted. The thin film transistor is implemented based on low temperature polysilicon (LTPS), amorphous silicon (a-Si), oxide or organic semiconductor layers.

In FIG. 2, one compensator CC is included in one subpixel. However, the compensation circuit CC may be omitted when the subject of compensation is located outside the sub-pixel such as the data driver 130 or the like. That is, one subpixel is basically composed of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor SW, a driving transistor DR, a capacitor Cst and an organic light emitting diode (OLED) (CC) is added, it may be composed of 3T1C, 4T2C, 5T2C, and the like.

The organic light emitting display device described above may be implemented as a top emission type, a bottom emission type, or a dual emission type. In addition, the organic light emitting display device described above may be implemented in various forms, such as providing curved surfaces, artificially or mechanically bending.

FIG. 3 is a plan view showing a problem occurring in a process of cutting a display panel formed on a mother substrate on a mother substrate, FIG. 4 is a photograph showing a crack generating portion in FIG. 3, Fig. 6 is a cross-sectional view showing the outer edge portion of the cell abnormally cut in the cutting process of Fig. 3; Fig.

3 and 4, in order to manufacture an organic light emitting display device having flexibility, a plurality of display panels 150 are formed on a mother substrate MG for each cell, and scribing lines SLx, SLy The display panel 150 is divided into cells and cut out.

However, when the cutting process is performed on the conventional structure, it is found that a crack (or damage) occurs in the edge portion 150_e of the outer side of the display panel as seen from the enlarged portion of FIG. 3 and the picture of FIG. .

Specifically, when the outer edge portion 150_e of the normally cut cell of FIG. 5 is compared with the outer edge portion 150_e of the abnormally cut cell of FIG. 6, the cells that are abnormally cut in the cutting process are cracked, The protective films 159 and 161 are torn.

The peeled protective films 159 and 161 are deteriorated in adhesion to the lower structures 153b and 152 formed on the substrate 150a due to cracks. The cracks generated before are propagated to the display area by the physical inclusion or the like applied in a post-process to form a passage. The outside air such as moisture permeates through the passages to the display area, and as a result, the lifetime, reliability and fairness of the device are deteriorated, and improvement thereof is required.

FIG. 7 is a plan view illustrating a cell of a display panel according to a first embodiment of the present invention, and FIG. 8 is a cross-sectional view illustrating an edge portion of the display panel shown in FIG.

7, the first crack prevention line 170 is formed at the outer edge 150_e located outside the display area (or the active area) AA of the cell of the display panel 150. As shown in FIG. The first crack prevention line 170 serves as a crack propagation preventing film for preventing a crack generated in the outer edge part 150_e from propagating to the inside of the display area AA.

A first anti-crack line 170 serving as a crack propagation preventing film is formed inside the protective film formed on the substrate. The first anti-crack line 170 may be selected from one or more of the materials used in the thin film manufacturing process of the display panel 150.

For example, the first anti-cracking line 170 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, photoacrylate, etc. forming a planarizing film or a bank layer ≪ / RTI > Organic materials have a soft nature in comparison with inorganic materials, which can alleviate the effects of physical impact. The first crack prevention line 170 may be formed in a rectangular shape along the outer edge portion 150_e.

At this time, the first crack prevention line 170 may have a rectangular shape in the form of a closed curve or a rectangular shape in which a specific region is opened as shown in the figure. The first anti-cracking line 170 may have a shape of a circle corresponding to the shape of a corner where a physical impact is concentrated during the cutting process.

As shown in FIGS. 7 and 8, lower structures 151a and 151b are formed on the substrate 150a. The substrate 150a may be formed of a material such as polyimide (PI), polyethersulfone (PES), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN) And acrylonitrile butadiene styrene (ABS).

The first substructure 151a may be defined as a gate electrode constituting a gate-in panel type gate driving unit and the second substructure 151b may be defined as a gate line connected with a gate electrode.

A first insulating layer 152 is formed on the lower structures 151a and 151b. The first insulating layer 152 may be a single layer or multiple layers of a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx). The first insulating film 152 is formed to cover all the regions of the substrate 150a together with the lower structures 151a and 151b.

