KR20160054363A - Finger sensor and touch device comprising the same - Google Patents

Abstract

According to an embodiment of the present invention, a fingerprint sensor includes a substrate including first to fourth areas. At least one among first and second electrodes is placed in the first to third areas. A chip, connected with the first and second electrodes, is included in the fourth area. Therefore, the present invention is capable of improving the reliability and touch properties of the fingerprint sensor.

Description

Technical Field [0001] The present invention relates to a finger sensor and a touch device including the finger sensor.

Embodiments relate to a fingerprint sensor and a touch device including the fingerprint sensor.

2. Description of the Related Art [0002] In recent years, a touch device has been applied to a variety of electronic products to input an image displayed on a display device by touching an input device such as a finger or a stylus.

A sensor for recognizing a fingerprint may be applied to such a touch device. In detail, by touching such a fingerprint sensor with a finger, various operations such as on-off of the touch device can be performed.

Such a fingerprint sensor can be manufactured by disposing electrodes and a fingerprint recognition driving chip on a substrate.

In the case of such a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance of the chip increases, the touch sensitivity of the fingerprint sensor deteriorates .

Accordingly, there is a demand for a fingerprint sensor having a new structure and a touch device including the fingerprint sensor that can solve the above problems.

Embodiments provide a fingerprint sensor having improved electrical characteristics and a touch device including the fingerprint sensor.

The fingerprint sensor according to an embodiment includes a substrate including first to fourth regions, wherein at least one of the first electrode and the second electrode is disposed in the first region to the third region, And the fourth region includes a chip connected to the first electrode and the second electrode.

The fingerprint sensor according to the embodiment can arrange electrodes and chips on the same surface of the substrate and fold the substrate to arrange the electrodes on one surface of the substrate and the chips on the other surface.

That is, the substrate may be bent so that the region where the first electrode and the second electrode are arranged and the region where the chip is arranged overlap each other.

Therefore, the first electrode and the second electrode can be connected to each other with the shortest distance therebetween.

In the case of a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance between the sensing unit and the chip increases, the touch sensitivity of the fingerprint sensor deteriorates .

Accordingly, since the fingerprint sensor according to the embodiment can reduce the distance between the distance chip and the electrode, that is, the distance between the chip and the sensing units, to a minimum, noise due to the distance difference between the chip and the sensing units can be reduced, The touch characteristics and the reliability of the touch panel can be improved.

1 is a plan view of a fingerprint sensor according to an embodiment.
FIGS. 2 to 6 are views showing various cross-sectional views of region A of FIG.
7 is a plan view showing a folded fingerprint sensor according to an embodiment.
8 to 11 are views showing an example of a touch device device to which the fingerprint sensor according to the embodiment is applied.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

Also, when a part is referred to as being "connected" to another part, it includes not only a case of being "directly connected" but also a case of being "indirectly connected" with another member in between. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, a fingerprint sensor according to an embodiment may include a substrate and electrodes and ribs disposed on the substrate.

The substrate 100 may be rigid or flexible. Preferably, the substrate 100 is flexible and can be bent or bent in various directions.

The substrate 100 may comprise plastic. For example, the substrate 100 may include plastic such as polyethylene terephthalate (PET).

Referring to FIG. 1, the substrate 100 may be formed in a rhombic shape as a whole. However, the embodiment is not limited thereto, and it is needless to say that the substrate 100 may be formed into a shape such as a polygon such as a square or a circle including a curved surface.

The substrate 100 may include at least two regions. For example, the substrate 100 may include a region where the electrode 200 is disposed and a region where the chip 300 is disposed. In detail, the substrate 100 includes a first region 1A, a second region 2A and a third region 3A in which the electrode 200 is disposed, and a fourth region 4A ).

The first region 1A, the second region 2A, the third region 3A, and the fourth region 4A may be integrally formed. That is, the first region 1A, the second region 2A, the third region 3A, and the fourth region 4A may be connected to each other and integrally formed.

The electrode 200 may be disposed on the substrate 100. For example, the electrode 200 may be disposed in the first region 1A, the second region 2A, and the third region 3A of the substrate 100. [

The electrode 200 may include a first electrode 210 and a second electrode 220.

The first electrode 210 and the second electrode 220 may include a conductive material. For example, at least one of the first electrode 210 and the second electrode 220 may include a transparent conductive material so that electricity can flow without disturbing the transmission of light. For example, At least one of the conductive layer electrodes of the first electrode 210 and the second conductive layer 220 may be formed of indium tin oxide, indium zinc oxide, copper oxide, tin oxide tin oxide, zinc oxide, titanium oxide, and the like.