On the first insulating film 152, upper structures 153a and 153b are formed. The first upper structure 153a may be defined as a source and a drain electrode constituting the electrodes of the thin film transistor and the second upper structure 153b may be defined as a data line connected to the source and drain electrodes.

A second insulating layer 155 is formed on the first insulating layer 152. The second insulating film 155 may be defined as a planarization film for planarizing the surface. The second insulating layer 155 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate. The second insulating film 155 covers the entire first upper structure 153a and covers a part of the second upper structure 153b.

A lower electrode layer 156 is formed on the second insulating layer 155. The lower electrode layer 156 may be formed of the same material and the same process as the first electrode layer of the organic light emitting diode. In the lower electrode layer 156, there is a region to be a first electrode layer (for example, an anode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

On the lower electrode layer 156, a bank layer 157 is formed. The bank layer 157 is a layer defining a light emitting region (or an opening region) of the organic light emitting diode formed in the display region. The bank layer 157 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate.

An upper electrode layer 158 is formed on the bank layer 157. The upper electrode layer 158 may be formed of the same material and the same process as the second electrode layer of the organic light emitting diode. The upper electrode layer 158 may have a region connected to the second upper structure 153b through the lower electrode layer 156. [ In the upper electrode layer 158, there is a region to be a second electrode layer (for example, a cathode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

A first crack prevention line 170 is formed on the first insulating layer 152 and the second upper structure 153b. The first anti-cracking line 170 is formed by the second insulating film 155 or the bank layer 157. The first anti-cracking line 170 is formed of an organic material such as the second insulating film 155 or the bank layer 157, and thus is formed thicker than the other insulating film. The first anti-crack line 170 may be positioned corresponding to the end of the translucent bonding member 165.

The line width of the first crack prevention line 170 may be selected to be 10 to 100 mu m. When the line width of the first crack prevention line 170 is 10 m or more, it is possible to maintain a minimum adhesive force with the film formed on the lower and upper portions of the first crack prevention line 170, and to perform a role as a crack propagation preventing film to some extent. However, when the line width of the first crack prevention line 170 is less than 10 mu m, the adhesive force is lowered and it becomes difficult to perform a role as a crack propagation preventing film.

When the line width of the first crack prevention line 170 is 100 탆 or less, it is possible to maintain a good adhesive force with a film formed on the lower and upper portions of the first crack prevention line 170 and to effectively perform a role as a crack propagation preventing film. In addition, it is possible to increase the blocking power of the path through which the outside air is propagated to the inside. However, if the line width of the first anti-crack line 170 is 100 mu m or more, the anti-crack propagation film may have a better role. However, the bezel area may increase, and the adhesive strength of the edge portions of the film formed at the lower and upper portions may be lowered.

The thickness of the first crack prevention line 170 may be selected to be 0.1 to 10 mu m. If the thickness of the first anti-crack line 170 is 0.1 mu m or more, it may have a minimum ability to protect the film formed on the upper and lower portions from physical impact. However, when the thickness of the first crack prevention line 170 is 0.1 mu m or less, it becomes difficult to have the ability to protect the film formed on the upper and lower portions from physical impact.

When the thickness of the first anti-cracking line 170 is 10 μm or less, it is possible to maintain excellent ability to protect the film formed on the upper and lower portions from physical impact. However, if the thickness of the first anti-cracking line 170 is 10 μm or more, the ability to protect the film formed on the upper and lower portions from the physical impact may be improved, but the process tack time can be increased.

A first protective film 159 is formed on the upper electrode layer 158. The first protective film 159 protects elements (e.g., thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The first protective film 159 is formed to cover all the regions of the substrate 150a together with the bank layer 157, the upper electrode layer 158 and the first anti-cracking line 170. [

The particle protective layer 160 is formed on the first protective layer 159. The particle protection layer 160 is formed to cover the display area. The particle protection layer 160 has a laminated structure of an inorganic film layer, an organic film layer, and an inorganic film layer. The particle protection layer 160 protects the organic light emitting diodes formed on the thin film transistors and the thin film transistors formed on the substrate 150a and prevents the elements from being damaged (shot, etc.) by particles such as particles .

A second protective film 161 is formed on the particle protective layer 160. The second protective film 161 protects elements (for example, thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The second protective film 159 is formed to cover the entire area of the substrate 150a together with the first protective film 159 and the particle protection layer 160. [

On the second protective film 161, a light-transmitting adhesive member 165 is formed. The light transmitting adhesive member 165 may be selected from PSA (Pressure Sensitive Adhesive Film) or OCA (Optical Clear Adhesive Film). The translucent adhesive member 165 serves to adhere the structure (for example, the second protective film) formed on the substrate 150a and the barrier film 150b.

As can be seen from the above description, the first crack prevention line 170 cushions the impact applied to the outer edge 150_e of the substrate 150a during the cutting process to cause cracks in the protective films 159 and 161 The problem is improved, and as a result, the lifetime, reliability and fairness of the device can be improved.

≪ Embodiment 2 >

FIG. 9 is a plan view illustrating a cell of a display panel according to a second embodiment of the present invention, and FIG. 10 is a cross-sectional view illustrating an edge portion of the display panel shown in FIG.

9, the second crack prevention line 175 is formed in the outer edge portion 150_e located outside the display region (or the active region) AA of the cell of the display panel 150. As shown in FIG. The second crack prevention line 175 serves as a crack propagation preventing film for preventing a crack generated in the outer edge part 150_e from propagating to the inside of the display area AA.

A second anti-crack line 175 serving as a crack propagation preventing film is formed on the outside (surface) of the protective film formed on the substrate. The second anti-crack line 175 may be selected from one or more of the materials used in the thin film manufacturing process of the display panel 150.

For example, the second anti-cracking line 175 may be formed of an organic material such as a polyimide, a benzocyclobutene series resin, an acrylate, a photoacrylate, etc. constituting a planarizing film or a bank layer ≪ / RTI > Organic materials have a soft nature in comparison with inorganic materials, which can alleviate the effects of physical impact. The second crack prevention line 175 may be formed in a rectangular shape along the outer edge portion 150_e.

At this time, the second crack prevention line 175 may have a rectangular shape in the form of a closed curve or a rectangular shape in which a specific region is opened as shown in the figure. In addition, the second anti-crack line 175 may have a root shape corresponding to a shape of a corner where a physical impact is concentrated during the cutting process.

As shown in FIGS. 9 and 10, lower structures 151a and 151b are formed on a substrate 150a. The substrate 150a may be formed of a material such as polyimide (PI), polyethersulfone (PES), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN) And acrylonitrile butadiene styrene (ABS).

The first substructure 151a may be defined as a gate electrode constituting a gate-in panel type gate driving unit and the second substructure 151b may be defined as a gate line connected with a gate electrode.

A first insulating layer 152 is formed on the lower structures 151a and 151b. The first insulating layer 152 may be a single layer or multiple layers of a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx). The first insulating film 152 is formed to cover all the regions of the substrate 150a together with the lower structures 151a and 151b.

On the first insulating film 152, upper structures 153a and 153b are formed. The first upper structure 153a may be defined as a source and a drain electrode constituting the electrodes of the thin film transistor and the second upper structure 153b may be defined as a data line connected to the source and drain electrodes.

An interlayer insulating film 154 is formed on the first insulating film 152. The interlayer insulating film 154 may be formed of a single layer or multiple layers of a silicon oxide film (SiOx) or a silicon nitride film (SiNx). The interlayer insulating film 154 is formed so as to cover the upper structures 153a and 153b. The interlayer insulating film 154 is used to improve adhesion, moisture permeability, and reliability, but it may be omitted (or omitted).

A second insulating film 155 is formed on the interlayer insulating film 154. The second insulating film 155 may be defined as a planarization film for planarizing the surface. The second insulating layer 155 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate. The second insulating film 155 covers the entire first upper structure 153a and covers a part of the second upper structure 153b.