Alternatively, at least one of the first electrode 210 and the second electrode 220 may include a connection structure, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, or a conductive polymer. have.

Alternatively, at least one of the first electrode 210 and the second electrode 220 may include various metals. For example, at least one of the first electrode 210 and the second electrode 220 may be formed of at least one selected from the group consisting of Cr, Ni, Cu, Al, Ag, , Molybdenum (Mo). Gold (Au), titanium (Ti), and alloys thereof.

At least one of the first electrode 210 and the second electrode 220 includes a plurality of sub-electrodes that intersect with each other and may be formed in a mesh shape.

 At least one of the first electrode 210 and the second electrode 220 may be formed on at least one of the first region 1A, the second region 2A, and the third region 3A As shown in FIG.

For example, the first electrode 210 may be disposed in the first region 1A. In addition, the second electrode 220 may be disposed in the second region 2A. In addition, the first electrode 210 and the second electrode 220 may be disposed in the T third area 3A.

The first electrode 210 may extend from the first region 1A to the third region 3A. In addition, the second electrode 220 may extend from the second region 2A to the third region 3A.

The first electrode 210 and the second electrode 220 may be disposed in the third region 3A and the first electrode 210 and the second electrode 220 may be disposed in the third region 3A, They can be overlapped and arranged in the third region 3A.

In addition, in the third region 3A, the first electrode 210 and the second electrode 220 may extend in different directions.

Referring to FIGS. 2 to 4, the first electrode 210 and the second electrode 220 may be disposed in contact with the substrate 100 in the third region 3A. For example, the first electrode 210 and the second electrode 220 may be disposed in contact with the substrate 100 on the same side of the third region 3A of the substrate 100.

In detail, the first electrode 210 and the second electrode 220 may be spaced apart from each other on the third region 3A of the substrate 100. The first electrode 210 may extend in a first direction and the second electrode 220 may be disposed as a unit electrode.

An insulating layer 250 may be disposed on the first electrode 210 and the second electrode 220. Referring to FIG. 2, the insulating layer 250 may be disposed in contact with a portion of the second electrode 220 while surrounding the first electrode 210. The second electrode 220 may include a non-contact region 220b that does not contact the contact region 220a contacting the insulating layer 250 and exposes the second electrode 220 .

A connection electrode 230 may be disposed on the insulation layer 250. The connection electrode 230 may be disposed in contact with the second electrode 220. For example, the connection electrode 230 is in contact with the second electrode 220 through the non-contact region 220b, so that the unit electrodes of the second electrode 220, Can be connected.

The connection electrode 230 may connect the second electrode 220 to the first electrode 210 in a different direction, that is, in a second direction. In detail, the second electrode 220 may extend in a different direction from the first electrode 210 through the connection electrode 230.

Accordingly, the first electrode 210 and the second electrode 220 may be disposed on the same side of the substrate 100 without contacting each other on the substrate 100.

The connection electrode 230 may include a conductive material. The connection electrode 230 may include the same or similar material as at least one of the first electrode 220 and the second electrode 220.

3, the insulating layer 250 surrounds the first electrode 210 and the second electrode 220 on the first electrode 210 and the second electrode 220, . In addition, a hole H partially exposing the second electrode 220 may be formed on the insulating layer 250.

A connection electrode 230 may be disposed on the insulation layer 250. The connection electrode 230 may be disposed in contact with the second electrode 220. For example, the connection electrode 230 contacts the second electrode 220 through the hole H, and the unit electrodes of the second electrode 220, which are disposed separately from each other, are connected to each other .

The connection electrode 230 may connect the second electrode 220 to the first electrode 210 in a different direction, that is, in a second direction. In detail, the second electrode 220 may extend in a different direction from the first electrode 210 through the connection electrode 230.

Accordingly, the first electrode 210 and the second electrode 220 may be disposed on the same side of the substrate 100 without contacting each other on the substrate 100.

The connection electrode 230 may include a conductive material. The connection electrode 230 may include the same or similar material as at least one of the first electrode 220 and the second electrode 220.

Alternatively, referring to FIG. 4, the insulating layer 250 may be disposed only on the first electrode 210. In detail, the insulating layer 250 may be disposed while surrounding the first electrode 210.

A connection electrode 230 may be disposed on the insulation layer 250. The connection electrode 230 may be disposed in contact with the second electrode 220. For example, the connection electrode 230 may be bent on the insulating layer 250 in the direction of the second electrode 220 to be in contact with the second electrode 220, The unit electrodes of the two electrodes 220 may be connected to each other.