A lower electrode layer 156 is formed on the second insulating layer 155. The lower electrode layer 156 may be formed of the same material and the same process as the first electrode layer of the organic light emitting diode. In the lower electrode layer 156, there is a region to be a first electrode layer (for example, an anode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

On the lower electrode layer 156, a bank layer 157 is formed. The bank layer 157 is a layer defining a light emitting region (or an opening region) of the organic light emitting diode formed in the display region. The bank layer 157 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate.

An upper electrode layer 158 is formed on the bank layer 157. The upper electrode layer 158 may be formed of the same material and the same process as the second electrode layer of the organic light emitting diode. The upper electrode layer 158 may have a region connected to the second upper structure 153b through the lower electrode layer 156. [ In the upper electrode layer 158, there is a region to be a second electrode layer (for example, a cathode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

A first protective film 159 is formed on the upper electrode layer 158. The first protective film 159 protects elements (e.g., thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The first protective film 159 is formed to cover all the regions of the substrate 150a together with the bank layer 157, the upper electrode layer 158 and the first anti-cracking line 170. [

The particle protective layer 160 is formed on the first protective layer 159. The particle protection layer 160 is formed to cover the display area. The particle protection layer 160 has a laminated structure of an inorganic film layer, an organic film layer, and an inorganic film layer. The particle protection layer 160 protects the organic light emitting diodes formed on the thin film transistors and the thin film transistors formed on the substrate 150a and prevents the elements from being damaged (shot, etc.) by particles such as particles .

A second protective film 161 is formed on the particle protective layer 160. The second protective film 161 protects elements (for example, thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The second protective film 159 is formed to cover the first protective film 159 and the particle protection layer 160.

On the second protective film 161, a second crack prevention line 175 is formed. The second anti-cracking line 175 may be formed of an organic film, an inorganic film, or an inorganic or organic composite film, but is not limited thereto. The line width of the second anti-crack line 175 may be selected to be 10 to 100 mu m, and the thickness of the second anti-crack line 175 may be selected to be 0.1 to 10 mu m. The description related to the line width and thickness of the second crack prevention line 175 is similar to or the same as the first embodiment, and therefore, it is referred to. The second anti-crack line 175 is located outside the end of the translucent bonding member 165.

On the second protective film 161, a light-transmitting adhesive member 165 is formed. The light transmitting adhesive member 165 may be selected from PSA (Pressure Sensitive Adhesive Film) or OCA (Optical Clear Adhesive Film). The translucent adhesive member 165 serves to adhere the structure (for example, the second protective film) formed on the substrate 150a and the barrier film 150b.

As can be seen from the above description, the second crack prevention line 175 cushions the impact applied to the outer edge 150_e of the substrate 150a during the cutting process to cause cracks in the protective films 159 and 161 The problem is improved, and as a result, the lifetime, reliability and fairness of the device can be improved.

≪ Third Embodiment >

FIG. 11 is a plan view illustrating a cell of a display panel according to a third embodiment of the present invention, and FIG. 12 is a cross-sectional view illustrating an edge portion of the display panel shown in FIG.

11, the first and third anti-crack lines 170 and 178 are formed in the outer edge portion 150_e located outside the display region (or the active region) AA of the cell of the display panel 150, Is formed. The first and third crack prevention lines 170 and 178 serve as a crack propagation preventing film for preventing a crack generated in the outer edge part 150_e from propagating to the inside of the display area AA.

A first anti-crack line 170 serving as a crack propagation preventing film is formed inside the protective film formed on the substrate, and a third anti-cracking line 178 is formed on the outer surface (surface) of the protective film. The first and third crack prevention lines 170 and 178 may be formed in a rectangular shape along the outer edge portion 150_e. The first and third anti-crack lines 170 and 178 may be selected from one or more of the materials used in the thin film manufacturing process of the display panel 150.

For example, the first and third anti-crack lines 170 and 178 may be formed of a polyimide, a benzocyclobutene series resin, an acrylate, a photoacid And a photocatalyst). Organic materials have a soft nature in comparison with inorganic materials, which can alleviate the effects of physical impact.