The connection electrode 230 may include a curved surface in the bent portion 230c. The thickness T3 of the connection electrode 230 may be equal to or greater than at least one of the thickness T1 of the first electrode 210 and the thickness T2 of the second electrode.

The connection electrode 230 may connect the second electrode 220 to the first electrode 210 in a different direction, that is, in a second direction. In detail, the second electrode 220 may extend in a different direction from the first electrode 210 through the connection electrode 230.

Accordingly, the first electrode 210 and the second electrode 220 may be disposed on the same side of the substrate 100 without contacting each other on the substrate 100.

The connection electrode 230 may include a conductive material. The connection electrode 230 may include the same or similar material as at least one of the first electrode 220 and the second electrode 220.

5 and 6, in the third region 3A, the first electrode 210 and the second electrode 220 may be disposed without contacting the substrate 100 directly. For example, the first electrode 210 and the second electrode 220 may be disposed on the same side of the third region 3A of the substrate 100 without contacting the substrate 100 .

In detail, the connection electrode 230 may be disposed on the third region 3A of the substrate 100. [ The connection electrode 230 may be disposed in direct contact with the substrate 100.

The insulating layer 250 may be disposed on the connection electrode 230. In detail, the insulating layer 250 may surround the connection electrode 230 or may be partially disposed on the connection electrode 230.

Referring to FIG. 5, the insulating layer 250 may be disposed while surrounding the connection electrode 230. In addition, a hole (H) may be formed in the insulating layer (250). In detail, the insulating layer 250 is disposed on the connection electrode 230, and the connection electrode can be exposed by the hole H.

The first electrode 210 and the second electrode 220 may be disposed on the insulating layer 250. In detail, the first electrode 210 and the second electrode 220 may be spaced apart from each other on the third region 3A of the substrate 100. The first electrode 210 may extend in a first direction and the second electrode 220 may be disposed as a unit electrode.

The first electrode 210 and the connection electrode 230 may extend in different directions. For example, the first electrode 210 may extend in a first direction and the connection electrode 230 may extend in a second direction.

The second electrode 220 may be disposed in contact with the connection electrode 230 through the hole H. [ Accordingly, the unit electrodes of the second electrode 220 disposed separately from each other can be connected to each other.

The second electrode 220 may extend in a second direction different from the first electrode 210 through the connection electrode 230.

Accordingly, the first electrode 210 and the second electrode 220 may be disposed on the same side of the substrate 100 without contacting each other on the substrate 100.

The connection electrode 230 may include a conductive material. The connection electrode 230 may include the same or similar material as at least one of the first electrode 220 and the second electrode 220.

Alternatively, referring to FIG. 6, the insulating layer 250 may be partially disposed on the connection electrode 230. For example, the insulating layer 250 may be partially disposed on the connection electrode 230, and both ends of the connection electrode may be exposed.

The connecting electrode 230 may include an unexposed region 230a covered by the insulating layer 250 and an exposed region 230b not covered by the insulating layer 250. Referring to FIG.

The first electrode 210 and the second electrode 220 may be disposed on the insulating layer 250. In detail, the first electrode 210 and the second electrode 220 may be spaced apart from each other on the third region 3A of the substrate 100. The first electrode 210 may extend in a first direction and the second electrode 220 may be disposed as a unit electrode.

The first electrode 210 and the connection electrode 230 may extend in different directions. For example, the first electrode 210 may extend in a first direction and the connection electrode 230 may extend in a second direction.

The second electrode 220 may be disposed in contact with the connection electrode 230 through the exposed region 230b. Accordingly, the unit electrodes of the second electrode 220 disposed separately from each other can be connected to each other.

The second electrode 220 may extend in a second direction different from the first electrode 210 through the connection electrode 230.

Accordingly, the first electrode 210 and the second electrode 220 may be disposed on the same side of the substrate 100 without contacting each other on the substrate 100.

The connection electrode 230 may include the same or similar material as at least one of the first electrode 220 and the second electrode 220.

The chip 300 may be disposed on the fourth region 4A of the substrate 100. [ For example, the chip 300 may be a fingerprint recognition driver chip. The chip 300 may be connected to the first electrode 210 and the second electrode 220. In detail, the chip 300 may be connected to the first electrode 210 extending in the first region 1A and the second electrode 220 extending in the second region 2A.

When the fingerprint is touched to the fingerprint sensor, the fingerprint is recognized and driven by the chip and the external mainboard drive chip, .

Referring to FIGS. 7 and 8, the substrate 100 may be folded. May be folded in the first region 1A and the second region 2A of the substrate 100 in detail to fold the third region 3A and the fourth region 4A together.