The first and third crack prevention lines 170 and 178 may have a quadrangular shape in the form of a closed curve as shown or a rectangular shape in which a specific region is open. In addition, the first and third anti-crack lines 170 and 178 may have a root shape corresponding to the shape of a corner where a physical impact is concentrated during the cutting process. In addition, the first and third anti-crack lines 170 and 178 may have different shapes (e.g., the first anti-crack line may be a translator shape located at a corner and the third anti-crack line may be rectangular).

As shown in FIGS. 11 and 12, lower structures 151a and 151b are formed on the substrate 150a. The substrate 150a may be formed of a material such as polyimide (PI), polyethersulfone (PES), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN) And acrylonitrile butadiene styrene (ABS).

The first substructure 151a may be defined as a gate electrode constituting a gate-in panel type gate driving unit and the second substructure 151b may be defined as a gate line connected with a gate electrode.

A first insulating layer 152 is formed on the lower structures 151a and 151b. The first insulating layer 152 may be a single layer or multiple layers of a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx). The first insulating film 152 is formed to cover all the regions of the substrate 150a together with the lower structures 151a and 151b.

On the first insulating film 152, upper structures 153a and 153b are formed. The first upper structure 153a may be defined as a source and a drain electrode constituting the electrodes of the thin film transistor and the second upper structure 153b may be defined as a data line connected to the source and drain electrodes.

An interlayer insulating film 154 is formed on the first insulating film 152. The interlayer insulating film 154 may be formed of a single layer or multiple layers of a silicon oxide film (SiOx) or a silicon nitride film (SiNx). The interlayer insulating film 154 is formed so as to cover the upper structures 153a and 153b. The interlayer insulating film 154 is used to improve adhesion, moisture permeability, and reliability, but it may be omitted (or omitted).

A second insulating film 155 is formed on the interlayer insulating film 154. The second insulating film 155 may be defined as a planarization film for planarizing the surface. The second insulating layer 155 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate. The second insulating film 155 covers the entire first upper structure 153a and covers a part of the second upper structure 153b.

A lower electrode layer 156 is formed on the second insulating layer 155. The lower electrode layer 156 may be formed of the same material and the same process as the first electrode layer of the organic light emitting diode. In the lower electrode layer 156, there is a region to be a first electrode layer (for example, an anode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

On the lower electrode layer 156, a bank layer 157 is formed. The bank layer 157 is a layer defining a light emitting region (or an opening region) of the organic light emitting diode formed in the display region. The bank layer 157 may be formed of an organic material such as polyimide, benzocyclobutene series resin, acrylate, and photoacrylate.

An upper electrode layer 158 is formed on the bank layer 157. The upper electrode layer 158 may be formed of the same material and the same process as the second electrode layer of the organic light emitting diode. The upper electrode layer 158 may have a region connected to the second upper structure 153b through the lower electrode layer 156. [ In the upper electrode layer 158, there is a region to be a second electrode layer (for example, a cathode electrode layer) of the organic light emitting diode, which is not shown but is located inside the display region.

A first crack prevention line 170 is formed on the first insulating layer 152 and the second upper structure 153b. The first anti-cracking line 170 is formed by the second insulating film 155 or the bank layer 157. The first anti-cracking line 170 is formed of an organic material such as the second insulating film 155 or the bank layer 157, and thus is formed thicker than the other insulating film. The line width of the first anti-crack line 170 may be selected to be 10 to 100 mu m, and the thickness of the first anti-crack line 170 may be selected to be 0.1 to 10 mu m. The description related to the line width and thickness of the first crack prevention line 170 is similar to or the same as the first embodiment, and therefore, it is referred to.

A first protective film 159 is formed on the upper electrode layer 158. The first protective film 159 protects elements (e.g., thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The first protective film 159 is formed to cover all the regions of the substrate 150a together with the bank layer 157, the upper electrode layer 158 and the first anti-cracking line 170. [

The particle protective layer 160 is formed on the first protective layer 159. The particle protection layer 160 is formed to cover the display area. The particle protection layer 160 has a laminated structure of an inorganic film layer, an organic film layer, and an inorganic film layer. The particle protection layer 160 protects the organic light emitting diodes formed on the thin film transistors and the thin film transistors formed on the substrate 150a and prevents the elements from being damaged (shot, etc.) by particles such as particles .

A second protective film 161 is formed on the particle protective layer 160. The second protective film 161 protects elements (for example, thin film transistors, capacitors, organic light emitting diodes) formed on the substrate 150a from outside air (oxygen, moisture, etc.). The second protective film 159 is formed to cover the first protective film 159 and the particle protection layer 160.

On the second protective film 161, a third anti-crack line 178 is formed. The third anti-crack line 178 is formed in the area adjacent to the first anti-crack line 170 and is formed inside the first anti-crack line 170. The third anti-crack line 178 may be formed by an insulating film or a bank layer, but is not limited thereto. Since the third anti-crack line 178 is made of an organic material, it is formed thicker than the other insulating film. The line width of the third anti-crack line 178 may be selected to be 10 to 100 mu m, and the thickness of the third anti-crack line 178 may be selected to be 0.1 to 10 mu m. The description related to the line width and thickness of the third anti-crack line 178 is similar to or the same as the first embodiment, and therefore, it is referred to.

On the other hand, the first crack prevention line 170 and the third crack prevention line 178 may have a relationship of a main crack prevention line and a sub crack prevention line. Therefore, for a line selected as the main crack prevention line, it may have a larger line width and a thicker thickness than the line selected as the sub-crack prevention line. In other words, the linewidth and thickness of the first anti-crack line 170 and the third anti-crack line 178 may differ depending on purposes and effects. Since the third crack prevention line 178 is located inside the light transmitting adhesive member 165 and is located on the second protective film 161, the third crack preventing line 178 prevents the second protective film 161 from being lifted by the crack, Can be prevented.

On the second protective film 161, a light-transmitting adhesive member 165 is formed. The light transmitting adhesive member 165 may be selected from PSA (Pressure Sensitive Adhesive Film) or OCA (Optical Clear Adhesive Film). The translucent adhesive member 165 serves to adhere the structure (for example, the second protective film, the third crack prevention line) formed on the substrate 150a and the barrier film 150b. The light-transmitting adhesive member 165 is formed so as to cover the third crack prevention line 178. [

In the above description, the first and third crack prevention lines 170 and 178 are formed on the outer edge portion 150_e located outside the display region (or the active region) AA of the cell of the display panel 150 And thus formed is explained as an example. However, this is only one example, and only the third anti-crack line 178 may be formed.

In addition, the anti-crack line can be formed at various positions as follows, and one or more anti-crack lines can be further positioned.

<Modifications>

The present invention can be modified into the following form by combining the first to third embodiments described above.

FIG. 13 is a cross-sectional view illustrating an outer edge portion of a display panel according to a first modified example of the embodiments of the present invention, FIG. 14 is a cross-sectional view illustrating an outer edge portion of the display panel according to the second modified example of the embodiments of the present invention Fig.

13, the first and second crack prevention lines 170 and 175 are formed in the outer edge portion 150_e located outside the display region (or the active region) AA of the cell of the display panel . The second crack prevention line 175 is formed on the outside of the light-transmitting adhesive member 165. The second anti-crack line 175 is formed outside the first anti-crack line 170.

At this time, the first and second crack prevention lines 170 and 175 may have a rectangular shape in the form of a closed curve or a rectangular shape in which a specific region is opened. In addition, the first and second crack prevention lines 170 and 175 may have a base shape corresponding to a shape of a corner where a physical impact is concentrated during the cutting process. In addition, the first and second anti-crack lines 170 and 175 may have different shapes (e.g., the first anti-crack line may be a navigator shape and the second anti-crack line may be rectangular).

The first crack preventing line 170 and the second crack preventing line 175 may have a relationship of a main crack preventing line and a sub crack preventing line. Therefore, for a line selected as the main crack prevention line, it may have a larger line width and a thicker thickness than the line selected as the sub-crack prevention line. In other words, the linewidth and thickness of the first anti-crack line 170 and the second anti-crack line 175 may differ depending on purposes and effects.