As the substrate 100 is folded, the first electrode 210 and the second electrode 220 of the third region may be disposed on one surface of the substrate 100, The chip 300 of the chip 4A may be disposed. The first electrode 210 and the second electrode 220 of the third region and the chip 300 of the fourth region 4A are electrically connected to the first electrode of the first region 1A 210 and the second electrode 220 of the second region 2A.

The fingerprint sensor according to the embodiment can arrange electrodes and chips on the same surface of the substrate and fold the substrate to arrange the electrodes on one surface of the substrate and the chips on the other surface.

That is, the substrate can be bent around the hypothetical line B-B 'of FIG. 1 so that the region where the first electrode and the second electrode are arranged and the region where the chip is arranged are overlapped.

Therefore, the first electrode and the second electrode can be connected to each other with the shortest distance therebetween.

In the case of a fingerprint sensor, the distance between the sensing unit and the chip must be short in order to detect a minute cap change, and as the distance between the sensing unit and the chip increases, the touch sensitivity of the fingerprint sensor deteriorates .

Accordingly, since the fingerprint sensor according to the embodiment can reduce the distance between the distance chip and the electrode, that is, the distance between the chip and the sensing units, to a minimum, noise due to the distance difference between the chip and the sensing units can be reduced, The touch characteristics and the reliability of the touch panel can be improved.

Hereinafter, an example of a touch device including a fingerprint sensor according to the above-described embodiments will be described with reference to FIGS. 9 to 12. FIG.

The fingerprint sensor according to the embodiments can be applied to the locking device. For example, the fingerprint sensor according to the embodiments can be applied to electronic products and the like as a locking device.

In detail, as shown in Fig. 9, the fingerprint sensor according to the embodiments can be applied to the lock of the door lock by being coupled to the door lock. Or may be applied to a locking device of a mobile phone in combination with a mobile phone as shown in Fig.

Alternatively, the fingerprint sensor according to the embodiments may be applied to a power supply apparatus. For example, the fingerprint sensor according to the embodiments can be applied to household appliances, vehicles, and the like.

11, it can be coupled to a home appliance such as an air conditioner and can be applied as a power supply device. Alternatively, as shown in FIG. 12, the present invention can be applied to a vehicle, such as a starting device of a vehicle, and a power supply device such as a car audio.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (16)

And a substrate including a first region to a fourth region,
Wherein at least one of the first electrode and the second electrode is disposed in the first region to the third region,
And a chip connected to the first electrode and the second electrode in the fourth region. The method according to claim 1,
The first electrode is disposed in the first region,
The second electrode is disposed in the second region,
And the first electrode and the second electrode are disposed in the third region. The method according to claim 1,
Wherein the first electrode and the second electrode overlap and are disposed in the third region. The method according to claim 2 or 3,
Wherein in the third region, the first electrode and the second electrode are disposed on the same side of the substrate. The method according to claim 2 or 3,
Wherein in the third region, the first electrode and the second electrode are arranged extending in different directions. The method according to claim 1,
Wherein the first electrode and the second electrode are disposed in contact with the substrate. The method according to claim 6,
In the third region,
A first electrode and a second electrode on the substrate;
An insulating layer disposed on the first electrode and the second electrode, the insulating layer exposing the second electrode; And
And a connection electrode disposed in contact with the second electrode on the insulating layer. 8. The method of claim 7,
Wherein the insulating layer is partially disposed on the second electrode. 8. The method of claim 7,
Wherein the insulating layer surrounds the first electrode and the second electrode,
Wherein the insulating layer has a through-hole for exposing the second electrode. The method according to claim 6,
In the third region,
A first electrode and a second electrode on the substrate;
An insulating layer surrounding the first electrode; And
And a connection electrode disposed in contact with the second electrode on the insulating layer. 11. The method of claim 10,
Wherein the insulating layer is disposed in contact with only the first electrode,
Wherein the connection electrode is bent on the insulating layer and disposed in contact with the second electrode. The method according to claim 1,
In the third region,
A connection electrode disposed on the substrate;
An insulating layer forming an exposed surface of the connection electrode and disposed on the connection electrode;
A first electrode disposed on the connection electrode; And
And a second electrode disposed on the connection electrode in contact with the connection electrode by the exposed surface. 13. The method of claim 12,
Wherein the connection electrode is disposed in contact with the substrate. 13. The method of claim 12,
Wherein the insulating layer surrounds the connection electrode,
Wherein the insulating layer has a through hole exposing the connection electrode. 13. The method of claim 12,
Wherein the insulating layer is disposed so as to expose both ends of the connection electrode. A touch device comprising a fingerprint sensor according to any one of claims 1 to 15.

Images