As shown in FIG. 14, the first to third crack prevention lines 170, 175, and 178 are formed in the outline edge portion 150_e located outside the display region (or active region) AA of the cell of the display panel. May be formed.

The second crack prevention line 175 is formed on the outer side of the first crack preventing line 170 and the third crack preventing line 178 is formed on the inner side of the first crack preventing line 170. The second crack prevention line 175 is formed on the outside of the light transmitting adhesive member 165 and the third crack preventing line 178 is formed on the inside of the light transmitting adhesive member 165.

The first crack prevention line 170 prevents cracks generated in the outer edge portion 150_e between the second crack prevention line 175 and the third crack prevention line 178 from propagating to the inside of the display region AA . Since the second crack prevention line 175 is located at the outermost one of the crack preventing lines, it is possible to mitigate the concentration phenomenon in which the physical impact applied during the cutting process is applied to the second protective film 161 or the like. Since the third crack prevention line 178 is formed on the second protective film 161 located inside the translucent adhesive member 165, it is possible to prevent the second protective film 161 from being lifted by the crack, And the like can be prevented.

The first to third crack preventing lines 170 to 178 may have a rectangular shape in the form of a closed curve or a rectangular shape in which a specific region is opened. In addition, the first to third anti-crack lines 170 to 178 may have a root shape corresponding to the shape of a corner where a physical impact is concentrated during the cutting process. The first to third anti-crack lines 170 to 178 have different shapes (for example, the first anti-crack line is a rectangular shape, the second anti-crack line is a translator shape located at a corner, The prevention line may be point-shaped).

The first to third crack prevention lines 170 to 178 may have the relationship of the main crack prevention line and the first and second sub crack prevention lines. Therefore, for a line selected as the main crack prevention line, it may have a larger line width and a thicker thickness than the line selected as the first and second sub crack prevention lines. In other words, the linewidth and thickness of the first to third anti-crack lines 170 to 178 may differ depending on purposes and effects.

The first to third crack prevention lines 170 to 178 buffer the impact applied to the outer edge 150_e of the substrate 150a during the cutting process to form the protective films 159 and 161, The problem of generating cracks in the device is improved, and as a result, the lifetime, reliability, and processability of the device can be improved.

As described above, according to the present invention, since the crack prevention line is formed on the substrate, the scribing line is set outside the outermost crack preventing line, and when the cutting process is performed along the scribing line, So that it can be cut out separately.

INDUSTRIAL APPLICABILITY The present invention has the effect of preventing and improving the problem that the outer crack of the display panel is propagated to the inside of the display area, thereby improving the lifetime, reliability and fairness of the device. In addition, the present invention provides a line that can prevent cracking by using a material used in a manufacturing process of a display panel, so that a process margin can be secured in a post-process.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

110: image processor 120: timing controller
130: Data driver 140: Gate driver
150: display panel 159: first protective film
160: particle protection layer 161: second protective film
170: first crack prevention line 175: second crack prevention line
178: third crack prevention line

Claims (7)

Board;
At least one protective film for protecting elements located on the substrate;
A barrier film on said substrate;
An adhesive member for adhering the substrate and the barrier film together; And
And at least one anti-crack line located at an outer edge of the substrate. The method according to claim 1,
The anti-
Wherein the at least one passivation layer is located on the surface of the at least one passivation layer or below the at least one passivation layer. The method according to claim 1,
The anti-
Wherein the organic electroluminescent display device is selected from one or more materials used in a thin film manufacturing process. The method according to claim 1,
The anti-
And a first crack prevention line located corresponding to an end of the adhesive member. The method according to claim 1,
The anti-
And a second crack prevention line located further outward than an end of the adhesive member. The method according to claim 1,
The anti-
And a third anti-crack line located further inside than the end of the adhesive member. The method according to claim 1,
The anti-
A first crack preventing line located corresponding to an end of the adhesive member and located below the at least one protective film,
A second crack prevention line located further outward than an end of the adhesive member and positioned on a surface of the at least one protective film,
And a third anti-crack line located further inside than the end of the adhesive member and positioned on a surface of the at least one protective film.

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